Single-component high-thermal-conductivity silicone gel, preparation method and application thereof

Abstract

The application belongs to the technical field of heat-conducting interface materials, and particularly relates to a novel single-component high-heat-conducting silicon gel, a preparation method and application thereof. The novel single-component high-heat-conducting silicon gel comprises the following components in parts by weight: 80-100 parts of vinyl silicone oil, 0.1-5 parts of hydrogen-containing silicone oil crosslinking agent, 300-2000 parts of heat-conducting filler, 50-200 parts of nanowire, 1-20 parts of treating agent, 1-4 parts of catalyst and 1-8 parts of pigment. The novel nanowire is introduced into the heat-conducting powder to form a phonon propagation channel with a faster heat transfer speed. Compared with the same type of gel currently used on the market, the novel single-component high-heat-conducting silicon gel has a higher heat conductivity and a lower density, and can ensure that the heat-conducting gel has a good dispensing efficiency.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of thermal interface materials, and particularly relates to a novel single-component high-thermal-conductivity silicon gel as well as a preparation method and application thereof. BACKGROUND

[0002] In the global industrial field, almost all electronic devices, from automotive electronics and consumer electronics to power transmission and aerospace applications, require effective thermal management to help electronic components transfer heat, reduce power consumption and ensure normal functions. Under the driving of the multi-functionalization and miniaturization requirements of electronic devices, whether it is a modern power semiconductor element or an electronic control unit, the development direction is to integrate more functions into smaller modules. This leads to the continuous rise of the working temperature of electronic devices. Therefore, the importance of thermal management is increasingly prominent, and the thermal interface material (TIM) plays an important role. The thermal interface material is a material commonly used in electronic packaging and electronic heat dissipation, which is mainly used to fill the micro-gaps and surface uneven holes generated when two materials are joined or contacted, reduce the thermal contact resistance of heat transfer, and improve the heat dissipation performance of the device. The thermal conductivity of air is 0.024 W / mK, which is a poor conductor of heat, seriously hindering heat conduction. High-thermal-conductivity interface materials are used to fill gaps, exclude air, establish an effective heat transfer channel, and significantly reduce thermal resistance to fully play the role of the heat sink. Therefore, the thermal interface material is essential in electronic packaging. The thermal interface material mainly includes thermal grease, thermal gel, thermal pad and phase change material. The thermal gel is widely used in thermal interface materials due to its high thermal conductivity, strong material cohesion, shape recovery, non-oil separation and long-term storage stability. At present, with the gradual replacement of fuel vehicles by new energy vehicles, the application of automotive electronics on new energy vehicles is increasing, but considering the endurance problem of new energy vehicles, the requirement for thermal materials is to realize lightweight under the premise of high thermal conductivity, and the lower the density of the product under the premise of meeting the performance, the better. However, the traditional thermal silicon gel has the defects of poor thermal conductivity, large density and poor dispensing performance, and therefore needs to be optimized. SUMMARY

[0003] The purpose of the present application is to overcome the defects of the existing thermal silicon gel, such as poor thermal conductivity, large density and poor dispensing performance, and to provide a novel single-component high-thermal-conductivity silicon gel with good thermal conductivity, small density and good dispensing performance.

[0004] Specifically, the application provides a new single-component high-thermal-conductivity silicone gel, which comprises the following components in parts by weight: 80-100 parts of vinyl silicone oil, 0.1-5 parts of hydrogen-containing silicone oil crosslinking agent, 300-2000 parts of thermal conductive filler, 50-200 parts of nanowire, 1-20 parts of treating agent, 1-4 parts of catalyst and 1-8 parts of pigment.

[0005] The application further provides a preparation method of the new single-component high-thermal-conductivity silicone gel, which comprises the following steps:

[0006] S1. uniformly mixing the vinyl silicone oil, hydrogen-containing silicone oil crosslinking agent, thermal conductive filler, nanowire, treating agent and pigment to obtain a premix;

[0007] S2. uniformly mixing the premix with the catalyst, heating to 100-200 DEG C, stirring and reacting under vacuum for 1-10 h, and then cooling to room temperature to obtain the new single-component high-thermal-conductivity silicone gel.

[0008] The application further provides application of the new single-component high-thermal-conductivity silicone gel as a thermal conductive interface material.

[0009] The traditional thermal conductive gel improves the thermal conductivity coefficient basically by increasing the filling proportion of the thermal conductive powder, but this increases the density of the thermal conductive gel, and the application introduces the new nanowire into the thermal conductive powder to form a phonon propagation channel with faster heat transfer speed, which can effectively improve the thermal conductive efficiency of the gel without increasing the powder filling amount and density. In summary, the new single-component high-thermal-conductivity silicone gel provided by the application not only has higher thermal conductivity coefficient and lower density, but also can ensure that the thermal conductive gel has good dispensing efficiency compared with the same type of gel commonly used on the market. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 A transmission electron microscope image of the nanowire used in Example 1;

[0011] Figure 2 An atomic force microscope image of the nanowire used in Example 1. DETAILED DESCRIPTION

[0012] The novel single-component high-thermal-conductivity silicone gel comprises vinyl silicone oil, hydrogen-containing silicone oil crosslinking agent, thermal conductive filler, nanowire, treating agent, catalyst and pigment. The content of the vinyl silicone oil is 80-100 parts by weight, such as 80, 82, 85, 88, 90, 92, 95, 98, 100 parts by weight, etc.; the content of the hydrogen-containing silicone oil crosslinking agent is 0.1-5 parts by weight, such as 0.1, 0.2, 0.5, 0.8, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5.0 parts by weight, etc.; the content of the thermal conductive filler is 300-2000 parts by weight, such as 300, 400, 500, 800, 1000, 1200, 1500, 1800, 2000 parts by weight, etc.; the content of the nanowire is 50-200 parts by weight, such as 50, 80, 100, 120, 150, 180, 200 parts by weight, etc.; the content of the treating agent is 1-20 parts by weight, such as 1, 2, 5, 8, 10, 12, 15, 18, 20 parts by weight, etc.; the content of the catalyst is 1-4 parts by weight, such as 1, 2, 3, 4 parts by weight, etc.; and the content of the pigment is 1-8 parts by weight, such as 1, 2, 3, 4, 5, 6, 7, 8 parts by weight, etc.

[0013] In a preferred embodiment, the vinyl silicone oil is selected from at least one of vinyl-terminated polydimethylsiloxane, vinyl-terminated polymethylphenylsiloxane and methyl-terminated and vinyl-containing side chain polysiloxane.

[0014] In a preferred embodiment, the vinyl content of the vinyl silicone oil is 0.1-0.5 mmoles / g, such as 0.1 mmoles / g, 0.2 mmoles / g, 0.3 mmoles / g, 0.4 mmoles / g, 0.5 mmoles / g or any value therebetween.

[0015] In a preferred embodiment, the viscosity of the vinyl silicone oil at 25℃ is 50-300 cSt, such as 50 cSt, 80 cSt, 100 cSt, 120 cSt, 150 cSt, 180 cSt, 200 cSt, 220 cSt, 250 cSt, 280 cSt, 300 cSt or any value therebetween.

[0016] In a preferred embodiment, the hydrogen-containing silicone oil crosslinking agent is end hydrogen-containing silicone oil crosslinking agent and / or side hydrogen-containing silicone oil crosslinking agent.

[0017] In a preferred embodiment, the content of Si-H in the end-hydrogen-containing silicone oil crosslinking agent is 1.0-1.5 mmoles / g, such as 1.0 mmoles / g, 1.1 mmoles / g, 1.2 mmoles / g, 1.3 mmoles / g, 1.4 mmoles / g, 1.5 mmoles / g, or any value between them.

[0018] In a preferred embodiment, the content of Si-H in the side-hydrogen-containing silicone oil crosslinking agent is 1.8-2.5 mmoles / g, such as 1.8 mmoles / g, 1.9 mmoles / g, 2.0 mmoles / g, 2.1 mmoles / g, 2.2 mmoles / g, 2.3 mmoles / g, 2.4 mmoles / g, 2.5 mmoles / g, or any value between them.

[0019] In a preferred embodiment, the viscosity of the hydrogen-containing silicone oil crosslinking agent at 25°C is 30-100 cSt, such as 30 cSt, 40 cSt, 50 cSt, 60 cSt, 70 cSt, 80 cSt, 90 cSt, 100 cSt, or any value between them.

[0020] In a preferred embodiment, the thermally conductive filler is selected from at least one of metal fillers, carbon materials, and inorganic thermally conductive particles, and specific examples include, but are not limited to, at least one of aluminum powder, diamond, aluminum oxide, aluminum nitride, zinc oxide, aluminum hydroxide, and silicon powder.

[0021] In a preferred embodiment, the thermally conductive filler is spherical or spherical-like thermally conductive particles with a particle size of 0.3-150 μm, more preferably spherical or spherical-like thermally conductive particles with a particle size of 0.1-40 μm, and most preferably spherical or spherical-like thermally conductive particles with a particle size of 0.1-3 μm account for 1-40% of the total amount, spherical or spherical-like thermally conductive particles with a particle size of 5-15 μm account for 10-40% of the total amount, and spherical or spherical-like thermally conductive particles with a particle size of 20-40 μm account for 20-70% of the total amount. The thermally conductive filler is compounded in this way, which can reduce the voids between the fillers, achieve the closest packing, and be conducive to the construction of heat transfer channels, accelerating the heat transfer in the system, so that the gel has a higher thermal conductivity and good thermal conductivity.

[0022] The term "nanowire" refers to a one-dimensional structural material with a lateral size limited to below 100 nm and no limitation in the longitudinal direction. The aspect ratio of a typical nanowire is above 1000.

[0023] In a preferred embodiment, the nanowires are selected from at least one of silk fibroin nanowires, silicon nanowires, diamond nanowires, aluminum oxide nanowires and zinc oxide nanowires. The nanowires are used to build the phonon channels that are interconnected for heat transfer, thus improving the heat conduction efficiency of the gel, by virtue of their high aspect ratio and good thermal conductivity.

[0024] In a preferred embodiment, the nanowires have a diameter of 1-10 nm, such as 1 nm, 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, 8 nm, 9 nm, 10 nm or any value therebetween; the nanowires have a length of 1-20 μm, such as 1 nm, 2 nm, 5 nm, 8 nm, 10 nm, 12 nm, 15 nm, 18 nm, 20 nm or any value therebetween; and the nanowires have an aspect ratio of (1000-20000):1, such as 1000:1, 2000:1, 5000:1, 8000:1, 10000:1, 12000:1, 15000:1, 18000:1, 20000:1 or any value therebetween.

[0025] In a preferred embodiment, the treating agent is selected from at least one of long-chain alkane trimethoxysiloxane, long-chain alkane triethoxysiloxane, vinyl trimethoxysiloxane, titanate and stearic acid. The treating agent is used to modify the thermal conductive filler, making it easier to disperse and fill.

[0026] In the present application, the catalyst is not particularly limited in type and can be selected from at least one of platinum-vinylsiloxane, platinum-alkyne-based chelate and chloroplatinic acid.

[0027] In the present application, the pigment can be reasonably selected according to actual needs, and specific examples include, but are not limited to, at least one of cobalt blue, iron red, carbon black and cadmium yellow.

[0028] The present application also provides a preparation method of the novel one-component high-thermal-conductivity silicone gel, which comprises the following steps: S1. uniformly mixing the vinyl silicone oil, hydrogen-containing silicone oil crosslinking agent, thermal conductive filler, nanowires, treating agent and pigment to obtain a premix; and S2. uniformly mixing the premix with a catalyst, heating to 100-200°C, mixing and stirring under vacuum for 1-10 h, and then cooling to room temperature to obtain the novel one-component high-thermal-conductivity silicone gel. The mixing in the above two steps can be carried out in various existing mixing equipment, for example, in a planetary mixer. In a specific embodiment, the vacuum condition in step S2 refers to vacuum extraction under a pressure of -0.1 MPa.

[0029] The present application will be described in detail below through specific examples.

[0030] In the following examples and comparative examples, the parts of the raw materials refer to parts by weight.

[0031] Example 1:

[0032] (1) Raw materials: the components of the novel single-component high-thermal-conductivity silicone gel include 80 parts of vinyl silicone oil, 2 parts of hydrogen-containing silicone oil crosslinking agent, 1900 parts of thermal conductive filler, 150 parts of nanowire, 12 parts of treating agent, 4 parts of catalyst, and 4 parts of pigment.

[0033] The vinyl silicone oil is vinyl-terminated polydimethylsiloxane, with a vinyl content of 0.22 mmoles / g and a viscosity of 250 cSt.

[0034] The hydrogen-containing silicone oil crosslinking agent includes 1 part of end-hydrogen-containing polydimethylsiloxane and 1 part of side-hydrogen-containing polydimethylsiloxane. The end-hydrogen-containing polydimethylsiloxane has a Si-H content of 1.17 mmoles / g and a viscosity of 130 cSt. The side-hydrogen-containing polydimethylsiloxane has a Si-H content of 2 mmoles / g and a viscosity of 70 cSt.

[0035] The thermal conductive filler includes 1500 parts of aluminum oxide and 400 parts of zinc oxide, which are spherical and / or spheroidal thermal conductive particles with a particle size of 0.5-40 μm. Based on the total mass of the thermal conductive filler, the proportion of spherical or spheroidal thermal conductive particles with a particle size of 0.5-2 μm is 20%, the proportion of spherical or spheroidal thermal conductive particles with a particle size of 5-15 μm is 30%, and the proportion of spherical or spheroidal thermal conductive particles with a particle size of 20-40 μm is 50%.

[0036] The nanowire is an aluminum oxide nanowire, the transmission electron microscopy image and the atomic force microscopy image of which are shown in Figure 1 and Figure 2 It can be seen from Figure 1 and Figure 2 that the diameter of the aluminum oxide nanowire is about 4 nm, the length is about 5 μm, and the aspect ratio is about 1250:1.

[0037] The treating agent is phthalate.

[0038] The catalyst is platinum-vinylsiloxane.

[0039] The pigment is iron red.

[0040] (2) Preparation process: S1. The vinyl silicone oil, hydrogen-containing silicone oil crosslinking agent, thermal conductive filler, nanowire, treating agent and pigment were weighed according to the proportion of the weight fraction, added into a planetary mixer, and mixed and stirred at room temperature for 1 h; S2. The corresponding mass of catalyst was weighed and added into the above planetary mixer, heated to 150°C, vacuumized at a pressure of -0.1 MPa, and then continuously stirred for 2 h, and then cooled to room temperature. The mixed single-component gel was loaded into a 30 CC single-component tube to obtain a single-component high thermal conductive silicone gel.

[0041] Example 2:

[0042] (1) Raw materials: The components of the novel single-component high thermal conductive silicone gel contain 100 parts of vinyl silicone oil, 0.2 parts of hydrogen-containing silicone oil crosslinking agent, 1000 parts of thermal conductive filler, 200 parts of nanowire, 20 parts of treating agent, 2 parts of catalyst and 1 part of pigment.

[0043] The vinyl silicone oil is a vinyl-terminated polydimethylsiloxane, the vinyl content is 0.22 mmoles / g, and the viscosity is 250 cSt.

[0044] The hydrogen-containing silicone oil crosslinking agent includes 0.1 part of end-hydrogen-containing polydimethylsiloxane and 0.1 part of side-hydrogen-containing polydimethylsiloxane. The Si-H content of the end-hydrogen-containing polydimethylsiloxane is 1.17 mmoles / g, and the viscosity is 130 cSt. The Si-H content of the side-hydrogen-containing polydimethylsiloxane is 2 mmoles / g, and the viscosity is 70 cSt.

[0045] The thermal conductive filler includes 500 parts of aluminum oxide and 500 parts of zinc oxide, which are spherical and / or spherical-like thermal conductive particles with a particle size of 0.5-40 μm. Based on the total mass of the thermal conductive filler, the proportion of spherical or spherical-like thermal conductive particles with a particle size of 0.5-2 μm is 20%, the proportion of spherical or spherical-like thermal conductive particles with a particle size of 5-15 μm is 30%, and the proportion of spherical or spherical-like thermal conductive particles with a particle size of 20-40 μm is 50%.

[0046] The nanowire is an aluminum oxide nanowire with a diameter of about 8 nm, a length of about 20 μm, and an aspect ratio of about 2500:1.

[0047] The treating agent is phthalate.

[0048] The catalyst is platinum-vinylsiloxane.

[0049] The pigment is cobalt blue.

[0050] (2) Preparation process: S1. The vinyl silicone oil, hydrogen-containing silicone oil crosslinking agent, thermal conductive filler, nanowire, treating agent and pigment were weighed according to the proportion of the weight fraction, added into a planetary mixer, and mixed and stirred at room temperature for 1 h; S2. The corresponding mass of catalyst was weighed and added into the above planetary mixer, heated to 150°C, vacuumized at a pressure of -0.1 MPa, and then continuously stirred for 2 h, and then cooled to room temperature. The mixed single-component gel was loaded into a 30 CC single-component tube to obtain a single-component high thermal conductive silicone gel.

[0051] Example 3:

[0052] (1) Raw materials: The components of the novel single-component high thermal conductive silicone gel contain 90 parts of vinyl silicone oil, 5 parts of hydrogen-containing silicone oil crosslinking agent, 500 parts of thermal conductive filler, 50 parts of nanowire, 1 part of treating agent, 1 part of catalyst and 8 parts of pigment.

[0053] The vinyl silicone oil is a vinyl-terminated polydimethylsiloxane, the vinyl content is 0.22 mmoles / g, and the viscosity is 250 cSt.

[0054] The hydrogen-containing silicone oil crosslinking agent includes 2.5 parts of end-hydrogen-containing polydimethylsiloxane and 2.5 parts of side-hydrogen-containing polydimethylsiloxane. The Si-H content of the end-hydrogen-containing polydimethylsiloxane is 1.17 mmoles / g, and the viscosity is 130 cSt. The Si-H content of the side-hydrogen-containing polydimethylsiloxane is 2 mmoles / g, and the viscosity is 70 cSt.

[0055] The thermal conductive filler includes 200 parts of aluminum oxide and 300 parts of zinc oxide, which are spherical and / or spherical-like thermal conductive particles with a particle size of 0.5-40 μm. Based on the total mass of the thermal conductive filler, the proportion of spherical or spherical-like thermal conductive particles with a particle size of 0.5-2 μm is 20%, the proportion of spherical or spherical-like thermal conductive particles with a particle size of 5-15 μm is 30%, and the proportion of spherical or spherical-like thermal conductive particles with a particle size of 20-40 μm is 50%.

[0056] The nanowire is an aluminum oxide nanowire with a diameter of about 1 nm and a length of about 10 μm, and the aspect ratio is about 10000:1.

[0057] The treating agent is phthalate.

[0058] The catalyst is platinum-vinylsiloxane.

[0059] The pigment is carbon black.

[0060] (2) Preparation process: S1. The vinyl silicone oil, hydrogen-containing silicone oil crosslinking agent, thermal conductive filler, nanowire, processing agent and pigment were weighed according to the proportion of weight fraction, added into a planetary mixer, and mixed and stirred at room temperature for 1 h; S2. The corresponding mass of catalyst was weighed and added into the above planetary mixer, heated to 150°C, vacuumized at a pressure of -0.1 MPa, and then continuously stirred for 2 h, and then cooled to room temperature. The mixed single-component gel was filled into a 30 CC single-component tube to obtain a single-component high thermal conductive silicone gel.

[0061] Example 4:

[0062] A new type of single-component high thermal conductive silicone gel was prepared according to the method of Example 1, except that the same weight fraction of silicon nanowires (diameter about 2 nm, length about 15 μm, aspect ratio about 7500:1) was used to replace the alumina nanowires, and the other conditions were the same as those of Example 1, to obtain a new type of single-component high thermal conductive silicone gel.

[0063] Example 5:

[0064] A new type of single-component high thermal conductive silicone gel was prepared according to the method of Example 1, except that the same weight fraction of zinc oxide nanowires (diameter about 8 nm, length about 12 μm, aspect ratio about 1500:1) was used to replace the alumina nanowires, and the other conditions were the same as those of Example 1, to obtain a new type of single-component high thermal conductive silicone gel.

[0065] Comparative Example 1:

[0066] A single-component silicone gel was prepared according to the method of Example 1, except that the same weight fraction of spherical alumina particles (particle size 20-40 μm) was used to replace the alumina nanowires, and the other conditions were the same as those of Example 1, to obtain a reference single-component silicone gel.

[0067] Comparative Example 2:

[0068] A single-component silicone gel was prepared according to the method of Example 5, except that the same weight fraction of spherical zinc oxide particles (particle size 5-15 μm) was used to replace the alumina nanowires, and the other conditions were the same as those of Example 5, to obtain a reference single-component silicone gel.

[0069] Comparative Example 3:

[0070] A single-component silicone gel was prepared according to the method of Example 4, except that the same weight fraction of spherical silicon oxide particles (particle size 3-10 μm) was used to replace the alumina nanowires, and the other conditions were the same as those of Example 4, to obtain a reference single-component silicone gel.

[0071] Comparative Example 4:

[0072] A commercially available thermal conductive silicone gel product 1 was purchased from Parker Chomerics Company, and the trade name was GEL25.

[0073] Comparative Example 5:

[0074] Market existing thermal conductive silicone gel product 2, available from Parker Hannifin Corporation, trade name GEL45.

[0075] Test Example

[0076] (1) Thermal conductivity: the thermal conductivity of the thermal conductive silicone gel obtained in each example and comparative example was tested according to the method of ASTM-D547, and the results are shown in Table 1.

[0077] (2) Density: the density of the thermal conductive gel obtained in each example and comparative example was tested according to the test method of ASTM-D792, and the results are shown in Table 1.

[0078] (3) Extrusion rate: the weight (g) of the rubber tube with a rubber nozzle size of 1 inch extruded in 1 min under a gas pressure of 90 psi, and the results are shown in Table 1. The higher the extrusion rate, the better the dispensing performance, and the more conducive to improving the dispensing efficiency.

[0079] Table 1

[0080]

[0081] From the above table, it can be seen that compared with the market existing similar products, the product provided by the present application has higher thermal conductivity, lower density and better dispensing performance. In other words, under the condition of the same density, the thermal conductivity of the present application is higher, the extrusion rate is higher, and the dispensing performance is better; under the condition of the same thermal conductivity, the density of the present application is lower, the extrusion rate is higher, and the dispensing performance is better.

[0082] Although the embodiments of the present application have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above-mentioned embodiments without departing from the principles and purposes of the present application within the scope of the present application.

Claims

1. A single-component high thermal conductivity silicone gel, characterized in that, The single-component high thermal conductivity silicone gel is composed of the following components in parts by weight: 80-100 parts vinyl silicone oil, 0.1-5 parts hydrogen-containing silicone oil crosslinking agent, 500-2000 parts thermally conductive filler, 50-200 parts nanowires, 1-20 parts treatment agent, 1-4 parts catalyst, and 1-8 parts pigment; the thermally conductive filler consists of spherical or near-spherical thermally conductive particles with a particle size of 0.3-150 μm; the nanowires have a diameter of 1-10 nm, a length of 1-20 μm, and an aspect ratio of (1000-20000):1; spherical or near-spherical thermally conductive particles with a particle size of 0.3-5 μm account for 1-40% of the total, spherical or near-spherical thermally conductive particles with a particle size of 10-30 μm account for 10-40% of the total, and particles with a particle size of 70-150 μm account for the remainder. The total number of spherical or near-spherical thermally conductive particles with a diameter of μm is 20-70%; the nanowires are alumina nanowires.

2. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The vinyl silicone oil is selected from at least one of vinyl-terminated polydimethylsiloxane, vinyl-terminated polymethylphenylsiloxane, and methyl-terminated polysiloxane with vinyl side chains.

3. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The vinyl content in the vinyl silicone oil is 0.1~0.5 mmoles / g.

4. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The viscosity of the vinyl silicone oil at 25°C is 50~300 cSt.

5. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The hydrogen-containing silicone oil crosslinking agent is an end-containing hydrogen-containing silicone oil crosslinking agent and / or a side-containing hydrogen-containing silicone oil crosslinking agent.

6. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The Si-H content in the hydrogen-terminated silicone oil crosslinking agent is 1.0~1.5 mmoles / g.

7. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The Si-H content in the hydrogen-containing silicone oil crosslinking agent is 1.8~2.5 mmoles / g.

8. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The viscosity of the hydrogen-containing silicone oil crosslinking agent at 25°C is 30~100 cSt.

9. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The thermally conductive filler is selected from at least one of metal fillers, carbon materials, and inorganic thermally conductive particles.

10. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The treatment agent is selected from at least one of long-chain alkane trimethoxysilane, long-chain alkane triethoxysilane, vinyltrimethoxysilane, titanate, and stearic acid.

11. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The catalyst is selected from at least one of platinum-vinylsiloxane, platinum-alkynyl chelate and chloroplatinic acid.

12. The single-component high thermal conductivity silicone gel according to claim 1, characterized in that, The pigment is selected from at least one of cobalt blue, iron oxide red, carbon black, and cadmium yellow.

13. The method for preparing the single-component high thermal conductivity silica gel according to any one of claims 1 to 12, characterized in that, The method includes: S1. Mix the vinyl silicone oil, hydrogen-containing silicone oil crosslinking agent, thermally conductive filler, nanowires, treatment agent and pigment evenly to obtain a premix; S2. After the premix and catalyst are mixed evenly, the temperature is raised to 100~200 ℃, and the mixture is stirred under vacuum for 1~10 h. Then it is cooled to room temperature to obtain a single-component high thermal conductivity silica gel.

14. The application of the single-component high thermal conductivity silicone gel according to any one of claims 1 to 12 as a thermally conductive interface material.

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