Epoxy resin composition, method for preparing the same, display module, and display device

Abstract

This application relates to an epoxy resin composition and its preparation method, a display module, and a display device. By weight, the epoxy resin composition comprises the following components: 3-10 parts epoxy resin, 0.8-3 parts silicone resin, 2-10 parts methacrylic acid resin, 2-10 parts melamine-urea-formaldehyde resin, 1.5-6 parts amine curing agent, 1-3 parts filler, 0.5-2 parts coupling agent, and 46-80 parts alcohol. The methacrylic acid resin and melamine-urea-formaldehyde resin interact with each other, and further combine with the epoxy resin and silicone resin, as well as with other components in a specific ratio, effectively improving the moisture-proof performance of the encapsulation film layer formed using this epoxy resin composition.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to an epoxy resin composition and its preparation method, a display module and a display device. Background Technology

[0002] LED displays are a type of display composed of LED display modules. Compared with LCD displays, LED displays have better image detail, higher contrast and true color reproduction, longer lifespan, lower power consumption, and can be assembled in unlimited sizes.

[0003] In recent years, as the pixel pitch of LED display modules has become smaller, the image detail and grayscale have also increased. Modules have evolved from SMD and mask-mount processes to small-pitch (below P2) and Mini LED / Micro LED modules (below P1.0) using COB (chip-on-board) and COG (chip-on-board) packaging forms. With the improvement of COB technology, large-pitch and small-pitch outdoor fixed installations and rental markets have become a trend. However, regardless of whether used outdoors or indoors, traditional COB display modules are prone to delamination due to moisture in environments with significant humidity differences, varying day-night humidity, and seasonal or diurnal temperature variations. Summary of the Invention

[0004] Based on this, this application provides an epoxy resin composition with good moisture resistance, a method for preparing the same, a display module, and a display device.

[0005] The technical solution to the above-mentioned technical problems in this application is as follows.

[0006] The first aspect of this application provides an epoxy resin composition comprising, by weight parts:

[0007] 3-10 parts epoxy resin

[0008] 0.8-3 parts of silicone resin

[0009] 2-10 parts of methacrylic resin

[0010] 2-10 parts of melamine urea-formaldehyde resin

[0011] 1.5-6 parts of amine curing agent

[0012] 1-3 parts of filler

[0013] Coupling agent 0.5-2 parts, and

[0014] 56-80 parts of alcohol.

[0015] In some embodiments, the epoxy resin composition comprises, by weight parts:

[0016] 5-10 parts epoxy resin

[0017] 1-3 parts of silicone resin

[0018] 3-8 parts of methacrylic resin

[0019] 4-8 parts of melamine urea-formaldehyde resin

[0020] 2-4 parts of amine curing agent

[0021] 2-3 parts of filler

[0022] 1-2 parts of coupling agent, and

[0023] 58-75 parts of alcohol.

[0024] In some embodiments, the ratio of the total mass of the methacrylic resin and the melamine-urea-formaldehyde resin to the total mass of the silicone resin and the epoxy resin in the epoxy resin composition is (1~4):1.

[0025] In some embodiments, the mass ratio of the melamine urea-formaldehyde resin to the methacrylic resin in the epoxy resin composition is (0.5~3):1.

[0026] In some embodiments, the epoxy resin composition has a mass ratio of epoxy resin to silicone resin of (1.5~6):1.

[0027] In some embodiments, the amine curing agent in the epoxy resin composition includes at least one of polyamide, fatty amine, and polyamide.

[0028] In some embodiments, the alcohol in the epoxy resin composition includes at least one of propylene glycol, n-propanol, and isopropanol.

[0029] In some embodiments, the filler in the epoxy resin composition includes at least one of mica powder and silicon powder.

[0030] In some embodiments, the coupling agent in the epoxy resin composition is at least one of a silane coupling agent and a titanate coupling agent.

[0031] In some embodiments, the epoxy resin composition further includes, by weight, 5 to 10 parts of nano-silica.

[0032] In some embodiments, the epoxy resin composition further comprises, by weight parts: 3.75-15 parts of propylene glycol methyl ether acetate, 0.25-1 part of dispersant, 0.65-2.6 parts of butyl acetate, and 0.35-1.4 parts of melanin.

[0033] In some embodiments, the dispersant in the epoxy resin composition includes at least one of STA-1110A, RD-9107, LS3050, water glass, sodium humate, sodium hexametaphosphate, sodium tripolyphosphate, CMC, and sodium citrate.

[0034] In some embodiments, the epoxy resin composition has a viscosity of 50 mPa·s to 200 mPa·s.

[0035] A second aspect of this application provides a method for preparing an epoxy resin composition, comprising the following steps:

[0036] Raw materials are provided according to the components of the epoxy resin composition provided in the first aspect of this application, and the raw materials are mixed.

[0037] The third aspect of this application provides an epoxy resin film layer, which is obtained by curing the epoxy resin composition provided in the first aspect of this application.

[0038] The fourth aspect of this application provides a display module, including a display module body and an encapsulation film layer, wherein the encapsulation film layer is disposed on the display module body and the encapsulation film layer includes the aforementioned epoxy resin film layer.

[0039] The fifth aspect of this application provides a display device, including the display module provided in the fifth aspect of this application.

[0040] Compared with the prior art, the epoxy resin composition of this application has the following beneficial effects:

[0041] The above-mentioned epoxy resin composition includes epoxy resin, silicone resin, methacrylic resin, melamine urea-formaldehyde resin, amine curing agent, filler, coupling agent and alcohol. The methacrylic resin and melamine urea-formaldehyde resin interact with each other, and are further combined with epoxy resin and silicone resin, as well as with other components in a specific ratio, which can effectively improve the moisture-proof performance of the encapsulation film formed by the epoxy resin composition. Detailed Implementation

[0042] Reference will now be made to detailed embodiments of the present invention, one or more of which are described below. Each example is provided for explanation and not for limitation of the invention. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made to the invention without departing from its scope or spirit. For example, features described or illustrated as part of one embodiment may be used in another embodiment to produce further embodiments.

[0043] Therefore, this invention is intended to cover such modifications and variations falling within the scope of the appended claims and their equivalents. Other objects, features, and aspects of the invention are disclosed in or will be apparent from the following detailed description. It will be understood by those skilled in the art that this discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the invention.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0045] The terms “comprising,” “including,” or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element preceded by the phrase “comprising one…” does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The indefinite articles “a” and “an” preceding an element or component of the invention are not restrictive in terms of the number of elements or components (i.e., the number of times they appear). Therefore, “an” or “an” should be interpreted as including one or at least one, and singular elements or components also include plural forms, unless the quantity clearly refers only to the singular. “A plurality” means at least two, such as two, three, etc., unless otherwise expressly specified.

[0046] The weights of the relevant components mentioned in the embodiments of this invention can refer not only to the specific content of each component, but also to the proportional relationship between the weights of the components. Therefore, any scaling up or down of the content of the relevant components according to the embodiments of this invention is within the scope disclosed in the embodiments of this invention. Specifically, the weights mentioned in the embodiments of this invention can be well-known units of mass in the chemical industry, such as μg, mg, g, and kg.

[0047] Unless otherwise shown or indicated in the operational embodiments, all figures used to represent the amounts, physicochemical properties, etc., of ingredients in the specification and claims are to be understood to be adjusted by the term "about" in all cases. For example, therefore, unless stated to the contrary, the numerical parameters listed in the foregoing specification and appended claims are approximations, and those skilled in the art can appropriately modify these approximations to obtain the desired characteristics by utilizing the teachings disclosed herein. The use of numerical ranges indicated by endpoints includes all numbers within that range and any range within that range; for example, 1 to 5 includes 1, 1.1, 1.3, 1.5, 2, 2.75, 3, 3.80, 4, and 5, etc.

[0048] One embodiment of this application provides an epoxy resin composition comprising, by weight parts:

[0049] 3-10 parts epoxy resin

[0050] 0.8-3 parts of silicone resin

[0051] 2-10 parts of methacrylic resin

[0052] 2-10 parts of melamine urea-formaldehyde resin

[0053] 1.5-6 parts of amine curing agent

[0054] 1-3 parts of filler

[0055] Coupling agent 0.5-2 parts, and

[0056] 56-80 parts of alcohol.

[0057] The above-mentioned epoxy resin composition includes epoxy resin, silicone resin, methacrylic resin, melamine urea-formaldehyde resin, amine curing agent, filler, coupling agent and alcohol. The methacrylic resin and melamine urea-formaldehyde resin interact with each other, and are further combined with epoxy resin and silicone resin, as well as with other components in a specific ratio, which can effectively improve the moisture-proof performance of the encapsulation film formed by the epoxy resin composition.

[0058] Meanwhile, the epoxy resin composition has good fluidity and is easy to apply evenly; and the encapsulation film formed by the epoxy resin composition has high hardness, with a pencil hardness > 4.5H, which effectively avoids the moisture-proof effect being affected by factors such as friction during operation.

[0059] It is understood that in the epoxy resin composition, the mass fractions of epoxy resin include, but are not limited to, 3, 4, 5, 6, 7, 8, 9, and 10 parts; the mass fractions of silicone resin include, but are not limited to, 0.8, 1, 1.2, 1.5, 1.8, 2, 2.2, 2.5, 2.8, and 3 parts; the mass fractions of methacrylic acid resin include, but are not limited to, 2, 3, 4, 5, 6, 7, 8, 9, and 10 parts; the mass fractions of melamine-urea-formaldehyde resin include, but are not limited to, 2, 3, 4, 5, 6, 7, 8, 9, and 10 parts; and the mass fractions of amine curing agent include, but are not limited to, 2, 3, 4, 5, 6, 7, 8, 9, and 10 parts. The mass fractions include, but are not limited to, 1.5 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, 2.8 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.2 parts, 5.5 parts, 5.8 parts, and 6 parts; the mass fractions of the filler include, but are not limited to, 1 part, 1.2 parts, 1.5 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, 2.8 parts, and 3 parts; the mass fractions of the coupling agent include, but are not limited to, 0.5 parts, 0.8 parts, 1 part, 1.2 parts, 1.5 parts, 1.8 parts, and 2 parts; the mass fractions of the alcohol include, but are not limited to, 56 parts, 60 parts, 65 parts, 70 parts, 75 parts, 78 parts, and 80 parts. In some examples, any two of these point values ​​can be used as the endpoints within a range, and the same applies below.

[0060] It is understood that the mass percentage relationship between the components in the above epoxy resin composition can also be expressed as a mass percentage relationship, such as:

[0061] In some of these examples, the epoxy resin composition comprises, by mass percentage, the following components:

[0062] Epoxy resin 3%~10%,

[0063] Organosilicon resin 0.8%~3%,

[0064] 2%~10% methacrylic resin

[0065] Melamine urea-formaldehyde resin 2%~10%

[0066] Amine curing agents 1.5%~6%,

[0067] Filler 1%~3%,

[0068] Coupling agent 0.5%~2%, and

[0069] Alcohol content: 56%–80%.

[0070] In some of these examples, the epoxy resin composition comprises, by weight, the following components:

[0071] 5-10 parts epoxy resin

[0072] 1-3 parts of silicone resin

[0073] 3-8 parts of methacrylic resin

[0074] 4-8 parts of melamine urea-formaldehyde resin

[0075] 2-4 parts of amine curing agent

[0076] 2-3 parts of filler

[0077] 1-2 parts of coupling agent, and

[0078] 58-75 parts of alcohol.

[0079] In some of these examples, the epoxy resin composition comprises, by weight, the following components:

[0080] 5-8 parts epoxy resin

[0081] 1-2 parts of silicone resin

[0082] 4-6 parts of methacrylic resin

[0083] 5-7 parts of melamine urea-formaldehyde resin

[0084] 3-4 parts of amine curing agent

[0085] 2-3 parts of filler

[0086] 1-2 parts of coupling agent, and

[0087] 58-75 parts of alcohol.

[0088] In some of these examples, the ratio of the total mass of methacrylic resin and melamine urea-formaldehyde resin to the total mass of silicone resin and epoxy resin in the epoxy resin composition is (1~4):1.

[0089] It can be understood that the sum of the masses of methacrylic resin and melamine-urea-formaldehyde resin is m1, and the sum of the masses of silicone resin and epoxy resin is m2, with m1 / m2 = (1~4):1. Furthermore, it can be understood that m1 / m2 includes, but is not limited to, ratios of 1:1, 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, and 4:1.

[0090] Optionally, the ratio of the sum of the masses of methacrylic resin and melamine urea-formaldehyde resin to the sum of the masses of silicone resin and epoxy resin is (1~3):1.

[0091] Furthermore, the ratio of the sum of the masses of methacrylic resin and melamine urea-formaldehyde resin to the sum of the masses of silicone resin and epoxy resin is (1.6~2):1.

[0092] In some of these examples, the mass ratio of melamine urea-formaldehyde resin to methacrylic resin in the epoxy resin composition is (0.5~3):1.

[0093] It is understood that the mass ratio of melamine urea-formaldehyde resin to methacrylic acid resin includes, but is not limited to, 0.5:1, 1:1, 1.5:1, 2:1, 2.5:1, and 3:1.

[0094] Optionally, the mass ratio of melamine urea-formaldehyde resin to methacrylic resin is (1~3):1.

[0095] Furthermore, the mass ratio of melamine urea-formaldehyde resin to methacrylic resin is (1.1~2):1.

[0096] In some of these examples, the mass ratio of epoxy resin to silicone resin in the epoxy resin composition is (1.5~6):1.

[0097] It is understood that the mass ratio of epoxy resin to silicone resin includes, but is not limited to, 1.5:1, 1.6:1, 1.7:1, 1.8:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1, and 6:1.

[0098] Optionally, the mass ratio of epoxy resin to silicone resin is (4~6):1.

[0099] In some of these examples, the amine curing agent in the epoxy resin composition includes at least one of polyamide, fatty amine, and polyamide.

[0100] In some of these examples, the alcohol in the epoxy resin composition includes at least one of propylene glycol, n-propanol, and isopropanol.

[0101] In some of these examples, the filler in the epoxy resin composition includes at least one of mica powder and silica powder.

[0102] Furthermore, the particle size of the filler is <48 μm.

[0103] In some of these examples, the coupling agent in the epoxy resin composition is at least one of a silane coupling agent and a titanate coupling agent.

[0104] It is understood that silane coupling agents include, but are not limited to, A151 (vinyltriethoxysilane), A171 (vinyltrimethoxysilane), and A172 (vinyltri(β-methoxyethoxy)silane); titanate coupling agents include, but are not limited to, isopropyl tris(isostearoyl) titanate (KR-TTS), isopropyl tris(dioctylpyrophosphoryl) titanate (KR-38S), and di(dioctylpyrophosphoryl)oxyacetate titanium (KR-138S).

[0105] In some of these examples, the epoxy resin composition further includes, by weight, 5 to 10 parts of nano-silica.

[0106] It is understood that the mass fractions of nano-silica include, but are not limited to, 5, 6, 7, 8, 9, and 10 parts.

[0107] In some of these examples, the epoxy resin composition, by weight, further comprises: 3.75 to 15 parts of propylene glycol methyl ether acetate, 0.25 to 1 part of dispersant, 0.65 to 2.6 parts of butyl acetate, and 0.35 to 1.4 parts of melanin.

[0108] It is understood that the epoxy resin composition contains 4 parts, 4.5 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, and 15 parts of propylene glycol methyl ether acetate; 0.25 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, and 1 part of dispersant; 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.5 parts, 2 parts, 2.2 parts, 2.4 parts, and 2.5 parts of butyl acetate; and 0.4 parts, 0.5 parts, 0.7 parts, 0.8 parts, 1 part, 1.2 parts, and 1.4 parts of melanin.

[0109] Optionally, the epoxy resin composition may further include, by weight parts: 5-10 parts of propylene glycol methyl ether acetate, 0.5-1 part of dispersant, 1-2 parts of butyl acetate and 0.5-1 part of melanin.

[0110] Furthermore, the dispersant includes at least one of STA-1110A, RD-9107, LS3050, water glass, sodium humate, sodium hexametaphosphate, sodium tripolyphosphate, CMC, and sodium citrate.

[0111] In some of these examples, the viscosity of the epoxy resin composition is 50 mPa·s to 200 mPa·s.

[0112] It is understood that the viscosity of the epoxy resin composition includes, but is not limited to, 50 mPa.s, 100 mPa.s, 150 mPa.s, and 200 mPa.s.

[0113] By controlling the viscosity of the epoxy composition, uniform coating and controllable thickness can be effectively achieved. Otherwise, excessive thickness may affect the splicing of the display screen and produce dark lines at the splicing.

[0114] One embodiment of this application provides a method for preparing an epoxy resin composition, comprising the following steps:

[0115] The raw materials are provided according to the components of the above epoxy resin composition, and the raw materials are mixed together.

[0116] Furthermore, in some of these examples, the mixing step in the method for preparing the epoxy resin composition includes:

[0117] (1) Mix epoxy resin, silicone resin, melamine urea-formaldehyde resin, methacrylic resin, amine curing agent, filler and coupling agent to obtain epoxy resin mixture;

[0118] (2) Mix nano-silica and alcohol to obtain a nano-silica dispersion;

[0119] (3) Mix the epoxy resin mixture and the nano silica dispersion.

[0120] It is understandable that steps (1) to (2) are not sequential.

[0121] Furthermore, in some of these examples, the mixing step also includes:

[0122] (4) Mix propylene glycol methyl ether acetate, dispersant, butyl acetate and melanin to obtain melanin paste;

[0123] (5) Mix the black slurry with the mixture obtained in step (3).

[0124] One embodiment of this application provides an epoxy resin film layer obtained by curing the above-mentioned epoxy resin composition.

[0125] The epoxy resin film obtained by curing the above epoxy resin composition has good moisture-proof performance.

[0126] One embodiment of this application provides a display module, including a display module body and an encapsulation film layer. The encapsulation film layer is disposed on the display module body and includes the epoxy resin film layer as described above.

[0127] It is understood that the display module provided above has an encapsulation film layer including the epoxy resin film layer on the display module body, which effectively improves the moisture resistance of the display module and thus prevents the display module from peeling off due to moisture.

[0128] In some examples, the epoxy resin film layer is disposed around the perimeter of the display module body. It can be understood that the perimeter of the display module body is in the thickness direction of the display module body.

[0129] In some of these examples, the epoxy resin film thickness in the module is shown to be 30 μm to 100 μm.

[0130] It is understood that the thickness of the epoxy resin film layer includes, but is not limited to, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, and 100 μm.

[0131] In some of these examples, the display module body includes a display structure and a surface encapsulation layer, which is disposed on the surface of the display structure to encapsulate the display structure.

[0132] It is understood that this application does not limit the encapsulation layer on the surface of the display structure, such as an epoxy resin encapsulation layer.

[0133] In some of these examples, the display structure is mounted on a substrate in the display module.

[0134] One embodiment of this application provides a method for manufacturing a display module, including step S10:

[0135] The epoxy resin composition described above is coated around the display module body and then cured.

[0136] In some of these examples, step S10 includes the curing step of baking at 80°C to 100°C for 3 to 5 minutes, followed by natural curing.

[0137] In some examples, in step S10, before the coating step, an easy-tear tape layer is applied to the surface of the display module body, then the coating is applied, and then the easy-tear tape layer is removed and cured.

[0138] It is understandable that the size of the easy-tear tape layer is determined by the size of the display module body. This prevents the coating from overflowing and contaminating the surface of the display module body.

[0139] In some examples, in step S10, coating is performed using a coating machine such as a dispensing machine or a potting machine.

[0140] In some of these examples, step S10 includes steps S11 to S15:

[0141] Step S11: Use a mold robotic arm to pick up easy-tear single-sided tape.

[0142] Furthermore, in step S11, the mold robotic arm is equipped with a vacuum air pressure pipe and a vacuum suction port.

[0143] Furthermore, in step S11, the thickness of the easy-tear single-sided tape is >1 mm, the width is >5 mm, and the shape is customized according to the specific product size.

[0144] Step S12: After step S11, the display module body is picked up by the mold robotic arm, so that the easy-tear single-sided adhesive tape layer is attached to the surface encapsulation layer in the display module body.

[0145] It is understandable that the display module body includes a substrate after die bonding and a surface encapsulation layer.

[0146] Step S13: Place the above epoxy resin composition into the injection needle of the coating machine, coat the display module body around its perimeter, and cure.

[0147] In some of these examples, in step S13, the injection needle is equipped with a brush.

[0148] Furthermore, the coating can be applied using a brush or a sponge, etc.

[0149] Furthermore, the coating can be applied in cylindrical or other shapes.

[0150] It's understandable that the syringe has a pneumatic tube.

[0151] It can be understood that the coated area is the perimeter of the easy-tear single-sided tape and the display module body after they are bonded together, that is, the cut surface after the easy-tear single-sided tape and the display module body are bonded together.

[0152] It is understandable that steps S11, S12, and S13 can be performed sequentially, or the epoxy resin composition can be placed in the injection needle of the coating machine for later use before performing step S11.

[0153] In some embodiments, the coating machine has an air pressure of 0.45 MPa to 0.6 MPa, an X / Y / X axis accuracy of ±0.02 mm, an adjustable glue output of 0.1 g to 1000 g, a glue output error of less than 0.5%, and a maximum moving speed of 500 mm / s.

[0154] In some of these examples, the coating machine used was the Changlin Automation CL-655G, and the dispensing port of the needle syringe was modified into a cylindrical brush head.

[0155] Traditional dispensing machines and needle-type glue dispensing machines are modified by changing the glue dispensing head, i.e., adding a customized brush to improve the accuracy of hand brushes or other machine brushes, ensuring uniform and no missed areas. At the same time, by controlling the viscosity of epoxy resin, the flow of liquid is reduced or eliminated before curing after uniform coating, thus preventing unevenness of the formed film and affecting module installation.

[0156] One embodiment of this application provides a display device including the above-described display module.

[0157] In some of these examples, the display device includes one or more of the aforementioned display modules joined together. That is, in one example, the display device may consist of a single display module. Alternatively, in another example, the display device may be a large-sized display device composed of multiple display modules joined together.

[0158] The present application will be described in further detail below with reference to specific embodiments, but the embodiments of the present application are not limited thereto.

[0159] Example 1

[0160] The components of the epoxy composition are as follows:

[0161] 6 parts epoxy resin (Shanghai Shunxinda New Material Technology 3801A), 1 part silicone resin (Kangmeite 7772), 5 parts methacrylic acid resin (Guangzhou Jingyi New Material Co., Ltd. SM 2703 / 80BACX), 6 parts melamine urea-formaldehyde resin (Jining Tangyi Chemical Co., Ltd. 563), 6 parts nano silica, 3 parts polyamide, 2 parts mica powder, 1 part coupling agent vinyltriethoxysilane (A151), 25 parts propylene glycol, 20 parts n-propanol, 20 parts isopropanol, 5 parts propylene glycol methyl ether acetate, 2 parts butyl acetate, 1 part carbon black, and 1 part water glass. The ratio of the total mass of methacrylic resin and melamine-urea-formaldehyde resin (m1) to the total mass of silicone resin and epoxy resin (m2) is approximately 1.6:1; the ratio of the mass of melamine-urea-formaldehyde resin (m3) to the mass of methacrylic resin (m4) is 1.2:1; and the ratio of the mass of epoxy resin (m5) to the mass of silicone resin (m6) is 6:1.

[0162] The addition of epoxy resin, silicone resin, methacrylic resin and melamine urea-formaldehyde resin in Examples 2 to 7 and Comparative Examples 1 to 6 is shown in Table 1. In Example 2, the proportions of each component are the same as in Example 1. The difference is that in Example 2, the filler is silica powder, the coupling agent is isopropyltris(isostearoyl)titanate (KR-TTS), the amine curing agent is polyamide, and the dispersant is sodium citrate. The other components in Examples 3 to 7 and Comparative Examples 1 to 6 are the same as in Example 1.

[0163] Table 1

[0164]

[0165] Add each component to a mixer in the specified proportions and mix thoroughly to obtain an epoxy resin matte black transparent coating.

[0166] Using Changlin Automation's CL-655G equipment, the dispensing port of the syringe was modified into a cylindrical brush head. 30g of the epoxy resin matte black transparent coating prepared in each of the embodiments and comparative examples was poured into the syringe. The air pressure of the CL-655G equipment was adjusted to 0.5 MPa, the dispensing volume to 0.1g, the brushing rotation speed to 50 rpm, and the brushing movement speed to 200 mm / s. A control program was programmed. The outdoor P1.875COB module was fixed on the syringe dispensing machine platform. The epoxy resin matte black transparent coating prepared in each of the embodiments and comparative examples was applied to the four sides of the COB module, and then sequentially placed into a tunnel curing oven and baked at 100℃ for 3-5 minutes. The coating thickness was approximately 50 μm, resulting in display modules A through M.

[0167] The display modules A through M will undergo pencil hardness and moisture resistance tests.

[0168] The pencil hardness test is as follows:

[0169] 1. Place the test piece upwards and fix it in place. Hold the pencil at a 45° angle to the test piece and scratch it forcefully, being careful not to break the lead. Scratch at a uniform speed of about 1 cm in front of the tester. The scratching speed should be 1 mm / s. After each scratch, the tip of the lead should be re-sharpened. Repeat the test 5 times using a pencil with the same hardness mark.

[0170] 2. When evaluating the damage to the coating, if the substrate or primer coating is visible in only 2 or fewer out of 5 tests, a pencil with a higher hardness mark should be used to perform the same test. When the coating is damaged more than 2 times (every 5 tests), the hardness mark of the pencil can be read at this time, and the next hardness mark of the pencil should be recorded.

[0171] The moisture-proof test steps are as follows:

[0172] 1. After the display module is placed in a 5% salt spray environment for 5 days, the dead lamp rate α (light chip failure) is tested. The lower the dead lamp rate, the better the moisture resistance. Moreover, a dead lamp rate of less than 10% is acceptable.

[0173] 2. Place the lamps at high temperature and high humidity (80℃, humidity greater than 85%) for 7 days and test the lamp failure rate (β, the failure rate of the light-emitting chip). The lower the lamp failure rate, the better the moisture-proof effect. A lamp failure rate of less than 10% is acceptable.

[0174] The test results are shown in Table 2:

[0175] Table 2

[0176]

[0177] As can be seen from Table 2, compared with the comparative examples, the epoxy resin compositions of the examples have higher pencil hardness and better moisture resistance. However, compared with Example 1, the main differences between Comparative Examples 1 to 6 are that Comparative Example 1 does not add acrylic resin, Comparative Example 2 does not add melamine urea-formaldehyde resin, Comparative Example 3 does not add silicone resin, the amount of silicone resin added in Comparative Example 4 is too large, Comparative Example 5 replaces methacrylic resin with an equal mass of vinyl ester resin, and Comparative Example 6 replaces melamine urea-formaldehyde resin with an equal mass of melamine urea-formaldehyde resin. The resulting epoxy resin compositions have lower pencil hardness, higher dead light rate, and poorer moisture resistance.

[0178] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0179] The embodiments described above are merely illustrative of several implementation methods of this application, intended to facilitate a detailed understanding of the technical solutions of this application, but should not be construed as limiting the scope of protection of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. It should be understood that technical solutions obtained by those skilled in the art based on the technical solutions provided in this application through logical analysis, reasoning, or limited experimentation are all within the scope of protection of the appended claims. Therefore, the scope of protection of this patent application should be determined by the content of the appended claims, and the specification can be used to interpret the content of the claims.

Claims

1. An epoxy resin composition, characterized by comprising: By mass parts, it includes the following components: 3-10 parts epoxy resin 0.8-3 parts of silicone resin 2-10 parts of methacrylic resin 2-10 parts of melamine urea-formaldehyde resin 1.5-6 parts of amine curing agent 1-3 parts of filler 0.5-2 parts of coupling agent and 56-80 parts of alcohol; The alcohol includes at least one of propylene glycol, n-propanol, and isopropanol.

2. The epoxy resin composition according to claim 1, wherein By mass, it includes the following components: 5-10 parts epoxy resin 1-3 parts of silicone resin 3-8 parts of methacrylic resin 4-8 parts of melamine urea-formaldehyde resin 2-4 parts of amine curing agent 2-3 parts of filler 1-2 parts of coupling agent and 58-75 parts of alcohol.

3. The epoxy resin composition according to claim 1, characterized in that, The ratio of the total mass of the methacrylic resin and the melamine-urea-formaldehyde resin to the total mass of the silicone resin and the epoxy resin is (1~4):

1.

4. The epoxy resin composition according to claim 3, characterized in that, The epoxy resin composition satisfies at least one of the following characteristics (1) to (2): (1) The mass ratio of the melamine urea-formaldehyde resin to the methacrylic acid resin is (0.5~3):1; (2) The mass ratio of the epoxy resin to the silicone resin is (1.5~6):

1.

5. The epoxy resin composition according to any one of claims 1 to 4, characterized in that, The epoxy resin composition satisfies at least one of the following characteristics (1) to (3): (1) The amine curing agent includes at least one of fatty amines and polyamides; (2) The filler includes at least one of mica powder and silicon powder; (3) The coupling agent is at least one of silane coupling agent and titanate coupling agent.

6. The epoxy resin composition according to any one of claims 1 to 4, characterized in that, The epoxy resin composition further comprises, by weight, 5-10 parts of nano-silica.

7. The epoxy resin composition according to claim 1, characterized in that, The epoxy resin composition further comprises, by weight parts: 3.75-15 parts of propylene glycol methyl ether acetate, 0.25-1 part of dispersant, 0.65-2.6 parts of butyl acetate, and 0.35-1.4 parts of melanin.

8. The epoxy resin composition according to claim 7, characterized in that, The dispersant includes at least one of STA-1110A, RD-9107, LS3050, water glass, sodium humate, sodium hexametaphosphate, sodium tripolyphosphate, CMC, and sodium citrate.

9. The epoxy resin composition according to any one of claims 1-4 and 7-8, characterized in that, The viscosity of the epoxy resin composition is 50 mPa·s to 200 mPa·s.

10. A method for preparing an epoxy resin composition, characterized in that, Includes the following steps: The raw materials are provided according to the components of the epoxy resin composition according to any one of claims 1 to 9, and the raw materials are mixed.

11. An epoxy resin film layer, characterized in that, It is obtained by curing the epoxy resin composition as described in any one of claims 1 to 9.

12. A display module, characterized in that, It includes a display module body and an encapsulation film layer, wherein the encapsulation film layer is disposed on the display module body, and the encapsulation film layer includes the epoxy resin film layer as described in claim 11.

13. A display device, characterized in that, Includes the display module as described in claim 12.

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