optical modules

Abstract

The present invention discloses an optical module. The optical module includes a housing, a circuit board assembly, and an optoelectronic assembly disposed within the housing. The housing is provided with an optical interface. The optoelectronic assembly includes an optoelectronic chip adjacent to and electrically connected to the circuit board assembly, and a wavelength division multiplexer / demultiplexer and an optoelectronic device arranged sequentially from the optoelectronic chip to the optical interface. The wavelength division multiplexer / demultiplexer is provided with a graphic circuit, and the optoelectronic device is electrically connected to the circuit board assembly via the graphic circuit. In this way, the wavelength division multiplexer / demultiplexer establishes an electrical connection path between the optoelectronic device and the circuit board assembly, making the electrical connection between the optoelectronic device and the circuit board assembly simpler and more reliable. Furthermore, the optical module facilitates active packaging of the optical path in the optical module, improves coupling accuracy in the optical path, and reduces optical loss.

Description

Technical Field

[0001] The present invention belongs to the technical field of optical communication component manufacturing, and in particular relates to an optical module. Background Art

[0002] In the field of fiber-optic communications, optical modules are core components that convert optical signals into electrical signals. They have both an electrical interface for connecting to an external host computer and an optical interface for connecting to an external optical fiber.

[0003] A typical optical module includes a circuit board assembly (PCBA) arranged sequentially from the electrical interface to the optical interface, an optoelectronic chip electrically connected to the PCBA, a wavelength division multiplexer / demultiplexer (WDM / DDM), and optoelectronic components, such as optical attenuators, optical amplifiers, and optical detectors, positioned between the WDM / DDM and the optical interface and used to process optical signals on the optical path between the WDM / DDM and the optical interface when powered. These optoelectronic components need to be electrically connected to the PCBA to receive power from the PCBA.

[0004] Currently, there are some difficulties in the electrical connection between the optoelectronic device and the circuit board assembly:

[0005] For example, the optoelectronic device is directly connected to the circuit board assembly by using bonding wires across the wavelength division multiplexer / demultiplexer. This method has a long bonding distance, is very difficult, and has low reliability of the bonding wires.

[0006] For another example, a circuit pattern is added to the bottom wall of the outer shell / tube shell of the optical module. The circuit pattern extends continuously from the vicinity of the circuit board assembly to the bottom of the optoelectronic device and is electrically connected to the optoelectronic device through bonding wires. However, since the cavity of the outer shell / tube shell is relatively deep and many devices including the optoelectronic device and the wavelength division multiplexer / demultiplexer are arranged in the cavity, the wiring operation space is very crowded, the wiring is difficult, and the processing difficulty of the outer shell / tube shell is increased. Summary of the Invention

[0007] In order to solve the above-mentioned problem of electrical connection between the optoelectronic device and the circuit board assembly, the present invention provides an optical module.

[0008] To achieve the above-mentioned purpose of the invention, one embodiment provides an optical module, including a shell, a circuit board assembly and an optoelectronic component arranged inside the shell, the shell is provided with an optical interface, the optoelectronic component includes an optoelectronic chip adjacent to the circuit board assembly and electrically connected to the circuit board assembly, and a wavelength division multiplexer / demultiplexer and an optoelectronic device arranged in sequence from the optoelectronic chip to the optical interface, the wavelength division multiplexer / demultiplexer is provided with a graphic circuit, and the optoelectronic device is electrically connected to the circuit board assembly via the graphic circuit.

[0009] Preferably, the wavelength division multiplexer / demultiplexer comprises a glass body for optical signals to pass through and a filter attached to an end face of the glass body, and the graphic circuit is formed on an upper surface of the glass body.

[0010] Preferably, the wavelength division multiplexer / demultiplexer includes a glass body for optical signals to pass through, a filter attached to the end face of the glass body, and an additional board attached to the upper surface of the glass body, and the graphic circuit is formed on the upper surface of the additional board.

[0011] Preferably, the additional plate is configured as a ceramic plate adhered to the upper surface of the glass body.

[0012] Preferably, the projection of the additional plate in the up and down directions completely falls within the projection of the glass body.

[0013] Preferably, the optoelectronic device is configured as any one or more of an optical amplifier, an optical detector, and an optical attenuator located in the optical path between the optical interface and the wavelength division multiplexer / demultiplexer.

[0014] Preferably, the optoelectronic chip is configured as a light receiving chip, and the optoelectronic device is configured as an optical amplifier;

[0015] Alternatively, the optoelectronic chip is configured as a light emitting chip, and the optoelectronic device is configured as an optical attenuator.

[0016] Preferably, the circuit board assembly includes a main circuit board, and the main circuit board is configured as any one or more of a rigid circuit board, a rigid-flex circuit board, and a flexible circuit board. The circuit board assembly also includes a ceramic carrier electrically connected to the main circuit board;

[0017] The optoelectronic device is electrically connected to the ceramic carrier via the graphic circuit;

[0018] The light emitting chip is fixedly mounted on the ceramic carrier and electrically connected to the ceramic carrier via bonding wires; alternatively, the light receiving chip is electrically connected to a transimpedance amplifier via bonding wires, and the transimpedance amplifier is fixedly mounted on the ceramic carrier and electrically connected to the ceramic carrier via bonding wires.

[0019] Preferably, the housing includes a lower housing and an upper housing, the lower housing includes a bottom wall and an upper opening opposite to the bottom wall, and the upper housing is installed at the upper opening;

[0020] The optical module further includes a cooler disposed between the optoelectronic device and the bottom wall, wherein the cooler is electrically connected to the circuit board assembly via the graphic circuit.

[0021] Preferably, one end of the graphic circuit is electrically connected to the optoelectronic device and the refrigerator via a bonding wire, and the other end of the graphic circuit is electrically connected to the circuit board assembly via a bonding wire.

[0022] Preferably, the housing includes a lower housing and an upper housing, the lower housing includes a bottom wall and an upper opening opposite to the bottom wall, and the upper housing is installed at the upper opening;

[0023] The optical module further includes a second cooler disposed between the optoelectronic chip and the bottom wall, wherein the second cooler is electrically connected to the circuit board assembly through bonding wires.

[0024] Compared with the commonly used technology, the technical effect of the present invention is that: in an optical module in which an optoelectronic device is arranged between a wavelength division multiplexer / demultiplexer and an optical interface, an electrical connection path between the optoelectronic device and the circuit board assembly is established with the help of the wavelength division multiplexer / demultiplexer, so that the electrical connection operation between the optoelectronic device and the circuit board assembly is simpler and the structure is more reliable, avoiding the problems of increased difficulty in processing the shell due to the power supply of the optoelectronic device and the complex packaging structure and difficulty in operation of the optical module; moreover, it is also conducive to realizing active packaging of the optical path in the optical module, improving the coupling accuracy in the optical path, and reducing optical loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a three-dimensional structural diagram of an optical module according to embodiment 1 of the present invention;

[0026] Figure 2 This is a partially disassembled structural diagram of the optical module according to Example 1 of the present invention;

[0027] Figure 3 is a three-dimensional structural diagram of an optical module according to embodiment 2 of the present invention;

[0028] Figure 4 This is a partially disassembled structural diagram of an optical module according to Example 2 of the present invention;

[0029] Figure 5 This is a disassembled structural diagram of a portion of the optical module according to embodiment 2 of the present invention from another perspective;

[0030] Figure 6 It is a three-dimensional structural diagram of the wavelength division multiplexer / demultiplexer of embodiment 3 of the present invention. DETAILED DESCRIPTION

[0031] The present application will be described in detail below with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present application, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are included within the scope of protection of the present application.

[0032] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

[0033] First, to overcome the technical problems mentioned in the background technology, the present application provides an optical module. It should be noted that the optical module mentioned in the present application is suitable for transmitting and / or receiving optical signals at various data rates per second, including but not limited to: 1 gigabit per second (Gbit), 2 Gbit, 4 Gbit, 8 Gbit, 10 Gbit, 20 Gbit, 100 Gbit, 400 Gbit, 800 Gbit or other fiber links with other bandwidths. In addition, optical modules of other types and configurations or optical modules having components that differ in some aspects from those shown and described herein may also benefit from the principles disclosed herein.

[0034] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. The following embodiments and features in the embodiments may be combined with each other unless there is any conflict.

[0035] Example 1

[0036] Ginseng Figure 1 and Figure 2 This embodiment provides an optical module 100, which includes a housing 110, an optical interface 120, a circuit board assembly 130 and an optoelectronic component.

[0037] The shell 110 is roughly a hollow box-shaped structure, which includes a lower shell 111 and an upper shell (not shown in the figure, which can be a cover plate), wherein: the lower shell 111 has a bottom wall 1111, two pairs of side walls 1113 and 1115 extending from the four edges of the bottom wall 1111 in the up and down directions, and an upper opening formed at the upper edges of the two pairs of side walls 1113 and 1115, and the upper opening is opposite to the bottom wall 1111 in the upper and lower directions; the upper shell is installed at the upper opening, and can be fixedly connected to the two pairs of side walls 1113 and 1115 by screws, snaps, welding, etc., and together with the lower shell 111, it encloses the internal accommodating cavity of the shell 110.

[0038] The optical interface 120 is disposed on the housing 110 , specifically, on a side wall 1115 of the lower housing 111 . The optical module 100 can achieve optical connection with an external optical fiber through the optical interface 120 .

[0039] The optoelectronic assembly is arranged inside the housing 110 and can be installed in the lower housing 111 through the upper opening. The optoelectronic assembly includes an optoelectronic chip 142, a wavelength division multiplexer / demultiplexer 144, and an optoelectronic device 146.

[0040] The optoelectronic chip 142 is disposed adjacent to the circuit board assembly 130 and connected to the circuit board assembly 130 , and can be used to perform electrical signal interaction with the circuit board assembly 130 and to implement conversion between electrical signals and optical signals.

[0041] The wavelength division multiplexer / demultiplexer 144 and the optoelectronic device 146 are disposed in the optical path between the optoelectronic chip 142 and the optical interface 120, and are arranged sequentially from the optoelectronic chip 142 to the optical interface 120. Thus, the wavelength division multiplexer / demultiplexer 144 is located between the optoelectronic device 146 and the optoelectronic chip 142; and the optoelectronic device 146 is located between the wavelength division multiplexer / demultiplexer 144 and the optical interface 120. When powered on, the optoelectronic device 146 can process optical signals on the optical path between the wavelength division multiplexer / demultiplexer 144 and the optical interface 120.

[0042] In the present invention, a graphic circuit 1440 is provided on the upper surface of the wavelength division multiplexer / demultiplexer 144 , and the optoelectronic device 146 is electrically connected to the circuit board assembly 130 via the graphic circuit 1440 .

[0043] In this way, the present invention uses the wavelength division multiplexer / demultiplexer 144 to establish an electrical connection path between the optoelectronic device 146 and the circuit board assembly 130, so that the electrical connection operation between the optoelectronic device 146 and the circuit board assembly 130 is simpler and the structure is more reliable, avoiding the problems of increased difficulty in processing the shell 110 due to the power supply of the optoelectronic device 146 and the complex packaging structure of the optical module 100 that is difficult to operate. Furthermore, the present invention facilitates active packaging of the optoelectronic components. For example, during the assembly of the optical module 100, the optoelectronic device 146 is first electrically connected to the graphic circuit 1440. A probe is then crimped from above onto the upper surface of the wavelength division multiplexer / demultiplexer 144 to power the graphic circuit 1440. This allows power to be supplied to the optoelectronic device 146, facilitating adjustment of the relative position of the optoelectronic device 146 with other optical components (e.g., the collimating lens 145 and focusing lens 147 described below) to improve optical coupling accuracy, thereby completing active packaging of the optical path. Subsequently, the graphic circuit 1440 is electrically connected to the circuit board assembly 130. Thus, while facilitating active packaging of the optical path, the present invention can improve coupling accuracy within the optical path and reduce optical loss.

[0044] In this embodiment, one end of the graphic circuit 1440 is electrically connected to the optoelectronic device 146 via a bonding wire 190, and the other end of the graphic circuit 1440 is electrically connected to the circuit board assembly 130 via a bonding wire 190. Combined with the placement of the graphic circuit 1440, this structure allows for a short single bonding distance and minimizes interference with components within the housing 110, thus reducing bonding difficulty and improving the reliability of the bonding wire 190.

[0045] It should be noted here that the bonding wires mentioned in this application can be implemented in the form of bonding gold wires (ie, metal conductive wires).

[0046] Furthermore, in this embodiment, the wavelength division multiplexer / demultiplexer 144 includes a glass body 1441 through which optical signals pass, and a filter 1442 attached to the end surface of the glass body 1441. A graphic circuit 1440 is formed on the upper surface of the glass body 1441, for example, by directly forming the graphic circuit 1440 on the upper surface of the glass body 1441 through glass metallization. Of course, the configuration of the graphic circuit 1440 is not limited to this, and for example, it can also be as described in Example 3 below.

[0047] Furthermore, the optoelectronic device 146 is specifically configured as any one or more of an optical amplifier, an optical detector, and an optical attenuator. In the drawings, the optoelectronic device 146 is exemplified as a semiconductor optical amplifier for increasing light intensity. For ease of understanding, the optical amplifier is also illustrated with the reference numeral 146 in this embodiment.

[0048] Specifically, in this embodiment, the optical module 100 is configured as an optical receiver, whose optical interface 120 is used to receive optical signals from an external optical fiber. The optoelectronic chip 142 is configured to convert the optical signal into an electrical signal and output it to the optical receiving chip 142 of the circuit board assembly 130, such as a photodetector diode (PD). Accordingly, the optoelectronic assembly includes a focusing lens 147, an optical amplifier 146, a collimating lens 145, a wavelength division multiplexer / demultiplexer 144, and a coupling lens 143, which are sequentially arranged along the propagation direction of the optical signal (i.e., from the optical interface 120 to the optoelectronic chip 142). In this way, after the optical signal enters the optoelectronic assembly, it is focused by the focusing lens 147, power amplified by the optical amplifier 146, collimated by the collimating lens 145, demultiplexed by the wavelength division multiplexer / demultiplexer 144, and focused and coupled by the coupling lens 143. After that, it is transmitted to the optical receiving chip 142 and converted into an electrical signal by the optical receiving chip 142.

[0049] Optical module 100 also includes a transimpedance amplifier 141. A light receiving chip 142 is electrically connected to transimpedance amplifier 141 via bonding wires. Transimpedance amplifier 141 is also electrically connected to circuit board assembly 130 via bonding wires. The electrical signal converted by light receiving chip 142 is transmitted to transimpedance amplifier 141 for signal amplification and then transferred to circuit board assembly 130.

[0050] It can be understood that the drawings and the above description are only a specific example of the optoelectronic component, and the structure of the optoelectronic component is not limited thereto. In addition, in addition to being set as the optical amplifier shown in the figure, the optoelectronic device 146 can also be set as a light detector or an optical attenuator. For example, the optoelectronic component also includes a splitter module arranged near the optical interface 120, and a light detector located on the first light output side of the splitter module (specifically, it can be a monitoring photodiode MPD), and an optical attenuator located on the second light output side of the splitter module (specifically, it can be an adjustable optical attenuator). The optical signal introduced by the optical interface 120 is first divided into a first optical signal output to the first light output side and a second optical signal output to the second light output side by the splitter module according to a constant light intensity ratio. When powered on, the optical detector detects the light intensity of the first optical signal to analyze the light intensity of the optical signal introduced by the optical interface 120. When powered on, the optical attenuator attenuates the light intensity of the second optical signal to ensure that the intensity of the optical signal transmitted to the optical amplifier 146 is moderate. Similarly, the optical detector and / or the optical attenuator can be electrically connected to the graphic circuit 1440 through bonding wires, and thus electrically connected to the circuit board assembly 130 via the graphic circuit 1440.

[0051] Furthermore, in this embodiment, the optical module 100 also includes a cooler 150 disposed between the optoelectronic device 146 (specifically, the optical amplifier 146) and the bottom wall 1111 of the lower housing 111. The cooler 150 can dissipate heat from the optoelectronic device 146 to maintain a stable operating temperature of the optoelectronic device 146. The cooler 150 is also electrically connected to the circuit board assembly 130 via the graphic circuit 1440 on the upper surface of the wavelength division multiplexer / demultiplexer 144. Specifically, the cooler 150 can be electrically connected to one end of the graphic circuit 1440 via a bonding wire 190, and the other end of the graphic circuit 1440 is electrically connected to the circuit board assembly 130 via the bonding wire 190. In this way, in this embodiment, the graphic circuit 1440 on the upper surface of the wavelength division multiplexer / demultiplexer 144 is not only used as a transition medium for the electrical connection between the optoelectronic device 146 and the circuit board assembly 130, but also used as a transition medium for the electrical connection between the refrigerator 150 and the circuit board assembly 130, further improving the electrical connection structure layout inside the shell 110 caused by the heat dissipation of the optoelectronic device 146, and reducing the layout structure difficulty and electrical connection operation difficulty of the optoelectronic device 146 and the refrigerator 150.

[0052] Furthermore, the circuit board assembly 130 includes a main circuit board 131 and a ceramic carrier board 133 electrically connected to the main circuit board 131. The main circuit board 131 is configured as any one or more of a rigid circuit board, a rigid-flex circuit board, and a flexible circuit board. For example, it can be configured as a combination of a rigid circuit board with gold fingers and a flexible circuit board electrically connected to the rigid circuit board, but is not limited thereto.

[0053] Ceramic carrier 133 is fixedly mounted on bottom wall 1111 of lower housing 111. Transimpedance amplifier 141 is fixedly mounted on the upper surface of ceramic carrier 133 and electrically connected to ceramic carrier 133 via bonding wires. Combined with the aforementioned optical receiver chip 142, it is electrically connected to transimpedance amplifier 141, thereby achieving an electrical connection between optical receiver chip 142 and circuit board assembly 130 (specifically, ceramic carrier 133). Simultaneously, optoelectronic device 146 is also electrically connected to ceramic carrier 133 via graphic circuit 144. In other words, the end of circuit board assembly 130 used to power optoelectronic chip 142 also serves to power optoelectronic device 146. The overall electrical connection structure of optical module 100 is simple, contributing to a compact overall layout.

[0054] In addition, the optical module 100 illustrated in the accompanying drawings is an airtightly packaged optical module, the main circuit board 131 is located outside the shell 110, and the ceramic carrier 133 is packaged inside the shell 110; correspondingly, a channel groove 1112 is opened on a side wall 1115 of the shell 110 that is relatively far away from the optical interface 120, and the circuit board assembly 130 also includes a transfer block 132 sealedly embedded in the channel groove 1112, one end of the main circuit board 131 is electrically connected to the part of the transfer block 132 located outside the shell 110, and the ceramic carrier 133 is electrically connected to the part of the transfer block 132 located inside the shell 110, thereby realizing the circuit connection between the main circuit board 131 and the ceramic carrier 133 via the transfer block 132.

[0055] Of course, the accompanying drawings are only one specific example of the circuit board assembly 130, and the configuration of the circuit board assembly 130 is not limited thereto. For example, in one variant embodiment, the circuit board assembly 130 may include only the main circuit board 131 and eliminate the adapter block 132 and ceramic carrier 133 shown in the accompanying drawings, and the transimpedance amplifier 141 may be directly electrically connected to the main circuit board 131 via soldering or bonding wires. In another variant embodiment, the circuit board assembly 130 may include only the main circuit board 131 and ceramic carrier 133 and eliminate the adapter block 132 shown in the accompanying drawings, and the ceramic carrier 133 may be electrically connected to the main circuit board 131 via soldering or bonding wires, and so on. These variant embodiments of the circuit board assembly 130 all benefit from the technical principle of providing the wavelength division multiplexer / demultiplexer 144 with the graphic circuit 1440 in this application.

[0056] Example 2

[0057] Ginseng Figures 3 to 5 This embodiment provides an optical module 200, which includes a housing 210, an optical interface 220, a circuit board assembly 230 and an optoelectronic component.

[0058] The shell 210 is roughly a hollow box-shaped structure, which includes a lower shell 211 and an upper shell (not shown in the figure, which can be a cover plate), wherein: the lower shell 211 has a bottom wall 2111, two pairs of side walls 2113 and 2115 extending from the four edges of the bottom wall 2111 in the up and down directions, and an upper opening formed at the upper edges of the two pairs of side walls 2113 and 2115, and the upper opening is opposite to the bottom wall 2111 in the upper and lower directions; the upper shell is installed at the upper opening, and can be fixedly connected to the two pairs of side walls 2113 and 2115 by screws, snaps, welding, etc., and together with the lower shell 211, it encloses the internal accommodating cavity of the shell 210.

[0059] The optical interface 220 is disposed on the housing 210 , specifically, on a side wall 2115 of the lower housing 211 . The optical module 200 can achieve optical connection with an external optical fiber through the optical interface 220 .

[0060] The optoelectronic assembly is arranged inside the housing 210 and can be installed in the lower housing 211 through the upper opening. The optoelectronic assembly includes an optoelectronic chip 242, a wavelength division multiplexer / demultiplexer 244, and an optoelectronic device 246.

[0061] The optoelectronic chip 242 is disposed adjacent to the circuit board assembly 230 and connected to the circuit board assembly 230 , and can be used to perform electrical signal interaction with the circuit board assembly 230 and to implement conversion between electrical signals and optical signals.

[0062] The wavelength division multiplexer / demultiplexer 244 and the optoelectronic device 246 are disposed in the optical path between the optoelectronic chip 242 and the optical interface 220, and are arranged sequentially from the optoelectronic chip 242 to the optical interface 220. Thus, the wavelength division multiplexer / demultiplexer 244 is located between the optoelectronic device 246 and the optoelectronic chip 242; and the optoelectronic device 246 is located between the wavelength division multiplexer / demultiplexer 244 and the optical interface 220. When powered on, the optoelectronic device 246 can process the optical signals on the optical path between the wavelength division multiplexer / demultiplexer 244 and the optical interface 220.

[0063] In the present invention, a graphic circuit 2440 is provided on the upper surface of the wavelength division multiplexer / demultiplexer 244 , and the optoelectronic device 246 is electrically connected to the circuit board assembly 230 via the graphic circuit 2440 .

[0064] Thus, the present invention uses the wavelength division multiplexer / demultiplexer 244 to establish an electrical connection path between the optoelectronic device 246 and the circuit board assembly 230, making the electrical connection between the optoelectronic device 246 and the circuit board assembly 230 simpler to operate and more reliable. This avoids problems such as increased difficulty in processing the housing 210 and complex packaging structure of the optical module 200 due to powering the optoelectronic device 246. Furthermore, the present invention facilitates active packaging of the optoelectronic assembly. For example, during the assembly of the optical module 200, the optoelectronic device 246 is first electrically connected to the graphic circuit 2440. At this time, a probe is pressed from above onto the upper surface of the wavelength division multiplexer / demultiplexer 244 to power the graphic circuit 2440. This allows power to be supplied to the optoelectronic device 246, facilitating adjustment of the relative position of the optoelectronic device 246 and other optical components (such as the reflector 245 described below) to improve the optical coupling accuracy between them, thus completing the active packaging of the optical path. Subsequently, the graphic circuit 2440 is electrically connected to the circuit board assembly 230. It can be seen that the present invention can improve the coupling accuracy in the optical path and reduce the optical loss while being conducive to realizing the active packaging of the optical path.

[0065] In this embodiment, one end of the graphic circuit 2440 is electrically connected to the optoelectronic device 246 via a bonding wire 290, and the other end of the graphic circuit 2440 is electrically connected to the circuit board assembly 230 via a bonding wire 290. Combined with the placement of the graphic circuit 2440, this structure allows for a short single bonding distance and minimizes interference with components within the housing 210, thus reducing bonding difficulty and improving the reliability of the bonding wire 290.

[0066] Furthermore, in this embodiment, the wavelength division multiplexer / demultiplexer 244 includes a glass body 2441 through which optical signals pass, and a filter 2442 attached to the end surface of the glass body 2441. A graphic circuit 2440 is formed on the upper surface of the glass body 2441, for example, by directly forming the graphic circuit 2440 on the upper surface of the glass body 2441 through glass metallization. Of course, the configuration of the graphic circuit 2440 is not limited to this, and for example, it can also be as described in Example 3 below.

[0067] Furthermore, the optoelectronic device 246 is specifically configured as any one or more of an optical amplifier, an optical detector, and an optical attenuator. In the drawings, the optoelectronic device 246 is exemplified as an optical attenuator 246 for attenuating light intensity, such as an adjustable optical attenuator.

[0068] Specifically, in this embodiment, the optical module 200 is configured as an optical transmitter, and its optical interface 220 is used to output optical signals to an external optical fiber. The optoelectronic chip 242 is configured to receive electrical signals from the circuit board assembly 230 and convert the electrical signals into optical signals. The optical transmitter chip 242, such as a laser diode (LD), accordingly, the optoelectronic assembly includes a coupling lens 243, a wavelength division multiplexer / demultiplexer 244, a reflector 245, and an optical attenuator 246, which are sequentially arranged along the propagation direction of the optical signal (i.e., from the optoelectronic chip 242 to the optical interface 220). Figure 5 The upper mirror 2460 of the optical attenuator 246 is located below the reflector 245. In this way, the optical transmitting chip 242 converts the electrical signal into an optical signal and transmits it to the coupling lens 243. The optical signal then undergoes focusing and coupling by the coupling lens 243, wavelength division multiplexing / demultiplexing by the wavelength division multiplexer / demultiplexer 244, and is reflected downward by the first reflective surface 2451 of the reflector 245 before reaching the optical attenuator 246. After the optical signal is attenuated by the optical attenuator 246, it is emitted upward to the second reflective surface 2452 of the reflector 245. After being reflected by the second reflective surface 2452 of the reflector 245, it is emitted from the optical interface 220 to the external optical fiber, thus realizing the optical transmission function of the optical module 100.

[0069] It is understood that the drawings and the above description are only specific examples of the optoelectronic component, and the structure of the optoelectronic component is not limited thereto. In addition, in addition to being configured as an optical attenuator as shown in the figure, the optoelectronic device 246 can also be configured as a light detector or an optical amplifier.

[0070] Furthermore, the circuit board assembly 230 includes a main circuit board 231 and a ceramic carrier board 233 electrically connected to the main circuit board 231. The main circuit board 231 is configured as any one or more of a rigid circuit board, a rigid-flex circuit board, and a flexible circuit board. For example, it can be configured as a combination of a rigid circuit board with gold fingers and a flexible circuit board electrically connected to the rigid circuit board, but is not limited thereto.

[0071] A ceramic carrier 233 is disposed within the housing 210. A light emitting chip 242 is fixedly mounted on the top surface of the ceramic carrier 233 and electrically connected to the ceramic carrier 233 via bonding wires. This electrically connects the light emitting chip 242 to the circuit board assembly 230 (specifically, the ceramic carrier 233). Simultaneously, the optoelectronic device 246 is also electrically connected to the ceramic carrier 233 via the graphic circuit 244. In other words, the same end of the circuit board assembly 230 that powers the optoelectronic chip 242 also powers the optoelectronic device 246. This results in a simple overall electrical connection structure for the optical module 200, contributing to a compact overall layout.

[0072] In addition, the optical module 200 illustrated in the accompanying drawings is an airtightly packaged optical module, the main circuit board 231 is located outside the shell 210, and the ceramic carrier 233 is packaged inside the shell 210; correspondingly, a channel groove 2112 is opened on a side wall 2115 of the shell 210 that is relatively far away from the optical interface 220, and the circuit board assembly 230 also includes a transfer block 232 sealedly embedded in the channel groove 2112, one end of the main circuit board 231 is electrically connected to the part of the transfer block 232 located outside the shell 210, and the ceramic carrier 233 is electrically connected to the part of the transfer block 232 located inside the shell 210, thereby realizing the circuit connection between the main circuit board 231 and the ceramic carrier 233 via the transfer block 232.

[0073] Of course, the accompanying drawings are only one specific example of the circuit board assembly 230, and the configuration of the circuit board assembly 230 is not limited thereto. For example, in one variant embodiment, the circuit board assembly 230 may include only the main circuit board 231 and eliminate the adapter block 232 and ceramic carrier 233 shown in the accompanying drawings, and the light emitting chip 242 may be directly electrically connected to the main circuit board 231 via soldering or bonding wires. In another variant embodiment, the circuit board assembly 230 may include only the main circuit board 231 and ceramic carrier 233 and eliminate the adapter block 232 shown in the accompanying drawings, and the ceramic carrier 233 may be electrically connected to the main circuit board 231 via soldering or bonding wires, and so on. These variant embodiments of the circuit board assembly 230 all benefit from the technical principle of configuring the wavelength division multiplexer / demultiplexer 244 with the graphic circuit 2440 in this application.

[0074] Furthermore, in this embodiment, the optical module 200 further includes a cooler 260 disposed between the ceramic carrier 233 and the bottom wall 2111 of the lower housing 211. The cooler 260 can dissipate heat from the ceramic carrier 233 and the light emitting chip 242 to maintain a stable operating temperature of the light emitting chip 242. The cooler 260 is electrically connected to the circuit board assembly 230 (specifically, the ceramic carrier 233) via bonding wires 290.

[0075] Example 3

[0076] Ginseng Figure 6 This embodiment also provides an optical module, which differs from the aforementioned embodiments 1 and 2 only in the specific structure of the wavelength division multiplexer / demultiplexer. In other words, the specific structure of the wavelength division multiplexer / demultiplexer provided in this embodiment is applicable to the optical modules of the aforementioned embodiments 1 and 2. The following describes only this difference.

[0077] In the aforementioned embodiment, the wavelength division multiplexer / demultiplexer includes a glass body and a filter, and a graphic circuit is formed on the upper surface of the glass body; differently, in this embodiment, the wavelength division multiplexer / demultiplexer 344, in addition to including a glass body 3441 for optical signals to pass through and a filter 3442 attached to the end face of the glass body 3441, further includes an additional board 3443 mounted on the upper surface of the glass body 3441, and a graphic circuit board 3440 is formed on the upper surface of the additional board 3443.

[0078] During specific processing, a base component having a glass body 3441 and a filter 3442 can be provided first, as well as an additional plate 3443 made of ceramic material (or glass material), and a graphic circuit 3440 is directly formed on the upper surface of the additional plate 3443 by metallization; and then the additional plate 3443 is installed on the upper surface of the glass body 3441 by pasting.

[0079] The projection of the additional plate 3443 in the vertical direction completely falls within the projection of the glass body 3441. In the figure, the additional plate 3443 and the glass body 3441 are exactly the same in size and shape.

[0080] In addition, it should be noted that the optical module 100 of the aforementioned embodiment 1 is implemented as an optical receiver, and the optical module 200 of the embodiment 2 is implemented as an optical transmitter, but the optical module of the present application is not limited to the aforementioned embodiments 1 and 2. For example, in a variant embodiment, the optical module of the present application can also be implemented as an optical transceiver having both the optical transmitting function as shown in embodiment 2 and the optical receiving function as shown in embodiment 1. Accordingly, its optoelectronic components include both an optical transmitting component that receives an electrical signal from a circuit board component and converts the electrical signal into an optical signal and outputs it through an optical interface (such as embodiment 2), and an optical receiving component that receives an external optical signal from an optical interface and converts the optical signal into an electrical signal and outputs it to a circuit board component (such as embodiment 1).

[0081] In summary, the present application has the following beneficial effects: in an optical module in which an optoelectronic device is arranged between a wavelength division multiplexer / demultiplexer and an optical interface, an electrical connection path is established between the optoelectronic device and the circuit board assembly with the help of the wavelength division multiplexer / demultiplexer, so that the electrical connection operation between the optoelectronic device and the circuit board assembly is simpler and the structure is more reliable, avoiding problems such as increased difficulty in processing the shell due to power supply of the optoelectronic device and complex packaging structure and difficulty in operation of the optical module; moreover, it is also conducive to realizing active packaging of the optical path in the optical module, improving the coupling accuracy in the optical path, and reducing optical loss.

[0082] It should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation method can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0083] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of this application. They are not intended to limit the scope of protection of this application. Any equivalent implementation methods or changes that do not deviate from the technical spirit of this application should be included in the scope of protection of this application.

Claims

1. An optical module comprising a housing, a circuit board assembly, and an optoelectronic assembly disposed within the housing, wherein the housing is provided with an optical interface, the optoelectronic assembly comprising an optoelectronic chip adjacent to and electrically connected to the circuit board assembly, and a wavelength division multiplexer / demultiplexer and an optoelectronic device sequentially arranged from the optoelectronic chip to the optical interface, characterized in that: The wavelength division multiplexer / demultiplexer is provided with a graphic circuit, and the optoelectronic device is electrically connected to the circuit board assembly via the graphic circuit.

2. The optical module according to claim 1, wherein The wavelength division multiplexer / demultiplexer includes a glass body for optical signals to pass through and a filter attached to the end face of the glass body. The graphic circuit is formed on the upper surface of the glass body.

3. The optical module according to claim 1, wherein: The wavelength division multiplexer / demultiplexer includes a glass body for optical signals to pass through, a filter attached to the end face of the glass body, and an additional board attached to the upper surface of the glass body. The graphic circuit is formed on the upper surface of the additional board.

4. The optical module according to claim 3, wherein: The additional plate is configured as a ceramic plate adhered to the upper surface of the glass body.

5. The optical module according to claim 3, wherein: The projection of the additional plate in the up-down direction completely falls within the projection of the glass body.

6. The optical module according to claim 1, wherein: The optoelectronic device is configured as any one or more of an optical amplifier, an optical detector, and an optical attenuator located in the optical path between the optical interface and the wavelength division multiplexer / demultiplexer.

7. The optical module according to claim 6, wherein: The optoelectronic chip is configured as a light receiving chip, and the optoelectronic device is configured as an optical amplifier; Alternatively, the optoelectronic chip is configured as a light emitting chip, and the optoelectronic device is configured as an optical attenuator.

8. The optical module according to claim 7, wherein: The circuit board assembly includes a main circuit board, which is configured as any one or more of a rigid circuit board, a rigid-flex circuit board, and a flexible circuit board. The circuit board assembly also includes a ceramic carrier electrically connected to the main circuit board. The optoelectronic device is electrically connected to the ceramic carrier via the graphic circuit; The light emitting chip is fixedly mounted on the ceramic carrier and electrically connected to the ceramic carrier via bonding wires; alternatively, the light receiving chip is electrically connected to a transimpedance amplifier via bonding wires, and the transimpedance amplifier is fixedly mounted on the ceramic carrier and electrically connected to the ceramic carrier via bonding wires.

9. The optical module according to claim 1, wherein: The housing comprises a lower housing and an upper housing, the lower housing comprises a bottom wall and an upper opening vertically opposite to the bottom wall, and the upper housing is mounted at the upper opening; The optical module further includes a cooler disposed between the optoelectronic device and the bottom wall, wherein the cooler is electrically connected to the circuit board assembly via the graphic circuit.

10. The optical module according to claim 9, wherein: One end of the graphic circuit is electrically connected to the optoelectronic device and the refrigerator through a bonding wire, and the other end of the graphic circuit is electrically connected to the circuit board assembly through a bonding wire.

11. The optical module according to claim 1, wherein: The housing comprises a lower housing and an upper housing, the lower housing comprises a bottom wall and an upper opening vertically opposite to the bottom wall, and the upper housing is mounted at the upper opening; The optical module further includes a second cooler disposed between the optoelectronic chip and the bottom wall, wherein the second cooler is electrically connected to the circuit board assembly through bonding wires.

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