heat sink

Abstract

This invention provides a heat dissipation device. The heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end communicating with the vapor chamber; at least one partition member disposed inside the heat pipe to divide the interior of the heat pipe into a first channel and a second channel that are isolated from each other; and a heat dissipation fin assembly disposed on the vapor chamber and partially covering the heat pipe. The vapor chamber is filled with a liquid working medium, which absorbs heat from the heat source and vaporizes into a gaseous working medium. The gaseous working medium moves to the first channel and the second channel, where it is condensed by the heat dissipation fin assembly, causing the gaseous working medium to liquefy back into a liquid working medium. The liquid working medium then flows back into the vapor chamber. The heat dissipation device of this invention has high overall heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation, and more particularly to a heat dissipation device using a heat exchange plate. Background Technology

[0002] To meet modern demands, computers and various electronic devices are developing rapidly and their performance is constantly improving. However, this process also brings with it the problem of heat dissipation caused by high-performance hardware. Generally, computers and various electronic devices typically use heat dissipation components, such as thermal paste or heat sinks, to absorb and dissipate heat from the electronic components. However, this method of heat dissipation has limited effectiveness, leading to the development of heat dissipation components that utilize the phase change of the working fluid to promote heat conduction.

[0003] The aforementioned heat dissipation components achieve heat transfer through phase change and flow direction of the working fluid. However, when faced with the large amount of heat generated by high-power processors, such heat dissipation components still cannot maintain an effective and consistent heat dissipation, resulting in poor overall heat dissipation efficiency.

[0004] Therefore, how to provide a heat dissipation device that can solve the above problems is one of the issues that the industry urgently needs to overcome. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation device to solve at least one of the above-mentioned problems.

[0006] This invention mainly provides a heat dissipation device, comprising: a heat spreader for contacting a heat source, and having a cavity formed therein; at least one heat pipe having a first end and a second end, the first end and the second end being connected to the heat spreader; at least one partition member disposed inside the heat pipe to divide the interior of the heat pipe into a first channel and a second channel that are isolated from each other; and a heat dissipation fin assembly disposed on the heat spreader and partially covering the heat pipe; wherein, the cavity is filled with a liquid working medium, and the liquid working medium absorbs heat from the heat source and vaporizes into a gaseous working medium, the gaseous working medium moves to the first channel and the second channel, and is condensed by the heat dissipation fin assembly, causing the gaseous working medium to liquefy back into the liquid working medium, and the liquid working medium flows back into the cavity.

[0007] In the aforementioned heat dissipation device, the space at the first end of the first channel is greater than the space at the first end of the second channel, and the space at the second end of the first channel is less than the space at the second end of the second channel.

[0008] In the aforementioned heat dissipation device, the gaseous working medium in the chamber enters the heat pipe through the first channel at the first end and the second channel at the second end, and the liquid working medium in the heat pipe enters the chamber through the second channel at the first end and the first channel at the second end.

[0009] In the aforementioned heat dissipation device, the radial cross-sectional area of ​​the first channel gradually decreases from the first end to the second end, and the radial cross-sectional area of ​​the second channel gradually decreases from the second end to the first end.

[0010] As described above, the heat pipe includes two bends and a middle section. The two bends are respectively erected on the heat spreader and their ends are bent. The two ends of the middle section are respectively connected to the ends of the two bends, so that the middle section is located between the two bends.

[0011] As described above, the heat dissipation fin group includes a first fin group and two second fin groups. The two second fin groups are respectively disposed at both ends of the heat spreader and each has at least one recess for accommodating the two bent portions. The first fin group is disposed between the two second fin groups corresponding to the position of the middle portion.

[0012] In the aforementioned heat dissipation device, the fin height of the second fin group is higher than the fin height of the first fin group.

[0013] In the aforementioned heat dissipation device, the middle part is located above the first fin group and is attached to the top of the first fin group.

[0014] In the aforementioned heat dissipation device, the portion of the separator located in the middle part is closer to the top of the first fin group and parallel to the middle part, thereby making the space of the first channel in the middle part smaller than the space of the second channel in the middle part.

[0015] In the aforementioned heat dissipation device, the fin extension direction of the first fin group and the second fin group is perpendicular to the extension direction of the middle portion.

[0016] In the aforementioned heat dissipation device, there are two heat pipes that are parallel to each other, two separators, and two recesses in each of the two second fin groups.

[0017] In the aforementioned heat dissipation device, the cross-sectional shape of the middle part includes a rectangle, a triangle, a trapezoid, a circle, or a semicircle.

[0018] The aforementioned heat dissipation device also includes a base on which the heat exchange plate is disposed, having an opening, and the heat exchange plate also includes a heat-absorbing part that protrudes from the opening and directly contacts the heat source.

[0019] In the aforementioned heat dissipation device, the heat source is the processor, and the base and the heat spreader are mounted on the circuit board around the processor by multiple fasteners and two fasteners, so that the processor can directly contact the heat absorption part.

[0020] As in the aforementioned heat dissipation device, the partition is a flat plate.

[0021] In the aforementioned heat dissipation device, the heat pipe and the separator are made of the same material and are integrally formed.

[0022] By employing the design of the vapor chamber, heat pipes, separators, and heat dissipation fins in the heat dissipation device of this invention, when facing the large amount of heat generated by a high-power processor, the separators can simultaneously divide the heat pipes into two channels. Furthermore, the radial cross-sectional areas of the two channels gradually decrease in opposite directions, ensuring that the working medium in the channels transitions from a gaseous to a liquid state in a single direction (i.e., the direction in which the radial cross-sectional area of ​​the channel decreases), preventing backflow due to interference. Therefore, the heat dissipation device of this invention provides high overall heat dissipation efficiency while maintaining effective and consistent heat dissipation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall heat dissipation device of the present invention.

[0024] Figure 2 This is an exploded view of the heat dissipation fin assembly in the heat dissipation device of the present invention.

[0025] Figure 3 This is an exploded view of the heat dissipation device of the present invention, showing the disassembly of the base, heat spreader, locking fasteners and fasteners.

[0026] Figure 4 for Figure 1 A schematic diagram of a cross section along section AA.

[0027] Figure 5A and Figure 5B They are respectively Figure 4 Enlarged schematic diagram of parts A and B within the dashed boxes.

[0028] Figure 6A for Figure 2 A schematic diagram of a cross section along the BB line.

[0029] Figure 6B for Figure 2 A schematic diagram of a cross section along the CC line.

[0030] Figure 6C for Figure 2 A schematic diagram of a cross section along the DD line.

[0031] Figure 6D for Figure 2A schematic diagram of a cross section along the EE line.

[0032] 7A to 7D They are respectively Figures 6A to 6D Cross-sectional schematic diagrams of different embodiments.

[0033] The attached figures are labeled as follows:

[0034] 1. Heat dissipation device

[0035] 10 bases

[0036] 101 Opening

[0037] 102 Through Hole

[0038] 11 heat spreader

[0039] 111 chambers

[0040] 112 Heat Absorption Section

[0041] 113 Through Hole

[0042] 12 heat pipes

[0043] 121 First End

[0044] 122 Second End

[0045] 123 Bend

[0046] 124 Middle section

[0047] 125 separator

[0048] 126 First Passage

[0049] 127 Second Channel

[0050] 13 Heat dissipation fins

[0051] 131 First Fin Group

[0052] 132 Second Fin Group

[0053] 133 recess

[0054] 14 Locking fasteners

[0055] 141 Threaded parts

[0056] 142 Washer

[0057] 143 O-ring

[0058] 15 Fasteners

[0059] 151 keyhole

[0060] 2 processors

[0061] 3 Circuit Boards

[0062] A, B (dashed boxes) Detailed Implementation

[0063] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification, and can also implement or apply it through other different specific embodiments.

[0064] Please also refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The heat dissipation device 1 of the present invention includes a heat spreader 11, at least one heat pipe 12, and a heat dissipation fin assembly 13. The heat spreader 11 is used to contact a heat source (e.g., processor 2), and a cavity 111 is formed inside the heat spreader 11 and filled with a working medium, such as water, alcohol, methanol, or acetone.

[0065] The number of heat pipes 12 can be one or more, but the present invention is not limited thereto and can be increased or decreased as needed. In this embodiment, the number of heat pipes 12 is illustrated using two as an example. Each heat pipe 12 has a first end 121 and a second end 122, which can connect to the heat spreader 11 and its chamber 111. Specifically, four openings (not shown) can be formed on the same surface of the heat spreader 11 to connect the first end 121 and the second end 122 of the two heat pipes 12 respectively, and the two heat pipes 12 are arranged parallel to each other on the same surface of the heat spreader 11, but the present invention is not limited thereto. In addition, the heat dissipation fin assembly 13 can be disposed on the heat spreader 11 and partially cover the heat pipes 12.

[0066] In this embodiment, each heat pipe 12 further includes two bends 123 and a middle section 124. The two bends 123 are cylindrical and are respectively erected (e.g., vertically erected) on the heat spreader 11 (as described above with openings) and their ends are bent. The middle section 124 is a rectangular tube with a width greater than its height, and its two ends are respectively connected to the ends of the two bends 123, so that the middle section 124 is located between the two bends 123.

[0067] In this embodiment, each heat pipe 12 is further provided with a partition 125 to divide the interior of the heat pipe 12 into a first channel 126 and a second channel 127 that are isolated from each other. That is, the number of partitions 125 is the same as the number of heat pipes 12, which is also two. The partition 125 is flat plate-shaped and the material can be the same as that of the heat pipe 12 (e.g., both are copper). It is fixed to the interior of the heat pipe 12 by pasting or welding. However, in other embodiments, the partition 125 can also be integrally formed with the heat pipe 12. The present invention is not limited to this. The first channel 126, the second channel 127 and the chamber 111 have a capillary structure formed by sintered particulate body, metal mesh, fiber, groove or a combination thereof.

[0068] The design of the separator 125 differs in different bends 123 and intermediate sections 124, resulting in differences in the spatial dimensions of the first channel 126 and the second channel 127. For details, please also refer to... Figure 5A , Figure 5B , Figure 6A , Figure 6B , Figure 6C and Figure 6D Due to the placement of the separator 125, located in the bend 123 at the first end 121, the space of the first channel 126 is larger than the space of the second channel 127. In other words, the radial cross-sectional area of ​​the first channel 126 in the bend 123 at the first end 121 is larger than the radial cross-sectional area of ​​the second channel 127 in the bend 123 at the first end 121 (e.g., ...). Figure 6A (As shown). In the other bend 123 located at the second end 122, the space of the first channel 126 is smaller than the space of the second channel 127. In other words, the radial cross-sectional area of ​​the first channel 126 in the other bend 123 located at the second end 122 is smaller than the radial cross-sectional area of ​​the second channel 127 in the other bend 123 located at the second end 122 (e.g.) Figure 6D (As shown). In the middle section 124, since the separator 125 is located closer to the heat dissipation fin assembly 13 and parallel to the middle section 124, the space of the first channel 126 in the middle section 124 is smaller than the space of the second channel 127 in the middle section 124. In other words, the radial cross-sectional area of ​​the first channel 126 in the middle section 124 is smaller than the radial cross-sectional area of ​​the second channel 127 in the middle section 124 (e.g., Figure 6B , Figure 6C (As shown).

[0069] In the above embodiment, the middle part 124 is described as a rectangular tubular body with a width greater than its height. However, the present invention is not limited to this. The middle part 124 can also be a rectangular tubular body, a triangular tubular body, a trapezoidal tubular body, a circular tubular body, or a semi-circular tubular body. That is to say, the cross-sectional shape of the middle part 124 can also be rectangular, triangular, trapezoidal, circular, or semi-circular.

[0070] Furthermore, although the above embodiments are described using the size of the space between the first channel 126 and the second channel 127 located at the first end 121, the second end 122, and the middle portion 124, the present invention is not limited thereto. The present invention can be designed to accommodate various cross-sectional shapes of the middle portion 124, such as... 7A to 7D As shown, as long as the radial cross-sectional area of ​​the first channel 126 gradually decreases from the first end 121 to the second end 122 (in sequence from...), Figure 7A , Figure 7B , Figures 7C to 7D The radial cross-sectional area of ​​the second channel 127 should gradually decrease from the second end 122 towards the first end 121 (in sequence from...). Figure 7D , Figure 7C , Figures 7B to 7A ).

[0071] In this embodiment, the heat dissipation fin assembly 13 includes a first fin assembly 131 and two second fin assemblies 132, each composed of multiple fins. The two second fin assemblies 132 are respectively disposed at both ends of the heat spreader 11, while the first fin assembly 131 is disposed between the two second fin assemblies 132, corresponding to the position of the middle portion 124. Furthermore, each second fin assembly 132 has two recesses 133 for accommodating the bent portions 123. The number of recesses 133 can actually correspond to the required number of heat pipes 12; the invention is not limited to two.

[0072] In one embodiment, since the fin height of the second fin group 132 is higher than the fin height of the first fin group 131, when each bend 123 is fully accommodated within each recess 133 of the second fin group 132, the middle portion 124 located above the first fin group 131 can float and contact the top of the first fin group 131. In other words, the height of the middle portion 124 can be equal to or less than the height difference between the first fin group 131 and the second fin group 132, and the shape of the top of the first fin group 131 can be designed according to the shape of the middle portion 124 so that the middle portion 124 accommodates and floats and contacts the top of the first fin group 131, thereby avoiding the situation where an excessive gap is generated between the middle portion 124 and the top of the first fin group 131, resulting in a reduction in heat dissipation efficiency. However, the present invention is not limited thereto.

[0073] In one embodiment, to improve heat dissipation efficiency, the fin extension direction of the first fin group 131 and the second fin group 132 may be perpendicular to the extension direction of the middle portion 124, but the present invention is not limited thereto.

[0074] In this embodiment, the heat dissipation device 1 further includes a base 10 on which a heat spreader 11 is disposed. The heat spreader 11 also includes a heat-absorbing portion 112 protruding from its surface on the surface that contacts the base 10, and the base 10 has an opening 101 at the position corresponding to the heat-absorbing portion 112 for exposing the heat-absorbing portion 112, so that when the heat spreader 11 is disposed on the base 10, the heat-absorbing portion 112 can pass through the opening 101 and directly contact the heat source.

[0075] In application, the heat dissipation device 1 can be used when the heat source is the processor 2. In this case, the base 10 can be mounted on the circuit board 3 surrounding the processor 2 via multiple fasteners 14 and two fasteners 15, allowing the processor 2 to directly contact the heat-absorbing part 112. Specifically, the base 10 may have multiple through holes 102, the heat spreader 11 may have multiple through holes 113 corresponding to the multiple through holes 102, and each fastener 15 may have two locking holes 151. During assembly, the fasteners 14 can sequentially pass through the locking holes 151, through holes 113, and through holes 102, thereby locking them into the corresponding screw holes (not shown) on the circuit board 3. In one embodiment, the fasteners 14 may include a threaded part 141 and a washer 142 and an O-ring 143 sequentially passed through the threaded part 141. There may be four locking devices 14, which are respectively located at the four corners of the processor 2. The number of through holes 102, through holes 113 and lock holes 151 is also four. However, the present invention does not limit the number and position of through holes 102, through holes 113, lock holes 151 and locking devices 14.

[0076] When the heat dissipation device 1 of the present invention is in operation, the liquid working medium in the chamber 111 absorbs heat from the heat source and vaporizes into a gaseous working medium. The gaseous working medium enters the heat pipe 12 from the first channel 126 located at the first end 121 and the second channel 127 located at the second end 122, and gradually fills the entire heat pipe 12. At this time, the heat dissipation fin assembly 13 can condense the gaseous working medium in the heat pipe 12, causing the gaseous working medium to liquefy into a liquid working medium. The liquid working medium in the heat pipe 12 can then flow back into the chamber 111 from the second channel 127 located at the first end 121 and the first channel 126 located at the second end 122 for the next heat dissipation cycle. Since the radial cross-sectional area of ​​the first channel 126 gradually decreases from the first end 121 to the second end 122, and the radial cross-sectional area of ​​the second channel 127 gradually decreases from the second end 122 to the first end 121, this means that the gaseous working medium in the chamber 111 enters the heat pipe 12 through the end with the larger radial cross-sectional area in the first channel 126 and the second channel 127, while the liquid working medium in the heat pipe 12 flows back to the chamber 111 through the end with the smaller radial cross-sectional area in the first channel 126 and the second channel 127. This design effectively makes it easier for the gaseous working medium in the chamber 111 to enter the heat pipe 12, and when the liquid working medium flows back to the chamber 111, it can be pressurized and sprayed into the chamber 111 due to the decreasing radial cross-sectional area of ​​the first channel 126 and the second channel 127, thus preventing backflow. At the same time, it can prevent the gaseous working medium in the chamber 111 from flowing into the second channel 127 at the first end 121 and the first channel 126 at the second end 122.

[0077] By employing the design of the vapor chamber, heat pipes, separator, and heat dissipation fins in the heat dissipation device of this invention, the vapor chamber can efficiently absorb heat energy when facing the large amount of heat generated by high-power processors. It also allows the gaseous working medium to more easily enter the heat pipes, enabling the heat pipes and heat dissipation fins to dissipate heat efficiently. Furthermore, the separator can simultaneously divide the heat pipes into two channels. The arrangement of the two channels with gradually decreasing radial cross-sectional areas in opposite directions ensures that the working medium transitions from a gaseous to a liquid state in a single direction (i.e., the direction in which the radial cross-sectional area of ​​the channel decreases), preventing backflow due to interference. Therefore, the heat dissipation device of this invention provides high overall heat dissipation efficiency while maintaining effective and consistent heat dissipation.

[0078] The above embodiments are merely illustrative of the technical principles, features, and effects of the present invention, and are not intended to limit the scope of implementation of the present invention. Those skilled in the art can modify and alter the above embodiments without departing from the spirit and scope of the present invention. However, any equivalent modifications and alterations made using the teachings of this invention should still be covered by the claims. The scope of protection of this invention should be as set forth in the claims.

Claims

1. A heat dissipation device, characterized in that, include: A heat spreader is used to contact the heat source, and a cavity is formed inside it; At least one heat pipe having a first end and a second end, wherein the first end and the second end are connected to the heat spreader; At least one separator is disposed inside the heat pipe to divide the interior of the heat pipe into a first channel and a second channel that are isolated from each other. The space of the first channel at the first end is larger than the space of the second channel at the first end, and the space of the first channel at the second end is smaller than the space of the second channel at the second end. as well as The heat dissipation fins are disposed on the heat exchange plate and partially cover the heat pipe; The chamber is filled with a liquid working medium, which absorbs heat from the heat source and vaporizes into a gaseous working medium. The gaseous working medium moves to the first channel and the second channel, where it is condensed by the heat dissipation fins, causing the gaseous working medium to liquefy back into a liquid working medium. The liquid working medium then flows back into the chamber.

2. The heat dissipation device as described in claim 1, characterized in that, The gaseous working medium in the chamber enters the heat pipe through the first channel at the first end and the second channel at the second end, and the liquid working medium in the heat pipe enters the chamber through the second channel at the first end and the first channel at the second end.

3. The heat dissipation device as described in claim 1, characterized in that, The radial cross-sectional area of ​​the first channel gradually decreases from the first end to the second end, and the radial cross-sectional area of ​​the second channel gradually decreases from the second end to the first end.

4. The heat dissipation device as described in claim 1, characterized in that, The heat pipe includes two bends and a middle section. The two bends are respectively erected on the heat spreader and their ends are bent. The two ends of the middle section are respectively connected to the ends of the two bends, so that the middle section is located between the two bends.

5. The heat dissipation device as described in claim 4, characterized in that, The heat dissipation fin assembly includes a first fin assembly and two second fin fin assemblies. The two second fin assemblies are respectively disposed at both ends of the heat spreader and each has at least one recess for accommodating the two bends. The first fin assembly is disposed between the two second fin assemblies, corresponding to the position of the middle part.

6. The heat dissipation device as described in claim 5, characterized in that, The fin height of the second fin group is higher than that of the first fin group.

7. The heat dissipation device as described in claim 5, characterized in that, The middle part is located above the first fin group and is attached to the top of the first fin group.

8. The heat dissipation device as described in claim 5, characterized in that, The portion of the separator located in the middle section is closer to the top of the first fin assembly and parallel to the middle section, thereby making the space of the first channel in the middle section smaller than the space of the second channel in the middle section.

9. The heat dissipation device as described in claim 5, characterized in that, The fins of the first fin group and the second fin group extend in a direction perpendicular to the extension direction of the middle portion.

10. The heat dissipation device as described in claim 5, characterized in that, The heat pipes are two in number and parallel to each other, the spacers are two in number, and each of the two second fin groups has two recesses.

11. The heat dissipation device as described in claim 4, characterized in that, The cross-sectional shape of the middle section can be rectangular, triangular, trapezoidal, circular, or semi-circular.

12. The heat dissipation device as claimed in claim 1, characterized in that, The heat dissipation device also includes a base on which the heat exchange plate is disposed, having an opening, and the heat exchange plate also includes a heat-absorbing part that protrudes from the opening and directly contacts the heat source.

13. The heat dissipation device as described in claim 12, characterized in that, The heat source is a processor, and the base and the heat spreader are mounted on the circuit board around the processor by multiple fasteners and two fasteners, so that the processor can directly contact the heat absorption part.

14. The heat dissipation device as claimed in claim 1, characterized in that, The divider is a flat plate.

15. The heat dissipation device as claimed in claim 1, characterized in that, The heat pipe and the separator are made of the same material and are integrally formed.

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