Cleaning brush for molding die, resin molding device, resin molded article manufacturing method

Abstract

The present invention provides a cleaning brush for a molding die, a resin molding device, and a resin molding product manufacturing method. A cleaning brush for a molding die is obtained, which appropriately cleans a molding die. The cleaning brush for a molding die, which cleans a molding die included in a resin molding device, includes a base (31), a bundle of soft hairs (32) fixed to the base (31) and extending in a direction away from the base (31), and a bundle of stiff hairs (33) fixed to the base (31) and extending in a direction away from the base (31), a plurality of hair materials constituting the bundle of soft hairs (32) being longer than a plurality of hair materials constituting the bundle of stiff hairs (33) and being formed of a softer hair material than the plurality of hair materials constituting the bundle of stiff hairs (33).

Description

Technical Field

[0001] This specification relates to a cleaning brush for molding dies, a resin molding apparatus, and a method for manufacturing resin molded articles. Background Technology

[0002] In a resin molding apparatus, a substrate containing electronic components such as integrated circuits (ICs), transistors, and capacitors is prepared as the object to be molded. Resin molding is performed using methods such as transfer molding, compression molding, and injection molding to seal the electronic components on the substrate with resin.

[0003] In the molding die of a resin molding apparatus, resin (also called resin flakes or resin residue) generated during resin molding may remain. As disclosed in Japanese Patent Application Publication No. 2002-240046 (Patent Document 1), the molding die is cleaned using a molding die cleaning brush.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2002-240046 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] A cleaning brush for forming molds includes a base and multiple bristles fixed to the surface of the base. For example, if the base has a plate shape, the bristles are fixed to one side of the base; if the base has a cylindrical shape, they are fixed to the outer periphery of the base. Here, when the multiple bristles have the same length and the same hardness, it can sometimes be difficult to properly clean the forming mold.

[0009] For example, when using soft wool, the wool is easily deformed, allowing it to reach the surface of the molding die and the sides or bottom of the cavity. However, soft wool can sometimes fail to remove resin that is strongly adhered to the molding die.

[0010] On the other hand, when using hard bristles, for example, when the brush is brought close to the mold cavity to clean the inner surface of the mold cavity, the hard bristles come into contact with the surface part of the mold (the top part where the mold cavity is not formed) before reaching the inner surface of the mold cavity (especially the bottom surface). As a result, it is difficult for the bristles to reach the bottom surface of the mold cavity, etc., and it is difficult to remove the resin adhering to the bottom surface, etc.

[0011] The purpose of this specification is to disclose a cleaning brush for molding dies, a resin molding apparatus, and a method for manufacturing resin molded articles, which have a structure that allows for more appropriate cleaning of molding dies compared to the prior art.

[0012] Technical means to solve the problem

[0013] A mold cleaning brush is used to clean the molding die included in the resin molding apparatus. The mold cleaning brush includes: a base; a soft bristle bundle fixed to the base and extending away from the base; and a bristle bundle fixed to the base and extending away from the base. The multiple bristles constituting the soft bristle bundle are longer than the multiple bristles constituting the bristle bundle and are formed of a softer material than the multiple bristles constituting the bristle bundle.

[0014] A resin molding apparatus for molding an object includes: a molding die; a mold locking mechanism for locking the molding die; and a cleaning brush for cleaning the molding die by removing resin from the molding die.

[0015] A method for manufacturing resin molded articles includes the following steps: molding an object into resin using a molding die; and cleaning the molding die by removing resin from the molding die using a cleaning brush.

[0016] The effects of the invention

[0017] According to the cleaning brush for the molding die, the resin molding apparatus, and the manufacturing method of the resin molded article, which include the structure described above, the molding die can be cleaned more appropriately compared with the prior art. Attached Figure Description

[0018] Figure 1 A functional block diagram showing an example of a resin molding apparatus according to an embodiment.

[0019] Figure 2 This is a plan view schematically showing the internal structure of the resin molding apparatus according to the embodiment.

[0020] Figure 3 For along Figure 2 The arrow view of the main part of line III-III is shown in the diagram.

[0021] Figure 4 This diagram schematically illustrates the external structure of the cleaning brush for the molding die included in the resin molding apparatus of the embodiment.

[0022] Figure 5 This diagram schematically illustrates the cross-sectional structure of the cleaning brush for the molding die and the lower die included in the resin molding apparatus of the embodiment.

[0023] Figure 6 This diagram illustrates the state in which the molding die included in the resin molding apparatus of the embodiment is imaginarily unfolded in the circumferential direction of the substrate using a cleaning brush.

[0024] Figure 7 This is a cross-sectional view showing the condition where the bristles of a cleaning brush used to clean the molding die of the resin molding apparatus included in the embodiment contact the lower mold.

[0025] Figure 8 For along Figure 7 The arrow view of line VIII-VIII shown.

[0026] Figure 9 For along Figure 7 The arrow view of the IX-IX line is shown in the cross section.

[0027] Figure 10 This is a cross-sectional view showing the condition where the bristles of the cleaning brush used to clean the molding die of the resin molding apparatus included in the embodiment contact the lower mold.

[0028] Figure 11 For along Figure 10 The arrow view of the XI-XI line is shown.

[0029] Figure 12 A cross-sectional view showing the state in which the molding die included in the comparative example resin molding apparatus is in contact with the lower die by a cleaning brush.

[0030] Figure 13 This diagram illustrates the state in which the molding die included in the resin molding apparatus of the first modified embodiment is imaginarily unfolded in the circumferential direction of the substrate using a cleaning brush.

[0031] Figure 14 This diagram illustrates the state in which the molding die included in the resin molding apparatus of the second variation of the embodiment is imaginarily unfolded in the circumferential direction of the substrate using a cleaning brush.

[0032] [Explanation of Symbols]

[0033] 1: Supply Module

[0034] 2: Control Department

[0035] 4: Resin molding module

[0036] 5: Molded Product Transfer Module

[0037] 10: Supply Department

[0038] 30, 80: Cleaning brush for forming molds

[0039] 31, 81: Matrix

[0040] 31a, 31b: Ends

[0041] 31c: Axial

[0042] 32: Soft hair bundles

[0043] 32N, 33N: Column structure

[0044] 32s, 33s: Roots

[0045] 32t, 33t: Top part

[0046] 33: Bristle bundle

[0047] 36a, 36b: Suction section

[0048] 37a: First inclined part

[0049] 37b: Second inclined section

[0050] 40: Forming section

[0051] 41, 91: Lower mold

[0052] 41a, 91a: Surface

[0053] 41b, 91b: Bottom surface

[0054] 42: Upper mold

[0055] 50: Relocation Agency

[0056] 51: First Ontology Department

[0057] 52: Second Body Section

[0058] 60: Discharge section

[0059] 82: Raw materials

[0060] 100: Resin molding apparatus

[0061] D1, D2, D3: Intervals

[0062] L1, L2: Length

[0063] L3: Size

[0064] L4, L5: Distance

[0065] LN: Baseline Line

[0066] M1: Above

[0067] M2: Below Detailed Implementation

[0068] The embodiments of this disclosure will now be described. In the embodiments described below, when referring to numbers, quantities, etc., unless specifically stated otherwise, the scope of this disclosure is not necessarily limited to the stated numbers, quantities, etc. Each structural component may not be necessary for this disclosure unless specifically stated otherwise. Sometimes, the same reference numerals are used to designate the same parts and equivalent parts, and repeated descriptions are not provided.

[0069] (Resin molding apparatus 100)

[0070] Figure 1 This is a functional block diagram illustrating an example of a resin molding apparatus 100 according to an embodiment. The resin molding apparatus 100 includes a control unit 2, a supply module 1, a resin molding module 4, and a molded article transfer module 5. The control unit 2 is configured to control the supply module 1, the resin molding module 4, and the molded article transfer module 5.

[0071] The supply module 1 is configured to supply resin material, which is the object to be molded before molding, to the resin molding module 4. The resin molding module 4 is configured to manufacture a resin molded article by locking the mold and molding the object with resin. The molded article removal module 5 is configured to remove the excess resin from the molded object and remove the resin molded article. The supply module 1, the resin molding module 4, and the molded article removal module 5 are detachable and interchangeable. Furthermore, the number of these modules can be increased or decreased.

[0072] Figure 2 A plan view schematically showing the main internal structure of the resin molding apparatus 100. Figure 3 For along Figure 2 The arrow view of the main part of line III-III is shown in the diagram. Figure 2 As shown, the resin molding apparatus 100 mainly includes a supply unit 10, a cleaning brush for molding molds 30, a molding unit 40, a conveying mechanism 50, and a discharge unit 60.

[0073] Reference Figures 1-3 The supply module 1 mainly includes a supply section 10. The supply section 10 contains a molding object to be formed. The molding object is typically a substrate to which electronic components such as semiconductor chips are connected. The substrate can be, for example, a lead frame, a printed circuit board, a metal substrate, a resin substrate, a semiconductor substrate, or a ceramic substrate.

[0074] The resin molding apparatus 100 also includes a conveying mechanism (not shown), which is configured to move between the supply module 1 and the resin molding module 4. The retracted position of the conveying mechanism is located in the supply module 1. The substrate and resin material are conveyed together from the supply section 10 to the molding section 40 via the conveying mechanism. The resin material can be, for example, in ingot-shaped resin formed by compressing powdered thermosetting resin.

[0075] The resin molding module 4 mainly includes a molding section 40. The molding section 40 includes a lower mold 41 and an upper mold 42, which serve as molding dies. Figure 3 The molding section 40 includes a lower mold 41 and an upper mold 42, which are locked by the locking mechanism to mold the molding die. In the molding section 40, the molded object is resin molded by means of the lower mold 41 and the upper mold 42.

[0076] The molded part transfer module 5 mainly includes a discharge section 60. After molding, the molded object is transferred from the molding section 40 to the discharge section 60 by the transfer mechanism 50. In the discharge section 60, the gate is degated and finally stored in the mount machine section.

[0077] The transfer mechanism 50 is configured to move between the resin molding module 4 and the molded article transfer module 5. The transfer mechanism 50 includes a cleaning brush 30 for the molding die. Here, the transfer mechanism 50 includes a first body portion 51 and a second body portion 52. The molded object is discharged by moving the first body portion 51 in the direction of arrow A1 and the second body portion 52 in the direction of arrow A2. The molding die is cleaned when the second body portion 52 moves in the direction of arrow A2.

[0078] Here, a mold cleaning brush 30 is provided on the side of the second body 52 of the transfer mechanism 50 near the molding section 40. In general, the method for manufacturing resin molded articles includes the following steps: molding the object to be molded with resin using a lower mold 41 and an upper mold 42, which serve as molds; and cleaning the mold by removing resin from the mold using the mold cleaning brush 30.

[0079] To clean the molding die of the resin molding apparatus 100, one or more molding die cleaning brushes 30 are provided in the transfer mechanism 50 of the resin molding apparatus 100 (described in detail below). Figure 3 In the case where there are two molds as shown, one mold uses a cleaning brush 30 to remove resin from the lower mold 41, and the other mold uses a cleaning brush 30 to remove resin from the upper mold 42. Figure 3 The resin is removed, thereby cleaning the molding die of the molding section 40.

[0080] (30mm cleaning brush for forming mold)

[0081] Figure 4 This diagram schematically illustrates the external structure of a cleaning brush 30 for forming molds. The cleaning brush 30 for forming molds includes: a base 31, which is driven by rotation; a bundle of soft bristles 32, which is fixed to the base 31 and extends in a direction away from the base 31; and a bundle of bristles 33, which is fixed to the base 31 and extends in a direction away from the base 31.

[0082] Here, the base 31 has a cylindrical shape extending axially 31c from one end 31a to the other end 31b. Multiple soft bristle bundles 32 and multiple bristle bundles 33 are fixed to the outer peripheral surface of the base 31. The forming mold cleaning brush 30 has a so-called roller brush shape. The soft bristle bundle 32 includes a root 32s and a tip 32t, with one side of the root 32s embedded in the base 31. Similarly, the bristle bundle 33 includes a root 33s and a tip 33t, with one side of the root 33s embedded in the base 31.

[0083] Figure 4 The depiction of the hair tuft 32 is cylindrical, but in reality, the hair tuft 32 is formed by multiple hairs. The root-side portions of these hairs are clustered together and embedded in the substrate 31, giving the overall hair tuft 32 a roughly cylindrical shape. However, the hair tuft 32 can also have a roughly truncated cone shape, gradually thickening from the root 32s towards the tip 32t. The same applies to the bristle tuft 33.

[0084] The tufts of hair 32 extend radially outward from the outer peripheral surface of the base 31, from the root 32s side toward the tip 32t side. The tufts of bristles 33 also extend radially outward from the outer peripheral surface of the base 31, from the root 33s side toward the tip 33t side.

[0085] Figure 5 This diagram schematically illustrates the cross-sectional structure of the cleaning brush 30 for the forming mold and the lower mold 41. (See diagram for reference.) Figure 5 As shown, the multiple bristles constituting the bristle bundle 33 extend radially from the outer peripheral surface of the substrate 31 with a length L1, and the multiple bristles constituting the soft bristle bundle 32 extend radially from the outer peripheral surface of the substrate 31 with a length L2 (see also...). Figure 8 ).

[0086] The distance from the central axis of the substrate 31 to the tip of the hair bundle 32 is, for example, 20 mm to 30 mm. In this embodiment, the multiple hairs (length L2) constituting the hair bundle 32 are longer than the multiple hairs (length L1) constituting the bristle bundle 33, and are formed of a softer hair material than the multiple hairs constituting the bristle bundle 33.

[0087] As an example, the multiple hairs (length L2) constituting the soft hair bundle 32 are formed of polyphenylene sulfide (PPS) with a diameter of about 0.10 mm to 0.20 mm, and the multiple hairs (length L1) constituting the bristle bundle 33 are formed of aramid fibers (such as Conex (registered trademark) manufactured by Teijin Corporation or Tetoron (registered trademark) manufactured by Toray Industries, Inc.) with a diameter of about 0.20 mm to 0.30 mm.

[0088] The difference between length L2 and length L1 can, for example, be set to the same value as the maximum depth of the cavity formed in the lower mold 41, i.e., the depth dimension L3 of the lower mold 41 from the surface 41a (the top surface portion without a cavity) to the bottom surface 41b of the cavity. The difference between length L2 and length L1 can also be larger than the depth dimension L3. In other words, the relationship (L3+L1)≦L2 can also hold. Although it also depends on the specifications, the depth dimension L3 is 1.0 mm or less, or 3.0 mm or less. The lengths L1 and L2 are optimized based on the depth dimension L3.

[0089] Figure 6 This diagram illustrates the state in which the forming mold is imaginarily unfolded in the circumferential direction of the base 31 using a cleaning brush 30. Figure 6 The rectangular shape shown generally corresponds to the outer circumference of the base 31, with its left side corresponding to end 31a and its right side corresponding to end 31b. The upper side M1 and the lower side M2 ​​are actually continuous in the circumferential direction.

[0090] In the forming mold cleaning brush 30, multiple soft bristle bundles 32 are arranged in one or more rows 32N from one side (the side of end 31a) to the other side (the side of end 31b) along the axial direction 31c of the base 31. Similarly, multiple bristle bundles 33 are arranged in one or more rows 33N from one side (the side of end 31a) to the other side (the side of end 31b) along the axial direction 31c of the base 31. If a reference line LN extending in a direction parallel to the axial direction 31c is defined on the outer peripheral surface of the base 31, then the row structures 32N extend parallel to the reference line LN, and the row structures 33N also extend parallel to the reference line LN.

[0091] Use a cleaning brush 30 to clean the forming mold along the circumferential direction. Figure 6The substrate 31 has three column structures 32N and four column structures 33N arranged sequentially from bottom to top. Specifically, the substrate 31 has three column structures 32N and four column structures 33N on its outer peripheral surface. The number of column structures 33N containing multiple bristle bundles 33 (four) is greater than the number of column structures 32N containing multiple hair bundles 32 (three). This allows for the appropriate removal of resin that is strongly adhered to the surface 41a of the lower mold 41.

[0092] (Functions and Effects)

[0093] Figure 7 This is a cross-sectional view showing the condition where the bristle bundles 32 of the cleaning brush 30 for the molding die included in the resin molding apparatus 100 contact the lower mold 41. Figure 8 For along Figure 7 The arrow view of line VIII-VIII shown. Figure 9 For along Figure 7 The arrow view of the IX-IX line is shown in the cross section.

[0094] like Figures 7-9 As shown, when cleaning the lower mold 41 using the molding die cleaning brush 30, the molding die cleaning brush 30 is moved toward the lower mold 41 in such a way that the tip 32t of the soft bristle bundle 32 reaches the bottom surface 41b of the lower mold 41.

[0095] As an example, the distance L5 from the outer peripheral surface of the substrate 31 to the bottom surface 41b is... Figure 8 The length L2 of the bristle bundle 32 can be set to the same value as the length L2 of the bristle bundle 32, and the distance L4 from the outer peripheral surface of the substrate 31 to the surface 41a can be set to the same value as the length L1 of the bristle bundle 33.

[0096] The soft hair bundles 32 are more easily deformed than the bristle bundles 33, therefore, when the soft hair bundles 32 contact the surface 41a, the soft hair bundles 32 are easily deformed (see reference). Figure 9 The movement of the substrate 31 to a predetermined position near the lower mold 41, and the state in which the substrate 31 is positioned near the predetermined position near the lower mold 41, are almost not limited by the rigidity of the bristle bundle 32. The bristle bundle 32 can reach the surface 41a of the lower mold 41 and the side or bottom surface 41b, which serves as the inner surface of the mold cavity. As the substrate 31 rotates, the bristle bundle 32 can remove resin and the like adhering to the bottom surface 41b, etc.

[0097] Figure 10 This is a cross-sectional view showing the condition where the bristle bundles 33 of the cleaning brush 30 for the molding die included in the resin molding apparatus 100 contact the lower mold 41. Figure 11 For along Figure 10 The arrow view of the XI-XI line is shown.

[0098] The bristle bundles 33 are less prone to deformation than the soft bristle bundles 32, thus achieving a higher cleaning effect on surface 41a compared to the soft bristle bundles 32. The bristle bundles 33 also have higher rigidity than the soft bristle bundles 32, exhibiting almost no deformation even when in contact with surface 41a. However, the contact of the bristle bundles 33 with surface 41a restricts the movement of the cleaning brush 30 towards the lower mold 41, making it difficult for the bristle bundles 33 to reach the side or bottom surface 41b, which serves as the inner surface of the mold cavity. Therefore, the bristle bundles 33 are insufficient for cleaning the bottom surface 41b of the mold cavity of the lower mold 41. However, as described above, in this embodiment, the soft bristle bundles 32, formed from bristles longer than the bristle bundles 33, can be used to remove resin and other substances adhering to the bottom surface 41b.

[0099] (Comparative Example)

[0100] Figure 12 This is a cross-sectional view showing the state in which the cleaning brush 80 for the molding die of the comparative example resin molding apparatus contacts the lower mold 91. The cleaning brush 80 for the molding die is constructed by spirally winding multiple strands 82 around the outer peripheral surface of a cylindrical base 81.

[0101] When a rigid bristle is used as bristle 82, when the brush is brought close to the mold cavity to clean the inner surface of the mold cavity of the lower mold 91, the rigid bristle contacts the surface 91a (the top surface portion where the mold cavity is not formed) of the lower mold 91 before it reaches the inner surface (especially the bottom surface) of the mold cavity. The brush's approach movement is restricted by the rigidity of the rigid bristle, and the bristle has difficulty reaching the bottom surface 91b of the mold cavity of the lower mold 91. As a result, it may be difficult to remove the resin adhering to the bottom surface 91b, etc.

[0102] On the other hand, when using soft wool as wool 82, the wool is easily deformed, so the wool can reach the surface 91a of the lower mold 91 and the side or bottom surface 91b, which is the inner surface of the mold cavity. However, the soft wool may sometimes be unable to remove the resin that is strongly attached to the molding mold.

[0103] In contrast, according to the molding die cleaning brush 30 of the described embodiment, resin adhering to or remaining on the bottom surface 41b can be effectively removed by the soft bristle bundles 32, and resin adhering to or remaining on the surface 41a can be effectively removed by the bristle bundles 33 and the soft bristle bundles 32. Furthermore, according to the molding die cleaning brush 30, the resin molding apparatus 100 using the molding die cleaning brush 30, and the method for manufacturing resin molded articles, the lower mold 41 can be cleaned more appropriately compared to the prior art. This situation is... Figure 3 The same applies to the upper mold 42 shown.

[0104] Furthermore, when focusing on a point on a plane located on the lower mold 41 and orthogonal to the axis 31c, the number of times the spiral-shaped brush cleans the point per revolution can be reduced to only one. According to the embodiment described, the forming mold cleaning brush 30 has a total of seven rows of soft bristle bundles 32 and stiff bristle bundles 33 arranged in the circumferential direction. This increases the number of times the brush cleans the point per revolution compared to the spiral-shaped case, resulting in a higher cleaning effect.

[0105] (First variation of the implementation method)

[0106] Figure 13 This diagram illustrates the state in which the molding die included in the resin molding apparatus of the first modified embodiment is imaginarily unfolded in the circumferential direction of the substrate 31 using a cleaning brush. Figure 13 Corresponding to the embodiments described Figure 6 .

[0107] like Figure 13 As shown, on the outer peripheral surface of the base 31, a line is defined relative to the axial direction 31c (refer to...). Figures 3-5 A reference straight line LN extends in a parallel direction. At least one of the column structures 32N containing multiple hair bundles 32 and column structures 33N containing multiple bristle bundles 33 can also be arranged on the outer peripheral surface of the substrate 31 in a manner that intersects with respect to the reference straight line LN. The minimum values ​​of the spacing D2 and spacing D3 between adjacent bristle bundles 33 are specified by the processing device used to implant the bristle bundles 33 onto the substrate 31, but if the structure described above, such as the column structure intersecting with respect to the reference straight line LN, is adopted, the spacing D2 and spacing D3 can be made smaller. Figure 6 The spacing D1 shown is smaller. As a result, the density of the multiple hair bundles 32 and multiple bristle bundles 33 relative to the substrate 31 can be increased, and the forming mold can be cleaned more effectively.

[0108] Figure 13 In the configuration shown, the column structure 33N further includes a first inclined portion 37a and a second inclined portion 37b. The first inclined portion 37a follows the axial direction 31c of the base 31 (see reference). Figures 3-5 One side of the first inclined portion 37a faces the other side, extending obliquely relative to the reference line LN. The second inclined portion 37b is located at the other end of the first inclined portion 37a, extending along the axial direction 31c of the base 31 (refer to...). Figures 3-5 One side of it faces the other side, and it extends obliquely relative to the reference line LN with an inclination opposite to that of the first inclined portion 37a. In summary, in Figure 13In the unfolded state shown, the column structure 33N is V-shaped. The same applies to the column structure 32N. If the substrate 31 rotates in, for example, the direction of arrow A3, the concave portion of the V-shape is located on the front side in the direction of rotation. With this structure, the resin removed from the molding die by the column structures 32N and 33N moves to both outer sides in the axial direction. Therefore, when suction parts 36a and 36b are arranged at both ends in the axial direction, dust can be collected efficiently.

[0109] (Second variation of the implementation method)

[0110] Figure 14 This is a diagram showing the state in which the molding die included in the resin molding apparatus of the second variation of the embodiment is imaginarily unfolded in the circumferential direction of the substrate 31 using a cleaning brush. Figure 14 Corresponding to the embodiments described Figure 6 .

[0111] The implementation method 1 ( Figure 6 ) and its first variation ( Figure 13 In the example, a structure is used in which multiple hair bundles 32 are arranged in a row from end 31a to end 31b in a column structure 32N. The same applies to a column structure 33N.

[0112] like Figure 14 As shown, the following structure can also be adopted: in a column structure 32N, multiple hair bundles 32 are arranged in two rows in a serrated pattern from the end 31a side to the end 31b side. The same applies to a column structure 33N. Depending on the performance of the processing device used to implant the hair bundles 32 or bristle bundles 33 onto the substrate 31, the hair bundles 32 or bristle bundles 33 can be arranged at a higher density on the outer peripheral surface of the substrate 31.

[0113] (Other variations of the implementation method)

[0114] In the described structure, the substrate 31 has a cylindrical shape extending axially, and soft bristle bundles 32 and bristle bundles 33 are fixed on its outer peripheral surface. Not limited to this structure, a structure can also be used where a plate-shaped substrate 31 is prepared, and soft bristle bundles 32 and bristle bundles 33 are fixed only on one side of its surface. Such a brush is driven, for example, by rocking rather than rotating. Even with the described structure, resin adhering to or remaining on the bottom surface 41b of the mold cavity of the lower mold 41 can be effectively removed by the soft bristle bundles 32, and resin adhering to or remaining on the surface 41a of the lower mold 41 can also be effectively removed by the bristle bundles 33 and soft bristle bundles 32.

[0115] The embodiments of this disclosure have been described above, but should be considered illustrative and not limiting in all respects. The scope of this disclosure is defined by the claims, including all modifications within the meaning and scope equivalent to the claims.

Claims

1. A cleaning brush for molding dies, used to clean molding dies included in a resin molding apparatus, wherein the cleaning brush for molding dies comprises: Matrix; The soft hair bundles are fixed to the substrate and extend away from the substrate; as well as The bristle bundles are fixed to the substrate and extend away from the substrate. The multiple hairs constituting the soft hair bundle are longer than the multiple hairs constituting the stiff hair bundle, and are formed of a softer material than the multiple hairs constituting the stiff hair bundle. The matrix has a cylindrical shape that extends along the axial direction. Multiple hair bundles and multiple bristle bundles are fixed on the outer peripheral surface of the substrate. The plurality of said hair bundles are arranged in one or more rows from one side to the other along the axis of the matrix. The plurality of said bristle bundles are arranged in one or more rows from one side to the other along the axial direction of the substrate. The number of column structures containing multiple sets of bristles is greater than the number of column structures containing multiple hair tufts.

2. The cleaning brush for forming molds according to claim 1, wherein, If a reference straight line is defined on the outer peripheral surface of the substrate, extending in a direction parallel to the axial direction, The column structure comprising a plurality of said hair bundles and at least one of the column structures comprising a plurality of said bristle bundles are arranged on the outer peripheral surface of the substrate in a manner that intersects with respect to the reference straight line.

3. A cleaning brush for molding dies, used to clean molding dies included in a resin molding apparatus, wherein the cleaning brush for molding dies comprises: Matrix; The soft hair bundles are fixed to the substrate and extend away from the substrate; as well as The bristle bundles are fixed to the substrate and extend away from the substrate. The multiple hairs constituting the soft hair bundle are longer than the multiple hairs constituting the stiff hair bundle, and are formed of a softer material than the multiple hairs constituting the stiff hair bundle. The matrix has a cylindrical shape that extends along the axial direction. Multiple hair bundles and multiple bristle bundles are fixed on the outer peripheral surface of the substrate. The plurality of said hair bundles are arranged in one or more rows from one side to the other along the axis of the matrix. The plurality of said bristle bundles are arranged in one or more rows from one side to the other along the axial direction of the substrate. If a reference straight line is defined on the outer peripheral surface of the substrate, extending in a direction parallel to the axial direction, At least one of the column structures comprising multiple hair bundles and multiple bristle bundles is arranged on the outer peripheral surface of the substrate in a manner that intersects the reference straight line. The at least one column structure includes: The first inclined portion extends obliquely relative to the reference line, from one side of the axial direction of the base towards the other; and The second inclined portion is provided at the other end of the first inclined portion and extends obliquely from one side of the axial direction of the base body toward the other side, having an inclination opposite to that of the first inclined portion relative to the reference line.

4. The cleaning brush for forming molds according to claim 3, wherein, The number of column structures containing multiple sets of bristles is greater than the number of column structures containing multiple hair tufts.

5. A resin molding apparatus for resin molding an object, wherein the resin molding apparatus comprises: Forming mold; The mold locking mechanism locks the forming mold; as well as The cleaning brush for molding dies as described in any one of claims 1 to 4 cleans the mold by removing resin from the molding die.

6. A method for manufacturing a resin molded article, comprising the steps of: molding an object into a resin using a molding die; and The molding die is cleaned by removing resin from the molding die using a cleaning brush as described in any one of claims 1 to 4.

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