An optical parts processing process and angle control method

Abstract

The present application discloses an optical parts processing process and angle control method. It belongs to the field of optical parts processing technology. The method can facilitate the simultaneous processing of multiple chips and effectively control the angle progress. The process includes the following steps: 1: preliminary gluing; 2: squeezing out excess glue; 3: pre-curing; 4: major curing; 5: milling treatment; 6: grinding treatment; 7: polishing treatment; 8: degumming treatment; 9: cleaning and drying; 10: packaging and shipping. The optical parts processing process and angle control method in the present invention both require the use of a specific fixture, which includes a base plate and a plurality of bite plates arranged parallel to the base plate, and the plurality of bite plates are arranged in a stacked stepped manner; both side ends of the bite plates are provided with upwardly protruding rims; both side ends of the base plate are provided with convex strips, which are flush with the rims and used in conjunction with each other, and the base plate and the plurality of bite plates are integrally formed.

Description

Technical Field

[0001] The present invention relates to the technical field of optical component processing, and in particular to an optical component processing flow and angle control method. Background Art

[0002] The processing of optical chips requires very high precision; traditional processing methods require individual chips to be angle-processed, which is cumbersome and difficult to achieve in batch production.

[0003] The usual processing flow is: a single wafer is placed on a fixture, and then glued and cured separately, and then the angle is processed by milling. The traditional method of processing the angle is: single-side grinding, single-side polishing, degumming, turning over and gluing to the fixture, milling processing angle, single-side grinding, single-side polishing, degumming, cleaning, selection, packaging and shipment.

[0004] Traditional processing methods are not only inefficient, but the yield rate is also related to the operator's skills and cannot be effectively guaranteed.

[0005] Therefore, it is urgent to develop an optical parts processing process and angle control method to solve the problems in the existing technology. Summary of the Invention

[0006] The purpose of the present invention is to provide an optical component processing process and angle control method, which can facilitate the simultaneous processing of multiple wafers and effectively control the angle progress to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] An optical parts processing process, the process comprising the following steps:

[0009] 1. Preliminary gluing: Apply UV glue on the surface of several wafers in turn and place them together for preliminary gluing to obtain a crystal block;

[0010] Second: Extrusion of excess glue: Place the preliminarily bonded blocks in a press, and use the press to squeeze out excess glue and control the glue thickness;

[0011] 3. Pre-curing: Take out the crystal block and place it on an angle-controlled fixture, precisely control the angle, and pre-curing is achieved by irradiating the crystal block surface with ultraviolet light;

[0012] Fourth: Main curing: remove the crystal block from the fixture and place it in the curing box for main curing;

[0013] Five: Milling and grinding: Place the solidified crystal blocks on the milling machine in order for processing, cut out the corresponding size, and turn over after the front processing is completed;

[0014] 6. Grinding process: The milled crystal block is double-sided ground by a double-sided grinding machine;

[0015] Seven: Polishing: The ground crystal block is polished on both sides by a double-sided polishing machine;

[0016] 8. Degumming: Place the polished crystal block in a degumming box for degumming. Degumming is done by first passing through hot water and then through cold water, and this process is repeated until the crystal block is completely separated into several wafers.

[0017] 9. Cleaning and drying: Separate the debonded wafers and insert them into the cleaning tool for automatic cleaning. After cleaning, centrifuge and dry them.

[0018] 10. Packaging and shipment: Carry out various index inspections according to product specifications to select good and bad products; good products are packaged and shipped according to packaging and shipment standards, and bad products are placed in the defective product warehouse and processed according to the defective product processing requirements.

[0019] As a further solution of the present invention: the press pressure of the press in step 2 is 80-120 kg; and the thickness of the glue is controlled to be 1-2 um.

[0020] As a further solution of the present invention: the clamp in step three includes a base plate, and several bite plates arranged parallel to the base plate, and the several bite plates are arranged in overlapping steps; both side ends of the bite plates are provided with upwardly protruding rims; both side ends of the base plate are provided with convex strips, the convex strips are flush with the rims and used in conjunction with them, and the base plate and the several bite plates are formed as one piece.

[0021] As a further solution of the present invention, discharge grooves are provided at adjacent wheel rims to facilitate the outflow of glue.

[0022] As a further solution of the present invention: the clamp can adjust the processing angle range by changing the layout and size of the bite plate, and can achieve precise control of the processing angle of 10-60°.

[0023] As a further solution of the present invention: in step three, 350nm ultraviolet light is used to irradiate the surface of the crystal block for 2 minutes to achieve pre-curing.

[0024] As a further solution of the present invention: in step eight, the debonding treatment requires the crystal block to be subjected to hot water above 90° C. and cold water below 20° C. in succession, and the process is repeated until the crystal block is completely separated into a plurality of wafers.

[0025] An angle control method for processing optical parts includes adopting the above-mentioned fixture; and also includes designing a new base or controlling and adjusting the angle between the plane where the base is located and the horizontal line to achieve controlled angle adjustment.

[0026] As a further solution of the present invention: since the angles formed between the base and the plurality of bite plates at each stage remain the same, the angular accuracy error between the wafers can be made within the range of ±2′.

[0027] Compared with the prior art, the present invention has the advantages of being able to facilitate simultaneous processing of multiple wafers and effectively control the angle progress.

[0028] Other features and advantages of the present invention will be disclosed in detail in the following specific embodiments and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 1 is a schematic diagram of the overall structure of the clamp in an embodiment of the present invention;

[0030] The reference numerals in the figures are: bottom plate 1, bite plate 2, rim 3, ridge 5, discharge chute 4. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] In an embodiment of the present invention, an optical component processing process includes the following steps:

[0033] 1. Preliminary gluing: Apply UV glue on the surface of several wafers in turn and place them together for preliminary gluing to obtain a crystal block;

[0034] Second: Extrusion of excess glue: Place the preliminarily bonded blocks in a press, and use the press to squeeze out excess glue and control the glue thickness;

[0035] 3. Pre-curing: Take out the crystal block and place it on an angle-controlled fixture, precisely control the angle, and pre-curing is achieved by irradiating the crystal block surface with ultraviolet light;

[0036] Fourth: Main curing: remove the crystal block from the fixture and place it in the curing box for main curing;

[0037] Five: Milling and grinding: Place the solidified crystal blocks on the milling machine in order for processing, cut out the corresponding size, and turn over after the front processing is completed;

[0038] 6. Grinding process: The milled crystal block is double-sided ground by a double-sided grinding machine;

[0039] Seven: Polishing: The ground crystal block is polished on both sides by a double-sided polishing machine;

[0040] 8. Degumming: Place the polished crystal block in a degumming box for degumming. Degumming is done by first passing through hot water and then through cold water, and this process is repeated until the crystal block is completely separated into several wafers.

[0041] 9. Cleaning and drying: Separate the debonded wafers and insert them into the cleaning tool for automatic cleaning. After cleaning, centrifuge and dry them.

[0042] 10. Packaging and shipment: Carry out various index inspections according to product specifications to select good and bad products; good products are packaged and shipped according to packaging and shipment standards, and bad products are placed in the defective product warehouse and processed according to the defective product processing requirements.

[0043] In this embodiment, 5-10 wafers are sequentially coated with UV glue and placed together for preliminary bonding to form a crystal block. Compared with traditional processing, the efficiency can be increased by about 10 times, and the yield rate is also greatly improved.

[0044] In this embodiment, the grinding process uses a 9B, 13B, or 16B double-sided grinding machine to perform double-sided grinding; and the polishing process uses a 9B, 13B, or 16B double-sided polishing machine to perform double-sided polishing.

[0045] In this embodiment, the press pressure of the press in step 2 is 100 kg; the thickness of the glue is controlled to be 1.5 um.

[0046] In this embodiment, see Figure 1 As shown, the fixture in step three includes a base plate 1, and several bite plates 2 arranged parallel to the base plate 1, and the several bite plates 2 are arranged in overlapping steps; both side ends of the bite plates 2 are provided with upwardly protruding rims 3; both side ends of the base plate 1 are provided with convex strips 5, and the convex strips 5 are flush with the rims 3 and used in conjunction with them, and the base plate 1 and the several bite plates 2 are formed as one piece.

[0047] In this embodiment, a discharge groove 4 is provided adjacent to the wheel rim 3 to facilitate the outflow of glue.

[0048] In this embodiment, the fixture utilizes several overlapping, stepped engagement plates 2, parallel to the base plate 1. This facilitates the sliding of multiple wafers from bottom to top onto the engagement plates 2, effectively ensuring consistent processing angles for each wafer. The provision of a rim 3 ensures consistent positioning of the wafer ends and facilitates securement for subsequent processing. A discharge chute 4 facilitates the removal of excess glue from the wafers after gluing.

[0049] In this embodiment, the width of the rim 3 and ridge 5 is 3 cm. The height of the rim 3 above the top plane of the corresponding bite plate 2 is 0.5 cm. The height of the ridge 5 above the top plane of the base plate 1 is 0.5 cm. The height difference between adjacent bite plates 2 is 2.5 cm. The radius of the discharge channel 4 is 0.5 cm.

[0050] In this embodiment, the fixture can adjust the processing angle range by changing the layout and size of the bite plate, and can achieve precise control of the processing angle of 10-60°.

[0051] In this embodiment, in step three, 350 nm ultraviolet light is used to illuminate the surface of the wafer for 2 minutes to achieve pre-curing.

[0052] In this embodiment, the debonding treatment in step eight requires the crystal block to be subjected to hot water above 90° C. and cold water below 20° C. in succession, and the process is repeated until the crystal block is completely separated into a plurality of wafers.

[0053] In this embodiment, a method for controlling the angle of optical parts processing includes using the above-mentioned fixture; and also includes designing a new base or controlling and adjusting the angle between the plane where the base is located and the horizontal line to achieve angle adjustment.

[0054] In this embodiment, since the angles formed between the base and the plurality of bite plates are kept the same, the angle accuracy error between the wafers can be made within the range of ±2′.

[0055] The present invention provides an optical component processing flow and angle control method, which can facilitate simultaneous processing of multiple wafers, effectively control angle progress, and have high reliability.

[0056] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0057] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An optical parts processing process, characterized in that: The process includes the following steps:

1. Preliminary gluing: Apply UV glue on the surface of several wafers in turn and place them together for preliminary gluing to obtain a crystal block; Second: Extrusion of excess glue: Place the preliminarily bonded blocks in a press, and use the press to squeeze out excess glue and control the thickness of the glue; Three: Pre-curing: The ingot is removed and placed on an angle-controlled fixture with precise angle control. Pre-curing is achieved by irradiating the ingot surface with ultraviolet light. The fixture includes a base plate and several bite plates arranged parallel to the base plate, and the bite plates are arranged in a stacked stepped manner. The bite plates are provided with upwardly protruding rims on both sides. The base plate is provided with raised strips on both sides, which are flush with the rims and work in conjunction with them. The base plate and the bite plates are integrally formed. Fourth: Main curing: remove the crystal block from the fixture and place it in the curing box for main curing; Five: Milling and grinding: Place the solidified crystal blocks on the milling machine in order for processing, cut out the corresponding size, and turn over after the front processing is completed; 6. Grinding process: The milled crystal block is double-sided ground by a double-sided grinding machine; Seven: Polishing: The ground crystal block is polished on both sides by a double-sided polishing machine; 8. Degumming: Place the polished crystal block in a degumming box for degumming. Degumming is done by first passing through hot water and then through cold water, and this process is repeated until the crystal block is completely separated into several wafers.

9. Cleaning and drying: Separate the debonded wafers and insert them into the cleaning tool for automatic cleaning. After cleaning, centrifuge and dry them.

10. Packaging and shipment: Carry out various index inspections according to product specifications to select good and bad products; good products are packaged and shipped according to packaging and shipment standards, and bad products are placed in the defective product warehouse and processed according to the defective product processing requirements.

2. An optical parts processing process according to claim 1, characterized in that: In step 2, the press pressure of the press is 80-120 kg; the thickness of the glue is controlled to be 1-2 μm.

3. The optical parts processing process according to claim 1, characterized in that: Adjacent wheel rims are provided with discharge grooves to facilitate the flow of glue.

4. An optical parts processing process according to claim 1, characterized in that: The fixture can adjust the processing angle range by changing the layout and size of the bite plate, and can achieve precise control of the processing angle of 10-60°.

5. The optical parts processing process according to claim 1, characterized in that: In step three, 350nm ultraviolet light is used to irradiate the surface of the crystal block for 2 minutes to achieve pre-curing.

6. The optical component processing process according to claim 1, characterized in that: In step eight, the debonding treatment requires the crystal block to be subjected to hot water above 90°C and cold water below 20°C, and repeated until the crystal block is completely separated into several wafers.

7. An angle control method for optical parts processing, characterized in that: The method uses the clamp as described in any one of claims 3 to 5; and also includes designing a new base or controlling and adjusting the angle between the plane where the base is located and the horizontal line to achieve controlled angle adjustment.

8. The angle control method for optical component processing according to claim 7, characterized in that: Since the angles formed between the base and the plurality of bite plates are kept the same, the angle accuracy error between the wafers can be kept within the range of ±2′.

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