Oral phototherapy device

Abstract

The application discloses an oral cavity phototherapy device. The oral cavity phototherapy device comprises a heat dissipation column, a first heat dissipation fin, a second heat dissipation fin, a lamp plate and a main plate; the heat dissipation column has a lamp plate connecting part, a heat dissipation column body part and a heat dissipation fin connecting part; the heat dissipation column disperses the heat generated by the light source on the lamp plate and transmits the heat to the first heat dissipation fin and the second heat dissipation fin; the lamp plate connecting part has a slope surface which is in close contact with one surface of the lamp plate; one end of the heat dissipation column body part is connected with the lamp plate connecting part, and the other end of the heat dissipation column body part is connected with the heat dissipation fin connecting part; the lamp plate connecting part is in contact with the first heat dissipation fin and the second heat dissipation fin; the first heat dissipation fin and the second heat dissipation fin are oppositely arranged, and the heat dissipation fin disperses the heat transmitted by the heat dissipation column; the surface of the side of the lamp plate which is opposite to the slope surface is provided with the light source; the lamp plate is electrically connected with the main plate; and the main plate is located between the first heat dissipation fin and the second heat dissipation fin. The oral cavity phototherapy device has good heat dissipation effect.

Description

Technical Field

[0001] This invention relates to an oral phototherapy device. Background Technology

[0002] During photodynamic oral therapy, LED lights, due to their high power, can heat up rapidly during use, posing a risk of burns if not cooled promptly. Since the oral phototherapy device needs to be inserted into the patient's mouth, its size cannot be too large. Therefore, improving the heat dissipation of LED lights while ensuring the heat dissipation components are simple, compact, and suitable for oral phototherapy devices is a pressing issue that needs to be addressed.

[0003] CN109954219A discloses a beauty lamp for acne treatment. This beauty lamp has a heat dissipation device, which includes a heat sink and a cooling fan. The heat sink is tightly attached to the back of an insulating lamp plate, and the cooling fan's exhaust direction is directly opposite the heat sink. Ventilation mesh holes are cut into the lamp head housing opposite the cooling fan. This heat dissipation device is suitable for beauty lamps, but its size is relatively large and it cannot be used in oral phototherapy devices.

[0004] CN203342209U discloses a phototherapy head. The phototherapy head includes a body, an LED lamp post, a heat sink, and an isolation plate. A heating module is fixed to the heat sink, and the LED lamp post is mounted on the heating module. An isolation plate is fixedly supported on the heat sink by at least three fixed posts, and spaced-apart posts are fixed on the isolation plate. This device dissipates heat through the heat sink, but this method has poor heat dissipation.

[0005] CN105126254A discloses an oral sterilization phototherapy device based on blue LEDs. The LED light assembly is fixed to a heat-conducting bracket with screws, and the circuit board of the LED light assembly is in contact with and insulated from the heat-conducting bracket. The heat-conducting bracket has arc-shaped heat-conducting holes, and two parallel heat-conducting pipe through-holes are arranged on the support column. Each end of the heat-conducting hole is connected to a heat-conducting pipe through-hole. The hand-held control box also includes a pressure pump and a heat dissipation device. The heat-conducting holes, heat-conducting pipe through-holes, and the heat dissipation device and pressure pump in the hand-held control box form a heat dissipation circuit, within which a tubular coolant is contained. This device, with its hand-held control box, has a large overall structure, requires coolant, and is relatively heavy, making it inconvenient to use.

[0006] CN103372265A discloses an oral phototherapy device. This device includes a phototherapy head, which comprises a transparent body and several phototherapy light sources disposed within the transparent body. For effective heat dissipation during phototherapy, the device may be equipped with a cooling circuit for water circulation, or with a heat pipe for heat dissipation, one end of which extends into the phototherapy head to dissipate heat from within the head during treatment. This document does not specify how the cooling circuit and heat pipe are configured. Summary of the Invention

[0007] In view of this, the purpose of the present invention is to provide an oral phototherapy device with good heat dissipation. Furthermore, the light source of this oral phototherapy device cannot be turned on when the working sleeve is not connected, preventing accidental activation of the light source from causing damage to the human eye.

[0008] The above-mentioned technical objectives are achieved through the following technical solutions.

[0009] The present invention provides a system comprising a heat dissipation column, a first heat sink, a second heat sink, a lamp board, and a main board;

[0010] The heat dissipation column has a lamp board connecting part, a heat dissipation column body part, and a heat sink connecting part; the heat dissipation column is configured to dissipate the heat generated by the light source located on the lamp board and transfer it to the first heat sink and the second heat sink.

[0011] The lamp panel connecting part has a slope, and the slope is in contact with one surface of the lamp panel;

[0012] One end of the heat dissipation column body is connected to the lamp panel connecting part, and the other end of the heat dissipation column body is connected to the heat sink connecting part.

[0013] The lamp board connection portion is in contact with the first heat sink and the second heat sink;

[0014] The first heat sink and the second heat sink are arranged opposite to each other, and the first heat sink and the second heat sink are configured to dissipate the heat transferred by the heat dissipation column;

[0015] A light source is provided on the surface of the lamp panel facing away from the slope; the lamp panel is electrically connected to the main board;

[0016] A light source is provided on the surface of the lamp panel and the surface of the lamp panel connection that are in contact with each other; the lamp panel is electrically connected to the main board;

[0017] The motherboard is located between the first heat sink and the second heat sink.

[0018] According to the oral phototherapy device of the present invention, preferably, the first heat sink and the second heat sink are located on both sides of the slope of the lamp plate connecting part and are connected to the heat sink connecting part.

[0019] According to the oral phototherapy device of the present invention, preferably, the angle between the slope of the lamp plate connection and the center line of the heat dissipation column is 10-25°.

[0020] According to the oral phototherapy device of the present invention, preferably, the area of ​​the projection of the heat dissipation column body onto a plane perpendicular to the centerline of the heat dissipation column is 30-60 mm². 2 .

[0021] According to the oral phototherapy device of the present invention, preferably, the ratio of the area of ​​the slope of the lamp plate connecting part to the surface area of ​​the heat dissipation column is 1:(10-20);

[0022] The ratio of the area of ​​the slope of the lamp panel connection to P is 1:(70-95); where P is the sum of the surface areas of the heat dissipation column, the first heat dissipation fin, and the second heat dissipation fin.

[0023] According to the oral phototherapy device of the present invention, a thermally conductive silicone layer is provided between the lamp plate and the lamp plate connection portion.

[0024] According to the oral phototherapy device of the present invention, the first heat sink has a first heat sink connecting portion and a first heat sink main board receiving portion; the first heat sink connecting portion is configured to be connected to the heat sink connecting portion of the heat sink column;

[0025] The second heat sink has a second heat sink connecting portion and a second heat sink motherboard receiving portion; the second heat sink connecting portion is configured to be connected to the heat sink connecting portion of the heat sink pillar;

[0026] A motherboard receiving cavity is formed between the first heat sink motherboard receiving portion and the second heat sink motherboard receiving portion, and the motherboard is located in the motherboard receiving cavity.

[0027] According to the oral phototherapy device of the present invention, preferably, the motherboard receiving cavity has a first cavity portion, a second cavity portion, and a third cavity portion that are connected in sequence; the first cavity portion is close to the first heat sink connecting portion and the second heat sink connecting portion;

[0028] In the first cavity, the distance between the first heat sink and the second heat sink is represented by F; in the second cavity, the distance between the first heat sink and the second heat sink is represented by S; in the third front cavity, the distance between the first heat sink and the second heat sink is represented by T; S>T≥F.

[0029] According to the oral phototherapy device of the present invention, preferably, the oral phototherapy device further includes a micro switch, a light source sleeve, and a working sleeve;

[0030] A micro switch mounting slot is provided on the main body of the heat dissipation column;

[0031] At least a portion of the micro switch is located in the micro switch mounting slot, and the micro switch is configured to control the connection and disconnection between the lamp board and the main board;

[0032] The light source sleeve is fitted outside the lamp board and heat dissipation column; the light source sleeve is provided with a light source hole and a switch button, the light source hole is designed to allow light generated by the light source to pass through, and the switch button is designed to be able to trigger a micro switch under the action of external force.

[0033] The working sleeve is provided with a working tip connection hole, which is used to connect with a working tip; the working tip connection hole is configured to allow light generated by a light source to pass through; when the working sleeve is fitted onto the outer periphery of the light source sleeve, the working sleeve triggers the switch button.

[0034] According to the oral phototherapy device of the present invention, preferably, the oral phototherapy device further includes a battery, a charging connection board, a housing, and control buttons;

[0035] The charging connection board is electrically connected to the battery, and the charging connection board is configured to supply electrical energy to the battery.

[0036] The battery is electrically connected to the motherboard, and the battery is configured to store electrical energy and supply electrical energy to the motherboard.

[0037] The battery, motherboard, first heat sink, second heat sink, and at least a portion of the charging connection board are located within the cavity formed by the outer casing;

[0038] The charging connection board is provided with a power connection terminal, and the outer shell is provided with an outer shell opening, through which the power connection terminal is exposed.

[0039] The control button is located on the housing and is connected to the control chip. The control button is configured to control the light source's illumination and extinguishing, the light emission time, and the wavelength of the light emitted by the light source.

[0040] The heat dissipation assembly of the present invention includes a heat dissipation column, a first heat sink, and a second heat sink. The heat dissipation column dissipates heat generated by the light source and transfers this heat to the first and second heat sinks, enhancing the heat dissipation effect. The heat dissipation column of the present invention has a specific structure, which maximizes the heat transfer capacity to the heat sinks within a limited volume. Furthermore, the heat conduction area and heat dissipation area of ​​the heat dissipation column of the present invention achieve a perfect balance within a limited volume, thereby realizing a dynamic balance between heat conduction and heat dissipation and improving the heat dissipation effect. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the heat dissipation component of the present invention assembled with the lamp board and the main board.

[0042] Figure 2 for Figure 1 The exploded view of the heat dissipation component is shown.

[0043] Figure 3 for Figure 1 A partial enlarged view of the structure of the heat sink shown.

[0044] Figure 4This is a schematic diagram of the structure of an oral phototherapy device according to the present invention.

[0045] Figure 5 for Figure 4 An exploded view of the oral phototherapy device shown.

[0046] Figure 6 This is an exploded view of the oral phototherapy device in Comparative Example 1.

[0047] Figure 7 for Figure 6 The diagram shows a partial enlarged view of the oral phototherapy device.

[0048] The detailed explanation of the reference numerals in the attached figures is as follows:

[0049] 1-Heat dissipation column; 101-Lamp board connection part; 1011-Slope surface; 102-Heat dissipation column body part; 1021-Micro switch mounting slot; 103-Heat dissipation fin connection part; 2-First heat dissipation fin; 201-First heat dissipation fin connection part; 202-First heat dissipation fin main board receiving part; 3-Second heat dissipation fin; 301-Second heat dissipation fin connection part; 302-Second heat dissipation fin main board receiving part; 401-First cavity part; 402-Second cavity part; 403-Third cavity part; 5-Main board; 6-Lamp board; 7 - Light source sleeve; 701- Light source hole; 702- Switch button; 8- Working sleeve; 801- Working tip connection hole; 9- Battery; 10- Charging connection board; 11- Housing; 12- Control button; 13- Micro switch; 14- Working tip; 151- Heat sink cover; 1511- Heat sink cover body; 15111- Spring contact hole; 1522- Heat sink cover connecting part; 152- Heat sink plate; 1521- Heat sink plate body; 1522- Heat sink plate connecting part; 16- Metal substrate; 161- Spring contact. Detailed Implementation

[0050] The present invention will be further described below with reference to specific embodiments, but the scope of protection of the present invention is not limited thereto.

[0051] <Heat dissipation components>

[0052] The heat dissipation component of this invention includes a heat dissipation column, a first heat dissipation fin, and a second heat dissipation fin. This heat dissipation component is applicable to oral phototherapy devices. Oral phototherapy devices need to be inserted into the patient's oral cavity, where space is limited; therefore, the size of the heat dissipation component suitable for oral phototherapy devices cannot be too large. This necessitates improving the heat dissipation effect of the heat dissipation component within a limited volume.

[0053] Heat dissipation column

[0054] The heat dissipation column of the present invention has a lamp plate connecting part, a heat dissipation column body part, and a heat sink connecting part. The heat dissipation column is configured to dissipate the heat generated by the light source located on the lamp plate in the oral phototherapy device and transfer it to the first heat sink and the second heat sink.

[0055] The heat sink is cylindrical in shape and has a solid structure. A connecting cable channel is provided inside the heat sink. The connecting cable passes through this channel, connecting the lamp board located at the lamp board connection point to the main board located between the first and second heat sinks.

[0056] One end of the heat dissipation column body is connected to the lamp panel connecting part. The other end of the heat dissipation column body is connected to the heat sink connecting part. The lamp panel connecting part, the heat dissipation column body part, and the heat sink connecting part can be an integral structure.

[0057] The lamp plate connecting part has a sloped surface. This sloped surface is used to connect with the lamp plate of the oral phototherapy device. The angle between the sloped surface of the lamp plate connecting part and the center line of the heat dissipation column is 10° to 25°; preferably 13° to 20°. The area of ​​the sloped surface can be 90 to 140 mm². 2 The preferred size is 100–120 mm. 2 This sloping surface design allows the light source to extend into the back of the mouth for treatment of the molars; it also increases the contact area between the lamp panel and the heat dissipation column within a limited volume, while ensuring sufficient heat dissipation area and improving heat dissipation efficiency.

[0058] The projected area of ​​the heat sink body in a plane perpendicular to the centerline of the heat sink can be 30–60 mm². 2 The preferred size is 40-50mm. 2 This helps to quickly transfer heat to the first and second heat sinks, improving heat dissipation.

[0059] The ratio of the slope area of ​​the lamp panel connection to the surface area of ​​the heat dissipation column can be 1:(10-20); preferably 1:(14-18). This allows the heat dissipation column to have appropriate heat transfer and heat dissipation areas within a limited volume, achieving a dynamic balance between heat conduction and heat dissipation, and resulting in good heat dissipation effect.

[0060] A microswitch mounting slot can be provided on the lamp board connection part. The microswitch mounting slot is used to install a microswitch. The microswitch is used to control the connection and disconnection between the lamp board and the main board.

[0061] The heat sink connector is used to contact the first heat sink and the second heat sink. The heat sink connector may be provided with heat sink pillar connection holes. The first heat sink, the second heat sink, and the heat sink pillars are connected through the heat sink pillar connection holes.

[0062] The heat dissipation column can be made of aluminum alloy.

[0063] First heat sink and second heat sink

[0064] The first and second heat sinks dissipate the heat transferred by the heat dissipation column. The first and second heat sinks respectively contact the heat sink connecting parts of the heat dissipation column. The first and second heat sinks can be fixedly connected to the heat sink connecting parts of the heat dissipation column. The first and second heat sinks are respectively located on both sides of the slope of the lamp panel connecting part.

[0065] The surface area of ​​the first heat sink is larger than the surface area of ​​the heat sink pillar. In some embodiments, the first heat sink has a first heat sink connecting portion and a first heat sink mainboard receiving portion. The first heat sink connecting portion is connected to the first heat sink mainboard receiving portion. The first heat sink connecting portion and the first heat sink mainboard receiving portion can be an integral structure. The first heat sink can be formed of aluminum alloy.

[0066] The surface area of ​​the second heat sink is larger than the surface area of ​​the heat sink pillar. In some embodiments, the second heat sink has a second heat sink connecting portion and a second heat sink mainboard receiving portion. The second heat sink connecting portion is connected to the second heat sink mainboard receiving portion. The second heat sink connecting portion and the second heat sink mainboard receiving portion can be an integral structure. The second heat sink can be formed of aluminum alloy.

[0067] The first heat sink connector is connected to the heat sink column. The first heat sink connector may have a first heat sink connection hole. The first heat sink is connected to the heat sink column through the first heat sink connection hole and the heat sink column connection hole.

[0068] The second heat sink connector is connected to the heat sink column. The second heat sink connector may have a second heat sink connection hole. The first heat sink is connected to the heat sink column through the second heat sink connection hole and the heat sink column connection hole.

[0069] The first heatsink motherboard receiving portion and the second heatsink motherboard receiving portion form a motherboard receiving cavity. The first heatsink motherboard receiving portion and the second heatsink motherboard receiving portion are disposed opposite to each other. The motherboard receiving cavity is capable of accommodating the motherboard.

[0070] The motherboard housing has a first cavity, a second cavity, and a third cavity that are connected in sequence. The first cavity is located near the first heatsink connection portion and the second heatsink connection portion. In the first cavity, the distance between the first and second heatsinks is denoted by F; in the second cavity, the distance between the first and second heatsinks is denoted by S; in the third cavity, the distance between the first and second heatsinks is denoted by T; S > T ≥ F. In some embodiments, S > T > F. This improves heat conduction efficiency. The outer surface of the first heatsink located in the second cavity protrudes away from the motherboard housing. The outer surface of the second heatsink located in the second cavity protrudes away from the housing. This facilitates user grip and increases the surface area of ​​the heatsink, thereby improving heat conduction efficiency.

[0071] The ratio of the area of ​​the slope of the lamp board connection to P is 1:(70-95); preferably 1:(75-90); more preferably 1:(85-90); where P is the sum of the surface areas of the heat dissipation column, the first heat sink, and the second heat sink. The surface area of ​​the first heat sink refers to the area of ​​the surface of the first heat sink away from the motherboard cavity, and the surface area of ​​the second heat sink refers to the area of ​​the surface of the second heat sink away from the motherboard cavity. The sum of the surface areas of the first heat sink and the second heat sink can be 7500-9000 mm². 2 The preferred diameter is 8000–8500 mm. 2 This ensures that the heat transfer and dissipation of the entire heat dissipation component maintain a dynamic equilibrium, thereby improving the heat dissipation effect of the heat dissipation component.

[0072] <Oral phototherapy device>

[0073] The oral phototherapy device of the present invention includes a heat dissipation assembly. In some embodiments, it further includes one or more of the following: a main board, a lamp board, a micro switch, a light source sleeve, a working sleeve, a battery, a charging connection board, a housing, control buttons, and a working tip. The structure of the heat dissipation assembly has been described above and will not be repeated here. The structure of the other components of the oral phototherapy device is described in detail below.

[0074] motherboard

[0075] The motherboard of this invention is configured to control a light source. The motherboard can control the emission and extinguishing of the light source. The motherboard can control the emission duration of the light source. The motherboard can control the wavelength of the light emitted by the light source. The motherboard is equipped with a control chip and control circuitry. Conventional control chips and control circuits can be used, and will not be described in detail here.

[0076] The motherboard is positioned between the first heatsink and the second heatsink. Specifically, the motherboard is housed within a motherboard receiving cavity formed by the first and second heatsinks.

[0077] Light panel

[0078] The lamp board is electrically connected to the main board.

[0079] One surface of the light panel is in contact with the slope of the light panel connection part of the heat dissipation column. Specifically, the light panel covers the slope of the light panel connection part. A thermally conductive silicone layer can also be provided between the light panel and the slope of the light panel connection part. The thermally conductive silicone layer can connect the light panel and the heat dissipation column together without affecting the heat transfer from the light panel to the heat dissipation column.

[0080] A light source is provided on the surface opposite to the surface of the lamp panel that is in contact with the lamp panel connecting part. In some embodiments, a thermistor is also provided on the surface of the lamp panel opposite to the surface of the lamp panel connecting part.

[0081] The light panel contains aluminum.

[0082] The light source is mounted on the light source mounting surface. Preferably, the light source of this invention is a light source capable of emitting blue light in the range of 430–450 nm and / or red light in the range of 630–650 nm. The light source can be an LED light source.

[0083] The thermistor is used to detect the temperature of the lamp board and transmit the electrical signal to the main board. The control chip on the main board controls the connection and disconnection of the light source and the power supply based on the received electrical signal. In this way, when the temperature of the lamp board is too high, the light source is disconnected from the power supply, realizing over-temperature protection.

[0084] micro switch

[0085] At least a portion of the microswitch of the present invention is located in a microswitch mounting slot. The microswitch is electrically connected to the main board. The microswitch is configured to control the connection and disconnection between the lamp board and the main board.

[0086] Light source sleeve

[0087] The light source sleeve is installed outside the lamp panel and heat dissipation column.

[0088] The light source sleeve has a light source hole. Light generated by the light source can pass through the light source hole. The area of ​​the projection of the light source hole onto the plane of the lamp panel is larger than the area of ​​the projection of the light source onto the plane of the lamp panel. Preferably, the projection of the light source onto the plane of the lamp panel falls within the range of the projection of the light source hole onto the plane of the lamp panel. Preferably, the projection of the light source onto the plane of the lamp panel is located at the middle of the projection of the light source hole onto the plane of the lamp panel.

[0089] A switch button is provided on the light source sleeve. The switch button is designed to actuate a microswitch under the action of external force. In some embodiments, at least a portion of the switch button is located on the outer surface of the light source sleeve and protrudes outward from the light source sleeve. The switch button can move towards the microswitch under the action of external force. The switch button actuates the microswitch, connecting the main board and the light source.

[0090] working sleeve

[0091] The working sleeve of this invention is provided with a working tip connection hole. The working tip connection hole is connected to the working tip. Light generated by the light source can pass through the working tip connection hole. The area of ​​the projection of the working tip connection hole onto the plane of the lamp board is greater than or equal to the area of ​​the projection of the light source onto the plane of the lamp board. When the working sleeve is fitted around the outer periphery of the light source sleeve, the projection of the light source onto the plane of the lamp board falls within the projection range of the working tip connection hole onto the plane of the light source. Due to the squeezing action of the working sleeve on the switch button, the switch button moves towards the microswitch, thereby activating the microswitch and connecting the light source to the main board.

[0092] The working sleeve can be connected to the outer shell. The connection method between the working sleeve and the outer shell is not limited; any conventional connection method in the art can be used, such as snap-fit ​​connection or tenon joint connection.

[0093] Battery, charging connector and charging dock

[0094] The battery of this invention is electrically connected to the motherboard. The battery stores electrical energy and supplies electrical energy to the motherboard.

[0095] The charging connection board is electrically connected to the battery. The charging connection board supplies electrical energy to the battery. The charging connection board has a power connection terminal that is connected to an external power source. In some embodiments, the power connection terminal is connected to a charging base.

[0096] casing and control buttons

[0097] The battery, motherboard, first heat sink, second heat sink, and at least a portion of the charging connection board are located within the cavity formed by the housing. The housing has an opening that exposes the power connection terminals.

[0098] The control buttons are located on the casing and are connected to the control chip. The control buttons can control the light source to turn on and off, the duration of light emission, and / or the wavelength of the light emitted by the light source.

[0099] working tip

[0100] The working tip is connected to the working tip connection hole. The working tip concentrates the light source passing through the working tip connection hole onto the area to be treated. The shape of the working tip can be determined according to the shape suitable for the treatment area. For example, the working tip can be conical, cylindrical, etc.

[0101] Example 1

[0102] like Figure 4 and 5 As shown, the oral phototherapy device of the present invention includes a main board 5, a lamp board 6, a light source sleeve 7, a working sleeve 8, a battery 9, a charging connection board 10, a housing 11, a control button 12, a micro switch 13, a connecting wire, and a heat dissipation component.

[0103] like Figure 1 and Figure 2 As shown, the heat dissipation component for an oral phototherapy device of the present invention includes a heat dissipation column 1, a first heat dissipation fin 2, and a second heat dissipation fin 3.

[0104] The heat dissipation column 1 is a solid structure. The heat dissipation column 1 is cylindrical in shape. A connecting wire groove (not shown) is provided inside the heat dissipation column 1. The connecting wire passes through the connecting wire groove and connects the lamp board 6 located at the lamp board connection part 101 to the main board 5 located between the first heat sink 2 and the second heat sink 3. The heat dissipation column 1 is used to dissipate the heat generated by the light source of the oral phototherapy device located on the lamp board 6 and transfer it to the first heat sink 2 and the second heat sink 3.

[0105] The heat dissipation column 1 has a lamp panel connecting part 101, a heat dissipation column body part 102, and a heat sink connecting part 103. The lamp panel connecting part 101, the heat dissipation column body part 102, and the heat sink connecting part 103 can be an integral structure.

[0106] The lamp panel connecting part 101 has a slope 1011. This slope 1011 is used to connect with the lamp panel 6 of the oral phototherapy device. The area of ​​the slope 1011 is 116 mm². 2 .like Figure 3 As shown, the angle α between the slope 1011 and the center line of the heat dissipation column 1 is 15°.

[0107] One end of the heat dissipation column body 102 is connected to the lamp panel connecting part 101, and the other end is connected to the heat sink connecting part 103. The projected area of ​​the heat dissipation column body 102 in a plane perpendicular to the centerline of the heat dissipation column 1 is 46.9 mm². 2 A microswitch mounting slot 1021 may be provided on the heat sink body 102. The microswitch mounting slot 1021 is used to install a microswitch 13. The microswitch 13 is used to control the connection and disconnection between the lamp board 6 and the main board 5.

[0108] The heat sink connector 103 has heat sink column connection holes. The heat sink connector 103 is used to connect the first heat sink 2 and the second heat sink 3.

[0109] The surface area of ​​heat sink 1 is 1871 mm². 2 Heat sink 1 is made of aluminum alloy.

[0110] The first heat sink 2 and the second heat sink 3 are respectively disposed on both sides of the slope 1011 of the lamp panel connection part 101.

[0111] The first heat sink 2 dissipates the heat transferred by the heat sink column 1. The first heat sink 2 has a first heat sink connecting portion 201 and a first heat sink main board receiving portion 202. The first heat sink connecting portion 201 and the first heat sink main board receiving portion 202 are connected. The first heat sink connecting portion 201 and the first heat sink main board receiving portion 202 can be an integral structure.

[0112] The second heat sink 3 dissipates the heat transferred by the heat sink column 1. The second heat sink 3 has a second heat sink connecting part 301 and a second heat sink main board receiving part 302. The second heat sink connecting part 301 and the second heat sink main board receiving part 302 are connected. The second heat sink connecting part 301 and the second heat sink main board receiving part 302 can be an integral structure.

[0113] The first heat sink connecting part 201 has a first heat sink connecting hole. The second heat sink connecting part 301 has a second heat sink connecting hole. Bolts connect the heat sink 1, the first heat sink 2, and the second heat sink 3 through the first heat sink connecting hole, the second heat sink connecting hole, and the heat sink connecting hole.

[0114] The first heatsink motherboard receiving portion 202 and the second heatsink motherboard receiving portion 302 are disposed opposite to each other, forming a motherboard receiving cavity. The motherboard receiving cavity is used to receive the motherboard 5.

[0115] The motherboard housing cavity has a first cavity portion 401, a second cavity portion 402, and a third cavity portion 403 that are connected in sequence. The first cavity portion 401 is located near the first heatsink connection portion 201 and the second heatsink connection portion 301. In the first cavity portion 401, the distance between the first heatsink 2 and the second heatsink 3 is denoted by F; in the second cavity portion 402, the distance between the first heatsink 2 and the second heatsink 3 is denoted by S; in the third cavity portion 403, the distance between the first heatsink 2 and the second heatsink 3 is denoted by T; S > T > F. The outer surface of the first heatsink 2 located in the second cavity portion 402 protrudes in a direction away from the motherboard housing cavity. The outer surface of the second heatsink 3 located in the second cavity portion 402 protrudes in a direction away from the motherboard housing cavity.

[0116] The sum of the surface areas of the first heat sink 2 and the second heat sink 3 is 8380 mm². 2The first heat sink 2 and the second heat sink 3 are both made of aluminum alloy.

[0117] The surface A of the lamp panel 6 is in contact with and covers the slope 1011 of the lamp panel connecting part 101. A thermally conductive silicone layer is provided between the lamp panel 6 and the slope 1011. This not only connects the lamp panel 6 to the heat dissipation column 1, but also transfers the heat of the lamp panel 6 to the heat dissipation column 1.

[0118] A light source and a thermistor are disposed on surface B of the lamp plate 6, which is opposite to surface A. In this embodiment, the lamp plate 6 contains aluminum.

[0119] The connecting wire (not shown) passes through the connecting wire groove set in the heat sink 1 to connect the lamp board 6 and the main board 5.

[0120] The motherboard 5 contains a control chip and control circuitry. The motherboard 5 controls the light source. The motherboard 5 is located within the motherboard housing formed by the first heatsink 2 and the second heatsink 3.

[0121] The light source can emit red and blue light. The light source can be an LED light source.

[0122] A thermistor detects the temperature of the lamp board 6 and transmits the electrical signal to the main board 5. The control chip on the main board 5 controls the connection and disconnection of the light source and the power supply based on the received electrical signal. In this way, when the temperature of the lamp board 6 is too high, the light source is disconnected from the power supply, thus achieving over-temperature protection.

[0123] At least a portion of the micro switch 13 is located in the micro switch mounting slot 1021.

[0124] The light source sleeve 7 is fitted over the lamp plate 6 and the heat dissipation column 1. The light source sleeve 7 is provided with a light source hole 701 and a switch button 702.

[0125] Light generated by the light source can pass through the light source aperture 701. The area of ​​the projection of the light source aperture 701 onto the plane of the lamp panel 6 is larger than the area of ​​the projection of the light source onto the plane of the lamp panel 6. In some embodiments, the center of the projection of the light source aperture 701 onto the plane of the lamp panel 6 coincides with the center of the projection of the light source onto the plane of the lamp panel 6.

[0126] At least a portion of the switch button 702 is disposed on the outer surface of the light source sleeve 7 and protrudes outward from the light source sleeve 7. The switch button 702 can move towards the micro switch 13 under the action of force. The switch button 702 actuates the micro switch 13, thereby connecting the main board 5 and the lamp board 6.

[0127] The working sleeve 8 is provided with a working tip connection hole 801. The working tip connection hole 801 is used to connect with the working tip 14. The light generated by the light source passes through the working tip connection hole 801. The area of ​​the projection of the working tip connection hole 801 onto the plane of the lamp board 6 is larger than the area of ​​the projection of the light source onto the plane of the lamp board 6. When the working sleeve 8 is fitted around the outer periphery of the light source sleeve 7, the projection of the light source onto the plane of the lamp board 6 falls within the projection range of the working tip connection hole 801 onto the plane of the lamp board 6; and due to the squeezing action of the working sleeve 8 on the switch button 702, the switch button 702 moves towards the micro switch 13, pressing the micro switch 13, so that the light source is connected to the main board 5.

[0128] Battery 9 is electrically connected to motherboard 5. Battery 9 stores electrical energy and supplies electrical energy to motherboard 5.

[0129] The charging connection board 10 is electrically connected to the battery 9. The charging connection board 10 supplies electrical energy to the battery 9. The charging connection board 10 has a power connection terminal, which is connected to an external power source.

[0130] The battery 9, motherboard 5, first heat sink 2, second heat sink 3, and part of the charging connection board 10 are located within the cavity formed by the housing 11. The housing 11 has an opening that exposes the power connection terminal of the charging connection board 10. The housing 11 may be made of plastic.

[0131] Control button 12 is located on the housing 11 and is connected to the control chip. Control button 12 controls the illumination and extinguishing of the light source, the illumination time of the light source, and the wavelength of the light emitted by the light source.

[0132] The working tip 14 is connected to the working tip connection hole 801. The working tip 14 concentrates the light emitted through the working tip connection hole 801 onto the area to be treated.

[0133] Example 2

[0134] Except for the following structure, the rest is the same as in Example 1:

[0135] The oral hygiene device in this embodiment also includes a charging base (not shown). The charging base is connected to the power supply of the charging connection board 10.

[0136] Comparative Example 1

[0137] Except for replacing the heat dissipation column 1 with the heat dissipation cover 151 and the heat dissipation plate 152, and replacing the lamp plate 6 with the metal substrate 16, the rest is the same as in embodiment 2.

[0138] The dental phototherapy device in this comparative example is as follows: Figure 6-7 As shown. The specific structures of the heat sink 151, heat sink 152, and metal substrate 16 are as follows:

[0139] The metal substrate 16 is electrically connected to the motherboard 5. A light source is located on one surface of the metal substrate 16. The light source is positioned at the end of the metal substrate 16 furthest from the motherboard 5. The metal substrate 16 contains aluminum.

[0140] The heat sink 152 has a heat sink body 1521 and a heat sink connecting part 1522. The heat sink body 1521 and the heat sink connecting part 1522 are connected. The heat sink body 1521 and the heat sink connecting part 1522 are an integral structure.

[0141] The heat sink body 1521 is attached to the surface of the metal substrate 16 opposite to the surface with the light source. The projection of the heat sink body 1521 onto the plane of the metal substrate 16 coincides with the metal substrate 16.

[0142] The material of the heat sink 152 is the same as that of the heat sink column 1 in Example 1.

[0143] The heat sink 151 has a heat sink body 1511 and a heat sink connecting part 1512. The heat sink body 1511 and the heat sink connecting part 1512 are connected. The heat sink body 1511 and the heat sink connecting part 1512 are an integral structure.

[0144] The heat sink body 1511 covers the surface of the metal substrate 16 that has a light source, without blocking the light source. The metal substrate 16 falls within the projection range of the heat sink body 1511 on the plane where the metal substrate 16 is located.

[0145] The material of the heat sink 151 is the same as that of the heat sink column 1 in Embodiment 1.

[0146] The heat sink cover connecting part 1512 is connected to the heat sink plate connecting part 1522. The heat sink cover 151, the metal substrate 16 and the heat sink plate 152 are fixed by bolts.

[0147] The heat sink 151 and the heat sink 152 transfer heat to the first heat sink 2 and the second heat sink 3.

[0148] The first heat sink 2 and the second heat sink 3 are located on opposite sides of the surface of the metal substrate 16 that has a light source. The first heat sink connecting part 201, the heat sink connecting part 1522, the heat sink cover connecting part 1512, and the second heat sink connecting part 301 are connected together.

[0149] A spring contact 161 is disposed near one end of the metal substrate 16 close to the main board 5. The spring contact 161 and the light source are located on the same surface of the metal substrate 16. The spring contact 161 controls the connection and disconnection between the main board 1 and the light source.

[0150] The heat sink body 1511 is provided with a spring opening 15111 at the position where it mates with the spring contact 161. At least a portion of the projection of the spring opening 15111 onto the plane of the metal substrate 16 coincides with the projection of the spring contact 161 onto the plane of the metal substrate 16.

[0151] The light source sleeve 7 is fitted over the heat sink 151, heat sink 152, and metal substrate 16. The light source sleeve 7 has a light source hole 701 and a switch button 702. The switch button 702 can move towards the spring contact 161 under pressure. The switch button 702 actuates the spring contact 161, thereby connecting the motherboard 5 and the light source.

[0152] Experimental Example

[0153] Turn on the oral phototherapy device and allow it to operate continuously until the end of the experiment, or until the over-temperature protection is triggered to end the experiment. Record the continuous operating time of the oral phototherapy device when the over-temperature protection is triggered or when the experiment ends, in 30-second increments. Also record the temperature at the working tip connection hole 801 at the beginning and end of the experiment, as well as the temperature of the outer surface of the sidewall opposite the working sleeve 8 and the working tip connection hole 801 (hereinafter referred to as "outer surface D") at the end of the experiment. Each oral phototherapy device was tested multiple times, and the specific data are shown in the table below.

[0154]

[0155] As shown in the table above, the oral phototherapy device of the present invention has a good heat dissipation effect, which can dissipate the heat generated by the light source in a timely manner and has a long continuous working time. After the test, the oral phototherapy device of Example 2 was heated all over, while the device of Comparative Example 1 was only heated at the head near the light source. This shows that the oral phototherapy device of the present invention has a good heat transfer and heat dissipation effect.

[0156] This invention is not limited to the above-described embodiments. Any modifications, improvements, or substitutions that can be conceived by those skilled in the art without departing from the essential content of this invention fall within the scope of this invention.

Claims

1. An oral phototherapy device, characterized in that, It includes heat dissipation pillars, a first heat sink, a second heat sink, a light board, a main board, and a casing; The heat dissipation column has a lamp board connecting part, a heat dissipation column body part, and a heat sink connecting part; the heat dissipation column is configured to dissipate the heat generated by the light source located on the lamp board and transfer it to the first heat sink and the second heat sink. The lamp panel connecting part has a slope, which is in contact with one surface of the lamp panel; the angle between the slope of the lamp panel connecting part and the center line of the heat dissipation column is 10 to 25°. One end of the heat dissipation column body is connected to the lamp panel connecting part, and the other end of the heat dissipation column body is connected to the heat sink connecting part. The area of ​​the projection of the heat sink body onto a plane perpendicular to the centerline of the heat sink is 30–60 mm². 2 ; The ratio of the area of ​​the slope of the lamp panel connection to the surface area of ​​the heat dissipation column is 1:(10~20); the first heat dissipation fin and the second heat dissipation fin are arranged opposite to each other, and the first heat dissipation fin and the second heat dissipation fin are configured to dissipate the heat transferred by the heat dissipation column. The first heat sink and the second heat sink are located on both sides of the slope of the lamp panel connection part, and are connected to the heat sink connection part; The ratio of the area of ​​the slope of the lamp panel connection to P is 1:(70-95); where P is the sum of the surface areas of the heat dissipation column, the first heat dissipation fin, and the second heat dissipation fin. A light source is provided on the surface of the lamp panel facing away from the slope; the lamp panel is electrically connected to the main board; The motherboard is located between the first heat sink and the second heat sink; The motherboard, the first heat sink, and the second heat sink are located within the cavity formed by the outer casing.

2. The oral phototherapy device according to claim 1, characterized in that, A thermally conductive silicone layer is provided between the lamp panel and the lamp panel connection portion.

3. The oral phototherapy device according to claim 1, characterized in that, The first heat sink has a first heat sink connecting portion and a first heat sink main board receiving portion; the first heat sink connecting portion is configured to be connected to the heat sink connecting portion of the heat sink column; The second heat sink has a second heat sink connecting portion and a second heat sink motherboard receiving portion; the second heat sink connecting portion is configured to be connected to the heat sink connecting portion of the heat sink pillar; A motherboard receiving cavity is formed between the first heat sink motherboard receiving portion and the second heat sink motherboard receiving portion, and the motherboard is located in the motherboard receiving cavity.

4. The oral phototherapy device according to claim 3, characterized in that, The motherboard receiving cavity has a first cavity portion, a second cavity portion, and a third cavity portion that are connected in sequence; the first cavity portion is close to the first heat sink connection portion and the second heat sink connection portion; In the first cavity, the distance between the first heat sink and the second heat sink is represented by F; In the second cavity, the distance between the first heat sink and the second heat sink is represented by S; In the third cavity, the distance between the first heat sink and the second heat sink is represented by T; S>T≥F.

5. The oral phototherapy device according to claim 1, characterized in that, The oral phototherapy device also includes a micro switch, a light source sleeve, and a working sleeve; A micro switch mounting slot is provided on the main body of the heat dissipation column; At least a portion of the micro switch is located in the micro switch mounting slot, and the micro switch is configured to control the connection and disconnection between the lamp board and the main board; The light source sleeve is fitted outside the lamp board and heat dissipation column; the light source sleeve is provided with a light source hole and a switch button, the light source hole is designed to allow light generated by the light source to pass through, and the switch button is designed to be able to trigger a micro switch under the action of external force. The working sleeve is provided with a working tip connection hole, which is used to connect with a working tip; the working tip connection hole is configured to allow light generated by a light source to pass through; when the working sleeve is fitted onto the outer periphery of the light source sleeve, the working sleeve triggers the switch button.

6. The oral phototherapy device according to claim 5, characterized in that, The oral phototherapy device also includes a battery, a charging connection board, and control buttons; The motherboard is equipped with a control chip; The charging connection board is electrically connected to the battery, and the charging connection board is configured to supply electrical energy to the battery. The battery is electrically connected to the motherboard, and the battery is configured to store electrical energy and supply electrical energy to the motherboard. The battery and at least a portion of the charging connection plate are located within the cavity formed by the housing; The charging connection board is provided with a power connection terminal, and the outer shell is provided with an outer shell opening, through which the power connection terminal is exposed. The control button is located on the housing and is connected to the control chip. The control button is configured to control the light source's illumination and extinguishing, the light emission time, and the wavelength of the light emitted by the light source.

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