Fluid immersion cooling system

Abstract

The present application provides a fluid immersion cooling system, including a shell, a circuit board, and a partition. The number of circuit boards is multiple, and the multiple circuit boards are spaced apart in a receiving cavity and are all located at the bottom of the shell. A guide hole is provided on the side of the circuit board close to the bottom of the shell; the number of partitions is multiple, and one partition is located between two adjacent circuit boards and is spaced apart from the corresponding circuit boards; the area between the partition and the circuit board, the top area of ​​the partition, and the guide hole together form a continuously curved flow channel for the circulation of the coolant. Through the above arrangement, the circulation area of ​​the coolant is reduced and the circulation speed is increased; the flow direction of the coolant on the chip side in the receiving cavity is the same as the flow direction of the bubbles generated by vaporization, and the generation of bubbles will cause a pressure difference. Under the action of the pressure difference, the circulation speed of the coolant is increased, and the bubbles are driven to flow, which can increase the flow speed of the bubbles and thereby improve the cooling efficiency of the fluid immersion cooling system.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment cooling, and in particular to a fluid immersion cooling system. Background Art

[0002] Electronic systems, such as information technology equipment (e.g., computers, routers, packet switches, cellular circuits), generate heat during operation. Fluid immersion cooling systems, including two-phase fluid immersion cooling systems, immerse the electronic systems in a coolant.

[0003] In a two-phase fluid immersion cooling system, the heat energy generated by the electronic system converts the coolant into vapor. The vapor rises and is collected by a condensing structure, which converts the vapor into liquid. The liquid then falls back into the coolant, completing the cooling cycle.

[0004] However, the above-mentioned fluid immersion cooling system has poor cooling effect, which affects user performance. Summary of the Invention

[0005] In order to solve at least one of the problems mentioned in the background technology, the present application provides a fluid immersion cooling system, which aims to solve the technical problem that the fluid immersion cooling system in the related technology has poor cooling effect and affects user use.

[0006] To achieve the above objectives, the present application provides a fluid immersion cooling system, comprising a housing, a circuit board, and a partition. The housing has a receiving cavity for accommodating a coolant. The housing comprises a plurality of circuit boards, which are spaced apart within the receiving cavity and are all located at the bottom of the housing. A guide hole is provided on a side of the circuit board close to the bottom of the housing. The partition comprises a plurality of partitions, one of which is located between two adjacent circuit boards and spaced apart from the corresponding circuit board.

[0007] The area between the partition and the circuit board, the top area of ​​the partition and the guide holes together form a continuously bent flow channel for the coolant to flow.

[0008] In the above-mentioned fluid immersion cooling system, optionally, a chip is provided on the circuit board, the surface of the circuit board on which the chip is provided is the front side, and the surface on which the chip is not provided is the back side, and the distance between the front side and the corresponding partition is greater than the distance between the back side and the corresponding partition.

[0009] In the above-mentioned fluid immersion cooling system, optionally, the distance between the front surface and the corresponding partition is A, the distance between the back surface and the corresponding partition is B, and the relationship between A and B is:

[0010]

[0011] In the above-mentioned fluid immersion cooling system, optionally, a plurality of the chips are provided on one circuit board, and the plurality of chips are arranged in an array at intervals on the circuit board;

[0012] The fluid immersion cooling system further includes a heat conducting member. There are multiple heat conducting members, each of which corresponds to the multiple chips and is arranged on a side of the corresponding chip away from the circuit board.

[0013] In the above-mentioned fluid immersion cooling system, optionally, the heat conducting member includes a metal member or graphite, and the heat conducting member at least covers a corresponding portion of the chip.

[0014] In the above-mentioned fluid immersion cooling system, optionally, the side of the partition away from the bottom of the shell is spaced apart from the inner wall of the top of the shell;

[0015] The side of the circuit board away from the bottom of the shell is spaced apart from the inner wall of the top of the shell, or the side of the circuit board away from the bottom of the shell is closely attached to the inner wall of the top of the shell.

[0016] In the above-mentioned fluid immersion cooling system, optionally, along an extension direction perpendicular to the circuit board, the orthographic projection of the partition on the housing at least covers the orthographic projection of the circuit board on the housing.

[0017] In the above-mentioned fluid immersion cooling system, optionally, there are multiple guide holes, and the multiple guide holes are arranged in an array at intervals on the circuit board.

[0018] In the above-mentioned fluid immersion cooling system, it is optional to further include an inner condenser and an outer condenser that are interconnected, wherein the inner condenser is located in the accommodating cavity and is arranged near the top of the shell, and the outer condenser is located outside the shell and is connected and conducted with the inner condenser.

[0019] In the above-mentioned fluid immersion cooling system, optionally, there are multiple inner condensing tubes, the multiple inner condensing tubes are arranged in parallel and spaced apart, and the multiple inner condensing tubes are all connected to the outer condensing tube.

[0020] The fluid immersion cooling system provided in the present application includes a shell, a circuit board and a partition. The shell has a accommodating cavity for accommodating a coolant. The coolant is used to cool the circuit board and perform convection heat exchange with the circuit board. Part of the coolant will vaporize in this process. There are multiple circuit boards, and the multiple circuit boards are arranged at intervals in the accommodating cavity and are all located at the bottom of the shell. A guide hole is provided on the side of the circuit board close to the bottom of the shell. By providing the above-mentioned guide hole, the coolant can flow from one side of the circuit board to the other side. There are multiple partitions, and one partition is located between two adjacent circuit boards and is spaced apart from the corresponding circuit boards. By providing the above-mentioned partition, the space between adjacent circuit boards is reduced, the circulation area of ​​the coolant is reduced, and the circulation speed is increased. The area between the partition and the circuit board, the top area of ​​the partition and the guide hole together form a continuously curved circulation channel for the circulation of the coolant. Through this arrangement, the flow channel forms a continuously curved structure. The direction of coolant flow within the chip-side of the housing cavity aligns with the flow direction of the bubbles generated by vaporization. The generation of bubbles and their movement away from the bottom of the housing under the action of gravity create a low-pressure area compared to the coolant remaining in the flow state, resulting in a pressure differential. This pressure differential increases the coolant's flow velocity, thereby improving the cooling efficiency of the fluid immersion cooling system. Furthermore, the accelerated coolant flow drives the bubbles, increasing their velocity and, consequently, the cooling efficiency of the fluid immersion cooling system.

[0021] The structure of the present application and its other application objectives and beneficial effects will be more clearly understood through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 A schematic structural diagram of a fluid immersion cooling system provided in an embodiment of the present application;

[0024] Figure 2 for Figure 1 Schematic diagram of the enlarged structure of the rectangular dotted box in FIG.

[0025] Figure 3 A schematic structural diagram of a circuit board of a fluid immersion cooling system provided in an embodiment of the present application from another perspective;

[0026] Figure 4A schematic diagram of a first structure of a circuit board of a fluid immersion cooling system provided in an embodiment of the present application;

[0027] Figure 5 A second structural schematic diagram of a circuit board of a fluid immersion cooling system provided in an embodiment of the present application;

[0028] Figure 6 A third structural schematic diagram of a circuit board of the fluid immersion cooling system provided in an embodiment of the present application;

[0029] Figure 7 A fourth structural schematic diagram of a circuit board of the fluid immersion cooling system provided in an embodiment of the present application;

[0030] Figure 8 A first structural schematic diagram from another perspective of the fluid immersion cooling system provided in an embodiment of the present application;

[0031] Figure 9 Another structural schematic diagram of the fluid immersion cooling system provided in an embodiment of the present application;

[0032] Figure 10 A second structural schematic diagram from another perspective of the fluid immersion cooling system provided in an embodiment of the present application.

[0033] Description of reference numerals:

[0034] 100-Fluid immersion cooling system;

[0035] 110-housing;

[0036] 120-circuit board;

[0037] 130-partition;

[0038] 111-accommodation chamber;

[0039] 121- diversion hole;

[0040] 140-heat conducting parts;

[0041] 150-inner condenser;

[0042] 160-external condenser;

[0043] 170-seal;

[0044] 180-drying pieces;

[0045] 190-Vacuum plug.

[0046] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0047] In related art, multiple circuit boards are installed within a housing, with both sides of the circuit boards spaced apart from the housing. Coolant circulates between the multiple circuit boards. During the flow of the coolant, some coolant flows through the gap between the top of the housing and the circuit boards, while another portion flows through the gap between the bottom of the housing and the circuit boards. The coolant flows in opposite directions, causing a conflict. Furthermore, due to convection heat transfer between the circuit boards and the coolant, some coolant vaporizes, generating bubbles that flow away from the ground, in the opposite direction of the coolant flow. This creates a conflict, affecting the flow of the coolant and bubbles, and consequently, the cooling effect of the fluid immersion cooling system.

[0048] Based on the above technical problems, the present application provides a fluid immersion cooling system, including a shell, a circuit board and a partition. The shell has a accommodating cavity, which is used to accommodate coolant. The coolant is used to cool the circuit board and perform convection heat exchange with the circuit board. Part of the coolant will vaporize in this process; there are multiple circuit boards, and the multiple circuit boards are arranged at intervals in the accommodating cavity and are all located at the bottom of the shell. A guide hole is provided on the side of the circuit board close to the bottom of the shell. By setting the above-mentioned guide hole, the coolant can flow from one side of the circuit board to the other side; there are multiple partitions, and one partition is located between two adjacent circuit boards and is spaced apart from the corresponding circuit boards. By setting the above-mentioned partition, the space between adjacent circuit boards is reduced, the circulation area of ​​the coolant is reduced, and the circulation speed is increased; the area between the partition and the circuit board, the top area of ​​the partition and the guide hole together form a continuously curved circulation channel for the circulation of the coolant. The above arrangement creates a continuously curved flow channel. The coolant's flow direction on the chip side of the housing cavity aligns with the flow direction of the bubbles generated by vaporization. The generation of bubbles and their movement away from the bottom of the housing under the influence of gravity create a low-pressure area, resulting in a pressure differential, compared to the coolant remaining in the flow state. This pressure differential increases the coolant's flow velocity, improving the cooling efficiency of the fluid immersion cooling system. Furthermore, the accelerated coolant flow drives the bubbles, increasing their velocity and ultimately the cooling efficiency of the fluid immersion cooling system.

[0049] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar structural parts or structural parts with the same or similar functions. The described embodiments are part of the structural embodiments of the present application, rather than full structural embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application. The embodiments of the present application are described in detail below in conjunction with the drawings.

[0050] In order to achieve the above purpose, please refer to the attached Figure 1 As shown, the present application provides a fluid immersion cooling system 100 , which includes a housing 110 , a circuit board 120 and a partition 130 .

[0051] Specifically, refer to the attached Figure 1 As shown, the housing 110 has a receiving chamber 111 for accommodating a coolant. The coolant is used to cool the circuit board 120 and conduct convective heat exchange with the circuit board 120, with some of the coolant vaporizing during this process. For example, the coolant may include water, mineral oil, or a fluorinated liquid. The embodiments of the present application do not limit the specific form of the coolant, nor are they limited to the above examples.

[0052] The following description will be made using the example of a coolant including a fluorinated liquid. The boiling point of the fluorinated liquid may be in the range of 30°C to 80°C, so as to facilitate convection heat transfer to the circuit board 120. The fluorinated liquid may be HFE-7000, HFE-7100, FC-3284, FC-72, FCM-47, and One or more of 2000.

[0053] It should be noted that the housing 110 has a certain pressure bearing capacity and a certain thickness to withstand the flow of coolant. In some embodiments, the housing 110 can withstand a pressure of 0.1 MPa. For example, the housing 110 can be made of aluminum alloy, copper or a copper alloy, stainless steel or other metals, or acrylic sheet material.

[0054] Among them, the thickness range of the shell 110 can be 4-6 mm. For example, the thickness of the shell 110 can be 4 mm, 5 mm, 6 mm, etc. The embodiment of the present application does not limit the specific thickness of the shell 110, nor is it limited to the above examples.

[0055] The following description will be made by taking as an example that the material of the housing 110 includes 3003 aluminum alloy and the thickness of the housing 110 is 5 mm.

[0056] Specifically, refer to the attached Figure 1 As shown, there are multiple circuit boards 120, and the multiple circuit boards 120 are arranged at intervals in the accommodating cavity 111 and are all located at the bottom of the shell 110. A guide hole 121 is provided on one side of the circuit board 120 close to the bottom of the shell 110. The guide hole 121 can be used to conduct coolant, so that the coolant can flow from one side of the circuit board 120 to the other side, so as to form mutually connected circulation channels, thereby facilitating the return of the coolant.

[0057] The circuit board 120 may include an FR-4 fiberglass cloth substrate, a CEM-1 / 3 fiberglass and paper composite substrate, an FR-1 paper-based copper-clad laminate, a metal-based copper-clad laminate, etc. The embodiments of the present application do not limit the specific form of the circuit board 120, nor are they limited to the above examples.

[0058] The following description will be made by taking the circuit board 120 including the FR-4 epoxy fiberglass cloth substrate as an example.

[0059] Specifically, refer to the attached Figure 1 As shown, there are multiple partitions 130 , one partition 130 is located between two adjacent circuit boards 120 and is spaced apart from the corresponding circuit board 120 so that the coolant can flow in the area between the circuit board 120 and the partition 130 .

[0060] It should be noted that the separator 130 is non-conductive to prevent contact between the circuit board 120 and the separator 130, which could affect the normal operation of the circuit board 120. Furthermore, there is a corresponding relationship between the separator 130 and the coolant. For example, when the coolant is a fluorinated liquid, the separator 130 can be made of a resin compatible with the fluorinated liquid or an acrylic sheet. The present embodiment of the application does not limit the material used for the separator 130, nor is it limited to the above examples.

[0061] It can be understood that by arranging the above-mentioned partition 130 between adjacent circuit boards 120, the space between adjacent circuit boards 120 is reduced, and thus the circulation area of ​​the coolant is reduced. When the coolant introduction conditions remain unchanged, the circulation speed of the coolant can be increased, and the time required for the coolant to complete the flow backflow is shortened, thereby improving the cooling efficiency of the fluid immersion cooling system 100.

[0062] Furthermore, the area between the partition 130 and the circuit board 120, the top area of ​​the partition 130, and the guide holes 121 collectively form a continuously curved flow channel for the coolant to flow. It should be noted that the top area of ​​the partition 130 can refer to the through hole provided on the top of the partition 130 or the space between the partition 130 and the top of the housing 110.

[0063] Refer to the attached Figure 1 As shown, the area between the partition 130 and the circuit board 120 is area a, the top area of ​​the partition 130 is area b, and the area for circulation of the guide hole 121 is area c. During the circulation of the coolant, the coolant begins to circulate from the area between the circuit board 120 and the side of the housing 110, and enters area a through the guide hole 121, i.e., area c. In area a, the coolant flows from the bottom of the housing 110 to the top of the housing 110. At this time, bubbles generated by the vaporization of the coolant also flow to the top of the housing 110 (it should be noted that the bubbles generated by the vaporization of the coolant are coolant gas, i.e., the bubbles are gaseous coolant and the coolant is liquid bubbles, the difference being only in the change of state). The flow direction of the coolant on the chip side of the accommodating cavity 111 is the same as the flow direction of the bubbles generated by vaporization. The flow velocity of the bubbles is less affected by the coolant, which facilitates improving the cooling efficiency of the fluid immersion cooling system 100. At the same time, the circulation of the coolant is less affected by the bubbles, and the flow velocity is improved, which can improve the cooling efficiency of the fluid immersion cooling system 100.

[0064] Furthermore, the coolant flows from region a to region b, and then flows through region b to another region a, and then flows through region c to another region a, and continues the above flow process. It can be understood that the flow direction of the coolant in two adjacent regions a is opposite, and the flow direction in regions b and c is the same, thereby forming a continuous curved flow channel for the coolant in the accommodating cavity 111. By forming the above-mentioned coolant flow channel, on the one hand, the conflict between the coolant and the bubbles can be reduced, and on the other hand, the flow speed of the coolant in the accommodating cavity 111 can be increased, thereby improving the cooling efficiency of the fluid immersion cooling system 100.

[0065] It should be noted that, through the above-mentioned setting, the circulation speed of the coolant in the accommodating cavity 111 can be increased, and the flow speed of the bubbles can be increased. Compared with the scheme without the above-mentioned setting, the fluid immersion cooling system 100 in the embodiment of the present application can cool more heat per unit time, that is, the heat flux density (Heat Flux) increases, which can meet the heat dissipation requirements of electronic devices with high heat flux density, such as CPU (Central Processing Unit) that generates large power consumption, and can meet user needs.

[0066] As an optional embodiment, a chip (not shown in the figure) is provided on the circuit board 120, the surface on which the chip is provided on the circuit board 120 is the front side, and the surface on which the chip is not provided is the back side. The distance between the front side and the corresponding partition 130 is greater than the distance between the back side and the corresponding partition 130.

[0067] It is understandable that the chip arranged on the circuit board 120 will emit heat during operation. During this process, the coolant can also perform convection heat exchange with the chip, thereby reducing the temperature of the chip and ensuring the normal operation of the chip.

[0068] It should be noted that each circuit board 120 has a front and a back, and the front is in the same position relative to the circuit board 120, that is, the front of each circuit board 120 faces one side of the corresponding circuit board 120. When the chip located on the front is in working condition, the bubbles generated by the convection heat exchange between the coolant and the chip and the circuit board 120 are all located on one side of the corresponding circuit board 120, that is, the side where the front is located. In this way, the bubbles generated by adjacent circuit boards 120 and chips will not interfere with each other and affect the flow of bubbles.

[0069] It is understood that the surface of the circuit board 120 on which the chip is provided is the front surface, and the surface of the circuit board 120 opposite to the front surface is the back surface. Further, the partition 130 is provided between two adjacent circuit boards 120, that is, the two sides of the partition 130 correspond to the front surface of one circuit board 120 and the back surface of the other circuit board 120, respectively. Figure 1 As shown, area a includes area a1 and area a2. The area between the partition 130 and the front surface of the circuit board 120 is area a1, and the area between the partition 130 and the back surface of the circuit board 120 is area a2.

[0070] It is understood that during the circulation of the coolant, the coolant begins to circulate from the area between the circuit board 120 and the side of the shell 110, and enters the a1 area from the c area. In the a1 area, the coolant flows from the bottom of the shell 110 to the top of the shell 110. At this time, the bubbles generated by the vaporization of the coolant also flow to the top of the shell 110. Afterwards, the coolant flows from the a1 area to the b area, and then flows through the b area to the a2 area. In the a2 area, the coolant flows from the top of the shell 110 to the bottom of the shell 110, close to the guide hole 121, and flows from the a2 area to another a1 area through the guide hole 121. As a result, the coolant can form a continuously curved circulation channel in the accommodating cavity 111. By forming the above-mentioned coolant circulation channel, on the one hand, the conflict between the coolant and the bubbles can be reduced, and on the other hand, the circulation speed of the coolant in the accommodating cavity 111 can be increased, thereby improving the cooling efficiency of the fluid immersion cooling system 100.

[0071] As an optional embodiment, refer to the attached Figure 1 and attached Figure 2 As shown, the distance between the front surface and the corresponding partition 130 is A, and the distance between the back surface and the corresponding partition 130 is B. The relationship between A and B is:

[0072]

[0073] By setting A to be greater than B, that is, the distance between the front surface and the corresponding partition 130 is greater than the distance between the back surface and the corresponding partition 130, the requirement of simultaneous flow of coolant and bubbles in the a1 region is met, providing sufficient space for the circulation of coolant and the flow of bubbles, thereby improving the cooling efficiency of the fluid immersion cooling system 100.

[0074] It is understandable that the values ​​of A and B can be arbitrary. For example, A can be 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, etc., and correspondingly, B can be 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 2 mm, etc. The embodiments of the present application are not limited to the specific values ​​of A and B, nor are they limited to the above examples. It is sufficient that the above relationship is satisfied.

[0075] It should be noted that as many circuit boards 120 as possible can be installed in the same housing 110 to improve the utilization rate of the coolant while meeting the cooling requirements for the circuit boards 120 .

[0076] As an optional embodiment, the front surface and the bottom surface of the shell 110 are arranged to intersect each other. For example, the angle range between the front surface and the bottom surface of the shell 110 can be 90°-120°, that is, the angle between the front surface and the bottom surface of the shell 110 is a right angle or a smaller obtuse angle, so that bubbles can flow along the bottom of the shell 110 toward the top of the shell 110.

[0077] It should be noted that when the angle between the front surface and the bottom surface of the housing 110 is relatively small, the space between the chip near the top of the housing 110 and the circuit board 120 and the corresponding partition 130 is larger, which facilitates the generation and flow of bubbles, thereby increasing the critical heat flux density (Critical Heat Flux) between the chip surface and the circuit board 120 surface, thereby improving the cooling efficiency of the fluid immersion cooling system 100. In addition, when the circuit board 120 is tilted, the front surface of the circuit board 120 faces upward, and the bubbles will not have difficulty escaping due to facing downward, thereby reaching the critical heat flux density, causing the chip temperature to exceed the critical value and affecting the normal operation of the chip.

[0078] As an optional embodiment, a plurality of chips (not shown in the figure) are provided on a circuit board 120, and the plurality of chips are arranged in an array on the circuit board 120 to avoid conflicts between adjacent chips, which may affect the generation of bubbles and further affect the normal operation of the chips.

[0079] It should be noted that the cross-sectional shape of the circuit board 120 in a direction perpendicular to the thickness of the circuit board 120 can be arbitrary. For example, the cross-sectional shape of the circuit board 120 can be rectangular, square, circular, triangular, polygonal, etc. The embodiments of the present application do not limit the specific shape of the circuit board 120, nor are they limited to the above examples.

[0080] To reduce the time required for bubbles to flow to the top of the housing 110, the cross-sectional shape of the circuit board 120 can be a rectangle, a diamond, or an ellipse, where the height is shorter than the width. Accordingly, the specific arrangement of the multiple chips on the circuit board 120 will also vary. For example, the chips can be arranged in 12 rows by 18 columns, 14 rows by 16 columns, 10 rows by 14 columns, and so on.

[0081] The embodiment of the present application does not limit the specific number of chips and the specific arrangement of multiple chips on the circuit board 120, nor is it limited to the above examples.

[0082] The following description takes the arrangement of chips on the circuit board 120 in a manner of 12 rows×18 columns as an example.

[0083] As an optional embodiment, refer to the attached Figure 1 -Attached Figure 3 As shown, the fluid immersion cooling system 100 further includes a heat conductor 140, and the number of the heat conductors 140 is multiple, and the multiple heat conductors 140 correspond to the multiple chips and are arranged on the side of the corresponding chip away from the circuit board 120. The heat conductor 140 can increase the number of bubble nucleations on the chip surface. The arrangement of the heat conductor 140 can be the same as the arrangement of the chip. Compared with the chip without the heat conductor 140, the chip with the heat conductor 140 has an increased number of bubble nucleations in the same time, that is, the speed of convective heat exchange between the coolant and the chip increases, which can increase the critical heat flux density and improve the convective heat transfer coefficient (Convective Heat Transfer Coefficient), so as to improve the cooling efficiency of the fluid immersion cooling system 100.

[0084] It should be noted that one heat conductor 140 can correspond to one chip, that is, multiple heat conductors 140 correspond one-to-one to multiple chips; one heat conductor 140 can also correspond to multiple chips. For example, one heat conductor 140 can correspond to two chips, three chips, or four chips. The embodiment of the present application does not limit the number of chips that a heat conductor 140 can correspond to, nor is it limited to the above examples.

[0085] Furthermore, when a heat conductor 140 corresponds to multiple chips, the multiple chips can be arranged in columns, rows, arrays, or other arrangements. The embodiment of the present application does not limit the arrangement of some chips corresponding to a heat conductor 140, nor is it limited to the above examples.

[0086] As an optional implementation, the heat conducting member 140 includes a metal member or graphite.

[0087] Exemplarily, when the heat conductor 140 includes a metal part, the form of the metal part can be arbitrary. Exemplarily, the metal part can be a block metal part, or a foam metal part, or a mesh metal part, or a metal column arranged in an array. Furthermore, the preparation material of the metal part can be copper, or other metal materials with thermal conductivity. When the heat conductor 140 includes graphite, the heat conductor 140 can include porous graphite. The embodiment of the present application does not limit the specific form of the heat conductor 140, nor is it limited to the above examples.

[0088] The following description will be made by taking the heat conducting member 140 as a copper block as an example. Specifically, the copper block can be formed by copper powder spraying, which can increase the surface roughness of the chip and thus increase the number of vaporization nuclei on the chip surface.

[0089] Furthermore, the heat conducting member 140 covers at least a portion of the corresponding chip, that is, the heat conducting member 140 can cover a portion of the corresponding chip, or can cover the entirety of the corresponding chip to contact the chip. In the embodiment of the present application, in order to ensure that the heat conducting member 140 can effectively increase the number of vaporization nuclei generated by the chip and better locate the installation position of the heat conducting member 140, the heat conducting member 140 can cover the entirety of the corresponding chip, that is, the size of the heat conducting member 140 is the same as the size of the corresponding chip.

[0090] As an optional embodiment, refer to the attached Figure 1 The side of the partition 130 shown is spaced apart from the inner wall of the top of the shell 110 away from the bottom of the shell 110 to form area b. Area b can be connected to at least two adjacent areas a, that is, area b is connected to at least adjacent areas a1 and a2 to form a connected flow channel.

[0091] The side of the circuit board 120 away from the bottom of the housing 110 is spaced apart from the inner wall of the top of the housing 110, that is, there is a gap between the circuit board 120 and the inner wall of the top of the housing 110, which can be used to facilitate the flow of bubbles. Alternatively, the side of the circuit board 120 away from the bottom of the housing 110 is placed in close contact with the inner wall of the top of the housing 110, that is, there is no gap between the circuit board 120 and the inner wall of the top of the housing 110, which can ensure that the coolant does not pass through the area between the circuit board 120 and the top of the housing 110 and interfere with the flow of bubbles.

[0092] It should be noted that in the above arrangement, bubbles are generated on the front side of the circuit board 120, resulting in a pressure differential between the front and back sides of the multiple circuit boards 120. This pressure differential causes the coolant to flow from the back side to the front side. Furthermore, because bubbles are generated in region a1, the pressure differential causes the coolant to flow from the back side to the front side through the guide holes 121, thereby enabling the coolant to circulate between the multiple circuit boards 120 and the multiple partitions 130.

[0093] As an optional embodiment, along the extension direction perpendicular to the circuit board 120, the orthographic projection of the partition 130 on the housing 110 at least covers the orthographic projection of the circuit board 120 on the housing 110. That is, the size of the partition 130 can be the same as the size of the circuit board 120, or it can be larger than the size of the circuit board 120. In the embodiment of the present application, the size of the partition 130 can be the same as the size of the circuit board 120, that is, the orthographic projection of the partition 130 on the housing 110 can overlap the orthographic projection of the circuit board 120 on the housing 110.

[0094] It should be noted that the thickness of the partition 130 can range from 1 to 3 mm. For example, the thickness of the partition 130 can be 1 mm, 2 mm, 3 mm, etc. The embodiment of the present application does not limit the specific thickness of the partition 130, nor is it limited to the above examples.

[0095] The following description will be made by taking the thickness of the partition plate 130 as 3 mm as an example.

[0096] As an optional embodiment, refer to the attached Figure 1 As shown, the side of the circuit board 120 close to the bottom of the housing 110 can be in contact with the housing 110 to facilitate the installation of the circuit board 120 and improve the installation stability of the circuit board 120. Figure 4 -Attached Figure 7 As shown, the guide hole 121 can be opened on one side of the circuit board 120 close to the bottom of the housing 110 , and the coolant can flow through the guide hole 121 .

[0097] It should be noted that, refer to the attached Figure 4 -Attached Figure 7As shown, the shape, size and number of the guide holes 121 can be arbitrary. For example, the cross-sectional shape of the guide holes 121 along the thickness direction perpendicular to the circuit board 120 can be rectangular, circular, rounded rectangular or triangular, etc.

[0098] As an optional embodiment, refer to the attached Figure 5 -Attached Figure 7 As shown, there are multiple guide holes 121, and the multiple guide holes 121 are arranged in an array at intervals on the circuit board 120. The number of guide holes 121 can be two, three, four, five, or ten, twenty, thirty, etc. The size of the guide holes 121 can be related to the wiring on the circuit board 120, and can also be related to the number of guide holes 121. For example, when there are fewer wirings on the circuit board 120, the guide holes 121 can be set to a larger size to facilitate the circulation of coolant; when there are more wirings on the circuit board 120, the guide holes 121 can be set to a smaller size to avoid affecting the normal operation of the circuit board 120. Furthermore, when the guide holes 121 are set to a larger size, the number of guide holes 121 is small; when the guide holes 121 can be set to a smaller size, the number of guide holes 121 is large.

[0099] As an optional embodiment, refer to the attached Figure 1 , Attachment Figure 8 -Attached Figure 10 As shown, the fluid immersion cooling system 100 also includes an inner condenser 150 and an outer condenser 160 that are interconnected. The inner condenser 150 is located in the accommodating cavity 111 and is arranged near the top of the shell 110. The outer condenser 160 is located outside the shell 110 and is connected and conductive to the inner condenser 150. The inner condenser 150 is used to condense the coolant gas, that is, the coolant and the chip or circuit board 120 perform convection heat exchange and generate a coolant in gaseous form. The inner condenser 150 contacts the coolant gas, the gas condenses, and is converted into coolant, realizing the liquid-gas-liquid state switching of the coolant, which can realize the working medium circulation. The outer condenser 160 is connected to the inner condenser 150 and can form a condensation pipeline that is interconnected with the inner condenser 150. During the process of condensing the coolant gas in the inner condenser 150, the coolant in the inner condenser 150 will be lost. By setting the outer condenser 160, the coolant in the inner condenser 150 can be replenished to maintain the circulation of the condensing medium in the inner condenser 150 and maintain the contact between the inner condenser 150 and the coolant gas.

[0100] It is understood that convective heat transfer between the coolant and the chip or circuit board 120 will result in some heat loss. The coolant generated by the condensation of the coolant gas can replenish some of this loss, thereby reducing the need for coolant replenishment, reducing the number of times the user needs to adjust the fluid immersion cooling system 100, and improving the user experience. In addition, the above-mentioned working fluid circulation can enhance the generation of coolant gas, thereby increasing the critical heat flux density and improving the convective heat transfer coefficient, thereby improving the cooling efficiency of the fluid immersion cooling system 100.

[0101] It should be noted that the inner condenser 150 can be integrally formed with the outer condenser 160, and the medium flowing in the inner condenser 150 and the outer condenser 160 can be the same. For example, the medium flowing in the inner condenser 150 and the outer condenser 160 can be water or ethylene glycol.

[0102] The following description will be made by taking the inner condensing tube 150 and the outer condensing tube 160 as an example in which they are integrally formed.

[0103] It is understandable that, with reference to the Figure 1 As shown, a sealant 170 may be provided between the inner condensing tube 150 and the circuit board 120, that is, the accommodating cavity 111 is divided into two cavities by the sealant 170, and the sealant 170 may have a through hole so that the coolant gas can contact the inner condensing tube 150 through the through hole to realize the condensation of the coolant gas.

[0104] It should be noted that the inner condenser tube 150 and the outer condenser tube 160 can be of any form. For example, the inner condenser tube 150 and the outer condenser tube 160 can both be metal tubes with a higher heat exchange rate. Furthermore, the inner condenser tube 150 and the outer condenser tube can both be metal tubes with smooth surfaces, or can both be external ribbed tubes, or can both be serrated tubes, or can both be serrated low-ribbed tubes or double-sided reinforced tubes. The embodiments of the present application do not limit the specific forms of the inner condenser tube 150 and the outer condenser tube 160, nor are they limited to the above examples.

[0105] The following description will be made by taking the example that both the inner condenser tube 150 and the outer condenser tube 160 are zigzag tubes.

[0106] As an optional embodiment, refer to the attached Figure 1 and attached Figure 8 As shown, there are multiple inner condenser tubes 150, which are arranged in parallel and spaced apart. All of the inner condenser tubes 150 are connected to the outer condenser tube 160. By providing the above-mentioned inner condenser tubes 150, the surface area of ​​the inner condenser tubes 150 can be increased, thereby facilitating contact between the coolant gas and the inner condenser tubes 150, thereby increasing the condensation rate of the coolant gas, shortening the working medium circulation time of the fluid immersion cooling system 100, and improving the cooling efficiency of the fluid immersion cooling system 100.

[0107] As another optional embodiment, refer to the attached Figure 9 , Attachment Figure 10 As shown, there is one inner condenser tube 150, which can be a continuously curved pipe. The provision of the inner condenser tube 150 increases the surface area of ​​the inner condenser tube 150, thereby facilitating contact between the coolant gas and the inner condenser tube 150, thereby increasing the condensation rate of the coolant gas, shortening the working medium cycle time of the fluid immersion cooling system 100, and improving the cooling efficiency of the fluid immersion cooling system 100.

[0108] As an optional embodiment, refer to the attached Figure 1 , Attachment Figure 8 -Attached Figure 10 As shown, the fluid immersion cooling system 100 further includes a drying element 180, which is located within the accommodating cavity 111, on the inner wall of the top of the housing 110, and close to the inner condenser 150. The drying element 180 is used to absorb water vapor within the accommodating cavity 111 to prevent the circuit board 120 from short-circuiting due to water.

[0109] Specifically, the drying unit 180 may include a drying box and a desiccant located in the drying box. The desiccant may include but is not limited to a silica gel desiccant or an activated carbon desiccant. The embodiment of the present application does not limit the type of desiccant and is not limited to the above examples.

[0110] The following description is made by taking silica gel desiccant as an example.

[0111] As an optional embodiment, refer to the attached Figure 1 , Attachment Figure 8 -Attached Figure 10 As shown, the fluid immersion cooling system 100 further includes a vacuum plug 190, which is disposed on the housing 110 and communicates with the receiving chamber 111. The vacuum plug 190 is used to inject coolant or empty the fluorinated liquid. It can also be connected to a vacuum pump (not shown) to evacuate the receiving chamber 111. The vacuum plug 190 may be a metal vacuum plug. When the coolant is a fluorinated liquid, the latent heat of vaporization of the fluorinated liquid is low, and the vacuum pump may be an oil-free vacuum pump.

[0112] It will be appreciated that when a seal 170 is provided within the housing 110, on the one hand, the housing 110 comprises an upper housing and a lower housing, with the circuit board 120, chip, and partition 130 all disposed in the lower housing, and the internal condenser 150, vacuum plug 190, and drying element 180 all disposed in the upper housing. On the other hand, the seal 170 can be located at the top of the housing 110 to seal the accommodating cavity 111. The seal 170 can be a sealing gasket or a sealing flange. The seal 170 can be installed and removed from the housing 110 via a threaded connection.

[0113] It should be noted that when the seal 170 is located in the housing 110, refer to the attached Figure 1 As shown, the seal 170 may have a through hole for the coolant gas to flow, so that the coolant gas can contact the inner condenser tube 150 through the through hole to achieve condensation of the coolant gas. Figure 9 As shown, the sealing member 170 is located at the edge of the housing 110 to seal the housing 110 , without providing a through hole for the coolant gas to flow.

[0114] At this point, the coolant filling process of the fluid immersion cooling system 100 is as follows:

[0115] In some embodiments, the upper shell is removed and coolant is injected into the cavity of the lower shell. The liquid level of the coolant is slightly higher than the height of the circuit board 120. Then, the upper shell is installed and the seal 170 is installed. Finally, a vacuum pump is connected through the vacuum plug 190 to evacuate the shell 110 to prevent non-condensable air from existing in the accommodating cavity 111.

[0116] In other embodiments, coolant is injected through the vacuum plug 190, the coolant level is slightly higher than the height of the circuit board 120, the seal 170 is installed, and finally, a vacuum pump is connected through the vacuum plug 190 to evacuate the housing 110. In this case, the housing 110 may also be a one-piece structure.

[0117] It should be noted that during the vacuuming process, the user can use a vacuum gauge to judge the pressure inside the shell 110, or can set a longer vacuuming time to reduce the possibility of air existing in the accommodating cavity 111, such as continuing the vacuuming operation for 5 minutes after confirming the vacuum through a vacuum gauge.

[0118] In the description of the embodiments of this application, it should be understood that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, the communication between the internal structures of two components, or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0119] Terms such as "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inner," and "outer" indicate positions or relationships based on those shown in the accompanying drawings. These terms are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. In the description of this application, "plurality" means two or more, unless otherwise specified.

[0120] The terms "first," "second," "third," "fourth," and the like in the specification and claims of the present application and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or sequential sequence. It should be understood that such terms are interchangeable where appropriate so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or that are inherent to these processes, methods, products, or apparatus.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for the structural or full structural technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A fluid immersion cooling system, characterized in that: The invention comprises a shell, a circuit board and a partition, wherein the shell has a receiving cavity for receiving coolant; the number of the circuit boards is multiple, and the multiple circuit boards are arranged at intervals in the receiving cavity and are all located at the bottom of the shell, and a guide hole is provided on the side of the circuit board close to the bottom of the shell; the number of the partitions is multiple, and one partition is located between two adjacent circuit boards and is spaced apart from the corresponding circuit board; The area between the partition and the circuit board, the top area of ​​the partition, and the guide hole together form a continuously curved flow channel for the coolant to flow; The circuit board is provided with a chip, the surface on which the chip is provided is the front side, and the surface on which the chip is not provided is the back side, and the distance between the front side and the corresponding partition is greater than the distance between the back side and the corresponding partition; The distance between the front surface and the corresponding partition is A, and the distance between the back surface and the corresponding partition is B. The relationship between A and B is: ； There are multiple guide holes, and the multiple guide holes are arranged in an array at intervals on the circuit board.

2. The fluid immersion cooling system according to claim 1, characterized in that: A plurality of the chips are arranged on one circuit board, and the plurality of chips are arranged in an array at intervals on the circuit board; The fluid immersion cooling system further includes a heat conducting member. There are multiple heat conducting members, each of which corresponds to the multiple chips and is arranged on a side of the corresponding chip away from the circuit board.

3. The fluid immersion cooling system according to claim 2, characterized in that: The heat conducting member includes a metal member or graphite, and the heat conducting member at least covers a corresponding portion of the chip.

4. The fluid immersion cooling system according to any one of claims 1 to 3, characterized in that: The side of the partition away from the bottom of the shell is spaced apart from the inner wall of the top of the shell; The side of the circuit board away from the bottom of the shell is spaced apart from the inner wall of the top of the shell, or the side of the circuit board away from the bottom of the shell is closely attached to the inner wall of the top of the shell.

5. The fluid immersion cooling system according to any one of claims 1 to 3, characterized in that: Along an extension direction perpendicular to the circuit board, the orthographic projection of the partition on the housing at least covers the orthographic projection of the circuit board on the housing.

6. The fluid immersion cooling system according to any one of claims 1 to 3, characterized in that: It also includes an inner condenser and an outer condenser that are interconnected. The inner condenser is located in the accommodating cavity and is arranged close to the top of the shell. The outer condenser is located outside the shell and is connected and conducted with the inner condenser.

7. The fluid immersion cooling system according to claim 6, characterized in that: There are multiple inner condensing tubes, and the multiple inner condensing tubes are arranged in parallel and at intervals, and the multiple inner condensing tubes are all connected to the outer condensing tube.

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