Optical device fabrication method and optical interconnection packaging method

CN116719124BActive Publication Date: 2026-07-07INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
Filing Date
2023-06-07
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Existing integrated optical chips are difficult to achieve a unified pattern structure among chips made of different materials, resulting in high difficulty in optical coupling, low integration density, and high optical coupling loss.

Method used

By pre-setting a sputtering region on a substrate, an optical device is formed by controlling the deposition of sputtered particles using an electromagnetic field. Semiconductor materials are grown on the substrate by magnetron sputtering, and combined with annealing, a low-dislocation, low-defect optical device is prepared, realizing optical interconnection packaging between chips of different material systems.

Benefits of technology

This technology enables the transformation of optical device dimensions between chips based on various material systems, improves optoelectronic integration, reduces optical coupling loss, decreases chip size, and promotes low-loss coupling in large-scale photonic integrated chips.

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Abstract

The application provides an optical device preparation method and an optical interconnection packaging method, which can be applied to the field of integrated optoelectronics. The optical device preparation method comprises the following steps: presetting a sputtering area on a substrate; a plurality of chips are preset on the substrate, and the sputtering area is arranged between two chips; determining parameters of a to-be-prepared optical device according to the properties of the preset chips; controlling sputtering particles through an electromagnetic field, so that the sputtering particles are deposited on the sputtering area on the substrate to obtain a first optical device; and performing annealing treatment on the surface of the first optical device to obtain a prepared optical device.
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