Electronic device

Abstract

An electronic device includes a stretchable substrate, a plurality of first electronic units, and a plurality of second electronic units. The stretchable substrate has a plurality of island portions and a plurality of bridge portions, each bridge portion connecting at least two of the island portions. The first electronic units are disposed on the island portions, and the second electronic units are disposed on the stretchable substrate, each second electronic unit including a mesh pattern disposed on at least one of the island portions, the mesh pattern including a first opening, the first opening overlapping at least one of the first electronic units.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device having a stretchable substrate. Background Technology

[0002] With the evolution and development of electronic devices, they have become indispensable items in modern society. To enable wider application of electronic devices in various locations and situations—for example, mounting them on curved surfaces or irregular objects (e.g., automotive electronics) or wearing them on the human body (e.g., wearable electronics)—the industry is currently dedicated to developing flexible and stretchable electronic devices to adapt to diverse environments. In the design of flexible and stretchable electronic devices, the bending, flexing, curling, and stretching actions affect the device's lifespan, yield rate, and reliability. Therefore, designing flexible and stretchable electronic devices with long lifespan, high yield rate, high reliability, and / or multifunctionality has become a crucial focus. Summary of the Invention

[0003] In one embodiment, the present invention provides an electronic device comprising a stretchable substrate, a plurality of first electronic units, and a plurality of second electronic units. The stretchable substrate has a plurality of island portions and a plurality of bridging portions, each bridging portion connecting at least two of the island portions. The first electronic units are disposed on the island portions, and the second electronic units are disposed on the stretchable substrate. Each second electronic unit includes a grid pattern disposed on at least one of the island portions, the grid pattern including a first opening overlapping at least one of the first electronic units. Attached Figure Description

[0004] Figure 1 and Figure 2 This is a top view schematic diagram of a part of the electronic device according to the first embodiment of the present invention.

[0005] Figure 3 This is a top view schematic diagram of the anti-breakage design of some embodiments of the present invention.

[0006] Figure 4 This is a top view schematic diagram of a part of the electronic device according to the first embodiment of the present invention.

[0007] Figure 5 for Figure 4 A magnified diagram of region R.

[0008] Figure 6 For along Figure 5 A schematic diagram of the structural cross-section along section line A-A'.

[0009] Figure 7 For along Figure 5 A schematic diagram of the structural cross-section along section line B-B'.

[0010] Figure 8 For along Figure 5 A schematic diagram of the structural cross-section line C-C'.

[0011] Figure 9 For along Figure 5 A schematic diagram of the structural cross-section line D-D'.

[0012] Figure 10 This is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention.

[0013] Figure 11 This is a cross-sectional schematic diagram of an electronic device according to a third embodiment of the present invention.

[0014] Figure 12 This is a cross-sectional schematic diagram of an electronic device according to the fourth embodiment of the present invention.

[0015] Figure 13 This is a top view schematic diagram of the electronic device according to the fifth embodiment of the present invention.

[0016] Figure 14 This is a top view schematic diagram of the electronic device according to the sixth embodiment of the present invention.

[0017] Explanation of reference numerals: 100, 200, 300, 400, 500, 600 - Electronic devices; 110 - Stretchable substrate; 110h - Hole; 110u - Substrate unit; 112 - Island portion; 114 - Bridging portion; 114a - First bridging portion; 114b - Second bridging portion; 120 - First electronic unit; 130 - Second electronic unit; 132, 142, 152 - Grid pattern; 132a - First outer frame; 132b - First opening; 132 d - Fourth opening; 132_1 - First grid pattern; 132_2 - Second grid pattern; 134, 144, 154 - Connecting patterns; 134a - Second outer frame; 134b - Second opening; 134_1 - First connecting pattern; 134_2 - Second connecting pattern; 140 - Bridging unit; 150 - Dummy unit; 530 - Bridging component; 610 - Electronic component; 620 - Connector; 630 - Circuit board; 640 - Connecting pad; A1 - First area; A2 - Second Area; A3 - Third area; AR - Active area; BS - Object; CL1, CL2, CL3, CL4, CL5 - Conductive layers; DSNa, DSNb, DSNc, DSNd, DSNe, DSNf - Anti-breakage design; EC - Encapsulation layer; ELS - Elastic material layer; FR - Outer frame; IL1, IL2, IL3, IL4, IL5 - Insulating layers; L1, L2 - Length; LE - Light-emitting element; OP, OP1, OP2 - Opening; PCR - Peripheral circuit area; PDL - Pixel definition layer; PR - Peripheral area; R - Region; SM - Semiconductor layer; SP - Subpixel; SP1 - Green subpixel; SP2 - Red subpixel; SP3 - Blue subpixel; ST, ST1, ST2 - Strip pattern; SW - Transistor; UN - Union unit; UN1 - First union unit; UN2 - Second union unit; US1 - First sub-unit; US2 - Second sub-unit; W1 - Width; WE - Wavy outer edge; X, Y, Z - Direction. Detailed Implementation

[0018] The present invention can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and to keep the drawings concise, many of the accompanying drawings depict only a portion of the display device, and certain elements in the drawings are not drawn to scale. Furthermore, the number and size of the elements in the drawings are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0019] Throughout this specification and claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same element. This document is not intended to distinguish between elements that have the same function but different names. In the following specification and claims, words such as "comprising," "containing," and "having" are open-ended terms and should therefore be interpreted as "containing but not limited to...". Thus, when the terms "comprising," "containing," and / or "having" are used in the description of this invention, they specify the presence of the corresponding feature, area, step, operation, and / or component, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or component.

[0020] The directional terms used herein, such as "up," "down," "front," "back," "left," and "right," are for reference only when referring to the accompanying drawings. Therefore, the directional terms used are illustrative and not intended to limit the invention. In the accompanying drawings, each figure illustrates general features of the methods, structures, and / or materials used in specific embodiments. However, these figures should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and positions of various films, regions, and / or structures may be reduced or enlarged.

[0021] When a component (e.g., a membrane or region) is referred to as "on another component," it can be directly on that component, or there may be other components between them. Conversely, when a component is referred to as "directly on another component," there are no components between them. Furthermore, when a component is referred to as "on another component," the two are vertically related, and this component can be above or below the other component, depending on the orientation of the device.

[0022] It should be understood that when a component or membrane is referred to as being "connected to" another component or membrane, it can be directly connected to this other component or membrane, or there can be an intercalated component or membrane between them. When a component is referred to as being "directly connected to" another component or membrane, there is no intercalated component or membrane between them. Additionally, when a component is referred to as being "coupled to another component (or a variant thereof)," it can be directly connected to this other component, or indirectly connected (e.g., electrically connected) to this other component through one or more components.

[0023] It should be understood that in the specification and claims, the term "horizontal direction" refers to a direction parallel to directions X and Y in the drawings, and the term "vertical direction" refers to a direction parallel to direction Z in the drawings, wherein directions X, Y, and Z are perpendicular to each other. In the specification and claims, the term "top view" refers to the result of viewing along the vertical direction. In the specification and claims, the term "section" refers to the result of viewing the structure cut along the vertical direction from a horizontal perspective.

[0024] It should be understood that in the specification and claims, the term "overlap" means that two components overlap in the Z direction, and unless otherwise specified, the term "overlap" includes partial or complete overlap. In the specification and claims, the term "parallel" means that the included angle between two components may be less than or equal to a specific angle, such as 5 degrees, 3 degrees, or 1 degree.

[0025] It should be understood that, unless otherwise specified in the specification and claims, the term "surround" means that a component may completely or partially surround another component in a viewing direction (e.g., from top view). "Component B completely surrounds component C" means that the periphery of component C has a corresponding component B in its normal direction. "Component B partially surrounds component C" means that the annular structure in component B used to surround component C has at least one notch, such that a portion of the periphery of component C does not have a corresponding component B in its normal direction.

[0026] The terms “approximate” or “same” are generally interpreted as being within ±20% of a given value, or within ±10%, ±5%, ±3%, ±2%, ±1%, or ±0.5% of a given value.

[0027] The ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number for that element (or those elements), nor do they represent the order of one element with another or the order of manufacture. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0028] It should be understood that the features described below can be replaced, recombined, or mixed in several different embodiments to complete other embodiments without departing from the spirit of the invention. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0029] According to embodiments of the present invention, the width, thickness, height, or area of ​​each element, or the distance or spacing between elements, can be measured using an optical microscopy (OM), a scanning electron microscope (SEM), an alpha-step thickness gauge, an ellipsometry, or other suitable methods, but are not limited thereto. Specifically, according to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional image containing the element to be measured, and the width, thickness, height, or area of ​​each element, or the distance or spacing between elements, can be measured, and the element volume can be obtained by a suitable method (e.g., integration). Furthermore, any two values ​​or directions used for comparison may have a certain degree of error.

[0030] In this invention, the electronic device may include a display device, a backlight device, an antenna device, a sensing device, or a splicing device, but is not limited thereto. The electronic device may be a bendable electronic device, a flexible electronic device, and / or a stretchable electronic device. The display device may be a non-self-emissive display device or a self-emissive display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device. The sensing device may be a sensing device that senses capacitance, light, heat, or ultrasound, but is not limited thereto. Electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited thereto. Electronic devices may also include liquid crystal materials, fluorescent materials, phosphorescent materials, quantum dot (QD) materials, or other suitable materials as needed, but are not limited thereto. Furthermore, the display device may be a color display or a monochrome display. The electronic device may have a driving system, a control system, a light source system, etc., and other peripheral systems to support the display device, backlight device, antenna device, sensing device, or splicing device. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. The shape of the electronic device may be polygonal (e.g., rectangular), a shape with curved edges (e.g., circular, elliptical), or other suitable shapes, but is not limited thereto. It should be noted that the electronic device can be any arrangement or combination of the foregoing, but is not limited thereto. The following description uses a stretchable color display device as an example of an electronic device or splicing device to illustrate the invention, but the invention is not limited thereto.

[0031] In this invention, because the electronic device is stretchable, it can be applied to a variety of situations. In some embodiments, the electronic device can be disposed on a surface containing a curved surface or on an irregular object, such as automotive electronic devices disposed on a windshield, window, rearview mirror, dashboard, or steering wheel of a vehicle, but is not limited thereto. In some embodiments, the electronic device can be applied to situations requiring repeated stretching, such as devices with push-button designs, wearable electronic devices, etc., but is not limited thereto.

[0032] In this invention, the electronic device may include an active area and a peripheral area. The active area may selectively include a display area, a sensing area, a light-emitting area, a transceiver area, and / or a working area, depending on the application of the electronic device. The peripheral area is located at least one outer side of the active area, and electronic components used to assist the active area may be disposed within the peripheral area, but are not limited thereto. For example, the active area of ​​the stretchable color display device of this invention may include a display area and a sensing area, but is not limited thereto.

[0033] Please refer to Figures 1 to 3 , Figure 1 and Figure 2 This is a top view schematic diagram of a portion of the electronic device according to the first embodiment of the present invention. Figure 3 This is a top view schematic diagram of the anti-breakage wire design of some embodiments of the present invention, wherein... Figure 1 The structure shown was not subjected to any force, therefore it was neither stretched nor deformed. Figure 2 The structure shown has been subjected to stress, resulting in tension and / or deformation. For example... Figure 1 As shown, the electronic device 100 includes a stretchable substrate 110, wherein the stretchable substrate 110 may comprise any suitable rigid and / or flexible material. For example, the stretchable substrate 110 may comprise glass, quartz, ceramic, sapphire, polyimide (PI), polyethylene terephthalate (PET), other suitable materials, or combinations thereof. In this invention, directions X and Y are perpendicular to the normal direction of the stretchable substrate 110, while direction Z is parallel to the normal direction of the stretchable substrate 110.

[0034] In this invention, the stretchable substrate 110 may have a patterned structure, thereby giving it stretchable properties. That is, even if the material of the stretchable substrate 110 does not have stretchable or flexible properties (e.g., a rigid material), the stretchable substrate 110 will still possess stretchable properties due to the patterned structure. In the manufacturing process of the stretchable substrate 110, for example, a patterned structure can be created by forming multiple holes 110h on a substrate using a patterning process, thereby forming the stretchable substrate 110.

[0035] In detail, the patterned structure of the stretchable substrate 110 may include a plurality of island portions 112 and a plurality of bridging portions 114, wherein each bridging portion 114 connects at least two island portions 112. For example, Figure 1Four island portions 112 are illustrated, each island portion 112 being connectable to four bridging portions 114, and each bridging portion 114 being connectable between two island portions 112, but not limited thereto. In this invention, the shapes of the island portions 112 and bridging portions 114 can be designed according to requirements, such as polygons (e.g., rectangles), shapes with curved edges (e.g., circles, ellipses), or other suitable shapes. For example, in... Figure 1 In this invention, the island portion 112 can be quadrilateral, while the bridging portion 114 can be a strip structure, but is not limited thereto. The arrangement of the island portion 112 and the bridging portion 114 can be designed according to requirements. For example, in… Figure 1 In this embodiment, the island portions 112 may be arranged in rows along direction X and in columns along direction Y, while some bridging portions 114 extend along direction X and others extend along direction Y, but this is not a limitation. It should be noted that in some embodiments, the edge at the connection between the bridging portion 114 and the island portion 112 may be a curved edge (e.g., an arc) to improve the yield rate during operation of the stretchable substrate 110 (e.g., during stretching and / or deformation), but this is not a limitation.

[0036] In some embodiments, the stretchable substrate 110 may have a plurality of substrate units 110u, each substrate unit 110u may include at least one island portion 112 and at least one bridging portion 114, and the number of island portions 112 and bridging portions 114 included in the substrate unit 110u may be designed according to requirements. For example, in Figure 1 In this configuration, each substrate unit 110u may include four island portions 112 arranged in a 2x2 array and twelve bridging portions 114 directly connecting these island portions 112 (four bridging portions 114 connect between these island portions 112, and one end of eight bridging portions 114 connects to the island portions 112 of other substrate units 110u). That is, Figure 1 A substrate unit 110u is illustrated, but it is not limited thereto. In some embodiments (such as...) Figure 1 As shown), the substrate unit 110u may have a symmetrical top view pattern, but is not limited thereto. In some embodiments (such as... Figure 1 As shown), the four island portions 112 arranged in a 2x2 array and the four bridging portions 114 directly connected between these island portions 112 can surround the H-shaped hole 110h of the stretchable substrate 110, and the top view pattern of the two ends of the H-shaped hole 110h can approximate a triangle, but is not limited thereto.

[0037] like Figure 2 As shown, since the stretchable substrate 110 has a patterned structure including island portions 112 and bridging portions 114, force can be applied to the stretchable substrate 110 to stretch and / or deform it. For example, in Figure 2 In the process, when a force is applied to the stretchable substrate 110, the island portion 112 can rotate, while the bridging portion 114 deforms, so that the stretchable substrate 110 can be stretched, but not limited thereto.

[0038] In some embodiments, pixels for displaying an image may be disposed on the island portion 112, and a pixel may include at least one sub-pixel (SP). In some embodiments, if the electronic device 100 is a color display, a pixel may include, for example, multiple sub-pixels (SP), such as a green sub-pixel, a red sub-pixel, and a blue sub-pixel, but is not limited thereto; the number and color of the sub-pixels (SP) included in a pixel may be changed as needed. In some embodiments, if the electronic device 100 is a monochrome display, a pixel may include, for example, one sub-pixel (SP), but is not limited thereto. For example, in Figure 1 In the illustrated electronic device 100 (stretchable color display device), an island portion 112 may have one pixel, and each pixel may include two green sub-pixels SP1, one red sub-pixel SP2 and one blue sub-pixel SP3, but is not limited thereto.

[0039] The electronic device 100 includes a plurality of first electronic units 120 disposed on an island portion 112 of a stretchable substrate 110. The first electronic units 120 may include active elements, such as transistors, light-emitting diodes, photodiodes, or other suitable active elements. In some embodiments, the first electronic units 120 may be active elements (e.g., light-emitting elements) disposed in a sub-pixel SP, and a sub-pixel SP may include one or more first electronic units 120, but is not limited thereto.

[0040] In this invention, light-emitting elements (e.g., light-emitting diodes) located in sub-pixels SP can provide light with corresponding light intensity based on the received voltage and / or current. The voltage and / or current received by the light-emitting elements are related to, for example, a grayscale signal (which can be provided by a chip or externally), thereby displaying an image. That is, the intensity of light generated by each light-emitting element is related to the grayscale value of the area in the display image corresponding to that light-emitting element.

[0041] The color of light emitted by the light-emitting elements can be designed according to requirements. For example, the light-emitting elements may emit different colors of light depending on the sub-pixel SP they are located in, such as red, green, or blue light, but are not limited thereto. In some embodiments, all light-emitting elements may emit the same color of light, and the electronic device 100 may additionally include a light conversion layer (not shown) disposed on the light-emitting elements to convert or filter the light emitted by the light-emitting elements into different colors of light. The light conversion layer may include a color filter, quantum dot (QD) material, fluorescent material, phosphorescent material, other suitable materials, or any combination thereof. For example, the light-emitting elements may emit white light, and the light conversion layer may convert the white light into the color required by the sub-pixel SP, such as red, green, or blue light, but is not limited thereto. As another example, the light-emitting elements may emit blue light, and the light conversion layer may convert the blue light into the color required by the sub-pixel SP, such as red, green, or maintain blue light without conversion, but is not limited thereto.

[0042] Photodiodes can generate electrical signals (such as voltage or current) in response to the received light, and can then be used for related applications, such as power generation and photosensing.

[0043] Examples of transistors include, but are not limited to, top-gate, bottom-gate, dual-gate, or other suitable types of transistors. In some embodiments, the transistor may be electrically connected to a light-emitting element (e.g., a light-emitting diode) in the sub-pixel SP to control the voltage and / or current received by the light-emitting element, but is not limited thereto.

[0044] Electronic device 100 may include a second electronic unit 130 disposed on a stretchable substrate 110, wherein the second electronic unit 130 may include passive components, such as resistors, capacitors, inductors, traces, electrodes (e.g., sensing electrodes), or other suitable passive components. In some embodiments, the second electronic unit 130 may include touch electrodes and / or traces (e.g., touch traces) so that the second electronic unit 130 can be used to detect touch controls (e.g., fingers, styluses, etc.) touching electronic device 100, serving as any suitable type of touch sensor (e.g., capacitive touch sensor, resistive touch sensor), but is not limited thereto. In some embodiments, the second electronic unit 130 may include signal transceiver elements (e.g., antenna elements) so that the second electronic unit 130 can be used to receive or transmit electromagnetic waves, thereby enabling electronic device 100 to have antenna functionality, but is not limited thereto.

[0045] In this invention, the second electronic unit 130 may be a single-layer structure or a multi-layer structure. In some embodiments, the second electronic unit 130 may be a single-layer structure including a conductive layer, but is not limited thereto. In some embodiments, the second electronic unit 130 may be a multi-layer structure including multiple conductive layers and an insulating layer sandwiched between two conductive layers, but is not limited thereto. In some embodiments, a portion of the second electronic unit 130 may be a single-layer structure and another portion may be a multi-layer structure, but is not limited thereto. It should be noted that, in this document, the materials of the conductive layers may include, for example, metals, transparent conductive materials (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), etc.), other suitable conductive materials or combinations thereof, and the materials of the insulating layers may include, for example, silicon oxide (SiOx), silicon nitride (SiNy), silicon oxynitride (SiOxNy), organic insulating materials (e.g., photosensitive resin), other suitable insulating materials or combinations thereof, but are not limited thereto. For example, the material of the conductive layer included in the second electronic unit 130 may be a metal, but is not limited thereto. Furthermore, the first electronic unit 120 and the second electronic unit 130 may be disposed on the same side or different sides of the stretchable substrate 110 as required.

[0046] In this invention, the arrangement range of each second electronic unit 130 can be designed according to requirements. For example, in Figure 1 In this context, the second electronic unit 130 and the substrate unit 110u of the stretchable substrate 110 have a one-to-one correspondence (i.e., one second electronic unit 130 is disposed on one substrate unit 110u), but this is not a limitation.

[0047] In some embodiments, the pattern of the second electronic unit 130 may have a breakage-resistant design as required to reduce breakage of the second electronic unit 130 when the electronic device 100 is stretched and / or deformed, thereby improving the pass rate of the electronic device 100 when stretched and / or deformed. In actual design, the pattern of the second electronic unit 130 may be designed according to the amount of stretching, deformation and / or bending curvature of the electronic device 100.

[0048] Figure 3 Some embodiments of the anti-breakage design are illustrated, but the anti-breakage design of the present invention is not limited thereto, and other anti-breakage designs may also be provided. Figure 3 The combination of the illustrated design or other suitable designs. In some embodiments (such as...) Figure 3 As shown, the anti-breakage design pattern may include an opening OP, and the shape of the opening OP may be a polygon (e.g., rectangle, rhombus, strip), a shape with curved edges (e.g., circle, ellipse), or other suitable shape. In some embodiments, the shape of the opening OP may be a polygon with rounded corners, wherein the presence of rounded corners can improve the pass rate when the electronic device 100 is stretched and / or deformed. In this invention, the area of ​​the opening OP can be designed according to requirements.

[0049] For example, in Figure 3 In the illustrated anti-breakage design DSNa, the anti-breakage design DSNa may include an outer frame FR surrounding the opening OP (e.g., but not limited to, a rectangular pattern), and the anti-breakage design DSNa may be formed by connecting the outer frames FR in series (the openings OP may, for example, be arranged in a row), but is not limited thereto. For example, in Figure 3 In the breakage protection design DSNb shown, the breakage protection design DSNb may include an outer frame FR surrounding the opening OP (e.g., but not limited to, an elliptical pattern), the outer frames FR being connected to each other to give the breakage protection design DSNb a wavy outer edge WE, and the openings OP being arranged in multiple rows. Figure 3 The DSNb's anti-breakage design features two rows of open pins (OPs), with the OPs in different rows staggered, but this is not a limitation. For example, in... Figure 3 In the illustrated anti-breakage design DSNc, the anti-breakage design DSNc may be a strip structure ST including at least one open OP (e.g., but not limited to, a pie pattern or an elliptical pattern), wherein the open OPs may be arranged in at least one row. In some embodiments of anti-breakage designs DSNa, DSNb, and DSNc, the area of ​​the open OPs may be greater than or equal to 1 square micrometer (μm). 2 And less than or equal to 50 square micrometers (i.e., 1 μm) 2 Area of ​​the opening OP ≤ 50 μm 2 This is to improve the pass rate of the electronic device 100 under tension and / or deformation, but is not limited thereto. In some embodiments of the anti-breakage design DSNa, anti-breakage design DSNb, and anti-breakage design DSNc, the ratio of the length L1 of the opening OP to the width W1 may be greater than or equal to 1 and less than or equal to 5 (i.e., 1≤L1 / W1≤5) to improve the pass rate of the electronic device 100 under tension and / or deformation, but is not limited thereto. It should be noted that in this invention, the length L1 is measured along the extension direction (long direction) parallel to the strip structure ST, and the width W1 is measured along the extension direction (long direction) perpendicular to the strip structure ST.

[0050] In some embodiments, Figure 3The breakage prevention designs DSNd and DSNe shown may have a bifurcated structure to divide a strip pattern ST1 into multiple strip patterns ST2. In the breakage prevention design DSNd, a strip pattern ST1 can be divided into three strip patterns ST2, and the opening OP (rectangular or strip pattern) is located between two adjacent of the three bifurcated strip patterns ST2, but is not limited thereto. In the breakage prevention design DSNe, a strip pattern ST1 can be divided into two strip patterns ST2, and the opening OP1 (rectangular or strip pattern) is located between the two bifurcated strip patterns ST2. It should be noted that because the breakage prevention designs DSNd and DSNe have a bifurcated structure, even if one of the bifurcated strip patterns ST2 breaks during the stretching of the electronic device 100, the electrical signal can still be transmitted through the other bifurcated strip patterns ST2, thereby preventing breakage of the electronic device 100 during stretching and / or deformation. In some embodiments of the anti-breakage design DSNd and anti-breakage design DSNe, the ratio of the length L2 of the bifurcated strip pattern ST2 to the length L1 of the opening OP1 can be greater than or equal to 1 and less than or equal to 2 (i.e., 1 ≤ L2 / L1 ≤ 2) to improve the pass rate of the electronic device 100 under stretching and / or deformation, but is not limited thereto. In some embodiments of the anti-breakage design DSNd and anti-breakage design DSNe, the ratio of the length L1 of the opening OP1 to the width W1 can be greater than or equal to 50 and less than or equal to 1000 (i.e., 50 ≤ L1 / W1 ≤ 1000) to improve the pass rate of the electronic device 100 under stretching and / or deformation, but is not limited thereto. It should be noted that in this invention, the length L1 is measured along the extension direction (long direction) parallel to the strip structure ST2, and the width W1 is measured along the extension direction (long direction) perpendicular to the strip structure ST2.

[0051] Furthermore, the anti-breakage design can have various types of openings. For example, the anti-breakage design DSNe can have a strip pattern (or rectangular pattern) opening OP1 and a pie pattern opening OP2, and the pie pattern opening OP2 can be set in the branched strip pattern ST2 to improve the pass rate when the electronic device 100 is stretched and / or deformed, but is not limited thereto. In addition, optionally, the anti-breakage design can have a notch without affecting the transmission of electrical signals to improve the anti-breakage effect.

[0052] In some embodiments (such as) Figure 3 As shown, the pattern of the anti-breakage design DSNf may be wavy to improve the tensile strength of the anti-breakage design DSNf, thereby improving the pass rate of the electronic device 100 under tension and / or deformation, but is not limited thereto.

[0053] In this invention, each second electronic unit 130 may include a grid pattern 132 disposed on the island portion 112, wherein the grid pattern 132 may optionally have a break-through protection design (i.e., the grid pattern 132 may include...). Figure 3 One of the anti-breakage wire designs shown. Figure 3 The combination of the anti-breakage design shown (or other suitable anti-breakage design) is used to reduce the breakage of the grid pattern 132 when the electronic device 100 is stretched and / or deformed, thereby improving the pass rate of the electronic device 100 when stretched and / or deformed. Figure 1 In the grid pattern 132, a first outer frame 132a and a first opening 132b may be included. The first outer frame 132a may surround (completely or partially surround) the first opening 132b, and the first opening 132b may overlap with at least one first electronic unit 120. Therefore, in Figure 1 In this invention, the first outer frame 132a may surround at least one first electronic unit 120, and the first outer frame 132a may not overlap with the first electronic unit 120. In this invention, the first outer frame 132a of the second electronic unit 130 may be a closed pattern or a non-closed pattern as required, to completely or partially surround the first opening 132b. In this invention, the first outer frame 132a of the grid pattern 132 of the second electronic unit 130 may include a conductive material (e.g., but not limited to, metal). In this invention, the shapes of the first outer frame 132a and the first opening 132b may be designed into any suitable shape as required, for example, but not limited to, polygons (e.g., rectangles, rhombuses, bars), and shapes with curved edges (e.g., circles, ellipses). In some embodiments, the shapes of the first outer frame 132a and the first opening 132b may be polygons with rounded corners to improve the yield rate when the electronic device 100 is stretched and / or deformed.

[0054] In this invention, the distribution of the grid pattern 132 of the second electronic unit 130 on the substrate unit 110u can be designed according to requirements, such that the grid pattern 132 is provided on one or more island portions 112 of the substrate unit 110u. In some embodiments, the grid pattern 132 of the second electronic unit 130 can be respectively provided on at least two island portions 112 in the substrate unit 110u. For example, in Figure 1 In this embodiment, the grid pattern 132 of the second electronic unit 130 can be respectively disposed on all island portions 112 in the substrate unit 110u, but is not limited thereto. Furthermore, one or more grid patterns 132 can be disposed on an island portion 112. For example, in... Figure 1 In the middle, four grid patterns 132 can be set on an island section 112, but this is not a limitation.

[0055] Each second electronic unit 130 may include a connection pattern 134 disposed on the bridging portion 114, where the connection pattern 134 can be used to electrically connect the grid patterns 132 on two adjacent island portions 112, and the pattern of the connection pattern 134 can be designed according to requirements. In some embodiments, the pattern of the connection pattern 134 may have a design for preventing wire breakage (i.e., the connection pattern 134 may include Figure 3 one of the wire breakage prevention designs shown, Figure 3 a combination of the wire breakage prevention designs shown, or other suitable wire breakage prevention designs), to reduce the wire breakage of the connection pattern 134 when the electronic device 100 is stretched and / or deformed, thereby improving the qualification rate of the electronic device 100 when stretched and / or deformed.

[0056] In some embodiments (as shown in Figure 1 ), the connection pattern 134 may include a second outer frame 134a and a second opening 134b, where the shape of the second opening 134b can be a polygon (e.g., rectangle, rhombus, bar), a shape with a curved edge (e.g., circle, ellipse), or other suitable shapes, and the second outer frame 134a can surround (completely surround or partially surround) the second opening 134b. In the present invention, the second outer frame 134a can be a closed pattern or an open pattern according to requirements, to completely surround or partially surround the second opening 134b. For example, the shapes of the second outer frame 134a and the second opening 134b can be a polygon with rounded corners (e.g., rectangle), and the connection pattern 134 can be formed by connecting the second outer frames 134a in series, to improve the qualification rate of the electronic device 100 when stretched and / or deformed, but not limited thereto.

[0057] In the case where the connection pattern 134 has a second opening 134b, the area relationship between the first opening 132b of the grid pattern 132 and the second opening 134b of the connection pattern 134 can be designed according to requirements. In Figure 1 , the first opening 132b has a first area A1, the second opening 134b has a second area A2, and the first area A1 can be greater than the second area A2. For example, the ratio of the first area A_{1} to the second area A_{2} is greater than 50 and less than or equal to 5000 (i.e., 50 < A1 / A2 ≤ 5000), to improve the qualification rate of the electronic device 100 when stretched and / or deformed, but not limited thereto. In addition, optionally, the areas of the first openings 132b of the grid pattern 132 on the same island portion 112 can be the same or different according to requirements. For example, in Figure 1In an island portion 112, the largest first opening 132b and the smallest first opening 132b (or the so-called third opening) of the grid pattern 132 respectively overlap different first electronic units 120, and the ratio of the area of the largest first opening 132b (e.g., the first area A1) to the area of the smallest first opening 132b (or the third area A3 of the third opening) can be greater than 1 and less than or equal to 5 (i.e., 1 < A1 / A3 ≤ 5), but not limited thereto. For another example, the areas of the first openings 132b of the grid pattern 132 on the same island portion 112 can be the same as each other (i.e., the first area A1 and the third area A3 are the same), but not limited thereto.

[0058] In some other embodiments (not shown in the figures), the connection pattern 134 can have a wavy shape to enhance the stretch resistance of the connection pattern 134, thereby improving the qualification rate when the electronic device 100 is stretched and / or deformed, but not limited thereto.

[0059] In some embodiments, the connection patterns 134 located at different positions in a second electronic unit 130 can have different pattern designs. For example (not shown in the figures), on a substrate unit 110u, a connection pattern 134 having Figure 3 the shown anti-disconnection design DSNa is provided on a bridging portion 114, and a connection pattern 134 having Figure 3 the shown anti-disconnection design DSNf is provided on another bridging portion 114, but not limited thereto. In addition, the connection pattern 134 can be designed according to the stretching amount, deformation amount, and / or bending curvature of the electronic device 100. For example, if the electronic device 100 has a relatively large stretching amount and / or deformation amount in the X direction, and the electronic device 100 has no stretching amount and / or deformation amount in the Y direction, the connection pattern 134 on the bridging portion 114 extending in the X direction can have an anti-disconnection design, while the connection pattern 134 on the bridging portion 114 extending in the Y direction can have no anti-disconnection design, but not limited thereto.

[0060] In the present invention, the distribution of the connection pattern 134 of the second electronic unit 130 on the substrate unit 110u can be designed according to requirements, such that the connection pattern 134 is provided on one or more bridging portions 114 of the substrate unit 110u. For example, as Figure 1 shown, the connection pattern 134 is provided on each bridging portion 114 in the substrate unit 110u corresponding to the second electronic unit 130, but not limited thereto. For another example (not shown in the figures), the connection pattern 134 is provided on at least one bridging portion 114 in the substrate unit 110u corresponding to the second electronic unit 130, and the connection pattern 134 is not provided on at least another bridging portion 114, but not limited thereto.

[0061] When a force is applied to the stretchable substrate 110, causing it to stretch and / or deform, some patterns in the second electronic unit 130 may deform. For example, in Figure 2 When the island portion 112 rotates due to applied force, the connection pattern 134 of the second electronic unit 130 deforms at the connection grid pattern 132. In some embodiments, the deformed portion of the second electronic unit 130 may have a pattern more adaptable to deformation. For example, the deformed portion of the second electronic unit 130 may have a larger opening, or the pattern of the deformed portion of the second electronic unit 130 may be designed according to the direction and / or curvature of the deformation of the stretchable substrate 110 in this portion.

[0062] Please refer to Figures 4 to 9 And at the same time refer to Figure 1 , Figure 4 This is a top view schematic diagram of a portion of the electronic device 100 according to the first embodiment of the present invention. Figure 5 for Figure 4 An enlarged schematic diagram of region R. Figures 6 to 9 respectively along Figure 5 The structural cross-sectional diagrams of sections A-A', B-B', C-C', and D-D' are shown. Figures 6 to 9 The object BS shown is any object on which the electronic device 100 can be mounted, such as, but not limited to, windshields, car windows, rearview mirrors, dashboards, steering wheels, animals, human bodies, etc., and the first electronic unit 120 is exemplified by a light-emitting element LE. Figure 4 As shown, the electronic device 100 may include a plurality of joint units UN, and each joint unit UN may include a plurality of second electronic units 130 connected to each other. For example, in Figure 4 In this configuration, each joint unit UN may include five second electronic units 130, and the five second electronic units 130 are connected in a "+" shape. That is, each joint unit UN may be disposed on multiple substrate units 110u of the stretchable substrate 110, but is not limited thereto. In some embodiments (e.g. Figure 4 As shown, the multiple joint units UN may include multiple first joint units UN1 and multiple second joint units UN2, wherein the first joint units UN1 and the second joint units UN2 are not directly connected to each other. For example, if the second electronic unit 130 is used for touch sensing, the joint unit UN may be a sensing electrode, wherein the first joint unit UN1 may be, for example, a signal transmitting electrode (Tx electrode), and the second joint unit UN2 may be, for example, a signal receiving electrode (Rx electrode), such that the multiple joint units UN including the second electronic unit 130 may be capacitive touch sensors, but are not limited thereto.

[0063] In this invention, the arrangement and connection of the first joint unit UN1 and the second joint unit UN2 can be designed according to requirements. For example, multiple first joint units UN1 arranged along the Y direction are electrically connected to each other to form a joint unit column, and multiple joint unit columns can be arranged along the X direction. Multiple second joint units UN2 arranged along the X direction are electrically connected to each other to form a joint unit row, and multiple joint unit rows can be arranged along the Y direction, but are not limited thereto.

[0064] The electronic device 100 may also include a plurality of bridging units 140 disposed on the stretchable substrate 110. For example, in Figure 4 In this invention, the bridging unit 140 and the substrate unit 110u of the stretchable substrate 110 have a one-to-one correspondence (i.e., one bridging unit 140 is disposed on one substrate unit 110u), but this is not a limitation. In this invention, each bridging unit 140 is electrically connected to two adjacent second electronic units 130, and these two adjacent second electronic units 130 may belong to different union units UN. Specifically, in... Figure 4 In this configuration, bridging unit 140 is located between two adjacent first joint units UN1 in the Y direction, electrically connecting second electronic units 130 belonging to different first joint units UN1, thereby electrically connecting the two adjacent first joint units UN1. Bridging unit 140 is located between two adjacent second joint units UN2 in the X direction, electrically connecting second electronic units 130 belonging to different second joint units UN2, thereby electrically connecting the two adjacent second joint units UN2. It should be noted that bridging unit 140 electrically connects the two adjacent first joint units UN1 via a first conductive path and the two adjacent second joint units UN2 via a second conductive path. The first conductive path is different from the second conductive path, ensuring that the first joint unit UN1 is not connected to the second joint unit UN2.

[0065] Similarly, the bridging unit 140 may include a grid pattern 142 disposed on the island portion 112 and a connection pattern 144 disposed on the bridging portion 114 (e.g., Figure 5 As shown), the details of the grid pattern 142 and the connection pattern 144 can be found in the grid pattern 132 and the connection pattern 134 of the second electronic unit 130 above, and will not be repeated here.

[0066] Optionally, the electronic device 100 may also include a plurality of dummy units 150 disposed on the stretchable substrate 110. For example, in Figure 4In this invention, the dummy unit 150 and the substrate unit 110u of the stretchable substrate 110 have a one-to-one correspondence (i.e., one dummy unit 150 is disposed on one substrate unit 110u), but this is not a limitation. In this invention, the dummy unit 150 is disposed between two adjacent second electronic units 130 and electrically insulated from the two adjacent second electronic units 130, wherein these two adjacent second electronic units 130 may belong to different joint units UN. In some embodiments, the dummy unit 150 can be used to separate the first joint unit UN1 and the second joint unit UN2.

[0067] Optionally, the dummy unit 150 may include a grid pattern 152 disposed on the island portion 112 and / or a connection pattern 154 disposed on the bridging portion 114 (e.g., Figure 5 As shown, the details of the grid pattern 152 and the connection pattern 154 can be found in the grid pattern 132 and the connection pattern 134 of the second electronic unit 130 above, and will not be repeated here.

[0068] Figure 5 The illustration shows four substrate units 110u in the area R and the structures disposed thereon, wherein the second electronic unit 130 of the first joint unit UN1, the second electronic unit 130 of the second joint unit UN2, the bridging unit 140, and the dummy unit 150 are respectively disposed on these four substrate units 110u. In this invention, the grid patterns 132, 142, and 152 located on different substrate units 110u can have the same or different designs as required, and the connection patterns 134, 144, and 154 located on different substrate units 110u can have the same or different designs as required. In some embodiments (e.g.) Figure 5 As shown), the grid patterns 132, 142, and 152 (located on the island portion 112) on different substrate units 110u can have the same design, but the connection patterns 134, 144, and 154 (located on the bridging portion 114) on different substrate units 110u can have different designs. For example, in Figure 5 In the first joint unit UN1, the connection pattern 134 of the second electronic unit 130 is the same as the connection pattern 134 of the second electronic unit 130 of the second joint unit UN2 (e.g., Figure 3 The anti-breakage design shown (DSNa) has a connection pattern 134 of the second electronic unit 130 of the first joint unit UN1 that is different from the connection pattern 144 of the bridging unit 140 (e.g., Figure 3 The connection pattern 154 between the anti-breakage design DSNc shown and the dummy unit 150 (e.g., Figure 3The anti-breakage design DSNf shown is different from the connection pattern 154 of the bridging unit 140, but is not limited thereto.

[0069] like Figures 5 to 8 As shown, the grid pattern 132 and connection pattern 134 of the second electronic unit 130 may, for example, be formed by a single conductive layer (e.g., conductive layer CL5), the grid pattern 132 of the bridging unit 140 may, for example, be formed by multiple conductive layers (e.g., conductive layers CL4 and CL5), and the connection pattern 144 of the bridging unit 140 may, for example, be formed by a single or multiple conductive layers, but is not limited thereto. In some embodiments (e.g. Figure 6 As shown, some portions of the grid pattern 142 of the bridging unit 140 may have a single conductive layer (e.g., conductive layer CL4 or conductive layer CL5), while other portions of the grid pattern 142 of the bridging unit 140 may have multiple conductive layers (e.g., conductive layer CL4 and conductive layer CL5). These portions may complement each other in top view to achieve the visual effect of the grid pattern 132 in top view, but this is not a limitation. In some embodiments, all portions of the grid pattern 142 of the bridging unit 140 may have multiple conductive layers (e.g., conductive layer CL4 and conductive layer CL5), but this is not a limitation.

[0070] The connection pattern 144 of the bridging unit 140 can be connected, as needed, to the connection pattern 134 of the second electronic unit 130 of the first combined unit UN1 or the connection pattern 134 of the second electronic unit 130 of the second combined unit UN2. For example... Figures 5 to 8 As shown, the connection pattern 134 (e.g., conductive layer CL5) of the second electronic unit 130 of the first joint unit UN1 can be connected to the connection pattern 144 (e.g., conductive layer CL4) of the bridging unit 140 through the holes in the insulating layer IL5. The connection pattern 134 (e.g., conductive layer CL5) of the second electronic unit 130 of the second joint unit UN2 can be directly connected to the connection pattern 144 (e.g., conductive layer CL5) of the bridging unit 140. That is, the structure connecting the bridging unit 140 to the first joint unit UN1 is located in the conductive layer CL4, and the structure connecting the bridging unit 140 to the second joint unit UN2 is located in the conductive layer CL5, but this is not a limitation.

[0071] exist Figure 5 and Figure 9 In the dummy unit 150, the grid pattern 152 and the connection pattern 154 are electrically insulated from the second electronic unit 130 of the first combined unit UN1, the second electronic unit 130 of the second combined unit UN2, and the bridging unit 140. In some embodiments, the dummy unit 150 may not have the connection pattern 154 and therefore cannot connect the second electronic unit 130 and the bridging unit 140.

[0072] In this invention, the electronic device 100 may also optionally include other desired components and / or structures. Figures 6 to 9 In this embodiment, the electronic device 100 further includes at least one conductive layer (e.g., conductive layer CL1, conductive layer CL2, conductive layer CL3), at least one insulating layer (e.g., insulating layer IL1, insulating layer IL2, insulating layer IL3, insulating layer IL4, insulating layer IL5), and at least one semiconductor layer SM to form desired components and / or structures, such as transistor SW, scan lines, and data lines. The transistor SW is electrically connected to the first electronic unit 120 (light-emitting element LE). The scan lines and data lines connect the electronic components in the active region and the electronic components in the peripheral region. The scan lines are used to transmit switching signals to control the switching on and off of the transistor SW, and the data lines are used to transmit the grayscale signals required by the light-emitting element LE, but are not limited thereto. In some embodiments (e.g.... Figure 6 As shown, the transistor SW may include a semiconductor layer SM, an insulating layer IL2, a gate (e.g., included in a conductive layer CL1), a source (e.g., included in a conductive layer CL2), and a drain (e.g., included in a conductive layer CL2). Scan lines may be included in the conductive layer CL1, and data lines may be included in the conductive layer CL2, but are not limited thereto. It should be noted that examples of materials for the semiconductor layer SM may include polysilicon, amorphous silicon, metal-oxide-semiconductor (IGZO) semiconductors, other suitable semiconductor materials, or combinations thereof, but are not limited thereto.

[0073] The electronic device 100 may also optionally include a pixel definition layer (PDL) located between two light-emitting elements (LEs) or two sub-pixels (SPs) to separate the light-emitting elements (LEs) or sub-pixels (SPs). The pixel definition layer (PDL) may be a single-layer structure or a composite structure, and may include, but is not limited to, insulating materials (organic or inorganic insulating materials), reflective materials, other suitable materials, or combinations of the above materials.

[0074] The electronic device 100 may also optionally include an encapsulation layer EC to encapsulate and protect the first electronic unit 120 (light-emitting element LE), wherein the encapsulation layer EC may include an organic insulating material or other suitable encapsulation material. Figure 6 In this case, the second electronic unit 130 may be disposed on the encapsulation layer EC, but is not limited thereto.

[0075] exist Figures 6 to 9In this embodiment, the electronic device 100 may optionally include an elastic material layer (ELS) disposed on the first electronic unit 120 and the second electronic unit 130. Furthermore, the elastic material layer (ELS) may also be disposed in areas where the stretchable substrate 110 is not present (i.e., between the two island portions 112, between the two bridging portions 114, and between the two substrate units 110u) to improve the structural strength and yield of the electronic device 100. Examples of the elastic material layer (ELS) may include transparent elastic insulating materials, but are not limited thereto.

[0076] The electronic device of the present invention is not limited to the above embodiments. Other embodiments will continue to be disclosed below. However, in order to simplify the description and highlight the differences between the embodiments and the above embodiments, the same reference numerals are used to refer to the same elements below, and repeated parts will not be described again.

[0077] Please refer to Figure 10 , Figure 10 This is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention. Figure 10 As shown, the difference between this embodiment and the first embodiment lies in the placement of the second electronic unit 130 in the electronic device 200. Figure 10 In this configuration, the second electronic unit 130 is disposed between the first electronic unit 120 (light-emitting element LE) and the transistor SW, but is not limited thereto.

[0078] Please refer to Figure 11 , Figure 11 This is a cross-sectional schematic diagram of an electronic device according to a third embodiment of the present invention. Figure 11 As shown, the difference between this embodiment and the first embodiment lies in the placement of the second electronic unit 130 in the electronic device 300. Figure 11 In this embodiment, the second electronic unit 130 is disposed between the encapsulation layer EC and the pixel definition layer PDL, but is not limited thereto. Furthermore, in the connection pattern 134 on the bridging portion 114 of the stretchable substrate 110, the connection pattern 134 may be a multilayer structure including conductive layers CL5 and CL2. In the connection pattern 134, a portion located in the conductive layer CL5 can be electrically connected to a portion located in the conductive layer CL2 through holes in the insulating layer IL4, such that the conductive layer CL2 may include a portion of the connection pattern 134 of the second electronic unit 130 and the source and drain of the transistor SW. In some embodiments, the connection pattern 134 may extend horizontally through a portion located in the conductive layer CL2, but is not limited thereto. In some embodiments, if the connection pattern 144 of the bridging unit 140 has this design, the number of conductive layers used in the electronic device 300 can be reduced, thereby reducing the cost of the electronic device 300.

[0079] Please refer to Figure 12 , Figure 12This is a cross-sectional schematic diagram of an electronic device according to a fourth embodiment of the present invention. Figure 12 As shown, the difference between this embodiment and the first embodiment lies in the design of the connection pattern 134 of the second electronic unit 130 of the electronic device 400. Figure 12 In the connection pattern 134 on the bridging portion 114 of the stretchable substrate 110, the connection pattern 134 may be a multilayer structure including a conductive layer CL4 and a conductive layer CL5. Furthermore, in the connection pattern 134, the portion located in the conductive layer CL5 can be electrically connected to the portion located in the conductive layer CL4 through holes in the insulating layer. In some embodiments, the connection pattern 134 may extend horizontally through the portion located in the conductive layer CL4, but this is not a limitation.

[0080] Please refer to Figure 13 , Figure 13 This is a top view schematic diagram of an electronic device according to the fifth embodiment of the present invention. Figure 13 As shown, the difference between this embodiment and the first embodiment lies in the design of the stretchable substrate 110 of the electronic device 500 and the configuration of the first electronic unit 120 and the second electronic unit 130. Figure 13 In this configuration, the island portion 112 may be U-shaped, and one island portion 112 may directly connect to five bridging portions 114. Each substrate unit 110u may include two island portions 112 and nine bridging portions 114 directly connecting these island portions 112. One first bridging portion 114a connects the island portions 112, and one end of each of the eight second bridging portions 114b connects to the island portion 112 of another substrate unit 110u. In some embodiments (e.g.) Figure 13 As shown), the width of the first bridging portion 114a is greater than the width of the second bridging portion 114b, but is not limited thereto. In some embodiments (such as...) Figure 13 As shown), the stretchable substrate 110 may have an H-shaped hole 110h, and the top view pattern of the two ends of the H-shaped hole 110h may approximate a triangle, but is not limited thereto.

[0081] For example, such as Figure 13 As shown, an island portion 112 may have two pixels, and a pixel may, for example, include four sub-pixels SP, but is not limited thereto. Figure 13 In one of the island portions 112 shown, two pixels are located on either side of the first bridging portion 114a, but this is not a limitation.

[0082] like Figure 13As shown, in a second electronic unit 130, the grid pattern 132 may include at least one first grid pattern 132_1 and at least one second grid pattern 132_2, and the connection pattern 134 may include at least one first connection pattern 134_1 and at least one second connection pattern 134_2. The first grid pattern 132_1 and the first connection pattern 134_1 are electrically connected to each other to form a first subunit US1, and the second grid pattern 132_2 and the second connection pattern 134_2 are electrically connected to each other to form a second subunit US2. The first subunit US1 and the second subunit US2 are not directly connected to each other, such that the first subunit US1 and the second subunit US2 are electrically insulated from each other and / or non-conductive. Figure 13 In a second electronic unit 130, at least one second bridging portion 114b may be provided with a first connection pattern 134_1, and at least one second bridging portion 114b may be provided with a second connection pattern 134_2, while the first bridging portion 114a may be provided with both the first connection pattern 134_1 and the second connection pattern 134_2, but is not limited thereto. Figure 13 In a second electronic unit 130, the first connection pattern 134_1 on the first bridging portion 114a can be electrically connected to the first grid pattern 132_1 located on the two island portions 112 respectively, and the second connection pattern 134_2 on the first bridging portion 114a can be electrically connected to the second grid pattern 132_2 located on the two island portions 112 respectively, but is not limited thereto. Additionally, the second electronic unit 130 may also include a bridging member 530 disposed at the connection between the first bridging portion 114a and the island portion 112. The bridging member 530 electrically connects the first grid pattern 132_1 and the first connection pattern 134_1 located on the first bridging portion 114a via a first conductive path, and the bridging member 530 electrically connects the second grid pattern 132_2 and the second connection pattern 134_2 located on the first bridging portion 114a via a second conductive path. The first conductive path is different from the second conductive path (for example, the conductive structures in different conductive layers of the bridging member 530 can serve as the first and second conductive paths respectively), so that the first subunit US1 is not conductive to the second subunit US2. It should be noted that in Figure 13 In this diagram, to facilitate differentiation between the first subunit US1, the second subunit US2, and the bridging member 530, the first subunit US1 is drawn with the thinnest line, the second subunit US2 with a medium line, and the bridging member 530 with the thickest line. However, the line widths of these structures in this invention are not limited to these specifications. In practice, the line widths of the first subunit US1, the second subunit US2, and the bridging member 530 can be the same. Therefore, it can be understood that... Figure 13A second electronic unit 130 shown may include a first subunit US1, a second subunit US2 and two bridging members 530. The first subunit US1 may include all the first grid patterns 132_1 and all the first connection patterns 134_1 disposed on a substrate unit 110u. The second subunit US2 may include all the second grid patterns 132_2 and all the second connection patterns 134_2 disposed on a substrate unit 110u. An island portion 112 may include a portion of the first subunit US1, a portion of the second subunit US2 and a bridging member 530.

[0083] In this invention, the arrangement and connection of the first subunit US1 and the second subunit US2 can be designed according to requirements. For example, multiple first subunits US1 arranged in the Y direction are electrically connected to each other to form a subunit column, and multiple subunit columns can be arranged along the X direction. Multiple second subunits US2 arranged along the X direction are electrically connected to each other to form a subunit row, and multiple subunit rows can be arranged along the Y direction, but are not limited thereto.

[0084] In addition, Figure 13 In the grid pattern 132 of the second electronic unit 130 shown, some portions of the grid pattern 132 (e.g., a portion of the first grid pattern 132_1 and a portion of the second grid pattern 132_2) may have a first opening 132b that overlaps with at least one first electronic unit 120, and other portions of the grid pattern 132 (e.g., another portion of the first grid pattern 132_1 and another portion of the second grid pattern 132_2) may have a fourth opening 132d that does not overlap with the first electronic unit 120, but are not limited thereto.

[0085] Please refer to Figure 14 , Figure 14 This is a top view schematic diagram of the electronic device according to the sixth embodiment of the present invention. Figure 14 The illustrated electronic device 600 is exemplarily mounted on a vehicle window, but the electronic device 600 of the present invention can be mounted on any suitable object BS as needed. In the present invention, the configuration of the active area AR and the peripheral area PR can be designed as needed, wherein electronic components 610 corresponding to the function of the active area AR (e.g., first electronic unit 120 and second electronic unit 130) can be provided on the substrate unit 110u (or island portion 112) of the active area AR, while the peripheral area PR is located at least one outer side of the active area AR. For example, in Figure 14In this context, the peripheral region PR may surround the active region AR, but is not limited thereto. It should be noted that if the peripheral region PR includes substrate units 110u (or island portions 112) of the stretchable substrate 110, then these substrate units 110u (or island portions 112) are not provided with electronic components 610 (e.g., first electronic unit 120 and second electronic unit 130) that perform the functions of the active region AR.

[0086] In some embodiments, the peripheral region PR may include the peripheral circuit region PCR. For example, in Figure 13 In this configuration, the peripheral circuit region (PCR) is located below the active region (AR), but is not limited thereto. In some embodiments, a driving element for driving the electronic component 610 in the active region (AR) may be disposed in the peripheral circuit region (PCR). Alternatively, the peripheral circuit region (PCR) may be provided with a connection pad 640, and the circuit board 630 may be electrically connected to the connection pad 640 via a connector 620, such that the electronic component 610 on the circuit board 630 may be electrically connected to the driving element in the peripheral circuit region (PCR), but is not limited thereto.

[0087] In summary, by patterning the stretchable substrate and designing the electronic units mounted on it, the performance and yield of electronic devices during stretching and / or deformation can be improved, and the lifespan of the electronic devices can be extended.

[0088] While the embodiments and advantages of the present invention have been described above, it should be understood that anyone skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Anyone skilled in the art can understand from the disclosure of the present invention that current or future developed processes, machines, manufacturing, material composition, apparatus, methods, and steps can be used according to the present invention as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of various claims and embodiments. The scope of protection of the present invention shall be determined by the claims.

[0089] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Those skilled in the art will recognize that the present invention can have various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that, include: A stretchable substrate having a plurality of island portions and a plurality of bridging portions, each of the bridging portions connecting at least two of the plurality of island portions; Multiple first electronic units are disposed on the multiple island portions; as well as A plurality of second electronic units are disposed on the stretchable substrate, each second electronic unit including a grid pattern disposed on at least one of the plurality of island portions, the grid pattern including a first opening overlapping at least one of the plurality of first electronic units.

2. The electronic device as claimed in claim 1, characterized in that, Each of the second electronic units further includes a connection pattern disposed on at least one of the plurality of bridging portions, the connection pattern including a second opening.

3. The electronic device as claimed in claim 2, characterized in that, The first opening has a first area, and the second opening has a second area, wherein the first area is larger than the second area.

4. The electronic device as claimed in claim 3, characterized in that, The ratio of the first area to the second area is greater than 50 and less than or equal to 5000.

5. The electronic device as claimed in claim 3, characterized in that, The second opening can be circular, elliptical, rhomboid, or strip-shaped.

6. The electronic device as claimed in claim 1, characterized in that, The grid pattern further includes a third opening that overlaps with at least one of the plurality of first electronic units. The first opening has a first area, and the third opening has a third area. The ratio of the first area to the third area is greater than 1 and less than or equal to 5.

7. The electronic device as claimed in claim 1, characterized in that, Each of the second electronic units further includes a connection pattern disposed on at least one of the plurality of bridging portions, the connection pattern having a wavy shape.

8. The electronic device as claimed in claim 1, characterized in that, One of the plurality of second electronic units is disposed on at least two of the plurality of island portions.

9. The electronic device as claimed in claim 1, characterized in that, It also includes multiple bridging units disposed on the stretchable substrate, wherein each of the bridging units is electrically connected to two adjacent second electronic units.

10. The electronic device as claimed in claim 1, characterized in that, It also includes a plurality of dummy units disposed on the stretchable substrate, wherein the plurality of dummy units are disposed between two adjacent second electronic units and electrically insulated from the two adjacent second electronic units.

11. The electronic device as claimed in claim 1, characterized in that, The plurality of first electronic units are light-emitting diodes.

12. The electronic device as claimed in claim 1, characterized in that, The plurality of first electronic units are photodiodes.

13. The electronic device as claimed in claim 1, characterized in that, The plurality of second electronic units are touch electrodes.

14. The electronic device as claimed in claim 1, characterized in that, The plurality of second electronic units are used to detect a stylus.

15. The electronic device as claimed in claim 1, characterized in that, The plurality of second electronic units are used to receive or transmit electromagnetic waves.

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