Heat pump system and control method thereof

Abstract

The application discloses a heat dissipation device of an electric control module, a heat pump system and a control method thereof. The heat dissipation device of the electric control module comprises a shell, a liquid cooling piece, a radiator and a fan arranged in the shell. The electric control module is in heat transfer connection with the liquid cooling piece along a first direction. The liquid cooling piece has a liquid cooling channel for circulating cooling medium and is used for absorbing heat generated by the electric control module during operation. The liquid cooling piece is in heat transfer connection with the radiator along the first direction and is used for absorbing heat transferred from the liquid cooling piece. The fan is arranged on the radiator and is located on any surface of the radiator which is not arranged towards the liquid cooling piece, is used for air cooling of the radiator and is used for disturbing air around the electric control module to avoid condensation caused by overcooling of the electric control module due to the liquid cooling piece. The heat dissipation device in the technical scheme can not only sufficiently dissipate heat of the electric control module but also disturb air around the electric control module through the fan to avoid condensation on the electric control module.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology, in particular to a heat pump system and a control method thereof. BACKGROUND

[0002] A heat pump is a high-efficiency energy-saving device that makes full use of low-grade heat. Heat can spontaneously transfer from a high-temperature object to a low-temperature object, but cannot spontaneously flow in the opposite direction. The working principle of a heat pump is to force heat to flow from a low-temperature object to a high-temperature object in a reverse cycle, which only consumes a small amount of net work in the reverse cycle, and can obtain a larger amount of heat supply, so as to effectively utilize low-grade heat that is difficult to apply to achieve energy-saving purposes.

[0003] The electric control module in the heat pump system has the characteristics of large heat dissipation, if the heat cannot be dissipated in time, it is easy to cause damage to the electric control module, and increase the use cost of the user. SUMMARY

[0004] The embodiments of the present application provide a heat pump system and a control method thereof, which can fully dissipate heat of an electric control module through the combination of a liquid cooling component, a heat sink and a fan, and the fan can also disturb the air around the electric control module to avoid condensation on the electric control module.

[0005] The shell has a mounting cavity;

[0006] The liquid cooling component is arranged in the mounting cavity, the electric control module is in heat transfer connection with the liquid cooling component in a first direction, the liquid cooling component has a liquid cooling channel for circulating cooling medium, and the liquid cooling component is used to absorb heat generated by the electric control module during operation;

[0007] The heat sink is arranged in the mounting cavity, the liquid cooling component is in heat transfer connection with the heat sink in the first direction, and the heat sink is used to absorb heat transferred from the liquid cooling component; and

[0008] The fan is arranged in the mounting cavity, arranged on the heat sink and located on any surface of the heat sink that is not arranged towards the liquid cooling component, used to air-cool and dissipate heat of the heat sink, and used to disturb the air around the electric control module to avoid condensation caused by overcooling of the electric control module due to the liquid cooling component.

[0009] In some embodiments, the liquid cooling component, the heat sink and the fan are arranged in sequence in the first direction, and the heat sink is located between the liquid cooling component and the fan.

[0010] In some embodiments, the heat dissipation device further comprises:

[0011] A heat-conducting interface material piece is arranged between the liquid cooling piece and the electronic control module, and / or a heat-conducting interface material piece is arranged between the liquid cooling piece and the heat sink.

[0012] In some embodiments, the cooling medium flowing in the liquid cooling channel includes water or refrigerant, and when the cooling medium includes water, the heat dissipation device further includes:

[0013] A water pump is in communication with an external water source and the liquid cooling channel, and is used to introduce the external water source into the liquid cooling channel.

[0014] In a second aspect, the embodiments of the present application provide a heat pump system, which includes the heat dissipation device of the electronic control module of any one of the above.

[0015] An electronic control module is arranged in the mounting cavity; and

[0016] A compressor is arranged in the mounting cavity, and the electronic control module is electrically connected with the compressor to control the compressor to work.

[0017] A fan wheel is arranged in the mounting cavity, and the electronic control module is electrically connected with the fan wheel to control the fan wheel to work.

[0018] The first direction is a direction from the compressor to the fan wheel.

[0019] In some embodiments, the heat dissipation device further includes a heat exchange piece, which has:

[0020] A heat exchange channel is in communication with the liquid cooling channel of the liquid cooling piece to receive the cooling medium output from the liquid cooling channel; and

[0021] A refrigerant channel is separated from the heat exchange channel,

[0022] The refrigerant channel is in communication with the gas outlet of the compressor to receive high-temperature refrigerant and heat the cooling medium in the heat exchange channel, so that when the cooling medium is water, the heat exchange channel can output hot water; or,

[0023] The refrigerant channel is in communication with the gas inlet of the compressor to receive low-temperature refrigerant and cool the cooling medium in the heat exchange channel, and the output end of the liquid cooling channel is in communication with the input end of the heat exchange channel, and the output end of the heat exchange channel is in communication with the input end of the liquid cooling channel, so that the cooled cooling medium reflows into the liquid cooling channel.

[0024] In some embodiments, when the refrigerant passage is in communication with the gas outlet of the compressor to receive high-temperature refrigerant and heat the cooling medium in the heat exchange passage, the heat pump system further comprises:

[0025] a first flow path switching member, a first valve port of the first flow path switching member being in communication with the first end of the heat exchange passage;

[0026] a cold water pipeline, the cold water pipeline being in communication with a second valve port of the first flow path switching member and being used to connect an external water source;

[0027] a water pump, an input end of the water pump being in communication with a third valve port of the first flow path switching member, an output end of the water pump being in communication with an input end of the liquid cooling passage, and an output end of the liquid cooling passage being in communication with the second end of the heat exchange passage.

[0028] a hot water pipeline, one end of the hot water pipeline being in communication with the second end of the heat exchange passage.

[0029] In some embodiments, the heat pump system further comprises:

[0030] a first flow path switching member, a first valve port of the first flow path switching member being in communication with the first end of the heat exchange passage;

[0031] a cold water pipeline, the cold water pipeline being in communication with a second valve port of the first flow path switching member and being used to connect an external water source;

[0032] a water pump, an input end of the water pump being in communication with a third valve port of the first flow path switching member, an output end of the water pump being in communication with an input end of the liquid cooling passage, and an output end of the liquid cooling passage being in communication with the second end of the heat exchange passage.

[0033] In some embodiments, the heat pump system further comprises:

[0034] a hot water pipeline, one end of the hot water pipeline being in communication with the second end of the heat exchange passage;

[0035] a switch valve, the switch valve being arranged on the hot water pipeline.

[0036] In some embodiments, the heat pump system further comprises:

[0037] a refrigerant outlet pipeline, the refrigerant outlet pipeline being in communication with the gas outlet;

[0038] a refrigerant inlet pipeline, the refrigerant inlet pipeline being in communication with the gas inlet;

[0039] a second flow path switching member, a first valve port of the second flow path switching member being in communication with the input end of the refrigerant passage, a second valve port of the second flow path switching member being in communication with the refrigerant outlet pipe, and a third valve port of the second flow path switching member being in communication with the refrigerant inlet pipe, so as to divert part of the high-temperature refrigerant from the refrigerant outlet pipe to the refrigerant passage when heating of the cooling medium is required;

[0040] a third flow path switching member, a first valve port of the third flow path switching member being in communication with the output end of the refrigerant passage, a second valve port of the third flow path switching member being in communication with the refrigerant outlet pipe, and a third valve port of the third flow path switching member being in communication with the air inlet port.

[0041] In some embodiments, further comprising:

[0042] a humidity sensor installed on the heat sink or the electronic control module, for detecting the ambient humidity around the electronic control module;

[0043] a first temperature sensor installed on the heat sink or the electronic control module, for detecting the ambient temperature around the electronic control module;

[0044] a second temperature sensor installed on the electronic control module, for detecting the surface temperature of the electronic control module; or

[0045] the protection level of the electronic control module is IP68.

[0046] In some embodiments, the heat pump system further comprises a heating member arranged in the space where the electronic control module is located, so as to increase the surface temperature of the electronic control module, or the liquid cooling passage is arranged in a curved manner.

[0047] In a third aspect, the embodiments of the present application provide a control method of a heat pump system, the control method comprising the following steps:

[0048] obtaining the dew point temperature of the environment where the electronic control module is located and the surface temperature of the electronic control module;

[0049] based on the condition that the surface temperature is less than or equal to the dew point temperature, controlling the fan to be in an operating state, so as to perform air cooling heat dissipation on the heat sink and disturb the air around the electronic control module, so as to avoid the overcooling of the electronic control module caused by the liquid cooling member and the generation of condensation.

[0050] In some embodiments, before the step of obtaining the dew point temperature of the environment where the electronic control module is located and the surface temperature of the electronic control module, the method further comprises:

[0051] obtaining the ambient temperature;

[0052] control the cooling medium to flow in the liquid cooling channel in the liquid cooling component based on a condition that the ambient temperature is greater than a first preset temperature, to dissipate heat of the electronic control module.

[0053] In some embodiments, the step of obtaining the ambient temperature further comprises:

[0054] control the fan to be in an operating state based on a condition that the ambient temperature is greater than a second preset temperature, wherein the second preset temperature is greater than the first preset temperature.

[0055] In some embodiments, the step of obtaining the ambient temperature further comprises:

[0056] control the fan to be in an operating state and control the cooling medium to stop flowing in the liquid cooling channel in the liquid cooling component based on a condition that the ambient temperature is less than the first preset temperature.

[0057] In a fourth aspect, an embodiment of the present application provides a computer storage medium storing a plurality of instructions, the instructions being suitable for being loaded by a processor and performing steps of the control method in any of the above aspects

[0058] The present application has the following advantages: the electronic control module and the heat sink are connected with the liquid cooling component; when the electronic control module generates heat, the heat on the electronic control module can be transferred to the liquid cooling component, and the heat on the liquid cooling component can be transferred to the heat sink, and the heat sink is air-cooled by the fan. Meanwhile, when the cooling medium in the liquid cooling component flows and causes the surface temperature of the electronic control module to be too low to generate condensation, the air around the electronic control module can be disturbed by the air force generated by the rotation of the fan, so as to reduce the ambient temperature and the ambient humidity around the electronic control module, and prevent the generation of condensation. BRIEF DESCRIPTION OF DRAWINGS

[0059] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in the drawings without creative labor.

[0060] Figure 1 FIG. 1 is a structural schematic diagram of an embodiment of the heat pump system of the present application;

[0061] Figure 2 FIG. 2 is a structural schematic diagram of the heat pump system of the present application; Figure 1 FIG. 3 is an enlarged view of part A in FIG. 2;

[0062] Figure 3 FIG. 4 is an enlarged view of part B in FIG. 2; Figure 1 ​

[0063] Figure 4 A schematic diagram of a liquid cooling channel structure in an embodiment of the heat dissipation device of the present application;

[0064] Figure 5 A schematic diagram of cooling medium flow in the heat pump system of the present application in an embodiment when the refrigerant channel is heated by the heat exchange channel;

[0065] Figure 6 A schematic diagram of cooling medium flow in the heat pump system of the present application in another embodiment when the refrigerant channel is heated by the heat exchange channel;

[0066] Figure 7 A schematic diagram of cooling medium flow in the heat pump system of the present application in still another embodiment when the refrigerant channel is heated by the heat exchange channel;

[0067] Figure 8 A schematic diagram of cooling medium flow in the heat pump system of the present application in an embodiment when the refrigerant channel is cooled by the heat exchange channel;

[0068] Figure 9 A schematic diagram of cooling medium flow in the heat pump system of the present application in another embodiment when the refrigerant channel is cooled by the heat exchange channel;

[0069] Figure 10 A schematic diagram of refrigerant flow in the heat pump system of the present application in an embodiment in a heating condition;

[0070] Figure 11 A schematic diagram of refrigerant flow in the heat pump system of the present application in an embodiment in a cooling condition;

[0071] Figure 12 A schematic diagram of the method flow in an embodiment of the control method of the heat pump system of the present application;

[0072] Figure 13 A schematic diagram of the method flow in still another embodiment of the control method of the heat pump system of the present application.

[0073] Explanation of reference numerals:

[0074] 10, control module; 11, circuit board; 12, transistor; 20, heat dissipation device; 21, liquid cooling member; 22, heat sink; 23, fan; 24, heat conductive interface material member; 25, water pump; 30, outdoor heat exchanger; 31, fan wheel; 40, housing; 40a, mounting cavity; 50, compressor; 51, gas outlet; 52, gas inlet; 60, heat exchange member; 61, first end; 62, second end; 70, first flow path switching member; 81, first pipeline; 82, second pipeline; 83, third pipeline; 84, cold water pipeline; 85, hot water pipeline; 86, cold water outlet pipe; 87, cold water inlet pipe; 90, second temperature sensor; 100, on-off valve; 110, four-way valve; 120, indoor heat exchanger; 130, second flow path switching member; 140, third flow path switching member; 150, throttling device.

[0075] The purposes, functional characteristics and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0076] In order to make the purposes, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0077] The following description relates to the accompanying drawings, unless otherwise indicated, the same reference numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all the embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0078] In the description of the present application, it should be understood that the terms "first", "second" and the like are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance. For those skilled in the art, the specific meanings of the above terms in the present application can be understood in specific cases. In addition, in the description of the present application, unless otherwise specified, "multiple" means two or more. "And / or", the association between the associated objects, means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. The character " / " generally represents that the associated objects before and after are in an "or" relationship.

[0079] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0080] Heat pump is a kind of high efficiency energy saving device which makes full use of low grade heat. Heat can spontaneously transfer from high temperature object to low temperature object, but cannot spontaneously transfer in the opposite direction. The working principle of heat pump is to force heat to flow from low temperature object to high temperature object in reverse cycle, which only consumes a small amount of reverse cycle net work, and can obtain a larger heat supply, so as to effectively utilize low grade heat which is difficult to apply to achieve energy saving purpose.

[0081] The electric control module in the heat pump system has the characteristics of large heat generation. If the heat cannot be dissipated in time, the electric control module is easy to be damaged, and the use cost of the user is increased.

[0082] At present, the electric control module is generally cooled by the heat transfer of refrigerant, that is, the heat on the electric control module is taken away by the refrigerant. However, the refrigerant is generally flammable, in order to prevent the refrigerant pipeline from leaking onto the electric control module to cause the combustion of the electric control module, the electric control module can only be made into a sealed structure. When the electric control module is cooled by the heat conduction of the refrigerant, the temperature of the shell on the electric control module may be lower than the temperature of the environment around the electric control module, which will cause the condensation phenomenon of the electric control shell, and the condensation will cause the short circuit failure of the components near the outside of the electric control shell.

[0083] Please refer to Figures 1 to 4 The first aspect of the present application proposes a heat dissipation device 20 of an electric control module 10, the heat dissipation device 20 is used for cooling the electric control module 10, the electric control module 10 can be the electric control module 10 of various electronic devices, and the following will be described taking the electric control module 10 of the heat pump system as an example. In the embodiment of the present application, the heat dissipation device 20 of the electric control module 10 includes a shell 40, a liquid cooling component 21, a radiator 22 and a fan 23. The shell 40 has a mounting cavity 40a, and the electric control module 10 is generally arranged in the mounting cavity 40a and protected by the shell 40, but the mounting cavity 40a is relatively closed, which also causes the electric control module 10 to be difficult to dissipate heat to the outside. The liquid cooling component 21, the radiator 22 and the fan 23 are all arranged in the mounting cavity 40a, and are used for fully cooling the electric control module 10. Exemplarily, the right to left direction in Figure 1 The heat dissipation device 20 of the present embodiment is described.

[0084] The electric control module 10 is arranged in the mounting cavity 40a and is in heat transfer connection with the liquid cooling member 21 along the first direction C. The liquid cooling member 21 has a liquid cooling channel for flowing cooling medium, and is used to absorb heat generated by the electric control module 10 during operation. The connection mode between the liquid cooling member 21 and the electric control module 10 is not limited, including but not limited to screw connection and welding. The connection mode between the liquid cooling member 21 and the heat sink 22 is also not limited, including but not limited to screw connection and welding. In order to store more cooling medium in the liquid cooling channel and improve the heat exchange efficiency, the liquid cooling channel can be arranged in a curved shape, for example, an "S" type flow channel, a polyline channel, a wave type channel, a zigzag type channel, etc.

[0085] The heat sink 22 is arranged in the mounting cavity 40a, and the liquid cooling member 21 is in heat transfer connection with the heat sink 22 along the first direction C, and is used to absorb heat transferred from the liquid cooling member 21. In some specific embodiments, the liquid cooling member 21 is arranged on the heat generating side of the electric control module 10, so as to more efficiently dissipate heat from the electric control module 10. The heat sink 22 can be a fin heat sink 22 or a semiconductor heat sink 22.

[0086] Based on the above embodiment, by arranging the electric control module 10, the liquid cooling member 21 and the heat sink 22 along the first direction C in sequence, that is, from right to left in sequence, the heat generated by the electric control module 10 during operation can be transferred along the first direction C away from the electric control module 10, thereby achieving heat dissipation of the electric control module 10, and avoiding the heat being transmitted back to the side of the electric control module 10, which is conducive to heat dissipation of the electric control module 10 to the surrounding environment.

[0087] The fan 23 is arranged in the mounting cavity 40a, and the fan 23 is arranged on the heat sink 22 and located on any surface of the heat sink 22 which is not arranged towards the liquid cooling member 21, for example Figure 1 and Figure 2 As shown in the left side of the heat sink 22 towards the liquid cooling member 21, the fan 23 can be arranged on the right side, the upper side, the lower side, the front side or the rear side of the heat sink 22. The fan 23 is used for air cooling of the heat sink 22, and is used for disturbing air around the electric control module 10 to avoid condensation caused by overcooling of the electric control module 10 due to the liquid cooling member 21. The fan 23 can be an axial fan 23 or a cross-flow fan 23, and the type of the fan 23 is not limited in the embodiment.

[0088] In some embodiments, the liquid cooling member 21, the heat sink 22 and the fan 23 are sequentially arranged along the first direction C, the heat sink 22 is located between the liquid cooling member 21 and the fan 23, and the fan 23 is arranged on the right side of the heat sink 22 or the side facing the right side, that is, the electric control module 10, the liquid cooling member 21, the heat sink 22 and the fan 23 are sequentially arranged from right to left, so that the heat generated by the electric control module 10 during operation can be transmitted farther away from the electric control module 10 along the first direction C, thereby achieving heat dissipation of the electric control module 10, and further avoiding the heat being transmitted back to the side of the electric control module 10, which is conducive to heat dissipation of the electric control module 10 to the surrounding environment.

[0089] The electric control module 10 and the heat sink 22 in the technical scheme of the present application are connected with the liquid cooling member 21. When the electric control module 10 generates heat during operation, the heat on the electric control module 10 can be transmitted to the liquid cooling member 21, and the heat on the liquid cooling member 21 can be transmitted to the heat sink 22. When the heat is transmitted to the heat sink 22, the fan 23 is started to perform air cooling and heat dissipation of the heat sink 22. At the same time, when the cooling medium in the liquid cooling member 21 flows to cause the surface temperature of the electric control module 10 to be too low and condensation to occur, the air flow generated by the rotation of the fan 23 can disturb the air around the electric control module 10, thereby reducing the ambient temperature around the electric control module 10 and preventing condensation from occurring on the surface of the electric control module 10.

[0090] In some embodiments, the electric control module 10 can be an electric control box or an electric control component. The electric control module 10 is provided with an electric control shell, the inside of the electric control shell is provided with a circuit board 11 and a transistor 12, for example, a PCB (Printed Circuit Board, circuit board 11) and an IGBT transistor 12 (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor 12); the transistor 12 is connected with the circuit board 11, and the heat generating side of the electric control module 10 is mainly the side close to the transistor 12. It can be understood that the liquid cooling member 21 is connected with the side close to the transistor 12 of the electric control module 10.

[0091] In other embodiments, in order to transmit as much heat on the electric control module 10 as possible to the liquid cooling member 21, one side of the liquid cooling member 21 is connected with the heat generating side of the electric control module 10. The other side opposite to the liquid cooling member 21 is connected with the bottom plate of the heat sink 22, so as to transmit as much heat on the liquid cooling member 21 as possible to the heat sink 22.

[0092] It should be noted that when the heat sink 22 is a fin heat sink 22, the fan 23 can be arranged on the heat dissipation fins of the heat sink 22 or near the heat dissipation fins, and the air flow formed by the rotation of the fan 23 can not only cool the heat dissipation fins, but also stir the air around the electric control module 10, so that the temperature of the air around the electric control module 10 is reduced, and the moisture in the air is also reduced.

[0093] Please refer to Figure 1 , the shell 40 can be a heat pump shell of a heat pump system, and the electric control module 10 can be arranged inside the heat pump shell of the heat pump system. When the temperature of the electric control module 10 is less than the ambient temperature inside the heat pump shell, condensation is likely to occur on the surface of the shell of the electric control module 10. The design of the fan 23 not only reduces the ambient temperature around the electric control module 10, but also reduces the moisture content in the air around the electric control module 10, which can effectively prevent the occurrence of condensation problems. It should be noted that condensation refers to the phenomenon that when the inner wall or outer surface of a cabinet / shell / box, etc. drops below the dew point temperature, water droplets will condense on the inner wall or outer surface of the cabinet / shell. Whether condensation occurs depends on the temperature inside the cabinet / shell / box, the temperature outside the cabinet / shell / box, the relative environmental humidity, and the dew point temperature.

[0094] In some embodiments, the electric control module 10 can include an electric control shell and electronic devices arranged in the electric control shell. In order to prevent condensation problems from occurring inside the electric control shell, the electric control module 10 has an IP68 (INGRESS PROTECTION) protection level. Under this protection level, the dust and moisture inside the electric control shell can be removed and treated at the beginning of the design of the electric control module 10. When the outer surface of the electric control shell may have a condensation problem, the interior of the electric control shell will not have a condensation problem.

[0095] Referring to Figure 2 and Figure 3 , in some embodiments, the heat dissipation device 20 further includes a heat-conducting interface material piece 24, which is arranged between the liquid cooling piece 21 and the electric control module 10, or arranged between the liquid cooling piece 21 and the heat sink 22, or arranged between the liquid cooling piece 21 and the electric control module 10 and between the liquid cooling piece 21 and the heat sink 22.

[0096] In this embodiment, in order to make the heat on the electric control module 10 be transferred to the liquid cooling piece 21 more efficiently, a heat-conducting interface material piece 24 is arranged between the liquid cooling piece 21 and the electric control module 10. The heat-conducting interface material piece 24 can be made of a material with good heat conductivity, such as heat-conducting silicone grease or heat-conducting pad, etc. The heat-conducting interface material piece 24 is clamped between the liquid cooling piece 21 and the heat generating side of the electric control module 10, and tightly contacts the heat generating source of the transistor 12 of the electric control module 10.

[0097] Similarly, in order to make the heat on the liquid cooling part 21 more efficiently transferred to the heat sink 22, a heat-conducting interface material part 24 is arranged between the liquid cooling part 21 and the heat sink 22, the heat-conducting interface material part 24 is connected to the side of the liquid cooling part 21 away from the electronic control module 10 or to any side of the liquid cooling part 21 not connected to the electronic control module 10, and the heat-conducting interface material part 24 is also connected to the heat sink 22 and is pressed at the bottom plate of the heat sink 22.

[0098] It should be noted that in order to make the heat-conducting interface material part 24 more closely adhere to the side of the liquid cooling part 21 and the side of the electronic control module 10, the surface of the heat-conducting interface material part 24 connected to the liquid cooling part 21 and the electronic control module 10 is a flat surface. Similarly, in order to make the heat-conducting interface material part 24 more closely adhere to the side of the liquid cooling part 21 and the bottom surface of the heat sink 22, the surface of the heat-conducting interface material part 24 connected to the liquid cooling part 21 and the heat sink is a flat surface.

[0099] In some embodiments, when the cooling medium includes water, the heat dissipation device 20 further includes a water pump 25, which is in communication with an external water source and the liquid cooling channel, for introducing the external water source into the liquid cooling channel. In order to drive the external water source to enter the liquid cooling channel of the liquid cooling part 21, a water pump 25 is also provided, which is in communication with an external water source and the liquid cooling channel, so that the water pump 25 can continuously transport the external low-temperature water source to the liquid cooling channel, thereby continuously cooling the electronic control module 10 by liquid cooling.

[0100] Specifically, when the electronic control device is applied to a heat pump system, the heat pump system further includes a heat exchanger, and the heat dissipation device 20 further includes a first pipeline 81 and a second pipeline 82. The input end of the first pipeline 81 is connected to an external water source, the output end of the first pipeline 81 is in communication with the input end of the liquid cooling channel, and the water pump 25 is arranged on the first pipeline 81. The input end of the second pipeline 82 is in communication with the output end of the liquid cooling channel, and the output end of the second pipeline 82 is in communication with the input end of the heat exchange part 60.

[0101] Please refer to Figure 1The application also provides a heat pump system, which can be an air conditioning system or a hot water system. The heat pump system comprises an electric control module 10, a heat pump shell (the heat pump shell is a specific embodiment of the aforementioned shell 40), a fan wheel 31, a compressor 50, and the heat dissipation device 20 of the electric control module 10. The electric control module 10, the fan wheel 31, the compressor 50, the heat exchange element 60, and the heat dissipation device 20 of the electric control module 10 are all arranged in the heat pump shell. The specific structure of the heat dissipation device 20 of the electric control module 10 is as described above. The electric control module 10 is electrically connected with the fan wheel 31 to control the operation of the fan wheel 31. The electric control module 10 is also electrically connected with the compressor 50 to control the operating frequency of the compressor 50. A large amount of heat is generated during the operation of the electric control module 10. Since the heat dissipation device 20 adopts all the technical solutions of the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, that is, the electric control module 10 can be fully cooled by the heat dissipation device 20, and the risk of condensation on the surface of the electric control module 10 can also be reduced.

[0102] Specifically, the first direction C is a direction from the compressor 50 to the fan wheel 31, that is Figure 1 The heat generated by the heat source, that is, the electric control module 10, can be transmitted to the space where the fan wheel 31 is located along the first direction C through the liquid cooling element 21, the heat sink 22, and the fan 23. The heat can be further transmitted to the outside of the shell 40 through the fan wheel 31, so that the heat can be transmitted to the outside of the mounting cavity 40a, which is conducive to reducing the temperature in the mounting cavity 40a and facilitating the heat dissipation of the electric control module 10 to the air in the mounting cavity 40a.

[0103] Please refer to Figure 1 In some embodiments, the heat pump system further comprises a heat exchange element 60, which has a heat exchange channel and a refrigerant channel that are isolated from each other. The heat exchange channel is in communication with the liquid cooling channel of the liquid cooling element 21 to receive the cooling medium output from the liquid cooling channel. For example, the heat exchange element 60 can be a plate heat exchanger 60, and the type of heat exchange element 60 is not limited herein. The heat exchange element 60 comprises a heat exchange channel and a refrigerant channel, and the heat exchange channel and the refrigerant channel are not in communication with each other, but can exchange heat. The cooling medium in the heat exchange channel can be water, and the refrigerant in the refrigerant channel can be R2 refrigerant, and the refrigerant in the refrigerant channel is not limited herein.

[0104] Please refer to Figure 1 , Figures 5-7 and Figure 10 In some embodiments, for the heating condition of the heat pump system, the refrigerant channel is in communication with the gas outlet 51 of the compressor 50 to receive high-temperature refrigerant and heat the cooling medium in the heat exchange channel, so that when the cooling medium is water, the heat exchange channel can output hot water.

[0105] Specifically, for the heating mode of the heat pump system, when the heat pump system is heating, the high-temperature and high-pressure gas led out from the gas outlet 51 of the compressor 50 passes through the four-way valve 110 to the indoor heat exchanger 120, at this time, the indoor heat exchanger 120 corresponds to a condenser, the condenser discharges heat and obtains a medium-temperature and high-pressure liquid; the medium-temperature and high-pressure liquid becomes a low-temperature and low-pressure liquid through an expansion valve or a throttling element; the low-temperature and low-pressure liquid enters the outdoor heat exchanger 30 again, at this time, the outdoor heat exchanger 30 corresponds to an evaporator, the low-temperature and low-pressure liquid absorbs heat from the outside under the action of the outdoor heat exchanger 30 and obtains a low-temperature and low-pressure gas; the low-temperature and low-pressure gas finally reenters the compressor 50 through the gas inlet 52 of the compressor 50. Referring to FIG. 1, the heat pump system is in the heating mode, and the fan 31 is started to cool the outdoor heat exchanger 30. Figures 5-7 When the outdoor heat exchanger 30 is operating, the fan 31 is started to cool the outdoor heat exchanger 30.

[0106] When the heat pump system is in the heating state and combined with the heat exchange element 60 of the present embodiment, the refrigerant channel of the heat exchange element 60 is in communication with the gas outlet 51 of the compressor 50, thus, can receive the high-temperature and high-pressure gas, the high-temperature gas is used to heat the water in the heat exchange channel of the heat exchange element 60, thus, the heat exchange channel can output hot water to the outside for use by the user.

[0107] Please refer to Figure 1 , Figures 8-9 and Figure 11 In other embodiments, for the cooling mode of the heat pump system, the refrigerant channel is in communication with the gas inlet 52 of the compressor 50 to receive the low-temperature refrigerant and cool the cooling medium in the heat exchange channel, and the output end of the liquid cooling channel is in communication with the input end of the heat exchange channel, and the output end of the heat exchange channel is in communication with the input end of the liquid cooling channel, so that the cooled cooling medium reflows into the liquid cooling channel.

[0108] Specifically, when the heat pump system is cooling, the high-temperature and high-pressure gas led out from the gas outlet 51 of the compressor 50 first passes through the four-way valve 110 to enter the outdoor heat exchanger 30, at this time, the outdoor heat exchanger 30 corresponds to a condenser, the high-temperature and high-pressure gas discharges heat to the outside under the action of the outdoor heat exchanger 30 and obtains a medium-temperature and high-pressure liquid; the medium-temperature and high-pressure liquid becomes a low-temperature and low-pressure liquid through an expansion valve or a throttling element; the low-temperature and low-pressure liquid enters the indoor heat exchanger 120 again, at this time, the indoor heat exchanger 120 corresponds to an evaporator, the low-temperature and low-pressure liquid absorbs heat from the inside under the action of the indoor heat exchanger 120 and cools the indoor (when the heat pump system is an air conditioning system) and obtains a low-temperature and low-pressure gas; the low-temperature and low-pressure gas finally reenters the compressor 50 through the gas inlet 52 of the compressor 50.

[0109] When the heat pump system is in the heating state and combined with the heat exchange member 60 of the present embodiment, the refrigerant channel of the heat exchange member 60 is in communication with the gas inlet 52 of the compressor 50, and thus can receive low-temperature and low-pressure gas. The low-temperature and low-pressure gas is used to cool the cooling medium (including water or other cooling medium) in the heat exchange channel of the heat exchange member 60, and thus the cooled cooling medium can be re-input into the liquid cooling member 21. That is, the same cooling medium is cooled by the refrigerant, and the cooling medium is circulated between the heat exchange member 60 and the liquid cooling member 21, thereby continuously dissipating heat from the electronic control module 10.

[0110] Please refer to Figure 1 , Figures 5-7 and Figure 10 In some embodiments, for the heating working condition of the heat pump system, when the refrigerant channel is in communication with the gas outlet 51 of the compressor 50 to receive high-temperature refrigerant and heat the cooling medium in the heat exchange channel, the heat pump system further comprises a water pump 25, a first flow path switching member 70, a first pipe 81, a second pipe 82, a third pipe 83, a cold water pipe 84, and a hot water pipe 85. The first flow path switching member 70 can be a three-way element, such as a three-way valve or a three-way element composed of multiple valves.

[0111] Specifically, the heat exchange channel can include a first end 61 and a second end 62; two ends of the third pipe 83 are in communication with the first valve port of the first flow path switching member 70 and the first end 61 of the heat exchange channel, respectively, i.e., the first valve port of the first flow path switching member 70 and the first end 61 of the heat exchange channel are in communication at this time; one end of the cold water pipe 84 is in communication with the second valve port of the first flow path switching member 70, and the other end is in communication with an external water source; the input end of the first pipe 81 is in communication with the third valve port of the first flow path switching member 70, and the output end of the first pipe 81 is in communication with the input end of the liquid cooling channel; the water pump 25 is connected to the first pipe 81, and the water pump 25 can drive the external water source to flow into the liquid cooling channel along the first pipe 81. The input end of the second pipe 82 is in communication with the output end of the liquid cooling channel, and the output end of the second pipe 82 is in communication with the second end 62 of the heat exchange channel. One end of the hot water pipe 85 is in communication with the second end 62 of the heat exchange channel, and the hot water pipe 85 can discharge hot water in the heat exchange channel.

[0112] It should be noted that due to the presence of the first flow path switching member 70, when the cooling medium in the heat exchange channel is water, there are three forms of heating treatment for the water:

[0113] First: refer to Figure 5, the first flow path switching piece 70 is a two-in-one-out split valve, or a pipeline communication piece is provided, and the pipeline communication piece is provided with three valve ports, each of which is communicated with the third pipeline 83, the first pipeline 81 and the cold water pipeline 84. At this time, the three valve ports can be opened at the same time, and the external water source enters the heat exchange channel and the liquid cooling channel at the same time. That is, the external water source with a lower temperature enters the heat exchange channel through the cold water pipeline 84, the third pipeline 83 and the first end 61 of the heat exchange channel in sequence. At this time, the high-temperature refrigerant in the refrigerant channel heats the external water source entering the heat exchange channel, and then the hot water flows into the hot water pipeline 85 through the second end 62 of the heat exchange channel and is transmitted to the external hot water heating device for use by the user. And the external water source with a lower temperature enters the heat exchange channel through the cold water pipeline 84, the first pipeline 81, the liquid cooling channel, the second pipeline 82 and the second end 62 of the heat exchange channel in sequence. When the water in the heat exchange channel is heated to hot water with a preset temperature, the hot water flows into the hot water pipeline 85 through the second end 62 of the heat exchange channel and is transmitted to the external hot water heating device.

[0114] Second: refer to Figure 6 In some embodiments, the first valve port and the second valve port of the first flow path switching piece 70 are opened, and the third valve port is closed. At this time, the external water source with a lower temperature enters the heat exchange channel through the cold water pipeline 84, the third pipeline 83 and the first end 61 of the heat exchange channel in sequence. At this time, the high-temperature refrigerant in the refrigerant channel heats the external water source entering the heat exchange channel, and then the hot water flows into the hot water pipeline 85 through the second end 62 of the heat exchange channel and is transmitted to the external hot water heating device for use by the user.

[0115] Third: refer to Figure 7 In another embodiment, the first valve port of the first flow path switching piece 70 is closed, and the second valve port and the third valve port of the first flow path switching piece 70 are opened. At this time, the external water source with a lower temperature enters the heat exchange channel through the cold water pipeline 84, the first pipeline 81, the liquid cooling channel, the second pipeline 82 and the second end 62 of the heat exchange channel in sequence. When the water in the heat exchange channel is heated to hot water with a preset temperature, the hot water flows into the hot water pipeline 85 through the second end 62 of the heat exchange channel and is transmitted to the external hot water heating device. A corresponding pipeline switch element can be provided at the second end 62. When the second pipeline 82 is filled with water, the hot water pipeline 85 is closed; when it is necessary to discharge the hot water from the heat exchange channel, the second pipeline 82 is closed, the hot water pipeline 85 is opened, and is transmitted to the external hot water heating device. At this time, another water pump 25 can be provided in the hot water pipeline 85 to pump the water in the heat exchange channel out to the hot water heating device.

[0116] It should be noted that in different flow path conditions, the first end 61 of the heat exchange channel can be used as an input end or an output end; similarly, the second end 62 can be used as an input end or an output end.

[0117] Please refer to Figure 1 , Figures 8-9 and Figure 11 , in some embodiments, for the refrigeration working condition of the heat pump system, different from the above-mentioned embodiments shown in Figures 5-7 , at this time, the hot water pipeline 85 can be removed. At this time, the second valve port and the third valve port of the first flow path switching piece 70 are opened, and the first valve port is closed. The external water source passes through the cold water pipeline 84, the first pipeline 81, the liquid cooling channel, the second pipeline 82 and the heat exchange channel in turn. Then, the first valve port and the third valve port of the first flow path switching piece 70 are opened, and the second valve port is closed. At this time, the liquid cooling channel and the heat exchange channel are filled with water, and a circulating flow channel is formed between the liquid cooling channel and the heat exchange channel. The water pump 25 can drive the cooling medium in the circulating flow channel to circulate. The cooling medium passes through the water pump 25, the first pipeline 81, the liquid cooling channel, the second pipeline 82 and the heat exchange channel in turn and returns to the water pump 25. Since the low-temperature refrigerant in the refrigerant channel can cool and cool the cooling medium in the heat exchange channel, the cooling medium in the circulating flow channel can be reused and heat dissipation for the electronic control module 10. It should be noted that in the refrigeration working condition, the low-temperature refrigerant from the suction port 52 of the compressor 50 can be directly connected to the liquid cooling piece 21 to directly cool the liquid cooling piece 21.

[0118] In yet another embodiment, based on Figure 8 the above-mentioned embodiments, for the heating working condition of the heat pump system, the heat pump system further comprises a hot water pipeline 85 and a switch valve 100 provided on the hot water pipeline 85. One end of the hot water pipeline 85 is in communication with the second end 62 of the heat exchange channel, and the switch valve 100 is provided on the hot water pipeline 85 to control the flow of water in the hot water pipeline 85. At this time, when the electronic control module 10 is cooled, the second valve port and the third valve port of the first flow path switching piece 70 are opened, and the first valve port is closed. The external water source passes through the cold water pipeline 84, the first pipeline 81, the liquid cooling channel, the second pipeline 82 and the heat exchange channel in turn. It should be noted that when the external water source passes through the liquid cooling channel, the heat in the liquid cooling channel will be taken away, and at this time the external water source will be heated. When the heated water passes through the heat exchange channel, the switch valve 100 can be opened, and the heated water directly flows into the hot water pipeline 85 through the second end 62 of the heat exchange channel. It should be noted that in different flow paths, the first end 61 of the heat exchange channel can be used as an input end or an output end; similarly, the second end 62 can be used as an input end or an output end.

[0119] In some embodiments, based on Figures 10-11 Figures 10-11 ​In the embodiment shown in the figure, the heat pump system is further provided with a second flow path switching member 130, a third flow path switching member 140 and a throttling device 150. The second flow path switching member 130 and the third flow path switching member 140 can be three-way elements such as three-way valves or three-way elements composed of multiple valves. The throttling device 150 can be an electronic expansion valve. The refrigerant outlet pipe is in communication with the gas outlet 51. The refrigerant inlet pipe is in communication with the gas inlet 52. The first valve port of the second flow path switching member 130 is in communication with the input end of the refrigerant passage. The second valve port of the second flow path switching member 130 is in communication with the refrigerant outlet pipe, so as to divert part of the high-temperature refrigerant from the refrigerant outlet pipe to the refrigerant passage when heating of the cooling medium is required. The third valve port of the second flow path switching member 130 is in communication with the refrigerant inlet pipe, so as to divert part of the low-temperature refrigerant from the refrigerant inlet pipe to the refrigerant passage when cooling of the cooling medium is required. The first valve port of the third flow path switching member 140 is in communication with the output end of the refrigerant passage. The second valve port of the third flow path switching member 140 is in communication with the refrigerant outlet pipe. The third valve port of the third flow path switching member 140 is in communication with the gas inlet.

[0120] For the heating working condition of the heat pump system, the gas outlet 51 of the compressor 50 transmits the high-temperature refrigerant to the refrigerant outlet pipe in one way and to the second flow path switching member 130 in the other way. After being transmitted to the second flow path switching member 130, the high-temperature refrigerant is transmitted through the refrigerant passage and is returned to the refrigerant outlet pipe via the third flow path switching member 140. Then, the high-temperature refrigerant is transmitted through the four-way valve 110, the indoor heat exchanger 120, the throttling device 150, the outdoor heat exchanger 30 and the four-way valve 110, and finally is returned to the gas inlet 52 in the form of low-temperature refrigerant.

[0121] For the cooling working condition of the heat pump system, the gas outlet 51 of the compressor 50 transmits the high-temperature refrigerant to the refrigerant outlet pipe. Then, the high-temperature refrigerant is transmitted through the four-way valve 110, the outdoor heat exchanger 30, the throttling device 150, the indoor heat exchanger 120 and the four-way valve 110, and finally is returned to the gas inlet 52 in the form of low-temperature refrigerant in two ways. One way is directly returned to the gas inlet 52. The other way is transmitted through the second flow path switching member 130 into the refrigerant passage, and then is transmitted to the gas inlet 52 after passing through the third flow path switching member 140.

[0122] In some embodiments, the heat pump system further comprises a humidity sensor, a first temperature sensor and a second temperature sensor 90. The humidity sensor is used to detect the ambient humidity inside the heat pump housing. The first temperature sensor is installed on the heat sink 22 or the electric control module 10 to detect the ambient temperature around the electric control module 10; the second temperature sensor 90 is installed on the electric control module 10 to detect the surface temperature of the electric control module 10. Both the first temperature sensor and the second temperature sensor 90 are arranged inside the heat pump housing. Since the first temperature sensor is used to detect the ambient temperature around the electric control module 10, the first temperature sensor is generally installed close to the electric control housing to improve the stability of the detection accuracy. The second temperature sensor 90 is used to detect the surface temperature of the electric control module 10, so in order to make the detection of the second temperature sensor 90 more accurate, the second temperature sensor 90 can be arranged on the outer surface of the electric control module 10. The heat pump system can determine the dew point temperature of the electric control module 10 according to the ambient temperature detected by the first temperature sensor and the ambient humidity detected by the humidity sensor, and the heat pump system can determine whether the surface of the electric control module 10 will condense dew according to the surface temperature detected by the second temperature sensor 90 and the dew point temperature, and then determine whether to start the fan 23.

[0123] It should be noted that the first temperature sensor and the second temperature sensor 90 can be composed of NTC (Negative Temperature Coefficient) thermistors, which are a kind of sensor resistors whose resistance value decreases with increasing temperature. They are widely used in various electronic components, such as electric control temperature sensors, resettable fuses and automatically regulated heaters, etc. In other embodiments, a mounting groove is arranged on the bottom plate of the heat sink 22, i.e. the side plate facing the liquid cooling member 21, and the electric control temperature sensor is placed in the mounting groove. More specifically, the mounting groove is close to the inlet end of the liquid cooling member 21, and a heat-conducting silicone grease is filled between the groove wall of the mounting groove and the electric control temperature sensor to improve the detection sensitivity of the electric control temperature sensor.

[0124] In some embodiments, the heat pump system further comprises a heating member arranged in the space where the electric control module 10 is located to increase the surface temperature of the electric control module 10. When the surface temperature on the electric control module 10 is lower than the ambient temperature inside the heat pump housing or lower than the ambient temperature around the electric control module 10, which will cause condensation problem, the heating member is started at this time to heat the electric control housing on the electric control module 10 to increase the temperature on the electric control housing. When the surface temperature of the electric control housing is higher than the ambient temperature around the electric control housing, the surface of the electric control housing will not condense dew, at which time the heating member can be turned off. It should be noted that in order not to overheat the outer surface of the electric control module 10, the heating member will not excessively heat the electric control housing, but only prevent the condensation problem on the electric control housing.

[0125] The application also provides a control method of the heat pump system, which is applied to the heat pump system described above, and the specific structure of the heat pump system is referred to the above embodiments, and the control method comprises the following steps: Figures 12-13

[0126] In step S100, the dew point temperature of the environment where the electric control module 10 is located and the surface temperature of the electric control module 10 are obtained.

[0127] Specifically, the dew point temperature can be obtained by obtaining the location information of the heat pump system, and obtaining the dew point temperature of the location of the heat pump system from the cloud based on the location information; or the environment humidity and the environment temperature of the electric control module 10 can also be obtained by the humidity sensor and the first temperature sensor of the heat pump system described above, and the corresponding dew point temperature is obtained according to the detected environment humidity, environment temperature and the preset corresponding relationship between the environment humidity, environment temperature and the dew point temperature. The surface temperature of the electric control module 10 can be detected by the second temperature sensor 90 described above.

[0128] In step S200, based on the condition that the surface temperature is less than or equal to the dew point temperature, the fan 23 is controlled to be in the working state to cool the radiator 22 and disturb the air around the electric control module 10 to avoid the condensation caused by the overcooling of the electric control module 10.

[0129] In the embodiment, when the surface temperature on the electric control module 10 is less than or equal to the dew point temperature of the environment around the electric control module 10, it indicates that the surface of the electric control module 10 is prone to condensation phenomenon. In order to prevent the generation of condensation phenomenon, the fan 23 is controlled to rotate, and the air generated by the rotation of the fan 23 can disturb the air around the electric control module 10, at this time the environment temperature around the electric control module 10 will be reduced, and the moisture in the surrounding air will also be reduced, so as to prevent the surface of the electric control module 10 from appearing condensation.

[0130] In some embodiments, before the step of obtaining the dew point temperature of the environment where the electric control module 10 is located and the surface temperature of the electric control module 10, the method further comprises:

[0131] In step S300, the environment temperature is obtained.

[0132] In step S400, based on the condition that the environment temperature is greater than the first preset temperature, the cooling medium is controlled to flow in the liquid cooling channel of the liquid cooling device 21 to cool the electric control module 10.

[0133] ​In the embodiment, the ambient temperature around the electronic control module 10 is acquired, when the ambient temperature is greater than the first preset temperature, it indicates that the ambient temperature around the electronic control module 10 is high at this time, in order to prevent the electronic control module 10 from overheating and affecting normal work, the water pump 25 is controlled to work at this time, so that the cooling medium flows in the liquid cooling channel in the liquid cooling member 21 to dissipate heat for the electronic control module 10.

[0134] In some embodiments, after the step of acquiring the ambient temperature, the method further comprises:

[0135] In step S600, based on the condition that the ambient temperature is greater than the second preset temperature, the fan 23 is controlled to be in the working state, wherein the second preset temperature is greater than the first preset temperature.

[0136] In the embodiment, the ambient temperature around the electronic control module 10 is acquired, when the ambient temperature is greater than the second preset temperature, it indicates that the ambient temperature around the electronic control module 10 is too high at this time, in order to prevent the electronic control module 10 from overheating, air cooling and water cooling are simultaneously performed for the electronic control module 10 at this time, that is, the fan 23 is started to disturb the air around the electronic control module 10, and the cooling medium is controlled to flow in the liquid cooling channel in the liquid cooling member 21 to quickly dissipate heat for the electronic control module 10. For example, the first preset temperature can be 40℃, and the second preset temperature can be 45℃.

[0137] In some embodiments, after the step of acquiring the ambient temperature, the method further comprises:

[0138] In step S700, based on the condition that the ambient temperature is less than the first preset temperature, the fan 23 is controlled to be in the working state and the cooling medium is controlled to stop flowing in the liquid cooling channel in the liquid cooling member 21.

[0139] In the embodiment, the ambient temperature around the electronic control module 10 is acquired, when the ambient temperature is less than the first preset temperature, it indicates that the ambient temperature around the electronic control module 10 is moderate at this time, and condensation problem is not easy to occur, so only the fan 23 can be started to disturb the air around the electronic control module 10 to dissipate heat for the electronic control module 10, thereby reducing energy consumption.

[0140] The embodiment of the application further provides a computer storage medium, which can store a plurality of program instructions, the program instructions are suitable for being loaded and executed by a processor, and the method steps of the embodiment shown in the above description are executed, and the specific execution process can be referred to the specific description of the embodiment shown in the above description, and details are not described herein. Figures 12-13 Figures 12-13 The embodiment of the application further provides a computer storage medium, which can store a plurality of program instructions, the program instructions are suitable for being loaded and executed by a processor, and the method steps of the embodiment shown in the above description are executed, and the specific execution process can be referred to the specific description of the embodiment shown in the above description, and details are not described herein.

[0141] ​The same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components; in the description of the present application, it is understood that if the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the orientations or positional relationships shown in the drawings, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationships in the drawings are only used for exemplary illustration, and cannot be understood as a limitation on the present patent, for those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0142] The above is only a preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat pump system, characterized by, The heat dissipation device comprises: a liquid cooling member arranged in the mounting cavity, the liquid cooling member having a liquid cooling channel for flowing cooling medium, the liquid cooling member being used for absorbing heat generated by the electric control module during operation; and a heat exchange member arranged in the mounting cavity, having a heat exchange channel in communication with the liquid cooling channel, and a refrigerant channel separated from the heat exchange channel, the heat exchange member being used for heat exchange between the refrigerant in the refrigerant channel and the cooling medium in the heat exchange channel, so as to heat or cool the cooling medium. The electric control module is in heat transfer connection with the liquid cooling member along a first direction, and the heat dissipation device comprises: a housing having the mounting cavity; a heat sink arranged in the mounting cavity, the liquid cooling member being in heat transfer connection with the heat sink along the first direction, and being used for absorbing heat transferred from the liquid cooling member; and a fan arranged in the mounting cavity, arranged on the heat sink and located on any surface of the heat sink not arranged towards the liquid cooling member, used for air cooling of the heat sink and for disturbing air around the electric control module to avoid condensation caused by overcooling of the electric control module due to the liquid cooling member. The liquid cooling member, the heat sink and the fan are arranged in sequence along the first direction, and the heat sink is located between the liquid cooling member and the fan. The first direction is a direction from the compressor to the fan.

2. The heat pump system of claim 1, wherein, Further comprising: a thermally conductive interface material member, the liquid cooling member and the electric control module being sandwiched with the thermally conductive interface material member, and / or the liquid cooling member and the heat sink being sandwiched with the thermally conductive interface material member. The cooling medium flowing in the liquid cooling channel comprises water or refrigerant, when the cooling medium comprises water, the heat dissipation device further comprises: a water pump in communication with an external water source and the liquid cooling channel, used for introducing the external water source into the liquid cooling channel.

3. The heat pump system of claim 2, wherein, The refrigerant channel is in communication with the gas outlet of the compressor to receive high-temperature refrigerant and heat the cooling medium in the heat exchange channel, so that when the cooling medium is water, the heat exchange channel can output hot water; or 4. The heat pump system of claim 2, wherein, The refrigerant channel is in communication with the gas inlet of the compressor to receive low-temperature refrigerant and cool the cooling medium in the heat exchange channel, and the output end of the liquid cooling channel is in communication with the input end of the heat exchange channel, and the output end of the heat exchange channel is in communication with the input end of the liquid cooling channel, so that the cooled cooling medium reflows into the liquid cooling channel.

5. The heat pump system of claim 2, wherein, When the refrigerant channel is in communication with the gas outlet of the compressor to receive high-temperature refrigerant and heat the cooling medium in the heat exchange channel, the heat pump system further comprises: a first flow path switching member, a first valve port of the first flow path switching member being in communication with a first end of the heat exchange channel; 6. The heat pump system of claim 2, wherein, ​ ​ 7. The heat pump system of claim 1, wherein, ​ ​ 8. The heat pump system of claim 7, wherein, ​ ​ a cold water pipeline, which is communicated with a second valve port of the first flow switching piece and is used for connecting an external water source; a water pump, an input end of which is communicated with a third valve port of the first flow switching piece, an output end of which is communicated with an input end of the liquid cooling channel, and an output end of the liquid cooling channel is communicated with a second end of the heat exchange channel; a hot water pipeline, one end of which is communicated with the second end of the heat exchange channel.

9. The heat pump system of claim 7, wherein, The heat pump system further comprises: a first flow switching piece, a first valve port of which is communicated with a first end of the heat exchange channel; a cold water pipeline, which is communicated with a second valve port of the first flow switching piece and is used for connecting an external water source; a water pump, an input end of which is communicated with a third valve port of the first flow switching piece, an output end of which is communicated with an input end of the liquid cooling channel, and an output end of the liquid cooling channel is communicated with a second end of the heat exchange channel.

10. The heat pump system of claim 9, wherein, The heat pump system further comprises: a hot water pipeline, one end of which is communicated with the second end of the heat exchange channel; a switch valve, which is arranged on the hot water pipeline.

11. The heat pump system of claim 10, wherein, The heat pump system further comprises: a refrigerant outlet pipe, which is communicated with the gas outlet; a refrigerant inlet pipe, which is communicated with the gas inlet; a second flow switching piece, a first valve port of which is communicated with an input end of the refrigerant channel, a second valve port of which is communicated with the refrigerant outlet pipe, so as to divert part of high-temperature refrigerant from the refrigerant outlet pipe to the refrigerant channel when heating of the cooling medium is required; and a third valve port of which is communicated with the refrigerant inlet pipe, so as to divert part of low-temperature refrigerant from the refrigerant inlet pipe to the refrigerant channel when cooling of the cooling medium is required; a third flow switching piece, a first valve port of which is communicated with an output end of the refrigerant channel, a second valve port of which is communicated with the refrigerant outlet pipe, and a third valve port of which is communicated with the gas inlet.

12. The heat pump system of claim 2, wherein, Further comprising: a humidity sensor, which is installed on the heat sink or the electronic control module and is used for detecting the ambient humidity around the electronic control module; a first temperature sensor, which is installed on the heat sink or the electronic control module and is used for detecting the ambient temperature around the electronic control module; a second temperature sensor, which is installed on the electronic control module and is used for detecting the surface temperature of the electronic control module; or the protection level of the electronic control module is IP68.

13. The heat pump system according to any one of claims 1 to 12, characterized in that, The heat pump system further comprises a heating piece, which is arranged in the space where the electronic control module is located, so as to improve the surface temperature of the electronic control module, or the liquid cooling channel is arranged in a curved shape.

14. A control method of a heat pump system, characterized by, The electronic control module is heat-transferringly connected with the liquid cooling piece in a first direction, and the heat dissipation device comprises: a shell, which has the mounting cavity; a heat sink, which is arranged in the mounting cavity, the liquid cooling piece is heat-transferringly connected with the heat sink in the first direction, and the heat sink is used for absorbing the heat transferred from the liquid cooling piece; and A fan is arranged in the mounting cavity, arranged on the radiator and located at any surface of the radiator which is not arranged towards the liquid cooling component, used for air cooling of the radiator and for disturbing air around the electronic control module to avoid dew condensation caused by overcooling of the electronic control module by the liquid cooling component; The control method comprises the following steps: acquiring a dew point temperature of an environment where the electronic control module is located and a surface temperature of the electronic control module; controlling the fan to be in a working state based on a condition that the surface temperature is less than or equal to the dew point temperature, so as to air cool the radiator and disturb air around the electronic control module to avoid dew condensation caused by overcooling of the electronic control module by the liquid cooling component.

15. The control method according to claim 14, characterized by, Before the step of acquiring the dew point temperature of the environment where the electronic control module is located and the surface temperature of the electronic control module, the method further comprises: acquiring an ambient temperature; controlling cooling medium to flow in a liquid cooling channel in the liquid cooling component to cool the electronic control module based on a condition that the ambient temperature is greater than a first preset temperature.

16. The control method according to claim 15, characterized by After the step of acquiring the ambient temperature, the method further comprises: controlling the fan to be in the working state based on a condition that the ambient temperature is greater than a second preset temperature, wherein the second preset temperature is greater than the first preset temperature.

17. The control method according to claim 15, characterized by, After the step of acquiring the ambient temperature, the method further comprises: controlling the fan to be in the working state and controlling the cooling medium to stop flowing in the liquid cooling channel in the liquid cooling component based on a condition that the ambient temperature is less than the first preset temperature.

18. A computer storage medium, characterized in that, The computer storage medium stores a plurality of instructions, which are suitable for being loaded and executed by the processor to perform the steps of the method according to any one of claims 14-17.

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