A silicon rod cutting device, a silicon rod processing apparatus, and a silicon rod cutting control method

Abstract

The embodiment of the present application provides a silicon rod cutting device, a silicon rod processing equipment and a silicon rod cutting control method, the silicon rod cutting device is provided with a cutting line for cutting a to-be-processed silicon rod, the silicon rod cutting device comprises a support and N cutting assemblies, N>=2; each cutting assembly is connected with the support; the cutting line is sequentially provided through each cutting assembly, the cutting line forms parallel line nets in each cutting assembly, each parallel line net comprises two mutually parallel cutting line segments, and the N parallel line nets are stacked in layers; in the stacking direction, the projections of the N parallel line nets are staggered to form a closed polygon, so that the to-be-processed silicon rod is cut into a polygonal silicon rod. The silicon rod cutting device can at least ensure that the cutting quality of the opposite two side walls of the silicon rod tends to be consistent during the cutting process, which helps to improve the cutting quality of the silicon rod and reduce the waste of the silicon rod.

Description

[0001] This application claims priority to Chinese Patent Application No. 202220405150.0, filed on February 24, 2022, entitled "A Silicon Rod Cutting Device and Silicon Rod Processing Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of silicon rod cutting technology, and in particular to a silicon rod cutting device, silicon rod processing equipment, and silicon rod cutting control method. Background Technology

[0003] Silicon wafers are the core component in the manufacturing process of solar cells, and the manufacturing of silicon wafers is usually inseparable from the processing of silicon rods.

[0004] In current silicon rod processing, a silicon rod cutting device with crisscrossing cutting lines is typically used. The rod is fed from its end face along a direction parallel to its axis, removing the surrounding curved edges in one pass to obtain a square silicon rod. In this type of crisscross cutting device, the cutting lines are sequentially arranged to form adjacent right-angled sides, thus forming a crisscross shape.

[0005] During the research of the above-mentioned prior art, the inventors discovered that the above-mentioned prior art solutions have the following drawbacks: In the existing silicon rod cutting equipment, the cutting wire wiring method, when a cutting wire is laid from beginning to end to form a wire network, the adjacent right-angled sides are close together and are greatly affected by the tension transmission of the cutting wire itself, resulting in poor cutting quality of the sidewalls of the square silicon rods, increasing the workload of post-processing of the square silicon rods, and causing waste of silicon material. Summary of the Invention

[0006] This invention provides a silicon rod cutting device, silicon rod processing equipment, and silicon rod cutting control method to solve the problem that existing silicon rod cutting equipment results in poor cutting quality of the sidewalls of the square silicon rods, increases the workload of post-processing of the square silicon rods, and causes waste of silicon material.

[0007] To solve the above problems, the present invention is implemented as follows:

[0008] This invention provides a silicon rod cutting device, which is equipped with a cutting line for cutting the silicon rod to be processed. The silicon rod cutting device includes a support and N cutting components, where N≥2.

[0009] Each of the cutting components is connected to the bracket;

[0010] The cutting lines are sequentially wound around each of the cutting components, and the cutting lines form a parallel line mesh in each of the cutting components. Each parallel line mesh includes two parallel cutting line segments, and N parallel line meshes are stacked vertically.

[0011] Along the stacking direction, the projections of the N parallel wire meshes intersect to form a closed polygon, so as to cut the silicon rod to be processed into a polygonal silicon rod.

[0012] This invention also provides a silicon rod cutting device, which is wound with a cutting line for cutting the silicon rod to be processed. The silicon rod cutting device includes a support and N cutting components, where N≥2.

[0013] Each of the cutting components includes two pairs of cutting rollers, each pair of cutting rollers includes two wiring wheels, the axes of the two wiring wheels are parallel and both are connected to the bracket, and the cutting line is wound from one of the wiring wheels and wound into the other wiring wheel to form a straight cutting line segment;

[0014] Wherein, the rotation parameter of the wiring wheel into which the cutting wire is wound is greater than the rotation parameter of the wiring wheel out of which the cutting wire is wound;

[0015] The cutting lines form a parallel mesh in each cutting component, and each parallel mesh includes two parallel cutting line segments, with N parallel meshes stacked vertically.

[0016] Along the stacking direction, the projections of the N parallel wire meshes intersect to form a closed polygon, so as to cut the silicon rod to be processed into a polygonal silicon rod.

[0017] This invention also provides a silicon rod processing device, which includes any of the aforementioned silicon rod cutting devices.

[0018] This invention also provides a silicon rod cutting control method, which is used in the aforementioned silicon rod cutting device, and includes:

[0019] The rotation parameters of the wiring wheel into which the cutting wire is wound are controlled to be greater than the rotation parameters of the wiring wheel from which the cutting wire is wound, so that the cutting wire segment is in a taut state. The rotation parameters include either rotational speed or torque.

[0020] In the silicon rod cutting apparatus of this invention, cutting wires for cutting silicon rods are successively wound around at least two cutting components. Parallel wire meshes are formed in each cutting component, with the number of parallel wire meshes being the same as the number of cutting components. Each parallel wire mesh includes two parallel cutting wire segments, and at least two parallel wire meshes are stacked vertically. Along the stacking direction, the projections of all parallel wire meshes intersect to form a closed polygon. Therefore, this cutting apparatus can cut a circular silicon rod into a polygonal silicon rod. In this cutting apparatus, because the cutting wires are first wound to form a parallel wire mesh from the parallel lines on opposite sides, and then the parallel wire meshes are stacked, the projections of parallel wire meshes in different layers form a closed polygon. Therefore, it can be ensured that the cutting quality of the two opposite sidewalls of the silicon rod tends to be consistent during the silicon rod cutting process, which helps to improve the cutting quality of the silicon rod and reduce silicon rod waste. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the silicon rod cutting device in an embodiment of the present invention is shown;

[0023] Figure 2 A simplified schematic diagram of the silicon rod cutting device in an embodiment of the present invention is shown;

[0024] Figure 3 A schematic diagram of the wiring wheel arrangement in the silicon rod cutting device according to an embodiment of the present invention is shown;

[0025] Figure 4 A schematic diagram showing the reversal of the cutting line in the guide wheel in the silicon rod cutting device according to an embodiment of the present invention is shown;

[0026] Figure 5 This diagram illustrates the positions of the two parallel wire meshes in the silicon rod cutting device according to an embodiment of the present invention.

[0027] Figure 6 A schematic diagram of another wiring method for the silicon rod cutting device in an embodiment of the present invention is shown;

[0028] Figure 7 A simplified schematic diagram of yet another silicon rod cutting device according to an embodiment of the present invention is shown;

[0029] Figure 8 A simplified schematic diagram of another silicon rod cutting device according to an embodiment of the present invention is shown.

[0030] Explanation of the attached drawing numbers:

[0031] Cutting wire-10, bracket-20, cutting assembly-21, first cutting assembly-211, second cutting assembly-212, first pair of cutting rollers-2111, first guide roller group-2112, second pair of cutting rollers-2113, second guide roller group-2121, third guide roller group-2122, third pair of cutting rollers-2123, fourth pair of cutting rollers-2124, first wiring roller-2111a, second wiring roller-2111b, third wiring roller-2113a, fourth wiring roller-2113b, fifth wiring roller-2123a, sixth wiring roller-2123 b, Seventh wiring wheel - 2124a, Eighth wiring wheel - 2124b, First guide wheel - 21121, Second guide wheel - 21122, Third guide wheel - 21123, Fourth guide wheel - 21211, Fifth guide wheel - 21212, Sixth guide wheel - 21221, Seventh guide wheel - 21222, Eighth guide wheel - 21223, First drive motor - M1, Second drive motor - M2, Third drive motor - M3, Fourth drive motor - M4, Fifth drive motor - M5, Sixth drive motor - M6, Seventh drive motor - M7, Eighth drive motor - M8. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0034] In various embodiments of the present invention, it should be understood that the sequence number of each process described below does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0035] Reference Figure 1 and Figure 2The diagram shows a schematic of a silicon rod cutting device according to an embodiment of the present invention. The silicon rod cutting device is provided with a cutting line 10 for cutting the silicon rod to be processed. The silicon rod cutting device includes a support 20 and N cutting components 21, where N≥2.

[0036] Each of the cutting components 21 is connected to the bracket 20;

[0037] The cutting line 10 is sequentially wound around each of the cutting components 21, and the cutting line 10 forms a parallel line mesh in each of the cutting components 21. Each parallel line mesh includes two parallel cutting line segments, and N parallel line meshes are stacked vertically.

[0038] Along the stacking direction, the projections of the N parallel wire meshes intersect to form a closed polygon, so as to cut the silicon rod to be processed into a polygonal silicon rod.

[0039] Specifically, the silicon rod cutting device of this invention is a cutting device for cutting and removing the outer layer of silicon rods, capable of cutting cylindrical silicon rods into rectangular, hexagonal, or other polygonal silicon rods. Figure 1 and Figure 2 As shown, a cutting wire 10 can be wound around the cutting assembly 21, which is mounted on the bracket 20. Through the winding path of the cutting wire 10, its projection forms a closed polygon. When the cutting wire 10 moves unidirectionally or reciprocally, the silicon rod can be cut.

[0040] It should be noted that in this embodiment of the invention, the number of cutting components 21 is at least two. When the cutting line 10 is wound around each cutting component 21, it can form a parallel line mesh including two cutting line segments. The number of parallel line meshes formed after the cutting line 10 is wound is the same as the number of cutting components 21. All the parallel line meshes are stacked vertically in three-dimensional space. It can be understood that the planes containing each parallel line mesh can be parallel or intersecting. When the planes containing each parallel line mesh intersect, it is sufficient to ensure that the cutting line segments do not obstruct or interfere with each other.

[0041] Along the direction of all parallel mesh stacking, the projection of any parallel mesh is two parallel lines, and the projections of all parallel meshes intersect to form a closed polygon. When the silicon rod to be processed moves relative to the parallel meshes, it can be cut into a polygonal silicon rod. The shape of the polygonal silicon rod formed depends on the number of cutting components 21 used in the cutting device, that is, the number of parallel meshes formed by the cutting lines 10. For example, when two cutting components 21 are used to form two parallel meshes, a square silicon rod can be cut; when three cutting components 21 are used to form three parallel meshes, a hexagonal silicon rod can be cut. It can be understood that different parallel meshes correspond to different planes, and when parallel meshes of different layers are parallel to each other, these planes are parallel to each other. The planes containing parallel meshes of different layers can also intersect, as long as the cutting segments within different parallel meshes do not obstruct each other.

[0042] The two cutting segments in each parallel mesh are parallel to each other and can be used to cut two opposing sidewalls to form a polygonal silicon rod. Figure 1 As illustrated, it is easy to understand that in the embodiments of the present invention, the cutting lines complete the layout of a parallel wire mesh when passing through each cutting component 21 in sequence during wiring. That is, the two cutting line segments used to cut the two opposite sidewalls of the polygonal silicon rod are laid first.

[0043] In the silicon rod cutting apparatus of this invention, cutting wires for cutting silicon rods are successively wound around at least two cutting components. Parallel wire meshes are formed in each cutting component, with the number of parallel wire meshes being the same as the number of cutting components. Each parallel wire mesh includes two parallel cutting wire segments, and at least two parallel wire meshes are stacked vertically. Along the stacking direction, the projections of all parallel wire meshes intersect to form a closed polygon. Therefore, this cutting apparatus can cut a circular silicon rod into a polygonal silicon rod. In this cutting apparatus, because the cutting wires are first wound to form a parallel wire mesh from the parallel lines on opposite sides, and then the parallel wire meshes are stacked, the projections of parallel wire meshes in different layers form a closed polygon. Therefore, it can be ensured that the cutting quality of the two opposite sidewalls of the silicon rod tends to be consistent during the silicon rod cutting process, which helps to improve the cutting quality of the silicon rod and reduce silicon rod waste.

[0044] Optionally, refer to Figure 2 Each of the cutting components 21 includes two pairs of cutting rollers, with the axes of the two wiring wheels of each pair of cutting rollers being parallel;

[0045] The wheelbase L between the two wiring wheels of each pair of cutting rollers does not exceed twice the diameter of the silicon rod to be processed.

[0046] Specifically, such as Figure 2As shown, each cutting assembly 21 includes two pairs of cutting rollers, which are used to wind the cutting wire 10. Each pair of cutting rollers includes two wiring wheels, which are roller-shaped or disc-shaped parts on which the cutting wire 10 is wound, so that the flexible cutting wire 10 forms corresponding cutting line segments along the designed path direction. The two wiring wheels in each pair of cutting rollers are arranged back and forth along the direction of the cutting wire 10, and the axes of the two wiring wheels are parallel. The four wiring wheels are mounted on the bracket 20 in a quadrilateral shape, so that when the cutting wire 10 is wound through the cutting assembly 21, a parallel wire mesh including two cutting line segments can be formed. It should be noted that in the cutting assembly formed by the four wiring wheels, the two wiring wheels located on the same axis can usually be referred to as main rollers. When the two wiring wheels are connected to the bracket 10 by a through shaft, a main roller is formed, and each main roller includes two coaxial wiring wheels. When the two wiring wheels are connected to the bracket 10 by two half shafts respectively, two independent main rollers are formed, and each main roller includes one wiring wheel. In traditional designs, due to the different wiring structures used, the axial distance L between the two pairs of cutting rollers is usually much larger than the diameter of the silicon rod to be processed.

[0047] like Figure 2 As illustrated in this embodiment of the invention, the axes of the two wiring wheels in each pair of cutting rollers are parallel, and the cutting line 10 between the two wiring wheels of each pair of cutting rollers can contact the silicon rod to be processed to complete the cutting. To improve the effective cutting ratio of the cutting line 10, the axial distance L between the two wiring wheels does not exceed twice the diameter of the silicon rod to be processed. For example, for a silicon rod with a diameter of 300mm, the axial distance L between the two wiring wheels can be designed to not exceed 600mm; specifically, it can be parameters such as 540mm, 480mm, 450mm, 420mm, 400mm, or 375mm. For a silicon rod with a diameter of 250mm, the axial distance L between the two wiring wheels can be designed to not exceed 500mm; specifically, it can be parameters such as 450mm, 400mm, 375mm, 350mm, 325mm, or 300mm. In this way, when the cutting line 10 contacts the silicon rod to be processed, the overhang length of the cutting line 10 can be reduced, increasing the effective contact ratio between the cutting line 10 and the silicon rod to be processed. This can avoid the swaying of the cutting line 10 caused by the long overhang length of the cutting line 10, and improve the cutting quality of the silicon rod.

[0048] Optionally, refer to Figure 1 and Figure 2 The at least two cutting components 21 include a first cutting component 211 and a second cutting component 212;

[0049] The cutting line 10 forms a first parallel mesh in the first cutting component 211, and the cutting line forms a second parallel mesh in the second cutting component 212;

[0050] Along the stacking direction, the projections of the first parallel mesh and the second parallel mesh intersect to form a quadrilateral.

[0051] Specifically, such as Figure 1 and Figure 2 As shown, when the silicon rod cutting device includes two cutting components, a first cutting component 211 and a second cutting component 212, the cutting wire 10 can first be wound around the first cutting component 211 to form a first parallel wire mesh, and then wound around the second cutting component 212 to form a second parallel wire mesh. The two cutting wire segments in the first parallel wire mesh are... Figure 1 As shown in 10e and 10f, the two cutting segments in the second parallel mesh are... Figure 1 As shown in Figures 10g and 10h, the first and second parallel meshes are stacked vertically. Cutting segments 10e and 10f are located in the lower plane, while cutting segments 10g and 10h are located in the upper plane. Along the stacking direction, cutting segments 10e, 10f and 10g, 10h intersect to form a quadrilateral. When two parallel meshes intersect at 90 degrees, they form a grid shape, which can be used to cut rectangular bars.

[0052] Optionally, refer to Figures 1 to 3 The first cutting assembly 211 includes a first pair of cutting rollers 2111, a first guide roller group 2112, and a second pair of cutting rollers 2113;

[0053] The first pair of cutting rollers 2111, the first guide roller group 2112, and the second pair of cutting rollers 2113 all rotate relative to the bracket;

[0054] The cutting line 10 is sequentially wound around the first pair of cutting rollers 2111, the first guide roller group 2112 and the second pair of cutting rollers 2113. The first guide roller group 2112 is used to guide the cutting line 10 to switch from the first pair of cutting rollers 2111 to the second pair of cutting rollers 2113.

[0055] The cutting line 10 forms a first cutting line segment 10e between the first pair of cutting rollers 2111, and the cutting line 10 forms a second cutting line segment 10f between the second pair of cutting rollers 2113. The first cutting line segment 10e and the second cutting line segment 10f are parallel to each other to form the first parallel wire mesh.

[0056] Specifically, such as Figures 1 to 3As shown, the first cutting assembly 211 includes a first pair of cutting rollers 2111, a first guide roller group 2112, and a second pair of cutting rollers 2113. The axes of the first wire-laying roller 2111a and the second wire-laying roller 2111b in the first pair of cutting rollers 2111 are parallel, and the axes of the third wire-laying roller 2113a and the fourth wire-laying roller 2113b in the second pair of cutting rollers 2113 are parallel. The axes of the first wire-laying roller 2111a and the third wire-laying roller 2113a are coaxial, and the axes of the second wire-laying roller 2111b and the fourth wire-laying roller 2113b are coaxial. The portion of the cutting line 10 between the first wire-laying roller 2111a and the second wire-laying roller 2111b is the first cutting line segment 10e, and the portion of the cutting line 10 between the third wire-laying roller 2113a and the fourth wire-laying roller 2113b is the second cutting line segment 10f. Since a single cutting line 10 is used for wiring, the first guide roller group 2112 is needed to switch the cutting line 10 from the first pair of cutting rollers 2111 to the second pair of cutting rollers 2113.

[0057] Optionally, refer to Figure 2 and Figure 4 The first guide wheel assembly 2112 includes a first guide wheel 21121, a second guide wheel 21122 and a third guide wheel 21123;

[0058] The cutting line 10 is sequentially wound around the first guide wheel 21121, the second guide wheel 21122 and the third guide wheel 21123, wherein the axis of the second guide wheel 21122 is perpendicular to the axis of the first guide wheel 21121 and the axis of the third guide wheel 21123.

[0059] Specifically, such as Figure 2 As shown, the aforementioned first guide wheel assembly 2112 includes a first guide wheel 21121, a second guide wheel 21122, and a third guide wheel 21123. The first guide wheel 21121 is installed near the second wiring wheel 2111b, the third guide wheel 21123 is installed near the third wiring wheel 2113a, and the second guide wheel 21122 is installed on the wiring path between the first guide wheel 21121 and the third guide wheel 21123, and can be installed at the corner of the bracket 20.

[0060] After the cutting wire 10 exits from the second wiring roller 2111b, it is guided and reversed by the first guide roller 21121, and then wound along the second guide roller 21122. After being guided and reversed by the second guide roller 21122, the cutting wire 10 is wound onto the third guide roller 21123, and then wound along the third guide roller 21123 onto the third wiring roller 2113a, thereby completing the switching of the cutting wire 10 between the first pair of cutting rollers 2111 and the second pair of cutting rollers 2113. In the above wiring switching structure, the second guide roller 21122 avoids the cutting wire 10 from passing through the closed polygon formed by the parallel wire mesh, which can avoid interference between the cutting wire and the silicon rod during the cutting process.

[0061] Optionally, refer to Figure 2 and Figure 4 The second cutting assembly 212 includes a second guide roller group 2121, a third guide roller group 2122, a third pair of cutting rollers 2123 and a fourth pair of cutting rollers 2124;

[0062] The second guide roller group 2121, the third guide roller group 2122, the third pair of cutting rollers 2123 and the fourth pair of cutting rollers 2124 all rotate relative to the bracket;

[0063] After the cutting wire 10 passes through the second pair of cutting rollers 2123, it passes sequentially through the second guide roller group 2121, the third pair of cutting rollers 2123, the third guide roller group 2122, and the fourth pair of cutting rollers 2124. The second guide roller group 2121 is used to guide the cutting wire 10 to switch from the second pair of cutting rollers 2113 to the third pair of cutting rollers 2123, and the third guide roller group 2122 is used to guide the cutting wire 10 to switch from the third pair of cutting rollers 2123 to the fourth pair of cutting rollers 2124.

[0064] The cutting line 10 forms a third cutting line segment 10g between the third pair of cutting rollers 2123, and the cutting line 10 forms a fourth cutting line segment 10h between the fourth pair of cutting rollers 2124. The third cutting line segment 10g and the fourth cutting line segment 10h are parallel to each other to form the second parallel wire mesh.

[0065] Specifically, such as Figure 2 and Figure 4As shown, the second cutting assembly 212 includes a second guide roller group 2121, a third guide roller group 2122, a third pair of cutting rollers 2123, and a fourth pair of cutting rollers 2124. The axes of the fifth wire-laying roller 2123a and the sixth wire-laying roller 2123b in the third pair of cutting rollers 2123 are parallel, and the axes of the seventh wire-laying roller 2124a and the eighth wire-laying roller 2124b in the fourth pair of cutting rollers 2124 are parallel. The axes of the fifth wire-laying roller 2123a and the seventh wire-laying roller 2124a are coaxial, and the axes of the sixth wire-laying roller 2123b and the eighth wire-laying roller 2124b are coaxial. The portion of the cutting line 10 between the fifth wire-laying roller 2123a and the sixth wire-laying roller 2123b is the third cutting line segment 10g, and the portion of the cutting line 10 between the seventh wire-laying roller 2124a and the eighth wire-laying roller 2124b is the fourth cutting line segment 10h. Since a single cutting line 10 is used for wiring, the second guide roller group 2121 is used to switch the cutting line 10 from the second pair of cutting rollers 2113 to the third pair of cutting rollers 2123, and the third guide roller group 2122 is used to switch the cutting line 10 from the third pair of cutting rollers 2123 to the fourth pair of cutting rollers 2124.

[0066] Optionally, refer to Figure 2 and Figure 4 The second guide wheel assembly 2121 includes a fourth guide wheel 21211 and a fifth guide wheel 21212;

[0067] The cutting line 10 is sequentially wound around the fourth guide wheel 21211 and the fifth guide wheel 21212, wherein the fourth guide wheel 21211 and the fifth guide wheel 21212 are located in the same plane.

[0068] Specifically, such as Figure 2 and Figure 4 As shown, the second guide roller group 2121 is used to switch the cutting wire 10 from the second pair of cutting rollers 2113 to the third pair of cutting rollers 2123, that is, to complete the switching of two parallel wire meshes. Referring to the diagram, the fourth guide roller 21211 is arranged and installed close to the fourth wire roller 2113b, and the fifth guide roller 21212 is arranged and installed close to the fifth wire roller 2123a, with the axes of the two guide rollers parallel to each other. After the cutting wire 10 exits from the fourth wire roller 2113b, i.e., leaves the second cutting segment 10f of the first parallel wire mesh, it winds through the fourth guide roller 21211 and the fifth guide roller 21212, and then winds into the fifth wire roller 2123a to form the third cutting segment 10g of the second parallel wire mesh.

[0069] Optionally, refer to Figure 2 and Figure 4 The third guide wheel group 2122 includes a sixth guide wheel 21221, a seventh guide wheel 21222 and an eighth guide wheel 21223;

[0070] The cutting line 10 is sequentially wound around the sixth guide wheel 21112, the seventh guide wheel 21222, and the eighth guide wheel 21223, wherein the axis of the seventh guide wheel 21222 is perpendicular to the axis of both the sixth guide wheel 21221 and the eighth guide wheel 21223.

[0071] Specifically, such as Figure 2 and Figure 4 As shown, the aforementioned third guide wheel group 2122 includes a sixth guide wheel 21221, a seventh guide wheel 21222, and an eighth guide wheel 21223. The sixth guide wheel 21221 is installed near the sixth wiring wheel 2123b, the eighth guide wheel 21223 is installed near the seventh wiring wheel 2124a, and the seventh guide wheel 21222 is installed on the wiring path between the sixth guide wheel 21221 and the eighth guide wheel 21223. It can be installed at the corner of the bracket 20, and the seventh guide wheel 21222 can be arranged diagonally with the second guide wheel 21122.

[0072] After the cutting wire 10 exits from the sixth wire feeding roller 2123b, it is guided and reversed by the sixth guide roller 21221, and then wound along the seventh guide roller 21222. After being guided and reversed by the seventh guide roller 21222, the cutting wire 10 is wound onto the eighth guide roller 21223, and then wound onto the seventh wire feeding roller 2124a along the eighth guide roller 21223. This completes the switching of the cutting wire 10 between the third pair of cutting rollers 2123 and the fourth pair of cutting rollers 2124. In the above-mentioned wire feeding switching structure, the seventh guide roller 21222 avoids the cutting wire 10 from passing through the closed polygon formed by the parallel wire mesh, which can avoid interference between the cutting wire and the silicon rod during the cutting process.

[0073] Optionally, refer to Figure 5 The first plane M containing the first parallel network is separated from the second plane N containing the second parallel network by a preset distance ΔH.

[0074] Specifically, combined Figure 5 The illustration shows two parallel line meshes, the first and the second, that are parallel to each other. The plane containing the first parallel line mesh is the first plane M, and the plane containing the second parallel line mesh is the second plane N. The first plane M is located on the lower layer, and the second plane N is located on the upper layer. The first plane M and the second plane N are separated by a preset distance ΔH as shown in the illustration. This avoids friction between the cutting lines 10 within the first and second parallel line meshes and the vibration caused by friction, while also helping to extend the service life of the cutting lines 10.

[0075] Optionally, at least one of the two wire-laying wheels coaxially arranged in the cutting assembly 21 is each connected to a drive motor; or,

[0076] At least two wire-laying wheels coaxially arranged in at least one of the cutting components 21 share a single drive motor; or,

[0077] At least one of the two wiring wheels located diagonally in the cutting assembly 21 is each connected to a drive motor.

[0078] Specifically, each cutting component 21 has two coaxially arranged wire-laying wheels. Considering the layout path and movement direction of the cutting line 10, it is easy to understand that the two coaxially arranged wire-laying wheels can rotate in the same direction. Therefore, in practical applications, when the two coaxially arranged wire-laying wheels rotate in the same direction, they can be connected by a single shaft and driven by the same drive motor. In this type of cutting device, the number of drive motors used is small, the structure of the device is relatively simple, the parts are easy to assemble, and the control is relatively convenient.

[0079] Furthermore, the two coaxially arranged wiring wheels can also be connected by two half-shafts, with each wiring wheel individually connected to a corresponding drive motor for driving. For example, in Figure 3 Based on the schematic diagram, the through shaft between the first wiring wheel 2111a and the third wiring wheel 2113a is replaced with two independent half-shafts. The first wiring wheel 2111a and the third wiring wheel 2113a can be connected to the bracket 10 by the two half-shafts. Drive motors can be connected to the first wiring wheel 2111a and the third wiring wheel 2113a respectively. In this cutting device, since each wiring wheel can be driven independently, the tension of the cutting wire 10 can be monitored. By monitoring the tension changes of the cutting wire 10, the output parameters of the drive motor on each wiring wheel can be adaptively adjusted to compensate for the tension attenuation of the cutting wire 10 at different wiring wheels. It should be noted that when the two wiring wheels are connected by two half-shafts, since the two coaxially arranged wiring wheels can rotate in opposite directions, therefore, as... Figure 6 As shown in the diagram, the wiring path can also be changed by removing the second guide wheel 21122 and the seventh guide wheel 21222 and adjusting the direction of the other guide wheels to form two layers of parallel wire mesh.

[0080] Furthermore, regardless of whether the two coaxially arranged wiring wheels are connected by a through shaft or a half shaft, each of the two wiring wheels located diagonally in the cutting assembly 21 can be connected to a drive motor. For example, combined with Figure 3As illustrated, in the first cutting assembly 211, drive motors can be connected to the third wire-laying wheel 2113a and the second wire-laying wheel 2111b respectively. In this case, the third wire-laying wheel 2113a acts as the driving wheel, and the fourth wire-laying wheel 2113b acts as the driven wheel opposite to the third wire-laying wheel 2113a. The second wire-laying wheel 2111b acts as the driving wheel, and the first wire-laying wheel 2111a acts as the driven wheel opposite to the second wire-laying wheel 2111b. The two driving wheels can drive the corresponding cutting segments to move in the same direction. Similarly, combined with... Figure 6 As illustrated, when drive motors are connected to the third wiring wheel 2113a and the second wiring wheel 2111b respectively, the two drive wheels can drive the corresponding cutting line segments to move in opposite directions. This drive motor connection scheme can both compensate for tension attenuation and avoid structural complexity caused by too many motors.

[0081] Reference Figure 1 and Figure 2 The present invention also provides a silicon rod cutting device, wherein the silicon rod cutting device is wound with a cutting line 10 for cutting the silicon rod to be processed, and the silicon rod cutting device includes a support 20 and N cutting components 21, where N≥2;

[0082] Each of the cutting components 21 includes two pairs of cutting rollers, each pair of cutting rollers includes two wiring wheels, the axes of the two wiring wheels are parallel and both are connected to the bracket 20, the cutting line 10 is wound from one of the wiring wheels and wound into the other wiring wheel to form a straight cutting line segment;

[0083] Wherein, the rotation parameter of the wiring wheel into which the cutting wire 10 is wound is greater than the rotation parameter of the wiring wheel out of which the cutting wire is wound;

[0084] The cutting line 10 forms a parallel line mesh in each of the cutting components 21, and each parallel line mesh includes two parallel cutting line segments, with N parallel line meshes stacked one above the other;

[0085] Along the stacking direction, the projections of the N parallel wire meshes intersect to form a closed polygon, so as to cut the silicon rod to be processed into a polygonal silicon rod.

[0086] Specifically, this invention also provides another silicon rod cutting device, the structure of which can be referred to... Figure 1 and Figure 2 The indication, and Figure 1 and Figure 2 The difference in the illustrated silicon rod cutting device is that:

[0087] Each cutting assembly 21 includes two pairs of cutting rollers, each pair of cutting rollers including two wiring wheels. The axes of the two wiring wheels in each pair of cutting rollers are parallel and both are connected to the bracket 20. When laying the cutting line 10, the cutting line 10 exits from one wiring wheel and enters the other wiring wheel to form a straight cutting line segment. Furthermore, the rotational parameter of the wiring wheel into which the cutting line 10 enters is greater than the rotational parameter of the wiring wheel from which the cutting line 10 exits. This rotational parameter can be the rotational speed or the torque of the wiring wheel. It should be noted that the entry and exit of the cutting line 10 are both referenced to the direction of the same cutting line segment. When the cutting line segment passes through two wiring wheels successively, the wiring wheel that passes through first is the wiring wheel from which the cutting line 10 exits, and the wiring wheel that passes through later is the wiring wheel into which the cutting line 10 enters.

[0088] Combination Figure 1 and Figure 2 As can be understood from the illustration, during the transmission motion of the cutting wire 10, due to the difference in rotational parameters between the wiring wheels that the cutting wire 10 passes through, the end of the wiring wheel into which the cutting wire 10 is wound can exert a pulling effect on the end of the wiring wheel from which the cutting wire 10 is wound, which helps to increase the tension of the cutting wire 10 and keep it in a taut state.

[0089] In any cutting assembly 21, there are two coaxially arranged wire wheels. Considering the layout path and direction of movement of the cutting line 10, it is easy to understand that the two coaxially arranged wire wheels can rotate in the same direction. Therefore, in practical applications, when the two coaxially arranged wire wheels rotate in the same direction, they can be connected by a single shaft and driven by the same drive motor. This type of cutting device uses fewer drive motors, has a simpler structure, and the various parts are easier to assemble and control. Alternatively, the two coaxially arranged wire wheels can be connected by two half-shafts, with each wire wheel connected to a corresponding drive motor. For further explanation of the following embodiments regarding whether the two wire wheels are connected by a single shaft or each half-shaft is connected to a bracket, please refer to the following descriptions.

[0090] Furthermore, similar to the silicon rod cutting device in the aforementioned embodiments, the cutting lines 10 of the silicon rod cutting device in this embodiment are also wound around the N cutting components 21 to form a parallel mesh of stacked lines. For details, please refer to the detailed description of the aforementioned embodiments, which will not be repeated here.

[0091] The silicon rod cutting device of this invention not only possesses the advantages of the aforementioned parallel wire mesh, ensuring consistent cutting quality on the two opposite sidewalls of the silicon rod during the cutting process, thus improving cutting quality and reducing waste, but also ensures that all wire guide wheels rotate during the cutting wire transmission motion. The rotational parameters of the wire guide wheel into which the cutting wire enters are greater than those of the wire guide wheel out of the cutting wire. This allows the cutting wire segment to be kept under tension, helping to compensate for the weakening of the cutting wire tension during transmission, preventing slippage and improving both cutting efficiency and quality.

[0092] Optionally, refer to Figure 1 and Figure 2 The N cutting components 21 include a first cutting component 211 and a second cutting component 212;

[0093] The cutting line 10 forms a first parallel mesh in the first cutting component 211, and the cutting line forms a second parallel mesh in the second cutting component 212;

[0094] Along the stacking direction, the projections of the first parallel mesh and the second parallel mesh intersect to form a quadrilateral.

[0095] Specifically, such as Figure 1 and Figure 2 As shown, when the N cutting components 21 include two cutting components, a first cutting component 211 and a second cutting component 212, the cutting line 10 can first pass through the first cutting component 211 to form a first parallel line mesh, and then pass through the second cutting component 212 to form a second parallel line mesh. The two cutting line segments in the first parallel line mesh are... Figure 1 As shown in 10e and 10f, the two cutting segments in the second parallel mesh are... Figure 1 As shown in Figures 10g and 10h, the first and second parallel meshes are stacked vertically. Cutting segments 10e and 10f are located in the lower plane, while cutting segments 10g and 10h are located in the upper plane. Along the stacking direction, cutting segments 10e, 10f and 10g, 10h intersect to form a quadrilateral. When two parallel meshes intersect at 90 degrees, they form a grid shape, which can be used to cut rectangular bars.

[0096] Optionally, refer to Figures 1 to 4The first cutting assembly 211 includes a first pair of cutting rollers 2111 and a second pair of cutting rollers 2113. The cutting line 10 forms a first cutting line segment 10e between the first pair of cutting rollers 2111 and a second cutting line segment 10f between the second pair of cutting rollers 2113. The first cutting line segment 10e and the second cutting line segment 10f are parallel to each other to form the first parallel wire mesh.

[0097] The second cutting assembly 212 includes a third pair of cutting rollers 2123 and a fourth pair of cutting rollers 2124. The cutting line 10 forms a third cutting line segment 10g between the third pair of cutting rollers 2123 and a fourth cutting line segment 10h between the fourth pair of cutting rollers 2124. The third cutting line segment 10g and the fourth cutting line segment 10h are parallel to each other to form the second parallel wire mesh.

[0098] Specifically, such as Figures 1 to 4 As shown, the first cutting assembly 211 includes a first pair of cutting rollers 2111 and a second pair of cutting rollers 2113, each pair of cutting rollers including two wire-laying wheels with parallel axes. A cutting line 10 forms a first cutting line segment 10e between the two wire-laying wheels in the first pair of cutting rollers 2111, and a cutting line 10 forms a second cutting line segment 10f between the two wire-laying wheels in the second pair of cutting rollers 2113. The first cutting line segment 10e and the second cutting line segment 10f are parallel to each other, forming a first parallel wire mesh.

[0099] The second cutting assembly 212 includes a third pair of cutting rollers 2123 and a fourth pair of cutting rollers 2124, each pair of cutting rollers including two wire-laying wheels with parallel axes. A third cutting line segment 10g is formed between the two wire-laying wheels within the third pair of cutting rollers 2123, and a fourth cutting line segment 10h is formed between the two wire-laying wheels within the fourth pair of cutting rollers 2124. The third cutting line segment 10g and the fourth cutting line segment 10h are parallel to each other, forming a second parallel wire mesh.

[0100] The two parallel meshes mentioned above are stacked one above the other with a certain spacing, such as... Figure 5 The illustration shows two parallel line meshes, the first and the second, that are parallel to each other. The plane containing the first parallel line mesh is the first plane M, and the plane containing the second parallel line mesh is the second plane N. The first plane M is located on the lower layer, and the second plane N is located on the upper layer. The first plane M and the second plane N are separated by a preset distance ΔH as shown in the illustration. This avoids friction between the cutting lines 10 within the first and second parallel line meshes and the vibration caused by friction, while also helping to extend the service life of the cutting lines 10.

[0101] Of course, in order to achieve the switching of a single cutting line 10 between different cutting components 21, the silicon rod cutting device of this embodiment may also include a number of guide wheels mounted on the bracket to guide the direction of the cutting line 10 to achieve reversal. For details, please refer to the detailed description of the first guide wheel group 2112, the second guide wheel group 2121 and the third guide wheel group 2122 in the foregoing embodiment.

[0102] Optionally, refer to Figures 1 to 4 The first pair of cutting rollers 2111 includes a first wiring roller 2111a and a second wiring roller 2111b, and the second pair of cutting rollers 2113 includes a third wiring roller 2113a and a fourth wiring roller 2113b. The first wiring roller 2111a and the third wiring roller 2113a are arranged coaxially, and the second wiring roller 2111b and the fourth wiring roller 2113b are arranged coaxially. The cutting wire 10 is wound between the first wiring roller 2111a and the second wiring roller 2111b to form the first cutting line segment 10e, and the cutting wire 10 is wound between the third wiring roller 2113a and the fourth wiring roller 2113b to form the second cutting line segment 10f.

[0103] The third pair of cutting rollers 2123 includes a fifth wiring roller 2123a and a sixth wiring roller 2123b, and the fourth pair of cutting rollers 2124 includes a seventh wiring roller 2124a and an eighth wiring roller 2124b. The fifth wiring roller 2123a and the seventh wiring roller 2124a are arranged coaxially, and the sixth wiring roller 2123b and the eighth wiring roller 2124b are arranged coaxially. The cutting wire 10 is wound between the fifth wiring roller 2123a and the sixth wiring roller 2123b to form the third cutting line segment 10g, and the cutting wire 10 is wound between the seventh wiring roller 2124a and the eighth wiring roller 2124b to form the fourth cutting line segment 10h.

[0104] Specifically, such as Figures 1 to 4 As shown, the axes of the first wire-laying roller 2111a and the second wire-laying roller 2111b in the first pair of cutting rollers 2111 are parallel, and the axes of the third wire-laying roller 2113a and the fourth wire-laying roller 2113b in the second pair of cutting rollers 2113 are parallel. The axes of the first wire-laying roller 2111a and the third wire-laying roller 2113a are coaxial, and the axes of the second wire-laying roller 2111b and the fourth wire-laying roller 2113b are coaxial. The portion of the cutting line 10 between the first wire-laying roller 2111a and the second wire-laying roller 2111b is the first cutting line segment 10e, and the portion of the cutting line 10 between the third wire-laying roller 2113a and the fourth wire-laying roller 2113b is the second cutting line segment 10f.

[0105] The axes of the fifth wire-laying roller 2123a and the sixth wire-laying roller 2123b in the third pair of cutting rollers 2123 are parallel, and the axes of the seventh wire-laying roller 2124a and the eighth wire-laying roller 2124b in the fourth pair of cutting rollers 2124 are parallel. The axes of the fifth wire-laying roller 2123a and the seventh wire-laying roller 2124a are coaxial, and the axes of the sixth wire-laying roller 2123b and the eighth wire-laying roller 2124b are coaxial. The portion of the cutting line 10 between the fifth wire-laying roller 2123a and the sixth wire-laying roller 2123b is the third cutting line segment 10g, and the portion of the cutting line 10 between the seventh wire-laying roller 2124a and the eighth wire-laying roller 2124b is the fourth cutting line segment 10h.

[0106] Cutting wire 10 is wound around the eight wire guides mentioned above to form a grid-like wire mesh for cutting square bars.

[0107] Optionally, refer to Figure 7 The second wiring wheel 2111b and the fourth wiring wheel 2113b are both connected to the first drive motor M1. The first drive motor M1 drives the second wiring wheel 2111b and the fourth wiring wheel 2113b to rotate synchronously. The first cutting segment 10e is transmitted along the direction from the first wiring wheel 2111a to the second wiring wheel 2111b, and the second cutting segment 10f is transmitted along the direction from the third wiring wheel 2113a to the fourth wiring wheel 2113b; and / or,

[0108] The sixth wiring wheel 2123b and the eighth wiring wheel 2124b are connected to the second drive motor M2. The second drive motor M2 is used to drive the sixth wiring wheel 2123b and the eighth wiring wheel 2124b to rotate synchronously. The third cutting line segment 10g is transmitted along the direction from the fifth wiring wheel 2123a to the sixth wiring wheel 2123b, and the fourth cutting line segment 10h is transmitted along the direction from the seventh wiring wheel 2124a to the eighth wiring wheel 2124b.

[0109] Specifically, Figure 4 A schematic diagram is given showing the two wiring wheels in the cutting assembly 21 connected to the bracket using a single through shaft. Figure 4 On this basis, Figure 7 The drive configuration scheme corresponding to this silicon rod cutting device is given. For example... Figure 7As illustrated, when two wire wheels in any cutting assembly 21 are connected to the bracket via a through shaft, the rotation parameters of the two wire wheels on the through shaft are exactly the same. For the aforementioned two pairs of parallel wire meshes, the tension of the wire mesh is improved when the cutting line 10 in at least one pair of parallel wire meshes is tightened during unidirectional transmission. Therefore, by connecting the second wire wheel 2111b and the third wire wheel 2113a together to the first drive motor M1, when the first drive motor M1 rotates, it drives the second wire wheel 2111b and the fourth wire wheel 2113b to rotate synchronously. The second wire wheel 2111b and the fourth wire wheel 2113b, as the driving wheels around which the cutting line 10 is wound, can generate tension on the first wire wheel 2111a and the third wire wheel 2113a around which the cutting line 10 is wound through the cutting line 10. That is, the cutting line segments 10e and 10f can be tightened and straightened at this time.

[0110] Similar to the principle described above, in order to achieve 10g and 10h tension and straightening of the cut line segments, such as... Figure 7 As illustrated, the sixth wire wheel 2123b and the eighth wire wheel 2124b can also be connected to the second drive motor M2. The second drive motor M2 drives the sixth wire wheel 2123b and the eighth wire wheel 2124b to rotate actively and provide the tension required to the cutting line segments 10g and 10h.

[0111] Of course, it is understandable that if it is necessary to achieve the tensioning effect on two pairs of parallel wire meshes at the same time, the first drive motor M1 and the second drive motor M2 can be applied simultaneously, referring to the description of the above embodiment.

[0112] Optionally, refer to Figure 7 The first wiring wheel 2111a and the third wiring wheel 2113a are both connected to the third drive motor M3, which drives the first wiring wheel 2111a and the third wiring wheel 2113a to rotate synchronously. The first cutting line segment 10e is reciprocated between the first wiring wheel 2111a and the second wiring wheel 2111b, and the second cutting line segment 10f is reciprocated between the third wiring wheel 2113a and the fourth wiring wheel 2113b; and / or,

[0113] The fifth wiring wheel 2123a and the seventh wiring wheel 2124a are connected to the fourth drive motor M4. The fourth drive motor M4 is used to drive the fifth wiring wheel 2123a and the seventh wiring wheel 2124a to rotate synchronously. The third cutting segment 10g is reciprocated between the fifth wiring wheel 2123a and the sixth wiring wheel 2123b, and the fourth cutting segment 10h is reciprocated between the seventh wiring wheel 2124a and the eighth wiring wheel 2124b.

[0114] Specifically, such as Figure 7 As illustrated, for the aforementioned two pairs of parallel wire meshes, the tension of the cutting wire 10 in at least one pair of parallel wire meshes is improved by being taut during reciprocating transmission. Therefore, in addition to using the aforementioned first drive motor M1 to drive the second wiring wheel 2111b and the fourth wiring wheel 2113b as driving wheels, the first wiring wheel 2111a and the third wiring wheel 2113a can also be connected to the third drive motor M3. By controlling the third drive motor M3 through the controller to drive the first wiring wheel 2111a and the third wiring wheel 2113a to rotate, the first wiring wheel 2111a and the third wiring wheel 2113a can act as driving wheels, ensuring that the cutting wire segments 10e and 10f are also taut and straightened during reverse transmission. It can be seen that by controlling the first drive motor M3 and the third drive motor M3 to operate at different time periods, the tension of the cutting wire segments 10e and 10f can be improved during reciprocating transmission.

[0115] Similar to the principles described above, such as Figure 7 As illustrated, the fifth wiring wheel 2123a and the seventh wiring wheel 2124a can be connected together to the fourth drive motor M4. The fourth drive motor M4 drives the fifth wiring wheel 2123a and the seventh wiring wheel 2124a to rotate actively and provide the tension required for the cutting line segments 10g and 10h, so that the cutting line segments 10g and 10h can also be stretched and straightened when they are transmitted in the opposite direction.

[0116] Of course, it is understandable that if it is necessary to ensure the tension of the cutting line when the two pairs of parallel wire meshes are transmitted back and forth, referring to the description of the above embodiment, the third drive motor M3 and the fourth drive motor M4 can be connected and used at the same time while using the first drive motor M1 and the second drive motor M2.

[0117] Optionally, refer to Figure 8 The second wiring wheel 2111b is connected to the first drive motor M1, which drives the second wiring wheel 2111b to rotate. The first cutting line segment 10e is transmitted along the direction from the first wiring wheel 2111a to the second wiring wheel 2111b; and / or,

[0118] The third wiring wheel 2113a is connected to the second drive motor M2, which drives the third wiring wheel 2113a to rotate. The second cutting line segment 10f is transmitted along the direction from the fourth wiring wheel 2113b to the third wiring wheel 2113a; and / or

[0119] The fifth wiring wheel 2123a is connected to the third drive motor M3, which drives the fifth wiring wheel 2123a to rotate. The third cutting line segment 10g is transmitted along the direction from the sixth wiring wheel 2123b to the fifth wiring wheel 2123a; and / or

[0120] The eighth wiring wheel 2124b is connected to the fourth drive motor M4, which drives the eighth wiring wheel 2124b to rotate. The fourth cutting line segment 10h is transmitted along the direction from the seventh wiring wheel 2124a to the eighth wiring wheel 2124b.

[0121] Specifically, Figure 6 A schematic diagram is provided showing the two wiring wheels in the cutting assembly 21 connected to the bracket by two half-shafts. In this cutting device, since each wiring wheel can be driven independently, the tension of the cutting wire 10 can be monitored. By monitoring the tension changes of the cutting wire 10, the output parameters of the drive motor on each wiring wheel can be adaptively adjusted to compensate for the tension attenuation of the cutting wire 10 at different wiring wheels. It should be noted that when the two wiring wheels are connected by two half-shafts, since the two coaxially arranged wiring wheels can rotate in opposite directions, therefore, as... Figure 6 As illustrated, the wiring path can also be changed by removing some guide wheels and adjusting the direction of other guide wheels to form two parallel wire meshes of upper and lower layers.

[0122] exist Figure 6 On this basis, Figure 8 The drive configuration scheme corresponding to this silicon rod cutting device is given. For example... Figure 8 As illustrated, when two wire-laying wheels in any cutting assembly 21 are each connected to the bracket via two half-shafts, the rotation parameters of the two coaxially arranged wire-laying wheels can be the same or different. In order to tension at least one segment of the cutting line 10, a drive motor can be connected to the wire-laying wheel around which the corresponding cutting line segment is wound, so that the wire-laying wheel operates as the driving wheel.

[0123] Taking the tensioning of the first cut line segment 10e as an example, the second wire wheel 2111b can be connected to the first drive motor M1. When the first drive motor M1 rotates, it can drive the second wire wheel 2111b to rotate. The second wire wheel 2111b acts as the driving wheel and pulls the first cut line segment 10e along the direction from the first wire wheel 2111a to the second wire wheel 2111b, so that it is tensioned.

[0124] Similarly, a second drive motor M2 can be connected to the third wiring wheel 2113a around which the second cutting segment 10f is wound to tension the second cutting segment 10f; a third drive motor M3 can be connected to the fifth wiring wheel 2123a around which the third cutting segment 10g is wound to tension the third cutting segment 10g; and a fourth drive motor M4 can be connected to the eighth wiring wheel 2124b around which the fourth cutting segment 10h is wound to tension the fourth cutting segment 10h. It is understood that the number of drive motors in this silicon rod cutting device and their connection positions can be determined based on the cutting segment to be tensioned, and this embodiment of the invention does not limit this.

[0125] Optionally, refer to Figure 8 The first wiring wheel 2111a is connected to the fifth drive motor M5, which drives the first wiring wheel 2111a to rotate. The first cutting line segment 10e is reciprocated between the first wiring wheel 2111a and the second wiring wheel 2111b; and / or,

[0126] The fourth wiring wheel 2113b is connected to the sixth drive motor M6, which drives the fourth wiring wheel 2113b to rotate. The second cutting segment 10f is reciprocated between the third wiring wheel 2113a and the fourth wiring wheel 2113b; and / or,

[0127] The sixth wiring wheel 2123b is connected to the seventh drive motor M7, which drives the sixth wiring wheel 2123b to rotate. The third cutting segment 10g is reciprocated between the fifth wiring wheel 2123a and the sixth wiring wheel 2123b; and / or,

[0128] The seventh wiring wheel 2124a is connected to the eighth drive motor M8, which drives the seventh wiring wheel 2124a to rotate. The fourth cutting line segment 10h is reciprocated between the seventh wiring wheel 2124a and the eighth wiring wheel 2124b.

[0129] Specifically, such as Figure 8 The diagram illustrates the wiring structure of the cutting line 10 when the two wiring wheels in the cutting assembly 21 are each connected to the bracket with two half shafts. For at least one cutting line segment, both wiring wheels can be connected to a drive motor to ensure that the cutting line segment can be effectively tensioned during reciprocating transmission.

[0130] Taking tensioning during the reciprocating transmission of the first cutting segment 10e as an example, in addition to connecting the second wiring wheel 2111b to the first drive motor M1, the first wiring wheel 2111a can also be connected to the fifth drive motor M5.

[0131] The fifth drive motor M5 is used to drive the first wiring wheel 2111a to rotate, and the first cutting line segment 10e is reciprocated between the first wiring wheel 2111a and the second wiring wheel 2111b; and / or

[0132] When the fifth drive motor M5 rotates, it can drive the first wiring wheel 2111a to rotate. The first wiring wheel 2111a acts as the driving wheel and pulls the first cutting line segment 10e in the direction from the second wiring wheel 2111b to the first wiring wheel 2111a, so that it can be tensioned when it is transmitted in the reverse direction.

[0133] Similar to the above principle, a sixth drive motor M6 can also be connected to the fourth wiring wheel 2113b corresponding to the second cutting line segment 10f to achieve tensioning of the reciprocating transmission of the second cutting line segment 10f;

[0134] A seventh drive motor M7 is connected to the sixth wiring wheel 2123b corresponding to the third cutting segment 10g to achieve tensioning of the reciprocating transmission of the third cutting segment 10g; an eighth drive motor M8 is connected to the seventh wiring wheel 2124a corresponding to the fourth cutting segment 10h to achieve tensioning of the reciprocating transmission of the fourth cutting segment 10h. It is understood that the number of drive motors in this silicon rod cutting device and their connection positions can be determined based on which cutting segment requires reciprocating transmission, and this embodiment of the invention does not limit this.

[0135] This invention also provides a silicon rod processing device, which includes any of the aforementioned silicon rod cutting devices.

[0136] Specifically, embodiments of the present invention also provide a silicon rod processing device that uses the aforementioned silicon rod cutting device. In addition to the silicon rod cutting device, this silicon rod processing device may also include devices required for different processes, such as silicon rod conveying and transfer devices and polishing devices. While meeting the silicon rod cutting quality requirements, it can further improve the automation level of silicon rod processing, which helps to improve the quality and efficiency of silicon rod processing.

[0137] This invention also provides a silicon rod cutting control method, which is used in any of the aforementioned silicon rod cutting devices, and includes:

[0138] The rotation parameters of the wiring wheel into which the cutting wire is wound are controlled to be greater than the rotation parameters of the wiring wheel from which the cutting wire is wound, so that the cutting wire segment is in a taut state. The rotation parameters include either rotational speed or torque.

[0139] Specifically, when using the silicon rod cutting apparatus of any of the aforementioned embodiments to cut silicon rods, the cutting program can be preset in the controller of the silicon rod cutting apparatus. By setting rotational parameters such as the rotational speed or torque of each wiring wheel, the rotational parameter of the wiring wheel around which the cutting wire is wound can be made greater than the rotational parameter of the wiring wheel around which the cutting wire is wound. This allows for a stretching effect on the corresponding cutting segment, keeping the cutting segment taut and achieving tension optimization.

[0140] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0141] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A silicon rod cutting apparatus, characterized by, The silicon rod cutting device is provided with a cutting line for cutting a to-be-processed silicon rod, and comprises a support and N cutting assemblies (N≥2); Each cutting assembly is connected with the support; The cutting line is sequentially arranged through each cutting assembly, and forms parallel line networks in each cutting assembly, each parallel line network comprising two mutually parallel cutting line segments, and N parallel line networks are stacked in layers; In the stacking direction, the projections of the N parallel line networks are staggered to form a closed polygon, so as to cut the to-be-processed silicon rod into a polygonal silicon rod; The N cutting assemblies comprise a first cutting assembly; The first cutting assembly comprises a first pair of cutting rollers, a first guide wheel set and a second pair of cutting rollers; The cutting line is sequentially arranged through the first pair of cutting rollers, the first guide wheel set and the second pair of cutting rollers; The first guide wheel set comprises a first guide wheel, a second guide wheel and a third guide wheel; The cutting line is sequentially arranged through the first guide wheel, the second guide wheel and the third guide wheel, wherein the axis of the second guide wheel is perpendicular to the axes of the first guide wheel and the third guide wheel.

2. The silicon-rod dicing apparatus according to claim 1, wherein Each cutting assembly comprises two pairs of cutting rollers, and the axes of the two wire wheels of each pair of cutting rollers are parallel; The distance between the two pairs of cutting rollers is not more than twice the diameter of the to-be-processed silicon rod.

3. The silicon-rod dicing apparatus according to claim 1 or 2, wherein The N cutting assemblies further comprise a second cutting assembly; The cutting line forms a first parallel line network in the first cutting assembly, and forms a second parallel line network in the second cutting assembly; In the stacking direction, the projections of the first parallel line network and the second parallel line network are staggered to form a quadrilateral.

4. The silicon rod cutting device according to claim 3, wherein The first pair of cutting rollers, the first guide wheel set and the second pair of cutting rollers are all rotatable relative to the support; The first guide wheel set is used to guide the cutting line to switch from the first pair of cutting rollers to the second pair of cutting rollers; The cutting line forms a first cutting line segment between the first pair of cutting rollers, and forms a second cutting line segment between the second pair of cutting rollers, and the first cutting line segment and the second cutting line segment are mutually parallel to form the first parallel line network.

5. The silicon-rod dicing apparatus according to claim 4, wherein The second cutting assembly comprises a second guide wheel set, a third guide wheel set, a third pair of cutting rollers and a fourth pair of cutting rollers; The second guide wheel set, the third guide wheel set, the third pair of cutting rollers and the fourth pair of cutting rollers are all rotatable relative to the support; After the cutting line is wound out of the second pair of cutting rollers, it is sequentially arranged through the second guide wheel set, the third pair of cutting rollers, the third guide wheel set and the fourth pair of cutting rollers, the second guide wheel set is used to guide the cutting line to switch from the second pair of cutting rollers to the third pair of cutting rollers, and the third guide wheel set is used to guide the cutting line to switch from the third pair of cutting rollers to the fourth pair of cutting rollers; The cutting line forms a third cutting line segment between the third pair of cutting rollers, and forms a fourth cutting line segment between the fourth pair of cutting rollers, and the third cutting line segment and the fourth cutting line segment are mutually parallel to form the second parallel line network.

6. The silicon-rod dicing apparatus according to claim 5, wherein The second guide wheel set comprises a fourth guide wheel and a fifth guide wheel; The cutting line is sequentially arranged through the fourth guide wheel and the fifth guide wheel, wherein the fourth guide wheel and the fifth guide wheel are located in the same plane.

7. The silicon-rod dicing apparatus according to claim 5, wherein The third guide wheel set comprises a sixth guide wheel, a seventh guide wheel and an eighth guide wheel; The cutting line is sequentially arranged through the sixth guide wheel, the seventh guide wheel and the eighth guide wheel, wherein the axis of the seventh guide wheel is perpendicular to the axis of the sixth guide wheel and the axis of the eighth guide wheel.

8. The silicon-rod dicing apparatus according to claim 3, wherein The first plane where the first parallel line net is located is spaced apart from the second plane where the second parallel line net is located by a preset distance.

9. A silicon rod cutting apparatus, characterized by, The silicon rod cutting device is provided with a cutting line for cutting a to-be-processed silicon rod, and comprises a support and N cutting assemblies, N≥2. Each cutting assembly comprises two pairs of cutting rollers, each pair of cutting rollers comprises two winding wheels, the axes of the two winding wheels are parallel, and the two winding wheels are connected with the support, the cutting line is wound out from one of the winding wheels and wound into the other winding wheel to form a straight cutting line segment. The rotation parameter of the winding wheel into which the cutting line is wound is greater than the rotation parameter of the winding wheel from which the cutting line is wound. The cutting line forms a parallel line net in each cutting assembly, each parallel line net comprises two parallel cutting line segments, and N parallel line nets are stacked in layers. In the stacking direction, the projections of the N parallel line nets are staggered to form a closed polygon, so as to cut the to-be-processed silicon rod into a polygonal silicon rod. The N cutting assemblies comprise a first cutting assembly. The first cutting assembly comprises a first pair of cutting rollers, a first guide wheel set and a second pair of cutting rollers. The cutting line is sequentially arranged through the first pair of cutting rollers, the first guide wheel set and the second pair of cutting rollers. The first guide wheel set comprises a first guide wheel, a second guide wheel and a third guide wheel. The cutting line is sequentially arranged through the first guide wheel, the second guide wheel and the third guide wheel, wherein the axis of the second guide wheel is perpendicular to the axis of the first guide wheel and the axis of the third guide wheel.

10. The silicon-rod dicing apparatus according to claim 9, wherein The N cutting assemblies further comprise a first cutting assembly. The cutting line forms a first parallel line net in the first cutting assembly, and the cutting line forms a second parallel line net in the second cutting assembly. In the stacking direction, the projection of the first parallel line net and the second parallel line net are staggered to form a quadrilateral.

11. The silicon rod cutting device according to claim 10, wherein The cutting line forms a first cutting line segment between the first pair of cutting rollers, the cutting line forms a second cutting line segment between the second pair of cutting rollers, and the first cutting line segment and the second cutting line segment are parallel to each other to form the first parallel line net; The second cutting assembly comprises a third pair of cutting rollers and a fourth pair of cutting rollers, the cutting line forms a third cutting line segment between the third pair of cutting rollers, the cutting line forms a fourth cutting line segment between the fourth pair of cutting rollers, and the third cutting line segment and the fourth cutting line segment are parallel to each other to form the second parallel line net.

12. The silicon-rod dicing apparatus according to claim 11, wherein The first pair of cutting rollers comprises a first wire wheel and a second wire wheel, the second pair of cutting rollers comprises a third wire wheel and a fourth wire wheel, the first wire wheel and the third wire wheel are coaxially arranged, and the second wire wheel and the fourth wire wheel are coaxially arranged; The cutting wire is wound between the first wire wheel and the second wire wheel to form the first cutting wire segment, and the cutting wire is wound between the third wire wheel and the fourth wire wheel to form the second cutting wire segment; The third pair of cutting rollers comprises a fifth wire wheel and a sixth wire wheel, the fourth pair of cutting rollers comprises a seventh wire wheel and an eighth wire wheel, the fifth wire wheel and the seventh wire wheel are coaxially arranged, and the sixth wire wheel and the eighth wire wheel are coaxially arranged; The cutting wire is wound between the fifth wire wheel and the sixth wire wheel to form the third cutting wire segment, and the cutting wire is wound between the seventh wire wheel and the eighth wire wheel to form the fourth cutting wire segment.

13. The silicon-rod dicing apparatus according to claim 12, wherein The second wire wheel and the fourth wire wheel are connected with a first driving motor, the first driving motor is used for driving the second wire wheel and the fourth wire wheel to rotate synchronously, the first cutting wire segment is transmitted in the direction from the first wire wheel to the second wire wheel, and the second cutting wire segment is transmitted in the direction from the third wire wheel to the fourth wire wheel; And / or, The sixth wire wheel and the eighth wire wheel are connected with a second driving motor, the second driving motor is used for driving the sixth wire wheel and the eighth wire wheel to rotate synchronously, the third cutting wire segment is transmitted in the direction from the fifth wire wheel to the sixth wire wheel, and the fourth cutting wire segment is transmitted in the direction from the seventh wire wheel to the eighth wire wheel.

14. The silicon-rod dicing apparatus according to claim 13, wherein The first wire wheel and the third wire wheel are connected with a third driving motor, the third driving motor is used for driving the first wire wheel and the third wire wheel to rotate synchronously, the first cutting wire segment is reciprocated between the first wire wheel and the second wire wheel, and the second cutting wire segment is reciprocated between the third wire wheel and the fourth wire wheel; And / or, The fifth wire wheel and the seventh wire wheel are connected with a fourth driving motor, the fourth driving motor is used for driving the fifth wire wheel and the seventh wire wheel to rotate synchronously, the third cutting wire segment is reciprocated between the fifth wire wheel and the sixth wire wheel, and the fourth cutting wire segment is reciprocated between the seventh wire wheel and the eighth wire wheel.

15. The silicon-rod dicing apparatus according to claim 12, wherein The second wire wheel is connected with a first driving motor, the first driving motor is used for driving the second wire wheel to rotate, and the first cutting wire segment is transmitted in the direction from the first wire wheel to the second wire wheel; And / or, The third wire wheel is connected with a second driving motor, the second driving motor is used for driving the third wire wheel to rotate, and the second cutting wire segment is transmitted in the direction from the fourth wire wheel to the third wire wheel; And / or, The fifth routing wheel is connected with a third driving motor, the third driving motor is used for driving the fifth routing wheel to rotate, and the third cutting line segment is transmitted in a direction from the sixth routing wheel to the fifth routing wheel. And / or, The eighth routing wheel is connected with a fourth driving motor, the fourth driving motor is used for driving the eighth routing wheel to rotate, and the fourth cutting line segment is transmitted in a direction from the seventh routing wheel to the eighth routing wheel.

16. The silicon rod cutting device according to claim 15, wherein, The first routing wheel is connected with a fifth driving motor, the fifth driving motor is used for driving the first routing wheel to rotate, and the first cutting line segment is reciprocally transmitted between the first routing wheel and the second routing wheel. And / or, The fourth routing wheel is connected with a sixth driving motor, the sixth driving motor is used for driving the fourth routing wheel to rotate, and the second cutting line segment is reciprocally transmitted between the third routing wheel and the fourth routing wheel. And / or, The sixth routing wheel is connected with a seventh driving motor, the seventh driving motor is used for driving the sixth routing wheel to rotate, and the third cutting line segment is reciprocally transmitted between the fifth routing wheel and the sixth routing wheel. And / or, The seventh routing wheel is connected with an eighth driving motor, the eighth driving motor is used for driving the seventh routing wheel to rotate, and the fourth cutting line segment is reciprocally transmitted between the seventh routing wheel and the eighth routing wheel.

17. A silicon rod processing apparatus characterized by comprising: The silicon rod processing equipment comprises the silicon rod cutting device according to any one of claims 1 to 16.

18. A method of controlling a silicon rod cutting, characterized by, The silicon rod cutting control method is used for the silicon rod cutting device according to any one of claims 1 to 16, and the silicon rod cutting control method comprises the following steps: The rotation parameter of the routing wheel into which the cutting line is wound is greater than the rotation parameter of the routing wheel out of which the cutting line is wound, so that the cutting line segment is in a taut state, wherein the rotation parameter comprises any one of a rotating speed and a torque.

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