A top-mounted photovoltaic inverter device with heat dissipation

Abstract

This application relates to the field of heat dissipation technology and discloses a top-mounted photovoltaic inverter device. The inverter device includes an inverter module and a top-mounted heat dissipation module. The inverter module includes an inverter circuit and a housing, with the inverter circuit installed in the housing. The inverter circuit includes a power circuit board and multiple power transistors. The top-mounted heat dissipation module includes a top-mounted heat dissipation component and a back-mounted heat dissipation component. The top-mounted heat dissipation component includes a condenser and a fan assembly, while the back-mounted heat dissipation component includes an evaporator and an air-cooled radiator. Specifically, the condenser and housing are stacked along a first direction, and the condenser and fan assembly are arranged adjacent to each other along a second direction. The housing, evaporator, and air-cooled radiator are arranged sequentially adjacent to each other along the second direction. The projections of the top-mounted heat dissipation component and the back-mounted heat dissipation component along a third direction do not overlap, and the first, second, and third directions are perpendicular to each other. The top-mounted heat dissipation module can dissipate heat from the inverter module, thereby improving the reliability of the inverter device.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of heat dissipation, in particular to a top-hung heat dissipation photovoltaic inverter device. BACKGROUND

[0002] With the increasing power of the inverter, the power and density of the power tube inside the inverter box body are gradually increased, and the heat generation of the inverter is also gradually increased. The over-high temperature can affect the service life and reliability of the power tube, and further affect the service life of the whole inverter. Therefore, with the increase of the power and density of the power tube in the inverter, the requirement for the heat dissipation capacity is also rapidly increased. The inverter usually adopts the following two heat dissipation modes: the first mode is to adopt a die-casting integrated heat sink combined with natural heat dissipation to dissipate heat of the inverter. The second mode is to adopt a chisel-tooth heat sink combined with forced air cooling to dissipate heat of the inverter. Since the heat generation of the inverter is gradually increased, the above heat dissipation modes cannot meet the heat dissipation requirement of the inverter at present.

[0003] How to effectively dissipate heat of the inverter to improve the heat dissipation performance of the inverter has become a technical problem to be solved at present. SUMMARY

[0004] The application provides a top-hung heat dissipation photovoltaic inverter device, which can rapidly dissipate heat of the inverter circuit in the inverter box body, so that the reliability of the inverter device is improved. In addition, the top-hung heat dissipation photovoltaic inverter device has a compact structure and a reasonable internal structure, and is convenient to maintain.

[0005] The top-hung heat dissipation photovoltaic inverter device provided by the application comprises an inverter module and a top-hung heat dissipation module. The inverter module comprises an inverter circuit and a box body, the inverter circuit comprises a power circuit board and a plurality of power tubes, and the box body is used for accommodating the power circuit board, and the power circuit board is used for fixing the plurality of power tubes. The top-hung heat dissipation module comprises a top-mounted heat dissipation assembly and a back-hung heat dissipation assembly, the top-mounted heat dissipation assembly comprises a condenser and a fan assembly, and the back-hung heat dissipation assembly comprises an evaporator and an air-cooled heat sink. Wherein: the condenser and the box body are arranged in a stack along a first direction, and the condenser and the fan assembly are arranged adjacent to each other along a second direction. The box body, the evaporator and the air-cooled heat sink are arranged adjacent to each other along the second direction, and a projection of the top-mounted heat dissipation assembly and a projection of the back-hung heat dissipation assembly do not overlap along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other. The evaporator and the air-cooled heat sink are arranged in an adjacent manner, which can reduce the occupied space of the back-hung heat dissipation assembly, so that the structure of the photovoltaic inverter device is relatively compact.

[0006] The inverter device is in operation, the inverter circuit in the inverter module generates heat, the temperature of the inverter module is higher, and the top-hanging heat dissipation module is used for dissipating heat for the inverter module. The top-hanging heat dissipation module and the inverter module are assembled in a pre-integrated mode, respectively, to improve the assembly efficiency. Among them, the evaporator and the condenser dissipate heat for the inverter circuit, and the air-cooled heat sink dissipates heat for the box. The projections of the condenser, the fan assembly, the evaporator and the air-cooled heat sink along the third direction do not overlap, and there is no mutual shielding between the heat dissipation assemblies, so that the heat dissipation effect is better, and the heat dissipation efficiency of the top-mounted heat dissipation assembly and the back-hung heat dissipation assembly is improved.

[0007] In an implementation manner, the top-hanging heat dissipation module comprises a top shell and a back shell. Among them: the top shell and the back shell are fixed to the box, the top shell and the box are arranged in layers along the first direction, the back shell and the box are arranged adjacent to each other along the second direction, the top shell and the back shell are arranged in layers along the first direction, and the top shell and the back shell are connected to form an L-shaped shell. The inverter circuit further comprises a plurality of inductor modules, and the plurality of inductor modules are arranged adjacent to each other in sequence along the third direction. The top shell is used for fixing the condenser and the fan assembly, and the back shell is used for fixing the evaporator, the air-cooled heat sink and the plurality of inductor modules. The top shell and the back shell are connected with the box in a detachable mounting mode, and when the equipment is maintained, the heat dissipation assemblies can be maintained in a targeted manner to improve the maintenance efficiency. For example, when the condenser and the fan assembly are maintained, only the top shell is detached; when the evaporator, the air-cooled heat sink and the inductor assembly are maintained, only the back shell is detached. The projection of the top shell along the third direction does not overlap with the projection of the back shell and the projection of the box, and there is no shielding between the shells, so that the heat dissipation effect is better and the maintenance is convenient. In addition, the inductor modules also generate heat when in operation, and are arranged outside the box, reducing the number of heat generating devices in the box, so that the density of the heat generating devices in the box is low, thereby reducing the temperature in the box, and also enabling the size of the box to be smaller.

[0008] In an implementation manner, the gap between the top shell and the box forms a first cavity, and the condenser and the fan assembly are arranged adjacent to each other in the first cavity along the second direction. The gap between the back shell and the box forms a second cavity, and the second cavity is used for accommodating the evaporator, the air-cooled heat sink and the plurality of inductor modules, and the evaporator and the air-cooled heat sink are arranged adjacent to each other in the second cavity along the second direction. The condenser and the evaporator are connected in communication through at least one pipeline, and the at least one pipeline is arranged in the second cavity along the third direction. The first cavity and the second cavity are connected to form an L-shaped cavity, which is a heat dissipation channel for the top-mounted heat dissipation assembly and the back-hung heat dissipation assembly. The condenser, the fan assembly, the evaporator, the air-cooled heat sink and the plurality of inductor modules are located in the L-shaped cavity, and air can flow in the L-shaped cavity, thereby improving the heat dissipation efficiency of the top-hanging heat dissipation module.

[0009] In an implementation, the box includes a box top plate and a box bottom plate, the box top plate and the box bottom plate are arranged oppositely along a first direction, and the box top plate and the top shell form a first cavity. The length of the first cavity along a second direction is greater than the length of the box top plate, so that the larger space of the first cavity can accommodate the condenser and the fan assembly.

[0010] In an implementation, the top-hanging heat dissipation module includes a plurality of supports, the plurality of supports are fixedly connected to the condenser, and the plurality of supports are arranged between the condenser and the box top plate along a third direction. The box supports the condenser through the plurality of supports, so that the condenser is installed more firmly, and the reliability of the condenser is improved. At the same time, the condenser is not in contact with the box, and the heat of the box cannot be transferred to the condenser. The condenser in a low-temperature state can improve its condensation efficiency.

[0011] In an implementation, the box includes a box cover plate and a box back plate, the box cover plate and the box back plate are arranged oppositely along a second direction. The position of the box cover plate is regarded as the front side of the inverter device, and the position of the box back plate is regarded as the rear side of the inverter device. The box cover plate can be opened, which is convenient for maintaining the inverter circuit inside the inverter module. The box back plate and the back shell form a second cavity, and the length of the second cavity along the first direction is less than or equal to the length of the box back plate, so that the second cavity is consistent with the box, and the appearance is more beautiful.

[0012] In an implementation, the box back plate includes two heat exchanger communication holes, the heat exchanger communication holes penetrate through the box back plate along the second direction, and the two heat exchanger communication holes are respectively used for communicating the inlet and the outlet of the air-cooled radiator. The air-cooled radiator is used for dissipating heat of the hot air in the box. The air-cooled radiator assists the evaporator and the condenser in dissipating heat of the inverter module, and the heat dissipation efficiency of the top-hanging heat dissipation module on the inverter module is improved.

[0013] In an implementation, the box back plate includes a heat dissipation window, the heat dissipation window penetrates through the box back plate along the second direction, the power circuit board is fixed to the side of the box back plate away from the back shell, the power tube is fixed to the side of the power circuit board facing the back shell and is in contact with the evaporator through the heat dissipation window, and the projection of the power circuit board, the projection of the evaporator and the projection of the heat dissipation window along the second direction overlap. The evaporator is in direct contact with the power tube to dissipate heat. The evaporator and the condenser are connected through a pipeline, the liquid refrigerant in the evaporator is vaporized by heat and then enters the condenser through the pipeline. The vaporized refrigerant is re-condensed into liquid state by the condenser, and then flows back to the evaporator through the pipeline.

[0014] In an implementation, the box back plate includes at least one inductor communication hole, the inductor communication hole penetrates through the box back plate along the second direction, and the inductor communication hole is used for communicating the power tube and the inductor module.

[0015] In an implementation, the top shell includes two top side plates and a slide rail, the two top side plates are arranged opposite to each other along the third direction, and the slide rail is fixed between the two top side plates and is used to slidingly mount the fan assembly along the third direction. At least one of the top side plates includes a fan mounting hole, and a projection of the fan mounting hole covers a projection of the fan assembly along the third direction. The fan assembly is slidingly mounted on the slide rail, and when the fan assembly is maintained, the top shell does not need to be disassembled. The fan assembly can be directly pulled out of the top shell, and the maintenance efficiency is improved.

[0016] In an implementation, the top shell includes a top back plate and a detachable top cover plate, the top cover plate and the top back plate are arranged opposite to each other along the second direction, and the condenser and the fan assembly are arranged in sequence between the top cover plate and the top back plate along the second direction. The top cover plate includes a plurality of air outlets, and each air outlet penetrates the top cover plate along the second direction. The top cover plate not only serves as a carrier of the air outlets, but also facilitates the maintenance of the condenser due to the detachable connection. When the condenser is maintained, only the top cover plate needs to be disassembled, and the top shell does not need to be completely disassembled, and the maintenance efficiency of the condenser is improved.

[0017] In an implementation, the top shell includes a partition plate, and the partition plate is fixed between the condenser and the fan assembly along the second direction. The fan assembly includes a plurality of fans, and the partition plate includes a plurality of openings, each opening penetrates the partition plate along the second direction, and wherein: the plurality of fans are arranged in sequence and adjacent to each other along the third direction, the plurality of openings are arranged in sequence and adjacent to each other along the third direction, and a projection of each fan covers a projection of one opening along the second direction. The partition plate separates the air inlet side and the air outlet side of the fan assembly. After the fan assembly is started, a negative pressure is formed in the region corresponding to the air inlet side of the fan assembly in the first cavity under the action of the partition plate, forcing external air (cooling air) to quickly enter the first cavity and the second cavity, accelerating the flow speed of the cooling air in the heat dissipation channel, and thus rapidly dissipating the heat in the heat dissipation channel.

[0018] In an implementation, the back shell includes a back bottom plate, and the evaporator and the air-cooled heat sink are arranged between the top shell and the back bottom plate along the first direction. The back bottom plate includes a plurality of bottom through holes, each bottom through hole penetrates the back bottom plate along the first direction, and the plurality of bottom through holes are arranged in sequence and spaced apart along the third direction. The bottom through hole is an air inlet, and the bottom through hole and the air outlet of the top cover plate form a heat dissipation channel. By using the property of hot air expansion and rising, under the action of the fan assembly, the top-hanging heat dissipation module takes in air from below and discharges air from above, and the cooling air carries the heat in the heat dissipation channel out of the air outlet above, thereby improving the heat dissipation efficiency.

[0019] In an implementation, the back shell comprises a back plate, the evaporators, the air-cooled radiators are sequentially arranged adjacent to each other between the cabinet and the back plate along the second direction, the back plate comprises two rows of back holes, each row of back holes comprises a plurality of back holes arranged at intervals, each back hole penetrates the back plate along the second direction, and projections of the two rows of back holes along the second direction at least partially do not overlap with a projection of the air-cooled radiators. The back holes can serve as air supplement openings, and cold air outside the device can enter the heat dissipation channel not only from the bottom holes but also from the back holes. The cooling air supplemented by the back holes can be mixed with the cooling air introduced by the bottom holes. Since the supplemented cooling air has a lower temperature, the mixing of the two streams of cooling air reduces the temperature of the cooling air in the heat dissipation channel, and the low temperature is conducive to the cooling of the top-mounted heat dissipation assembly and the back-hung heat dissipation assembly, effectively improving the heat dissipation capacity of the top-mounted heat dissipation assembly and the back-hung heat dissipation assembly, and further improving the heat dissipation efficiency of the inverter module.

[0020] In an implementation, the cabinet comprises two cabinet side plates arranged opposite to each other along the third direction, at least one of the cabinet side plates comprises a maintenance window penetrating the cabinet side plate along the third direction. The inverter module comprises at least one maintenance cavity fixed to one of the cabinet side plates and in communication with the maintenance window of the cabinet side plate, the maintenance cavity being used for accommodating output terminals or input terminals of the inverter module, the output terminals and the input terminals being used for electrical connection with external electrical equipment. The output terminals or the input terminals of the inverter module are electrically connected with the power tube through the maintenance window, and a projection of the maintenance cavity along the third direction overlaps with projections of the cabinet and the back shell. The maintenance cavity comprises a first maintenance cavity and a second maintenance cavity, and doors are respectively arranged on sides of the first maintenance cavity and the second maintenance cavity away from the cabinet. The connection of the external electrical equipment with the photovoltaic inverter device can be completed by only opening the doors and connecting the external electrical equipment with the output terminals and the input terminals. When the external electrical equipment is connected, the doors of the first maintenance cavity and the second maintenance cavity are kept open, so that the connection can be completed without opening the cabinet, reducing the influence on the sealing property of the cabinet and the internal inverter circuit. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A side view of a top-hung heat dissipation photovoltaic inverter device provided for an embodiment of the present application;

[0022] Figure 2 An assembly view of a cabinet and a top-hung heat dissipation module provided for an embodiment of the present application;

[0023] Figure 3 An assembly side view of a top-hung heat dissipation module and a cabinet provided for an embodiment of the present application;

[0024] Figure 4 An exploded view of a top-hung heat dissipation module and a cabinet provided for an embodiment of the present application;

[0025] Figure 5 A structural schematic diagram of a top shell and a back shell provided for an embodiment of the present application;

[0026] Figure 6 An exploded view of a top shell and a fan assembly provided for an embodiment of the present application;

[0027] Figure 7 A structural schematic diagram of a top-hung heat-dissipating photovoltaic inverter device provided for an embodiment of the present application.

[0028] Reference signs:

[0029] N-first direction; P-second direction; M-third direction; 1-box; 11-box top plate; 12-box back plate; 13-box bottom plate; 14-box cover plate; 21-condenser; 22-fan assembly; 31-evaporator; 32-air-cooled radiator; 121-radiating window; 2-top shell; 3-back shell; 122-first vent hole; 123-second vent hole; 341-air supply opening; 342-air return opening; 2131-pipe; 212-bracket; 100-first cavity; 200-second cavity; 201-first top side plate; 202-second top side plate; 203-third top side plate; 204-top cover plate; 205-top back plate; 2222-second air inlet; 2223-third air inlet; 24-sliding rail; 214-fan mounting hole; 222-back bottom plate; 2221-bottom through hole; 23-baffle; 231-opening; 232-flange; 10-inductor module; 124-inductor communication hole; 223-back back plate; 15-first side plate; 16-second side plate; 17-first maintenance cavity; 18-second maintenance cavity; 151-first maintenance window; 161-second maintenance window. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings. However, the example embodiments can be implemented in various forms, and should not be understood as being limited to the embodiments set forth herein. The same reference signs in the drawings represent the same or similar structures, and thus repeated description thereof will be omitted. The expressions of position and direction described in the embodiments of the present application are described with reference to the drawings, but can be changed as needed, and the changes made are included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative positional relationship, and do not represent the true proportions.

[0031] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application, as claimed.

[0032] In order to facilitate the understanding of the top-hanging heat dissipation photovoltaic inverter device provided by the present application, the application scene thereof is introduced first. The photovoltaic system is a power generation system that converts solar energy into electric energy by using the photovoltaic effect of semiconductor materials. The photovoltaic system usually includes a cell panel and a photovoltaic inverter device, and the cell panel and the photovoltaic inverter device are electrically connected. Among them, the cell panel can be used to convert solar energy into electric energy, and the photovoltaic inverter device is used to convert the current or voltage from the cell panel to power, so as to match the output power of the photovoltaic system with the power of the external power equipment.

[0033] With the gradual increase of the power and density of the power tube in the photovoltaic inverter device, the heat dissipation of the photovoltaic inverter device is also increasing. Excessive temperature will affect the service life and reliability of the power tube, thereby affecting the overall service life of the photovoltaic inverter device. At present, the traditional heat dissipation method cannot meet the heat dissipation requirements of the photovoltaic inverter device with large power, so that the internal temperature of the photovoltaic inverter device cannot be effectively reduced, which will affect its service life.

[0034] In view of the above problems, the embodiments of the present application improve the heat dissipation mode of the photovoltaic inverter device, so as to realize effective heat dissipation of the power tube, thereby reducing the risk of power tube failure and improving the use reliability of the photovoltaic inverter device. The top-hanging heat dissipation photovoltaic inverter device provided by the embodiments of the present application will be described in detail below.

[0035] Figure 1 A side view of the top-hanging heat dissipation photovoltaic inverter device provided by the embodiments of the present application, Figure 2 An assembly view of the box body and the top-hanging heat dissipation module provided by the embodiments of the present application. Combined with Figure 1 and Figure 2In an embodiment, the photovoltaic inverter device comprises an inverter module and a top-hanging heat dissipation module for dissipating heat for the inverter module. The inverter module comprises an inverter circuit and a box body 1, and the inverter circuit is installed inside the box body 1. The inverter circuit (not shown in the figure) comprises a power circuit board and a plurality of power tubes installed on the power circuit board. The inverter circuit generates heat during operation, and the top-hanging heat dissipation module is installed outside the box body 1 to dissipate heat for the inverter circuit in the box body 1, so that the inverter circuit can work normally. The top-hanging heat dissipation module comprises a top-mounted heat dissipation assembly and a back-hanging heat dissipation assembly. The top-mounted heat dissipation assembly comprises a condenser 21 and a fan assembly 22, and the back-hanging heat dissipation assembly comprises an evaporator 31 and an air-cooled heat sink 32. The condenser 21 and the box body 1 are arranged in a first direction N, the condenser 21 and the fan assembly 22 are arranged in a second direction P, and the box body 1, the evaporator 31 and the air-cooled heat sink 32 are arranged in the second direction P. The evaporator 31 and the condenser 21 are used for dissipating heat for the inverter circuit, and the air-cooled heat sink 32 is used for heat exchange and heat dissipation for hot air inside the box body 1. The fan assembly 22 is used to accelerate the air flow around the condenser 21, the evaporator 31 and the air-cooled heat sink 32 to improve the heat dissipation efficiency. The top-hanging heat dissipation module and the inverter module are assembled in a pre-integrated mode, and then the two modules are vertically assembled in a modular manner, which is convenient for assembly and improves work efficiency. The evaporator 31 and the air-cooled heat sink 32 are arranged in an adjacent manner to reduce the occupied space of the back-hanging heat dissipation assembly, so that the structure of the inverter device is relatively compact. When the top-mounted heat dissipation assembly and the back-hanging heat dissipation assembly are installed, the projection of the top-mounted heat dissipation assembly along a third direction M does not overlap with the projection of the back-hanging heat dissipation assembly, that is, the condenser 21, the fan assembly 22, the evaporator 31 and the air-cooled heat sink 32 do not block each other along the third direction M, so that the heat dissipation effect is good, and the heat dissipation efficiency of the top-mounted heat dissipation assembly and the back-hanging heat dissipation assembly is improved. The first direction N, the second direction P and the third direction M are perpendicular to each other.

[0036] Please continue to refer to Figure 1 and Figure 2In an embodiment, the box 1 is a square box, which comprises a box top plate 11, a box back plate 12, a box bottom plate 13 and a box cover plate 14. The box top plate 11 and the box bottom plate 13 are arranged oppositely along a first direction N, and the box cover plate 14 and the box back plate 12 are arranged oppositely along a second direction P. The box back plate 12 comprises a heat dissipation window 121, which penetrates the box back plate 12 along the second direction P. In the process of manufacturing the box back plate 12, a through hole is formed on the box back plate 12 as the heat dissipation window 121. In the process of installation, the power circuit board and the evaporator 31 are fixedly installed on both sides of the box back plate 12. The projection of the power circuit board along the second direction P covers the projection of the heat dissipation window 121, and the projection of the evaporator 31 also covers the projection of the heat dissipation window 121. That is, the power circuit board and the evaporator 31 block the heat dissipation window 121, so that the box 1 has good sealing performance. The power tube on the power circuit board is in contact with the evaporator 31 through the heat dissipation window 121, and the evaporator 31 dissipates heat for the power tube.

[0037] Figure 3 A side view of the assembly of the top-hanging heat dissipation module and the box provided by the embodiment of the present application, Figure 4 An exploded view of the top-hanging heat dissipation module and the box provided by the embodiment of the present application. Combined Figures 1 to 4 The box back plate 12 further comprises two heat exchanger communication holes, which penetrate the box back plate 12 along the second direction P. The two heat exchanger communication holes are respectively used for communicating the inlet and the outlet of the air-cooled radiator 32. The air-cooled radiator 32 has a heat exchange cavity, which is in communication with the box 1 through the two heat exchanger communication holes. The inlet and the outlet of the air-cooled radiator 32 are respectively an air inlet 341 and an air outlet 342. In the embodiment, the two heat exchanger communication holes are respectively a first ventilation hole 122 and a second ventilation hole 123. The air inlet 341 is in communication with the box 1 through the first ventilation hole 122, and the air outlet 342 is in communication with the box 1 through the second ventilation hole 123. The hot air in the box 1 enters the heat exchange cavity of the air-cooled radiator 32 through the air outlet 342 and the second ventilation hole 123. After heat exchange in the heat exchange cavity, the hot air returns to the box 1 through the air inlet 341 and the first ventilation hole 122. The air-cooled radiator 32 cools the hot air in the box 1, so that the temperature in the box 1 is kept low, and the reliability of the inverter circuit is improved. In order to accelerate the heat exchange speed between the box 1 and the air-cooled radiator 32, a fan can be arranged at the first ventilation hole 122 or the second ventilation hole 123, so that the flow speed of the air between the box 1 and the heat exchange cavity is accelerated.

[0038] In an embodiment, the distance between the first vent 122 and the second vent 123 is greater than or equal to a predetermined value. The back plate 12 of the cabinet is square, and the first vent 122 and the second vent 123 are arranged as far apart as possible, for example, at two opposite sides of the back plate 12 of the cabinet, so that the hot air in the cabinet 1 can circulate by convection, thereby making the air temperature in the cabinet 1 more uniform and improving the heat dissipation efficiency.

[0039] In an embodiment, the first vent 122 and the second vent 123 are arranged at the positions of the two ends of the diagonal line of the back plate 12 of the cabinet, and at this time, the distance between the first vent 122 and the second vent 123 is farther, so that the hot air in the cabinet 1 can circulate by convection better, thereby making the air temperature in the cabinet 1 more uniform and improving the heat dissipation efficiency.

[0040] Please refer to Figure 4 The condenser 21 and the evaporator 31 are connected by at least one pipe 2131, and the at least one pipe 2131 is arranged along the third direction M. The pipe 2131 can include a two-phase pipe, which includes a gas pipe and a liquid pipe. The liquid refrigerant in the evaporator 31 is vaporized by heat and enters the condenser 21 through the gas pipe, and then the vaporized refrigerant is re-condensed into a liquid state by the condenser 21 and flows back to the evaporator 31 through the liquid pipe. In an embodiment, the first direction N is the direction of gravity, and the condenser 21 is higher than the evaporator 31 along the first direction N, so that the refrigerant condensed into a liquid state by the condenser 21 flows back to the evaporator 31 under the action of gravity, which is beneficial to speed up the flow rate of the refrigerant and improve the heat dissipation efficiency. In another embodiment, the first direction N is the horizontal direction, and a pump body is arranged in the liquid pipe between the condenser 21 and the evaporator 31 to make the refrigerant flow back to the evaporator 31.

[0041] Please refer to Figure 1 and Figure 4 The top-hanging heat dissipation module further includes a plurality of supports 212, and the plurality of supports 212 are fixedly connected to the condenser 21. The plurality of supports 212 are arranged between the condenser 21 and the top plate 11 along the third direction M, and the cabinet 1 supports the condenser 21 through the plurality of supports 212, so that the condenser 21 is installed more firmly and the reliability of the condenser 21 is improved. The condenser 21 does not have direct contact with the cabinet 1, and the heat of the cabinet 1 cannot be transferred to the condenser 21, and the condenser 21 in a low-temperature state can improve the efficiency of condensing the refrigerant. In an embodiment, when the supports 212 are arranged, the adjacent two supports 212 are spaced apart by an equal distance, so that the condenser 21 is subjected to an average force. In another embodiment, the adjacent supports 212 are spaced apart by unequal distances, and the appropriate spacing can be selected as needed.

[0042] Please refer to Figure 1In an embodiment, the top-hanging heat dissipation module further comprises a top shell 2 and a back shell 3, which are respectively installed on the box 1. The top shell 2 and the box 1 are arranged in a stack along the first direction N, the box 1 and the back shell 3 are arranged adjacent along the second direction P, and the top shell 2 and the back shell 3 are arranged in a stack along the first direction N. The projection of the top shell 2 along the third direction M, the projection of the back shell 3 along the third direction M, and the projection of the box 1 along the third direction M do not overlap, thereby reducing the mutual shielding between the shells and affecting the heat dissipation effect. The top shell 2 is used to fix the condenser 21 and the fan assembly 22, and the back shell 3 is used to fix the evaporator 31 and the air-cooled radiator 32. In the specific installation of the top shell 2 and the back shell 3, the top shell 2 and the box 1 are detachably connected, the back shell 3 and the box 1 are detachably connected, and the top shell 2 and the back shell 3 are detachably connected. In this way, the top-mounted heat dissipation assembly and the back-hung heat dissipation assembly can be conveniently maintained, and the condenser 21, the fan assembly 22, the evaporator 31, or the air-cooled radiator 32 can be maintained according to the maintenance requirements.

[0043] The gap between the top shell 2 and the box 1 forms a first cavity 100, and the condenser 21 and the fan assembly 22 are arranged adjacent in the first cavity 100 along the second direction P. The gap between the back shell 3 and the box 1 forms a second cavity 200, and the evaporator 31 and the air-cooled radiator 32 are arranged adjacent in the second cavity 200 along the second direction P. The first cavity 100 and the second cavity 200 are connected to each other to form an L-shaped cavity, which is a heat dissipation channel for the top-mounted heat dissipation assembly and the back-hung heat dissipation assembly. Air can flow in the heat dissipation channel, thereby improving the heat dissipation efficiency of the top-hanging heat dissipation module.

[0044] In an embodiment, the side where the box cover plate 14 is located is the front side in the second direction P, and the side where the box back plate 12 is located is the back side. The box cover plate 14 can be opened to facilitate maintenance of the inverter circuit inside the inverter module. The top shell 2 is similar to a cover and covers the box top plate 11. The top shell 2 and the box top plate 11 form a first cavity 100. The length of the first cavity 100 in the second direction P is greater than the length of the box top plate 11, that is, the top shell 2 extends to the back side beyond the box top plate 11. The back shell 3 is also similar to a cover and covers the box back plate 12. The box back plate 12 and the back shell 3 form a second cavity 200. The length of the second cavity 200 in the first direction N is less than or equal to the length of the box back plate 12. That is, the length of the back shell 3 in the first direction N is not greater than the length of the box back plate 12. The top shell 2 and the back shell 3 form an L-shaped cover. The top shell 2 and the back shell 3 are two sides of the L-shaped cover. The L-shaped cover covers the top and back of the box 1 and accommodates the top-mounted heat dissipation assembly and the back-hung heat dissipation assembly in the L-shaped cover. During assembly, the top shell 2 and the back shell 3 can be connected first, then the top-mounted heat dissipation assembly is installed in the top shell 2, and the back-hung heat dissipation assembly is installed in the back shell 3, to complete the assembly of the top-hung heat dissipation module. The inverter circuit is installed in the box 1 to complete the assembly of the inverter module. Finally, the top-hung heat dissipation module and the inverter module are assembled. The top-hung heat dissipation module and the inverter module adopt an integrated modular structure. During production, the top-hung heat dissipation module and the inverter module are pre-assembled respectively, and then assembled as a whole. During maintenance, they can also be maintained separately. The top-hung heat dissipation photovoltaic inverter equipment provided by the present application adopts a pre-integrated modular assembly method, which makes the installation and maintenance work more convenient and improves the installation and maintenance efficiency.

[0045] Figure 5 A structural diagram of the top shell and the back shell provided for the embodiment of the present application, Figure 6 An exploded view of the top shell and the fan assembly provided for the embodiment of the present application. As Figure 5 and Figure 6As shown, in one embodiment, the top shell 2 includes two top side plates and a slide rail 24, the two top side plates are arranged oppositely along the third direction M. The slide rail 24 is fixed between the two top side plates. In a specific installation of the slide rail 24, the slide rail 24 can be connected to the top shell 2 by screwing or riveting. The slide rail 24 is used to slidingly install the fan assembly 22 along the third direction M. At least one of the top side plates includes a fan mounting hole 214, and the projection of the fan mounting hole 214 along the third direction M covers the projection of the fan assembly. The top shell 2 includes a first top side plate 201, a second top side plate 202, and a third top side plate 203. The first top side plate 201, the second top side plate 202, and the third top side plate 203 can be formed by bending a strip-shaped plate into three sections. The first top side plate 201 and the third top side plate 203 are arranged oppositely along the third direction M and are respectively located on both sides of the second top side plate 202, and the second top side plate 202 is opposite to the top plate 11 of the cabinet. The two top side plates refer to the first top side plate 201 and the third top side plate 203, the slide rail 24 is installed between the first top side plate 201 and the third top side plate 203, and the two ends of the slide rail 24 extend to the first top side plate 201 and the third top side plate 203 respectively. The slide rail 24 includes two parallel tracks, and the distance between the two tracks is consistent with the height of the fan assembly 22, so that the fan assembly 22 can be slidingly installed between the two tracks to achieve the detachable connection between the fan assembly 22 and the top shell 2. The fan mounting hole 214 is located on the first top side plate 201 or the third top side plate 203, and the projection of the fan mounting hole 214 along the third direction M covers the projection of the fan assembly 22 on the first top side plate 201 or the third top side plate 203, so that the fan assembly 22 can be inserted into or pulled out of the top shell 2 through the fan mounting hole 214 and can be detachably installed on the slide rail 24. When the fan assembly 22 needs to be maintained, the top shell 2 does not need to be removed for maintenance, which improves the maintenance efficiency.

[0046] Please continue to refer to Figure 6In an embodiment, the top shell 2 comprises a top back plate 205 and a detachable top cover plate 204, the top cover plate 204 and the top back plate 205 are arranged oppositely along the second direction P, and the condenser 21 and the fan assembly 22 are arranged in sequence between the top cover plate 204 and the top back plate 205 along the second direction P. The top cover plate 204 comprises a plurality of air outlets (not shown in the figure), each of which penetrates the top cover plate 204 along the second direction P, and the air outlet side of the fan assembly 22 faces the air outlet. When selecting the top cover plate 204, a grid plate can be selected as the top cover plate 204, and the holes of the grid can be used as the air outlets. In other embodiments, the air outlets can also be located on the first top side plate 201, the second top side plate 202, and the third top side plate 203. It should be noted that when the air outlets are arranged on the first top side plate 201, the second top side plate 202, or the third top side plate 203, the air outlets should be arranged in the area corresponding to the fan assembly 22 on the top shell 2, so that the air passing through the fan assembly 22 can flow out of the air outlet to the heat dissipation channel. When the condenser 21 needs to be maintained, the top shell 2 does not need to be completely disassembled, and the condenser 21 can be maintained by only opening the top cover plate 204, thereby improving the maintenance efficiency.

[0047] Please refer to Figure 1 and Figure 5 In an embodiment, the back shell 3 comprises a back bottom plate 222, the evaporator 31 and the air-cooled radiator 32 are arranged between the top shell 2 and the back bottom plate 222 along the first direction N, and the evaporator 31 and the air-cooled radiator are arranged along the second direction P. The back bottom plate 222 comprises a plurality of bottom through holes 2221, each of which penetrates the back bottom plate 222 along the first direction N. The plurality of bottom through holes 2221 are arranged in sequence along the third direction M. The bottom through holes 2221 are air inlets, and the bottom through holes 2221 and the air outlets of the top cover plate 204 form a heat dissipation channel. In this embodiment, the first direction N is the direction of gravity, and the top shell 2 is located above the back shell 3 along the first direction N. By using the property of hot air rising, under the action of the fan assembly 22, the top-hanging heat dissipation module takes in air from below and discharges air from above, and the cooling air carries the heat in the heat dissipation channel out of the air outlet above, thereby improving the heat dissipation efficiency.

[0048] In one embodiment, the first direction N is the direction of gravity, and the bottom through hole 2221 faces the ground. The back bottom plate 222 is spaced apart from the ground by a certain distance, so that the cooling air enters the back shell 3 from the bottom through hole 2221 and flows upward. The evaporator 31 and the air-cooled radiator 32 are located above the back bottom plate 222, and the bottom through hole 2221 also faces the evaporator 31 and the air-cooled radiator 32. The cooling air entering the heat dissipation channel from the bottom through hole 2221 first passes through the evaporator 31 and the air-cooled radiator 32, taking away the heat of the evaporator 31 and the air-cooled radiator 32, thereby effectively improving the heat dissipation capacity of the back-hung heat dissipation assembly, and further improving the heat dissipation efficiency of the inverter module. It should be noted that the "ground" refers to the mounting surface perpendicular to the direction of gravity, and the bottom through hole 2221 faces the mounting surface. The ground is not limited to the actual ground. The photovoltaic inverter device can also be placed on a horizontally arranged support or other load-bearing object. At this time, the upper surface of the load-bearing object corresponds to the "ground".

[0049] Please refer to Figure 1 and Figure 5In one embodiment, the top shell 2 comprises a partition plate 23, which is fixed between the condenser 21 and the fan assembly 22 along the second direction P. The fan assembly 22 comprises a plurality of fans, and the partition plate 23 comprises a plurality of openings 231, each of which penetrates the partition plate 23 along the second direction P. The plurality of fans are arranged in sequence along the third direction M, and the plurality of openings 231 are also arranged in sequence. The number of the fans is consistent with the number of the openings 231, and each fan is installed in one-to-one correspondence. The projection of each fan covers the projection of one opening 231 along the second direction P. When the partition plate 23 is installed, the edges of the partition plate 23 are connected to the top plate 11, the first top side plate 201, the second top side plate 202, and the third top side plate 203, respectively. The fan assembly 22 is in contact with the partition plate 23, and the air vents of the fans are in communication with the openings 231. Thus, the partition plate 23 separates the air inlet side and the air outlet side of the fans. When the fan assembly 22 is installed, one end of the air outlet side of the fan assembly 22 is in contact with the partition plate 23. After the fan assembly 22 is started, the first cavity 100 and the region corresponding to the air inlet side of the fan assembly 22 form a negative pressure under the action of the partition plate 23, forcing external air (cooling air) to quickly enter the heat dissipation channel, accelerating the flow speed of the cooling air, so that the heat in the heat dissipation channel is quickly dissipated from the air outlet. In the preparation of the partition plate 23, the diameter of the opening 231 is equal to the diameter of the air vent of the fan. Of course, in other embodiments, the diameter of the opening 231 can also be different from the diameter of the air vent of the fan 33, for example, the diameter of the opening 231 is greater than the diameter of the air vent of the fan 33, so that the fan is easy to install in position; or the diameter of the opening 231 is smaller than the diameter of the air vent of the fan, so as to reduce the leakage of cooling air. The diameter of the opening 231 is processed according to the needs, which is not limited in the present application. The fan assembly 22 described above is provided with a plurality of fans, which can improve the flow speed of the cooling air in the air duct and improve the heat dissipation efficiency of the top-hanging heat dissipation device.

[0050] In another possible embodiment, the positional relationship between the fan assembly 22 and the partition plate 23 is adjusted: the fan assembly 22 is located between the condenser 21 and the partition plate 23 along the second direction P, that is, one end of the air inlet side of the fan assembly 22 is in contact with the partition plate 23, which also achieves the above technical effects.

[0051] The fan assembly 22 described above further comprises a mounting frame, and the plurality of fans are installed on one mounting frame to integrate the fan assembly 22, which is convenient for maintaining the fan assembly 22.

[0052] In an optional embodiment, the slide rail 24 can also be fixedly installed on the partition plate 23. After the fan assembly 22 is installed on the slide rail 24, the projection of each fan covers the projection of one opening 231, so that the partition plate 23 can separate the regions corresponding to the air outlet side and the air inlet side of the fan assembly 22. In the specific installation of the slide rail 24, the slide rail 24 can be connected to the partition plate 23 by screwing or riveting.

[0053] Please continue to refer to Figure 5 To reduce the weight of the top-hung heat dissipation module, the thin plate can be selected as the partition plate 23. Since the edge of the thin plate is thin, the contact area between the partition plate 23 and the top plate 11 of the box body is narrow. Therefore, the edge of the partition plate 23 towards the top plate 11 of the box body is provided with a flange 232, so that the contact area between the partition plate 23 and the top plate 11 of the box body is larger, thereby making the contact between the partition plate 23 and the top plate 11 of the box body more compact and the sealing better, and thus improving the sealing of the first cavity 100 and the corresponding area of the fan assembly 22 on the air inlet side and the air outlet side of the fan assembly 22, so as to reduce the amount of cooling air flowing from the air inlet side of the fan assembly 22 to the air outlet side of the fan assembly 22 through the bottom of the partition plate 23. The bending direction of the flange 232 can be towards the air inlet side of the above-mentioned fan assembly 22 or towards the air outlet side, which is not specifically limited in the present application. When the flange 232 is specifically processed, the flange 232 can be provided with a notch for avoiding the pipeline 2131 connecting the condenser 21 and the evaporator 31.

[0054] Please combine Figure 1 and Figure 3 In an embodiment, the above-mentioned inverter circuit further comprises a plurality of inductor modules 10, and the plurality of inductor modules 10 are arranged in sequence along the third direction M. In addition to being used for fixing the evaporator 31 and the air-cooled heat sink 32, the back shell 3 is also used for fixing the plurality of inductor modules 10, and the air-cooled heat sink 32 and the inductor modules 10 are arranged in layers along the first direction N. The above-mentioned box body back plate 12 comprises at least one inductor communication hole 124, and the inductor communication hole 124 penetrates the box body back plate 12 along the second direction P. The inductor communication hole 124 is used for communicating the power tube and the inductor module 10. The inductor module 10 also generates heat when working, and is arranged outside the box body 1, thereby reducing the number of heat generating devices in the box body 1, making the density of the heat generating devices in the box body 1 lower, thereby reducing the temperature in the box body 1, and also making the size of the box body 1 smaller. The heat generating devices mentioned above refer to the power tube and the power circuit board. The plurality of inductor modules 10 are located in the second cavity 200, that is, in the heat dissipation channel, and the cooling air entering the heat dissipation channel can not only cool the evaporator 31 and the air-cooled heat sink 32, but also cool the inductor modules 10. The inductor modules 10 are arranged outside the inverter module box body 1, and share a heat dissipation channel with the evaporator 31 and the air-cooled heat sink 32, thereby saving the internal space of the box body 1 and effectively utilizing the space of the second cavity 200.

[0055] Combine Figure 1 and Figure 5In one embodiment, the back housing 3 includes a back panel 223, which is connected to the top back panel 205 to form a plane. An evaporator 31 and a heatsink 32 are arranged sequentially and adjacently between the housing 1 and the back panel 223 along the second direction P. The back panel 223 includes two rows of back through-holes, each row comprising multiple spaced-apart through-holes, each through-hole penetrating the back panel 223 along the second direction P. The back through-holes can serve as air intakes, allowing external cold air to enter the heat dissipation channel not only through the bottom through-hole 2221 but also through the back through-holes. The cooling air entering the heat dissipation channel from the bottom through-hole 2221 passes through the evaporator 31 and the heatsink 32, raising the temperature of the cooling air. The heated cooling air then flows through the back through-holes and mixes with the new cooling air introduced through them. Because the newly introduced cooling air is at a lower temperature, the mixing of the two cooling air streams lowers the temperature of the cooling air in the heat dissipation channel. The condenser 21, located in the top housing 2, is cooled by the uniformly heated cooling air flowing upwards, further cooling the condenser 21 and carrying away its heat. The two rows of back-mounted through-holes lower the temperature in the heat dissipation channel. This lower temperature is beneficial for the cooling of the top-mounted and back-mounted heat dissipation components, effectively improving their heat dissipation capacity and thus enhancing their heat dissipation efficiency for the inverter module.

[0056] Please combine Figure 1 and Figure 5 In one specific embodiment, the projections of the two rows of back through holes along the second direction P do not at least partially overlap with the projection of the air-cooled radiator 32, thereby reducing the area of ​​the back through holes obscured by the air-cooled radiator 32. Along the first direction N, one row of back through holes serves as the second air inlet 2222, located at the upper edge of the air-cooled radiator 32, and the other row serves as the third air inlet 2223, located at the lower edge of the air-cooled radiator 32. The air-cooled radiator 32 also includes fins, which are installed on the side of the heat exchange chamber facing away from the housing 1. Cooling air enters the second chamber 200 from the third air inlet 2223 located upstream of the heat dissipation channel. As it flows through the heat dissipation channel, it passes through the air-cooled radiator 32, carrying away heat from the fins and causing the temperature of the cooling air to rise. At this time, the cooling air entering from the second air inlet 2222 located downstream of the heat dissipation channel mixes again with the higher-temperature cooling air, causing the temperature of the cooling air in the second chamber 200 to drop, thereby cooling the air in the heat exchange chamber and improving the heat dissipation efficiency of the air-cooled radiator.

[0057] Because the heat dissipation channel is relatively long, the temperature gradually rises as the cooling air flows. The bottom through-hole 2221, the second air inlet 2222, and the third air inlet 2223 are located at different positions in the heat dissipation channel, which can introduce more cooling air into the heat dissipation channel at different positions, so as to keep the temperature in the heat dissipation channel at a low level, which is beneficial to improving the heat dissipation efficiency of the top-mounted heat dissipation module.

[0058] Figure 7 This is a schematic diagram of a top-mounted photovoltaic inverter device with heat dissipation provided in an embodiment of this application. Please refer to... Figure 4 and Figure 7 In one embodiment, the enclosure 1 further includes two enclosure side panels arranged opposite each other along a third direction M. At least one enclosure side panel includes a maintenance window that penetrates the enclosure side panel along the third direction M. The inverter module includes at least one maintenance cavity, which is fixed to one enclosure side panel and communicates with the maintenance window of one enclosure side panel. The maintenance cavity is used to accommodate the output terminal or input terminal of the inverter module, and the output port or input port of the inverter module is electrically connected to the power transistor through the maintenance window. In this embodiment, the two enclosure side panels are a first side panel 15 and a second side panel 16. There are two maintenance cavities, namely a first maintenance cavity 17 and a second maintenance cavity 18. The first maintenance cavity 17 is provided with an output terminal (not shown in the figure), and the second maintenance cavity 18 is provided with an input terminal (not shown in the figure). The output terminal and the input terminal are used for electrical connection with external electrical equipment. When installing the first maintenance cavity 17 and the second maintenance cavity 18, the first maintenance cavity 17 is installed on the first side panel 15, and the second maintenance cavity 18 is installed on the second side panel 16. The projections of the first maintenance cavity 17 and the second maintenance cavity 18 along the third direction M overlap with the projection of the housing 1, and also overlap with the projection of the back shell 3. A through-hole is provided on the first side plate 15 as a first maintenance window 151, and a through-hole is provided on the second side plate 16 as a second maintenance window 161. The first maintenance cavity 17 and the second maintenance cavity 18 are connected to the housing 1 through the first maintenance window 151 and the second maintenance window 161, respectively. The output terminals and input terminals are electrically connected to the power transistors through the first maintenance window 151 and the second maintenance window 161, respectively. Doors are provided on the side of the first maintenance cavity 17 and the second maintenance cavity 18 facing away from the housing 1. Simply opening the doors and connecting external electrical equipment to the output and input terminals completes the connection between the external electrical equipment and the photovoltaic inverter. When connecting external electrical equipment, the doors of the first maintenance cavity 17 and the second maintenance cavity 18 remain open, allowing connection without opening the housing 1, reducing the impact on the housing 1's sealing and the internal inverter circuitry.

[0059] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A top-hung, thermally ventilated photovoltaic inverter apparatus, characterized by, The inverter device comprises an inverter module and a top-hanging heat dissipation module, the inverter module comprises an inverter circuit and a box body, the inverter circuit comprises a power circuit board and a plurality of power tubes, the power circuit board is used for fixing the plurality of power tubes, the top-hanging heat dissipation module comprises a top-mounted heat dissipation assembly and a back-hung heat dissipation assembly, the top-mounted heat dissipation assembly comprises a condenser and a fan assembly, the back-hung heat dissipation assembly comprises an evaporator and an air-cooled radiator, and the box body is used for accommodating the power circuit board, wherein: The condenser and the box body are arranged in a first direction, the condenser and the fan assembly are arranged in a second direction, the box body, the evaporator and the air-cooled radiator are arranged in the second direction in sequence, and the projection of the top-mounted heat dissipation assembly and the projection of the back-hung heat dissipation assembly do not overlap in a third direction, and the first direction, the second direction and the third direction are perpendicular to each other. The top-hanging heat dissipation module comprises a top shell and a back shell, the top shell is detachably connected with the box body, the back shell is detachably connected with the box body, and the top shell is detachably connected with the back shell; the top shell and the box body are arranged in the first direction, the back shell and the box body are arranged in the second direction, and the top shell and the back shell are arranged in the first direction; the top shell is used for fixing the condenser and the fan assembly, and the back shell is used for fixing the evaporator and the air-cooled radiator.

2. The photovoltaic inverter device of claim 1, wherein, The inverter circuit further comprises a plurality of inductance modules, wherein: The back shell is used for fixing the plurality of inductance modules, and the plurality of inductance modules are arranged in sequence in a third direction; The projection of the top shell, the projection of the back shell and the projection of the box body do not overlap in the third direction.

3. The photovoltaic inverter device of claim 2, wherein, The gap between the top shell and the box body forms a first cavity, and the condenser and the fan assembly are arranged in the first cavity in the second direction; The gap between the back shell and the box body forms a second cavity, the second cavity is used for accommodating the evaporator, the air-cooled radiator and the plurality of inductance modules, and the evaporator and the air-cooled radiator are arranged in the second cavity in the second direction; The condenser and the evaporator are connected by at least one pipeline, and the at least one pipeline is arranged in the second cavity in the third direction.

4. The photovoltaic inverter device of claim 3, wherein, The box body comprises a box top plate and a box bottom plate, the box top plate and the box bottom plate are arranged in the first direction, the box top plate and the top shell form the first cavity, and the length of the first cavity in the second direction is greater than the length of the box top plate.

5. The photovoltaic inverter device of claim 4, wherein, The top-hanging heat dissipation module comprises a plurality of supports, the plurality of supports are fixedly connected to the condenser, the plurality of supports are arranged between the condenser and the box top plate in the third direction, and the box supports the condenser through the plurality of supports.

6. The photovoltaic inverter apparatus of claim 2, wherein, The box body comprises a box body cover plate and a box body back plate, the box body cover plate and the box body back plate are arranged oppositely along the second direction, and the box body back plate is surrounded by the back shell to form the second cavity, and the length of the second cavity along the first direction is less than or equal to the length of the box body back plate.

7. The photovoltaic inverter device of claim 6, wherein, The box body back plate comprises two heat exchanger communication holes penetrating through the box body back plate along the second direction, and the two heat exchanger communication holes are used for communicating the inlet and outlet of the air-cooled radiator respectively.

8. The photovoltaic inverter device of claim 6, wherein, The box body back plate comprises a heat dissipation window penetrating through the box body back plate along the second direction, the power circuit board is fixed to the side of the box body back plate away from the back shell, the power tube is fixed to the side of the power circuit board facing the back shell and is in contact with the evaporator through the heat dissipation window, and the projections of the power circuit board and the evaporator along the second direction cover the projection of the heat dissipation window.

9. The photovoltaic inverter apparatus of claim 6, wherein, The box body back plate comprises at least one inductor communication hole penetrating through the box body back plate along the second direction, and the inductor communication hole is used for communicating the power tube and the inductor module.

10. The photovoltaic inverter apparatus of claim 2, wherein, The top shell comprises two top side plates arranged oppositely along the third direction and a slide rail fixed between the two top side plates, the slide rail is used for slidingly mounting the fan assembly along the third direction, at least one of the top side plates comprises a fan mounting hole, and the projection of the fan mounting hole along the third direction covers the projection of the fan assembly.

11. The photovoltaic inverter apparatus of claim 2, wherein, The top shell comprises a top back plate and a detachable top cover plate, the top cover plate and the top back plate are arranged oppositely along the second direction, the condenser and the fan assembly are arranged between the top cover plate and the top back plate along the second direction in sequence, the top cover plate comprises a plurality of air outlets penetrating through the top cover plate along the second direction.

12. The photovoltaic inverter apparatus of claim 2, wherein, The top shell comprises a partition plate fixed between the condenser and the fan assembly along the second direction, the fan assembly comprises a plurality of fans, and the partition plate comprises a plurality of openings penetrating through the partition plate along the second direction, wherein: The plurality of fans are arranged adjacent to each other along the third direction, the plurality of openings are arranged adjacent to each other along the second direction, and the projection of each fan along the second direction covers the projection of one opening.

13. The photovoltaic inverter apparatus of claim 2, wherein, The back shell comprises a back back plate, the evaporator and the air-cooled radiator are arranged between the box body and the back back plate along the second direction in sequence, the back back plate comprises two rows of back through holes, each row of back through holes comprises a plurality of back through holes arranged at intervals, each back through hole penetrates through the back back plate along the second direction, and the projections of the two rows of back through holes along the second direction at least partially do not overlap with the projection of the air-cooled radiator.

14. The photovoltaic inverter apparatus of claim 2, wherein, The back shell comprises a back bottom plate, the evaporator and the air-cooled radiator are arranged between the top shell and the back bottom plate along the first direction, the back bottom plate comprises a plurality of bottom through holes, each of the bottom through holes penetrates the back bottom plate along the first direction, and the plurality of bottom through holes are sequentially and spacedly arranged along the third direction.

15. The photovoltaic inverter apparatus of claim 1, wherein, The cabinet comprises two cabinet side plates, the two cabinet side plates are oppositely arranged along the third direction, at least one of the cabinet side plates comprises a maintenance window penetrating the cabinet side plate along the third direction; The inverter module comprises at least one maintenance cavity, the maintenance cavity is fixed to one of the cabinet side plates and communicates with the maintenance window of the one cabinet side plate, the maintenance cavity is used for accommodating an output terminal or an input terminal of the inverter module, the output terminal or the input terminal of the inverter module is electrically connected with the power tube through the maintenance window, and a projection of the maintenance cavity along the third direction overlaps with projections of the cabinet and the back shell.

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