Thermal insulation device, thermal insulation method and corresponding computer readable storage medium

Abstract

The embodiment of the present application provides a kind of heat insulation device, heat insulation method and computer readable storage medium, it is related to heat insulation technical field;Heat insulation device includes shell, and is arranged in the acquisition module, processing module, temperature regulating assembly and temperature measuring component in the shell;Wherein, shell is arranged in the test hole of test chamber, shell is communicated with test chamber by first through-hole;Temperature measuring component is connected with acquisition module, acquisition module is connected with processing module;Processing module is connected with temperature regulating assembly, and processing module is used to adjust the temperature inside shell by controlling temperature regulating assembly.The temperature inside shell is adjusted in the embodiment of the present application by temperature regulating assembly, so that the temperature inside shell is consistent with the temperature inside test chamber, to block the heat convection of test chamber with outside through heat insulation device, to improve the heat insulation effect of heat insulation device to test chamber.

Description

Technical Field

[0001] The present application relates to the field of thermal insulation technology, and in particular to a thermal insulation device, a thermal insulation method, and a corresponding computer-readable storage medium. Background Art

[0002] Conventional high and low temperature environmental test chambers typically use audible and visual alarms to warn of temperature violations, automatically shutting down the chamber if the temperature exceeds the specified limit. When testing the temperature of samples within the chamber, a thermometer is placed outside the chamber and a thermocouple is inserted through a test port. The test port is typically insulated with a thermal plug made of a polymer composite plastic.

[0003] However, the insulation effect of the insulation plug is poor, which will affect the high and low temperature environment tests.

[0004] Application Contents

[0005] The embodiments of the present application hope to provide a thermal insulation device, a thermal insulation method and a corresponding computer-readable storage medium, which can improve the thermal insulation effect and ensure the test effect of high and low temperature environment tests.

[0006] The technical solution of this application is achieved as follows:

[0007] An embodiment of the present invention provides a heat insulation device, which includes a housing, a collection module, a processing module, a temperature adjustment component, and a temperature measurement component; wherein,

[0008] The shell is arranged in the test hole of the test box, and the outer wall of the shell is in contact with the hole wall of the test hole; a first through hole is opened on the bottom wall of the shell, and the shell is connected to the test box through the first through hole;

[0009] The acquisition module, the processing module, the temperature adjustment component and the temperature measurement component are all arranged on the housing;

[0010] The temperature measuring component is connected to the acquisition module, and the temperature measuring component is used to detect the temperature of the object to be measured;

[0011] The acquisition module is connected to the processing module, and is used to obtain temperature data detected by the temperature measurement component and send the temperature data to the processing module; wherein the temperature data includes: test chamber temperature data, sample temperature data and insulation device temperature data;

[0012] The processing module is connected to the temperature adjustment component, and the processing module is used to control the temperature adjustment component according to the temperature value;

[0013] The temperature regulating assembly is used to adjust the temperature inside the shell until the temperature inside the shell is consistent with the temperature inside the test box.

[0014] In the above solution, the temperature measurement component includes: at least three temperature sensors; wherein,

[0015] The temperature measuring end of the first temperature sensor extends into the interior of the test box and is used to detect the temperature of the gas inside the test box;

[0016] The temperature measuring end of the second temperature sensor is connected to the sample in the test chamber;

[0017] A temperature measuring end of the third temperature sensor extends into the interior of the housing and is used to detect the temperature of the gas inside the housing;

[0018] The first temperature sensor, the second temperature sensor, and the third temperature sensor are any one of the at least three temperature sensors.

[0019] In the above solution, the heat insulation device further includes: a communication module; wherein,

[0020] The communication module is connected to the processing module, and is used to receive the alarm instruction sent by the processing module and send the alarm information to the client via SMS according to the alarm instruction.

[0021] In the above solution, the heat insulation device further comprises: at least one circuit board; wherein,

[0022] The at least one circuit board is disposed in the housing and divides the interior of the housing into a first space and a second space;

[0023] The processing module and the communication module are arranged in the first space, and the temperature adjustment component, the acquisition module and the temperature measurement component are arranged in the second space.

[0024] In the above solution, the at least one circuit board includes a first circuit board, a second circuit board and a third circuit board;

[0025] The first circuit board is disposed between the second circuit board and the third circuit board, and divides the interior of the housing into the first space and the second space; the communication module and the processing module are disposed on a side of the first circuit board close to the second circuit board, and the temperature adjustment component is disposed on a side of the first circuit board close to the third circuit board;

[0026] A notch is provided on the top of the housing, a display screen and a power interface are provided in an area corresponding to the notch on a side of the second circuit board facing away from the first circuit board, a power module is provided on a side of the second circuit board close to the first circuit board, an input end of the power module is connected to the power interface, an output end of the power module is connected to the display screen and the thermal insulation device, and the power module is used to supply power to the thermal insulation device and the display screen;

[0027] The third circuit board is arranged on the inner wall of the bottom of the housing, and a hole is opened on the third circuit board corresponding to the first through hole, and the acquisition module and the temperature measurement component are arranged on a side of the third circuit board close to the first circuit board;

[0028] The first circuit board, the second circuit board and the third circuit board are all connected by wires.

[0029] In the above solution, the heat insulation device further includes: a second through hole; wherein,

[0030] The second through hole is formed on a side wall of the housing that is in contact with the hole wall of the testing hole, and passes through the housing.

[0031] In the above solution, the housing includes: an outer shell and an inner shell; wherein,

[0032] The outer shell is arranged outside the inner shell, and the material of the outer shell is elastic material;

[0033] Edges of the first circuit board, the second circuit board, and the third circuit board are all fixed to the inner wall of the inner shell.

[0034] In the above solution, the temperature adjustment component includes: a resistance wire and a fan; wherein,

[0035] The resistance wire and the fan are both arranged on a side of the first circuit board close to the third circuit board; the resistance wire is connected to the processing module, and the resistance wire is used to heat the gas in the housing;

[0036] The fan is connected to the processing module and is used to cool the gas in the shell.

[0037] In the above solution, a protective tube is provided outside the resistance wire.

[0038] An embodiment of the present invention provides a heat insulation method, which is applied to the processing module in the above solution, and includes:

[0039] Obtain test chamber temperature data, sample temperature data and insulation device temperature data;

[0040] Comparing the test chamber temperature data, the sample temperature data, the insulation device temperature data, and at least one preset temperature data to obtain a corresponding comparison result;

[0041] According to the comparison result, the temperature regulating component is controlled to adjust the temperature inside the shell until the temperature data of the test chamber is consistent with the temperature data of the thermal insulation device, or an alarm instruction is sent to the communication module

[0042] In the above solution, the comparison of the test chamber temperature data, the sample temperature data, the insulation device temperature data, and at least one preset temperature data to obtain a corresponding comparison result includes:

[0043] Compare the test chamber temperature data and the insulation device temperature data to obtain the corresponding comparison result; or, compare the sample temperature data, the first preset temperature data and the second preset temperature data to obtain the corresponding comparison result; or, compare the test chamber temperature data, the third preset temperature data and the fourth preset temperature data to obtain the corresponding comparison result; wherein, the first preset temperature data, the second preset temperature data, the preset third preset temperature data and the preset fourth preset temperature data are the at least one preset temperature data.

[0044] In the above solution, according to the comparison result, controlling the temperature regulating component to adjust the temperature inside the housing until the temperature data of the test chamber is consistent with the temperature data of the thermal insulation device, or sending an alarm instruction to the communication module, includes:

[0045] When the comparison result shows that the test chamber temperature data is greater than or equal to the insulation device temperature data, the resistance wire in the temperature adjustment component is turned on and the fan in the temperature adjustment component is turned off until the test chamber temperature data is consistent with the insulation device temperature data;

[0046] When the comparison result shows that the test box temperature data is lower than the insulation device temperature data, the fan is turned on and the resistance wire is turned off until the test box temperature data is consistent with the insulation device temperature data.

[0047] In the above solution, according to the comparison result, the temperature regulating component is controlled to adjust the temperature inside the housing until the temperature data of the test chamber is consistent with the temperature data of the thermal insulation device, or an alarm instruction is sent to the communication module, which also includes:

[0048] When the comparison result is that the sample temperature data is greater than the first preset temperature data, or the sample temperature data is less than the second preset temperature data, a temperature alarm is sent to the communication module as the alarm instruction.

[0049] In the above solution, according to the comparison result, the temperature regulating component is controlled to adjust the temperature inside the housing until the temperature data of the test chamber is consistent with the temperature data of the thermal insulation device, or an alarm instruction is sent to the communication module, which also includes:

[0050] When the comparison result shows that the test chamber temperature data is greater than the third preset temperature data, or the test chamber temperature data is less than the fourth preset temperature data, an over-temperature alarm of the test chamber is sent to the communication module as the alarm instruction.

[0051] An embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores execution instructions. When a processing module executes the execution instructions, the heat insulation method according to the embodiment of the present invention is implemented.

[0052] Embodiments of the present invention provide a thermal insulation device, a thermal insulation method, and a computer-readable storage medium. The thermal insulation device includes a shell, an acquisition module, a processing module, a temperature adjustment component, and a temperature measurement component. The shell is disposed in a test hole of a test chamber, and the outer wall of the shell is in contact with the hole wall of the test hole. A first through hole is formed on the bottom wall of the shell, and the shell is connected to the test chamber through the first through hole. The acquisition module, the processing module, the temperature adjustment component, and the temperature measurement component are all disposed on the shell. The temperature measurement component is connected to the acquisition module and is used to detect the temperature of an object to be measured. The acquisition module is connected to the processing module and is used to obtain temperature data detected by the temperature measurement component and send the temperature data to the processing module. The temperature data includes test chamber temperature data, sample temperature data, and thermal insulation device temperature data. The processing module is connected to the temperature adjustment component and is used to control the temperature adjustment component based on the temperature value. The temperature adjustment component is used to adjust the temperature inside the shell until the temperature inside the shell is consistent with the temperature inside the test chamber.

[0053] In an embodiment of the present invention, the acquisition module collects the temperature through the temperature measuring component, and then the processing module controls the temperature regulating component to adjust the temperature inside the shell according to the data collected by the acquisition module, so that the temperature inside the shell is consistent with the temperature inside the test chamber, thereby blocking the heat convection between the test chamber and the outside world through the insulation device, so as to improve the insulation effect of the insulation device on the test chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A cross-sectional view of the structure of an optional thermal insulation device provided in an embodiment of the present invention;

[0055] Figure 2 A cross-sectional view of the structure of another optional thermal insulation device provided in an embodiment of the present invention;

[0056] Figure 3 A cross-sectional view of the structure of another optional thermal insulation device provided in an embodiment of the present invention;

[0057] Figure 4 A cross-sectional view of the structure of another optional thermal insulation device provided in an embodiment of the present invention;

[0058] Figure 5 A cross-sectional view of the structure of another optional thermal insulation device provided in an embodiment of the present invention;

[0059] Figure 6 A top view of another thermal insulation device provided by an embodiment of the present invention;

[0060] Figure 7 A bottom view of another thermal insulation device provided by an embodiment of the present invention;

[0061] Figure 8 A structural block diagram of a heat insulation device provided by an embodiment of the present invention;

[0062] Figure 9 A schematic flow chart of a heat insulation method provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0063] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0064] Figure 1 A cross-sectional view of the structure of an optional thermal insulation device provided in an embodiment of the present invention, such as Figure 1 As shown; an embodiment of the present invention provides a heat insulation device, the heat insulation device comprising:

[0065] Housing 1, acquisition module 16, processing module 11, temperature adjustment component 13 and temperature measurement component 15; wherein,

[0066] The housing 1 is disposed in the test hole of the test box, and the outer wall of the housing 1 is in contact with the inner wall of the test hole; a first through hole 9 is formed on the housing 1, and the housing 1 is connected to the test box through the first through hole 9;

[0067] The acquisition module 16, the processing module 11, the temperature adjustment component 13 and the temperature measurement component 15 are all arranged on the housing 1;

[0068] The temperature measuring component 15 is connected to the acquisition module 16, and the temperature measuring component 15 is used to detect the temperature of the object to be measured;

[0069] The acquisition module 16 is connected to the processing module 11 and is used to obtain the temperature data detected by the temperature measuring component 15 and send the temperature data to the processing module 11; wherein the temperature data includes: test chamber temperature data, sample temperature data and insulation device temperature data;

[0070] The processing module 11 is connected to the temperature adjustment component 13, and the processing module 11 is used to control the temperature adjustment component 13 according to the temperature value;

[0071] The temperature regulating assembly 13 is used to adjust the temperature inside the housing 1 until the temperature inside the housing 1 is consistent with the temperature inside the test chamber.

[0072] In this embodiment of the present invention, the thermal insulation device is placed within a test hole in the test chamber, with the outer wall of the housing 1 in contact with the inner wall of the test hole. The test hole is formed in and extends through the wall of the test chamber. The housing 1 can be a cube or a cylinder, with both ends of the housing 1 closed. For example, the housing 1 can be cylindrical.

[0073] In an embodiment of the present invention, the test chamber refers to a high and low temperature environment test chamber, which is used to detect whether a product is resistant to high or low temperatures, and can also be used to provide a constant test temperature environment. The test hole usually passes through the side wall of the test chamber, and the outer diameter of the shell 1 can be slightly larger than or equal to the inner diameter of the test hole. When the outer diameter of the shell 1 is slightly larger than the inner diameter of the test hole, it means that after the shell 1 is placed in the test hole, an interference fit will be formed between the shell 1 and the test hole, reducing the probability of the thermal insulation device detaching from the test hole. The height of the thermal insulation device can be greater than or equal to the thickness of the side wall of the test chamber, wherein, when the height of the thermal insulation device is greater than the thickness of the wall of the test chamber, the thermal insulation device is placed in the test hole, and both ends of the shell 1 will extend out of the test hole, so that one end of the shell 1 is located inside the test chamber and the other end is located outside the test chamber.

[0074] In this embodiment of the present invention, the first through hole 9 of the thermal insulation device extends through the housing 1, allowing communication between the housing 1 and the test chamber. This allows for convection between the gas within the housing 1 and the gas within the test chamber. There can be at least one first through hole 9, and the at least one first through hole 9 can be located at one end of the housing 1 near the interior of the test chamber.

[0075] In the embodiment of the present invention, the processing module 11 can not only process data and control the temperature adjustment component 13, but also has storage functions, alarm functions, etc.

[0076] In an embodiment of the present invention, the temperature regulating component 13 is used to heat up or cool down the temperature inside the shell 1 so that the temperature inside the shell 1 is consistent with the temperature inside the test chamber. The temperature regulating component 13 may include a heating component and a cooling component. The heating component is used to increase the temperature inside the shell 1, such as a heating rod. The cooling component is used to reduce the temperature inside the shell 1, such as a condenser. The temperature measuring component 15 is used to collect the temperature corresponding to the inside of the shell 1, the inside of the test chamber and / or the sample placed inside the test chamber, and obtain corresponding temperature data; the temperature measuring component 15 may be a thermocouple sensor.

[0077] In this embodiment of the present invention, the thermal insulation device can provide thermal insulation through a temperature measurement assembly 15. Exemplarily, the temperature measurement assembly 15 includes a thermocouple A and a thermocouple B. The temperature adjustment assembly 13 includes a heating element and a cooling element. The thermal insulation function is as follows: thermocouple A measures the test chamber temperature T1, while thermocouple B measures the internal temperature T2 of the housing 1, which is the internal temperature T2 of the thermal insulation device. After collecting T1 and T2, acquisition module 16 sends them to processing module 11. Processing module 11 compares the difference between T1 and T2 in real time and controls the operation of temperature adjustment component 13 to maintain a dynamic equilibrium between T1 and T2. If T1 ≥ T2, processing module 11 controls the heating element in temperature adjustment component 13 to operate, thereby heating the interior of housing 1. If T1 < T2, processing module 11 controls the heating element in temperature adjustment component 13 to stop operating, and the cooling element in temperature adjustment component 13 operates to transfer the higher temperature gas inside housing 1 to the test chamber, thereby accelerating the transfer of heat from the interior of housing 1 to the test chamber and cooling the interior of housing 1. During the above process, T1 and T2 are displayed in real time on the LCD screen.

[0078] In an embodiment of the present invention, the processing module 11 can output voltages of different sizes to the heating component in the temperature regulating component 13 according to the difference between the test chamber temperature and the insulation device temperature collected by the collection module 16, so as to control the heating state of the heating component in the temperature regulating component 13. Exemplarily, the acquisition module 16 transmits the collected temperatures T1, T2, and T3 to the processing module 11 in real time. The processing module 11 compares the sizes of T1 and T2. When T1-T2≥10°C, the processing module 11 outputs a voltage U for the heating component in the temperature regulating component 13 to work; when 10>T1-T2≥5°C, the processing module 11 outputs a voltage 0.5U for the heating component in the temperature regulating component 13 to work; when 5>T1-T2≥0°C, the processing module 11 outputs a voltage 0.25U for the heating component in the temperature regulating component 13 to work; when T1<T2, the processing module 11 outputs a voltage 0, the heating component in the temperature regulating component 13 does not work, and the cooling component in the temperature regulating component 13 works to exchange heat between the high-temperature air in the insulation device and the low-temperature air in the test box through the first through hole 9 until the temperature in the test box is consistent with the temperature in the insulation device, thereby achieving the effect of temperature consistency between the two.

[0079] It can be understood that in the embodiment of the present invention, the insulation device can raise or lower the temperature inside the shell 1 through the temperature adjustment component 13, so that the temperature inside the shell 1 is consistent with the temperature inside the test chamber, thereby blocking the heat convection between the test chamber and the outside world through the insulation device, so as to improve the insulation effect of the insulation device on the test chamber.

[0080] In some embodiments of the present invention, Figure 1 As shown, the temperature measurement component 15 includes: at least three temperature sensors; wherein,

[0081] The temperature measuring end of the first temperature sensor 151 is arranged inside the test chamber, and is used to detect the temperature of the gas inside the test chamber; the temperature measuring end of the second temperature sensor 152 is connected to the sample in the test chamber, and the temperature measuring end of the third temperature sensor 153 extends into the shell 1, and is used to detect the temperature of the gas inside the shell 1; the first temperature sensor 151, the second temperature sensor 152 and the third temperature sensor 153 are any one of the at least three temperature sensors.

[0082] In some embodiments of the present invention, at least three temperature sensors are thermocouples. In practical applications, the thermocouple includes an output end and a temperature measuring end, wherein the output end of the thermocouple is connected to the acquisition module 16, and the temperature measuring end of the thermocouple is in contact with the object to be measured.

[0083] In some embodiments of the present invention, since the first temperature sensor 151 is used to detect the internal temperature of the test chamber, the temperature measuring end of the first temperature sensor 151 will extend into the test chamber and come into contact with the gas inside the test chamber. Since the second temperature sensor 152 is used to detect the temperature of the test sample, the temperature measuring end of the second temperature sensor 152 will extend into the test chamber and come into contact with the surface of the sample inside the test chamber. Since the third temperature sensor 153 is used to detect the internal temperature of the thermal insulation device, the temperature measuring end of the third temperature sensor 153 will extend into the housing 1 and come into contact with the gas inside the housing 1.

[0084] It can be understood that the temperature measuring component 15 can simultaneously detect the temperature inside the insulation device, inside the test chamber and the sample, and can achieve real-time monitoring of the temperature conditions inside the insulation device, inside the test chamber and the sample, detect abnormalities in time and issue an alarm, thereby reducing the probability of the sample being damaged due to temperature abnormalities.

[0085] In some embodiments of the present invention, based on Figure 1 , Figure 2 A cross-sectional view of the structure of an optional thermal insulation device provided in an embodiment of the present invention; Figure 2 As shown, the thermal insulation device further includes a communication module 10; wherein,

[0086] The communication module 10 is connected to the processing module 11 . The communication module 10 is used to receive the alarm instruction sent by the processing module 11 and send the alarm information to the client via SMS according to the alarm instruction.

[0087] In some embodiments of the present invention, the communication module 10 is a narrowband Internet of Things (NB-IoT) module. When the communication module 10 receives an alarm instruction sent by the processing module 11, the communication module 10 uploads the alarm information to a cloud platform, which then sends the alarm information to the client via a text message. The cloud platform may be the oneNET cloud platform.

[0088] In some embodiments of the present invention, the thermal insulation device can provide at least one of the following services through the communication module 10: sample temperature measurement and over-temperature alarm function and test chamber over-temperature alarm function. Exemplarily, the temperature measurement component 15 also includes a thermocouple C; the sample temperature measurement and over-temperature alarm function is: the thermocouple C collects the sample temperature T3 placed in the test chamber, and compares T3 with the first preset temperature data (sample high temperature alarm temperature) T4 and the second preset temperature data (sample low temperature alarm temperature) T5. If T3>T4 or T3<T5, the temperature alarm mechanism is triggered, and the processing module 11 sends the corresponding alarm instruction to the NB-IoT module. The NB-IoT module transmits the alarm information to the client in the form of SMS through NB-IoT technology, and the relevant personnel can obtain the alarm information through the client. The client can be the mobile phone, computer, etc. of the relevant personnel. The over-temperature alarm function of the test chamber is: thermocouple A collects the internal temperature T1 of the test chamber, and compares T1 with the third preset temperature data (high temperature alarm temperature of the test chamber) T6 and the fourth preset temperature data (low temperature alarm temperature of the test chamber) T7. If T1>T6 or T1<T7, the over-temperature alarm mechanism of the test chamber is triggered, and the processing module 11 sends the corresponding alarm instruction to the NB-IoT module. The NB-IoT module transmits the alarm information to the client in the form of SMS through NB-IoT technology.

[0089] It is understandable that the communication module 10 uses NB-IOT technology to implement a remote alarm reminder function when the temperature exceeds the limit, reducing the safety issues that may be caused by the test chamber temperature exceeding the limit.

[0090] In some embodiments of the present invention, based on Figure 1 and Figure 2 , Figure 3 A cross-sectional view of another optional thermal insulation device provided in an embodiment of the present invention, such as Figure 3 Said heat insulation device further comprises: at least one circuit board; wherein,

[0091] At least one circuit board is disposed in the housing 1, and divides the interior of the housing 1 into a first space and a second space;

[0092] The processing module 11 and the communication module 10 are arranged in the first space, and the temperature adjustment component 13, the acquisition module 16 and the temperature measurement component 15 are arranged in the second space.

[0093] In some embodiments of the present invention, at least one circuit board can be a printed circuit board (PCB), and the at least one circuit board is fixed to the housing 1 via screws 5 to separate the interior of the housing 1 into a first space and a second space. Exemplarily, the at least one circuit board is a first circuit board 141, the processing module 11 and the communication module 10 are disposed on top of the first circuit board 141, the temperature adjustment component 13 is disposed on the bottom of the first circuit board 141, and the acquisition module 16 is connected to the temperature measurement component 15, and the acquisition module 16 is connected to the first circuit board 141 via a wire 8.

[0094] It is understandable that at least one circuit board 14 separates the housing 1 into a first space and a second space, so that the temperature of the first space is not easily affected by the temperature of the second space, thereby preventing the performance of the processing module 11 from being affected by the temperature of the second space.

[0095] In some embodiments of the present invention, based on Figure 3 , Figure 4 A cross-sectional view of the structure of another optional thermal insulation device provided in an embodiment of the present invention; Figure 4 As shown, the at least one circuit board includes a first circuit board 141, a second circuit board 142 and a third circuit board 143;

[0096] The first circuit board 141 is disposed between the second circuit board 142 and the third circuit board 143, and divides the interior of the housing into a first space and a second space; the communication module 10 and the processing module 11 are disposed on a side of the first circuit board 141 close to the second circuit board 142, and the temperature adjustment component 13 is disposed on a side of the first circuit board 141 close to the third circuit board 143;

[0097] A notch is provided at the top of the housing 1. The second circuit board 142 is located on a side facing away from the first circuit board 141. A display screen 3 and a power interface 4 are provided in the area corresponding to the notch. A power module 7 is provided on the side of the second circuit board 142 near the first circuit board 141. The input end of the power module 7 is connected to the power interface 4, and the output end of the power module 4 is connected to the display screen 3 and the thermal insulation device. The power module 7 is used to supply power to the thermal insulation device and the display screen 3.

[0098] The third circuit board 143 is provided on the inner wall of the bottom of the housing 1 , and a hole is opened on the third circuit board 143 corresponding to the first through hole 9 . The acquisition module 16 and the temperature measurement component 15 are provided on the side of the third circuit board 143 close to the first circuit board 141 .

[0099] The first circuit board 141 , the second circuit board 142 and the third circuit board 143 are all connected via wires 8 .

[0100] In some embodiments of the present invention, the power interface 4 is connected to the display screen 3, the temperature adjustment component 13, the processing module 11, the acquisition module 16, and the temperature measurement component 15. The power interface 4 is used to electrically connect to the power module 7, or to connect to an external power source; wherein, the power module 7 can be a rechargeable power module, which can be connected to an external power source for charging through the power interface 4. The display screen 3 can be a liquid crystal display screen, which is connected to the acquisition device and is used to display in real time the temperature data collected by the acquisition device through the temperature measurement component 15. In actual applications, the display screen 3 can be fixed in the notch, or fixed on the housing 1. A groove can also be provided on the housing 1, and the display screen 3 can be provided in the groove so that the upper surface of the display screen 3 is flush with the upper surface of the housing 1.

[0101] It is understandable that this can reduce the wiring harness in the housing 1, reduce the complexity of the internal components of the thermal insulation device, and facilitate subsequent maintenance or repair of the thermal insulation device.

[0102] In some embodiments of the present invention, Figure 4 As shown, the heat insulation device further includes: a second through hole 17; wherein,

[0103] The second through hole 17 is formed on the side wall of the housing 1 that is in contact with the hole wall of the testing hole, and passes through the housing 1 .

[0104] In some embodiments of the present invention, at least two second through holes 17 are provided. Exemplarily, four second through holes 17 may be provided, and the four second through holes 17 are divided into two groups. One group of second through holes 17 extends through the housing 1, connecting the test hole to the first space, and the other group of second through holes 17 extends through the housing 1, connecting the test hole to the second space. Each group of second through holes 17 is evenly distributed on the housing 1. In actual use, the thermal insulation device can be used to introduce a test cable into the thermal insulation device through the second through holes 17. The test cable can also be introduced into the test chamber through the first through hole 9, allowing the thermal insulation device or the test chamber to communicate with the outside.

[0105] It is understandable that the thermal insulation device can be connected to the outside through the second through hole 17, which is suitable for situations where a test cable needs to be led out of the thermal insulation device or the test box through the test hole.

[0106] In some embodiments of the present invention, based on Figure 4 , Figure 5 A cross-sectional view of the structure of another optional thermal insulation device provided in an embodiment of the present invention; Figure 5 As shown; the housing 1 includes an outer shell 101 and an inner shell 102; wherein the outer shell 101 is provided outside the inner shell 102, and the material of the outer shell 101 is an elastic material;

[0107] Edges of the first circuit board 141 , the second circuit board 142 , and the third circuit board 143 are all fixed to the inner wall of the inner shell 102 .

[0108] In some embodiments of the present invention, the shell 1 includes an inner shell 102 and an outer shell 101, the inner shell 102 is made of metal, such as stainless steel, etc.; the outer shell 101 is made of elastic material, such as polyurethane (PU) semi-rigid foam material, etc.; wherein the outer shell 101 can only cover the outer peripheral wall of the inner shell 102.

[0109] In some embodiments of the present invention, the inner peripheral wall of the inner shell 102 can be provided with a ridge or protrusion, so that the edges of the first circuit board 141, the second circuit board 142 and the third circuit board 143 can be fixed to the inner wall of the inner shell 102 by screws 5, or can be fixed to the inside of the inner shell 102 by an adhesive.

[0110] In some embodiments of the present invention, the second through hole 17 passes through the outer shell 101 and the inner shell 102 of the housing 1 .

[0111] It can be understood that the housing 101 is made of elastic material, and the compressibility of the elastic material can be used to improve the sealing effect between the thermal insulation device and the test hole.

[0112] In some embodiments of the present invention, Figure 5 As shown, the temperature adjustment component 13 includes a resistance wire 132 and a fan 131; wherein,

[0113] The resistance wire 132 and the fan 131 are both arranged on a side of the first circuit board 141 close to the third circuit board 143; the resistance wire 132 is connected to the processing module 13 and is used to heat the gas in the housing 1;

[0114] The fan 131 is connected to the processing module 13 , and the fan 13 is used to cool the gas in the housing 1 .

[0115] In some embodiments of the present invention, a protective tube is provided outside the resistance wire 132 .

[0116] In some embodiments of the present invention, the protection tube may be a carbon-containing protection tube.

[0117] In some embodiments of the present invention, Figure 5 As shown, the processing module 11 includes a single chip computer 111 and a storage module 112 .

[0118] In some embodiments of the present invention, based on Figure 5 , Figure 6 A top view of another thermal insulation device provided in an embodiment of the present invention; Figure 5 、 6As shown, the display screen 3 is fixed on the top of the inner shell 102 , and the power interface 4 is located on one side of the display screen 3 .

[0119] In some embodiments of the present invention, based on Figure 5 , Figure 7 A bottom view of another thermal insulation device provided by an embodiment of the present invention; Figure 7 As shown, there may be four through holes 2 , which are symmetrically opened at one end of the housing 1 close to the interior of the test box.

[0120] It is understandable that the protective tube can protect the resistance wire 132 to prevent the resistance wire 132 from directly contacting other devices, thereby improving the safety of the thermal insulation device.

[0121] In some embodiments of the present invention, Figure 5 As shown, the heat insulation device is placed inside the test hole of the test box, and the shell 1 of the heat insulation device includes a stainless steel inner shell (inner shell 102) and a PU semi-rigid foam outer shell (outer shell 101); the compressibility of the PU semi-rigid foam outer shell enables the heat insulation device and the test hole of the test box to achieve a certain sealing effect; wherein, the heat insulation device is connected to the external power adapter through the power interface 4 for power supply; PCB board 1 (second circuit board 142), PCB board 2 (first circuit board 141) and PCB board 3 (third circuit board 143) are fixed to the stainless steel inner shell by stainless steel screws (screws 5); P CB board 1 and PCB board 2 communicate and are powered by wire 8, and PCB board 2 and PCB board 3 communicate and are powered by wire 8; the thermal insulation device is connected to the test hole through through hole 1 (second through hole 17), and is connected to the inside of the test box through through hole 2 (first through hole 9); thermocouple A (first temperature sensor 151) is placed inside the test box for temperature collection, thermocouple C (second temperature sensor 152) is placed at the sample temperature measurement point in the test box for temperature collection, and thermocouple B (third temperature sensor 153) is placed inside the thermal insulation device for temperature collection inside the shell 1.

[0122] In some embodiments of the present invention, based on Figure 5 , Figure 8 A structural block diagram of a heat insulation device provided by an embodiment of the present invention; Figure 8As shown, exemplarily, the display screen 3, the communication module (NB-IoT module) 10, the temperature adjustment component 13 and the acquisition module 16 are all connected to the processing module 11, and each temperature sensor in the temperature measurement component 15 is connected to the acquisition module 16; wherein, each temperature sensor includes: a first temperature sensor 151, a second temperature sensor 152 and a third temperature sensor 153; the temperature adjustment component 13 includes a fan 131 and a resistance wire 132; the processing module 11 is composed of a single-chip microcomputer 111 and a storage module 112 connected together, and the storage module 112 is used to store the temperature data collected by the acquisition module 16.

[0123] In some embodiments of the present invention, before the test chamber starts running, the single-chip microcomputer 111 in the processing module 11 controls the fan 131 to start working. When the test chamber starts running, the temperature inside the test chamber begins to change. Thermocouple A causes its own resistance to change as the temperature inside the test chamber changes. The temperature acquisition unit (acquisition module 16) generates the test chamber temperature T1 based on the resistance of thermocouple A; the thermocouple C causes its own resistance to change as the temperature of the sample temperature measurement point changes, and the temperature acquisition unit generates the sample temperature T3 based on the resistance of thermocouple C; the thermocouple B causes its own resistance to change as the temperature inside the insulation device changes, and the temperature acquisition unit generates the internal temperature T2 of the insulation device based on the resistance of thermocouple B.

[0124] It can be understood that in the embodiment of the present invention, the thermal insulation device can increase or decrease the temperature inside the thermal insulation device through the resistance wire 132 and the fan 131, so that the temperature inside the thermal insulation device is consistent with the temperature inside the test box, thereby blocking the heat convection between the test box and the outside world through the thermal insulation device, so as to improve the thermal insulation effect of the thermal insulation device on the test box.

[0125] based on Figure 1-8 , Figure 9 A schematic flow chart of a heat insulation method provided by an embodiment of the present invention is shown in FIG. Figure 9 As shown; an embodiment of the present invention provides a heat insulation method, which is applied to the processing module 11 in the heat insulation device of the embodiment of the present invention; wherein the above method includes:

[0126] S201. Acquire test chamber temperature data, sample temperature data, and thermal insulation device temperature data.

[0127] In some embodiments of the present invention, the test chamber temperature data refers to the temperature of the gas inside the test chamber, the sample temperature data refers to the temperature of the temperature measuring point of the sample in the test chamber, and the insulation device temperature data refers to the temperature of the gas inside the insulation device, that is, the temperature of the gas in the second space in the shell 1.

[0128] It is understandable that after the processing module 11 acquires the test chamber temperature data, the sample temperature data and the thermal insulation device temperature data through the acquisition module 16 , the temperature conditions of the test chamber, the sample and the thermal insulation device can be obtained.

[0129] S202: Compare the test chamber temperature data, the sample temperature data, the insulation device temperature data, and at least one preset temperature data to obtain a corresponding comparison result.

[0130] In some embodiments of the present invention, the at least one preset temperature data may include a preset sample high temperature alarm temperature, a sample low temperature alarm temperature, a test chamber high temperature alarm temperature, and a test chamber low temperature alarm temperature.

[0131] In some embodiments of the present invention, S202 may include comparing the test chamber temperature data and the insulation device temperature data to obtain corresponding comparison results; or, comparing the sample temperature data, and the first preset temperature data and the second preset temperature data to obtain corresponding comparison results; or, comparing the test chamber temperature data, and the third preset temperature data and the fourth preset temperature data to obtain corresponding comparison results; wherein the first preset temperature data, the second preset temperature data, the preset third preset temperature data and the preset fourth preset temperature data are at least one preset temperature data.

[0132] In some embodiments of the present invention, the first preset temperature data is the sample high temperature alarm temperature, the second preset temperature data is the sample low temperature alarm temperature, the third preset temperature data is the test chamber high temperature alarm temperature, and the fourth preset temperature data is the test chamber low temperature alarm temperature.

[0133] It can be understood that by comparing the sample temperature data and the test chamber temperature data based on the first preset temperature data, the second preset temperature data, the third preset temperature data and the fourth preset temperature data, the temperature conditions of the sample and the test chamber can be obtained, thereby avoiding damage to the sample due to excessive sample temperature or safety problems caused by excessive test chamber temperature.

[0134] S203. According to the comparison result, the temperature regulating component is controlled to adjust the temperature inside the shell until the temperature data of the test chamber is consistent with the temperature data of the thermal insulation device, or an alarm instruction is sent to the communication module.

[0135] In some embodiments of the present invention, S203 may include: when the comparison result is that the test chamber temperature data is greater than or equal to the insulation device temperature data, turning on the resistance wire 132 in the temperature adjustment component 13, and turning off the fan 131 in the temperature adjustment component 13, until the test chamber temperature data is consistent with the insulation device temperature data; when the comparison result is that the test chamber temperature data is less than the insulation device temperature data, turning on the fan 131, and turning off the resistance wire 132, until the test chamber temperature data is consistent with the insulation device temperature data.

[0136] In some embodiments of the present invention, S203 may further include: when the comparison result is that the sample temperature data is greater than the first preset temperature data, or the sample temperature data is less than the second preset temperature data, sending a temperature alarm as an alarm instruction to the communication module 10.

[0137] In some embodiments of the present invention, S203 may further include: when the comparison result is that the test chamber temperature data is greater than the third preset temperature data, or the test chamber temperature data is less than the fourth preset temperature data, sending a test chamber overtemperature alarm as an alarm instruction to the communication module 10.

[0138] It can be understood that the present invention can take temperature control measures based on the temperature difference between the internal temperature of the insulation device and the internal temperature of the test chamber, dynamically adjust the temperature of the insulation device itself, and keep it consistent with the internal temperature of the test chamber in real time, thereby blocking the test chamber from transferring heat energy to the outside of the test chamber through the test hole, thereby improving the thermal insulation effect; and when the sample temperature exceeds the set sample high temperature or sample low temperature, or the test chamber temperature exceeds the set test chamber high temperature or test chamber low temperature, the alarm information will be notified to the relevant personnel in a timely manner through text messages sent through the communication module 10, thereby improving the timeliness and transmission distance of the alarm information.

[0139] An embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores execution instructions. When the processing module 11 executes the execution instructions, the heat insulation method according to the embodiment of the present invention is implemented.

[0140] It should be understood that the "one embodiment" or "an embodiment" or "some embodiments" or "other embodiments" or "for example" or "another example" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" or "in some embodiments" or "for example" or "another example" etc. appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present invention, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention. The serial numbers of the embodiments of the present invention mentioned above are for description only and do not represent the advantages and disadvantages of the embodiments. The above description of the various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other. For the sake of brevity, they will not be repeated here.

[0141] The term "and / or" in this article is only a description of the association relationship between associated objects, indicating that there can be three relationships. For example, object A and / or object B can mean: object A exists alone, object A and object B exist at the same time, and object B exists alone.

[0142] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0143] In the several embodiments provided by the present invention, it should be understood that the disclosed devices can be implemented in other ways. The embodiments described above are merely illustrative. For example, multiple modules or components can be combined or integrated into another system, or some features can be omitted or not implemented. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or modules can be electrical, mechanical, or other forms.

[0144] The features disclosed in several product embodiments provided by the present invention can be arbitrarily combined without conflict to obtain new product embodiments.

[0145] The features disclosed in the several device embodiments provided by the present invention can be arbitrarily combined without conflict to obtain new device embodiments.

[0146] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of hardware embodiments, software embodiments, or embodiments combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage and optical storage, etc.) containing computer-usable program code.

[0147] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0148] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0149] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention.

Claims

1. A heat insulation device, characterized in that: The thermal insulation device includes a shell, a collection module, a processing module, a temperature adjustment component and a temperature measurement component; wherein, The shell is arranged in the test hole of the test box, and the outer wall of the shell is in contact with the hole wall of the test hole; a first through hole is opened on the bottom wall of the shell, and the shell is connected to the test box through the first through hole; The acquisition module, the processing module, the temperature adjustment component and the temperature measurement component are all arranged on the housing; The temperature measuring component is connected to the acquisition module, and the temperature measuring component is used to detect the temperature of the object to be measured; The acquisition module is connected to the processing module, and is used to obtain temperature data detected by the temperature measurement component and send the temperature data to the processing module; wherein the temperature data includes: test chamber temperature data, sample temperature data and insulation device temperature data; The processing module is connected to the temperature adjustment component, and the processing module is used to control the temperature adjustment component according to the temperature value; The temperature regulating assembly is used to adjust the temperature inside the shell until the temperature inside the shell is consistent with the temperature inside the test box.

2. The thermal insulation device according to claim 1, characterized in that The temperature measurement component includes: at least three temperature sensors; wherein, The temperature measuring end of the first temperature sensor extends into the interior of the test box and is used to detect the temperature of the gas inside the test box; The temperature measuring end of the second temperature sensor is connected to the sample in the test chamber; A temperature measuring end of the third temperature sensor extends into the interior of the housing and is used to detect the temperature of the gas inside the housing; The first temperature sensor, the second temperature sensor, and the third temperature sensor are any one of the at least three temperature sensors.

3. The thermal insulation device according to claim 1 or 2, characterized in that: The thermal insulation device further comprises: a communication module; wherein, The communication module is connected to the processing module, and is used to receive the alarm instruction sent by the processing module and send the alarm information to the client via SMS according to the alarm instruction.

4. The thermal insulation device according to claim 3, characterized in that The heat insulation device further comprises: at least one circuit board; wherein, The at least one circuit board is disposed in the housing and divides the interior of the housing into a first space and a second space; The processing module and the communication module are arranged in the first space, and the temperature adjustment component, the acquisition module and the temperature measurement component are arranged in the second space.

5. The thermal insulation device according to claim 4, characterized in that The at least one circuit board includes a first circuit board, a second circuit board and a third circuit board; The first circuit board is disposed between the second circuit board and the third circuit board, and divides the interior of the housing into the first space and the second space; the communication module and the processing module are disposed on a side of the first circuit board close to the second circuit board, and the temperature adjustment component is disposed on a side of the first circuit board close to the third circuit board; A notch is provided on the top of the housing, a display screen and a power interface are provided in an area corresponding to the notch on a side of the second circuit board facing away from the first circuit board, a power module is provided on a side of the second circuit board close to the first circuit board, an input end of the power module is connected to the power interface, an output end of the power module is connected to the display screen and the thermal insulation device, and the power module is used to supply power to the thermal insulation device and the display screen; The third circuit board is arranged on the inner wall of the bottom of the housing, and a hole is opened on the third circuit board corresponding to the first through hole, and the acquisition module and the temperature measurement component are arranged on a side of the third circuit board close to the first circuit board; The first circuit board, the second circuit board and the third circuit board are all connected by wires.

6. The thermal insulation device according to claim 4 or 5, characterized in that: The heat insulation device further includes: a second through hole; wherein, The second through hole is formed on a side wall of the housing that is in contact with the hole wall of the testing hole, and passes through the housing.

7. The thermal insulation device according to claim 5, characterized in that The housing comprises an outer shell and an inner shell; wherein, The outer shell is arranged outside the inner shell, and the material of the outer shell is elastic material; Edges of the first circuit board, the second circuit board, and the third circuit board are all fixed to the inner wall of the inner shell.

8. The thermal insulation device according to claim 5, characterized in that The temperature adjustment component includes: a resistance wire and a fan; wherein, The resistance wire and the fan are both arranged on a side of the first circuit board close to the third circuit board; the resistance wire is connected to the processing module, and the resistance wire is used to heat the gas in the housing; The fan is connected to the processing module and is used to cool the gas in the shell.

9. The thermal insulation device according to claim 8, characterized in that A protection tube is provided outside the resistance wire.

10. A heat insulation method, characterized in that: The method is applied to the thermal insulation device according to any one of claims 1 to 9, and the method comprises: Obtain test chamber temperature data, sample temperature data and insulation device temperature data; Comparing the test chamber temperature data, the sample temperature data, the insulation device temperature data, and at least one preset temperature data to obtain a corresponding comparison result; According to the comparison result, the temperature regulating component is controlled to adjust the temperature inside the shell until the temperature data of the test box is consistent with the temperature data of the thermal insulation device, or an alarm instruction is sent to the communication module.

11. The heat insulation method according to claim 10, characterized in that: The comparing the test chamber temperature data, the sample temperature data, the insulation device temperature data, and at least one preset temperature data to obtain a corresponding comparison result includes: Compare the test chamber temperature data and the insulation device temperature data to obtain the corresponding comparison result; or compare the sample temperature data, the first preset temperature data and the second preset temperature data to obtain the corresponding comparison result; or compare the test chamber temperature data, the third preset temperature data and the fourth preset temperature data to obtain the corresponding comparison result; wherein, the first preset temperature data, the second preset temperature data, the third preset temperature data and the fourth preset temperature data are the at least one preset temperature data.

12. The heat insulation method according to claim 10, characterized in that: According to the comparison result, controlling the temperature regulating component to adjust the temperature inside the housing until the temperature data of the test chamber is consistent with the temperature data of the thermal insulation device, or sending an alarm instruction to the communication module, includes: When the comparison result shows that the test chamber temperature data is greater than or equal to the insulation device temperature data, the resistance wire in the temperature adjustment component is turned on and the fan in the temperature adjustment component is turned off until the test chamber temperature data is consistent with the insulation device temperature data; When the comparison result shows that the test box temperature data is lower than the insulation device temperature data, the fan is turned on and the resistance wire is turned off until the test box temperature data is consistent with the insulation device temperature data.

13. The heat insulation method according to claim 11, characterized in that: According to the comparison result, controlling the temperature regulating component to adjust the temperature inside the housing until the temperature data of the test chamber is consistent with the temperature data of the thermal insulation device, or sending an alarm instruction to the communication module, further comprising: When the comparison result shows that the sample temperature data is greater than the first preset temperature data, or the sample temperature data is less than the second preset temperature data, a temperature alarm is sent to the communication module as the alarm instruction.

14. The heat insulation method according to claim 11, characterized in that: According to the comparison result, controlling the temperature regulating component to adjust the temperature inside the housing until the temperature data of the test chamber is consistent with the temperature data of the thermal insulation device, or sending an alarm instruction to the communication module, further comprising: When the comparison result shows that the test chamber temperature data is greater than the third preset temperature data, or the test chamber temperature data is less than the fourth preset temperature data, an over-temperature alarm of the test chamber is sent to the communication module as the alarm instruction.

15. A computer-readable storage medium, characterized in that The computer-readable storage medium stores execution instructions, and when the processing module executes the execution instructions, the thermal insulation method according to any one of claims 10 to 14 is implemented.

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