A headlamp and working method facilitating water vapor removal from a lampshade

Abstract

The application discloses a headlamp convenient for water vapor removal of a lampshade and a working method, solves the problem that there is no suitable scheme to reduce water vapor in a headlamp lampshade in the prior art, has the beneficial effect of effectively avoiding water vapor in the headlamp, and specifically has the following technical scheme: a headlamp convenient for water vapor removal of a lampshade, which comprises a lamp shell, the two ends of the lamp shell are respectively connected with a lampshade in a clamping mode, a lamp holder is fixed in the lamp shell to support a light source, the light source is provided with a light source heat dissipation plate, the lamp shell supports a semiconductor refrigeration assembly, the semiconductor refrigeration assembly comprises a shell, heat conduction fins are fixed to the inner side of the shell, heat dissipation fins are arranged on the outer side of the shell, the heat conduction fins are located on one side of the light source heat dissipation plate and are arranged at a spacing distance from the light source heat dissipation plate, the lamp holder is provided with a convex part away from the lampshade, the convex part is provided with an opening, air at a set temperature flows at the light source heat dissipation plate, is cooled by flowing through the semiconductor refrigeration assembly, and then flows to the lampshade through the opening of the convex part, and finally returns to the light source heat dissipation plate.

Description

Technical Field

[0001] This invention relates to the field of vehicles, and in particular to a headlight and its operating method that facilitates the removal of moisture from the lamp cover. Background Technology

[0002] The statements in this section are merely background information related to the present invention and do not necessarily constitute prior art.

[0003] Car headlight assemblies are not completely sealed; they typically have ventilation openings. Whether it's a halogen, xenon, or LED lamp, they all reach high temperatures when turned on. As the temperature rises, the air inside the headlight gradually increases in pressure and fills the entire headlight assembly. When the air humidity is high and the temperature difference between the inside and outside is significant, moisture can easily adhere to the lens, similar to fogging on a windshield. For example, if headlights are used for an extended period, or if the lights are turned off immediately after parking or stopping, the high internal temperature of the headlights, combined with the high humidity or temperature difference, will produce moisture. This moisture is difficult to dissipate for a period of time, significantly reducing the headlight's penetrating power, causing diffused light, unclear road illumination, and other problems. This affects the normal use of the headlights and, in severe cases, can even cause short circuits, posing a significant safety hazard.

[0004] The inventors discovered that there is no suitable solution in the existing technology to reduce the formation of water vapor in the lamp cover. They all rely on the heat sink of the lamp for heat dissipation. In summer, the temperature of the lamp cover can quickly reach equilibrium with the temperature inside the lamp and no longer produce water vapor. However, in winter, the temperature of the lamp cover rises more slowly, and the water vapor remains for a longer period of time, which poses a certain safety hazard when driving at night. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a headlight that facilitates the removal of moisture from the lamp cover, effectively preventing moisture buildup inside the headlight and ensuring vehicle driving safety.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0007] A headlight that facilitates the removal of moisture from the lampshade includes a lamp housing with both ends snapped into the lampshade. A lamp holder is fixed inside the lamp housing to support the light source. The light source has a heat sink. The lamp housing supports a semiconductor cooling component. The semiconductor cooling component includes a housing with a heat-conducting fin fixed inside and a heat sink on the outside. The heat-conducting fin is located on one side of the heat sink and spaced apart from it. The lamp holder has a protrusion away from the lampshade with an opening. Air at a set temperature flows at the heat sink, passes through the semiconductor cooling component to cool down, and then flows through the opening of the protrusion to the lampshade, finally returning to the heat sink.

[0008] The aforementioned headlight, by incorporating a lamp holder and a semiconductor cooling component within the lamp housing, ensures that airflow is directed from the heat sink of the light source towards the lamp cover through the opening in the lamp holder. This defines the airflow path. The heat-conducting fins of the semiconductor cooling component are located on one side of the heat sink of the light source. As the air temperature at the heat sink gradually increases and flows towards the lamp cover, it is cooled by the heat-conducting fins, which then dissipate heat from the heat sink, further reducing the heat generated by the light source. The cooled air then flows towards the lamp cover through the opening. At this point, the air temperature inside the lamp cover is closer to the outside temperature, preventing the formation of moisture in the lamp cover.

[0009] As described above, in a headlight that facilitates the removal of moisture from the lampshade, the semiconductor cooling component is a Peltier cooling component. The semiconductor cooling component also has a Peltier element inside the housing, located outside the heat-conducting sheet. The Peltier element utilizes the Peltier effect, where heat at the junction of two different conductors is absorbed or dissipated when current passes through it. Combined with the heat-conducting sheet and the heat sink, it further cools the high-temperature air in the airflow path.

[0010] As described above, a headlight that facilitates the removal of moisture from the lamp cover has a U-shaped longitudinal section for the housing, with the opening side of the housing facing the lamp holder. The Peltier element is fixed inside the housing, and one end of the heat-conducting sheet is fixedly connected to a ceramic plate on one side of the Peltier element. The housing design ensures the stable fixation of the Peltier element and also facilitates the fixation of the heat-conducting sheet.

[0011] As described above, in a headlight that facilitates the removal of moisture from the lamp cover, a fan is also provided on the side of the heat sink away from the housing. The fan housing is fixed to the heat sink, and the fan can quickly remove heat from the semiconductor cooling component.

[0012] As described above, a headlight that facilitates the removal of moisture from the lamp cover includes a base plate, a side wall, and a top plate. One end of the base plate is engaged with one end of the lamp cover, and the other end of the base plate is connected to the side wall. The housing of the semiconductor cooling component is fixed to the side wall, the side wall is connected to one end of the top plate, and the other end of the top plate is engaged with the other end of the lamp cover.

[0013] As described above, a headlight that facilitates the removal of moisture from the lamp cover has a step in the middle section of the base plate away from the lamp holder. The base plate has a set distance between the side near the lamp cover and the opening of the protrusion. A first recess is provided at one end of the base plate facing the lamp cover, and a first protrusion is provided at one end of the lamp cover. The first protrusion is engaged with the first recess. The arrangement of the base plate further ensures that the air inside the lamp cover flows to the opening of the protrusion.

[0014] As described above, in a headlight designed to facilitate the removal of moisture from the lampshade, one end of the heat sink plate for the light source is at a predetermined distance from the side wall. The heat sink plate is positioned facing the top plate and is inclined relative to the side wall to allow air at a predetermined temperature to flow through the top plate and towards the semiconductor cooling assembly.

[0015] As described above, for a headlight that facilitates the removal of moisture from the lamp cover, considering the installation of the headlight and the airflow inside the headlight, the top plate is inclined upward relative to the side wall, a second recess is provided at one end of the top plate near the lamp cover, and a second protrusion is provided at one end of the lamp cover, with the second protrusion engaging with the second recess.

[0016] As described above, a headlight that facilitates the removal of moisture from the lamp cover includes a lamp holder comprising a first plate and a second plate, which support the heat sink of the light source. The first plate is an arc-shaped structural component with the protrusion. The second plate is spaced apart from the lamp cover. The lamp holder not only ensures the position of the heat sink of the light source but also ensures the airflow path inside the headlight.

[0017] Secondly, the present invention also provides a method for operating a headlight that facilitates the removal of moisture from the lamp cover, comprising the following:

[0018] When the headlight is working, the light source generates heat, which is dissipated by the heat sink. The temperature of the air at the heat sink rises, and the air at the set temperature flows through the gap between the heat sink and the lamp housing to the semiconductor cooling component. The semiconductor cooling component cools the air at the set temperature, and the cooled air flows through the opening of the lamp holder protrusion to the lamp cover. The cooled air is close to the temperature of the outside air, so no water vapor is generated at the lamp cover.

[0019] The beneficial effects of the present invention are as follows:

[0020] 1) The present invention, through the arrangement of the lamp holder, lamp housing and lamp cover inside the headlight, has a reasonable overall structure that fully limits the air flow path inside the headlight. A semiconductor cooling component is set at an appropriate position in the lamp housing, which can fully cool down the air at a higher temperature in the air flow path. The cooled air flows to the lamp cover through the opening. At this time, the air temperature inside the lamp cover is close to the outside temperature, which avoids the generation of water vapor in the lamp cover, thereby reducing the impact on the light transmittance of the lamp cover, ensuring the brightness of the headlight, and ensuring vehicle driving safety.

[0021] 2) This invention uses a semiconductor cooling component as a Peltier cooling component. The Peltier element utilizes the Peltier effect. When current passes through, the heat at the junction of two different conductors is absorbed or dissipated. Combined with a heat-conducting plate and a heat sink, the heat-conducting plate facilitates the entry of heat into the Peltier element, and the heat sink facilitates heat dissipation. This helps to fully cool the high-temperature air in the airflow path, and the heat can be quickly dissipated by a fan.

[0022] 3) In this invention, the semiconductor cooling component is set on the side wall of the lamp housing, which is a reasonable position. Moreover, the structure of the housing is reasonable. The housing is supported by the side wall and can effectively accommodate the Peltier element and fix the heat-conducting plate and heat sink.

[0023] 4) The lamp holder structure in this invention is reasonably designed. The lamp holder includes a first plate and a second plate. The first plate is an arc-shaped structural component, which ensures the airflow path between the outer side of the first plate and the side wall and the bottom plate. The second plate ensures the airflow path between the lamp cover and the second plate. Attached Figure Description

[0024] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0025] Figure 1 This is a schematic diagram of a headlight according to one or more embodiments of the present invention, which facilitates the removal of moisture from the lamp cover.

[0026] The diagram exaggerates the spacing or dimensions between parts to show their positions; the diagram is for illustrative purposes only.

[0027] Among them: 1. Top plate, 2. Side wall, 3. Heat-conducting plate, 4. Peltier element, 5. Fan, 6. Heat sink, 7. Housing, 8. Bottom plate, 9. Opening, 10. Light source heat sink, 11. Lampshade, 12. First plate, 13. Second plate. Detailed Implementation

[0028] It should be noted that the following detailed description is illustrative and intended to provide further explanation of the invention. Unless otherwise specified, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0029] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention. As used herein, unless otherwise expressly indicated by the invention, the singular form is also intended to include the plural form. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0030] As described in the background section, there is no suitable solution in the prior art to reduce the problem of moisture in the headlight cover. In order to solve the above-mentioned technical problem, the present invention proposes a headlight that facilitates the removal of moisture from the cover.

[0031] Example 1

[0032] In a typical embodiment of the present invention, reference is made to Figure 1 As shown, a headlight that facilitates the removal of moisture from the lamp cover includes a lamp housing. Both ends of the lamp housing are respectively engaged with the lamp cover 11. A lamp holder is fixed inside the lamp housing to support the light source. The light source has a heat sink 10. The lamp housing supports a semiconductor cooling component. The semiconductor cooling component includes a housing 7. A heat-conducting sheet 3 is fixed inside the housing 7. A heat sink 6 is provided on the outside of the housing. The heat-conducting sheet 3 is located on one side of the heat sink 10 and the two are spaced apart. The lamp holder has a protrusion away from the lamp cover. The protrusion has an opening 9. Air at a set temperature flows at the heat sink 10, flows through the semiconductor cooling component to cool down, and then flows through the opening 9 of the protrusion to the lamp cover 11, and finally returns to the heat sink 10.

[0033] It is easy to understand that when the light source is an LED lamp, the heat sink for the light source is an LED heat sink; of course, the light source can also be a halogen lamp or other types of lamps.

[0034] In this embodiment, the semiconductor cooling component is a Peltier cooling component. The semiconductor cooling component also has a Peltier element 4 inside the housing. The Peltier element 4 is located outside the heat-conducting plate 3. The Peltier element utilizes the Peltier effect. When current passes through, the heat at the junction of the two different conductors is absorbed or dissipated. Combined with the heat-conducting plate and the heat sink, the high-temperature air in the air flow path is further cooled.

[0035] Specifically, the Peltier element 4 is connected to the power supply. Two high thermal conductivity ceramic plates are set on each side of the Peltier element 4, and the Peltier element 4 is sandwiched between the two high thermal conductivity ceramic plates. The Peltier element can effectively transfer the heat generated by the lamp source from one ceramic plate to the other ceramic plate for heat conduction.

[0036] Among them, the heat-conducting plate 3 on one side of the Peltier element 4 is a metal heat-conducting plate, which can quickly conduct heat to the Peltier element 4. The heat sink on the other side is a commonly used device for dissipating heat from easily heated electronic components in electrical appliances, and can be in the form of a plate or multiple plates.

[0037] In this embodiment, the longitudinal section of the outer shell 7 is U-shaped, and the opening side of the outer shell 7 is set towards the lamp holder. The Peltier element 4 is fixed inside the outer shell 7. One end of the heat-conducting sheet is fixed to the ceramic plate on one side of the Peltier element. The cooling surface of the Peltier element 4 faces the inside of the outer shell, and the heating surface is located on the outside of the outer shell. The outer shell ensures the stable fixation of the Peltier element and also facilitates the fixation of the heat-conducting sheet.

[0038] In addition, a fan 5 is provided on the side of the heat sink 6 away from the outer casing. The casing of the fan 5 is fixed to the heat sink, and the fan 5 can quickly remove the heat from the semiconductor cooling component.

[0039] The lamp housing includes a base plate 8, a side wall 2, and a top plate 1. One end of the base plate 8 is engaged with one end of the lamp shade 11, and the other end of the base plate 8 is engaged with the side wall. The housing 7 of the semiconductor cooling component is fixed to the side wall 2. The side wall 2 is engaged with one end of the top plate 1, and the other end of the top plate 1 is engaged with the other end of the lamp shade 11.

[0040] The base plate 8 has a step in the middle section away from the lamp holder. That is, the base plate 8 includes a first section and an L-shaped second section. The first section and the second section are connected. There is a set distance between the side of the base plate near the lamp cover and the opening of the protrusion. The end of the base plate 8 facing the lamp cover 11 has a first recess, and the end of the lamp cover has a first protrusion. The first protrusion is inserted into the first recess. The arrangement of the base plate further ensures that the air inside the lamp cover flows to the opening of the protrusion.

[0041] It should be noted that there is a set distance between one end of the heat sink 10 and the side wall 2. The heat dissipation surface of the heat sink 10 faces the top plate 1. In some examples, the heat sink 10 and the top plate are parallel to each other, with a set distance between them. The heat sink 10 is inclined relative to the side wall so that the air at the set temperature can flow to the semiconductor cooling component through the top plate 4. In this way, the high temperature air flows upward and is blocked by the top plate 1 before flowing downward. It flows through the gap between the heat sink 10 and the side wall 2. After the headlight is installed in the vehicle, one end of the heat sink 10 is located above the heat conduction plate 3. When the high temperature air reaches the heat conduction plate 3, it turns and flows downward.

[0042] Considering the installation of the headlights and the airflow inside the headlights, the top plate 1 is inclined upward relative to the side wall. A second recess is provided at one end of the top plate 1 near the lamp cover 11, and a second protrusion is provided at one end of the lamp cover. The second protrusion is inserted into the second recess.

[0043] The lamp holder includes a first plate 12 and a second plate 13. The first plate and the second plate support the heat sink 10 of the light source. The first plate 12 is an arc-shaped structural component with a protrusion that bends downward. The protrusion is at a set distance from the second step of the lamp housing base plate. The second plate 13 is located inside and above the headlight. The second plate is bent and both the first plate and the second plate are fixed to the lamp housing. The second plate 13 is spaced apart from the lamp cover 11. The lamp holder not only ensures the position of the heat sink 10 of the light source, but also ensures the airflow path inside the headlight. The second plate ensures the airflow path between the lamp cover and the second plate.

[0044] Regarding the lampshade 11, a second protrusion is provided on the top side and a first protrusion is provided on the bottom side. Apart from the second and first protrusions, the lampshade has multiple downward steps from the top to the bottom side. Each step is inclined downward. The bottom side of the third step of the lampshade is bent towards the base plate, that is, the third step of the lampshade is connected to one end of the herringbone section, and the other end of the herringbone section is provided with a second protrusion facing the base plate.

[0045] The headlight provided in this embodiment features a lamp holder and a semiconductor cooling component inside the lamp housing. The lamp holder has an opening, ensuring that airflow is directed from the heat sink of the light source to the lamp cover. This defines the airflow path. The heat-conducting fins of the semiconductor cooling component are located on one side of the heat sink of the light source. When the headlight is working, the air temperature at the heat sink gradually increases and flows towards the lamp cover. The heat-conducting fins absorb the high temperature inside the headlight, and the heat sink dissipates heat, further reducing the heat generated by the light source. Simultaneously, a fan operates to quickly lower the temperature inside the headlight, preventing the heat dissipated by the heat sink from remaining inside the headlight and causing high internal temperatures. The cooled air flows through the opening to the lamp cover, where the air temperature is closer to the outside temperature, preventing moisture from forming in the lamp cover.

[0046] Example 2

[0047] This embodiment provides a method for operating a headlight that facilitates the removal of moisture from the lamp cover, including the following:

[0048] When the headlight is working, the light source generates heat, which is dissipated by the heat sink. The temperature of the air at the heat sink rises, and the air at the set temperature flows through the gap between the heat sink and the lamp housing to the semiconductor cooling component. The semiconductor cooling component cools the air at the set temperature, and the cooled air flows through the opening of the lamp holder protrusion to the lamp cover. The cooled air is close to the temperature of the outside air, so no water vapor is generated at the lamp cover.

[0049] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A headlight that facilitates the removal of moisture from the lampshade, characterized in that, The lamp includes a lamp housing, with both ends of the lamp housing engaging with a lamp shade. A lamp holder is fixed inside the lamp housing to support the light source. The light source has a heat sink plate. The lamp housing supports a semiconductor cooling component. The semiconductor cooling component includes a housing, with a heat-conducting sheet fixed inside the housing and a heat sink plate on the outside of the housing. The heat-conducting sheet is located on one side of the heat sink plate and the two are spaced apart. The lamp holder has a protrusion away from the lamp shade. The protrusion has an opening. Air at a set temperature flows at the heat sink plate, flows through the semiconductor cooling component to cool down, and then flows through the opening of the protrusion to the lamp shade, and finally returns to the heat sink plate. The lamp housing includes a base plate, a side wall, and a top plate. One end of the base plate is engaged with one end of the lamp shade, and the other end of the base plate is connected to the side wall. The housing of the semiconductor cooling component is fixed to the side wall, the side wall is connected to one end of the top plate, and the other end of the top plate is engaged with the other end of the lamp shade. There is a set distance between one end of the heat sink and the side wall. The heat sink is positioned facing the top plate and is inclined relative to the side wall so that air at a set temperature can flow to the semiconductor cooling component through the top plate.

2. A headlight according to claim 1 that facilitates moisture removal from the lampshade, characterized in that, The semiconductor cooling component is a Peltier cooling component, and the semiconductor cooling component also has a Peltier element inside the housing, the Peltier element being located on the outside of the heat-conducting sheet.

3. A headlight according to claim 2 that facilitates moisture removal from the lampshade, characterized in that, The longitudinal section of the housing is U-shaped, with the opening side of the housing facing the lamp holder. The Peltier element is fixed inside the housing, and one end of the heat-conducting sheet is fixedly connected to a ceramic plate on one side of the Peltier element.

4. A headlight according to claim 1 that facilitates moisture removal from the lampshade, characterized in that, A fan is also provided on the side of the heat sink away from the outer casing, and the fan casing is fixed to the heat sink.

5. A headlight according to claim 1 that facilitates moisture removal from the lampshade, characterized in that, The base plate has a step in the middle section away from the lamp holder. There is a set distance between the side of the base plate near the lamp cover and the opening of the protrusion. The end of the base plate facing the lamp cover has a first recess, and the end of the lamp cover has a first protrusion. The first protrusion is inserted into the first recess.

6. A headlight according to claim 1 that facilitates moisture removal from the lampshade, characterized in that, The top plate is inclined upward relative to the side wall, and a second recess is provided at one end of the top plate near the lampshade. A second protrusion is provided at one end of the lampshade, and the second protrusion is inserted into the second recess.

7. A headlight according to claim 1 that facilitates moisture removal from the lampshade, characterized in that, The lamp holder includes a first plate and a second plate, which support the heat dissipation plate of the light source. The first plate is an arc-shaped structural component with the protrusion. The second plate is spaced apart from the lamp cover.

8. A method for operating a headlight according to any one of claims 1-7 for facilitating moisture removal from the lampshade, characterized in that, Includes the following: When the headlight is working, the light source generates heat, which is dissipated by the heat sink. The temperature of the air at the heat sink rises, and the air at the set temperature flows through the gap between the heat sink and the lamp housing to the semiconductor cooling component. The semiconductor cooling component cools the air at the set temperature, and the cooled air flows through the opening of the lamp holder protrusion to the lamp cover. The cooled air is close to the temperature of the outside air, so no water vapor is generated at the lamp cover.

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