A vacuum pump cooling device

Abstract

This invention belongs to the field of vacuum pump technology, and specifically relates to a vacuum pump heat dissipation device, comprising a housing, inside which a pump body is installed. Both sides of the housing are connected and fixed with enclosures, and fans are fixed inside each enclosure. A filter plate is tightly fitted to one side wall of each enclosure, and each filter plate has two locking holes. This invention, by setting up a housing, pump body, enclosures, fans, filter plates, an air collector, a U-shaped air duct, a thermoelectric cooler, and a blower plate, utilizes a heat dissipation device. The thermoelectric cooler cools the air, turning the air blown into the housing into cold air. With the cooperation of the two fans, the interior of the housing can be quickly ventilated, thus achieving rapid cooling of the pump body. Furthermore, the included limiting components facilitate easier removal of the filter plate from the enclosure for cleaning when a large amount of dust has accumulated on its surface.

Description

Technical Field

[0001] This invention relates to the field of vacuum pump technology, specifically to a vacuum pump heat dissipation device. Background Technology

[0002] A vacuum pump is a device or equipment that uses mechanical, physical, chemical, or physicochemical methods to evacuate a container and create a vacuum. Commonly used vacuum pumps include dry screw vacuum pumps, water ring pumps, reciprocating pumps, slide valve pumps, rotary vane pumps, Roots pumps, and diffusion pumps. These pumps are essential main pumps in the application of vacuum technology in various sectors of my country's national economy. Vacuum pumps generate a lot of heat during use, but current vacuum pumps only use simple heat dissipation holes for natural heat dissipation, which has low heat dissipation efficiency. Although some vacuum pumps use exhaust fans to blow air into the motor housing for heat dissipation, exhaust fans can only blow air in one direction, making it difficult to dissipate heat from the pump body located in the leeward part in time, resulting in untimely heat dissipation and easily affecting the service life of the vacuum pump. Therefore, we propose a vacuum pump heat dissipation device to solve the above problems. Summary of the Invention

[0003] (a) Technical problems to be solved

[0004] To address the shortcomings of existing technologies, this invention provides a vacuum pump cooling device, which solves the problems mentioned in the background section.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, the present invention specifically adopts the following technical solution:

[0007] A vacuum pump cooling device includes a housing, inside which a pump body is installed. Both sides of the housing are connected and fixed with side panels, and fans are fixed inside each side panel. A filter plate is tightly fitted to one side wall of each side panel, and each filter plate has two locking holes. Each side panel is equipped with a limiting component for engaging the locking holes. An air collecting hood is fixed to the inner wall of the housing on one side of one side panel. A U-shaped air supply pipe is connected and fixed to one side wall of the air collecting hood. Four semiconductor cooling chips are fixed inside the U-shaped air supply pipe. Air blowing plates are fixed to both inner walls of the housing. The two ends of the U-shaped air supply pipe are respectively connected and fixed to the corresponding air blowing plates. A cover plate is hinged to the top of the housing.

[0008] Furthermore, the limiting assembly includes a rotating shaft rotatably connected to the top of the enclosure via a bearing. A gear is fixed to the surface of the rotating shaft. Two guide rails are fixed to the top of the enclosure. A rack is slidably connected inside a groove opened on one side wall of each guide rail. The rack is meshed with the gear. A locking plate adapted to a locking hole is fixed to one side wall of each rack. The locking plate is respectively locked inside the corresponding locking hole. A spring is fixed to one side wall of each guide rail. The other end of the spring is respectively fixedly connected to the corresponding rack.

[0009] Furthermore, both enclosures have a moisture-proof layer inside.

[0010] Furthermore, a square sealing gasket is fixed to one side wall of each of the two enclosures, and the other side of the square sealing gasket is tightly fitted to one side wall of the corresponding filter plate.

[0011] Furthermore, each of the four bottom corners of the housing is fixed with a universal self-locking wheel.

[0012] (III) Beneficial Effects

[0013] Compared with the prior art, the present invention provides a vacuum pump heat dissipation device, which has the following beneficial effects:

[0014] This invention, by setting up a housing, pump body, enclosure, fan, filter plate, air collector, U-shaped air supply pipe, semiconductor cooling chip, and air blowing plate, utilizes a heat dissipation device. The semiconductor cooling chip cools the air, turning the air blown into the housing into cold air. With the cooperation of two fans, the interior of the housing can be quickly ventilated, thus enabling rapid cooling of the pump body. Furthermore, the included limiting components facilitate easier removal of the filter plate from the enclosure for cleaning when a large amount of dust has accumulated on its surface. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the internal structure of the housing of the present invention;

[0017] Figure 3 This is a schematic diagram of the enclosure structure of the present invention;

[0018] Figure 4 This is a schematic diagram of the limiting component structure of the present invention;

[0019] Figure 5 This is a schematic diagram of the filter plate structure of the present invention;

[0020] Figure 6 This is a schematic diagram of the U-shaped air supply duct structure of the present invention.

[0021] In the diagram: 1. Housing; 2. Pump body; 3. Enclosure; 4. Fan; 5. Filter plate; 6. Clip hole; 7. Limiting component; 701. Rotating shaft; 702. Gear; 703. Guide rail; 704. Rack; 705. Clamping plate; 706. Spring; 8. Air collector hood; 9. U-shaped air supply duct; 10. Semiconductor cooling chip; 11. Air blower plate; 12. Cover plate; 13. Moisture-proof layer; 14. Square sealing gasket; 15. Universal self-locking wheel. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Example

[0024] like Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6As shown, an embodiment of the present invention discloses a vacuum pump cooling device, including a housing 1. Universal self-locking wheels 15 are fixed to the four corners of the bottom of the housing 1, making it easier to move the vacuum pump within a short distance. A pump body 2 is installed inside the housing 1. Surrounding plates 3 are fixed to both the left and right sides of the housing 1. A moisture-proof layer 13 is provided inside each of the two surrounding plates 3. The moisture-proof layer 13 is made of a mixture of absorbent cotton and lime, which prevents humid air from entering the housing 1, thus protecting the pump body 2. A fan 4 is fixed inside each of the surrounding plates 3. A filter plate 5 is tightly fitted to one side wall of each surrounding plate 3. Two locking holes 6 are provided on each filter plate 5. A limiting component 7 for engaging the locking holes 6 is provided on each surrounding plate 3. An air collecting hood 8 is fixed to the inner wall of the housing 1 on one side of one of the surrounding plates 3. A U-shaped air supply pipe 9 is fixed to one side wall of the air collecting hood 8. Four semiconductor cooling chips 1 are fixed inside the U-shaped air supply pipe 9. 0. Both sides of the inner wall of the housing 1 are fixed with air blowing plates 11. The two ends of the U-shaped air supply pipe 9 are respectively connected and fixed to the corresponding air blowing plates 11. The top of the housing 1 is hinged with a cover plate 12. When using this vacuum pump, when the vacuum pump generates heat, the two fans 4 start. One of the fans 4 will send the outside air through the air collection hood 8 to the inside of the U-shaped air supply pipe 9. Under the action of the semiconductor cooling chip 10, the air entering the inside can be cooled. Then the cooled air will be evenly blown to the surface of the pump body 2 through the air blowing plate 11 to cool it down. Then the other fan 4 will exhaust the air used inside the housing 1. With the cooperation of the two fans 4, the inside of the housing 1 can be quickly ventilated, thus realizing the rapid cooling operation of the inside of the housing 1. The two L-shaped pipes connected to the pump body 2 in the figure slide through the housing 1 and extend to the outside, which makes it easy to remove the pump body 2 from the inside of the housing 1.

[0025] like Figure 1 and Figure 4As shown, in some embodiments, the limiting component 7 includes a rotating shaft 701 rotatably connected to the top of the enclosure 3 via a bearing. A gear 702 is fixed to the surface of the rotating shaft 701. Two guide rails 703 are fixed to the top of the enclosure 3. A rack 704 is slidably connected inside a groove opened on one side wall of each guide rail 703. The rack 704 meshes with the gear 702. A locking plate 705 adapted to the locking hole 6 is fixed to one side wall of each rack 704. The locking plate 705 is respectively locked into the corresponding locking hole 6. A spring 706 is fixed to one side wall of each guide rail 703. The other end of the spring 706 is respectively fixedly connected to the corresponding rack 704. When needed... When cleaning the filter plate 5, the rotating shaft 701 can be rotated. When the rotating shaft 701 rotates, it will drive the gear 702 to rotate. After the gear 702 rotates, it will drive the two racks 704 to move in opposite directions. After the racks 704 move, the spring 706 will be in a stretched state, and the clamping plate 705 will also move out of the inside of the clamping hole 6. At this time, the filter plate 5 can be separated from the surrounding plate 3. When installing, repeat the above operation. After the filter plate 5 and the surrounding plate 3 are attached, release the operation on the rotating shaft 701. At this time, under the restoring force of the spring 706, the clamping plate 705 can be re-clamped into the inside of the clamping hole 6, thereby realizing the limiting and fixing of the filter plate 5.

[0026] like Figure 3 and Figure 4 As shown, in some embodiments, a square sealing gasket 14 is fixed to one side wall of each of the two enclosure plates 3, and the other side of the square sealing gasket 14 is tightly fitted to one side wall of the corresponding filter plate 5, which can further enhance the sealing performance after the enclosure plate 3 and the filter plate 5 are fitted together.

[0027] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A vacuum pump cooling device, comprising a housing (1), characterized in that: The pump body (2) is installed inside the box (1). The left and right sides of the box (1) are connected and fixed with the surrounding plates (3). The fans (4) are fixed inside the surrounding plates (3). The filter plates (5) are tightly attached to one side wall of the surrounding plates (3). The filter plates (5) have two holes (6). The surrounding plates (3) are provided with limiting components (7) for engaging the holes (6). One side of one of the surrounding plates (3) is provided with an air collecting hood (8) fixed to the inner wall of the box (1). The side wall of the air collecting hood (8) is connected and fixed with a U-shaped air supply pipe (9). The U-shaped air supply pipe (9) has four semiconductor cooling chips (10) fixed inside. The inner walls of both sides of the box (1) are fixed with air blowing plates (11). The two ends of the U-shaped air supply pipe (9) are connected and fixed to the corresponding air blowing plates (11). The top of the box (1) is hinged with a cover plate (12). The limiting component (7) includes a rotating shaft (701) rotatably connected to the top of the enclosure (3) via a bearing. A gear (702) is fixed on the surface of the rotating shaft (701). Two guide rails (703) are fixed on the top of the enclosure (3). A rack (704) is slidably connected inside a groove opened on one side wall of each guide rail (703). The racks (704) are meshed with the gears (702). A locking plate (705) that matches the locking hole (6) is fixed on one side wall of each rack (704). The locking plates (705) are respectively locked inside the corresponding locking holes (6). A spring (706) is fixed on one side wall of each guide rail (703). The other end of the spring (706) is fixedly connected to the corresponding rack (704).

2. The vacuum pump cooling device according to claim 1, characterized in that: Both enclosure panels (3) have a moisture-proof layer (13) inside.

3. The vacuum pump cooling device according to claim 1, characterized in that: Square sealing gaskets (14) are fixed to one side wall of each of the two enclosures (3), and the other side of the square sealing gaskets (14) is tightly fitted to one side wall of the corresponding filter plate (5).

4. The vacuum pump cooling device according to claim 1, characterized in that: The bottom four corners of the box (1) are all fixed with universal self-locking wheels (15).

Images