Electronic device

Abstract

The application provides an electronic device, comprising: a main body; a decorative ring arranged on the main body; and a circuit board assembly arranged on the main body and located at a circumferential side of the decorative ring, wherein the decorative ring and the circuit board assembly form a near field communication antenna.

Description

electronic devices Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] In related technologies, the near-field communication antenna of electronic devices is usually arranged on the back. The back of the electronic device is also equipped with a camera. In order to improve the aesthetics, a decorative ring is usually set at the camera. However, because the size of the decorative ring is relatively large, it affects the size of the near-field communication antenna, resulting in poor performance of the near-field communication antenna. Summary of the Invention

[0003] This application aims to provide an electronic device that can solve or improve the technical problem that the performance of the near-field communication antenna is poor due to the setting of the decorative ring.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, this application provides an electronic device, comprising:

[0006] main body;

[0007] A decorative ring is placed on the main body;

[0008] A circuit board assembly is mounted on the main body and located around the decorative ring. The decorative ring and the circuit board assembly together form a near-field communication antenna.

[0009] In embodiments of this application, the electronic device includes a main body, a decorative ring, and a circuit board assembly. The decorative ring and the circuit board assembly are disposed on the main body, and the circuit board assembly is disposed around the decorative ring. The decorative ring and the circuit board form a near-field communication antenna. That is, the near-field communication antenna is formed by using the decorative ring and the circuit board assembly, thereby increasing the area of ​​the near-field communication antenna and improving its performance.

[0010] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0011] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0012] Figure 1 shows a schematic diagram of an electronic device provided in one embodiment of this application;

[0013] Figure 2 shows a schematic diagram of an electronic device provided in one embodiment of this application;

[0014] Figure 3 shows a schematic diagram of an electronic device provided in one embodiment of this application;

[0015] Figure 4 shows a schematic diagram of an electronic device provided in one embodiment of this application;

[0016] Figure 5 shows a schematic diagram of an electronic device provided in one embodiment of this application;

[0017] Figure 6 shows a schematic diagram of an electronic device provided in one embodiment of this application;

[0018] Figure 7 shows a schematic diagram of an electronic device provided in one embodiment of this application.

[0019] Figure 1 to Figure 7 reference numerals:

[0020] 100 Electronic device, 110 Main body, 120 Decorative ring, 122 First ring body, 124 Second ring body, 126 First power supply point, 128 First grounding point, 130 Connecting part, 140 Circuit board assembly, 142 Ferrite layer, 144 Circuit board, 146 Second power supply point, 148 Third power supply point, 150 Second grounding point. Detailed Implementation

[0021] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] In the description of this application, it should be understood that the terms "upper" and "inner", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] The following describes an electronic device 100 according to an embodiment of this application, with reference to Figures 1 to 7. In Figures 1 to 5, the arrows indicate the direction of current transmission.

[0026] As shown in Figures 1 to 7, this application provides an electronic device 100, including: a main body 110; a decorative ring 120 disposed on the main body 110; and a circuit board assembly 140 disposed on the main body 110 and located around the decorative ring 120, wherein the decorative ring 120 and the circuit board assembly 140 form a near-field communication antenna.

[0027] In the embodiments of this application, the electronic device 100 includes a main body 110, a decorative ring 120, and a circuit board assembly 140. The decorative ring 120 and the circuit board assembly 140 are disposed on the main body 110, and the circuit board assembly 140 is disposed around the decorative ring 120. The decorative ring 120 and the circuit board assembly 140 form a near-field communication antenna. That is, the near-field communication antenna is formed by the decorative ring 120 and the circuit board assembly 140, thereby increasing the area of ​​the near-field communication antenna and improving its performance.

[0028] Furthermore, by coordinating the decorative ring 120 and the circuit board assembly 140, the space occupied by the near-field communication antenna in the electronic device 100 is reduced, and material input is decreased, lowering production costs. This ensures both the aesthetics of the electronic device 100 and improves its near-field communication performance. Specifically, the near-field communication antenna can be placed on the back of the electronic device 100, closer to the top, thus facilitating the use of near-field communication functions. Moreover, it allows for the coordination of multiple cameras and a larger decorative ring 120, thereby achieving higher near-field communication performance within a limited wiring area.

[0029] The decorative ring 120 can be made of metal, such as iron, iron alloy, copper, copper alloy, aluminum, aluminum alloy, silver, or silver alloy.

[0030] The decorative ring 120 has a through hole in the middle, which can maintain the overall texture of the electronic device 100 and reduce the weight of the electronic device 100. The near-field communication antenna formed by combining the circuit board assembly 140 and the decorative ring 120 can have high near-field communication performance.

[0031] Furthermore, the circuit board assembly 140 can be disposed at any position around the decorative ring 120, for example, the circuit board assembly 140 can be disposed on the left, right, upper or lower side of the decorative ring 120.

[0032] As shown in Figures 1 to 7, in one possible implementation, the decorative ring 120 includes a first power supply point 126 and a first ground point 128. The decorative ring 120 is powered through the first power supply point 126 and grounded through the first ground point 128. A first ring body portion 122 is formed on the side of the decorative ring 120 closest to the circuit board assembly 140 between the first power supply point 126 and the first ground point 128, and a second ring body portion 124 is formed on the side of the decorative ring 120 furthest from the circuit board assembly 140 between the first power supply point 126 and the first ground point 128. When the decorative ring 120 is powered, the current on the second ring body portion 124 is less than the current on the first ring body portion 122.

[0033] Specifically, the decorative ring 120 includes a first power supply point 126 and a first ground point 128. Since the decorative ring 120 is a ring structure, the first power supply point 126 and the first ground point 128 divide the decorative ring 120 into two distributions, one of which is a first ring body portion 122 and the other is a second ring body portion 124. The first ring body portion 122 is a semi-ring structure with an opening. Similarly, the second ring body portion 124 is a semi-ring structure with an opening. The first ring body portion 122 is closer to the circuit board assembly 140 than the second ring body portion 124.

[0034] When the decorative ring 120 is fed through the first feed point 126, the current is transmitted to the first ground point 128 through the first ring body 122 and the second ring body 124 respectively. That is, when the near-field communication antenna is working, the current on the decorative ring 120 consists of two parts: one is the current I1 transmitted through the first ring body 122, and the other is the current I2 transmitted through the second ring body 124. Furthermore, the current I2 on the second ring body 124 is far away from the current on the circuit board assembly 140. When I2 plays a major role, the intermediate magnetic field is weak, which can easily lead to a large working dead zone. When the current I1 on the first ring body 122 plays a major role, the intermediate magnetic field is strong, and the performance of the near-field communication antenna is better.

[0035] Therefore, by making the current I1 on the first ring body 122 greater than the current I2 on the second ring body 124, the proportion of the current I2 on the second ring body 124 is reduced, so that the current I1 on the first ring body 122 plays a major role and the performance of the near-field communication antenna is improved.

[0036] Furthermore, the proportion of the first ring body portion 122 on the decorative ring 120 is smaller than the proportion of the second ring body portion 124 on the decorative ring 120, that is, the length of the first ring body portion 122 is smaller than the length of the second ring body portion 124.

[0037] The decorative ring 120 can be a ring structure composed of at least one straight edge and an arc edge. For example, the decorative ring 120 can be a circular ring structure, a polygonal ring structure, an elliptical ring structure, or a racetrack ring structure, etc.

[0038] Furthermore, the first grounding point 128 may have one or more, and the decorative ring 120 may be grounded by means of a series capacitor, thereby improving the performance of the near-field communication antenna.

[0039] As shown in Figures 2, 3, 5, 6 and 7, in one possible implementation, the second ring body 124 and the first ring body 122 are made of the same material, and the cross-sectional area of ​​the first ring body 122 perpendicular to the current passing direction is greater than the cross-sectional area of ​​the second ring body 124 perpendicular to the current passing direction.

[0040] Specifically, the first ring portion 122 and the second ring portion 124 are made of the same material. The cross-sectional area of ​​the first ring portion 122 perpendicular to the current flow direction is greater than that of the second ring portion 124 perpendicular to the current flow direction. This increases the cross-sectional area of ​​the first ring portion 122 perpendicular to the current flow direction, reduces the impedance of the first ring portion 122, and thus increases the current I1 on the first ring portion 122, thereby improving the performance of the near-field communication antenna.

[0041] The first ring body 122 and the second ring body 124 can be an integral structure, that is, the first ring body 122 and the second ring body 124 are formed together by injection molding or machining.

[0042] In other words, the current I1 is increased by optimizing the impedance of the first ring body 122 path. When the material is the same, the larger the cross-sectional area of ​​the conductor, the smaller its impedance. The impedance optimization in this embodiment is based on this principle. By appropriately increasing the material of the first ring body 122, i.e., increasing it to W, the path impedance between the first feed point 126 and the first ground point 128 is reduced. This increases the current I1, giving it a greater weight compared to the current I2, thus significantly enhancing the performance of the near-field communication antenna.

[0043] As shown in Figures 2, 3, 5, 6 and 7, in one possible implementation, the width of the first ring portion 122 is greater than the width of the second ring portion 124.

[0044] Specifically, the width of the first ring portion 122 is greater than the width of the second ring portion 124. This ensures that the thickness of the decorative ring 120 is consistent while increasing the intensity of the current I1 on the first ring portion 122 and reducing the overall thickness of the electronic device 100. The first ring portion 122 includes the locations of the first feed point 126 and the first ground point 128. Furthermore, the minimum width of the first ring portion 122 is greater than the maximum width of the second ring portion 124.

[0045] As shown in Figure 1, the width W of the first ring body portion 122 and the width of the second ring body portion 124 are basically the same. As shown in Figure 2, the width W of the first ring body portion 122 is increased so that the width W of the first ring body portion 122 is greater than the width of the second ring body portion 124, thereby increasing the proportion of the current I1 on the first ring body portion 122. Therefore, the electronic device 100 provided in this application has better near-field communication performance.

[0046] As shown in Figure 3, the width W of the first ring body 122 and the width of the second ring body 124 are basically the same. As shown in Figure 4, the width W of the first ring body 122 is increased so that the width W of the first ring body 122 is greater than the width of the second ring body 124, thereby increasing the proportion of the current I1 on the first ring body 122. Therefore, the electronic device 100 provided in this application has better near-field communication performance.

[0047] Of course, in other embodiments of this application, the thickness of the first ring portion 122 may be greater than the thickness of the second ring portion 124.

[0048] As shown in Figures 1 to 5, in one possible implementation, the circuit board assembly 140 is electrically connected to the first power supply point 126, the circuit board assembly 140 includes a second power supply point 146, the circuit board assembly 140 is powered through the second power supply point 146, and the decorative ring 120 is powered through the circuit board assembly 140.

[0049] Specifically, the circuit board assembly 140 is electrically connected to the first power supply point 126. The circuit board assembly 140 includes a second power supply point 146, through which the circuit board assembly 140 is powered. Furthermore, the decorative ring 120 can be powered through the circuit board assembly 140, thereby generating current and radiation to achieve the purpose of near-field communication.

[0050] That is, the circuit board assembly 140 and the decorative ring 120 are connected as a whole, powered by the circuit board assembly 140 and grounded through the first ground point 128 on the decorative ring 120, so that the decorative ring 120 forms part of the coil of the near field communication antenna.

[0051] As shown in Figures 1 to 5, in one possible implementation, the distance between the second feed point 146 and the first ground point 128 is a first distance, and the distance between the second feed point 146 and the first feed point 126 is a second distance, with the first distance being less than the second distance.

[0052] Specifically, the distance between the second feed point 146 and the first ground point 128 is the first distance, and the distance between the second feed point 146 and the first feed point 126 is the second distance. Furthermore, the first distance is less than the second distance, meaning that the distance between the first ground point 128 and the second feed point 146 is closer, thereby improving the performance of the near-field communication antenna.

[0053] Furthermore, the first grounding point 128 and the second feed point 146 are placed as close as possible to each other, that is, the distance between the two is as close as possible, thereby improving the performance of near-field communication.

[0054] As shown in Figures 6 and 7, in one possible implementation, the circuit board assembly 140 and the decorative ring 120 are separated. The circuit board assembly 140 includes a third power supply point 148 and a second ground point 150. The circuit board assembly 140 is powered through the third power supply point 148 and grounded through the second ground point 150.

[0055] Specifically, the circuit board assembly 140 and the decorative ring 120 are separate and do not form an electrical connection. The circuit board assembly 140 includes a third feed point 148 and a second ground point 150. The circuit board assembly 140 is fed through the third feed point 148 and grounded through the second ground point 150. Together with the first feed point 126 and the first ground point 128 on the decorative ring 120, a dual-ended near-field communication antenna is formed, thereby improving the performance of the near-field communication antenna.

[0056] As shown in Figures 6 and 7, in one possible implementation, the distance between the first grounding point 128 and the second grounding point 150 is the third distance, and the distance between the first grounding point 128 and the third feed point 148 is the fourth distance, with the third distance being less than the fourth distance; the distance between the first feed point 126 and the third feed point 148 is the fifth distance, and the distance between the first feed point 126 and the second grounding point 150 is the sixth distance, with the fifth distance being less than the sixth distance.

[0057] Specifically, the distance between the first grounding point 128 and the second grounding point 150 is the third distance, the distance between the first grounding point 128 and the third feed point 148 is the fourth distance, and the third distance is less than the fourth distance, meaning the first grounding point 128 is closer to the second grounding point 150. The distance between the first feed point 126 and the third feed point 148 is the fifth distance, and the distance between the first feed point 126 and the second grounding point 150 is the sixth distance, and the fifth distance is less than the sixth distance, meaning the first feed point 126 is closer to the third feed point 148. This ensures that the first feed point 126 and the third feed point 148 are approximately oriented towards the same end of the electronic device 100, and the first grounding point 128 and the second grounding point 150 are approximately oriented towards the same end of the electronic device 100, thereby constructing a current loop in the same direction and improving the performance of the near-field communication antenna.

[0058] As shown in Figure 5, in one possible implementation, the decorative ring 120 further includes a connecting portion 130. One end of the connecting portion 130 is connected to the first power supply point 126, and the other end is connected to the first grounding point 128. The connecting portion 130 passes through the inner ring of the decorative ring 120. The width of the connecting portion 130 is greater than the width of the first ring body portion 122, and the width of the connecting portion 130 is greater than the width of the second ring body portion 124.

[0059] Specifically, a connecting portion 130 is provided in the middle of the decorative ring 120. The connecting portion 130 is located between the first ring body portion 122 and the second ring body portion 124. The connecting portion 130 passes through the inner ring of the decorative ring 120, that is, it passes through the hollowed-out part in the middle of the decorative ring 120. A gap is formed between the connecting portion 130 and the first ring body portion 122, and a gap is also formed between the connecting portion 130 and the second ring body portion 124. Furthermore, the width S of the connecting portion 130 is greater than the width W of the first ring body portion 122. The width of the second ring portion 124 is also considered. The width of the first ring portion 122 is approximately the same as the width of the second ring portion 124. This means that the current I3 on ​​the connecting portion 130 is significantly larger than the current I1 on the first ring portion 122 and the current I2 on the second ring portion 124. In other words, I3 plays a major role, thereby improving the operating range of the near-field communication antenna. Furthermore, the gap between the first ring portion 122 and the connecting portion 130 achieves a weight reduction effect, making the electronic device 100 lighter and more portable.

[0060] The connecting part 130 can be any shape, such as a polygonal structure, a circular structure, an elliptical structure, or other structures with straight and curved edges joined together.

[0061] As shown in Figures 1 to 7, in one possible implementation, the circuit board assembly 140 includes: a ferrite layer 142; and a circuit board 144 disposed on the side of the ferrite layer 142 away from the main body 110, with the circuit board 144 covering a portion of the ferrite layer 142.

[0062] Specifically, the circuit board assembly 140 includes a ferrite layer 142 and a circuit board 144. The ferrite layer 142 is disposed on the main body 110, thereby shielding the radiation from the circuit board 144 into the main body 110 and shielding the radiation from the inside of the main body 110 into the circuit board 144, ensuring the normal operation of the electronic device 100 and ensuring the performance of near-field communication.

[0063] In this circuit board 144, only a portion of the ferrite layer 142 is covered, and the area of ​​the ferrite layer 142 is larger than the area of ​​the circuit board 144 to ensure the shielding effect of the ferrite layer 142. The circuit board 144 can be a flexible circuit board.

[0064] Among them, electronic devices 100 include mobile phones, tablets, wearable devices or laptops, etc.

[0065] As shown in Figures 1 and 2, taking the decorative ring 120 as an example with a four-sided ring structure, the circuit board assembly 140 is disposed on one side of one side of the decorative ring 120. The first ring body 122 is one side of the decorative ring 120, and the second ring body 124 is the other side of the decorative ring 120. A first power supply point 126 and a first grounding point 128 are respectively provided at both ends of the first ring body 122. The circuit board assembly 140 includes a circuit board 144 and a ferrite layer 142. The electronic device 100 has a motherboard, and the ferrite layer 142 is disposed between the motherboard and the circuit board 144.

[0066] The circuit board assembly 140 includes a second power supply point 146, and the circuit board assembly 140 is also connected to a first power supply point 126 on the decorative ring 120. When the circuit board assembly 140 is powered through the second power supply point 146, the circuit board assembly 140 powers the decorative ring 120, and the current on the decorative ring 120 is transmitted to the first ground point 128 through the first ring body portion 122 and the second ring body portion 124, respectively.

[0067] As shown in Figure 1, the first grounding point 128 and the second feed point 146 both point to the same side of the electronic device 100, thus bringing the first grounding point 128 and the second feed point 146 close together. When the decorative ring 120 and the circuit board assembly 140 operate as a near-field communication antenna, the current on the decorative ring 120 consists of two parts: current I1 transmitted by the first ring body 122 and current I2 transmitted by the second ring body 124. At this time, the main areas where the near-field communication antenna function is effective are the first ring body 122 and the circuit board assembly 140.

[0068] In this near-field communication antenna scheme with a large decorative ring 120, the current I2 on the second ring body 124 is far from the path current of the circuit board assembly 140. When the current I2 plays a major role, the magnetic field in the middle is weak, resulting in a large working dead zone. When the current I1 on the first ring body 122 plays a major role, the magnetic field in the middle target area is strong, and the performance of the near-field communication antenna composed of the decorative ring 120 and the circuit board assembly 140 is better.

[0069] As shown in Figure 2, to achieve better near-field communication performance, it is necessary to obtain a larger current I1 in the first ring body 122 and reduce the proportion of the current I2 in the second ring body 124. Therefore, the current I1 can be increased by reducing the impedance of the first ring body 122.

[0070] Specifically, with the same material, the larger the cross-sectional area of ​​the conductor, the smaller its impedance. This embodiment optimizes the impedance based on this principle. By appropriately increasing the material of the first ring body 122, i.e., increasing the width W of the first ring body 122, the impedance of the first ring body 122 is reduced. Therefore, the current I1 can be increased, and the current I1 can gain a greater weight than the current I2, thereby improving the performance of the near-field communication antenna.

[0071] As shown in Figures 3, 4, and 5, taking the decorative ring 120 as an example with a circular structure, the circuit board assembly 140 is disposed on one side of the decorative ring 120. The first ring body portion 122 is a partial fan-shaped arc edge of the decorative ring 120, and the second ring body portion 124 is the other fan-shaped arc edge of the decorative ring 120. A first power supply point 126 and a first grounding point 128 are respectively provided at both ends of the first ring body portion 122. The circuit board assembly 140 includes a circuit board 144 and a ferrite layer 142. The electronic device 100 has a motherboard, and the ferrite layer 142 is disposed between the motherboard and the circuit board 144.

[0072] The circuit board assembly 140 includes a second power supply point 146, and the circuit board assembly 140 is also connected to a first power supply point 126 on the decorative ring 120. When the circuit board assembly 140 is powered through the second power supply point 146, the circuit board assembly 140 powers the decorative ring 120, and the current on the decorative ring 120 is transmitted to the first ground point 128 through the first ring body portion 122 and the second ring body portion 124, respectively.

[0073] As shown in Figure 1, the first grounding point 128 and the second feed point 146 both point to the same side of the electronic device 100, thus making the first grounding point 128 and the second feed point 146 close together. When the decorative ring 120 and the circuit board assembly 140 operate as a near-field communication antenna, the current on the decorative ring 120 consists of two parts: current I1 transmitted by the first ring body 122 and current I2 transmitted by the second ring body 124. At this time, the first ring body 122 is close to the circuit board assembly 140. When the decorative ring 120 and the circuit board assembly 140 operate as a near-field communication antenna, the main area of ​​operation is the loop between the first ring body 122 and the circuit board assembly 140.

[0074] The current I2 on the second ring body 124 is far from the path current of the circuit board assembly 140. When the current I2 plays a major role, the magnetic field in the middle is weak, resulting in a large working blind zone. When the current I1 on the first ring body 122 plays a major role, the magnetic field in the middle target area is strong, and the performance of the near-field communication antenna composed of the decorative ring 120 and the circuit board assembly 140 is better.

[0075] As shown in Figure 5, to achieve better near-field communication performance, it is necessary to obtain a larger current I1 in the first ring body 122 and reduce the proportion of the current I2 in the second ring body 124. Therefore, the current I1 can be increased by reducing the impedance of the first ring body 122.

[0076] Specifically, as shown in Figures 3 and 4, with the same material, the larger the cross-sectional area of ​​the conductor, the smaller its impedance. This embodiment optimizes the impedance based on this principle. By appropriately increasing the material of the first ring body 122, that is, increasing the width W of the first ring body 122, which means filling part of the material inside the decorative ring 120, the first ring body 122 forms a semi-circular structure, reducing the impedance of the first ring body 122. Therefore, the current I1 can be increased, and the current I1 can obtain a greater weight than the current I2, thus improving the performance of the near-field communication antenna.

[0077] Furthermore, in the embodiment shown in FIG4, when the width of the first ring portion 122 is increased to reduce impedance, material can be filled into the first ground point 128 and the first feed point 126. This can construct the shortest current path between the first ground point 128 and the first feed point 126. While keeping the positions of the first ground point 128 and the first feed point 126 unchanged, the working path of I1 will be further away from the circuit board assembly 140, thereby increasing the effective working area of ​​the near-field communication antenna.

[0078] As shown in Figure 5, based on the shortest path construction between the first feed point 126 and the first ground point 128 on the decorative ring 120, a connecting part 130 can also be set on the decorative ring 120 to conduct the first feed point 126 and the first ground point 128 to obtain a certain width and achieve the effect of reducing impedance. This setting method, as shown in the electronic device 100 in Figure 5, can reduce the weight of the decorative ring 120 and has better near-field communication performance.

[0079] As shown in Figures 6 and 7, the decorative ring 120 and the circuit board assembly 140 are independently fed and grounded, thus forming a dual-ended feed. Since the currents at the first feed point 126 and the third feed point 148 are opposite when the dual-ended feed is used, the first feed point 126 and the third feed point 148 are set close to each other in the design, and the first ground point 128 and the second ground point 150 are set close to each other to form a current loop in the same direction, thereby enhancing the performance of the near-field communication antenna.

[0080] In the description of this specification, references to terms such as "an embodiment" or "specific embodiment" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0081] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: main body; A decorative ring is provided on the main body; A circuit board assembly is disposed on the main body and located around the decorative ring. The decorative ring and the circuit board assembly form a near-field communication antenna. The decorative ring includes a first feed point and a first ground point. The decorative ring is fed through the first feed point and grounded through the first ground point. A first ring body is formed on the portion of the decorative ring close to the circuit board assembly between the first feed point and the first ground point, and a second ring body is formed on the portion of the decorative ring away from the circuit board assembly between the first feed point and the first ground point. When the decorative ring is fed, the current on the second ring body is less than the current on the first ring body.

2. The electronic device according to claim 1, characterized in that, The first ring portion and the second ring portion are made of the same material, and the cross-sectional area of ​​the first ring portion perpendicular to the current flow direction is larger than the cross-sectional area of ​​the second ring portion perpendicular to the current flow direction.

3. The electronic device according to claim 2, characterized in that, The width of the first ring portion is greater than the width of the second ring portion.

4. The electronic device according to claim 1, characterized in that, The circuit board assembly is electrically connected to the first power supply point. The circuit board assembly includes a second power supply point, through which the circuit board assembly is powered. The decorative ring is powered through the circuit board assembly.

5. The electronic device according to claim 4, characterized in that, The distance between the second power supply point and the first grounding point is the first distance, and the distance between the second power supply point and the first power supply point is the second distance. The first distance is less than the second distance.

6. The electronic device according to claim 1, characterized in that, The circuit board assembly and the decorative ring are separate. The circuit board assembly includes a third power supply point and a second grounding point. The circuit board assembly is powered through the third power supply point and grounded through the second grounding point.

7. The electronic device according to claim 6, characterized in that, The distance between the first grounding point and the second grounding point is the third distance, the distance between the first grounding point and the third feed point is the fourth distance, and the third distance is less than the fourth distance; the distance between the first feed point and the third feed point is the fifth distance, the distance between the first feed point and the second grounding point is the sixth distance, and the fifth distance is less than the sixth distance.

8. The electronic device according to claim 1, characterized in that, The decorative ring also includes a connecting portion, one end of which is connected to the first power supply point and the other end of which is connected to the first grounding point. The connecting portion passes through the inner ring of the decorative ring, and the width of the connecting portion is greater than the width of the first ring body portion and the width of the connecting portion is greater than the width of the second ring body portion.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The circuit board assembly includes: a ferrite layer; and a circuit board disposed on the side of the ferrite layer opposite to the main body, the circuit board covering a portion of the ferrite layer.

Images