Slit coater and coating method

Abstract

The embodiment of the present disclosure provides a slit coating device and a coating method, which comprises a bearing table, a coating head, a liftable top ring, an overflow groove and a scraping structure; the bearing table is used for placing a wafer to be coated; the coating head is used for moving along a first direction under the action of a first driving device, so as to realize coating of photoresist on the surface of the wafer to be coated; when the coating head is located at an initial position, the liftable top ring is located at the same horizontal plane as the bearing table; when the coating head moves to an end position, the liftable top ring moves along a second direction under the action of a second driving device, so as to form an overflow groove; the scraping structure scrapes the photoresist located outside the wafer at the position of the overflow groove, so as to realize uniform coating of a circular silicon wafer based on the slit coating device.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to the field of semiconductor technology and related technical fields, in particular, to a slit coating device and a coating method. BACKGROUND

[0002] As a coating device for forming a coating film on a coated component (for example, a substrate of a silicon wafer) with a uniform thickness, a slit coater and a spin coater are known, which have different characteristics, and the use thereof is expanded according to the characteristics thereof.

[0003] The slit coater is used, for example, to form a coating film on a color filter or a TFT substrate of a liquid crystal display. The slit coater can also cope with a large glass substrate, and has the characteristic that the utilization efficiency of a coating liquid is high (that is, the waste of the coating liquid is small), but cannot coat a circular silicon wafer. In comparison with the slit coater, the spin coater is poor in coping with a large substrate or the utilization efficiency of a coating liquid, but can coat a circular silicon wafer, but cannot guarantee the uniformity of the coating.

[0004] Based on the problems existing in the prior art, the embodiments of the present disclosure provide a slit coating device, which realizes uniform coating of a circular silicon wafer. SUMMARY

[0005] The embodiments described herein provide a slit coating device and a coating method, which solve the problems existing in the prior art.

[0006] According to the first aspect of the present disclosure, a slit coating device is provided, comprising: a bearing table, a coating head, a liftable top ring, an overflow groove, and a scraping structure;

[0007] The bearing table is used to place a wafer to be coated.

[0008] The coating head is used to move in a first direction under the action of a first driving device, so as to coat photoresist on the surface of the wafer to be coated.

[0009] When the coating head is located at an initial position, the liftable top ring is located at the same horizontal plane as the wafer to be coated placed on the bearing table, when the coating head moves to an end position, the liftable top ring moves in a second direction under the action of a second driving device, forming an overflow groove, and the scraping structure scrapes the photoresist outside the wafer at the position of the overflow groove.

[0010] In some embodiments of the present disclosure, the scraping structure is arranged on the side of the wafer to be coated away from the bearing table, and the vertical projection of the bearing table is located in the overflow groove.

[0011] After the liftable top ring moves in the second direction under the action of the second driving device to form the overflow groove, the scratch structure moves in the second direction into the overflow groove under the action of the third driving device.

[0012] In some embodiments of the present disclosure, the scratch structure is connected to the liftable top ring.

[0013] When the liftable top ring moves in the second direction under the action of the second driving device, the liftable top ring drives the scratch structure to move into the overflow groove.

[0014] In some embodiments of the present disclosure, the scratch structure is arranged at the edge of the bearing table.

[0015] After the liftable top ring moves in the second direction under the action of the second driving device to form the overflow groove, the scratch structure moves in the fourth direction to the position of the overflow groove under the action of the third driving device, and moves in the second direction into the overflow groove under the action of the third driving device.

[0016] In some embodiments of the present disclosure, the depth of the overflow groove is H1, the thickness of the wafer to be coated is H2, and the depth H1 of the overflow groove satisfies: H1≥H2.

[0017] In some embodiments of the present disclosure, the depth of the overflow groove is H1, the thickness of the wafer to be coated is H2, and the thickness of the bearing table is H3, and the depth H1 of the overflow groove satisfies: H1>H2+H3.

[0018] In some embodiments of the present disclosure, a container is further included, which is arranged at the side of the overflow groove away from the wafer to be coated.

[0019] After the scratch structure scratches the photoresist outside the wafer at the position of the overflow groove, the container contains the scratched photoresist.

[0020] In some embodiments of the present disclosure, a liftable top rod is further included, which is arranged at the side of the bearing table away from the wafer to be coated.

[0021] After moving in the third direction to the target position under the action of the fourth driving device, the wafer to be coated is received by the conveying device, and the third direction is opposite to the second direction.

[0022] According to the second aspect of the present disclosure, a coating method is provided, which is applied to the slit coating device of any one of the first aspect, and includes:

[0023] output a first driving signal to the first driving device to move the coating head along a first direction under the action of the first driving device to realize coating photoresist on the surface of the wafer to be coated;

[0024] when it is detected that the coating head moves to an end position, output a second driving signal to the second driving device to move the liftable top ring along a second direction under the action of the second driving device to form an overflow groove;

[0025] output a third driving signal to the scraping structure to scrape the photoresist outside the wafer in the overflow groove.

[0026] In some embodiments of the present disclosure, the outputting of the third driving signal to the scraping structure to scrape the photoresist outside the wafer in the overflow groove comprises:

[0027] outputting the third driving signal to the scraping structure to move into the overflow groove;

[0028] According to the structure of the overflow groove, the movement track of the scraping structure in the overflow groove is determined to realize the scraping of the photoresist outside the wafer by the scraping structure at the position of the overflow groove.

[0029] The slit coating device and the coating method provided by the embodiments of the present disclosure comprise a bearing table, a coating head, a liftable top ring, an overflow groove and a scraping structure. The bearing table is used to place a wafer to be coated. The coating head moves along a first direction under the action of a first driving device to realize coating photoresist on the surface of the wafer to be coated. When the coating head is at an initial position, the liftable top ring is at the same horizontal plane as the bearing table. When the coating head moves to an end position, the liftable top ring moves along a second direction under the action of a second driving device to form an overflow groove. The scraping structure scrapes the photoresist outside the wafer at the position of the overflow groove. That is, when the coating head is at the initial position (i.e., the coating head does not coat photoresist on the wafer to be coated), the liftable top ring is at the same horizontal plane as the bearing table to ensure the uniformity of the photoresist coated on the wafer to be coated by the coating head. When the coating head coats photoresist on the wafer to be coated, the coating head moves to the end position (i.e., the coating head completes the coating of photoresist on the wafer to be coated). At this time, the second driving device drives the liftable top ring to move along the second direction to form an overflow groove on the bearing table. The photoresist coated on the bearing table falls into the overflow groove along with the movement of the liftable top ring. The scraping structure scrapes the photoresist coated on the bearing table at the position of the overflow groove, i.e., the scraping structure separates the photoresist coated on the bearing table from the photoresist coated on the wafer, ensuring that the wafer after coating is an independent wafer and improving the efficiency of the coating process. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly described in the following. It should be known that the drawings described below only relate to some of the embodiments of the present disclosure, rather than limiting the present disclosure, in which:

[0031] Figure 1 is a structural schematic diagram of a slit coating device provided by an embodiment of the present disclosure;

[0032] Figure 2 is a sectional structural schematic diagram of a slit coating device provided by an embodiment of the present disclosure;

[0033] Figure 3 is a sectional structural schematic diagram of another slit coating device provided by an embodiment of the present disclosure;

[0034] Figure 4 is a sectional structural schematic diagram of still another slit coating device provided by an embodiment of the present disclosure;

[0035] Figure 5 is a sectional structural schematic diagram of still another slit coating device provided by an embodiment of the present disclosure;

[0036] Figure 6 is a sectional structural schematic diagram of still another slit coating device provided by an embodiment of the present disclosure;

[0037] Figure 7 is a flow schematic diagram of a coating method provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person skilled in the art without any inventive effort are also within the scope of protection of the present disclosure.

[0039] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this present subject matter belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the specification and relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. As used herein, the statement that two or more parts are "connected" or "coupled" together will mean that the parts are joined together either directly or through one or more intermediate parts.

[0040] The singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, the term "a" or "an" shall mean one or more of the referenced item, and the terms "a" (or "an"), "one or more" and "at least one" are used interchangeably herein. Similarly, the word "or" is intended to mean either or both of the referenced items, unless the context clearly indicates otherwise. The terms "includes" and "including" should be interpreted broadly to mean that "including and / or including at least one of. Similarly, the term "example" is used herein to mean "an example of, and is not used in a restrictive sense to mean "an example only." The terms "example" and "exemplary" are used to mean "an example of or "an example, and are therefore to be interpreted not as "one of or only an example. The terms "a or an" and "one or more" are used interchangeably.

[0041] Based on the problems existing in the prior art, the slit coating device provided by the embodiments of the present disclosure, Figure 1 is a structural schematic diagram of the slit coating device provided by the embodiments of the present disclosure, Figure 2 is a sectional structural schematic diagram of the slit coating device provided by the embodiments of the present disclosure, Figure 3 is a sectional structural schematic diagram of another slit coating device provided by the embodiments of the present disclosure, in combination with Figure 1 , Figure 2 and Figure 3 , the slit coating device comprises a bearing table 10, a coating head 20, a liftable top ring 30, an overflow groove 40 and a scraping structure 50; the bearing table 10 is used for placing a wafer to be coated 00; the coating head 20 is used for moving in a first direction X1 under the action of a first driving device, so as to realize coating photoresist 01 on the surface of the wafer to be coated 00; when the coating head 20 is located at an initial position A1, the liftable top ring 30 is located at the same horizontal plane as the wafer to be coated 00 placed on the bearing table 10, when the coating head 20 moves to an end position A2, the liftable top ring 30 moves in a second direction X2 under the action of a second driving device, forming an overflow groove 40, as shown in Figure 3 , the scraping structure 50 scrapes the photoresist outside the wafer at the position of the overflow groove 40.

[0042] In the prior art, in the process of coating photoresist on a silicon wafer by using a rotary coater, the photoresist formed on the silicon wafer is related to the rotation rate of the coater and the viscosity of the photoresist, and there may be a problem of uneven coating. Based on the problems existing in the prior art, the embodiments of the present disclosure provide a slit coating device to realize uniform coating of a silicon wafer. As shown in Figure 1As shown, the wafer to be coated 00 is arranged on the bearing table 10, the coating head 20 is arranged on one side of the bearing table 10, and the first driving device drives the coating head 20 to move in the first direction X1 to realize the coating of the photoresist on the wafer to be coated 00 on the bearing table 10. Since the wafer to be coated 00 is circular, the width and length of the photoresist coated by the coating head 20 need to be greater than or equal to the diameter of the wafer to be coated 00 during the coating process of the photoresist on the wafer to be coated 00 on the bearing table 10, so as to realize the complete coverage of the photoresist coated by the coating head 20 on the wafer to be coated 00. However, the width and length of the photoresist coated by the coating head 20 greater than or equal to the diameter of the wafer to be coated 00 will inevitably cause the photoresist coated on the wafer to be coated 00 to exist on the bearing table 10. At this time, the second driving device drives the liftable top ring 30 to move in the second direction X2 to form the overflow groove 40, and the photoresist 01 coated on the bearing table 10 will fall into the overflow groove 40 along with the movement of the liftable top ring 30, so as to separate the photoresist 01 coated on the bearing table 10 from the photoresist coated on the wafer, realize the coating of the wafer, and improve the coating process efficiency.

[0043] Since the slit coating method is used for the wafer to be coated in the present application, the uniformity of the photoresist coated on the wafer to be coated can be ensured.

[0044] In the embodiment of the present disclosure, when the coating head 20 is located at the initial position A1 (i.e., the coating head does not coat the photoresist on the wafer to be coated), the liftable top ring 30 and the wafer to be coated 00 placed on the bearing table 10 are located at the same horizontal plane, as shown in Figure 2 which ensures the uniformity of the photoresist coated by the coating head 20 on the wafer to be coated 00. After the photoresist is coated on the wafer to be coated 00 by the coating head 20, the coating head moves to the end position A2 (i.e., the coating head completes the coating of the photoresist on the wafer to be coated), at this time, the second driving device drives the liftable top ring 30 to move in the second direction X2 to form the overflow groove 40 on the bearing table 10, as shown in Figure 3 which makes the photoresist coated on the bearing table 10 fall into the overflow groove 40 along with the movement of the liftable top ring 30, and the photoresist at the position of the overflow groove 40 is scraped by the scraping structure 50, i.e., the photoresist coated on the bearing table is separated from the photoresist coated on the wafer by the scraping structure 50, so as to ensure that the coated wafer is an independent wafer, improve the uniformity of the photoresist coated on the wafer, and improve the coating process efficiency.

[0045] It should be noted that in the above embodiment, when the coating head 20 is located at the initial position A1, the liftable top ring 30 and the wafer to be coated 00 placed on the bearing table 10 are located at the same horizontal plane, as shown in Figure 2As shown, when the coating head 20 moves to the end position A2, the liftable top ring 30 moves along the second direction X2 under the action of the second driving device to form the overflow groove 40. It can be seen from Figure 3 , specifically, the second direction X2 is perpendicular to the horizontal plane in which the first direction X1 is located, and the overflow groove 40 formed thereby surrounds the to-be-coated wafer 00, that is, the liftable top ring 30 is arranged to surround the to-be-coated wafer 00 and is located at the same horizontal plane as the to-be-coated wafer 00 placed on the carrier table 10.

[0046] In the above embodiment, the first direction X1 is a direction parallel to the carrier table. In a specific implementation, the moving direction of the coating head 20 is related to the position of the to-be-coated wafer 00 and the setting position of the coating head 20, and the present disclosure does not make a specific limitation thereon.

[0047] The slit coating device provided by the embodiment of the present disclosure comprises a carrier table, a coating head, a liftable top ring, an overflow groove and a scraping structure. The carrier table is used to place a to-be-coated wafer. The coating head moves along a first direction under the action of a first driving device to realize coating of photoresist on the surface of the to-be-coated wafer. When the coating head is located at an initial position, the liftable top ring is located at the same horizontal plane as the carrier table. When the coating head moves to an end position, the liftable top ring moves along a second direction under the action of a second driving device to form an overflow groove. The scraping structure scrapes photoresist located outside the wafer at the position of the overflow groove. That is, when the coating head is located at the initial position (i.e., the coating head does not coat photoresist on the to-be-coated wafer), the liftable top ring is located at the same horizontal plane as the carrier table, thereby ensuring the uniformity of photoresist coating on the to-be-coated wafer by the coating head. After the coating head coats photoresist on the to-be-coated wafer, the coating head moves to the end position (i.e., the coating head completes photoresist coating on the to-be-coated wafer). At this time, the second driving device drives the liftable top ring to move along the second direction to form an overflow groove on the carrier table. The photoresist coated on the carrier table falls into the overflow groove along with the movement of the liftable top ring, and the scraping structure scrapes the photoresist coated on the carrier table at the position of the overflow groove. That is, the scraping structure separates the photoresist coated on the carrier table from the photoresist coated on the wafer, thereby ensuring that the coated wafer is an independent wafer and improving the efficiency of the coating process.

[0048] As a specific implementation, the scraping structure 50 is arranged on the side of the to-be-coated wafer 00 away from the carrier table 10, and the vertical projection of the scraping structure 50 on the carrier table 10 is located in the overflow groove 40. After the liftable top ring 30 moves along the second direction X2 under the action of the second driving device to form the overflow groove 40, the scraping structure 50 moves along the second direction X2 into the overflow groove 40 under the action of a third driving device.

[0049] Specifically, in combination with Figure 4, the scraping structure 50 is arranged on the side of the wafer to be coated away from the supporting table 10, i.e. above the supporting table 10. When the coating head 20 moves along the first direction X1 under the action of the first driving device to coat the photoresist on the surface of the wafer to be coated, the scraping structure 50 is located on the side of the wafer to be coated away from the supporting table 10, and the scraping structure 50 is not in contact with the wafer to be coated, thereby ensuring the coating of the wafer to be coated by the coating head 20. After the coating head 20 moves along the first direction X1 under the action of the first driving device to coat the photoresist on the surface of the wafer to be coated, i.e. when the coating head moves to the end position, the lifting top ring 30 is driven to move along the second direction X2 by the second driving device to form the overflow groove 40. After the overflow groove 40 is formed, the scraping structure 50 is driven to move into the overflow groove along the second direction X2 by the third driving device, as shown in Figure 3 .

[0050] To ensure that the scraping structure is accurately moved into the overflow groove along the second direction by the third driving device, the vertical projection of the scraping structure on the supporting table is arranged in the overflow groove, so that the scraping structure is moved into the overflow groove under the action of the third driving device.

[0051] It should be noted that in the above embodiment, in the embodiment in which the scraping structure is arranged on the side of the wafer to be coated away from the supporting table, the distance between the scraping structure and the supporting table is greater than the sum of the thickness of the wafer to be coated and the height of the coating head, so as to avoid that the scraping structure scrapes the photoresist formed by the coating on the surface of the wafer to be coated during the coating of the photoresist on the wafer to be coated.

[0052] As another specific implementation, the scraping structure 50 is connected with the lifting top ring 30, as shown in Figure 5 . When the lifting top ring 30 moves along the second direction X2 under the action of the second driving device, the lifting top ring 30 drives the scraping structure 50 to move into the overflow groove 40.

[0053] In the above embodiment, the lifting top ring 30 and the scraping structure 50 are respectively moved by different driving devices, i.e. the driving device connected with the lifting top ring 30 and the driving device connected with the scraping structure 50 are two independent driving devices. To realize a small-size slot coating device, as a kind of implementation, the scraping structure 50 is connected with the lifting top ring 30, as shown in Figure 5 . When the lifting top ring 30 moves along the second direction X2 under the action of the second driving device, the lifting top ring 30 drives the scraping structure 50 to move into the overflow groove 40, as shown in Figure 3 .

[0054] Specifically, the scraping structure 50 is arranged above the liftable top ring 30, i.e., the scraping structure 50 is arranged in connection with the liftable top ring 30, when the liftable top ring 30 moves along the second direction X2 under the action of the second driving device, the liftable top ring 30 drives the scraping structure 50 to move along the second direction X2 into the overflow groove 40.

[0055] In the specific implementation process, the width of the coating head is arranged to be the same as the diameter of the wafer to be coated.

[0056] As another specific implementable manner, as shown in Figure 6 The scraping structure 50 is arranged at the edge of the bearing table 10; after the liftable top ring 30 moves along the second direction X2 under the action of the second driving device to form the overflow groove 40, the scraping structure 50 moves along the fourth direction to the position of the overflow groove under the action of the third driving device, and moves along the second direction into the overflow groove 40 under the action of the third driving device.

[0057] In addition, the scraping structure 50 can be arranged at the edge of the bearing table 10, as shown in Figure 6 When the coating head moves along the first direction X1 under the action of the first driving device to coat the photoresist on the surface of the wafer to be coated 00, the scraping structure 50 is at the edge of the bearing table 10, the scraping structure 50 does not contact the wafer to be coated 00, and the coating of the coating head on the wafer to be coated is ensured. After the coating head 20 moves along the first direction under the action of the first driving device to coat the photoresist on the surface of the wafer to be coated, i.e., the coating head moves to the end position, at this time, the liftable top ring is driven to move along the second direction by the second driving device, and the overflow groove is formed. After the overflow groove is formed, the third driving device drives the scraping structure to move along the fourth direction to the position of the overflow groove, and moves along the second direction into the overflow groove under the action of the third driving device, i.e., the third driving device first drives the scraping structure to move along the surface of the bearing table to the position of the overflow groove, and then moves along the second direction into the overflow groove.

[0058] It should be noted that in this embodiment, the fourth direction is parallel to the plane where the bearing table is located, and the specific direction of the fourth direction is related to the position of the formed overflow groove and the arrangement position of the scraping structure, and the present disclosure does not specifically limit this.

[0059] As an implementable manner, optionally, the depth of the overflow groove 40 is H1, the thickness of the wafer to be coated 00 is H2, and the depth H1 of the overflow groove satisfies: H1≥H2.

[0060] By setting the depth H1 of the overflow groove to be greater than or equal to the thickness H2 of the wafer to be coated, it is ensured that after the scraping structure is moved to the overflow groove, the photoresist coated on the carrier table is scraped by the scraping structure at the position of the overflow groove, that is, the photoresist coated on the carrier table is separated from the photoresist coated on the wafer by the scraping structure

[0061] As an implementable manner, optionally, the depth of the overflow groove is H1, the thickness of the wafer to be coated is H2, and the thickness of the carrier table is H3, and the depth H1 of the overflow groove satisfies: H1>H2+H3.

[0062] Optionally, the slit coating device further comprises a container corresponding to the overflow groove; after the scraping structure scrapes the photoresist outside the wafer at the position of the overflow groove, the container contains the scraped photoresist.

[0063] By setting the depth H1 of the overflow groove to be greater than the sum of the thickness H2 of the wafer to be coated and the thickness H3 of the carrier table, that is, H1>H2+H3, it is ensured that after the photoresist coated on the carrier table is scraped by the scraping structure at the position of the overflow groove, the scraped photoresist can fall into the container corresponding to the position of the overflow groove, realizing the recycling of the photoresist.

[0064] As an implementable manner, as shown in Figure 1 It further comprises a lifting top rod 60 located on the side of the carrier table 10 away from the wafer to be coated 00; after being moved to the target position by the fourth driving device in the third direction opposite to the second direction, the wafer to be coated is received by the conveying device.

[0065] By setting the lifting top rod, before the coating head coats the wafer to be coated, the lifting top rod is moved to the target position in the third direction, and the wafer to be coated is received by the conveying device; after receiving the wafer to be coated, the lifting top rod is moved to the carrier table position in the second direction, and the wafer to be coated is coated by the coating head of the carrier table.

[0066] As an implementable manner, the present disclosure further provides a coating method, as shown in Figure 7 The coating method comprises:

[0067] S110, output a first driving signal to a first driving device, so that the coating head moves in a first direction under the action of the first driving device, and realizes coating of photoresist on the surface of the wafer to be coated.

[0068] In combination with Figure 1first driving signal to the first driving device to move the coating head along the first direction under the action of the first driving device, so as to realize coating of the photoresist on the surface of the wafer to be coated.

[0069] S120, when it is detected that the coating head moves to the end position, output a second driving signal to the second driving device to move the liftable top ring along the second direction under the action of the second driving device to form the overflow groove.

[0070] When the coating head performs photoresist coating on the wafer to be coated, the coating head moves to the end position (i.e. the coating head completes photoresist coating on the wafer to be coated), at this time, by outputting the second driving signal, the liftable top ring moves along the second direction under the action of the second driving signal to form the overflow groove on the carrier table, so that the photoresist coated on the carrier table falls into the overflow groove along with the movement of the liftable top ring.

[0071] S130, output a third driving signal to the scraping structure to scrape the photoresist outside the wafer in the overflow groove.

[0072] When the overflow groove is formed on the carrier table, the photoresist coated on the carrier table falls into the overflow groove along with the movement of the liftable top ring, at this time, by outputting the third driving signal to the scraping structure, the scraping structure scrapes the photoresist outside the wafer in the overflow groove, that is, the photoresist coated on the carrier table is separated from the photoresist coated on the wafer by the scraping structure, ensuring that the wafer after coating is an independent wafer and improving the coating process efficiency.

[0073] The implementation process of step S130 specifically includes:

[0074] Output the third driving signal to the scraping structure to move the scraping structure into the overflow groove; determine the movement trajectory of the scraping structure in the overflow groove according to the structure of the overflow groove, so as to realize scraping of the photoresist outside the wafer at the position of the overflow groove by the scraping structure.

[0075] It should be noted that in the above embodiments, the wafer to be coated is exemplarily represented as a regular circle, and in other implementable manners, the wafer to be coated can be other irregular shapes, which are not specifically limited in the embodiments of the present disclosure.

[0076] In the process of scraping the photoresist outside the wafer at the position of the overflow groove by the scraping structure, the movement trajectory is determined according to the shape of the formed overflow groove, and the shape of the formed overflow groove is related to the shape of the wafer to be coated.

[0077] The slit coating method provided by the embodiments of the present disclosure comprises: outputting a first driving signal to a first driving device to enable a coating head to move along a first direction under the action of the first driving device, so as to coat photoresist on the surface of a wafer to be coated; when it is detected that the coating head moves to an end position, outputting a second driving signal to a second driving device to enable a liftable top ring to move along a second direction under the action of the second driving device, so as to form an overflow groove; outputting a third driving signal to the scraping structure, so that the scraping structure scrapes the photoresist located outside the wafer in the overflow groove, that is, when the coating head is located at an initial position (that is, the coating head does not coat photoresist on the wafer to be coated), the liftable top ring is located at the same horizontal plane as the support table, so as to ensure the uniformity of the photoresist coated on the wafer to be coated; when the coating head coats photoresist on the wafer to be coated, the coating head moves to an end position (that is, the coating head completes the coating of photoresist on the wafer to be coated), at this time, the second driving device drives the liftable top ring to move along the second direction to form an overflow groove on the support table, so that the photoresist coated on the support table falls into the overflow groove along with the movement of the liftable top ring, and the photoresist coated on the support table is scraped by the scraping structure at the position of the overflow groove, that is, the photoresist coated on the support table is separated from the photoresist coated on the wafer by the scraping structure, so as to ensure that the wafer after coating is an independent wafer, improve the uniformity of the photoresist coated on the wafer, and improve the coating process efficiency.

[0078] The embodiments of the present disclosure also provide a computer device for executing the coating method provided by the above embodiments to coat a wafer to be coated. The computer device comprises a memory and a processor which are communicatively connected through a system bus. It should be noted that only the computer device with components is shown in the figure, but it should be understood that all the shown components are not required to be implemented, and more or fewer components can be alternatively implemented. Among them, those skilled in the art can understand that the computer device herein is a device capable of automatically performing numerical calculation and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to microprocessors, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0079] The computer device can be a desktop computer, a notebook computer, a palm computer, a cloud server and other computing devices. The computer device can interact with the user through a keyboard, a mouse, a remote controller, a touchpad or a voice control device.

[0080] The memory includes at least one type of readable storage medium, which includes non-volatile memory or volatile memory, for example, flash memory, a hard disk, a multimedia card, a card-type memory (e.g., SD or DX memory, etc.), random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), a magnetic memory, a magnetic disk, an optical disk, etc. The RAM can include static RAM or dynamic RAM. In some embodiments, the memory can be an internal storage unit of the computer device, for example, a hard disk or a memory of the computer device. In other embodiments, the memory can also be an external storage device of the computer device, for example, a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, or a flash card, etc. equipped on the computer device. Of course, the memory 710 can also include both the internal storage unit and the external storage device of the computer device. In the present embodiment, the memory is generally used to store an operating system and various application software installed on the computer device, for example, program codes of the above method, etc. In addition, the memory can also be used to temporarily store various data that has been output or will be output.

[0081] The processor is generally used to perform the overall operation of the computer device. In the present embodiment, the memory is used to store program codes or instructions, which include computer operation instructions. The processor is used to execute the program codes or instructions stored in the memory or process data, for example, run the program codes of the above method.

[0082] In this document, the bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The bus system can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, only one thick line is shown in the figure, but this does not mean that there is only one bus or only one type of bus.

[0083] Another embodiment of the present application also provides a computer readable medium, which can be a computer readable signal medium or a computer readable storage medium. A processor in a computer reads computer readable program codes stored in the computer readable medium, so that the processor can perform the functions and actions specified in each step or combination of steps in the above method; and generates a device that implements the functions and actions specified in each block or combination of blocks in the block diagram.

[0084] The computer readable medium includes, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any appropriate combination of the foregoing, for storing program codes or instructions, which include computer operation instructions, and a processor for executing the program codes or instructions of the above method stored in the memory.

[0085] The definitions of the memory and the processor can refer to the descriptions of the foregoing computer device embodiments, which will not be repeated here.

[0086] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the modules or units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units or components shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or other forms.

[0087] The functional units or modules in each embodiment of the present application can be integrated in one processing unit, or can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0088] If the integrated unit is implemented in the form of a software function unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the embodiments of the method of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0089] Unless the context clearly indicates otherwise, as used herein and in the appended claims, the singular form "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Accordingly, the use of "a" or "an" herein and in the following claims is intended to be interpreted to include the plural, unless the context clearly indicates otherwise. Similarly, the words "comprise," "comprises," and "comprising" are to be interpreted inclusively rather than exclusively. Likewise, the terms "include," "including," and "includes" should be construed to be inclusive, unless otherwise indicated herein. Where the term "example" is used occurring in this document, particularly with respect to a term or phrase, the "example" is merely an example and is not to be construed as preferred or advantageous over other examples.

[0090] Further aspects and scope of adaptation become apparent from the description provided herein. It should be understood that various aspects of the present application can be practiced alone or in combination with one or more other aspects. It should also be understood that the description and specific examples herein are intended to be illustrative only and are not intended to limit the scope of the present application.

[0091] The above detailed description of several embodiments of the present disclosure has been described, but it is obvious that those skilled in the art can make various modifications and variations to the embodiments of the present disclosure without departing from the spirit and scope of the present disclosure. The protection scope of the present disclosure is defined by the appended claims.

Claims

1. A slit coating device, characterized in that: The application relates to a photoresist coating device. The device comprises a bearing table, a coating head, a liftable top ring, an overflow groove and a scraping structure. The bearing table is used for placing a wafer to be coated. The coating head is used for moving along a first direction under the action of a first driving device, so as to coat photoresist on the surface of the wafer to be coated. When the coating head is located at an initial position, the liftable top ring is located at the same horizontal plane as the wafer to be coated placed on the bearing table.

2. The apparatus of claim 1, wherein, When the coating head moves to an end position, the liftable top ring moves along a second direction under the action of a second driving device, so as to form an overflow groove. The scraping structure is arranged on the side of the wafer to be coated away from the bearing table.

3. The apparatus of claim 1, wherein, The vertical projection of the scraping structure on the bearing table is located in the overflow groove. After the liftable top ring moves along the second direction under the action of the second driving device to form the overflow groove, the scraping structure moves along the second direction into the overflow groove under the action of a third driving device.

4. The apparatus of claim 1, wherein, The scraping structure is connected with the liftable top ring. When the liftable top ring moves along the second direction under the action of the second driving device, the liftable top ring drives the scraping structure to move into the overflow groove.

5. The apparatus of claim 1, wherein, The scraping structure is arranged on the edge of the bearing table.

6. The apparatus of claim 1, wherein, After the liftable top ring moves along the second direction under the action of the second driving device to form the overflow groove, the scraping structure moves along a fourth direction to the position of the overflow groove under the action of the third driving device, and then moves along the second direction into the overflow groove under the action of the third driving device.

7. The apparatus of claim 6, wherein, The depth of the overflow groove is H1, the thickness of the wafer to be coated is H2, and the depth H1 of the overflow groove satisfies H1 >= H2. The depth of the overflow groove is H1, the thickness of the wafer to be coated is H2, and the thickness of the bearing table is H3, and the depth H1 of the overflow groove satisfies H1 > H2+H3.

8. The apparatus of claim 1, wherein, The device further comprises a container, which is arranged on the side of the overflow groove away from the wafer to be coated. After the scraping structure scrapes the photoresist outside the wafer at the position of the overflow groove, the container contains the scraped photoresist.

9. A coating method applied to the slot die coating apparatus of any one of claims 1 to 8, characterized in that, The device further comprises a lifting top rod, which is arranged on the side of the bearing table away from the wafer to be coated. After moving to a target position along a third direction under the action of a fourth driving device, the lifting top rod receives the wafer to be coated transmitted by a transmission device, and the third direction is opposite to the second direction. The device comprises a controller. The controller outputs a first driving signal to a first driving device, so that the coating head moves along a first direction under the action of the first driving device, and photoresist is coated on the surface of the wafer to be coated. When the controller detects that the coating head moves to an end position, the controller outputs a second driving signal to a second driving device, so that the liftable top ring moves along a second direction under the action of the second driving device, and an overflow groove is formed. The controller outputs a third driving signal to the scraping structure, so that the scraping structure scrapes the photoresist outside the wafer in the overflow groove.

10. The method of claim 9, wherein, The output third driving signal to the scraping structure, so that the scraping structure in the overflow tank on the outside of the wafer photoresist scraping, including: Output third driving signal to the scraping structure, so that the scraping structure moves into the overflow tank; According to the structure of the overflow tank, determine the movement trajectory of the scraping structure in the overflow tank, to realize the scraping structure in the overflow tank position on the outside of the wafer photoresist scraping.

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