A substrate surface for improving the interface bonding effect of a construction element

Abstract

The application discloses a substrate surface for improving the interface bonding effect of a building component, comprising a central rectangular area, an inner loop area and an outer loop area. The V-shaped structure of the inner loop area can improve the stress state of the inner loop area when compressed. Due to the existence of the V-shaped structure, the force which is not conducive to the interface bonding and diffuses outward along the interface direction is changed into the force which is conducive to the interface bonding and has small component force in the bonding interface direction, which is beneficial to improve the effective force of the interface bonding of the inner loop area and improve the bonding effect of the edge position of the building component. The surface of the central rectangular area is provided with a certain roughness, the roughness surface is not easy to be mixed with the abrasive which falls off, the local oxide aggregation effect formed in the hot-pressing process is not obvious, and then the bonding effect of the central rectangular area of the building component is improved. The outer loop area is helpful to avoid the influence of vacuum electron beam sealing on the inner loop area.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of metal substrate construction forming, and particularly relates to a substrate surface for improving the interface bonding effect of a construction member. BACKGROUND

[0002] Large forgings are basic pieces for preparing key components such as nuclear power support rings and wind power connecting flanges, and have very important applications. In the conventional manufacturing method of large forgings, a large cast ingot is usually used as an initial blank. Due to the influence of the "size effect" in the pouring process of the large cast ingot, central defects and other problems are prone to occur in the poured large cast ingot, which ultimately affects the quality of the prepared large forgings. In order to avoid the above problems, the research team of the Institute of Metal of Chinese Academy of Sciences first proposed a construction forming technology. The technology uses a small homogenized plate blank as a basic unit, and through surface treatment, vacuum sealing, high-temperature forging and heat preservation diffusion processes, the interface between the plate blanks is bonded, and finally a large-scale forging is formed.

[0003] Because high-temperature forging is required in the construction forming process, large deformation will cause the construction member to have a "bulging" phenomenon on the side surface after interface bonding. During the construction forming forging, the larger the angle between the interface and the bonding interface in the range of 0-90°, the more conducive to interface bonding. That is, the smaller the component of the pressure in the direction of the bonding interface, the more conducive to interface bonding. At the center position of the construction member interface, the force at the interface is perpendicular to the interface direction, while at the edge position of the construction member interface, the "bulging" caused by compression deformation will cause the force at the interface to spread outward along the interface direction, which is not conducive to the bonding of the edge position interface. The above situation will cause the interface of the prepared construction member to be well bonded in the central rectangular area, and poorly bonded at the edge. The poorly bonded edge position is the weak link of the entire construction member, and improper subsequent processing can easily form bonding defects, which poses a quality risk to the prepared large forgings. Therefore, it is necessary to improve the interface bonding effect of the edge position of the construction member. In addition, for the bonding of the central rectangular area of the construction member interface, it is not yet determined what state of the surface is most conducive to interface bonding.

[0004] There is no method to solve the poor bonding effect of the edge position of the construction component, and no substrate surface most suitable for the interface bonding of the construction component is proposed. Only some patents improve the interface bonding effect by changing the stress of the bonding interface. Chinese patent CN 107520584 A proposes a special-shaped metal construction forming method, which prepares the prefabricated blank into a sandglass-shaped module, so that the deformation in the forging process is concentrated at the interface position of the sandglass-shaped module blank, improving the stress state of the blank and the interface healing effect, and effectively reducing the pressure required for forging. Similar to the above patent, Chinese patent CN 107671216 A proposes a sandglass-shaped metal construction method, which stacks multiple blanks together to form a shape with increasing cross-sectional area from the middle to the ends, avoiding the "bulging" phenomenon of the construction component caused by the upsetting process, and reducing the risk of weld cracking. The above patents change the overall shape of the blank to change the stress at the bonding interface between the blanks, which improves the healing effect between the blanks to some extent, but the bonding effect of the interface at the edge of the blank is not improved, and the most beneficial surface for interface healing is not given. SUMMARY

[0005] To solve the problems of poor interface bonding effect of the edge position of the construction component and the determination of the surface state of the center rectangular region of the construction component that is most beneficial to interface bonding in the prior art, the present application proposes a substrate surface for improving the interface bonding effect of the construction component.

[0006] To achieve the above-mentioned purpose, the technical scheme of the present application is as follows: a substrate surface for improving the interface bonding effect of the construction component, the substrate surface refers to the lower surface of the upper substrate and the upper surface of the lower substrate, that is, the interface to be bonded; the interface to be bonded includes a center rectangular region, an inner loop-shaped region and an outer loop-shaped region; the outer side of the outer loop-shaped region is the outer side of the substrate interface, the inner side of the outer loop-shaped region is the outer side of the inner loop-shaped region, and the inner side of the inner loop-shaped region is the outer side of the center rectangular region;

[0007] The outer loop-shaped region is a polished surface and a welding region, and the width H of the outer loop-shaped region is determined by the material of the substrate. The width of the outer loop-shaped region is equal to the weld depth of the vacuum electron beam sealing in the construction forming process of the material.

[0008] The inner loop-shaped region is a surface with a V-shaped structure, and the V-shaped structure is composed of a plurality of parallel V-shaped grooves. The width of the inner loop-shaped region and the size of the V-shaped structure are determined by the size of the substrate. The value of the width S of the inner loop-shaped region is 1 / 9-1 / 11 of the size W of the substrate. The horizontal distance d between the top of the two adjacent V-shaped grooves of the V-shaped structure and the center line of the top is 1 / 5-1 / 6 of the width of the inner loop-shaped region, and the height h is 1 / 2-2 / 3 of the distance d.

[0009] The inner profiled area of the upper substrate to be bonded interface is consistent with the width of the inner profiled area of the lower substrate to be bonded interface, and the V-shaped structure of the inner profiled area of the upper substrate to be bonded interface and the V-shaped structure of the inner profiled area of the lower substrate to be bonded interface are just fitted, that is, the top of the V-shaped groove of the upper substrate is just fitted with the bottom of the V-shaped groove of the lower substrate.

[0010] The center rectangular area is a polished surface, and the surface roughness is 0.18-0.26 μm Sa; the length C of the center rectangular area is the substrate size W minus twice the width of the inner profiled area and the width of the outer profiled area.

[0011] Further, the number of V-shaped grooves in the V-shaped structure is determined by the width of the inner profiled area and the horizontal distance between the top of the V-shaped groove and the top, and when the number of V-shaped grooves is not an integer, the distance less than the horizontal distance between the top of the V-shaped groove and the top is divided equally to the V-shaped grooves adjacent to the outer profiled area and the center rectangular area.

[0012] Further, the V-shaped structure of the inner profiled area is composed of four V-shaped groove strips of the same size, the bottom edge of the left V-shaped groove strip is connected with the upper side edge of the lower V-shaped groove strip, the left side edge of the upper V-shaped groove strip is connected with the right side edge of the left V-shaped groove strip, the top edge of the right V-shaped groove strip is connected with the lower side edge of the upper V-shaped groove strip, and the right side edge of the lower V-shaped groove strip is connected with the left side edge of the right V-shaped groove strip.

[0013] Compared with the existing surface of the built-up forming substrate, the substrate surface provided by the present application has the following beneficial effects:

[0014] 1. The V-shaped structure of the inner profiled area of the present application can improve the stress state of the inner profiled area during compression. Due to the presence of the V-shaped structure, the force that is not conducive to the interface bonding and diffuses outward along the interface direction is converted into a force that is conducive to the interface bonding and has a smaller component in the bonding interface direction, which is beneficial to improve the effective force of the interface bonding of the inner profiled area and improve the bonding effect of the edge position of the built-up member.

[0015] 2. The surface of the center rectangular area provided by the present application has a certain roughness. The roughness surface is not easy to be mixed with the falling abrasive, and the local oxide aggregation effect formed during the hot pressing process is not obvious, thereby improving the bonding effect of the center rectangular area of the built-up member interface; in addition, the surface under the roughness has small preparation difficulty and high processing efficiency.

[0016] 3. The outer profiled area provided by the present application is a sacrificial area for vacuum electron beam sealing, and the entire outer profiled area is melted during welding, which helps to avoid the influence of vacuum electron beam sealing on the designed inner profiled area and protect the transformation of the V-shaped structure of the inner profiled area to the force diffusing outward along the interface direction. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 This is a schematic diagram of the substrate construction and forming of the present invention.

[0018] Figure 2 This is a top view of the substrate of the present invention.

[0019] Figure 3 This is a cross-sectional view of the substrate of the present invention.

[0020] Figure 4 This is a dimension diagram of the V-shaped structure of the inner loop region of the present invention.

[0021] In the diagram: 1. Upper substrate; 2. Interface to be bonded; 3. Lower substrate; 4. Outer loop area; 5. Inner loop area; 6. Central rectangular area. Detailed Implementation

[0022] The present invention will now be further described with reference to the accompanying drawings.

[0023] like Figures 1-4 As shown, a substrate surface for improving the bonding effect of structural components is provided. The substrate surface refers to the lower surface of the upper substrate 1 and the upper surface of the lower substrate 3, which is the interface to be bonded 2. The interface to be bonded 2 includes a central rectangular area 6, an inner loop area 5, and an outer loop area 4. The outer side of the outer loop area 4 is the outer side of the substrate interface, the inner side of the outer loop area 4 is the outer side of the inner loop area 5, and the inner side of the inner loop area 5 is the outer side of the central rectangular area 6.

[0024] The outer helical region 4 is a polished surface and also a welding area. The width H of the outer helical region 4 is determined by the material of the substrate. The width of the outer helical region 4 is equal to the weld depth of the vacuum electron beam sealing of the material in the construction process.

[0025] The inner loop region 5 is a surface with a V-shaped structure, which is composed of multiple parallel V-shaped grooves. The width of the inner loop region 5 and the dimensions of the V-shaped structure are determined by the dimensions of the substrate. The width S of the inner loop region 5 is 1 / 9 to 1 / 11 of the substrate dimension W. The horizontal distance d between the top of two adjacent V-shaped grooves and the top center line is 1 / 5 to 1 / 6 of the width of the inner loop region 5, and the height h is 1 / 2 to 2 / 3 of the distance d.

[0026] The inner loop-shaped area 5 of the interface 2 to be joined of the upper substrate 1 has the same width as the inner loop-shaped area 5 of the interface 2 to be joined of the lower substrate 3. The V-shaped structure of the inner loop-shaped area 5 of the interface 2 to be joined of the upper substrate 1 and the V-shaped structure of the inner loop-shaped area 5 of the interface 2 to be joined of the lower substrate 3 are perfectly fitted together, that is, the top of the V-shaped groove of the upper substrate 1 is exactly matched with the bottom of the V-shaped groove of the lower substrate 3.

[0027] The center rectangular area 6 is a polishing surface with a surface roughness of 0.18-0.26 μm Sa; the length C of the center rectangular area 6 is the substrate size W minus twice the width of the inner curved area 5 and the width of the outer curved area 4.

[0028] Further, the number of V-shaped grooves in the V-shaped structure is determined by the width of the inner curved area 5 and the horizontal distance between the top of the V-shaped groove and the top of the V-shaped groove; when the number of V-shaped grooves is not an integer, the distance less than the horizontal distance between the top of the V-shaped groove and the top of the V-shaped groove is evenly divided to the V-shaped grooves adjacent to the outer curved area 4 and the center rectangular area 6.

[0029] Further, the V-shaped structure of the inner curved area 5 is composed of four V-shaped groove strips with the same size, the bottom edge of the left V-shaped groove strip is connected with the upper side edge of the lower V-shaped groove strip, the left side edge of the upper V-shaped groove strip is connected with the right side edge of the left V-shaped groove strip, the top edge of the right V-shaped groove strip is connected with the lower side edge of the upper V-shaped groove strip, and the right edge of the lower V-shaped groove strip is connected with the left side edge of the right V-shaped groove strip.

[0030] The embodiment of the present application is as follows: the substrate material is 316H stainless steel, and the surface size is 2x2 m.

[0031] The width H of the outer curved area 4 is 50 mm.

[0032] The width S of the inner curved area 5 is 200 mm, the distance d of the V-shaped groove is 40 mm, and the height h is 20 mm.

[0033] The length C of the center rectangular area 6 is 1500 mm.

[0034] Other parameters are shown in Table 1.

[0035] Table 1: The required weld seam depth of vacuum electron beam sealing for commonly used materials in construction forming

[0036] Material Type Weld Depth 316H Stainless Steel 55mm Sa 508-3 Steel 50mm Other Alloy Steels 45mm

[0037] The present application is not limited to the present embodiment, and any equivalent concept or change within the technical scope disclosed in the present application is included in the protection scope of the present application.

Claims

1. A substrate surface for improving the interface bonding effect of a construction element, said substrate surface referring to the lower surface of an upper substrate (1) and the upper surface of a lower substrate (3), i.e. the interface (2) to be bonded; characterized in that: The interface (2) to be combined comprises a central rectangular area (6), an inner meandering area (5) and an outer meandering area (4); the outer side of the outer meandering area (4) is the outer side of the substrate interface, the inner side of the outer meandering area (4) is the outer side of the inner meandering area (5), and the inner side of the inner meandering area (5) is the outer side of the central rectangular area (6); The outer meandering area (4) is a polished surface and is also a welding area, and the width H of the outer meandering area (4) is determined by the material of the substrate, and the width of the outer meandering area (4) is equal to the welding seam depth of the material vacuum electron beam sealing in the construction forming process; The inner meandering area (5) is a surface with a V-shaped structure composed of a plurality of parallel V-shaped grooves; the width of the inner meandering area (5) and the size of the V-shaped structure are determined by the size of the substrate; the width S of the inner meandering area (5) is 1 / 9-1 / 11 of the size W of the substrate; the horizontal distance d between the top of the two adjacent V-shaped grooves of the V-shaped structure and the center line of the top is 1 / 5-1 / 6 of the width of the inner meandering area (5), and the height h is 1 / 2-2 / 3 of the distance d; The inner meandering area (5) of the interface (2) to be combined of the upper substrate (1) is consistent with the width of the inner meandering area (5) of the interface (2) to be combined of the lower substrate (3), and the V-shaped structure of the inner meandering area (5) of the interface (2) to be combined of the upper substrate (1) is just fitted with the V-shaped structure of the inner meandering area (5) of the interface (2) to be combined of the lower substrate (3), that is, the top of the V-shaped groove of the upper substrate (1) is just fitted with the bottom of the V-shaped groove of the lower substrate (3). The central rectangular area (6) is a polished surface with a surface roughness of 0.18-0.26 μm Sa; the length C of the central rectangular area (6) is the size W of the substrate minus twice the width of the inner meandering area (5) and the width of the outer meandering area (4).

2. The substrate surface for improving the interface bonding effect of a construction element according to claim 1, characterized in that: The number of V-shaped grooves in the V-shaped structure is determined by the width of the inner meandering area (5) and the horizontal distance between the top of the V-shaped groove and the top; when the number of V-shaped grooves is not an integer, the distance less than the horizontal distance between the top of the V-shaped groove and the top is evenly divided to the V-shaped grooves adjacent to the outer meandering area (4) and the central rectangular area (6).

3. The substrate surface for improving the interface bonding effect of a construction element according to claim 1, wherein: The V-shaped structure of the inner meandering area (5) is composed of four V-shaped groove strips with the same size, the bottom edge of the left V-shaped groove strip is connected with the upper side edge of the lower V-shaped groove strip, the left side edge of the upper V-shaped groove strip is connected with the right side edge of the left V-shaped groove strip, the top edge of the right V-shaped groove strip is connected with the lower side edge of the upper V-shaped groove strip, and the right side edge of the lower V-shaped groove strip is connected with the left side edge of the right V-shaped groove strip.

Images