Circuit board welding equipment

Abstract

The present invention discloses a circuit board soldering device, comprising a carrier board, a placement board, and a soldering device. The top of the placement board is provided with a first positioning groove and a second positioning groove, respectively used to position and place a first integrated circuit and a second integrated circuit. The placement board is provided with two first limiting assemblies and a second limiting assemblies. The first limiting assemblies respectively engage with two groups of wire banks. The second limiting assemblies are located at the top of the placement board and adjacent to the second positioning grooves, and are used to limit the second integrated circuit and the wire banks connected thereto. A plurality of soldering devices are provided, all connected to the carrier board and respectively located above the first positioning groove and above the second positioning groove. The soldering device comprises a column and a tin discharging mechanism. The column is connected to the carrier board. The tin discharging mechanism is connected to the column and located on the side of the column for discharging a tin bar. The column is also connected to a hot melt assembly and a tin clamping mechanism. Two tin clamping mechanisms are provided and are located on both sides of the hot melt assembly for clamping the tin bar.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing equipment, and in particular to circuit board welding equipment. Background Art

[0002] Reference Figure 3 A circuit board is proposed, comprising a first integrated circuit in the form of a trapezoidal plate. Two sets of wire banks are spaced apart and connected to the bottom of the first integrated circuit. The two sets of wire banks are each connected to a second integrated circuit along their lengthwise outer sides. In the related art, the wire banks need to be soldered to each of the first and second integrated circuits separately. However, currently, soldering is performed sequentially using a soldering device, which prevents simultaneous processing, resulting in low processing efficiency and unfavorable production. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a circuit board welding device that can simultaneously weld a first integrated circuit, a second integrated circuit, and a wire array, thereby improving processing efficiency.

[0004] According to the circuit board welding device of the first embodiment of the present invention, the circuit board includes a first integrated circuit in the shape of a trapezoidal plate, two groups of wire banks are connected to the bottom of the first integrated circuit at intervals, and the outer sides of the two groups of wire banks along the length direction are connected to the second integrated circuit, and the circuit board welding device includes a carrier, a placement plate and a welding device. The placement plate is connected to the carrier, and the top of the placement plate is provided with a first positioning groove and a second positioning groove, the first positioning groove is trapezoidal in shape, and is used to position and place the first integrated circuit, and the second positioning groove is used to position and place the second integrated circuit, and the placement plate is provided with two first limiting components and a second limiting component, the two first limiting components respectively corresponding to the two groups of wire banks, the second limiting component is located at the top of the placement plate and adjacent to the second positioning groove, and the structure of the second limiting component is the same as the first limiting component, and is used to limit the second integrated circuit and the wire banks connected thereto. There are multiple welding devices, all connected to the carrier plate. The welding devices are respectively located above the first positioning groove and above the second positioning groove. The welding device includes a column and a tin-discharging mechanism. The column is connected to the carrier plate. The tin-discharging mechanism is connected to the column and located on the side of the column for discharging the tin bar. The column is also connected to a hot melt assembly and a tin clamping mechanism. The hot melt assembly includes a slider and a hot melt plate connected to the bottom of the slider. The slider is slidably connected to the column. There are two tin clamping mechanisms, which are respectively located on both sides of the hot melt assembly for clamping the tin bar.

[0005] The circuit board welding equipment according to the embodiment of the present invention has at least the following beneficial effects: for a circuit board structure having one first integrated circuit and two second integrated circuits, one first positioning groove and two second positioning grooves are respectively provided on the carrier board, and three welding devices are further provided, corresponding to the welding line bank and the first integrated circuit and the second integrated circuit, respectively. For the welding device, the tin-discharging mechanism drives the long tin bar to move directly to the tin clamping mechanism, and the tin clamping mechanism drives it to move toward the carrier board until it abuts against the connection between the circuit board and the line bank. The slider of the hot melt assembly moves toward the carrier board, driving the hot melt plate to contact the tin bar, so that the tin bar is hot-melted and then solidified, thereby automatically completing the welding of the line bank and the first integrated circuit and the two second integrated circuits at the same time.

[0006] According to some embodiments of the present invention, the tin discharging mechanism includes a discharging cylinder, which is a tubular object with openings at both ends, and a discharging nozzle is provided at one end, through which the tin bar is discharged. The mechanism also includes a bracket and a discharging roller around which the tin bar is wound, and the bracket is provided with a guide roller, which is located below the discharging roller, and the tin bar rotates along the guide roller to gradually extend out of the discharging roller.

[0007] According to some embodiments of the present invention, the discharge cylinder is located at the bottom end of the bracket, and one end of the discharge cylinder facing away from the discharge nozzle is connected to a material guide pipe, and the other end of the material guide pipe is connected to the bracket and adjacent to the material guide roller.

[0008] According to some embodiments of the present invention, the tin clamping mechanism includes a fixed block and a movable block, the fixed block is connected to the slider, the movable block is slidably connected to the fixed block, and a clamping claw is provided at the bottom of the movable block, and the clamping claw is arranged adjacent to the discharge barrel and close to the discharge nozzle.

[0009] According to some embodiments of the present invention, the clamp includes a front clamp close to the side of the column and a rear clamp away from the side of the column, and the front clamp and the rear clamp each include a connecting portion, a yielding portion and a clamping portion connected in sequence, the connecting portion is connected to the movable block, the yielding portion is inclined toward the direction of the column, the two ends of the yielding portion are respectively connected to the connecting portion and the clamping portion, and the clamping portion is vertically downward.

[0010] According to some embodiments of the present invention, a tin scraping mechanism is further included, which is connected to one side of the tin discharging mechanism, and includes a driving cylinder and a tin scraping rod connected to the driving cylinder. The driving cylinder drives the tin scraping rod to move toward the carrier plate to contact the connection between the circuit board and the wire array.

[0011] According to some embodiments of the present invention, the carrier plate is provided with a support plate, and a brush is provided on the side of the support plate facing the placement plate. The brush can abut the top surface of the placement plate, and the brush passes through the support plate and is connected to the drive shaft of the motor to drive the brush to rotate.

[0012] According to some embodiments of the present invention, the first limiting assembly is arranged adjacent to the first positioning groove, and includes a base and a pressure plate rotatably connected to the base, one end of the pressure plate is connected to a rotating shaft, and the pressure plate moves circumferentially around the axis of the rotating shaft to abut the top surface of the wire array.

[0013] According to some embodiments of the present invention, a plurality of limiting buckles are evenly arranged on the placement plate, and the plurality of limiting buckles are evenly arranged in two rows along the length direction of the wire array. The limiting buckles can press the wire array respectively to limit the wire array from falling off, wherein the limiting buckles located on the side close to the first positioning groove can abut against the pressure plate to cooperate with the pressure plate to fix the wire array.

[0014] According to some embodiments of the present invention, the limiting buckle is fixed to the top of the placement plate by a screw, and the limiting buckle has an arc-shaped side wall and can be rotated around the axis of the screw to press the wire row or the pressure plate.

[0015] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0017] Figure 1 A schematic front view of a circuit board welding device according to an embodiment of the present invention;

[0018] Figure 2 A schematic top view of a carrier plate and a placement plate of a circuit board welding device according to an embodiment of the present invention;

[0019] Figure 3 is a schematic diagram of a circuit board according to an embodiment of the present invention;

[0020] Figure 4 Schematic diagram of the left side of the clamping jaws of the device for wire row welding according to an embodiment of the present invention.

[0021] Reference numerals: carrier plate 100; column 101; placement plate 110; first positioning groove 111; second positioning groove 112; first limiting assembly 120; pressing plate 121; base 122; second limiting assembly 130; limiting buckle 140; brush 150; support plate 151; tin discharging mechanism 200; bracket 210; discharging roller 220; guide roller 230; discharging cylinder 250; discharging nozzle 251; Guide tube 252; drive cylinder 260; scraper rod 261; tin clamping mechanism 300; fixed block 310; movable block 320; clamping claw 330; front clip 331; rear clip 332; connecting portion 333; clearance portion 334; clamping portion 335; hot melt assembly 400; slider 410; hot melt plate 420; tin bar 500; first integrated circuit 600; wire array 610; second integrated circuit 620. DETAILED DESCRIPTION

[0022] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0023] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0024] In the description of the present invention, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0025] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0026] Reference Figure 1 、 Figure 2 and Figure 3The present invention proposes a circuit board welding device, the circuit board includes a first integrated circuit 600 in a trapezoidal plate shape, two groups of wire arrays 610 are connected to the bottom of the first integrated circuit 600 at intervals, and the two groups of wire arrays 610 are connected to the outer sides along the length direction of the second integrated circuit 620. The circuit board welding device includes a carrier board 100, a placement board 110 and a welding device. The placement plate 110 is connected to the carrier plate 100, and a first positioning groove 111 and a second positioning groove 112 are provided on the top of the placement plate 110. The first positioning groove 111 is trapezoidal and is used to position and place the first integrated circuit 600. The second positioning groove 112 is used to position and place the second integrated circuit 620. The placement plate 110 is provided with two first limiting components 120 and a second limiting component 130. The two first limiting components 120 correspond to and snap on two groups of wire arrays 610 respectively. The second limiting component 130 is located at the top of the placement plate 110 and is adjacent to the second positioning groove 112. The structure of the second limiting component 130 is the same as that of the first limiting component 120, and is used to limit the second integrated circuit 620 and the wire array 610 connected thereto. There are multiple soldering devices, all connected to the carrier 100. The soldering devices are located above the first positioning groove 111 and above the second positioning groove 112, respectively. The soldering device includes a column 101 and a tin-discharging mechanism 200. The column 101 is connected to the carrier 100. The tin-discharging mechanism 200 is connected to the column 101 and is located on the side of the column 101 for discharging the tin bar 500. The column 101 is also connected to a hot melt component 400 and a tin clamping mechanism 300. The hot melt component 400 includes a slider 410 and a hot melt plate 420 connected to the bottom of the slider 410. The slider 410 is slidably connected to the column 101. There are two tin clamping mechanisms 300, which are located on both sides of the hot melt component 400 for clamping the tin bar 500. It can be understood that for Figure 3 The circuit board structure shown has one first integrated circuit 600 and two second integrated circuits 620. A first positioning groove 111 and two second positioning grooves 112 are respectively provided on the carrier 100. Further, three welding devices are provided, corresponding to the welding line array 610 and the first integrated circuit 600 and the second integrated circuit 620, respectively. For the welding device, the tin-discharging mechanism 200 drives the long strip of tin 500 to move directly to the tin clamping mechanism 300, and the tin clamping mechanism 300 drives it to move toward the carrier 100 until it abuts against the connection between the circuit board and the line array 610. The slider 410 of the hot melt assembly 400 moves toward the carrier 100, driving the hot melt plate 420 to contact the tin bar 500, causing the tin bar 500 to melt and then solidify, thereby automatically completing the welding of the line array 610 and the first integrated circuit 600 and the two second integrated circuits 620 at the same time.

[0027] Reference Figure 1 and Figure 4The discharge barrel 250 is a tubular object with openings at both ends. One end is provided with a discharge nozzle 251, through which the tin bar 500 is discharged. The discharge barrel 250 also includes a bracket 210 and a discharge roller 220 around which the tin bar 500 is wound. The bracket 210 is provided with a guide roller 230, which is located below the discharge roller 220. The tin bar 500 rotates along the guide roller 230 and gradually extends out of the discharge roller 220. The discharge barrel 250 is located at the bottom end of the bracket 210. The end of the discharge barrel 250 facing away from the discharge nozzle 251 is connected to a guide pipe 252. The other end of the guide pipe 252 is connected to the bracket 210 and is adjacent to the guide roller 230. There are two tin clamping mechanisms 300, which are located on both sides of the hot melt assembly 400 respectively. The tin clamping mechanism 300 includes a fixed block 310 and a movable block 320. The fixed block 310 is connected to the slider 410, and the movable block 320 is slidably connected to the fixed block 310. A clamping claw 330 is provided at the bottom of the movable block 320. The clamping claw 330 is arranged adjacent to the discharge barrel 250 and close to the discharge nozzle 251. The clamping jaw 330 includes a front clamping piece 331 on the side close to the column 101 and a rear clamping piece 332 on the side away from the column 101. The front clamping piece 331 and the rear clamping piece 332 both include a connecting portion 333, a yielding portion 334 and a clamping portion 335 connected in sequence. The connecting portion 333 is connected to the movable block 320, and the yielding portion 334 is inclined toward the column 101. The two ends of the yielding portion 334 are respectively connected to the connecting portion 333 and the clamping portion 335, and the clamping portion 335 is set vertically downward. The tinning mechanism drives the long strip of tin 500 through the discharge barrel 250 and moves through the discharge nozzle 251. The discharge nozzle 251 is adjacent to the clamping jaws 330. The tin bar 500 moves directly between the clamping jaws 330 and is clamped by the clamping jaws 330. Then, driven by the movable block 320 of the clamping mechanism, it moves toward the carrier 100 until it abuts the connection between the circuit board and the wire bank 610. The slider 410 of the hot melt assembly 400 moves toward the carrier 100, driving the hot melt plate 420 to contact the tin bar 500, causing the tin bar 500 to melt and solidify, thereby completing the welding of the wire bank 610 and the circuit board. The two sets of clamping jaws 330 of the two tin clamping mechanisms 300 jointly clamp the two ends of the tin bar 500, preventing the tin bar 500 from sagging or deforming due to gravity, resulting in inaccurate positioning, thereby ensuring the welding effect and meeting production requirements.

[0028] Reference Figure 1 The tin scraping mechanism 200 is further provided. The tin scraping mechanism 200 is connected to one side of the tin discharging mechanism 200 and includes a driving cylinder 260 and a tin scraping rod 261 connected to the driving cylinder 260. The driving cylinder 260 drives the tin scraping rod 261 to move toward the carrier 100 to contact the connection between the circuit board and the wire array 610. This cleans the connection between the soldered circuit board and the wire array 610 to ensure product quality.

[0029] Reference Figure 1The carrier plate 100 is provided with a support plate 151. A brush 150 is provided on the side of the support plate 151 facing the placement plate 110. The brush 150 can abut the top surface of the placement plate 110. The brush 150 passes through the support plate 151 and is connected to the drive shaft of the motor to drive the brush 150 to rotate. Furthermore, the carrier plate 100 and the placement plate 110 are movably connected. The placement plate 110 moves to drive the soldering position of the circuit board to move and be abutted by the brush 150. The motor drives the brush 150 to rotate. The end of the brush 150 abuts the soldering position on the circuit board, removing excess solder by friction, thereby cleaning the circuit board after soldering.

[0030] Reference Figure 2 The first limiting assembly 120 is arranged adjacent to the first positioning groove 111, and includes a base 122 and a pressure plate 121 rotatably connected to the base 122. One end of the pressure plate 121 is connected to a rotating shaft, and the pressure plate 121 makes circumferential motion around the axis of the rotating shaft to abut against the top surface of the wire row 610. A plurality of limiting buckles 140 are evenly arranged on the placement plate 110, and the plurality of limiting buckles 140 are evenly arranged in two rows along the length direction of the wire row 610. The limiting buckles 140 can press the wire row 610 respectively to prevent the wire row 610 from falling off, wherein the limiting buckle 140 located on the side close to the first positioning groove 111 can abut against the pressure plate 121 to cooperate with the pressure plate 121 to fix the wire row 610. Refer to Figure 2 The limiting buckle 140 is fixed to the top of the placement plate 110 by a screw. The limiting buckle 140 has an arc-shaped side wall and can rotate around the axis of the screw to press the wire array 610 or the pressure plate 121. The worker places the first integrated circuit 600 corresponding to the first positioning groove 111, and then places the wire array 610 in the longitudinal direction along the arrangement direction of the limiting buckle 140. The limiting buckle 140 abuts the wire array 610 to play a fixing role. The pressure plate 121 of the first limiting assembly 120 rotates along the rotation axis toward the wire array 610, and the limiting buckle 140 near the first positioning groove 111 abuts the end of the pressure plate 121 away from the rotation axis, thereby applying pressure to the pressure plate 121. The pressure plate 121 applies pressure to the wire array 610 to play a limiting role, which is conducive to the welding of the first integrated circuit 600 and the second integrated circuit 620. Ensure the welding effect and production quality. The worker turns the limit buckle 140 by loosening the screw to open and close the limit control of the line row 610, which is easy to use.

[0031] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the scope of the present invention.

Claims

1. A circuit board soldering device, wherein the circuit board comprises a first integrated circuit in a trapezoidal shape, wherein two groups of wire banks are connected to the bottom of the first integrated circuit at intervals, and the outer sides of the two groups of wire banks along the length direction are connected to a second integrated circuit, characterized in that: include: carrier board; A placement plate connected to the carrier plate, wherein a first positioning groove and a second positioning groove are provided on the top of the placement plate, wherein the first positioning groove is trapezoidal and is used to position and place the first integrated circuit, and the second positioning groove is used to position and place the second integrated circuit, and the placement plate is provided with two first limiting components and a second limiting component, wherein the two first limiting components respectively buckle with two groups of the wire banks, and the second limiting component is located at the top of the placement plate and adjacent to the second positioning groove, and the structure of the second limiting component is the same as that of the first limiting component, and is used to limit the second integrated circuit and the wire bank connected thereto; A plurality of soldering devices are provided, all of which are connected to the carrier plate, the soldering devices are respectively located above the first positioning groove and above the second positioning groove, the soldering device includes a column and a tin-discharging mechanism, the column is connected to the carrier plate, the tin-discharging mechanism is connected to the column and is located on the side of the column for leading out the tin bar, the column is also connected to a hot melt assembly and a tin clamping mechanism, the hot melt assembly includes a slider and a hot melt plate connected to the bottom of the slider, the slider is slidably connected to the column, and two tin clamping mechanisms are provided, and are respectively located on both sides of the hot melt assembly for clamping the tin bar; The first limiting assembly is arranged adjacent to the first positioning groove, and includes a base and a pressure plate rotatably connected to the base. One end of the pressure plate is connected to a rotating shaft, and the pressure plate moves circumferentially around the axis of the rotating shaft to abut the top surface of the wire row. A plurality of limiting buckles are evenly arranged on the placement plate, and the plurality of limiting buckles are evenly arranged in two rows along the length direction of the wire row. The limiting buckles can press the wire row respectively to limit the wire row from falling off, wherein the limiting buckle located on the side close to the first positioning groove can abut the pressure plate to cooperate with the pressure plate to fix the wire row.

2. The circuit board welding equipment according to claim 1, characterized in that: The tin discharging mechanism includes a discharging cylinder, which is a tubular object with openings at both ends. A discharging nozzle is provided at one end, and the tin bar is discharged through the discharging nozzle. The mechanism also includes a bracket and a discharging roller around which the tin bar is wound. The bracket is provided with a guide roller, and the guide roller is located below the discharging roller. The tin bar rotates along the guide roller to gradually extend out of the discharging roller.

3. The circuit board welding equipment according to claim 2, characterized in that: The discharging cylinder is located at the bottom end of the bracket, and one end of the discharging cylinder away from the discharging nozzle is connected to a material guide pipe, and the other end of the material guide pipe is connected to the bracket and adjacent to the material guide roller.

4. The circuit board welding equipment according to claim 2, characterized in that: The tin clamping mechanism includes a fixed block and a movable block, the fixed block is connected to the slider, the movable block is slidably connected to the fixed block, and a clamping claw is provided at the bottom of the movable block, the clamping claw is arranged adjacent to the discharge barrel and close to the discharge nozzle.

5. The circuit board welding equipment according to claim 4, characterized in that: The clamping claw includes a front clamping piece close to the side of the column and a rear clamping piece away from the side of the column. The front clamping piece and the rear clamping piece each include a connecting portion, a yielding portion and a clamping portion connected in sequence. The connecting portion is connected to the movable block, and the yielding portion is inclined toward the direction of the column. The two ends of the yielding portion are respectively connected to the connecting portion and the clamping portion, and the clamping portion is vertically downward.

6. The circuit board welding equipment according to claim 1, characterized in that: It also includes a tin scraping mechanism connected to one side of the tin discharging mechanism, including a driving cylinder and a tin scraping rod connected to the driving cylinder, and the driving cylinder drives the tin scraping rod to move toward the carrier plate to contact the connection between the circuit board and the line row.

7. The circuit board welding equipment according to claim 1, characterized in that: The carrier plate is provided with a support plate, and a brush is provided on the side of the support plate facing the placement plate. The brush can abut the top surface of the placement plate. The brush passes through the support plate and is connected to the driving shaft of the motor to drive the brush to rotate.

8. The circuit board welding equipment according to claim 1, characterized in that: The limiting buckle is fixed to the top of the placement plate by a screw. The limiting buckle has an arc-shaped side wall and can be rotated around the axis of the screw to press the line row or the pressure plate.

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