Pointing display module maintenance method, device, equipment and readable storage medium

Abstract

The application relates to a display module maintenance method, device and equipment and a readable storage medium. The method comprises the following steps: determining a to-be-filled wafer in a to-be-maintained display module; filling a region where the to-be-filled wafer is located based on a preset microsphere colloid; detecting whether a height difference between a filled colloid height and a reference colloid height of the region where the to-be-filled wafer is located belongs to a preset threshold range; and if the height difference belongs to the preset threshold range, determining that the to-be-maintained display module is maintained. After the to-be-filled wafer is determined, the region where the to-be-filled wafer is located is filled based on the microsphere colloid, and the filling progress of the region where the to-be-filled wafer is located is detected in real time, so that uniform filling of the colloid can be realized, and the filling effect of the colloid layer can be ensured.

Description

Technical Field

[0001] This application relates to the field of LED display module repair technology, and in particular to a method, apparatus, equipment and readable storage medium for repairing fixed-point display modules. Background Technology

[0002] When a defective LED chip occurs in a chip-on-board light-emitting diode (COBLED) display module, it needs to be repaired. In existing methods, the entire surface encapsulation layer is often molded in one step during the filling process. The filled adhesive at the repair point is prone to being uneven, creating a difference from the overall surface encapsulation layer, which affects the product quality of the COBLED display module. Summary of the Invention

[0003] Therefore, it is necessary to provide a method, apparatus, equipment, and readable storage medium for repairing fixed-point display modules that can uniformly apply adhesive, addressing the aforementioned technical problems.

[0004] Firstly, this application provides a method for repairing a fixed-point display module, the method comprising:

[0005] Identify the chip to be filled in the display module under repair;

[0006] The area where the wafer to be filled is located is filled based on a preset microsphere colloid;

[0007] Detect whether the height difference between the filling colloid height and the reference colloid height in the area where the wafer to be filled is located falls within a preset threshold range;

[0008] If the height difference falls within a preset threshold range, the repair of the display module to be repaired is determined to be complete.

[0009] In one embodiment, the method further includes:

[0010] If the height difference is not within the preset threshold range, continue to execute the step of filling the area of ​​the wafer to be filled based on the preset microsphere colloid.

[0011] In one embodiment, determining the chip to be filled in the display module to be repaired includes:

[0012] Light up the display module that needs repair;

[0013] Detect the brightness of all display chips in the display module to be repaired;

[0014] The display chip with the highest brightness is identified as the chip to be filled.

[0015] In one embodiment, after determining the chip to be filled in the display module to be repaired, the method further includes:

[0016] Obtain the spatial dimensions of the region where the wafer to be filled is located, wherein the spatial dimensions include the filling area and the filling height;

[0017] The target colloid diameter of the preset microsphere colloid is determined based on the filling height.

[0018] The number of target colloids in the preset microsphere colloid is determined based on the filling area and the target colloid diameter.

[0019] Multiple preset microsphere colloids are generated based on the target colloid diameter and the target colloid quantity.

[0020] In one embodiment, the minimum colloidal diameter of the preset microsphere colloid is 2 nm, and the maximum colloidal diameter of the preset microsphere colloid is 1000 nm.

[0021] In one embodiment, the filling of the region where the wafer to be filled is located based on a preset microsphere colloid includes:

[0022] Detect whether the difference between the actual colloidal diameter of the preset microsphere colloid and the target colloidal diameter falls within a preset error range;

[0023] If the size difference is within the preset error range, the preset microsphere colloid will be filled into the area where the wafer to be filled is located;

[0024] The area where the wafer to be filled is located is irradiated with ultraviolet light for a preset time to solidify the colloid in the area where the wafer to be filled is located.

[0025] In one embodiment, after determining whether the height difference between the height of the filling colloid in the region where the wafer to be filled is located and the height of the reference colloid falls within a preset threshold range, the method further includes:

[0026] If the height difference is not within the preset threshold range, continue to execute the step of obtaining the spatial dimensions of the area where the wafer to be filled is located.

[0027] Secondly, this application also provides a fixed-point display module repair device, the device comprising:

[0028] The filling determination module is used to determine the wafers to be filled in the display module to be repaired;

[0029] A filling module is used to fill the area where the wafer to be filled is located based on a preset microsphere colloid;

[0030] The detection module is used to detect whether the height difference between the height of the filling colloid and the height of the reference colloid in the area where the wafer to be filled is located is within a preset threshold range;

[0031] The maintenance determination module is used to determine that the maintenance of the display module to be maintained is completed if the height difference is within a preset threshold range.

[0032] Thirdly, this application also provides a fixed-point display module repair device, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps of the fixed-point display module repair method described in the first aspect.

[0033] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the fixed-point display module maintenance method described in the first aspect.

[0034] In summary, this application proposes a method, apparatus, device, and readable storage medium for repairing a fixed-point display module. The method includes: determining the wafer to be filled in the display module to be repaired; filling the area where the wafer to be filled is located based on a preset microsphere colloid; detecting whether the height difference between the height of the filling colloid in the area where the wafer to be filled is located and the height of a reference colloid is within a preset threshold range; if the height difference is within the preset threshold range, determining that the repair of the display module to be repaired is complete. This invention, after determining the wafer to be filled, fills the area where the wafer to be filled is located based on a microsphere colloid, and detects the filling progress in real time, enabling uniform filling of the colloid and ensuring the filling effect of the colloid layer. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the module's structure.

[0036] Figure 2 This is an application environment diagram of a fixed-point display module maintenance method in one embodiment;

[0037] Figure 3 This is one of the flowcharts illustrating a method for repairing a fixed-point display module in one embodiment;

[0038] Figure 4 This is a second flowchart illustrating a method for repairing a fixed-point display module in one embodiment;

[0039] Figure 5 This is a schematic flowchart illustrating the steps for determining the wafer to be filled in one embodiment;

[0040] Figure 6 This is the third flowchart illustrating a method for repairing a fixed-point display module in one embodiment;

[0041] Figure 7 This is a schematic diagram of the steps for filling the area of ​​the wafer to be filled based on a preset microsphere colloid in one embodiment.

[0042] Figure 8 This is the fourth flowchart illustrating a method for repairing a fixed-point display module in one embodiment;

[0043] Figure 9 This is a schematic diagram illustrating an application scenario of repairing a display module based on a fixed-point display module repair method in one embodiment.

[0044] Figure 10 This is a structural block diagram of a fixed-point display module maintenance device in one embodiment;

[0045] Figure 11 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0047] like Figure 1 As shown, the display module in this application embodiment can be a chip-on-board light-emitting diode display screen. A COB LED display screen is a display module in which the display chip is mounted on a printed circuit board, and then the entire circuit board and the surface of the display chip are encapsulated with epoxy resin.

[0048] In one embodiment, the packaging structure of the COB LED display module includes a printed circuit board (PCB), driving surface components, LED chips, and a surface encapsulation layer colloid. Specifically, the material of the surface encapsulation layer colloid and the packaging process can be adaptively selected according to the actual application scenario, and this embodiment does not limit them.

[0049] During the manufacturing or use of COB LED display modules, defects may appear in the LED chips due to reasons such as poor LED chip packaging, poor soldering between the LED chip and the PCB board, or impacts during use. In this case, it is necessary to remove the surface encapsulation layer of the LED chip at the defective point, replace the LED chip, and then re-encapsulate the defective LED chip with adhesive.

[0050] In this embodiment, a preset thinning method can be used to remove the surface encapsulating layer colloid at the defective area of ​​the LED chip. Specifically, the preset thinning method can be any thinning method, including laser thinning, mechanical thinning, and chemical etching thinning. This embodiment does not limit the specific implementation process of the preset thinning method; an appropriate thinning method can be selected to remove the surface encapsulating layer colloid at the defective area of ​​the LED chip according to the actual application scenario.

[0051] After removing the surface encapsulant from the defective LED chip, the defective LED chip is replaced, and a new LED chip is soldered to the corresponding position on the PCB board. It should be noted that in this embodiment, the new LED chip is a usable LED chip, not necessarily a brand new one.

[0052] After replacing the LED chip, the fixed-point display module repair method proposed in this embodiment is used to re-encapsulate the defective LED chip and monitor the dimensional parameters of the surface encapsulation layer in real time to ensure the product quality of the repaired display module.

[0053] The fixed-point display module repair method provided in this application embodiment can be applied to, for example... Figure 2 In the application environment shown, terminal 202 communicates with server 204 via a network. A data storage system can store the data that server 204 needs to process. The data storage system can be integrated onto server 204 or located in the cloud or on other network servers. Terminal 202 can be, but is not limited to, various personal computers, laptops, smartphones, tablets, or micro / nano 3D printing devices. Specifically, when terminal 202 is a personal computer, laptop, smartphone, or tablet, it connects to the micro / nano 3D printing device through a corresponding communication interface to control the device to execute a fixed-point display module repair method, thereby performing repair processing on the COB LED display module. Server 204 can be implemented using a standalone server or a server cluster consisting of multiple servers.

[0054] In one embodiment, such as Figure 3 As shown, a method for maintaining a fixed-point display module is provided, which can be applied to... Figure 2 Taking the application environment in [the document] as an example, the following steps are included:

[0055] S301, Identify the chip to be filled in the display module to be repaired.

[0056] Specifically, the display module to be repaired is one where the defective display chip has been replaced, but the encapsulation process has not yet been completed. In a specific embodiment, if the display module to be repaired is a COB LED display module, then the display chip is an LED chip. It should be noted that the fixed-point display module repair method provided in this embodiment can also be applied to other types of display modules that require encapsulation.

[0057] In a specific embodiment, this embodiment determines the wafer to be filled by identifying the adhesive height of all display wafers on the surface of the display module to be repaired. Since the adhesive is missing at display wafers that have not undergone adhesive sealing, this embodiment identifies the wafer to be filled by identifying display wafers with significantly lower adhesive heights. For example, after startup, the micro-nano 3D printing equipment automatically monitors the adhesive height of each display wafer area on the display module to be repaired, calculates the difference in adhesive height between each pair of display wafer areas, and determines the display wafer area with the lower adhesive height as the area where the wafer to be filled is located when the difference in adhesive height exceeds a preset threshold. It should be noted that the preset threshold can be set to a height difference threshold at the nanometer level; this embodiment does not specifically limit this.

[0058] In one embodiment, after the display module to be repaired is lit, the brightness of the display chip that has not yet completed the encapsulation process will be significantly higher than that of the display chip under the surface encapsulation layer. This embodiment can also determine the chip to be filled by identifying the brightness of all display chips in the lit display module. This embodiment, by identifying brightness differences, can identify the chip to be filled more quickly. It should be noted that the method used in this embodiment to determine the chip to be filled in the display module can be adaptively configured according to the needs of the actual application scenario.

[0059] It's important to understand that in practical applications, there can be multiple defective display chips in the display module under repair. During the pre-treatment thinning process, the surface encapsulation layer at multiple defective display chips will be damaged, and multiple defective display chips will need to be replaced. During the chip identification process, all display chips with abnormal brightness will be identified.

[0060] In this embodiment, the adhesive filling order can be set for each chip to be filled according to the identification order of the chips to be filled. For example, if the identification of the chips to be filled is carried out by comparing the brightness of each display chip from left to right, then the adhesive filling order is also carried out from left to right, and each chip to be filled is filled with adhesive in turn.

[0061] S302, fills the area where the wafer to be filled is located based on the preset microsphere colloid.

[0062] Specifically, in this embodiment, a micro-nano 3D printing device is used to fill the area of ​​the wafer to be filled with a colloid. The preset microsphere colloid is generated by the micro-nano 3D printing device according to the size parameters of the area where the wafer to be filled is located.

[0063] In one embodiment, the minimum colloidal diameter of the preset microsphere colloid is 2 nm, and the maximum colloidal diameter of the preset microsphere colloid is 1000 nm.

[0064] In the specific implementation process, after identifying the wafer to be filled, the micro-nano 3D printing equipment in this embodiment will perform an environmental scan of the area where the wafer to be filled is located in order to calculate the amount of adhesive needed for the microsphere colloid to be printed, and print a certain number of microsphere colloids sufficient to fill the area where the wafer to be filled is located.

[0065] In one embodiment, the minimum total height of the adhesive layer in the area where the wafer to be filled is located is 2 μm (micrometers), and the maximum total height of the adhesive layer in the area where the wafer to be filled is located is 1000 μm.

[0066] Specifically, when using micro-nano 3D printing equipment to print pre-set microsphere colloids to fill the area where the wafer to be filled is located, the pre-set microsphere colloids can be generated in batches. The colloid diameter of different batches of pre-set microsphere colloids is different. Pre-set microsphere colloids with different colloid diameters are used to fill the area where the wafer to be filled is located.

[0067] For example, if the total height of the adhesive layer in the area where the wafer to be filled is 5µm, for areas below 4µm, a preset microsphere adhesive with a diameter of 1000nm can be used for adhesive filling; for areas above 4µm and below 4.5µm, a preset microsphere adhesive with a diameter of 500nm can be used for adhesive filling; and for areas close to 5µm in total height, a preset microsphere adhesive with a diameter of 2nm can be used for adhesive filling.

[0068] This embodiment uses a micro-nano 3D printing device to generate nanoscale microsphere colloids, which are then used to fill the area where the wafer to be filled is located. This effectively controls the height difference between the filling colloid and the original surface encapsulation colloid layer, thereby ensuring that the surface encapsulation colloid layer of the repaired display module remains flat, while effectively guaranteeing the display performance of the display module.

[0069] S303, detect whether the height difference between the filling colloid height and the reference colloid height in the area where the wafer to be filled is located is within a preset threshold range.

[0070] Specifically, in this embodiment, a micro-nano 3D printing device is used to print microsphere colloids to fill the area where the wafer to be filled is located, which can ensure that the height of the filling colloid is consistent with the height of the reference colloid to the greatest extent. After completing the colloid filling step, the micro-nano 3D printing device further scans the height of the filling colloid at the wafer to be filled and the height of the reference colloid at the normal wafer, and calculates the height difference between the height of the filling colloid and the height of the reference colloid.

[0071] It should be noted that the preset threshold can be adaptively set according to the production needs of the product process in the actual application scenario. In this embodiment, the preset threshold can be set to 5nm. A height difference of 5nm cannot be identified by sight or touch. This embodiment can effectively realize the wafer filling and repair process of filling and detecting at the same time, thus ensuring the product quality of the repaired display module.

[0072] S304, if the height difference is within the preset threshold range, the repair of the display module to be repaired is confirmed to be completed.

[0073] Specifically, if the absolute value of the height difference between the reference colloid height and the filling colloid height is less than a preset threshold, it can be determined that the repair of the display module to be repaired is completed, and the repair completion indication can be displayed on the display interface of the 3D micro-nano printing equipment or terminal.

[0074] The aforementioned fixed-point display module repair method accurately identifies the wafer to be filled in the display module by using brightness measurement. It then generates sufficient microsphere colloid based on 3D micro-nano printing equipment to fill the area where the wafer is located, achieving automated repair of defective wafers in the display module and effectively improving repair efficiency. Furthermore, the display module repair method provided in this embodiment can also detect the dimensional parameters of the area where the wafer is to be filled in real time, thereby enabling real-time monitoring of the colloid filling progress and effect. This allows for a wafer filling repair step that involves monitoring while filling, ensuring that the height of the filled colloid and the reference colloid height remain within a preset threshold range, thus improving the repair quality of the display module.

[0075] In one embodiment, such as Figure 4 As shown, the method for maintaining a fixed-point display module also includes:

[0076] S305, if the height difference is not within the preset threshold range, continue to execute the step of filling the area of ​​the wafer to be filled based on the preset microsphere colloid.

[0077] Specifically, in this embodiment, during the process of filling the area of ​​the wafer to be filled with microsphere colloid using the colloid printing equipment, the 3D micro-nano printing equipment scans the dimensional parameters of the area of ​​the wafer to be filled in real time, and specifically identifies the filling colloid height and the reference colloid height. The filling colloid height is the height of the colloid already filled in the area of ​​the wafer to be filled with microsphere colloid, and the reference colloid height is the height of the colloid layer on the surface of the normal wafer area.

[0078] If, during the filling process, the height difference between the reference colloid height and the filling colloid height does not fall within the preset threshold range, the 3D micro-nano printing equipment will continue to print the corresponding preset microsphere colloid to fill the area where the wafer to be filled is located.

[0079] In one embodiment, when the 3D micro / nano printing device fills the area of ​​the wafer to be filled based on a preset microsphere colloid, it fills the area according to different batches of the preset microsphere colloid. Each batch of preset microsphere colloid will fill one layer of the area of ​​the wafer to be filled. The layer of colloid filled based on one batch of preset microsphere colloid is less than the total height of the colloid in the area of ​​the wafer to be filled.

[0080] At this point, after each batch of preset microsphere colloids has filled the area where the wafer to be filled is located, the 3D micro-nano printing equipment will perform an environmental scan of the area where the wafer to be filled is located and determine whether the height of the filling colloid and the height of the reference colloid in the area where the wafer to be filled is located are within the preset threshold range.

[0081] In one embodiment, such as Figure 5 As shown, S301 also includes:

[0082] S501, the maintenance display module is lit.

[0083] S502 detects the brightness of all display chips in the display module under repair.

[0084] S503 identifies the display chip with the highest brightness as the chip to be filled.

[0085] In a specific embodiment, the 3D printing equipment provided in this embodiment has a nano-image recognition function, which can accurately identify the coordinates of bad pixels on the display chip.

[0086] In practical applications, by simultaneously illuminating all the display chips in the display module under repair, the 3D printing equipment can detect the brightness of all display chips according to a preset recognition order and identify the display chip with the highest brightness as the chip to be filled. Specifically, this can be achieved by controlling the power-on of the display module under repair to illuminate all the display chips in it.

[0087] In a specific embodiment, after identifying one wafer to be filled, steps S501-S503 can be repeated to identify multiple wafers to be filled. It should be noted that if no wafer is found after executing steps S501-S503, it indicates that the module to be repaired has been repaired or the brightness recognition function of the 3D printing equipment is malfunctioning. Users can determine whether the brightness recognition function of the 3D printing equipment is malfunctioning based on the actual state of the module to be repaired in the actual application scenario.

[0088] Specifically, in one embodiment, when determining the chip to be filled, the brightness difference between the brightness of each display chip and the reference brightness can be compared sequentially. If the brightness difference between the brightness of the display chip and the reference brightness exceeds a preset brightness threshold, the display chip can be determined as the chip to be filled.

[0089] In one embodiment, such as Figure 6 As shown in Figure S301, the maintenance method for the fixed-point display module also includes:

[0090] S601, obtain the spatial dimensions of the area where the wafer to be filled is located, where the spatial dimensions include the filling area and the filling height.

[0091] S602, determine the target colloid diameter of the preset microsphere colloid based on the filling height.

[0092] S603, determine the target colloid quantity of the preset microsphere colloid based on the filling area and the target colloid diameter.

[0093] S604 generates multiple preset microsphere colloids based on the target colloid diameter and the target colloid quantity.

[0094] In a specific embodiment, the 3D micro-nano printing device calculates the target colloid diameter and the number of target colloids to be generated based on the spatial dimensions of the area where the wafer to be filled is located.

[0095] The target colloid diameter is the colloid diameter that matches the filling height of the preset microsphere colloid to the current spatial size, where the filling height is the required filling colloid height for the area where the wafer to be filled is located.

[0096] The target colloid quantity is the number of colloids that match the filling area of ​​the current space size using the preset microsphere colloid. The filling area is the area of ​​the colloid filling completely filled by the preset microsphere colloid in the area where the wafer to be filled is located.

[0097] In a specific embodiment, a corresponding program can be pre-configured in the 3D micro-nano printing device to calculate the target colloid diameter and target colloid quantity of the preset microsphere colloid based on the spatial dimensions of the wafer to be filled obtained by scanning, and generate microsphere colloids with the corresponding target colloid diameter and target colloid quantity.

[0098] In one embodiment, such as Figure 7 As shown, S302 also includes:

[0099] S701, detect whether the difference between the actual diameter of the preset microsphere colloid and the diameter of the target colloid is within the preset error range.

[0100] S702, if the size difference is within the preset error range, fill the area where the wafer to be filled is with the preset microsphere colloid.

[0101] S703 uses ultraviolet light to irradiate the area where the wafer to be filled is located for a preset time to solidify the colloid in the area where the wafer to be filled is located.

[0102] In a specific embodiment, when the 3D micro-nano printing equipment uses the printed preset microsphere colloid to fill the area where the wafer to be filled is located, it is necessary to further determine whether the printed size of the preset microsphere colloid is the colloid size printed according to the set value. The set value is the target colloid diameter calculated by the 3D micro-nano printing equipment based on the spatial dimensions of the area where the wafer to be filled is located.

[0103] Specifically, the dimensional difference between the actual diameter of the printed microsphere colloid and the target colloid diameter is used to determine whether the preset microsphere colloid meets the requirements. The preset error range can be adaptively set according to the needs of the actual application scenario. In one embodiment, the preset error range is ±5%, that is, the dimensional tolerance between the actual colloid diameter and the target colloid diameter is ±5%.

[0104] When using a pre-set microsphere colloid to fill the area where the wafer is to be filled, it is also necessary to irradiate the colloid in the area where the wafer is to be filled with an ultraviolet lamp (UV lamp) at any time to cure the adhesive.

[0105] In practical applications, after each batch of pre-set microsphere colloid is filled with one layer of colloid, the area where the wafer to be filled is located is irradiated with UV light for a preset time to cure the adhesive in the area where the wafer is located. Specifically, the preset time can be adaptively set according to the actual application scenario, and this embodiment does not limit it.

[0106] In one embodiment, such as Figure 8 As shown, following S703, the maintenance method for the fixed-point display module also includes:

[0107] S801, detect whether the height difference between the height of the filling colloid in the area where the wafer to be filled is located and the height of the reference colloid is within a preset threshold range;

[0108] S802, if the height difference is within the preset threshold range, the repair of the display module to be repaired is confirmed to be completed;

[0109] S803, if the height difference is not within the preset threshold range, continue to execute the step of obtaining the spatial dimensions of the area where the wafer to be filled is located.

[0110] In a specific embodiment, irradiating the area of ​​the wafer to be filled with a UV lamp once does not necessarily mean that the area has been completely filled with colloid. At this point, the 3D micro-nano printing equipment needs to further detect whether the height difference between the filling colloid height and the reference colloid height meets a preset threshold range. If it meets the preset threshold range, it means that the repair of the display module to be repaired has been completed. If it does not meet the preset threshold range, it is necessary to continue printing the corresponding preset microsphere colloid to fill the area of ​​the wafer to be filled, in order to achieve multiple cyclic filling steps.

[0111] In summary, this embodiment proposes a method for repairing point-of-care display modules. It accurately identifies defective pixels on the display chip based on brightness or colloid height differences, and uses 3D printing equipment to identify the spatial dimensions of the area where the chip to be filled is located. Based on these dimensions, it generates corresponding preset microsphere colloids, enabling colloid filling tailored to the specific filling requirements of each defective pixel. During the colloid filling process, the preset microsphere colloids are cyclically printed and cured using UV light, ensuring that the height difference between the filled colloid and the reference colloid falls within a preset threshold range. This eliminates the need for polishing the filled colloid, resulting in a smooth and flat surface colloid encapsulation layer. This method effectively improves the efficiency and quality of colloid filling, ensuring that the repaired display module meets product quality requirements.

[0112] like Figure 9As shown in a more detailed embodiment, when a defective LED chip appears in the COB LED display module, the encapsulation layer colloid at the defective LED chip is first removed using a preset thinning process. The defective LED chip is then repaired and replaced, and the new LED chip is soldered onto the PCB board. Afterward, the repaired COB LED display module is powered on, and a micro-nano 3D printing device is used to identify the defective LED chip, i.e., the area where the chip to be filled is located. The micro-nano 3D printing device prints microsphere colloids that conform to the dimensions of the area where the chip to be filled is located, and fills the area based on the microsphere colloids. During the filling process, UV light is used to cure the filling colloid. When the height difference between the filling colloid height and the reference colloid height in the area to be filled, as identified by the micro-nano 3D printing device, falls within a preset threshold range, it is determined that after replacing the LED chip, the printed filling colloid at the defective LED chip location in the COB LED display module is flush with the original colloid, and the COB LED display module repair is complete.

[0113] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0114] Based on the same inventive concept, this application also provides a fixed-point display module repair device for implementing the fixed-point display module repair method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more fixed-point display module repair device embodiments provided below can be found in the limitations of the fixed-point display module repair method described above, and will not be repeated here.

[0115] In one embodiment, such as Figure 10 As shown, a fixed-point display module repair device 1000 is provided, including: a filling determination module 1010, a filling module 1020, a detection module 1030, and a repair determination module 1040, wherein:

[0116] The filling determination module 1010 is used to determine the chip to be filled in the display module to be repaired;

[0117] The filling module 1020 is used to fill the area where the wafer to be filled is located based on a preset microsphere colloid.

[0118] The detection module 1030 is used to detect whether the height difference between the height of the filling colloid in the area where the wafer to be filled is located and the height of the reference colloid is within a preset threshold range;

[0119] The maintenance determination module 1040 is used to determine that the maintenance of the display module to be maintained is completed if the height difference is within a preset threshold range.

[0120] In one embodiment, the maintenance determination module 1040 is further configured to continue executing the step of filling the area where the wafer to be filled is located based on the preset microsphere colloid if the height difference does not fall within a preset threshold range.

[0121] In one embodiment, the filling determination module 1010 is further configured to: illuminate the display module to be repaired; detect the brightness of all display chips in the display module to be repaired; and determine the display chip with the highest brightness as the chip to be filled.

[0122] In one embodiment, the colloid printing module is used to obtain the spatial dimensions of the area where the wafer to be filled is located, wherein the spatial dimensions include the filling area and the filling height; determine the target colloid diameter of the preset microsphere colloid based on the filling height; determine the target colloid quantity of the preset microsphere colloid based on the filling area and the target colloid diameter; and generate multiple preset microsphere colloids based on the target colloid diameter and the target colloid quantity.

[0123] In one embodiment, the filling module 1020 is further configured to detect whether the size difference between the actual colloid diameter and the target colloid diameter of the preset microsphere colloid is within a preset error range; if the size difference is within the preset error range, the preset microsphere colloid is filled into the area where the wafer to be filled is located; and ultraviolet light is used to irradiate the area where the wafer to be filled is located for a preset time to cure the colloid in the area where the wafer to be filled is located.

[0124] In one embodiment, the repair determination module 1040 is further configured to detect whether the height difference between the height of the filling colloid in the area where the wafer to be filled is located and the height of the reference colloid is within a preset threshold range; if the height difference is within the preset threshold range, the repair of the display module to be repaired is determined to be completed; if the height difference is not within the preset threshold range, the step of obtaining the spatial dimensions of the area where the wafer to be filled is located is continued.

[0125] Each module in the aforementioned fixed-point display module repair device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0126] In one embodiment, a fixed-point display module repair device is provided. This device can be a micro / nano 3D printing device, and its internal structure diagram can be as follows: Figure 11 As shown. The fixed-point display module repair equipment includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a fixed-point display module repair method. The display unit of the fixed-point display module repair equipment forms a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the point display module repair equipment can be a touch layer covering the display screen, or a button, trackball, or touchpad set on the shell of the point display module repair equipment, or an external keyboard, touchpad, or mouse, etc.

[0127] Those skilled in the art will understand that Figure 11 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the fixed-point display module repair equipment to which the present application is applied. The specific fixed-point display module repair equipment may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0128] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the fixed-point display module repair method in the above method embodiment.

[0129] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the fixed-point display module maintenance method in the above method embodiment.

[0130] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0131] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0132] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for repairing a fixed-point display module, characterized in that, The method includes: Identify the chip to be filled in the display module under repair; The area where the wafer to be filled is located is filled based on a preset microsphere colloid; Detect whether the height difference between the filling colloid height and the reference colloid height in the area where the wafer to be filled is located falls within a preset threshold range; If the height difference falls within a preset threshold range, the repair of the display module to be repaired is determined to be complete.

2. The method according to claim 1, characterized in that, The method further includes: If the height difference is not within the preset threshold range, continue to execute the step of filling the area of ​​the wafer to be filled based on the preset microsphere colloid.

3. The method according to claim 1, characterized in that, The process of determining the chip to be filled in the display module to be repaired includes: Light up the display module to be repaired; Detect the brightness of all display chips in the display module to be repaired; The display chip with the highest brightness is identified as the chip to be filled.

4. The method according to claim 1, characterized in that, After determining the chip to be filled in the display module to be repaired, the method further includes: Obtain the spatial dimensions of the region where the wafer to be filled is located, wherein the spatial dimensions include the filling area and the filling height; The target colloid diameter of the preset microsphere colloid is determined based on the filling height. The number of target colloids in the preset microsphere colloid is determined based on the filling area and the target colloid diameter. Multiple preset microsphere colloids are generated based on the target colloid diameter and the target colloid quantity.

5. The method according to claim 4, characterized in that, The minimum colloidal diameter of the preset microsphere colloid is 2 nm, and the maximum colloidal diameter of the preset microsphere colloid is 1000 nm.

6. The method according to claim 4, characterized in that, The process of filling the region of the wafer to be filled with a preset microsphere colloid includes: Detect whether the difference between the actual colloidal diameter of the preset microsphere colloid and the target colloidal diameter falls within a preset error range; If the size difference is within the preset error range, the preset microsphere colloid will be filled into the area where the wafer to be filled is located; The area where the wafer to be filled is located is irradiated with ultraviolet light for a preset time to solidify the colloid in the area where the wafer to be filled is located.

7. The method according to claim 6, characterized in that, After detecting whether the height difference between the filling colloid height and the reference colloid height in the region where the wafer to be filled is located falls within a preset threshold range, the method further includes: If the height difference is not within the preset threshold range, continue to execute the step of obtaining the spatial dimensions of the area where the wafer to be filled is located.

8. A fixed-point display module repair device, characterized in that, The device includes: The filling determination module is used to determine the wafers to be filled in the display module to be repaired; A filling module is used to fill the area where the wafer to be filled is located based on a preset microsphere colloid; The detection module is used to detect whether the height difference between the filling colloid height and the reference colloid height in the area where the wafer to be filled is located is within a preset threshold range; The maintenance determination module is used to determine that the maintenance of the display module to be maintained is completed if the height difference is within a preset threshold range.

9. A fixed-point display module repair device, comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the fixed-point display module maintenance method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the fixed-point display module maintenance method according to any one of claims 1 to 7.

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