Lamp board, backlight module and display device

Abstract

The present disclosure provides a light board, a backboard, a backlight module and a display device, wherein the light board is used to be installed on the backboard of the backlight module; the light board comprises: a substrate; a plurality of light-emitting diodes arranged on the substrate, the plurality of light-emitting diodes being arranged at intervals; and a first magnetic structure for magnetically adsorbing and fixing the substrate to the backboard, wherein the first magnetic structure is configured to be magnetically attracted and have or not have magnetism. The light board, the backboard, the backlight module and the display device provided by the present disclosure can improve the problem of warping and deformation of the light board.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a lamp board, a backboard, a backlight module and a display device. Background Art

[0002] In the related art, under high temperature conditions, the lamp board of the backlight module of the display device may warp and deform, which may lead to the problem of the lamp board breaking. Summary of the invention

[0003] The embodiments of the present disclosure provide a lamp board, a backboard, a backlight module and a display device, which can improve the problem of warping and deformation of the lamp board.

[0004] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0005] In a first aspect, an embodiment of the present disclosure provides a light board for mounting on a back plate of a backlight module; the light board comprises:

[0006] substrate;

[0007] A plurality of light emitting diodes are disposed on the substrate, wherein the plurality of light emitting diodes are arranged at intervals; and

[0008] The first magnetic structure is used for magnetically adsorbing and fixing the substrate to the backplane, wherein the first magnetic structure is configured to be magnetically attractable and has magnetic properties or has no magnetic properties.

[0009] Exemplarily, the first magnetic structure includes: a plurality of first magnetic members arranged at intervals on the substrate, the first magnetic members are located in gaps between adjacent light-emitting diodes, and the orthographic projections of the first magnetic members and the light-emitting diodes on the substrate do not overlap.

[0010] Exemplarily, the light board also includes: a plurality of supports, wherein the supports are arranged on the substrate and are on the same side of the substrate as the light-emitting diodes; in a direction perpendicular to the substrate, a height of the supports protruding from the substrate is greater than a height of the light-emitting diodes protruding from the substrate, and at least a portion of the first magnetic member is configured on the supports.

[0011] Exemplarily, the support is made of a magnetic material, and the magnetic material includes a rare earth permanent magnet material.

[0012] Exemplarily, a first reflective film is provided in the gap between any two adjacent light-emitting diodes; the light board also includes a second reflective film provided on the outer surface of the support, the reflectivity difference between the second reflective film and the first reflective film is less than or equal to a first threshold, and the reflectivity of the second reflective film and the first reflective film are both greater than or equal to a second threshold.

[0013] Exemplarily, the light panel further comprises a buffer film layer wrapped on the outer surface of the support, and the surface hardness of the buffer film layer is less than the surface hardness of the support.

[0014] In a second aspect, an embodiment of the present disclosure provides a back panel for use in a backlight module, wherein the back panel includes a light board; the back panel includes a light board mounting area for mounting the light board, wherein the back panel is configured to have a second magnetic structure in the light board mounting area for adsorbing and fixing the light board magnetically, and the second magnetic structure is configured to be magnetically attractable and to be magnetic or non-magnetic.

[0015] Exemplarily, the back panel is provided with a plurality of grooves in the lamp board mounting area, the second magnetic structure includes a plurality of second magnetic parts, the second magnetic parts are embedded in the grooves, the light board includes a plurality of light-emitting diodes arranged at intervals, the second magnetic parts are arranged corresponding to the gaps between adjacent light-emitting diodes, and the second magnetic parts are made of a strong magnetic material having a magnetic strength greater than a predetermined value.

[0016] In a third aspect, an embodiment of the present disclosure provides a backlight module, including:

[0017] A light board, wherein the light board adopts the light board as described above; and

[0018] A back plate, wherein the back plate adopts the back plate as described above;

[0019] The lamp board is stacked on the lamp board installation area of ​​the back panel, and the side of the substrate away from the light-emitting diode faces the back panel, and the first magnetic structure and the second magnetic structure are magnetically attracted to each other to magnetically adsorb and fix the lamp board and the back panel.

[0020] Exemplarily, the light emitting direction of each of the light emitting diodes is toward a direction away from the substrate;

[0021] The backlight module further comprises: an optical film material, wherein the optical film material is arranged on the light emitting side of the light emitting diode;

[0022] When the light board is as described above, the buffer layer is in contact with the optical film material on the side of the support away from the substrate, and the surface hardness of the buffer layer is less than the surface hardness of the optical film material.

[0023] Exemplarily, the backlight module further includes:

[0024] A heat sink is clamped between the lamp panel and the back panel.

[0025] Exemplarily, the light board installation area includes a middle area and a peripheral area located outside the middle area; wherein, in the middle area, the light board and the back panel are magnetically adsorbed and fixed by the first magnetic structure and the second magnetic structure; in the peripheral area, the light board and the back panel are adhered and fixed by an easy-to-pull adhesive tape.

[0026] In a fourth aspect, an embodiment of the present disclosure provides a display device, comprising the backlight module as described above.

[0027] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0028] In the above scheme, by setting a first magnetic structure on the lamp board and a second magnetic structure on the back plate, the lamp board can be fixed on the back plate by magnetic adsorption. In this way, under high temperature conditions, the thermal expansion of the lamp board and the back plate is not easy to produce residual stress, the module will not warp, the warping phenomenon of the lamp board is improved, the lamp board is prevented from being broken, and the lamp board can be recycled and reused. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A partial cross-sectional schematic diagram showing the assembly structure of the light panel and the back panel provided in the embodiment of the present disclosure;

[0030] Figure 2 A partial cross-sectional schematic diagram showing the assembly structure of the light panel, the back panel, and the optical film material provided in the embodiment of the present disclosure;

[0031] Figure 3 A top view of a light panel provided in an embodiment of the present disclosure is shown;

[0032] Figure 4 A top view of a back plate provided in an embodiment of the present disclosure is shown;

[0033] Figure 5 A top view of the assembly structure of the light panel and the back panel provided in the embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0035] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] Before describing in detail the lamp board, backboard, backlight module and display device provided in the embodiments of the present disclosure, it is necessary to describe the related technologies as follows:

[0037] In the related art, when the backlight module is tested under specific conditions (such as high temperature and high humidity), the backlight module may warp. Since the back panel and the light board are adhered and fixed to each other with easy-tear tape, it is difficult for relative displacement to release the deformation caused by the warping, which causes the light board to break directly when a large deformation occurs.

[0038] According to the analysis of the inventors of the present disclosure, the reason for the warping of the backlight module is that the easy-pull tape is made of rubber, which will expand greatly at high temperatures, and it is difficult for the easy-pull tape to return to its original state after returning from high temperature to room temperature, resulting in residual stress between the easy-pull tape and the light board and backboard, which in turn causes the light board to warp and the light board to break. If double-sided tape is used to achieve mutual adhesion and fixation of the backboard and the light board, the problem of warping of the backlight module can be improved. However, due to the high viscosity of the double-sided tape, it is difficult to separate the backboard and the light board without loss once assembled, that is, it cannot be reused.

[0039] Therefore, in order to ensure the reusability of each component (lamp board or back panel) in the backlight module and improve the problem of warping of the backlight module at high temperatures, a lamp board, a back panel, a backlight module and a display device are provided in the embodiments of the present disclosure, which can improve the problem of warping and deformation of the lamp board, and the lamp board can be reused.

[0040] like Figure 1 As shown, the lamp board 10 provided in the embodiment of the present disclosure is used to be installed on the back plate 20 of the backlight module.

[0041] like Figure 1As shown, the light board 10 includes: a substrate 11, a plurality of light-emitting diodes 12 and a first magnetic structure 13, wherein the plurality of light-emitting diodes 12 are arranged on the substrate 11, and the plurality of light-emitting diodes 12 are arranged at intervals; the first magnetic structure 13 is used to magnetically adsorb and fix the substrate 11 to the back panel 20, and the first magnetic structure 13 is configured to be magnetically attractable and to be magnetic or non-magnetic.

[0042] In the above scheme, by setting the first magnetic structure 13 on the lamp board 10, the lamp board 10 and the back panel 20 can be fixed by magnetic adsorption. In this way, under high temperature conditions, the thermal expansion of the lamp board 10 and the back panel 20 is not easy to produce residual stress, the module will not warp, the warping phenomenon of the lamp board 10 is improved, the breakage of the lamp board 10 is avoided, and the lamp board 10 can be recycled and reused.

[0043] In addition, it should be noted that the first magnetic structure 13 may be magnetic itself, such as neodymium iron boron material; or may be non-magnetic itself but attracted by magnetism, such as iron, cobalt, nickel, etc.

[0044] It should also be noted that when the backlight module is undergoing an electromagnetic interference (EMI) test, the magnetic field generated by the magnet will affect the EMI test. However, the SPI (Serial Peripheral interface) signal on the light board 10 in the backlight module is a low-frequency signal, and the magnetic field mainly affects the high-frequency signal. Therefore, the magnetic field has little effect on the low-frequency signal.

[0045] In some exemplary embodiments, as shown in the figure, the first magnetic structure 13 includes: a plurality of first magnetic members 131 arranged at intervals on the substrate 11, the first magnetic members 131 are located in the gaps between adjacent light-emitting diodes 12, and the first magnetic members 131 do not overlap with the orthographic projections of the light-emitting diodes 12 on the substrate 11.

[0046] In the above scheme, the first magnetic structure 13 is provided with a plurality of first magnetic members 131 distributed between the LEDs 12 . On the one hand, it is convenient to assemble the first magnetic members 131 on the substrate 11 , and on the other hand, it can minimize the influence of the magnetic field on the LEDs 12 .

[0047] Of course, it is understandable that the first magnetic structure 13 may also be disposed at other locations. For example, the first magnetic structure 13 may be disposed around the edge of the substrate 11 .

[0048] When the light board 10 provided in the embodiment of the present disclosure is applied to a backlight module, it can be used as a direct-down light source or an edge-in light source. In some embodiments, the light board 10 includes a plurality of light-emitting diodes arranged in an array, such as Figure 2 As shown, the light-emitting diode 12 includes an inorganic light-emitting diode with a size of hundreds of microns, the backlight module may include an optical film material 30, and the optical film material 30 may be arranged on the light-emitting side of the light-emitting diode 12, and the light board 10 may be arranged between the back panel 20 of the backlight module and the optical film material 30.

[0049] like Figure 1 and Figure 3 As shown, the light board 10 also includes: a plurality of supporters 13', wherein the supporters 13' are arranged on the substrate 11 and are on the same side of the substrate 11 as the light-emitting diodes 12, and the supporters 13' can be used to contact and support the optical film material 30; in a direction perpendicular to the substrate 11, the height of the supporters 13' protruding from the substrate 11 is greater than the height of the light-emitting diodes 12 protruding from the substrate 11, and at least part of the first magnetic member 131 is configured on the supporters 13'.

[0050] By adopting the above solution, at least part of the first magnetic member 131 is disposed on the support 13 ′, and the support 13 ′ can be directly reused to support the optical film material 30 and magnetically adsorb the back plate 20 .

[0051] Of course, it is understandable that the first magnetic member 131 may be independent of the support 13'. In some embodiments, the plurality of first magnetic members 131 may be partially disposed on the support 13' and partially independently disposed.

[0052] In some embodiments, Figure 1 As shown, the support 13' is made of magnetic material, that is, the main structure of the support 13' is made of magnetic material. In other embodiments, the first magnetic member 131 is arranged on the support 13', which can be a magnet having magnetic properties fixed on the support 13'.

[0053] Exemplarily, the magnetic material includes rare earth permanent magnetic material, such as neodymium iron boron material. Neodymium iron boron is a new type of strong magnetic material, composed of elements such as neodymium, iron, and boron. Its magnetic properties are very excellent and it is one of the strongest permanent magnetic materials known. Neodymium iron boron magnets have the advantages of high magnetic energy product, high coercive force, high magnetic permeability, and high stability. Of course, it is understandable that the magnetic material of the support 13' is not limited thereto.

[0054] Furthermore, in some exemplary embodiments, Figure 1 As shown, the light emitting direction of each of the light emitting diodes 12 is toward the direction away from the substrate 11, and a first reflective film 14 is provided in the gap between any two adjacent light emitting diodes 12. The light board also includes a second reflective film 15 provided on the outer surface of the support 13', and the reflectivity difference between the second reflective film 15 and the first reflective film 14 is less than or equal to a first threshold value, and the reflectivity of the second reflective film 15 and the first reflective film 14 are both greater than or equal to a second threshold value.

[0055] In the above scheme, in order to ensure the uniformity of the light source and improve the light utilization rate, a first reflective film 14 is provided in the gap between any two adjacent light emitting diodes 12, and in order to ensure the surface reflectivity of the support 13', a second reflective film 15 can be provided on the surface of the support 13'.

[0056] The reflectivity of the second reflective film 15 and the first reflective film 14 is less than or equal to a first threshold, which means that the reflectivity of the second reflective film 15 on the surface of the support 13' is similar to the reflectivity of the first reflective film 14 on the light board 10. For example, the first threshold can be 0 or a value close to 0.

[0057] To further ensure the reflectivity, the reflectivity of the first reflective film 14 and the second reflective film 15 is greater than or equal to a second threshold value, for example, the second threshold value may be 90%. Exemplarily, the first reflective film 14 and the second reflective film 15 include but are not limited to a white ink layer.

[0058] In addition, if Figure 1 and Figure 2 As shown, in some exemplary embodiments, Figure 1 As shown, the light panel further includes a buffer film layer 16 wrapped on the outer surface of the support 13 ′, and the surface hardness of the buffer film layer 16 is less than the surface hardness of the support 13 ′.

[0059] In the above scheme, since the support 13' contacts and supports the optical film 30, in order to prevent the support 13' from scratching the surface of the optical film 30 when the optical film 30 moves in the backlight module, thereby affecting the uniformity of the image, a buffer film layer 16 may be wrapped on the surface of the support 13', and the hardness of the buffer film layer 16 is less than the surface hardness of the support 13', and preferably, the hardness of the buffer film layer 16 is less than the surface hardness of the optical film 30 in contact with it. For example, the buffer film layer 16 may be made of silicone material.

[0060] In addition, if Figure 1 As shown, in some embodiments, the light emitting diode 12 is wrapped with a protective glue 17 to protect the light emitting diode 12 .

[0061] In addition, if Figure 1 and Figure 4 As shown, an embodiment of the present disclosure provides a back panel 20 for use in a backlight module, wherein the back panel 20 includes a light board 10; the back panel 20 includes a light board mounting area A for mounting the light board 10, wherein the back panel 20 is configured to have a second magnetic structure 21 in the light board mounting area A for magnetically adsorbing and fixing the light board 10, and the second magnetic structure 21 is configured to be magnetically attractable and to be magnetic or non-magnetic.

[0062] In the above scheme, by setting a second magnetic structure 21 on the back plate 20, the lamp board 10 and the back plate 20 can be fixed by magnetic adsorption. In this way, under high temperature conditions, the thermal expansion of the lamp board 10 and the back plate 20 is not easy to produce residual stress, the module will not warp, the warping phenomenon of the lamp board 10 is improved, the lamp board 10 is prevented from being broken, and the lamp board 10 can be recycled and reused.

[0063] In addition, it should be noted that the back plate 20 may include a bottom plate 22 and a side plate 23. When the light board is used as an edge-type light source, the light board installation area A may include the side plate 23; when the light board is used as a direct-type light source, the light board installation area A may include the bottom plate 22. The second magnetic structure 21 may have magnetism itself, such as neodymium iron boron material; or it may not have magnetism itself but be attracted by magnetism, such as iron, cobalt, nickel, etc.

[0064] It should also be noted that when the backlight module is undergoing an electromagnetic interference (EMI) test, the magnetic field generated by the magnet will affect the EMI test. However, the SPI (Serial Peripheral interface) signal on the light board 10 in the backlight module is a low-frequency signal, and the magnetic field mainly affects the high-frequency signal. Therefore, the magnetic field has little effect on the low-frequency signal.

[0065] In some embodiments, Figure 1 and Figure 4 As shown, the back panel 20 is provided with a plurality of grooves 24 in the lamp board mounting area A, the second magnetic structure 21 includes a plurality of second magnetic members 211, the second magnetic members 211 are embedded in the grooves 24, the lamp board 10 includes a plurality of light-emitting diodes 12 arranged at intervals, and the second magnetic members 211 are arranged corresponding to the gaps between adjacent light-emitting diodes 12.

[0066] With the above solution, considering the weight and heat dissipation of the backlight module, the main material of the back panel 20 can be aluminum or other materials, but aluminum cannot be attracted by magnetism. Therefore, a groove 24 can be set at the position of the light board installation area A on the back panel 20 corresponding to the first magnetic part 131, and the second magnetic part 211 can be embedded in the groove 24, so that the first magnetic part 131 and the second magnetic part 211 are magnetically attracted to each other. By embedding the second magnetic part 211 in the groove 24, the flatness and strength of the back panel 20 can be ensured. For example, Figures 3 to 5 As shown, each of the second magnetic members 211 is disposed corresponding to one of the first magnetic members 131 , that is, the second magnetic members 211 and the first magnetic members 131 are fixed by point-to-point magnetic attraction.

[0067] Of course, it can be understood that the above is only an example. In other embodiments, the second magnetic structure 21 can also be set on the back plate 20 in any other suitable manner. For example, each of the second magnetic members 211 can also correspond to at least two of the first magnetic members 131.

[0068] In addition, if Figure 4 As shown, in some embodiments, a positioning mark 25 is further provided on the back plate 20 for positioning the lamp board 10 when the lamp board 10 and the back plate 20 are assembled, so that the corresponding first magnetic member 131 and the second magnetic member 211 cooperate and adsorb.

[0069] In addition, in some embodiments, in order to ensure the magnetic force between the lamp board 10 and the back plate 20, the material of the second magnetic member 211 can be selected from a strong magnetic material with a magnetic strength greater than a predetermined value, such as at least one of iron, nickel, and cobalt, or an alloy material of at least two of iron, nickel, and cobalt. It should be noted here that the magnetic strength greater than the predetermined value may refer to a magnetic induction intensity greater than 0.4 to 0.7 Tesla.

[0070] It should be noted that in order to ensure that the light board 10 does not move when the backlight module vibrates or the packaging material falls, a certain magnetic force needs to be met between the light board 10 and the back panel 20, and the magnetic force between all the first magnetic parts 211 and the second magnetic parts 211 should be greater than the impact force that the display module is subjected to when it vibrates or falls. The magnetic force depends on the magnetism, quantity and contact area of ​​the first magnetic parts 131 and the second magnetic parts 211.

[0071] For example, in some embodiments, Figures 3 to 5As shown, the first magnetic member 131 is made of rare earth magnetic material, and the second magnetic member 211 is made of ferromagnetic material. At least one first magnetic member 131 and a second magnetic member 211 are arranged between any two of the light-emitting diodes 12. The shape of the positive projection of the first magnetic member 131 and the second magnetic member 211 on the substrate 11 can be any suitable shape such as circle, rectangle, etc.

[0072] Furthermore, in some embodiments, Figure 1 As shown, the orthographic projection area of ​​the second magnetic member 211 on the substrate 11 is greater than or equal to the orthographic projection area of ​​the first magnetic member 131 on the substrate 11 .

[0073] By adopting the above scheme, since the orthographic projection of the first magnetic component 131 on the substrate 11 does not overlap with the orthographic projection of the light-emitting diode 12 on the substrate 11, the space occupied by the first magnetic component 131 on the lamp board 10 is limited. In order to ensure that the magnetic force between the first magnetic component 131 and the second magnetic component 211 meets the requirements and the assembly tolerance, the orthographic projection area of ​​the second magnetic component 211 on the substrate 11 can be designed to be greater than or equal to the orthographic projection area of ​​the first magnetic component 131 on the substrate 11 to facilitate assembly and ensure that the effective contact area between the first magnetic component 131 and the second magnetic component 211 meets the requirements.

[0074] Furthermore, in some embodiments, in order to minimize the influence of the magnetic field on the signal of the LED 12 , as shown in the figure, the orthographic projection of the second magnetic member 211 on the substrate 11 does not overlap with the orthographic projection of the LED 12 on the substrate 11 .

[0075] In addition, the embodiment of the present disclosure further provides a backlight module, which includes:

[0076] A light board 10, wherein the light board 10 is the light board 10 provided by the embodiment of the present disclosure; and

[0077] A back plate 20, wherein the back plate 20 is the back plate 20 provided by the embodiment of the present disclosure;

[0078] Among them, the lamp board 10 is stacked on the lamp board installation area A of the back panel 20, and the side of the substrate 11 facing away from the light-emitting diode 12 faces the back panel 20, and the first magnetic structure 13 and the second magnetic structure 21 are magnetically attracted to each other to magnetically adsorb and fix the lamp board 10 and the back panel 20.

[0079] In the above scheme, by setting the first magnetic structure 13 on the lamp board 10, the lamp board 10 and the back panel 20 can be fixed by magnetic adsorption. In this way, under high temperature conditions, the thermal expansion of the lamp board 10 and the back panel 20 is not easy to produce residual stress, the module will not warp, the warping phenomenon of the lamp board 10 is improved, the breakage of the lamp board 10 is avoided, and the lamp board 10 can be recycled and reused.

[0080] In some exemplary embodiments, Figure 2 As shown, the light emitting direction of each of the light emitting diodes 12 is toward a direction away from the substrate 11; the backlight module also includes: an optical film material 30, which is arranged on the light emitting side of the light emitting diode 12; on the side of the support 13' away from the substrate 11, the buffer layer is in contact with the optical film material 30, and the surface hardness of the buffer layer is less than the surface hardness of the optical film material 30.

[0081] In the above scheme, since the support 13' contacts and supports the optical film 30, in order to prevent the support 13' from scratching the surface of the optical film 30 when the optical film 30 moves in the backlight module, thereby affecting the uniformity of the image, a buffer film layer 16 may be wrapped on the surface of the support 13', and the hardness of the buffer film layer 16 is less than the surface hardness of the support 13', and preferably, the hardness of the buffer film layer 16 is less than the surface hardness of the optical film 30 in contact with it. For example, the buffer film layer 16 may be made of silicone material.

[0082] In some exemplary embodiments, Figure 1 As shown, the backlight module further includes: a heat sink 40 clamped between the light board 10 and the back board 20 .

[0083] As the distance between two magnetic objects decreases, the suction force will increase. If the light board 10 and the back panel 20 are directly attached during the assembly of the light board 10, the light board 10 may be broken into pieces. Therefore, in the above scheme, a heat sink 40 is added between the back panel 20 and the light board 10. This can ensure good thermal conductivity of the light board 10 while buffering the light board 10 to avoid the light board 10 from being broken into pieces.

[0084] In some embodiments, the heat sink 40 may be a graphene heat sink.

[0085] In addition, in order to further prevent the light board 10 from being displaced relative to the back board 20 when the backlight module is subjected to an impact, in some exemplary embodiments, Figure 4 and Figure 5As shown, the light board installation area A includes a middle area and a peripheral area located outside the middle area; wherein, in the middle area, the light board 10 and the back panel 20 are fixed by magnetic adsorption through the first magnetic structure 13 and the second magnetic structure 21; in the peripheral area, the light board 10 and the back panel 20 are fixed by adhesive tape 50.

[0086] By adopting the above scheme, magnetic attraction can be used as the main method for adsorption and fixation in the middle area between the light board 10 and the back panel 20, while the light board 10 and the back panel 20 can be supplemented by edge frame pasting with easy-tear tape. This combined fixing method with magnetic attraction as the main method and frame pasting as the auxiliary method can more effectively limit the displacement of the light board 10 relative to the back panel 20.

[0087] Specifically, in some exemplary embodiments, Figure 4 As shown, the easy-to-pull adhesive tape 50 includes at least two sub-tapes, wherein at least one sub-tape 51 extends along the first edge of the light panel 10, and at least another sub-tape 52 extends along the second edge, and the first edge is at an angle to the second edge, for example, the first edge is perpendicular to the second edge, thereby limiting the displacement of the adhesive tape relative to the back panel 20 in two directions parallel to the back panel 20.

[0088] In a fourth aspect, the embodiment of the present disclosure provides a display device, including the backlight module provided by the embodiment of the present disclosure. Obviously, the display device also has the beneficial effects brought by the backlight module provided by the embodiment of the present disclosure, which will not be described in detail here.

[0089] There are a few points to note:

[0090] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0091] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of the layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate 11 is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0092] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0093] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A light board, used for mounting on the back plate of a backlight module; characterized in that: The light board comprises: substrate; A plurality of light emitting diodes are disposed on the substrate, wherein the plurality of light emitting diodes are arranged at intervals; and A first magnetic structure for magnetically adsorbing and fixing the substrate to the backplane, wherein the first magnetic structure is configured to be magnetically attractable and has magnetic properties or has no magnetic properties; The first magnetic structure comprises: a plurality of first magnetic members arranged at intervals on the substrate; The light board further includes: a plurality of supports, which are arranged on the substrate and are located on the same side of the substrate as the light-emitting diodes, and at least part of the first magnetic member is configured on the supports.

2. The light board according to claim 1, characterized in that: The first magnetic member is located in a gap between adjacent light-emitting diodes, and the first magnetic member and the orthographic projection of the light-emitting diode on the substrate do not overlap.

3. The light board according to claim 2, characterized in that: In a direction perpendicular to the substrate, a height of the support protruding from the substrate is greater than a height of the light emitting diode protruding from the substrate.

4. The light board according to claim 3, characterized in that: The support is made of magnetic material, and the magnetic material includes rare earth permanent magnetic material.

5. The light board according to claim 3, characterized in that: A first reflective film is provided in the gap between any two adjacent light-emitting diodes; the light board also includes a second reflective film provided on the outer surface of the support, the reflectivity difference between the second reflective film and the first reflective film is less than or equal to a first threshold, and the reflectivity of the second reflective film and the first reflective film are both greater than or equal to a second threshold.

6. The light board according to claim 3, characterized in that: The light panel further comprises a buffer film layer wrapped on the outer surface of the support, and the surface hardness of the buffer film layer is less than the surface hardness of the support.

7. A backlight module, characterized in that: include: A light board, wherein the light board is a light board as claimed in any one of claims 1 to 6; and A back plate, the back plate comprising a lamp board installation area for installing the lamp board, the back plate being configured to have a second magnetic structure for adsorbing and fixing the lamp board in the lamp board installation area, the second magnetic structure being configured to be magnetically attractable and having magnetism or not having magnetism; The lamp board is stacked on the lamp board installation area of ​​the back panel, and the side of the substrate away from the light-emitting diode faces the back panel, and the first magnetic structure and the second magnetic structure are magnetically attracted to each other to magnetically adsorb and fix the lamp board and the back panel.

8. The backlight module according to claim 7, characterized in that: The back panel is provided with a plurality of grooves in the lamp board mounting area, the second magnetic structure comprises a plurality of second magnetic parts, the second magnetic parts are embedded in the grooves, the lamp board comprises a plurality of light-emitting diodes arranged at intervals, the second magnetic parts are arranged corresponding to the gaps between adjacent light-emitting diodes, and the second magnetic parts are made of a strong magnetic material having a magnetic strength greater than a predetermined value.

9. The backlight module according to claim 7, characterized in that: The light emitting direction of each light emitting diode is toward a direction away from the substrate; The backlight module further comprises: an optical film material, wherein the optical film material is arranged on the light emitting side of the light emitting diode; When the light board is the light board as claimed in claim 6, the buffer film layer is in contact with the optical film material on the side of the support away from the substrate, and the surface hardness of the buffer film layer is less than the surface hardness of the optical film material.

10. The backlight module according to claim 7, characterized in that: The backlight module also includes: A heat sink is clamped between the lamp panel and the back panel.

11. The backlight module according to claim 7, characterized in that: The light panel installation area includes a middle area and a peripheral area located outside the middle area; in In the middle area, the light board and the back plate are fixed by magnetic adsorption through the first magnetic structure and the second magnetic structure; in the peripheral area, the light board and the back plate are fixed by adhesive tape.

12. A display device, characterized in that: Comprising the backlight module as described in any one of claims 7 to 11.

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