A cathode device for magnetron sputtering

Abstract

The present invention discloses a cathode device for magnetron sputtering. The hollow housing is electrically connected to the negative electrode of the power supply of the magnetron sputtering instrument. Above the target in the housing, a magnet group, a magnet mounting plate and a rotation driving assembly are further installed; an opening is provided at the bottom of the housing; the bottom surface of the target is exposed outside the opening; the magnet group includes two spiral magnets; the two spiral magnets are spaced apart and placed in a staggered position, and the top surfaces of the two spiral magnets respectively abut against the bottom surface of the magnet mounting plate; the bottom surface and the top surface of the spiral magnet are respectively two magnetic poles, and the magnetic pole directions of the two spiral magnets are opposite, and the plane where the bottom surfaces of the two spiral magnets are located is parallel to the plane where the bottom surface of the target is located; the driving end of the rotation driving assembly extending downward is connected to the top surface of the magnet mounting plate. The rotating magnetic confinement region uniformly covers the bottom surface of the target, which can effectively improve the consumption uniformity of the target during the magnetron sputtering process and improve the effective utilization rate of the target.

Description

Technical Field

[0001] The present invention relates to the technical field of magnetron sputtering equipment, and in particular to a cathode device for magnetron sputtering. Background Art

[0002] The magnetron sputtering device is a widely used coating device in the prior art.

[0003] The working principle of the magnetron sputtering device is that electrons collide with the filling gas under the action of an orthogonal electric field and a magnetic field to generate a large number of positive ions, and the positive ions are accelerated by the electric field to fly towards the cathode target. The high-energy positive ions bombard the surface of the target, causing the microparticles sputtered from the target to deposit on the surface of the substrate to form a coating.

[0004] In some magnetron sputtering devices, the multiple magnetic confinement regions formed by the magnets are stationary and do not rotate. Sputtering etching only occurs on the surface of the target within the magnetic confinement regions. One or more strip-shaped grooves similar to the shape of the magnetic confinement regions are formed on the surface of the sputtered target. Sputtering etching does not occur on the surface of the target between adjacent magnetic confinement regions, thus reducing the effective utilization rate of the target.

[0005] There is also a magnetron sputtering device, such as the Chinese patent with the authorization announcement number CN217173853U, which is provided with a first adjusting part and a second adjusting part on the rotating cathode magnetic rod. The distance between the magnetic rod and the target is adjusted by the first adjusting part, and the rotation angle of the magnetic rod is adjusted by the second adjusting part to improve the effective utilization rate of the target. As a result, the structure of the rotating cathode magnetic rod is complex and the manufacturing cost is high. Summary of the Invention

[0006] Aiming at the above problems, the purpose of the present invention is to provide a cathode device for magnetron sputtering, which does not require the use of an adjusting mechanism and can effectively improve the effective utilization rate of the target.

[0007] To achieve this purpose, the present invention adopts the following technical solutions:

[0008] A cathode device for magnetron sputtering, including a housing and a target. The housing is electrically connected to the negative electrode of the power supply of the magnetron sputtering instrument, and further includes a magnet group, a magnet mounting plate, and a rotation driving component;

[0009] The bottom of the hollow cylindrical housing is provided with an open mouth;

[0010] The target, the magnet group, the magnet mounting plate, and the rotation driving component are sequentially installed in the housing from bottom to top; the bottom surface of the edge of the target abuts against the top surface of the edge of the open mouth, and the bottom surface of the target is exposed outside the open mouth;

[0011] The magnet group includes two spiral magnets; the spiral magnets are strip-shaped spirals extending from the center to the circumference, the two spiral magnets are spaced apart and placed in a staggered position, the top surface of the spiral magnet abuts against the bottom surface of the magnet mounting plate; the bottom surface and the top surface of the spiral magnet are respectively two magnetic poles, the magnetic pole directions of the two spiral magnets are opposite, and the plane where the bottom surfaces of the two spiral magnets are located is parallel to the plane where the bottom surface of the target is located;

[0012] The driving end of the rotation driving assembly extending downward is connected to the top surface of the magnet mounting plate.

[0013] Furthermore, an isolation plate is also included;

[0014] The housing includes an upper cover plate, a cylinder body, and a fixing ring arranged in sequence from top to bottom;

[0015] The upper cover plate seals the top of the cylinder body;

[0016] The bottom surface of the hollow fixing ring is provided with the opening;

[0017] The inner wall surface of the fixing ring is screwed to the outer wall surface of the bottom of the hollow cylinder body;

[0018] The top surface of the isolation plate abuts against and seals the bottom surface of the cylinder body; the top surface of the target abuts against the bottom surface of the isolation plate, and the bottom surface of the target abuts against the inner bottom surface of the edge of the opening.

[0019] Preferably, the isolation plate is a non-magnetic shielding body.

[0020] Furthermore, the magnet mounting plate is a magnetic conductor.

[0021] Preferably, the two spiral magnets have the same external dimensions, and the two spiral magnets are symmetrically distributed with the center point of the magnet mounting plate as the center;

[0022] The side surfaces of the two spiral magnets cover each other, and the side surface of the spiral magnet not covered by the other spiral magnet is the outer peripheral surface of the spiral magnet, and the outer peripheral surface of the spiral magnet is close to the inner wall surface of the housing.

[0023] Specifically, the rotation driving assembly includes a motor, a transmission shaft, a transmission gear, a driven gear, an upper support plate, and a lower support plate;

[0024] The inner wall of the cylinder body is provided with a first boss and a second boss that are spaced apart vertically and protrude inward respectively;

[0025] The bottom surface of the upper support plate is fixed to the top surface of the first boss, and the bottom surface of the lower support plate is fixed to the top surface of the second boss;

[0026] The bottom of the motor is fixed to the top surface of the lower support plate, the output end of the motor extends upward, and the transmission gear is sleeved on the outer peripheral surface of the output end of the motor;

[0027] The upper end of the transmission shaft is rotatably fixed to the middle of the upper support plate, and the lower end of the transmission shaft passes through the lower support plate and is connected to the top surface of the magnet mounting plate; the driven gear is clamped on the outer peripheral surface of the middle part of the transmission shaft, and the transmission gear meshes with the driven gear.

[0028] Further, the rotation driving assembly further includes two bearings;

[0029] A first mounting hole is provided in the middle of the upper support plate, and the first mounting hole penetrates through the upper support plate;

[0030] A second mounting hole is provided in the middle of the lower support plate, and the second mounting hole penetrates through the lower support plate;

[0031] The outer rings of the two bearings are respectively clamped in the first mounting hole and the second mounting hole which are spaced apart vertically and aligned, the inner rings of the two bearings are respectively clamped on the outer peripheral surface of the transmission shaft at intervals vertically and rotatably, and the upper end portions of the bearings protrude outside the periphery of the upper edge of the first mounting hole.

[0032] The cathode device for magnetron sputtering of the above technical solution of the present invention includes two spiral magnets. The spiral magnet is a strip-shaped spiral body that extends from the center to the circumference. The two spiral magnets are misaligned and spaced apart and have opposite pole directions. A magnetic confinement region covering the bottom surface of the target is formed below the gap between the two spiral magnets. The planes where the bottom surfaces of the two spiral magnets are located are parallel to the plane where the bottom surface of the target is located. The rotation driving assembly drives the magnet mounting plate to rotate, which can drive the two spiral magnets to rotate synchronously, so that the rotating magnetic confinement region uniformly covers the bottom surface of the target. There is no need to set an adjustment mechanism to adjust the distance between the spiral magnet and the target or the rotation angle of the spiral magnet, and no strip-shaped grooves will be formed on the surface of the target after sputter etching, which can effectively improve the consumption uniformity of the target during the magnetron sputtering process, and further improve the effective utilization rate of the target and the coating efficiency of the magnetron sputtering. Description of the Drawings

[0033] Figure 1 is a schematic cross-sectional structure view of an embodiment of the cathode device for magnetron sputtering of the present invention;

[0034] Figure 2 is Figure 1 an exploded view of the components of the cathode device for magnetron sputtering in

[0035] Figure 3Schematic diagram of the assembly structure of two spiral magnets in the magnet group;

[0036] Wherein: housing 1; target 2; magnet group 3; isolation plate 4; magnet mounting plate 5; rotary drive assembly 6; upper cover plate 11; cylinder 12; fixing ring 13; spiral magnet 31; motor 61; transmission shaft 62; transmission gear 63; driven gear 64; bearing 65; upper support plate 66; lower support plate 67; opening 131; first mounting hole 661; second mounting hole 671. Specific embodiments

[0037] The following is combined with the attached Figures 1-3 And further illustrate the technical solution of the present invention through specific embodiments.

[0038] The drawings are only for illustrative purposes and should not be construed as a limitation of this patent; for better illustration of this embodiment, some components in the drawings will be omitted, enlarged or reduced, and do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0039] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be said that the interiors of two components are connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

[0040] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the protection scope of the present invention; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0041] A cathode device for magnetron sputtering, including a housing 1 and a target 2, the housing 1 is electrically connected to the negative electrode of the power supply of the magnetron sputtering instrument, and further includes a magnet group 3, a magnet mounting plate 5 and a rotary drive assembly 6;

[0042] An opening 131 is provided at the bottom of the hollow cylindrical housing 1;

[0043] The target 2, the magnet group 3, the magnet mounting plate 5, and the rotary drive assembly 6 are sequentially installed in the housing 1 from bottom to top; the bottom surface of the edge of the target 2 abuts against the top surface of the edge of the open end 131, and the bottom surface of the target 2 is exposed outside the open end 131;

[0044] The magnet group 3 includes two spiral magnets 31; the spiral magnet 31 is a strip-shaped spiral body that extends from the center of the circle to the circumference in a coiled manner. The two spiral magnets 31 are spaced apart and placed in a staggered position. The top surface of the spiral magnet 31 abuts against the bottom surface of the magnet mounting plate 5; the bottom surface and the top surface of the spiral magnet 31 are respectively two magnetic poles, and the magnetic pole directions of the two spiral magnets 31 are opposite. The plane where the bottom surfaces of the two spiral magnets 31 are located is parallel to the plane where the bottom surface of the target 2 is located;

[0045] The driving end of the rotary drive assembly 6 extending downward is connected to the top surface of the magnet mounting plate 5.

[0046] As Figures 1-3 shown, the cathode device for magnetron sputtering of the present invention includes two spiral magnets 31. The spiral magnet 31 is a strip-shaped spiral body that extends from the center of the circle to the circumference in a coiled manner. The two spiral magnets 31 are placed in a staggered and spaced position and have opposite magnetic pole directions. A magnetic confinement region covering the bottom surface of the target 2 is formed below the gap between the two spiral magnets 31. The plane where the bottom surfaces of the two spiral magnets 31 are located is parallel to the plane where the bottom surface of the target 2 is located. The rotary drive assembly 6 drives the magnet mounting plate 5 to rotate, which can drive the two spiral magnets 31 to rotate synchronously, so that the rotating magnetic confinement region uniformly covers the bottom surface of the target 2. There is no need to set up an adjustment mechanism to adjust the distance between the spiral magnet 31 and the target 2 or the rotation angle of the spiral magnet 31, and no strip-shaped grooves will be formed on the surface of the target 2 after sputter etching. The consumption uniformity of the target 2 during the magnetron sputtering process can be effectively improved, thereby improving the effective utilization rate of the target 2 and the coating efficiency of magnetron sputtering.

[0047] It should be noted that the open end 131 at the bottom of the housing 1 of the cathode device for magnetron sputtering of the present invention faces downward and is aligned with the surface of the substrate to be coated.

[0048] Furthermore, it further includes a separator plate 4;

[0049] The housing 1 includes an upper cover plate 11, a cylinder 12, and a fixing ring 13 arranged in sequence from top to bottom;

[0050] The upper cover plate 11 seals the top of the cylinder 12;

[0051] The bottom surface of the hollow fixing ring 13 is provided with the open end 131;

[0052] The inner wall surface of the fixed ring 13 is screwed to the outer wall surface of the bottom of the hollow cylinder 12;

[0053] The top surface of the partition plate 4 abuts against and seals the bottom surface of the cylinder 12; the top surface of the target 2 abuts against the bottom surface of the partition plate 4, and the bottom surface of the target 2 abuts against the inner bottom surface of the edge of the opening.

[0054] As Figure 1 shown, this can improve the installation stability of the partition plate 4 and the target 2, as well as the tightness of the inner cavity of the housing 1.

[0055] During operation, it is necessary to evacuate to make the magnetron sputtering area in a vacuum state. The partition plate 4 can cut off the connection between the inner cavity of the housing 1 and the magnetron sputtering area, thereby preventing the inner cavity of the housing 1 from being evacuated to a vacuum, and then avoiding affecting the operating performance of the rotary drive assembly 6. It can also prevent the inner cavity of the non-vacuum state housing 1 from forming a downward pressure on the top surface of the target 2, and further avoid the downward bending deformation of the target 2, which affects the consumption uniformity and effective utilization rate of the target 2.

[0056] Preferably, the partition plate 4 is a non-magnetic shielding body.

[0057] As Figures 1-2 shown, the partition plate 4 is a non-magnetic shielding body, preferably made of a dense ceramic plate.

[0058] If the partition plate 4 is a conductor, an eddy current effect will be generated during the rotation of the magnet group 3, thereby shielding the magnetic fields of the two spiral magnets 31, and then preventing the formation of a magnetic confinement region covering the bottom surface of the target 2. Therefore, the partition plate 4 cannot be a conductor.

[0059] Furthermore, the magnet mounting plate 5 is a magnetic conductor.

[0060] The magnet mounting plate 5 made of a magnetic conductor can keep the two spiral magnets 31 in a magnetically conductive state all the time, thereby enhancing the magnetic field intensity between the magnetic poles at the bottom surfaces of the two spiral magnets 31, and further improving the effective utilization rate of the target 2 and the coating efficiency of magnetron sputtering.

[0061] The magnet mounting plate 5 can be selected as a magnetic conductor made of ferrite, silicon steel sheet or permalloy.

[0062] Preferably, the outer dimensions of the two spiral magnets 31 are the same, and the two spiral magnets 31 are symmetrically distributed with the center point of the magnet mounting plate 5 as the center;

[0063] The sides of the two spiral magnets 31 cover each other, and the side of the spiral magnet 31 that is not covered by the other spiral magnet 31 is the outer peripheral surface of the spiral magnet 31. The outer peripheral surface of the spiral magnet 31 is close to the inner wall surface of the housing 1.

[0064] As Figures 1-2 shown, this can further improve the uniformity of the magnetic confinement area between the two rotating spiral magnets 31 covering the bottom surface of the target 2.

[0065] Specifically, the rotation drive assembly 6 includes a motor 61, a transmission shaft 62, a driving gear 63, a driven gear 64, an upper support plate 66, and a lower support plate 67;

[0066] The inner wall of the cylinder 12 is provided with a first boss 121 and a second boss 122 that are spaced apart vertically and protrude inward respectively;

[0067] The bottom surface of the upper support plate 66 is fixed to the top surface of the first boss 121, and the bottom surface of the lower support plate 67 is fixed to the top surface of the second boss 122;

[0068] The bottom of the motor 61 is fixed to the top surface of the lower support plate 67. The output end of the motor 61 extends upward, and the driving gear 63 is sleeved on the outer peripheral surface of the output end of the motor 61;

[0069] The upper end of the transmission shaft 62 is rotatably fixed to the middle of the upper support plate 66. The lower end of the transmission shaft 62 passes through the lower support plate 67 and is connected to the top surface of the magnet mounting plate 5; the driven gear 64 is clamped on the outer peripheral surface of the middle of the transmission shaft 62, and the driving gear 63 meshes with the driven gear 64.

[0070] As Figure 1 and Figure 2 shown, the motor 61 drives the magnet mounting plate 5 to rotate through the driving gear 63, the driven gear 64, and the transmission shaft 62 in sequence, thereby driving the two spiral magnets 31 to rotate synchronously. Then, a uniform magnetic confinement area in a circular shape is formed below the bottom surface of the target 2, thereby improving the consumption uniformity of the target 2 during the magnetron sputtering process, and further improving the effective utilization rate of the target 2 and the coating efficiency of the magnetron sputtering.

[0071] Furthermore, the rotation drive assembly 6 further includes two bearings 65;

[0072] A first mounting hole 661 is provided in the middle of the upper support plate 66, and the first mounting hole 661 penetrates through the upper support plate 66;

[0073] A second mounting hole 671 is provided in the middle of the lower support plate 67, and the second mounting hole 671 penetrates through the lower support plate 67;

[0074] The outer rings of the two bearings 65 are respectively clamped in the upper and lower spaced and aligned first mounting holes 661 and second mounting holes 671. The inner rings of the two bearings 65 are respectively spaced up and down and rotatably clamped on the outer peripheral surface of the transmission shaft 62. The upper end portions of the bearings 65 protrude outside the peripheries of the upper edges of the first mounting holes 661.

[0075] As Figure 1 and Figure 2 shown, in this way, the transmission shaft 62 is rotatably fixed between the upper and lower aligned first mounting hole 661 and second mounting hole 671 through the two bearings 65, thereby improving the rotational stability and smoothness of the transmission shaft 62.

[0076] In summary, in the embodiment of the present invention as Figures 1-3 shown, the cathode device for magnetron sputtering includes two spiral magnets 31. The spiral magnet 31 is a strip-shaped spiral body that coils and extends from the center of the circle to the circumference. The two spiral magnets 31 are placed in a staggered and spaced manner with opposite magnetic pole directions. A magnetic confinement region covering the bottom surface of the target 2 is formed below the gap between the two spiral magnets 31. The planes where the bottom surfaces of the two spiral magnets 31 are located are parallel to the plane where the bottom surface of the target 2 is located. The rotation driving assembly 6 drives the magnet mounting plate 5 to rotate, which can drive the two spiral magnets 31 to rotate synchronously, so that the rotating magnetic confinement region uniformly covers the bottom surface of the target 2. There is no need to set an adjustment mechanism to adjust the distance between the spiral magnet 31 and the target 2 or the rotation angle of the spiral magnet 31. No strip-shaped grooves will be formed on the surface of the target 2 after sputter etching, which can effectively improve the consumption uniformity of the target 2 during the magnetron sputtering process, and further improve the effective utilization rate of the target 2 and the coating efficiency of the magnetron sputtering.

[0077] The technical principle of the present invention has been described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be construed as limiting the protection scope of the present invention in any way. Based on the explanations herein, those skilled in the art can think of other specific embodiments of the present invention without creative labor, and these embodiments will fall within the protection scope of the present invention.

Claims

1. A cathode device for magnetron sputtering, comprising a housing and a target, wherein the housing is electrically connected to the negative electrode of the power supply of the magnetron sputtering instrument, and is characterized in that, It further includes a magnet group, a magnet mounting plate, and a rotary drive assembly; An opening is provided at the bottom of the hollow cylindrical housing; The target, the magnet group, the magnet mounting plate, and the rotary drive assembly are sequentially installed in the housing from bottom to top; the bottom surface of the edge of the target abuts against the top surface of the edge of the opening, and the bottom surface of the target is exposed outside the opening; The magnet group includes two spiral magnets; the spiral magnet is a strip-shaped spiral body that coils and extends from the center to the circumference. The two spiral magnets are spaced apart and misaligned. The top surface of the spiral magnet abuts against the bottom surface of the magnet mounting plate; the bottom surface and the top surface of the spiral magnet are respectively two magnetic poles, and the magnetic pole directions of the two spiral magnets are opposite. The plane where the bottom surfaces of the two spiral magnets are located is parallel to the plane where the bottom surface of the target is located; The driving end of the rotary drive assembly extending downward is connected to the top surface of the magnet mounting plate; It further includes a separator plate; The housing includes an upper cover plate, a cylinder body, and a fixing ring arranged in sequence from top to bottom; The upper cover plate seals the top of the cylinder body; The opening is provided at the bottom surface of the hollow fixing ring; The inner wall surface of the fixing ring is screwed to the outer wall surface of the bottom of the hollow cylinder body; The top surface of the separator plate abuts against and seals the bottom surface of the cylinder body; the top surface of the target abuts against the bottom surface of the separator plate, and the bottom surface of the target abuts against the inner bottom surface of the edge of the opening; The magnet mounting plate is a magnetic conductor.

2. The cathode device for magnetron sputtering according to claim 1, characterized in that, The separator plate is a non-magnetic shielding body.

3. The cathode device for magnetron sputtering according to claim 1, characterized in that, The two spiral magnets have the same external dimensions, and the two spiral magnets are symmetrically distributed with the center point of the magnet mounting plate as the center; The sides of the two spiral magnets cover each other. The side of the spiral magnet not covered by the other spiral magnet is the outer peripheral surface of the spiral magnet, and the outer peripheral surface of the spiral magnet is close to the inner wall surface of the housing.

4. The cathode device for magnetron sputtering according to claim 1, wherein, The rotary drive assembly includes a motor, a transmission shaft, a driving gear, a driven gear, an upper support plate, and a lower support plate; First and second bosses that protrude inward are provided on the inner wall of the cylinder body at intervals up and down; The bottom surface of the upper support plate is fixed to the top surface of the first boss, and the bottom surface of the lower support plate is fixed to the top surface of the second boss; The bottom of the motor is fixed to the top surface of the lower support plate, the output end of the motor extends upward, and the driving gear is sleeved on the outer peripheral surface of the output end of the motor; The upper end of the transmission shaft is rotatably fixed to the middle of the upper support plate, the lower end of the transmission shaft passes through the lower support plate and is connected to the top surface of the magnet mounting plate; the driven gear is clamped on the outer peripheral surface of the middle of the transmission shaft, and the driving gear meshes with the driven gear.

5. The cathode device for magnetron sputtering according to claim 4, characterized in that, The rotary drive assembly further includes two bearings; A first mounting hole is provided in the middle of the upper support plate, and the first mounting hole penetrates through the upper support plate; A second mounting hole is provided in the middle of the lower support plate, and the second mounting hole penetrates through the lower support plate; The outer rings of the two bearings are respectively clamped in the first mounting hole and the second mounting hole which are spaced apart vertically and aligned, the inner rings of the two bearings are respectively spaced apart vertically and rotatably clamped on the outer peripheral surface of the transmission shaft, and the upper end portions of the bearings protrude outside the peripheries of the upper edges of the first mounting holes.

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