A test method for detecting open and short circuits of test points of an array

Abstract

The application provides a test method for detecting open and short circuits of test points of an array, which comprises a POWER1 power supply, a SWITCH1 switching module, an R1 resistor, an MCU1 master control module, a POWER2 power supply, a SWITCH2 switching module, an R2 resistor, an MCU2 master control module, a PCB1 board and a PCB2 board. A plurality of to-be-tested points corresponding in position are arranged on the PCB1 board and the PCB2 board. The POWER1 power supply is used for supplying power to the SWITCH1 switching module. The SWITCH1 switching module is connected to the to-be-tested points on the PCB1 board through the R1 resistor. The to-be-tested points on the PCB1 board and the to-be-tested points on the PCB2 board form a loop through probes. The MCU1 master control module controls the SWITCH1 switching module to switch high and low levels through an IO port. The high and low level output states of the test points are set through the MCU control SWITCH module. The level states of each test point are converted and fed back to the MCU. Then, the MCU is used for reading and judging and feeding back to a host computer on the PC for detection and judgment.

Description

Technical Field

[0001] This invention relates to the field of electronic testing technology, specifically a testing method for detecting open and short circuits at test points of a detection array. Background Technology

[0002] Dual motherboard technology is one of the main application technologies in electronic products at present. Its main advantage is that it can improve the internal space utilization of electronic products, saving more space for the battery and increasing the battery life of electronic products. In dual motherboard technology, two motherboards are connected and conductive through corresponding electronic components. The corresponding connection positions of the two motherboards are arrayed with the points that need to be connected. These points need to correspond to each other in position and, more importantly, need to be conductive.

[0003] In traditional manufacturing, a blue film is laid between a set of motherboards, and then needle-punched and pressed to leave a mark on the blue film. By detecting the mark on the blue film, if the connection points on the two motherboards are in the same position, a corresponding mark will appear; if the positions are not in the same position, no mark will be left.

[0004] By understanding the above technology, it is not difficult to see that this detection method can only detect whether the connection points on the two motherboards correspond. On the one hand, it cannot detect whether the connection points on the two motherboards can be connected, and on the other hand, it cannot detect whether the connection points on the same motherboard are short-circuited. Currently, it cannot simultaneously detect open and short circuits for multi-point double-sided test points. If this problem can be solved, it will be a major breakthrough in electronic circuit testing. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] The technical problem this invention aims to solve is that traditional testing methods can only detect whether the connection points on two motherboards correspond. On the one hand, they cannot detect whether the connection points on two motherboards can be connected, and on the other hand, they cannot detect whether the connection points on the same motherboard are short-circuited. Currently, for multi-point double-sided test points, it is not possible to detect open and short circuit conditions at the same time. If this problem can be solved, it will be a major breakthrough in electronic circuit testing.

[0007] (II) Technical Solution

[0008] To address the aforementioned problems, this invention provides the following technical solution: a test method for detecting open / short circuits at test points in an array, comprising a POWER1 power supply, a SWITCH1 switching module, a resistor R1, an MCU1 main control module, a POWER2 power supply, a SWITCH2 switching module, a resistor R2, an MCU2 main control module, a PCB1 board, and a PCB2 board. The PCB1 board and the PCB2 board have several test points with corresponding positions. The POWER1 power supply powers the SWITCH1 switching module. The SWITCH1 switching module connects to the test points on the PCB1 board via the resistor R1. The test points are connected, and the test point on PCB1 and the test point on PCB2 form a loop through probes. The MCU1 main control module controls the SWITCH1 switching module to switch between high and low levels through the IO port. The POWER2 power supply is used to power the SWITCH2 switching module. The SWITCH2 switching module is connected to the test point on PCB2 through the resistor R2, and the test point on PCB2 forms a loop with the test point on PCB1 through probes. The MCU2 main control module controls the SWITCH2 switching module to switch between high and low levels through the IO port.

[0009] Furthermore, it also includes an ADC1 conversion chip and an ADC2 conversion chip. The ADC1 conversion chip is used to detect the level state of the test point on the PCB1 board and convert it into a digital signal to be fed back to the MCU1 main control module. The ADC2 conversion chip is used to detect the level state of the test point on the PCB2 board and convert it into a digital signal to be fed back to the MCU2 main control module.

[0010] Furthermore, it also includes a PC-based upper-position judgment and display module. The MCU1 main control module and the MCU2 main control module communicate with the upper-position judgment and display module via two USB ports, respectively. The upper-position judgment and display module performs judgment and displays the results.

[0011] Furthermore, the detection method is as follows:

[0012] Step 1: During the open-circuit test, the MCU1 main control module and the MCU2 main control module control the SWITCH1 switching module and the SWITCH2 switching module respectively to switch the high and low level output states of the test point for high and low level setting. The MCU1 main control module and the MCU2 main control module respectively set the test point on the PCB1 board and the PCB2 board to a high level input state through the IO port. At the same time, when the corresponding test point input terminals on the PCB1 board and the PCB2 board are simultaneously set to the POWER high level state, the reading is then taken. The level state of the measured point should be high. If any one of them is different, the circuit of this measured point is open. The upper-level judgment and display module receives the feedback instruction and judges whether it is PASS or FAIL. If the input terminals of the measured points on PCB1 and PCB2 are simultaneously set to GND low level, the level state of the measured point is read. At this time, all the measured points should be low level. If any one of them is different, the circuit of this measured point is open. The upper-level judgment and display module receives the feedback instruction and judges whether it is PASS or FAIL.

[0013] Step 2: During the short-circuit test, the MCU1 main control module and the MCU2 main control module respectively set the output state of the SWITCH1 switching module and the SWITCH2 switching module to the POWER high level through the IO ports, set the test point on the PCB1 board to the low level, and set the corresponding test point on the PCB2 board to the high level input state. Then, read the IO port status of the ADC1 conversion chip and the ADC2 conversion chip. The correct test point is the one on the PCB1 board that is low level and the corresponding test point on the PCB2 board that is high level. If both corresponding test points are low level, then the two test points are short-circuited. The upper-level judgment and display module receives the feedback instruction and judges PASS and FAIL.

[0014] (III) Beneficial Effects

[0015] The beneficial effects of this invention are as follows: the MCU controls the SWITCH module to switch the high and low level output states of the test points to set the high and low levels of the test points, the ADC converts and feeds back the level state of each test point to the MCU, the MCU reads and judges the data and then feeds it back to the host computer on the PC for detection and judgment. The overall circuit design is simple and can be operated with both double-sided test points and test points with few test points. Moreover, the judgment can be displayed on the screen, which is convenient and fast. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention;

[0017] In the diagram: 1-POWER1 power supply, 2-SWITCH1 switching module, 3-R1 resistor, 4-MCU1 main control module, 5-POWER2 power supply, 6-SWITCH2 switching module, 7-R2 resistor, 8-MCU2 main control module, 9-PCB1 board, 10-PCB2 board, 11-ADC1 conversion chip, 12-ADC2 conversion chip, 13-Upstream position judgment and display module. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figure 1 A test method for detecting open / short circuits at test points in an array includes a POWER1 power supply 1, a SWITCH1 switching module 2, a resistor R1 3, an MCU1 main control module 4, a POWER2 power supply 5, a SWITCH2 switching module 6, a resistor R2 7, an MCU2 main control module 8, a PCB1 board 9, and a PCB2 board 10. The PCB1 board 9 and PCB2 board 10 have several test points with corresponding positions. The POWER1 power supply 1 supplies power to the SWITCH1 switching module 2. The SWITCH1 switching module 2 is connected to the test points on the PCB1 board 9 via the resistor R1 3. The test point on PCB1 board 9 and the test point on PCB2 board 10 form a loop through probes. MCU1 main control module 4 controls SWITCH1 switching module 2 to switch between high and low levels through IO ports. POWER2 power supply 5 is used to power SWITCH2 switching module 6. SWITCH2 switching module 6 is connected to the test point on PCB2 board 10 through resistor R2 7, and the test point on PCB2 board 10 forms a loop with the test point on PCB1 board 9 through probes. MCU2 main control module 8 controls SWITCH2 switching module 6 to switch between high and low levels through IO ports.

[0020] Furthermore, it also includes an ADC1 conversion chip 11 and an ADC2 conversion chip 12. The ADC1 conversion chip 11 is used to detect the level state of the test point on the PCB1 board 9 and convert it into a digital signal to be fed back to the MCU1 main control module 4. The ADC2 conversion chip 12 is used to detect the level state of the test point on the PCB2 board 10 and convert it into a digital signal to be fed back to the MCU2 main control module 8.

[0021] Furthermore, it also includes a PC-based upper-device positioning and display module 13. The MCU1 main control module 4 and the MCU2 main control module 8 communicate with the upper-device positioning and display module 13 via two USB ports, and the upper-device positioning and display module 13 performs the judgment and displays the results.

[0022] Furthermore, the detection method is as follows:

[0023] Step 1: During the open-circuit test, the MCU1 main control module 4 and the MCU2 main control module 8 control the SWITCH1 switching module 2 and the SWITCH2 switching module 6 respectively to switch the high and low level output states of the test points for setting the high and low levels of the test points. The MCU1 main control module 4 and the MCU2 main control module 8 set the test points on PCB1 board 9 and PCB2 board 10 to a high level input state through the IO ports respectively. At the same time, when the corresponding test point input terminals on PCB1 board 9 and PCB2 board 10 are simultaneously set to the POWER high level state, the test point is then read. The level state of the test point should be high. If one of them is different, the circuit of this test point is open. The upper-level judgment and display module 13 receives the feedback instruction and judges whether it is PASS or FAIL. If the input terminals of the test points on PCB1 board 9 and PCB2 board 10 are set to GND low level at the same time, the level state of the test point is read. At this time, the test points should be low. If one of them is different, the circuit of this test point is open. The upper-level judgment and display module 13 receives the feedback instruction and judges whether it is PASS or FAIL.

[0024] Step 2: During the short-circuit test, MCU1 main control module 4 and MCU2 main control module 8 respectively set the output state of SWITCH1 switching module 2 and SWITCH2 switching module 6 to POWER high level through the IO ports, set the test point on PCB1 board 9 to low level, and set the corresponding test point on PCB2 board 10 to high level input state. Then, read the IO port status of ADC1 conversion chip 11 and ADC2 conversion chip 12. Only the test point on PCB1 board 9 should be low level, and the corresponding test point on PCB2 board 10 should be high level. If both corresponding test points are low level, the two test points are short-circuited. The upper-level judgment and display module 13 receives the feedback instruction and judges PASS and FAIL.

[0025] For ease of explanation, now Figure 1The test points on PCB1 board 9 and PCB2 are labeled as TP1, TP2, TP3, and TP4, respectively, and explained as follows: One end of TP1 on PCB1 board 9 is connected to the output of SWITCH1 switching module 2 through resistor R1 3, and the other end TP3 is directly connected to ADC2 conversion chip 12 on PCB2 board 10; One end of TP2 on PCB1 board 9 is directly connected to ADC1 conversion chip 11, and the other end is connected to the output of SWITCH2 switching module 6 through resistor R2 7; ADC1 conversion chip 11 communicates with MCU1 main control module 4 and ADC2 conversion chip 12 communicates with MCU2 main control module 8 via I2C; MCU1 main control module 4 and MCU2 main control module 8 are connected to the upper-level judgment and display module 13 on the PC via USB;

[0026] During open-circuit testing: MCU1 main control module 4 and MCU2 main control module 8 control SWITCH1 switching module 2 and SWITCH2 switching module 6 to switch the high and low level output states of the test points for high and low level setting. MCU1 main control module 4 and MCU2 main control module 8 set TP2 and TP3 test points to high level input state through the IO port. If the input terminals of test points TP1 and TP4 are simultaneously set to POWER high level state, and then the level state of TP2 and TP3 is read, TP2 and TP3 should both be high. If the level state is different, the circuit of this measurement point is open. The upper-level judgment and display module 13 on the PC receives the feedback instruction and judges PASS and FAIL. If the input terminals of measurement points TP1 and TP4 are set to GND low level at the same time, and then the level state of TP2 and TP3 is read, TP2 and TP3 should both be low level. If one of them is different, the circuit of this measurement point is open. The upper-level judgment and display module 13 on the PC receives the feedback instruction and judges PASS and FAIL.

[0027] During the short-circuit test: MCU1 main control module 4 and MCU2 main control module 8 set the output state of SWITCH1 switching module 2 and SWITCH2 switching module 6 to POWER high level through the IO port, set the TP2 test point to low level, and set the TP3 test point to high level input state. Then, read the IO port state of ADC1 conversion chip 11 or ADC2 conversion chip 12. Only TP2 should be low level, and TP3 should be high level. If both TP2 and TP3 are low level, then TP2 and TP3 are short-circuited. Set the TP3 test point to low level and the TP2 test point to high level input state. Then, read the IO port state of ADC1 conversion chip 11 or ADC2 conversion chip 12. Only TP3 should be low level, and TP2 should be high level. If both TP2 and TP3 are low level, then TP2 and TP3 are short-circuited. The PC's upper-level judgment and display module 13 receives the feedback instruction and judges PASS and FAIL.

[0028] Based on the above two methods, when there are many test points on PCB1 board 9 and PCB2 board 10, the same method can be used for testing. When the detection status of adjacent test point IO ports is the same, that is, both are high or low, this signal is fed back to the PC's upper-level judgment and display module 13 to determine the PASS or FAIL status, and whether the test point is open or short-circuited. The PC's upper-level judgment and display module 13 communicates with the MCU and sends commands via USB. The PC's display screen can show which test points are open or short-circuited. Maintenance and testing personnel can correctly judge and repair based on this display result. At the same time, SWITCH1 switching module 2 and SWITCH2 switching module 6 have multiple output ports, which can test multiple sets of monitoring points at one time, making it faster.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A test method for detecting open and short circuits at test points in a detection array, characterized in that: The system includes a POWER1 power supply (1), a SWITCH1 switching module (2), a resistor R1 (3), an MCU1 main control module (4), a POWER2 power supply (5), a SWITCH2 switching module (6), a resistor R2 (7), an MCU2 main control module (8), a PCB1 board (9), and a PCB2 board (10). The PCB1 board (9) and the PCB2 board (10) have several corresponding test points. The POWER1 power supply (1) supplies power to the SWITCH1 switching module (2). The SWITCH1 switching module (2) is connected to the test points on the PCB1 board (9) via the resistor R1 (3). The test point on 9) and the test point on PCB2 (10) form a loop through the probe. The MCU1 main control module (4) controls the SWITCH1 switching module (2) to switch between high and low levels through the IO port. The POWER2 power supply (5) is used to power the SWITCH2 switching module (6). The SWITCH2 switching module (6) is connected to the test point on PCB2 (10) through the R2 resistor (7). The test point on PCB2 (10) forms a loop with the test point on PCB1 (9) through the probe. The MCU2 main control module (8) controls the SWITCH2 switching module (6) to switch between high and low levels through the IO port.

2. The test method for detecting open and short circuits at test points of a detection array according to claim 1, characterized in that: It also includes an ADC1 conversion chip (11) and an ADC2 conversion chip (12). The ADC1 conversion chip (11) is used to detect the level state of the test point on the PCB1 board (9) and convert it into a digital signal to be fed back to the MCU1 main control module (4). The ADC2 conversion chip (12) is used to detect the level state of the test point on the PCB2 board (10) and convert it into a digital signal to be fed back to the MCU2 main control module (8).

3. The test method for detecting open and short circuits at test points of a detection array according to claim 2, characterized in that: It also includes a PC-based upper-device positioning and display module (13). The MCU1 main control module (4) and the MCU2 main control module (8) communicate with the upper-device positioning and display module (13) via two USB ports respectively. The upper-device positioning and display module (13) performs the judgment and displays the results.

4. The test method for detecting open and short circuits at test points of a detection array according to claim 3, characterized in that: The detection method is as follows: Step 1: During the open circuit test, the MCU1 main control module (4) and the MCU2 main control module (8) control the SWITCH1 switching module (2) and the SWITCH2 switching module (6) to switch the high and low level output states of the test points to set the high and low levels of the test points. The MCU1 main control module (4) and the MCU2 main control module (8) set the test points on the PCB1 board (9) and PCB2 board (10) to a high level input state through the IO ports, and at the same time set the corresponding test point input terminals on the PCB1 board (9) and PCB2 board (10) to a POWER high level state. When, then read the level state of the point under test at this time. At this time, all points under test should be in a high level state. If one of them is different, the line of this point under test is open. The upper position judgment and display module (13) receives the feedback instruction and judges PASS and FAIL. If the input terminals of the points under test on the PCB1 board (9) and PCB2 board (10) are set to GND low level state at the same time, then read the level state of the point under test at this time. At this time, all points under test should be in a low level state. If one of them is different, the line of this point under test is open. The upper position judgment and display module (13) receives the feedback instruction and judges PASS and FAIL. Step 2: During the short circuit test, the MCU1 main control module (4) and the MCU2 main control module (8) respectively set the output state of the SWITCH1 switching module (2) and the SWITCH2 switching module (6) to the POWER high level state through the IO port, set the test point on the PCB1 board (9) to the low level, and set the corresponding test point on the PCB2 board (10) to the high level input state. Then read the IO port state of the ADC1 conversion chip (11) and the ADC2 conversion chip (12). Only the test point on the PCB1 board (9) is low level, and the corresponding test point on the PCB2 board (10) should be high level. If both corresponding test points are low level, then the two test points are short circuit. The upper position judgment and display module (13) receives the feedback instruction and judges PASS and FAIL.

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