Display module, preparation method thereof and display device

Abstract

Provided are a display module and a preparation method therefor, and a display device, and belong to the technical field of display. In the display module, a flexible circuit board located in a non-display area on a side of a display area away from a light-emitting surface of a bending area has a slotted area exposing the non-display area. A driving chip is located in the slotted area and is spaced apart from the flexible circuit board. In addition, a heat-conducting structure is filled in the space between the driving chip and the flexible circuit board. In this way, the driving chip can be better cooled, and the problem of abnormal pixel brightness at the position corresponding to the driving chip due to the driving chip being too hot after long-time work can be avoided, and thus the problem of display abnormality such as yellowing of the display panel in the display module can be avoided, that is, the display effect of the display panel can be ensured to be good.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] With the development of display technology, a foldable display module that is easy for users to carry has emerged.

[0003] In related technologies, foldable display modules generally include: a display panel with a display area, a bending area, and a non-display area; multiple pixels located in the display area; and a flexible circuit board and a driver chip located in the non-display area. The non-display area can be bent through the bending area to the side of the display area away from the light-emitting surface of the display panel. The flexible circuit board and the driver chip work together to illuminate multiple pixels, thereby driving the display panel to display an image. Furthermore, the driver chip is generally encased within the flexible circuit board.

[0004] However, due to the ever-increasing demand for refresh rates, current driver chips tend to overheat after prolonged operation. This can cause abnormal brightness of pixels at the corresponding locations on the driver chip, resulting in a yellowish display issue. Summary of the Invention

[0005] This disclosure provides a display module and its manufacturing method, as well as a display device, which can solve the problem of overheating of the driver chip after prolonged operation in related technologies. This overheating can lead to abnormal brightness of pixels at the corresponding locations of the driver chip, causing a yellowish display abnormality. The technical solution is as follows:

[0006] On one hand, a display module is provided, the display module comprising:

[0007] The display panel has a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to the side of the display area away from the light-emitting surface of the display panel;

[0008] A flexible circuit board is located on the side of the non-display area away from the display area, and in a first direction, the flexible circuit board has a slotted area that exposes the non-display area;

[0009] The driver chip is located on the side of the non-display area away from the display area and is located in the slotted area of ​​the flexible circuit board, and is spaced apart from the flexible circuit board in a second direction, the second direction intersecting the first direction;

[0010] A heat-conducting structure is located within the gap between the driving chip and the flexible circuit board, and is in contact with both the driving chip and the flexible circuit board.

[0011] Optionally, the thermally conductive structure includes thermally conductive adhesive.

[0012] Optionally, the orthographic projection of the thermal conductive structure on the display panel overlaps the orthographic projection of the driver chip on the display panel.

[0013] Optionally, the non-display area includes: a first binding area and a second binding area spaced apart from each other in the second direction, wherein the first binding area is farther away from the bending area relative to the second binding area;

[0014] The flexible circuit board is bonded to the display panel in the first bonding area, and the slotted area of ​​the flexible circuit board exposes the second bonding area.

[0015] The driver chip is located on the side of the second bonding area away from the display area, and is bonded to the display panel in the second bonding area.

[0016] Optionally, the heat-conducting structure is also located between the flexible circuit board and the non-display area.

[0017] Optionally, in the first direction, the cross-section of the heat-conducting structure includes a circular arc edge.

[0018] Optionally, the display module further includes:

[0019] A first back film, a support layer, and a second back film are sequentially stacked between the display area and the non-display area along the first direction;

[0020] The support layer has at least one first slot, and the orthographic projection of the at least one first slot on the display panel overlaps with the orthographic projection of the heat-conducting structure on the display panel.

[0021] Optionally, the display module further includes:

[0022] A first adhesive layer is located between the first back film and the support layer, and is used to bond the first back film and the support layer.

[0023] The second adhesive layer is located between the second back film and the support layer, and is used to bond the second back film and the support layer.

[0024] The first adhesive layer is made of a flexible material, and the second adhesive layer is made of a non-flexible material.

[0025] Furthermore, the second adhesive layer has at least one second slot, and the orthographic projection of the at least one second slot on the display panel overlaps with the orthographic projection of the thermal conductive structure on the display panel.

[0026] Optionally, the display module further includes:

[0027] A thermally conductive reinforcing layer is located between the support layer and at least one of the first back membrane and the second back membrane.

[0028] Optionally, the thermally conductive reinforcing layer is located between the support layer and the second back film, and is bonded to the support layer through the second adhesive layer;

[0029] Furthermore, the thermally conductive reinforcing layer has at least one third slot, and the orthographic projection of the at least one third slot on the display panel overlaps with the orthographic projection of the thermally conductive structure on the display panel.

[0030] Optionally, the support layer has a plurality of first slots spaced apart from each other along the second direction, the plurality of first slots being located on the side of the support layer closer to the flexible circuit board in the first direction, and the orthographic projection of the plurality of first slots on the display panel overlaps with the orthographic projection of the thermal conductive structure on the display panel;

[0031] And / or,

[0032] The second adhesive layer has a second slot, the second slot penetrating the second adhesive layer in the first direction, and the orthographic projection of the second slot on the display panel is located within the orthographic projection of the thermal conductive structure on the display panel;

[0033] And / or,

[0034] The thermally conductive reinforcement layer has a plurality of third slots spaced apart from each other along the second direction. The plurality of third slots are located at the middle position of the thermally conductive reinforcement layer in the first direction, and the orthographic projection of the plurality of third slots on the display panel covers the orthographic projection of the thermally conductive structure on the display panel.

[0035] Optionally, the support layer has a plurality of first slots, and the thermally conductive reinforcement layer has a plurality of third slots; and the plurality of first slots and the plurality of third slots are arranged in any of the following manner:

[0036] The plurality of first slots and the plurality of third slots are arranged sequentially along the second direction and the third direction, and in any direction, the orthographic projections of the plurality of first slots and the plurality of third slots on the display panel are staggered.

[0037] The plurality of first slots and the plurality of third slots are arranged sequentially along the second direction and the third direction, and the plurality of first slots and the plurality of third slots correspond one to one, and their orthographic projections on the display panel overlap each other;

[0038] The plurality of first slots are arranged sequentially along the third direction, the plurality of third slots are arranged sequentially along the second direction, and the orthographic projections of the plurality of first slots and the plurality of third slots on the display panel overlap each other;

[0039] The third direction intersects the second direction in the same plane, and both intersect the first direction in different planes.

[0040] Optionally, any one of the first slot, the second slot, and the third slot may have a hexagonal or rectangular orthographic projection on the display panel.

[0041] Optionally, the material of the first adhesive layer includes polyimide; the material of the support layer includes stainless steel or copper; the material of the second adhesive layer includes polyethylene terephthalate; and the material of the thermally conductive reinforcing layer includes copper.

[0042] Optionally, the flexible circuit board includes:

[0043] The multilayer protective layer and the metal trace layer are alternately stacked along the first direction, and the material of the metal trace layer includes: metallic copper.

[0044] On the other hand, a method for manufacturing a display module is provided, for manufacturing a display module as described in the above aspect; the method includes:

[0045] A display panel is provided, the display panel having a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to the side of the display area away from the light-emitting surface of the display panel;

[0046] A flexible circuit board is formed on the side of the non-display area away from the display area, and the formed flexible circuit board has a slotted area in a first direction that exposes the non-display area;

[0047] A driving chip is formed in the slotted area of ​​the flexible circuit board, and the formed driving chip is spaced apart from the flexible circuit board in a second direction, the second direction intersecting the first direction;

[0048] A thermally conductive structure is formed within the gap between the driver chip and the flexible circuit board, and the formed thermally conductive structure is in contact with both the driver chip and the flexible circuit board.

[0049] In another aspect, a display module is provided, the display module comprising:

[0050] The display panel has a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to the side of the display area away from the light-emitting surface of the display panel;

[0051] A flexible circuit board is located on the side of the non-display area away from the display area and is bonded to the non-display area, and in a first direction, the flexible circuit board has a slotted area that exposes the non-display area;

[0052] The driver chip is located in the slotted area of ​​the flexible circuit board and is bonded to the non-display area. In the second direction, any sidewall of the driver chip is spaced apart from any sidewall of the flexible circuit board, and the second direction intersects with the first direction.

[0053] The heat-conducting structure is located within the gap between the driver chip and the flexible circuit board, and is in contact with the driver chip, the flexible circuit board and the non-display area.

[0054] In another aspect, a display device is provided, the display device comprising: a power supply component, and a display module as described in one and another aspect above;

[0055] The power supply component is coupled to the display module and is used to supply power to the display module.

[0056] In summary, the beneficial effects of the technical solutions provided by the embodiments of this disclosure can at least include:

[0057] A display module, its fabrication method, and a display device are provided. In this display module, a flexible circuit board located in the non-display area, bent to the side of the display area away from the light-emitting surface, has a slotted area exposing the non-display area. A driver chip is located within this slotted area and spaced apart from the flexible circuit board. Furthermore, a heat-conducting structure is filled in the gap between the driver chip and the flexible circuit board. This allows for better heat dissipation of the driver chip, preventing overheating after prolonged operation and avoiding abnormal pixel brightness at the corresponding location. This, in turn, prevents display abnormalities such as yellowing from appearing on the display panel, thus ensuring a better display effect. Attached Figure Description

[0058] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0059] Figure 1 This is a schematic diagram of the film layer structure of a display module provided in an embodiment of the present disclosure;

[0060] Figure 2This is a schematic diagram of the unfolded plan of a display panel in a display module provided in an embodiment of this disclosure;

[0061] Figure 3 This is a schematic diagram of a partial film layer structure of a display module provided in an embodiment of this disclosure;

[0062] Figure 4 This is a schematic diagram of a partial film layer structure of another display module provided in an embodiment of this disclosure;

[0063] Figure 5 This is a schematic diagram of a partial film layer structure of another display module provided in this embodiment;

[0064] Figure 6 This is a schematic diagram of the film layer structure of another display module provided in this embodiment;

[0065] Figure 7 This is a schematic diagram of a partial film layer structure of another display module provided in this embodiment;

[0066] Figure 8 This is a schematic diagram of the slotted arrangement in a display module provided in an embodiment of the present disclosure;

[0067] Figure 9 This is a schematic diagram of the slotted arrangement in another display module provided in this embodiment;

[0068] Figure 10 This is a schematic diagram of the slotted arrangement in another display module provided in this embodiment;

[0069] Figure 11 This is a flowchart of a method for manufacturing a display module according to an embodiment of this disclosure;

[0070] Figure 12 This is a process flow diagram of the manufacturing process of a display module provided in an embodiment of this disclosure;

[0071] Figure 13 This is a schematic diagram of the structure of a display device provided in an embodiment of this disclosure. Detailed Implementation

[0072] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0073] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of this disclosure. For example... Figure 1 As shown, the display module includes: a display panel 01, a flexible circuit board 02, a driver chip 03, and a heat-conducting structure 04.

[0074] Among them, Figure 1On this basis, Figure 2 A plan view of the display panel 01 in its unfolded state is shown. (Reference) Figure 1 and Figure 2 As can be seen, the display panel 01 has a display area A1, a bending area A2, and a non-display area A3 connected in sequence, and the non-display area A3 is bent through the bending area A2 to the side of the display area A1 away from the light-emitting surface of the display panel 01. It should be noted that, in this embodiment, the display area A1, bending area A2, and non-display area A3 of the display panel 01 belong to different parts of the same substrate in the display panel 01. Correspondingly, it can be understood that the display area A1 can also be bent in the same way as the bending area A2. Figure 1 The form shown is only for illustrative purposes with the display area A1 not bent.

[0075] The light-emitting surface of display panel 01 refers to the side that displays the image. Correspondingly, the side furthest from the light-emitting surface of display panel 01 can be called the backlight surface of display panel 01. In other words, the display area A1 can be the light-emitting surface used for displaying the image, while the non-display area A3 can be the backlight surface and not display the image. The bending area A2 can be partially or entirely used for displaying the image, or it can be left unused. This type of display module is commonly used in foldable display products, such as foldable phones.

[0076] Optionally, the display panel 01 described in this embodiment can be an organic light-emitting diode (OLED) display panel. The display panel 100 may also include multiple pixels. Each pixel includes a pixel circuit and a light-emitting element. The pixel circuit is coupled to the light-emitting element and is used to drive the light-emitting element to emit light. For an OLED display panel, the light-emitting element is an OLED comprising an anode, a light-emitting layer, and a cathode stacked sequentially, wherein the light-emitting layer contains a light-emitting material for emitting light of a corresponding color.

[0077] Continue to refer to Figure 1 It can also be seen that the flexible printed circuit (FPC) 02 is located on the side of the non-display area A3 away from the display area A1, and in Figure 1 In the first direction Z shown, the flexible circuit board 02 may have a slotted area (also called an opening area) B1 that exposes the non-display area A3. That is, as Figure 1 As shown, the flexible circuit board 02 can be disposed on the backlight surface of the display panel 01 and is divided into two by the slotted area B1, so that the non-display area A3 is exposed.

[0078] Continue to refer to Figure 1As can be seen, the driver chip 03, i.e., the integrated circuit (IC) chip, is located on the side of the non-display area A3 away from the display area A1, and is located within the slotted area B1 of the flexible circuit board 02, and is spaced apart from the flexible circuit board 02 in the second direction X. That is, in this embodiment of the present disclosure, the driver chip 03 can be disposed on the backlight surface of the display panel 01 in the same way as the flexible circuit board 02, and can be located within the slotted area B1 of the flexible circuit board 02, spaced apart from the flexible circuit board 02.

[0079] In this way, the driver chip 03 is exposed within the slotted area B1, allowing it to interact with the outside environment and providing a heat dissipation path. This enables better heat dissipation for the driver chip 03, preventing it from overheating after prolonged operation and thus protecting the light-emitting material at the corresponding location from damage due to high temperatures. The driver chip 03 can be electrically connected to the pixel circuit described in the above embodiment and used to drive the pixel circuit to control the light-emitting element to emit light.

[0080] Wherein, the second direction X intersects the first direction Z. For example, refer to... Figure 1 The first direction Z can be a direction perpendicular to the supporting surface of the display panel 01, and the second direction X can be a direction parallel to the supporting surface of the display panel 01. Based on this, the second direction X and the first direction Z can be as follows: Figure 1 Perpendicular to each other.

[0081] Continue to refer to Figure 1 As can be seen, the heat-conducting structure 04 is located within the gap between the driver chip 03 and the flexible circuit board 02, and is in contact with both the driver chip 03 and the flexible circuit board 02. That is, in this embodiment of the present disclosure, a heat-conducting structure 04 capable of conducting heat can also be filled between the driver chip 03 and the flexible circuit board 02. The heat-conducting structure 04 at least covers the sidewall of the driver chip 03 and contacts the hole wall of the slotted area B1 of the flexible circuit board 02.

[0082] This provides a better heat dissipation path for the driver chip 03, allowing heat from the driver chip 03 to be conducted away through the thermal conductive structure 04 and evenly distributed onto the flexible circuit board 02, where it interacts with the external environment. This further improves heat dissipation for the driver chip 03, preventing it from overheating after prolonged operation and thus avoiding damage to the light-emitting material at the corresponding location of the driver chip 03 due to high temperatures. By setting the slotted area B1 and filling the thermal conductive structure 04, the display panel 01 can effectively avoid display abnormalities such as yellowing at the location of the driver chip 03.

[0083] In summary, this disclosure provides a display module. In this display module, a flexible circuit board located in the non-display area, bent to the side of the display area away from the light-emitting surface, has a slotted area exposing the non-display area. A driver chip is located within this slotted area and spaced apart from the flexible circuit board. Furthermore, a heat-conducting structure is filled within the gap between the driver chip and the flexible circuit board. This allows for better heat dissipation of the driver chip, preventing overheating after prolonged operation and avoiding abnormal pixel brightness at the corresponding location. Consequently, it avoids display abnormalities such as yellowing on the display panel in the display module, ensuring a better display effect.

[0084] Optional, see reference Figure 1 It can also be seen that the flexible circuit board 02 described in this embodiment may include: a multilayer protective layer 021 and a metal trace layer 022 alternately stacked along a first direction Z (e.g., the direction away from the non-display area A3).

[0085] That is, such as Figure 1 As shown, the flexible circuit board 02, divided into two parts by the slotted area B1, can each include multiple sets of sequentially stacked protective layers 021 and metal trace layers 022. Based on this structure, the heat-conducting structure 04 can connect the driver chip 03 and the metal trace layer 022 of the flexible circuit board 02, increasing heat diffusion in at least the first direction Z and the second direction X. This allows the heat from the driver chip 03 to be reliably dissipated through the metal trace layer 022 and evenly distributed on the flexible circuit board 02, effectively interacting with the outside environment and achieving reliable heat dissipation for the driver chip 03.

[0086] Optionally, the protective layer 021 can be solder resist ink, such as green solder resist ink, also known as green oil. The material of the metal trace layer 022 can include metallic copper (Cu), and correspondingly, the metal trace layer 022 can also be called a Cu foil trace layer. Because metallic copper (Cu) has good heat dissipation capabilities, it can further reliably dissipate the heat transferred through the heat-conducting structure 04.

[0087] Optionally, the thermally conductive structure 04 described in this embodiment may include thermally conductive adhesive. That is, thermally conductive adhesive can be filled in the slotted area B1 between the driver chip 03 and the flexible circuit board 02 to dissipate the heat of the driver chip 03. In addition, by using thermally conductive adhesive as the filling of the thermally conductive structure 04, the strength of the driver chip 03 can be strengthened, and the process reliability of the display module can be improved.

[0088] Optionally, in one implementation, the above can be combined with... Figure 1 and Figure 3 As shown in the partial film layer schematic diagram, the thermally conductive structure 04 can only wrap the left and right sidewalls of the driver chip 03 within the slotted area B1.

[0089] Alternatively, in another implementation, refer to the following: Figure 4 and Figure 5 As shown in the partial schematic diagram of the film layers, the orthographic projection of the heat-conducting structure 04 described in this embodiment of the present disclosure onto the display panel 01 can cover the orthographic projection of the driving chip 03 onto the display panel 01. That is, the heat-conducting structure 04 can not only wrap around the left and right sidewalls of the driving chip 03 within the slotted area B1, but also around the upper side of the driving chip 03 within the slotted area B1 (i.e., the side of the driving chip 03 furthest from the non-display area A3). In this way, the heat-conducting area can be increased, further ensuring reliable heat conduction to the driving chip 03.

[0090] Optional, see reference Figures 3 to 5 It can also be seen that the non-display area A3 described in the embodiments of this disclosure may include: a first binding area A31 and a second binding area A32 spaced apart from each other in the second direction X, and the first binding area A31 is farther away from the bending area A2 relative to the second binding area A32.

[0091] The flexible circuit board 02 is bonded to the display panel 01 in the first bonding area A31, and the slotted area of ​​the flexible circuit board 02 exposes the second bonding area A32. The driver chip 03 is located on the side of the second bonding area A32 away from the display area A1, and is bonded to the display panel 01 in the second bonding area A32.

[0092] Optional, combined Figure 1 ,as well as Figures 3 to 5 It can also be seen that, in this embodiment of the present disclosure, the flexible circuit board 02 can be electrically connected to the conductive pad P1 on the side of the second bonding area A32 away from the display area A1 through the bonding member B2 (e.g., bonding adhesive), thereby realizing the bonding connection with the display panel 01.

[0093] Optional, continue to refer to Figure 1 and Figures 3 to 5 It can also be seen that the thermally conductive structure 04 provided in this embodiment can also be located between the flexible circuit board 02 and the non-display area A3. That is, the thermally conductive structure 04, similar to thermally conductive adhesive, can also fill the gap between the flexible circuit board 02 and the non-display area A3 of the display panel 01. In this way, a larger heat dissipation area can be further ensured, resulting in better heat dissipation effect.

[0094] Optionally, in this embodiment of the present disclosure, the cross-section of the heat-conducting structure 04 in the first direction Z may include a rounded edge. Furthermore, the rounded edge may be recessed towards the non-display area A3; or, the rounded edge may protrude away from the non-display area A3.

[0095] Example, reference Figure 1 , Figure 3 and Figure 4 The heat-conducting structure 04 shown has an arc-shaped edge that protrudes away from the non-display area A3 in the first direction Z. Accordingly, the cross-section of the heat-conducting structure 04 can be considered to be semi-circular. Alternatively, refer to... Figure 5 The heat-conducting structure 04 shown has an arc-shaped edge that is recessed towards the non-display area A3 in the first direction Z. Accordingly, the cross-section of the heat-conducting structure 04 can be considered as a rectangle with a concave edge. This concave edge can be the side of the rectangular heat-conducting structure 04 furthest from the non-display area A3 (i.e., the upper side of the driver chip 03), and the concave edge is recessed towards the non-display area A3. Of course, the above is only a schematic illustration of the shape of the heat-conducting structure 04 and does not limit the shape of the heat-conducting structure 04.

[0096] Optional, Figure 6 This is a schematic diagram of another display module provided in an embodiment of this disclosure. (Combined with...) Figure 1 and Figure 6 It can be seen that the display module described in this embodiment may further include: a first back film (U-Film) 05, a bracket (BKT) layer 06 and a second back film 07, which are located between the display area A1 and the non-display area A3 and are sequentially stacked along the first direction Z (e.g., the direction away from the display area A1).

[0097] Furthermore, the support layer 06 may have at least one first slot K1, the orthographic projection of which on the display panel 01 overlaps with the orthographic projection of the heat-conducting structure 04 on the display panel 01. That is, the support layer 06 included in the display module can be slotted in this embodiment.

[0098] For example, such as Figure 6 As shown, the support layer 06 has a plurality of first slots K1 spaced apart from each other along the second direction X. Figure 6 The diagram schematically shows four first slots K1, and the first slots K1 are located on the side of the support layer 06 in the first direction Z close to the flexible circuit board 02. The orthographic projection of the first slots K1 on the display panel 01 coincides with the orthographic projection of the heat-conducting structure 04 on the display panel 01.

[0099] By opening multiple first slots K1 as described in the above embodiment on the support layer 06, the contact area of ​​the stacked layers in the first direction Z can be reduced, thereby reducing the temperature propagation in the first direction Z and further facilitating the heat dissipation of the driver chip 03.

[0100] Optionally, the material of the support layer 06 may include stainless steel (SUS) or copper (Cu). Since both stainless steel (SUS) and copper (Cu) have good thermal conductivity, they can achieve better heat dissipation while also improving the heat conduction of the driver chip 03, in addition to achieving good heat dissipation through slotting.

[0101] Optional, continue to combine Figure 1 and Figure 6 It can also be seen that the display module described in the embodiments of this disclosure may further include: a first adhesive layer 08 and a second adhesive layer 09.

[0102] The first adhesive layer 08 can be located between the first back film 05 and the support layer 06, and can be used to bond the first back film 05 and the support layer 06.

[0103] The second adhesive layer 09 can be located between the second back film 07 and the support layer 06, and can be used to bond the second back film 07 and the support layer 06.

[0104] Furthermore, the material of the first adhesive layer 08 may include a flexible material, such as polyimide (PI). The material of the second adhesive layer 09 may include a non-flexible material, such as polyethylene terephthalate (PET). Accordingly, the first adhesive layer 08 may also be referred to as PI adhesive, and the second adhesive layer 09 may also be referred to as a PET adhesive, which is a type of flexible tape.

[0105] Based on this, such as Figure 6 As shown, the second adhesive layer 09, which has greater strength on one side of the support layer 06, can also be grooved, so that the second adhesive layer 09 has at least one second groove K2, and the orthographic projection of at least one second groove K2 on the display panel 01 can overlap with the orthographic projection of the heat-conducting structure 04 on the display panel 01. Of course, if the strength of the first adhesive layer 08 is also greater, a groove can also be made on the first adhesive layer 08. Here, the first adhesive layer 08 is set to be a flexible material in order to protect the display panel 01.

[0106] For example, such as Figure 6 As shown, the second adhesive layer 09 has a second slot K2, and the second slot K2 penetrates the second adhesive layer 09 in the first direction Z (correspondingly, the second slot K2 can also be called a through slot), and the orthographic projection of the second slot K2 on the display panel 01 is located within the orthographic projection of the heat-conducting structure 04 on the display panel 01.

[0107] By opening a second slot K2 (i.e., a through slot) as described in the above embodiment on the second adhesive layer 09, air circulation can be facilitated, so that the heat dissipated by the driver chip 03 can be carried away by the air flowing at the first slot K1, reducing heat concentration and improving heat dissipation speed.

[0108] As described in the above embodiments, while multiple mutually spaced first slots K1 are opened on the support layer 06, a through second slot K2 is also opened on the second adhesive layer 09. This can reduce the contact area of ​​the stacked layers in the first direction Z, reduce the temperature propagation in the first direction Z, increase air circulation, reduce heat concentration, thereby effectively improving the heat dissipation speed, achieving uniform heat dissipation, and preventing the driver chip 03 from overheating and causing yellowing display abnormalities at the corresponding position of the display panel.

[0109] Optional, combined Figure 7 The schematic diagram of another display module shown also shows that the display module described in this embodiment may further include a thermally conductive reinforcing layer 010.

[0110] The thermally conductive reinforcing layer 010 may be located between the support layer 06 and at least one of the first back film 05 and the second back film 07.

[0111] Example, Figure 7 The thermally conductive reinforcing layer 010 shown is located between the support layer 06 and the second back film 07, and can be bonded to the support layer 06 through the second adhesive layer 09.

[0112] Optionally, the material of the thermally conductive reinforcing layer 010 may include metallic copper (Cu), and correspondingly, the thermally conductive reinforcing layer 010 may also be referred to as a reinforcing Cu sheet. Of course, in some other embodiments, the material of the thermally conductive reinforcing layer 010 may also be other metallic materials, such as stainless steel (SUS).

[0113] In this embodiment, by adding the reinforcing Cu sheet to one side of the support layer 06, the heat dissipation area in at least the second direction X can be further increased, improving heat dissipation efficiency and ensuring reliable heat dissipation for the driver chip 02. Alternatively, the heat dissipation area in a third direction Y, which is coplanar with and intersects the second direction X (e.g., a plane parallel to the bearing surface of the display panel 01), can be increased, allowing more heat to diffuse and be released through both the second direction X and the third direction Y, thereby improving heat dissipation efficiency.

[0114] Optional, continue to refer to Figure 7As can be seen, in this embodiment of the present disclosure, the thermally conductive reinforcing layer 010 can also be slotted, that is, the thermally conductive reinforcing layer 010 can have at least one third slot K3, and the orthographic projection of the at least one third slot K3 on the display panel 01 can also overlap with the orthographic projection of the thermally conductive structure 04 on the display panel 01.

[0115] Example, Figure 7 In the display module shown, the thermally conductive reinforcement layer 010 has a plurality of third slots K3 spaced apart from each other along the second direction X. Figure 7 The diagram schematically shows five third slots K3. These third slots K3 are located at the center of the thermally conductive reinforcement layer 010 in the first direction Z. The center of the thermally conductive reinforcement layer 010 in the first direction Z can be understood as being located on the central axis of the thermally conductive reinforcement layer 010 in the second direction X. Furthermore, the orthographic projection of the multiple third slots K3 on the display panel 01 overlaps the orthographic projection of the thermally conductive structure 04 on the display panel 01. Similar to the arrangement of the first slot K1, by adding these third slots K3 to the thermally conductive reinforcement layer 010, the contact area of ​​the stacked layers in the first direction Z can be further reduced, reducing temperature propagation in the first direction Z, and increasing the heat dissipation area, allowing heat to be evenly distributed, further accelerating heat dissipation efficiency, and achieving reliable heat dissipation for the driver chip 03.

[0116] It should be noted that the above regarding Figure 6 and Figure 7 The first groove K1, the second groove K2, and the third groove K3 can be arranged in combination or independently. For example, the second adhesive layer 09 has the following... Figure 6 Based on the second slot K2 shown, the support layer 06 can also have only one first slot K1, instead of having as shown. Figure 6 The four first slots K1 are shown as being spaced apart from each other.

[0117] Optional, combined Figures 8 to 10 As can be seen from the display module plan views shown respectively, the plurality of first slots K1 (i.e., slots on the support layer 06) and the plurality of third slots K3 (i.e., slots on the reinforcing Cu sheet 010) described in the embodiments of this disclosure can be arranged in any of the following manner:

[0118] like Figure 8 As shown: Multiple first slots K1 and multiple third slots K3 can be arranged sequentially along the second direction X and the third direction Y, and in any direction, the orthographic projections of multiple first slots K1 and multiple third slots K3 on the display panel 01 can be staggered.

[0119] like Figure 9As shown: Multiple first slots K1 and multiple third slots K3 can be arranged sequentially along the second direction X and the third direction Y, and the multiple first slots K1 and multiple third slots K3 can correspond one-to-one, and their orthogonal projections on the display panel 01 overlap with each other.

[0120] like Figure 10 As shown: multiple first slots K1 can be arranged sequentially along the third direction Y, multiple third slots K3 can be arranged sequentially along the second direction X, and the orthographic projections of multiple first slots K1 and multiple third slots K3 on the display panel 01 can overlap with each other.

[0121] As described in the above embodiments, the third direction Y and the second direction X can intersect in the same plane, and both can intersect with the first direction Z in different planes. For example, the first direction Z can be perpendicular to the supporting surface of the display panel 01, and the second direction X and the third direction Y can both be parallel to the supporting surface of the display panel 01. It should be noted that the above... Figures 8 to 10 The illustration shown is merely a schematic representation of the slotted arrangement.

[0122] Optional, combined Figure 8 It can be seen that the orthographic projection of any of the three slots—the first slot K1, the second slot K2, and the third slot K3—on the display panel 01 can be hexagonal. Optionally, the display panel 01 may also include multiple pixels, and the orthographic projection of these pixels on the display panel 01 can also be hexagonal, generally referring to an anodized shape. Based on this, the aforementioned hexagonal slot arrangement can refer to the arrangement of multiple pixels. Correspondingly, Figure 8 The slots shown can also be called pixel-type slots. Based on the slotting method of multiple pixel arrangement, the slots can be further etched with reference to the pixel forming process, thereby simplifying the process, saving manufacturing costs, and speeding up manufacturing efficiency.

[0123] Or, combine Figure 9 and Figure 10 It can be seen that the orthographic projection of any of the three slots—the first slot K1, the second slot K2, and the third slot K3—on the display panel 01 can also be rectangular. Furthermore, for Figure 9 Regarding the structure shown, its rectangular slot can be called a block-shaped slot; while for Figure 10 In the arrangement shown, the rectangular slots can be called through-hole slots. Of course, this is only an illustrative example of some shapes; the slots can also be other shapes, such as circles, ellipses, or triangles.

[0124] Optionally, for any of the first slot K1 (which can also refer to the first type of slot), the second slot K2 (which can also refer to the second type of slot), and the third slot K3 (which can also refer to the third type of slot), the following implementation methods are also possible:

[0125] Firstly, combining Figures 8 to 10 In the case of multiple slots of the same type, the shapes of each slot can be identical. For example, combining... Figure 8 The multiple first slots K1 can have the same shape, all being hexagonal. Of course, in some other embodiments, the shapes of the multiple slots included in the same type of slot can also be different. For example, among the multiple first slots K1, some of the first slots K1 are rectangular, and others are hexagonal.

[0126] Secondly, different types of slots can have the same shape. For example, combining... Figure 8 The first slot K1 and the third slot K3 can have the same shape, both being hexagonal. Of course, in some other embodiments, the shapes of the different slots can also be different. For example, the first slot K1 can be rectangular, and the third slot K3 can be hexagonal.

[0127] Third, among the multiple slots of the same type, the spacing between any two adjacent slots can be a fixed spacing, that is, the spacing between any two adjacent slots is the same. Of course, in some other embodiments, the spacing between any two adjacent slots can also be different.

[0128] Fourth, the dimensions of all slots included in the same type of slotting can be equal. Here, the dimensions can refer to the cross-sectional area of ​​the slot on the bearing surface perpendicular to the display panel 01. Of course, in some other embodiments, the dimensions of the slots included in the same type of slotting can also be different.

[0129] Optionally, the first groove K1, the second groove K2, and the third groove K3 described in the above embodiments can all be formed by etching process, and therefore can also be called etched grooves.

[0130] Optional, combined Figure 1 , Figure 6 and Figure 7 It can also be seen that the display module described in this embodiment may further include a connecting portion B0 located between the flexible circuit board 02 and the non-display area A3 of the display panel 01. This connecting portion B0 can be used to reliably fix the flexible circuit board 02 to the display panel 01, enhancing the connection strength between the flexible circuit board 02 and the display panel 01 and preventing tearing. For example, the connecting portion B0 here can be pressure-sensitive adhesive (PSA), double-sided adhesive, or thermally conductive copper foil.

[0131] Optional, combined Figure 6 and Figure 7It can also be seen that the display module described in this embodiment may further include: double-sided adhesive covering the surface of the bending area A2 of the display panel 01 away from the display area A1 and the non-display area A3. The double-sided adhesive can be used to protect the bending area A2 (e.g., to protect the metal wiring within the bending area A2).

[0132] Optional, combined Figure 1 , Figure 6 and Figure 7 It can also be seen that the display module described in this embodiment may further include: a device area Q1 located on the side of the flexible circuit board 02 away from the non-display area A3. This device area Q1 may include electronic components such as capacitors, resistors, and / or flash memory. Furthermore, in conjunction with... Figure 6 and Figure 7 It can also be seen that the display module described in this embodiment may further include other modules M0 located on the side of the bracket layer 06 away from the display area A1, such as a power supply battery.

[0133] Based on the above description, the bonding scheme adopted by the display module provided in this disclosure can be described as a heat dissipation-friendly FPC reverse bonding IC scheme. This scheme can better and more effectively dissipate heat from the IC, improve the reliability of the display module, reduce heat in the first direction Z, and increase heat conduction in the second direction X and the third direction Y, thereby improving heat dissipation efficiency and achieving uniform heat dissipation. This can solve the yellowing problem of the display panel. Furthermore, the scheme provided in this disclosure is applicable to various FPC IC opening structures, and the etching groove design for bending foldable products can improve heat dissipation efficiency while reducing product weight.

[0134] In summary, this disclosure provides a display module. In this display module, a flexible circuit board located in the non-display area, bent to the side of the display area away from the light-emitting surface, has a slotted area exposing the non-display area. A driver chip is located within this slotted area and spaced apart from the flexible circuit board. Furthermore, a heat-conducting structure is filled within the gap between the driver chip and the flexible circuit board. This allows for better heat dissipation of the driver chip, preventing overheating after prolonged operation and avoiding abnormal pixel brightness at the corresponding location. Consequently, it avoids display abnormalities such as yellowing on the display panel in the display module, ensuring a better display effect.

[0135] Figure 11 This is a flowchart illustrating a method for fabricating a display module according to an embodiment of this disclosure, used to fabricate the display module described in the above embodiments. Figure 11 As shown, the method includes:

[0136] Step 1101: Provide a display panel, wherein the provided display panel has a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to the side of the display area away from the light-emitting surface of the display panel.

[0137] Step 1102: A flexible circuit board is formed on the side of the non-display area away from the display area, and the formed flexible circuit board has a slotted area that exposes the non-display area in the first direction.

[0138] Step 1103: A driver chip is formed in the slotted area of ​​the flexible circuit board, and the formed driver chip and the flexible circuit board are spaced apart from each other in the second direction.

[0139] Among them, such as Figure 1 As shown, the second direction X and the first direction Z can intersect (e.g., be perpendicular to each other).

[0140] Step 1104: A heat-conducting structure is formed in the gap between the driver chip and the flexible circuit board, and the formed heat-conducting structure is in contact with both the driver chip and the flexible circuit board.

[0141] Optional, with Figure 1 Taking the structure shown as an example, Figure 12 A flowchart of a preparation process is shown. For example... Figure 12 As shown: First, a COP process can be performed on the substrate, that is, an IC is bonded and set in the non-display area, and a flexible circuit board (FPC) is also bonded and set. Figure 12 The diagram schematically illustrates two bonded ICs. Next, pressure-sensitive adhesive (PSA) can be applied. Then, the FOP process can continue in the non-display area, where the FPC carrier film is placed in the non-display area. This completes the setup of the FPC and ICs. Furthermore, in this embodiment, the FPC has a slotted area B1, and the bonded IC is located in this slotted area B1. Finally, the thermally conductive structure 04 described in the above embodiment (e.g., thermally conductive adhesive) can be filled into the slotted area B1, also known as a dispenser, and can be filled between the IC and the FPC to achieve thermal conductivity.

[0142] It should be noted that the slots or openings in the embodiments of this disclosure can be achieved by the etching process described in the above embodiments. Different film layers can be etched together, so as not to increase costs.

[0143] In summary, this disclosure provides a display module. In this display module, a flexible circuit board located in the non-display area, bent to the side of the display area away from the light-emitting surface, has a slotted area exposing the non-display area. A driver chip is located within this slotted area and spaced apart from the flexible circuit board. Furthermore, a heat-conducting structure is filled within the gap between the driver chip and the flexible circuit board. This allows for better heat dissipation of the driver chip, preventing overheating after prolonged operation and avoiding abnormal pixel brightness at the corresponding location. Consequently, it avoids display abnormalities such as yellowing on the display panel in the display module, ensuring a better display effect.

[0144] Optionally, embodiments of this disclosure also provide a display module, combined with Figure 1 The display module includes:

[0145] The display panel 01 has a display area A1, a bending area A2 and a non-display area A3 connected in sequence, and the non-display area A3 is bent through the bending area A2 to the side of the display area A1 away from the light-emitting surface of the display panel 01.

[0146] The flexible circuit board 02 is located on the side of the non-display area A3 away from the display area A1 and is bonded to the non-display area A3. In the first direction Z, the flexible circuit board 02 has a slotted area B1 that exposes the non-display area A3.

[0147] The driver chip 03 is located in the slotted area B1 of the flexible circuit board 02 and is bonded to the non-display area A3. In the second direction X, any sidewall of the driver chip 03 is spaced apart from any sidewall of the flexible circuit board 02. The second direction X intersects with the first direction Y.

[0148] The heat-conducting structure 04 is located in the space between the driver chip 03 and the flexible circuit board 02, and is in contact with the driver chip 03, the flexible circuit board 02 and the non-display area A3.

[0149] Figure 13 This is a schematic diagram of the structure of a display device provided in an embodiment of this disclosure. Figure 13 As shown, the display device includes: a power supply component J1, and a display module 00 as described in the above embodiment.

[0150] The power supply component J1 can be coupled to the display module 00 and used to supply power to the display module 00.

[0151] Optionally, the display module 00 can be a foldable display module as described in the above embodiments. The display device can be any product or component with display function, such as a mobile phone, tablet computer, flexible display device, television, and monitor.

[0152] The terminology used in the embodiments of this disclosure is for the purpose of explaining the embodiments of this disclosure only and is not intended to limit this disclosure. Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should be understood in their ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains.

[0153] For example, the terms “first,” “second,” or “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components.

[0154] Similarly, words like "one" or "one" do not indicate a quantity limit, but rather that there is at least one.

[0155] The word “includes” or similar terms means that the elements or objects preceding “includes” or “include” cover the elements or objects listed after “includes” or “include” or their equivalents, and do not exclude other elements or objects.

[0156] Terms like "up," "down," "left," or "right" are used only to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly. "Connection" or "coupled" refers to an electrical connection.

[0157] The "and / or" signifies that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0158] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the gate drive circuit, shift register unit, various circuits and sub-circuits described above can be referred to the corresponding processes in the method embodiments, and will not be repeated here.

[0159] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A display module, characterized in that, The display module includes: The display panel has a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to the side of the display area away from the light-emitting surface of the display panel; A flexible circuit board is located on the side of the non-display area away from the display area, and in a first direction, the flexible circuit board has a slotted area that exposes the non-display area; The driver chip is located on the side of the non-display area away from the display area and is located in the slotted area of ​​the flexible circuit board, and is spaced apart from the flexible circuit board in a second direction, the second direction intersecting the first direction; A heat-conducting structure is located within the gap between the driving chip and the flexible circuit board, and is in contact with both the driving chip and the flexible circuit board; A first back film, a support layer, and a second back film are sequentially stacked between the display area and the non-display area along the first direction; The support layer has at least one first slot, and the orthographic projection of the at least one first slot on the display panel overlaps with the orthographic projection of the heat-conducting structure on the display panel.

2. The display module according to claim 1, characterized in that, The thermally conductive structure includes thermally conductive adhesive.

3. The display module according to claim 1, characterized in that, The projection of the heat-conducting structure onto the display panel overlaps the projection of the driver chip onto the display panel.

4. The display module according to any one of claims 1 to 3, characterized in that, The non-display area includes: a first binding area and a second binding area spaced apart from each other in the second direction, wherein the first binding area is farther away from the bending area relative to the second binding area; The flexible circuit board is bonded to the display panel in the first bonding area, and the slotted area of ​​the flexible circuit board exposes the second bonding area. The driver chip is located on the side of the second bonding area away from the display area, and is bonded to the display panel in the second bonding area.

5. The display module according to any one of claims 1 to 3, characterized in that, The heat-conducting structure is also located between the flexible circuit board and the non-display area.

6. The display module according to any one of claims 1 to 3, characterized in that, In the first direction, the cross-section of the heat-conducting structure includes a circular arc edge.

7. The display module according to claim 1, characterized in that, The display module also includes: A first adhesive layer is located between the first back film and the support layer, and is used to bond the first back film and the support layer. The second adhesive layer is located between the second back film and the support layer, and is used to bond the second back film and the support layer. The first adhesive layer is made of a flexible material, and the second adhesive layer is made of a non-flexible material. Furthermore, the second adhesive layer has at least one second slot, and the orthographic projection of the at least one second slot on the display panel overlaps with the orthographic projection of the thermal conductive structure on the display panel.

8. The display module according to claim 7, characterized in that, The display module also includes: A thermally conductive reinforcing layer is located between the support layer and at least one of the first back membrane and the second back membrane.

9. The display module according to claim 8, characterized in that, The thermally conductive reinforcing layer is located between the support layer and the second back film, and is bonded to the support layer through the second adhesive layer; Furthermore, the thermally conductive reinforcing layer has at least one third slot, and the orthographic projection of the at least one third slot on the display panel overlaps with the orthographic projection of the thermally conductive structure on the display panel.

10. The display module according to claim 9, characterized in that, The support layer has a plurality of first slots spaced apart from each other along the second direction. The plurality of first slots are located on the side of the support layer closer to the flexible circuit board in the first direction, and the orthographic projection of the plurality of first slots on the display panel overlaps with the orthographic projection of the heat-conducting structure on the display panel. And / or, The second adhesive layer has a second slot, the second slot penetrating the second adhesive layer in the first direction, and the orthographic projection of the second slot on the display panel is located within the orthographic projection of the thermal conductive structure on the display panel; And / or, The thermally conductive reinforcement layer has a plurality of third slots spaced apart from each other along the second direction. The plurality of third slots are located at the middle position of the thermally conductive reinforcement layer in the first direction, and the orthographic projection of the plurality of third slots on the display panel covers the orthographic projection of the thermally conductive structure on the display panel.

11. The display module according to claim 9, characterized in that, The support layer has a plurality of first slots, and the thermally conductive reinforcement layer has a plurality of third slots; and the plurality of first slots and the plurality of third slots are arranged in any of the following manner: The plurality of first slots and the plurality of third slots are arranged sequentially along the second direction and the third direction, and in any direction, the orthographic projections of the plurality of first slots and the plurality of third slots on the display panel are staggered. The plurality of first slots and the plurality of third slots are arranged sequentially along the second direction and the third direction, and the plurality of first slots and the plurality of third slots correspond one to one, and their orthographic projections on the display panel overlap each other; The plurality of first slots are arranged sequentially along the third direction, the plurality of third slots are arranged sequentially along the second direction, and the orthographic projections of the plurality of first slots and the plurality of third slots on the display panel overlap each other; The third direction intersects the second direction in the same plane, and both intersect the first direction in different planes.

12. The display module according to claim 9, characterized in that, In the first slot, the second slot, and the third slot, the orthographic projection of any one of the slots on the display panel is hexagonal or rectangular.

13. The display module according to claim 8, characterized in that, The material of the first adhesive layer includes polyimide; the material of the support layer includes stainless steel or copper; the material of the second adhesive layer includes polyethylene terephthalate; and the material of the thermally conductive reinforcing layer includes copper.

14. The display module according to any one of claims 1 to 3, characterized in that, The flexible circuit board includes: The multilayer protective layer and the metal trace layer are alternately stacked along the first direction, and the material of the metal trace layer includes: metallic copper.

15. A method for manufacturing a display module, characterized in that, A method for preparing a display module as described in any one of claims 1 to 14; the method includes: A display panel is provided, the display panel having a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to the side of the display area away from the light-emitting surface of the display panel; A flexible circuit board is formed on the side of the non-display area away from the display area, and the formed flexible circuit board has a slotted area in a first direction that exposes the non-display area; A driving chip is formed in the slotted area of ​​the flexible circuit board, and the formed driving chip is spaced apart from the flexible circuit board in a second direction, the second direction intersecting the first direction; A thermally conductive structure is formed within the gap between the driver chip and the flexible circuit board, and the formed thermally conductive structure is in contact with both the driver chip and the flexible circuit board.

16. A display module, characterized in that, The display module includes: The display panel has a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to the side of the display area away from the light-emitting surface of the display panel; A flexible circuit board is located on the side of the non-display area away from the display area and is bonded to the non-display area, and in a first direction, the flexible circuit board has a slotted area that exposes the non-display area; The driver chip is located in the slotted area of ​​the flexible circuit board and is bonded to the non-display area. In the second direction, any sidewall of the driver chip is spaced apart from any sidewall of the flexible circuit board, and the second direction intersects with the first direction. A heat-conducting structure is located within the gap between the driver chip and the flexible circuit board, and is in contact with the driver chip, the flexible circuit board and the non-display area; A first back film, a support layer, and a second back film are sequentially stacked between the display area and the non-display area along the first direction; The support layer has at least one first slot, and the orthographic projection of the at least one first slot on the display panel overlaps with the orthographic projection of the heat-conducting structure on the display panel.

17. A display device, characterized in that, The display device includes: a power supply component, and a display module as described in any one of claims 1 to 14 or 16; The power supply component is coupled to the display module and is used to supply power to the display module.

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