Semiconductor packaging equipment

Abstract

The present invention discloses a semiconductor packaging device, comprising a hot press and a loading system and a unloading system located on both sides of the hot press in the X direction. The loading system comprises a first frame, on which an epoxy resin loading module, a tablet loading module and a first conveying module are provided. The epoxy resin loading module is used for loading epoxy resin, arranging a plurality of epoxy resins into a group, and then moving a group of epoxy resins into the working range of the conveying module. The tablet loading module is used for loading tablets one by one, arranging a plurality of tablets into a group, and then moving a group of tablets into the working range of the conveying module. The first conveying module is used to clamp a group of epoxy tablets and multiple groups of epoxy resins, and convey both to the hot press. The unloading system comprises a second frame, on which a second conveying module and a punching module are provided. The second conveying module is used to convey the tablets after hot pressing in the hot press to the punching module, and the punching module is used to punch the tablets.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor element packaging equipment, and in particular to a semiconductor packaging equipment. Background Art

[0002] Packaging is an important step in the manufacturing process of semiconductor components. The so-called packaging refers to arranging the semiconductor components on a wafer and using epoxy resin as the packaging material. Epoxy resin is a black solid and slightly flexible under normal conditions. The epoxy resin is heated to the potting temperature and becomes liquid for potting the wafer. It solidifies after natural cooling, completing the packaging of the semiconductor components.

[0003] During the packaging process, a loading system is usually required to load the sheet and epoxy resin. The corresponding sheet and epoxy resin are then moved synchronously to a hot press for hot pressing and packaging. The packaged sheet is then unloaded through a unloading system. During the unloading process, the sheet is punched in a punching mechanism. The punched sheet is the finished product and can be collected. However, existing semiconductor packaging equipment is often arranged in a single direction, occupying a large area and failing to fully utilize the space. At the same time, the overall strength is poor, especially during punching, and it is prone to shaking and deformation, which affects the packaging effect. Summary of the Invention

[0004] In order to overcome the above shortcomings, the purpose of the present invention is to provide a semiconductor packaging device that realizes automatic semiconductor packaging while making full use of space, greatly reducing the overall size and making the structure more stable.

[0005] In order to achieve the above objectives, the technical solution adopted by the present invention is: a semiconductor packaging device, including a hot press and a loading system and an unloading system located on both sides of the hot press in the X direction.

[0006] The feeding system includes a first frame on which are mounted an epoxy resin feeding module, a blank feeding module, and a first conveying module. The epoxy resin feeding module includes a discharge mechanism and a feed mechanism sequentially arranged along the X-axis. The discharge mechanism is used to arrange multiple epoxy resins into a group and push them to the feed mechanism. The feed mechanism is used to store a group of epoxy resins and move them into the working range of the first conveying module.

[0007] The sheet loading module includes a loading mechanism and a heating plate. The loading mechanism is located below the feeding mechanism and on one side of the unloading mechanism along the Y direction. The loading mechanism can place the sheets one by one on the heating plate. The heating plate can move back and forth in a straight line along the Y direction to move multiple sheets synchronously to directly below the feeding mechanism.

[0008] The first conveying module includes a first clamping device capable of linear reciprocating movement along the X-direction, wherein the first clamping device can simultaneously clamp the sheet material and the epoxy resin and move between the feeding mechanism and the hot press;

[0009] The blanking system includes a second frame, on which a second conveying module and a punching module are provided. The second conveying module includes a second clamping device that can move back and forth in a straight line along the X direction. The second clamping device can clamp the sheet and move back and forth between the hot press and the blanking station in the second frame.

[0010] The punching module includes an upper mold assembly and a lower mold assembly. The upper mold assembly is located on one side of the blanking station in the Y direction. The lower mold assembly can move back and forth in a straight line in the Y direction to switch between the blanking station and the upper mold assembly. When the upper mold assembly moves downward and the lower mold assembly is closed, the punching of the sheet is completed.

[0011] The beneficial effects of the present invention are:

[0012] 1. The loading system and unloading system are fixed by the first frame and the second frame respectively. The frame structure can effectively disperse the impact force, improve the overall stability, and save the connection and support parts required for each module, thereby reducing production costs;

[0013] 2. The layout of each module in the loading and unloading system makes full use of space and achieves staggering, which makes the entire equipment more compact and saves floor space while meeting the functions.

[0014] Furthermore, the feeding mechanism includes a feeding assembly capable of linear reciprocating movement along the X direction, and the feeding assembly includes a first moving frame and a barrel;

[0015] The barrel can store multiple epoxy resins, and the discharge mechanism is used to arrange the multiple epoxy resins into a group and push them into the barrel. The first movable frame can move linearly in the X direction. The barrel can move synchronously with the first movable frame and can also move linearly in the Y and Z directions along the first movable frame. The barrel can also rotate about the X axis to adjust the direction of the epoxy resin.

[0016] The barrel is adjustable in three directions: X, Y, and Z. It can be moved to the desired position to connect with the second pusher assembly and the clamping device. The barrel can be flipped in both horizontal and vertical directions to facilitate the loading and unloading of epoxy resin.

[0017] Furthermore, the discharge mechanism includes a weighing device and a loading device, wherein the weighing device is used to weigh each epoxy resin and sequentially convey the epoxy resins that have passed the weighing to the loading device, thereby ensuring that all epoxy resins subjected to hot pressing are qualified products, thereby improving the yield rate of the final packaged product.

[0018] The loading device includes a pre-loading frame, a first pushing assembly and a second pushing assembly. The pre-loading frame performs reciprocating linear motion between the first pushing assembly and the second pushing assembly along the X direction. The pre-loading frame is penetrated by a plurality of loading holes. One loading hole can only accommodate one epoxy resin. The first pushing assembly is used to push the epoxy resin delivered by the weighing device into different loading holes one by one, and the second pushing assembly is used to synchronously push the epoxy resin in all loading holes into the barrel.

[0019] While the preloading rack is inserting epoxy resin, the barrel can simultaneously deliver a batch of epoxy resin to the clamping device. When the preloading rack moves to the position of the second pusher assembly, the barrel simultaneously arrives there, and the second pusher assembly simultaneously pushes a batch of epoxy resin into the barrel. By preloading on a preloading rack, the efficiency of epoxy resin loading in this application is effectively improved.

[0020] Furthermore, the barrel includes a barrel body, on which a accommodating space is formed. Each of the accommodating spaces is arranged through the barrel body, and a baffle corresponding to the accommodating space is slidably installed at one end of the barrel body. The baffle rod can be moved to cover at least a partial area of ​​the opening of the corresponding accommodating space.

[0021] The blocking rod can block the opening of the accommodating space and release the blocking of the opening of the accommodating space, so that the epoxy resin will not fall off when the barrel is turned over, and after being turned into place, the epoxy resin can fall under the action of gravity.

[0022] Furthermore, a plurality of placement plates are distributed in an array on the hot pressing plate, each of the placement plates is detachably connected to the heating plate and its position on the heating plate is adjustable, the placement plate can only place one sheet, and the heating plate can heat the sheet.

[0023] The loading mechanism includes a clamping claw unit that can move in the X direction, the Y direction and the Z direction. The clamping claw unit can grab the sheets one by one and place them on a placement plate.

[0024] Furthermore, a lower module and an upper module corresponding to the lower module are fixed on the hot press, and the lower module can move up and down under the drive of the hot press.

[0025] Two guide rails spaced apart along the Y direction are fixed on the upper module. The guide rails extend along the X direction and have both ends fixedly connected to the first frame and the second frame respectively. The first clamping device and the second clamping device both slide along the two guide rails.

[0026] Since the upper mold is fixed in position and its lower end surface is flat, securing the guide rail to the lower end surface of the upper mold facilitates its securement, improving its positioning accuracy and, in turn, the movement accuracy of the first and second clamping devices. Furthermore, securing the guide rail to the lower end surface of the upper mold rationally utilizes the space between the upper and lower molds, making the overall structure more compact.

[0027] Furthermore, the first conveying module and the second conveying module respectively include a first moving drive device and a second moving drive device, and the first moving drive device and the second moving drive device are respectively arranged corresponding to the two guide rails to avoid interference between the two moving drives.

[0028] The first mobile drive device and the second mobile drive device both include a rack, a gear and a mobile drive member. The mobile drive member is fixed to the first frame or the second frame and drives the gear to rotate. The rack is fixed to the first clamping device or the second clamping device and meshes with the gear.

[0029] The positions of the moving drive member and the gear are fixed, while the rack is set to be movable. Within the same moving range, the length of the rack is reduced, making the structure more compact.

[0030] Specifically, the epoxy resin loading module includes a first fixed plate, on which the discharge mechanism and feed mechanism are mounted. The tablet loading module includes a second fixed plate, the first and second fixed plates being parallel and spaced apart, the loading mechanism being mounted on the second fixed plate, and the heating plate being movable along the second fixed plate. Both the first and second fixed plates are fixed to a first frame.

[0031] Furthermore, the punching module includes a third fixed plate and a fourth fixed plate that are parallel and spaced apart from each other. The upper mold assembly can move up and down between the third fixed plate and the fourth fixed plate. A lifting drive component that drives the upper mold assembly to rise and fall is fixed on the third fixed plate. The lower mold assembly can slide along the fourth fixed plate. The third fixed plate and the fourth fixed plate are both fixed to the second frame.

[0032] The third and fourth fixed plates, which bear most of the impact force during the punching process, are directly fixed on the second frame. The impact force during the punching process is dispersed through the second frame. On the one hand, the frame structure itself is utilized to save space and cost. On the other hand, the frame has high support strength and can disperse the pressure generated by the upper and lower mold assemblies when the mold is closed, thereby avoiding deformation caused by impact.

[0033] Furthermore, the blanking station is provided with a material receiving box located below the fourth fixed plate, and the fourth fixed plate has a blanking opening corresponding to the material receiving box. When the lower die assembly moves to the blanking station, the second clamping device can move to directly above the lower die assembly and place the hot-pressed blank onto the lower die block, or remove the punched blank from the lower die assembly. When the second clamping device leaves the blanking station, the blank is placed into the blanking box, completing the blanking. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram of the result after removing the frame in an embodiment of the present invention;

[0036] Figure 3 This is a schematic structural diagram of a feeding system in an embodiment of the present invention;

[0037] Figure 4 This is a structural diagram of a blanking system in an embodiment of the present invention;

[0038] Figure 5 for Figure 2 Enlarged view of point A in the middle;

[0039] Figure 6 This is a schematic structural diagram of an epoxy resin feeding module according to an embodiment of the present invention;

[0040] Figure 7 This is a schematic structural diagram of the epoxy resin feeding module from another angle in an embodiment of the present invention;

[0041] Figure 8 for Figure 7 Enlarged view of point B in the middle;

[0042] Figure 9 for Figure 7 Enlarged view of point C in the middle;

[0043] Figure 10 This is a schematic structural diagram of a sheet loading module in an embodiment of the present invention;

[0044] Figure 11 Schematic diagram of the structure of a hot press in an embodiment of the present invention;

[0045] Figure 12 This is a structural diagram of the blanking system after removing the second frame in an embodiment of the present invention;

[0046] Figure 13 Schematic diagram of the structure of the lower mold assembly in an embodiment of the present invention;

[0047] Figure 14 This is a schematic structural diagram of a first clamping device in an embodiment of the present invention;

[0048] Figure 15 Schematic diagram of the structure of the second clamping device in an embodiment of the present invention.

[0049] In the picture:

[0050] 100, loading system; 200, unloading system; 300, hot press;

[0051] 11. First frame; 111. First fixing plate; 112. Second fixing plate; 12. Second frame; 121. Third fixing plate; 122. Fourth fixing plate;

[0052] 2. Discharging mechanism; 21. Pre-loading rack; 211. Loading hole; 212. First linear motion module; 22. First pusher assembly; 221. First pusher cylinder; 23. Second pusher assembly; 231. Second pusher rod; 232. Second pusher cylinder; 24. Conveyor line; 25. Weighing platform; 26. Clamping assembly; 27. Slide plate; 28. Waste assembly;

[0053] 3. Feeding mechanism; 311. First moving frame; 312. Second linear motion module; 32. Cylinder; 321. Cylinder body; 321a. Accommodating space; 322. Stop rod;

[0054] 4. Loading mechanism; 41. Gripping unit;

[0055] 5. Heating plate; 51. Placement plate; 52. Third linear motion module;

[0056] 6. First clamping device; 61. First connecting frame; 62. First transplanting plate; 63. First clamping jaw assembly; 631. First clamping drive member; 64. Placement cylinder;

[0057] 7. Second clamping device; 71. Cleaning assembly;

[0058] 81. First mobile drive device; 811. Rack; 812. Gear; 813. Mobile drive member; 82. Second mobile drive device; 83. Guide rail;

[0059] 91. Upper die assembly; 92. Lower die assembly; 93. Fourth linear motion module;

[0060] 10. Blanking box;

[0061] 1a, upper mold; 1b, lower mold. DETAILED DESCRIPTION

[0062] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0063] It should be noted that, in the description of the present invention, terms such as "upper," "lower," "left," "right," "front," and "rear" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. These are merely for ease of description and are not intended to indicate or imply that the device or component described must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0064] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "connected," and "connected" should be understood in a broad sense, and may refer to, for example, a fixed connection, a detachable connection, or an integral connection. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0065] See attached Figure 1 As shown, a semiconductor packaging device of the present invention includes a hot press 300 and a loading system 100 and a unloading system 200 located on both sides of the hot press 300. The loading system 100 and the unloading system 200 are respectively located on both sides of the hot press 300 in the X direction.

[0066] See attached Figure 2 and attached Figure 3 As shown, the feeding system 100 includes a first frame 11, on which are provided an epoxy resin feeding module, a tablet feeding module and a first conveying module. The epoxy resin feeding module is used for feeding epoxy resin, arranging a plurality of epoxy resins into a group, and then moving a group of epoxy resins into the working range of the conveying module. The tablet feeding module is used for feeding tablets one by one, arranging a plurality of tablets into a group, and then moving a group of tablets into the working range of the conveying module. The first conveying module is used to clamp a group of epoxy tablets and multiple groups of epoxy resins, and convey both to the hot press 300.

[0067] See attached Figure 2 and attached Figure 4As shown, the blanking system 200 includes a second frame 12, on which a second conveying module and a punching module are provided. The second conveying module is used to convey the sheet after hot pressing by the hot press 300 to the punching module, and the punching module is used to punch the sheet.

[0068] In this embodiment, the loading system 100 and the unloading system 200 are fixed by the first frame 11 and the second frame 12 respectively. The frame structure can effectively disperse the impact force, improve the overall stability, and at the same time save the connecting support parts required for each module, thereby reducing production costs.

[0069] See attached Figure 6 and attached Figure 7 As shown, the epoxy resin loading module includes a discharge mechanism 2 and a feed mechanism 3, which are sequentially arranged along the X-axis. The feed mechanism 3 includes a feed assembly capable of linear reciprocating motion along the X-axis. The feed assembly includes a barrel 32, which can store a group of epoxy resins. The discharge mechanism 2 is used to arrange multiple epoxy resins into a group and push them into the barrel 32. As the feed assembly moves, it reciprocates between the discharge mechanism 2 and the conveying module to move the discharged group of epoxy resins to the conveying module.

[0070] The blank loading module is located below the epoxy resin loading module and includes a loading mechanism 4 and a heating plate 5. The loading mechanism 4 is located below the feeding mechanism 3 and to one side of the unloading mechanism along the Y direction. The loading mechanism 4 can place the blanks one by one onto the heating plate 5 to form a group of blanks in an array structure. The heating plate 5 can move linearly back and forth along the Y direction to move a group of blanks directly below the feeding mechanism 3.

[0071] The first conveying module, located in the Z direction between the epoxy resin loading module and the blank loading module, includes a first clamping device 6 that can reciprocate linearly in the X direction. The first clamping device 6 can be moved below the feed mechanism 3. When the heating plate 5 moves below the feed mechanism 3, the heating plate 5 is positioned below the first clamping device 6. The first clamping device 6 is used to clamp the blank and epoxy resin. After clamping the blank and epoxy resin, the first clamping device 6 can then move in the X direction toward a side away from the discharge mechanism 2 to transfer the blank and epoxy resin to the hot press 300.

[0072] See attached Figure 12 As shown, the second conveying module includes a second clamping device 7 that can perform linear reciprocating movement along the X direction. The second clamping device 7 can reciprocate between the hot press 300 and the unloading station in the second frame 12.

[0073] See attached Figure 12 and attached Figure 13As shown, the punching module includes an upper die assembly 91 and a lower die assembly 92. The upper die assembly 91 is located on one side of the blanking station in the Y direction, and the lower die assembly 92 can move linearly back and forth in the Y direction to switch between the blanking station and the upper die assembly 91. When the upper die assembly 91 and the lower die assembly 92 are closed, the blank is punched.

[0074] In this embodiment, the feeding system 100 is located on one side of the hot press 300. The epoxy resin feeding module, the tablet feeding module and the first conveying module are used to automatically feed the epoxy resin and tablets. Multiple epoxy resins and tablets can be fed at a time, which greatly improves production efficiency. At the same time, the epoxy resin feeding module and the tablet feeding module are arranged in a special position. While the two are spaced apart in the Z direction, the discharge mechanism 2 is located on the X side of the feeding mechanism 3, and the feeding mechanism 4 is located on the Y side of the feeding mechanism 3, so as to achieve the staggered arrangement of the discharge mechanism 2 and the feeding mechanism 4. Then, the epoxy resin and tablet are moved to the upper and lower sides of the first clamping device 6 respectively by the two feeding mechanisms 3 and the heating plate 5 that move in the X and Y directions respectively, so as to achieve the intersection in the vertical direction. Meanwhile, the blanking system 200 is located on the other side of the hot press 300. A second clamping device 7, also moving in the X-direction, removes the blank from the hot press 300. The lower mold assembly 92, also moving in the Y-direction, then moves below the upper mold assembly 91 for punching. This arrangement allows the second clamping device 7 and the punching module to intersect horizontally. This arrangement fully utilizes space, ensuring injection molding efficiency while making the entire equipment more compact and saving floor space.

[0075] See attached Figure 3 As shown, the epoxy resin feeding module includes a first fixed plate 111, on which the discharge mechanism 2 and the feed mechanism 3 are mounted. The tablet feeding module includes a second fixed plate 112. The first and second fixed plates 111, 112 are arranged parallel to each other and spaced apart. The feeding mechanism 4 is mounted on the second fixed plate 112, along which the heating plate 5 can move. Both the first and second fixed plates 111, 112 are fixed to the first frame 11, which supports the entire feeding system 100.

[0076] See attached Figure 4 As shown, the punching module includes a third fixing plate 121 and a fourth fixing plate 122 that are parallel and spaced apart from each other. The upper die assembly 91 can move up and down between the third fixing plate 121 and the fourth fixing plate 122, and the lower die assembly 92 can slide along the fourth fixing plate 122. The third fixing plate 121 and the fourth fixing plate 122 are both fixed to the second frame 12, and the entire blanking system 200 is supported by the second frame 12.

[0077] In particular, the punching module is directly supported by the second frame 12, and the third fixed plate 121 and the fourth fixed plate 122, which bear most of the impact force during the punching process, are directly fixed on the second frame 12. The impact force during the punching process is dispersed through the frame. On the one hand, the frame structure itself is utilized to save space and cost. On the other hand, the frame has high support strength and can disperse the pressure generated by the upper mold assembly 91 and the lower mold assembly 92 when the mold is closed, thereby avoiding deformation caused by impact.

[0078] See attached Figure 3 and attached Figure 4 As shown, the first frame 11 and the second frame 12 have the same structure, both being cuboids. The first frame 11 and the second frame 12 each include at least four vertical profiles arranged in a rectangular pattern. An upper frame is fixed to the upper end of the vertical profile, and a lower frame is fixed to the lower end of the vertical profile. The upper and lower frames serve to fix the vertical profiles, allowing the entire frame to form a whole. Multiple fixed frames are also provided between the upper and lower frames, and the fixed frames are fixed to the vertical profiles. The first fixed plate 111 and the second fixed plate 112 are fixed to the upper end surface of the fixed frame of the first frame 11 at different heights, and the third fixed plate 121 and the fourth fixed plate 122 are fixed to the upper end surface of the fixed frame of the second frame 12 at different heights.

[0079] See attached Figure 6 and attached Figure 7 As shown, the discharge mechanism 2 includes a weighing device and a loading device. The weighing device is used to weigh each epoxy resin and transport the qualified epoxy resins to the loading device in sequence. The loading device includes a pre-loading frame 21, a first pushing assembly 22 and a second pushing assembly 23. The pre-loading frame 21 is slidably arranged on the first fixed plate 111, and the pre-loading frame 21 can perform reciprocating linear motion between the first pushing assembly 22 and the second pushing assembly 23 in the X-axis direction. The pre-loading frame 21 is penetrated by a plurality of loading holes 211 evenly spaced along the X-direction. Each loading hole 211 penetrates the pre-loading frame 21 along the Y-direction, and only one epoxy resin can be accommodated in one loading hole 211. The first pushing assembly 22 is used to push the epoxy resins transported by the weighing device into different loading holes 211 one by one, and the second pushing assembly 23 is used to synchronously push the epoxy resins in all loading holes 211 into the barrel 32.

[0080] The preloading frame 21 can move under the push of the first linear motion module 212. The first pushing assembly 22 and the second pushing assembly 23 are arranged at intervals along the X direction, and the first pushing assembly 22 is arranged at a position close to the weighing device. When the preloading frame 21 moves to the position of the first pushing assembly 22, the first pushing assembly 22 pushes the epoxy resin into the loading holes 211 one by one. During the movement of the preloading frame 21, each loading hole 211 reaches the position of the first pushing assembly 22 in turn and inserts the epoxy resin in turn. While the preloading frame 21 is inserting the epoxy resin, the barrel 32 can transport a group of epoxy resin to the clamping device. When the preloading frame 21 moves to the position of the second pushing assembly 23, the barrel 32 arrives here at the same time, and the second pushing assembly 23 pushes a group of epoxy resin into the barrel 32 synchronously. Through the preloading of a preloading frame 21, the loading efficiency of the epoxy resin of this application is effectively improved. It should be noted that the linear motion module is a mature technology, which can be realized by cylinders, linear screws or transmission belts, and the details will not be elaborated.

[0081] See attached Figure 6 and attached Figure 8 As shown, the weighing device includes a conveyor line 24, a weighing platform 25, a clamping assembly 26, and a slide 27. The conveyor line 24 is arranged on the first fixed plate 111 along the Y direction. The conveyor line 24 can simultaneously transport multiple epoxy resins moving along the Y direction. The epoxy resins are sequentially arranged along the Y direction on the conveyor line 24. The conveyor line 24 is a belt conveyor line 24, which is a mature technology and will not be described in detail here.

[0082] The weighing platform 25 is arranged at the end of the conveyor line 24 along the X direction. This arrangement can increase the amount of epoxy resin conveyed by the conveyor line 24. The weighing platform 25 includes at least a weighing sensor and a tray, wherein the tray is arranged above the weighing sensor to weigh each piece of epoxy resin.

[0083] See attached Figure 8 As shown, clamping assembly 26 is positioned directly above weighing platform 25. Clamping assembly 26 pushes epoxy resin conveyed from conveyor line 24 along the X-axis onto the pallet, making it easy to operate. After the epoxy resin on the pallet is tested, clamping assembly 26 re-grips the epoxy resin to be tested and moves it toward the pallet. The tested epoxy resin on the pallet is then pushed off the pallet by the next epoxy resin.

[0084] See attached Figure 8 As shown, slide 27 is located on the side of the pallet, extending in the X-direction and tilted, with the highest point of slide 27 resting against the pallet. After the epoxy resin is weighed, the qualified epoxy resin is pushed into slide 27 via clamping assembly 26, allowing the tested epoxy resin to be moved to the next processing step via slide 27. This simple structure is highly practical.

[0085] In one embodiment, the weighing device further includes a waste removal assembly 28. When the product weight does not meet a predetermined value, the waste removal assembly 28 can remove and collect the epoxy resin on the tray. The waste removal assembly 28 is positioned on one side of the weighing platform 25 along the Y-axis. The waste removal assembly 28 can selectively push the epoxy resin that does not meet the standards off the tray along the Y-axis, allowing staff to recycle and reuse the epoxy resin.

[0086] See attached Figure 8 As shown, the first pusher assembly 22 is arranged at the low point of the slide 27, and includes a first pusher rod that can move linearly back and forth along the Y direction. The first pusher plate moves under the drive of the first pusher cylinder 221. During the movement, the first pusher rod pushes the epoxy resin at the end of the slide 27 out of the slide 27.

[0087] See attached Figure 7 As shown, the second pushing assembly 23 includes a plurality of second pushing rods 231 corresponding to the loading holes 211 and capable of linear reciprocating movement along the Y direction. The plurality of first pushing plates are driven by the same second pushing cylinder 232 to move. During the movement, the second pushing rods 231 can synchronously push the epoxy resin in all the loading holes 211 out of the pre-installed rack 21.

[0088] See attached Figure 6 As shown, the feeding assembly also includes a first movable frame 311, which moves linearly along the first fixed plate 111 in the X-direction. The first fixed plate 111 is provided with a second linear motion module 312 that drives the first movable frame 311. The barrel 32 can also move linearly along the first movable frame 311 in the Y and Z directions to adjust its position, and the barrel 32 can rotate about the X-axis to adjust the direction of the epoxy resin.

[0089] See attached Figure 9 As shown, the barrel 32 includes a barrel body 321, which is formed with a receiving space 321a corresponding to the loading hole 211. Each receiving space 321a is provided through the barrel body 321. A blocking rod 322 corresponding to the receiving space 321a is slidably mounted on one end of the barrel body 321. Each blocking rod 322 is provided corresponding to the opening of each receiving space 321a and can be moved to at least partially cover the opening of the receiving space 321a. The provision of the blocking rod 322 prevents the epoxy resin from falling out when the barrel 32 is turned over.

[0090] The barrel 32 is positionally adjustable in the X, Y, and Z directions and can be moved to a corresponding position to dock with the second pushing assembly 23 and the clamping device.

[0091] See attached Figure 10As shown, the heating plate 5 has a built-in heating element that heats the sheet on it, improving the efficiency of subsequent hot pressing. Multiple placement plates 51 are arranged in an array on the hot pressing plate, each of which can only hold one sheet. A third linear motion module 52 is mounted on the second fixed plate 112 to drive the heating plate 5 in the Y direction.

[0092] In one embodiment, the placement plate 51 is detachably connected to the heating plate 5 and is adjustable on the heating plate 5 to adjust the position of the placement plate 51 according to actual needs and improve accuracy. The placement plate 51 can be fixed to the heating plate 5 by bolts. The placement plate 51 has waist-shaped holes for the bolts to slide, thereby adjusting the position of the placement plate 51.

[0093] See attached Figure 10 As shown, the loading mechanism 4 includes a clamping unit 41 that can move in three directions of X / Y / Z. The clamping unit 41 can grab a piece of material one by one and place it on a placement plate 51.

[0094] The first conveying module further includes a first moving drive device 81, which is used to drive the first clamping device 6 to move along the X direction. Figure 5 As shown, the first mobile driving device includes a rack 811, a gear 812 and a mobile driving member 813. The mobile driving member 813 is fixed on the second fixed plate 112 and drives the gear 812 to rotate. The rack 811 is fixed on the first clamping device 6 and meshes with the gear 812.

[0095] The positions of the movable driving member 813 and the gear 812 are fixed, while the rack 811 is set to be movable. Within the same moving range, the length of the rack 811 is reduced, making the structure more compact.

[0096] See attached Figure 4 As shown, the second conveying module further includes a second mobile drive device 82, which is used to drive the second clamping device 7 to move along the X-direction. The second mobile drive device 82 has the same structure as the first mobile drive device 81. The mobile drive member 813 of the second mobile drive device 82 is fixed to the fourth fixed plate 122, and the rack 811 of the second mobile drive device is fixed to the second clamping device 7.

[0097] See attached Figure 11As shown, a lower module and an upper module corresponding to the lower module are fixed to the hot press 300. The lower module can move up and down under the drive of the hot press 300 to achieve mold closing and opening with the upper module. The upper module is fixed with two guide rails 83 spaced apart along the Y direction. The guide rails 83 extend along the X direction and are fixedly connected to the first fixed plate 111 and the third fixed plate 121 at their ends. The first clamping device 6 and the second clamping device 7 both slide along the two guide rails 83, providing stable support for the movement of the first clamping device 6 and the second clamping device 7.

[0098] Because the upper mold 1a is fixed in position and its lower end surface is flat, in this embodiment, the guide rail 83 is fixed to the lower end surface of the upper mold 1a. This facilitates the fixation of the guide rail 83, improves the positioning accuracy of the guide rail 83, and thereby improves the movement accuracy of the first clamping device 6 and the second clamping device 7. Furthermore, fixing the guide rail 83 to the lower end surface of the upper mold 1a rationally utilizes the space between the upper mold 1a and the lower mold 1b, making the overall structure more compact.

[0099] The first mobile drive device 81 and the second mobile drive device 82 correspond one-to-one to the two guide rails 83, that is, the first mobile drive device 81 is set at the position of one guide rail 83, and the second mobile drive device 82 is set at the position of the other guide rail 83 to avoid interference with each other.

[0100] See attached Figure 13 As shown, a fourth linear motion module 93 is fixed to the fourth fixed plate 122, which drives the movement of the lower mold assembly 92. A material receiving box is also provided at the unloading station, located below the fourth fixed plate 122. The fourth fixed plate 122 has an unloading opening corresponding to the material receiving box. When the lower mold assembly 92 moves to the unloading station, the second clamping device 7 can move to directly above the lower mold assembly 92 and place the hot-pressed sheet onto the lower module, or remove the sheet that has been punched from the lower mold assembly 92. When the second clamping device 7 leaves the unloading station, the sheet is placed into the unloading box 10, completing the unloading. When the lower mold assembly 92 moves to the entire bottom of the upper mold assembly 91, the upper mold assembly 91 can move downward to complete the punching of the sheet and remove excess runners. A lifting drive component is fixed to the third fixed plate 121, which drives the upper mold assembly 91 up and down.

[0101] See attached Figure 14As shown, the first clamping device 6 includes a first connecting frame 61, a first transfer plate 62 and a plurality of first clamping jaw assemblies 63. The first rack 811 is fixed to the first connecting frame 61. The first transfer plate 62 can be raised and lowered along the connecting frame. The first clamping jaw assemblies 63 are provided in multiple groups and are arranged corresponding to the placement plate 51. Each group of first clamping jaw assemblies 63 has at least two first clamping jaws. The lower ends of the two first clamping jaws extend out of the first transfer plate 62 and can move relative to or away from each other. When the clamping jaws move toward each other, a clamping space is gradually formed between the clamping jaws to clamp the sheet. A first clamping drive 631 is installed on the upper surface of the first transfer plate. The first clamping drive 631 is used to drive the two first clamping jaws to move synchronously toward or away from each other.

[0102] The first clamping device 6 also includes a placement cylinder 64 located above the first transfer plate 62. The placement cylinder 64 is provided with a plurality of feed channels arranged in the vertical direction along the X direction. Each feed channel can hold an epoxy resin, that is, the epoxy resin delivered by the barrel 32 falls into the feed channel. The number and spacing of the feed channels on the placement cylinder 64 match the accommodating space 321a on the barrel 32. Leak holes corresponding to the feed channels are provided on the transfer plate. The feed channels have the same diameter as the leak holes, or the diameter of the feed channels is smaller than the diameter of the leak holes. The diameter relationship between the two only needs to ensure that the black glue in the feed channels can fall freely through the leak holes. The placement cylinder 64 is slidably arranged on the top of the first transfer plate 62 along the X direction so that the feed channels and the leak holes can be coaxial or offset.

[0103] The second clamping device 7 includes a second connecting frame, a second transfer plate, and a plurality of second clamping jaw assemblies. The second connecting frame, the second transfer plate, and the second clamping jaw assemblies are structurally identical to the first connecting frame 61, the first transfer plate 62, and the first clamping jaw assembly 63. The first clamping assembly 26 can be moved below the lower mold 1b and downwardly moved to grasp the hot-pressed sheet.

[0104] See attached Figure 15 As shown, the second clamping device 7 also includes a cleaning component 71, which is located below the second transfer plate and includes a cleaning component and a vacuum adsorption component arranged in sequence along the cleaning direction. The front cleaning component is made of flexible material to clean the surface of the lower mold 1b, and the rear vacuum adsorption component is used to adsorb and remove waste materials on the surface of the lower mold 1b.

[0105] The specific working process of this embodiment is as follows: the feeding system 100 synchronously conveys the epoxy resin and the sheet material to the lower mold 1b in the hot press 300. The epoxy resin moves along the conveyor line 24 and is pushed by the clamping assembly 26 to enter the weighing platform 25 for weighing. For epoxy resins that pass the weighing, when the next epoxy resin enters the weighing platform 25, it is pushed onto the slide 27 and slides to the lower position along the inclined slide 27. The first pusher assembly 22 at the lower position of the slide 27 pushes the epoxy resins horizontally into the pre-loading frame 21 one by one. As the pre-loading frame 21 moves along the X direction, the loading holes 211 of the pre-loading frame 21 are aligned with the first pusher assembly 22 in sequence. When epoxy resin is pushed into all the loading holes 211 of the pre-loading frame 21, the pre-loading frame 21 moves to the position of the second pusher assembly 23. This time, the barrel 32 also reaches the position of the second pusher assembly 23. The storage space 321a of the barrel 32 is aligned with the loading hole 211, and their axes coincide. The second pusher assembly 23 then actuates, pushing the epoxy resin in the pre-loading rack 21 into the barrel 32. The first movable rack 311 moves the barrel 32 in the Y direction to the position of the first clamping device 6. The barrel 32 then moves in the Y direction to the position of the placement cylinder 64. The barrel 32 flips and turns the epoxy resin to a vertical position. During this process, the blocking rod 322 blocks the storage space 321a. When the barrel 32 is completely flipped, the blocking rod 322 moves to release the restriction on the opening, and the epoxy resin exits the storage space 321a under the action of gravity and falls into the placement cylinder 64.

[0106] The sheet loading module and the epoxy resin loading module work synchronously. Initially, the heating plate 5 is located on one side of the epoxy resin loading module. The clamping claw unit 41 clamps the sheets one by one and places them on the placement plate 51 of the heating plate 5 in turn. When eight sheets are placed, the heating plate 5 moves along the Y direction to directly below the first clamping device 6, and the first clamping device 6 can clamp the sheets.

[0107] After the epoxy resin and sheet are fixed on the first clamping device 6, the first clamping device 6 can be moved into the hot press 300 and the epoxy resin and sheet are placed on the lower mold 1b. The hot press 300 drives the lower mold 1b to move up and close the mold to complete the hot pressing.

[0108] After hot pressing is complete, the second clamping device 7 moves into the hot press 300, clamps the hot-pressed sheet, and moves it to the unloading station. The second clamping device 7 places the sheet onto the lower die assembly 92, which then moves directly below the upper die assembly 91. The upper die assembly 91 then moves downward, completing the punching of the sheet. After the punching is complete, the lower die assembly 92 moves again to the unloading station. After the second clamping device 7 grabs the punched sheet, when the lower die assembly 92 leaves the unloading station, the second clamping device 7 releases the sheet into the receiving box.

[0109] The above embodiments are only for illustrating the technical concept and features of the present invention. Its purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. It cannot be used to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor packaging device comprising a hot press and a loading system and an unloading system located on both sides of the hot press in the X direction, characterized in that: The feeding system includes a first frame, on which an epoxy resin feeding module, a tablet feeding module and a first conveying module are arranged, wherein The epoxy resin loading module includes a discharge mechanism and a feeding mechanism arranged in sequence along the X direction, the discharge mechanism is used to arrange multiple epoxy resins into a group and push them to the feeding mechanism, and the feeding mechanism is used to store a group of epoxy resins and move them into the working range of the first conveying module; The web loading module includes a loading mechanism and a heating plate. The loading mechanism is located below the feeding mechanism and on one side of the unloading system along the Y direction. The loading mechanism can place webs one by one onto the heating plate. The heating plate can move linearly back and forth along the Y direction to synchronously move multiple webs to the bottom of the feeding mechanism. The first conveying module includes a first clamping device capable of linear reciprocating movement along the X-direction, wherein the first clamping device can simultaneously clamp the sheet material and the epoxy resin and move between the feeding mechanism and the hot press; The blanking system includes a second frame, on which a second conveying module and a punching module are provided, wherein The second conveying module includes a second clamping device capable of linear reciprocating movement along the X direction, the second clamping device can clamp the sheet and reciprocate between the hot press and the unloading station in the second frame; The punching module includes an upper die assembly and a lower die assembly. The upper die assembly is located on one side of the blanking station in the Y direction. The lower die assembly can make linear reciprocating movements in the Y direction to switch between the blanking station and the upper die assembly. When the upper die assembly moves downward and closes the lower die assembly, the blank is punched. The heating plate is provided with a plurality of placement plates arranged in an array, each of which is detachably connected to the heating plate and adjustable in position on the heating plate. The placement plates can only hold one sheet, and the heating plate can heat the sheet. The loading mechanism includes a gripper unit that can move in the X, Y, and Z directions, and the gripper unit can grab the sheets one by one and place them on a placement plate. A lower module and an upper module corresponding to the lower module are fixed on the hot press, and the lower module can move up and down under the drive of the hot press; two guide rails arranged at intervals along the Y direction are fixed on the upper module, and the guide rails extend along the X direction and the two ends are fixedly connected to the first frame and the second frame respectively, and the first clamping device and the second clamping device both slide along the two guide rails.

2. The semiconductor packaging device according to claim 1, wherein: The feeding mechanism includes a feeding assembly capable of linear reciprocating movement along the X direction, and the feeding assembly includes a first moving frame and a barrel; The barrel can store multiple epoxy resins, and the discharge mechanism is used to arrange the multiple epoxy resins into a group and push them into the barrel; The first movable frame can move linearly in the X direction. The barrel can move linearly in the Y direction and the Z direction along the first movable frame while moving synchronously with the first movable frame. The barrel can rotate around the X axis to adjust the direction of the epoxy resin.

3. The semiconductor packaging device according to claim 1, wherein: The discharging mechanism includes a weighing device and a charging device, wherein The weighing device is used to weigh each epoxy resin and sequentially convey the epoxy resins that have passed the weighing to the loading device; The loading device includes a pre-loading frame, a first pushing assembly and a second pushing assembly. The pre-loading frame performs reciprocating linear motion between the first pushing assembly and the second pushing assembly along the X direction. The pre-loading frame is penetrated by a plurality of loading holes. One loading hole can only accommodate one epoxy resin. The first pushing assembly is used to push the epoxy resin delivered by the weighing device into different loading holes one by one, and the second pushing assembly is used to synchronously push the epoxy resin in all loading holes into the barrel.

4. The semiconductor packaging device according to claim 2, wherein: The barrel includes a barrel body, on which a accommodating space is formed. Each of the accommodating spaces is arranged through the barrel body. A baffle rod corresponding to the accommodating space is slidably installed at one end of the barrel body, and the baffle rod can be moved to block at least a partial area of ​​the opening of the corresponding accommodating space.

5. The semiconductor packaging device according to claim 1, wherein: The first conveying module and the second conveying module respectively include a first moving drive device and a second moving drive device, and the first moving drive device and the second moving drive device are respectively arranged corresponding to the two guide rails; The first mobile drive device and the second mobile drive device both include a rack, a gear and a mobile drive member. The mobile drive member is fixed to the first frame or the second frame and drives the gear to rotate. The rack is fixed to the first clamping device or the second clamping device and meshes with the gear.

6. The semiconductor packaging device according to any one of claims 1 to 5, wherein: The epoxy resin feeding module includes a first fixed plate, and the discharge mechanism and the feeding mechanism are arranged on the first fixed plate; The sheet feeding module includes a second fixed plate, the first fixed plate and the second fixed plate are parallel and spaced apart from each other, the feeding mechanism is arranged on the second fixed plate, and the heating plate can move along the second fixed plate; The first fixing plate and the second fixing plate are both fixed on the first frame.

7. The semiconductor packaging device according to any one of claims 1 to 5, wherein: The punching module includes a third fixed plate and a fourth fixed plate that are parallel and spaced apart from each other. The upper mold assembly can move up and down between the third fixed plate and the fourth fixed plate. A lifting drive member that drives the upper mold assembly to rise and fall is fixed on the third fixed plate. The lower mold assembly can slide along the fourth fixed plate. The third fixed plate and the fourth fixed plate are both fixed to the second frame.

8. The semiconductor packaging device according to claim 7, wherein: The blanking station is provided with a material receiving box located below the fourth fixed plate, and the fourth fixed plate is provided with a blanking opening corresponding to the material receiving box.

Images