A thick film multi-tab integrated ceramic substrate and a manufacturing method thereof

Abstract

The application discloses a thick-film multi-plate integrated ceramic substrate and a manufacturing method thereof. The thick-film multi-plate integrated ceramic substrate comprises a ceramic substrate frame (1) with two perpendicular positioning edges (2), a group of through holes (3) arranged in the ceramic substrate frame (1), and a circuit substrate (4) arranged in each through hole (3). The edge of the circuit substrate (4) is fixedly connected with the corresponding through hole (3) through at least two connecting parts (5). Each circuit substrate (4) has a certain size relationship with each positioning edge (2). The circuit substrate (4) is a circuit forming substrate provided with electronic components. The application solves the consistency problem of printing registration patterns through a process edge and an alignment symbol. The multi-plate structure eliminates the positioning error of a single substrate. A plurality of single plates are positioned at a time during one-time pattern printing, single plate resistance automatic laser fine adjustment is realized, the spacing between circular substrates is set through a laser fine adjustment program, and first-end-to-last-end connection multi-plate uninterrupted automatic fine adjustment is realized.

Description

Technical Field

[0001] This invention belongs to the field of thick-film integrated circuit manufacturing technology, specifically relating to a thick-film multi-layer integrated ceramic substrate and its manufacturing method. Background Technology

[0002] Currently, the main manufacturing process for a single thick film substrate is as follows: single-piece photoplotting pattern, single-piece screen printing, manually rotating the substrate to find the two fixed points of the camera, manually fine-tuning the cross coordinates of the screen printing machine, and then printing the single piece. The second layer of printing also needs to follow the alignment direction of the first layer of printing to ensure that the second layer of printing pattern is aligned with the first layer of pattern. According to the design requirements, the pattern is registered multiple times and printed multiple times. Laser trimming: A single substrate is placed on the worktable, edge-positioned, and vacuum-adhesive. The XY position and level of the worktable are adjusted according to the placement of each substrate to ensure the laser trimming probe card contacts the pads in the pattern for testing, and to locate the laser cut coordinates for each resistor. The worktable position for each substrate must match its printed position for the probe card to land on the corresponding pad. However, in reality, the printed positions of each substrate have some error, making laser alignment impossible. The coordinates of each resistor must be changed. Therefore, after edge positioning of each circular substrate on the worktable, the level of the worktable must be adjusted each time to ensure the substrate is level, and then the worktable position must be adjusted again to ensure accurate probe placement. This means that the coordinates of each resistor in the previous laser program need to be manually repositioned (stepped), meaning the trimming coordinates of each resistor must be manually set sequentially. Because of these level adjustments, the probe contact is inconsistent. Furthermore, the inconsistent starting cuts of the laser trimming resistors due to each adjustment of the resistor positioning coordinates in the program lead to inaccurate testing, inaccurate resistance values, and even incorrect or missed cuts.

[0003] After laser trimming is completed, a single film-forming substrate is placed on the substrate stage and fixed with a positioning fixture. Then, the angle of the substrate is adjusted and positioned. The fixture base is rotated to find the appropriate placement angle for each component, and the components are individually picked up and placed. Then, the substrates are placed and bonded. Finally, testing and packaging are performed.

[0004] As can be seen from the above manufacturing process, each process step of a single substrate requires repositioning. For some irregularly shaped ceramic substrates, due to their irregular outer contours, even positioning with straight edges or notches can easily lead to problems of inconvenience and inaccuracy. When the above-mentioned processes are repeated for positioning, positioning errors will inevitably accumulate, affecting product quality and processing efficiency. In particular, the laser trimming process has even higher requirements for positioning accuracy; even a slight difference in positioning accuracy will affect trimming performance and efficiency.

[0005] Existing technologies primarily improve the positioning accuracy of thick-film substrates by fabricating positioning fixtures. For example, Chinese patent document CN113942288A discloses a method for manufacturing a high-temperature resistant continuous printing fixture based on a circular substrate thick-film printing design. This method achieves accurate substrate positioning by setting figure-eight positioning posts in the fixture. However, since thick-film substrates of different specifications have different contours, corresponding positioning fixtures need to be fabricated, which also increases processing costs. Summary of the Invention

[0006] To address the shortcomings of the aforementioned technical problems, this invention provides a thick-film multi-layer integrated ceramic substrate and its fabrication method.

[0007] The present invention adopts the following technical solution: A thick-film multi-layer integrated ceramic substrate includes a ceramic substrate frame, characterized in that: the outer contour of the ceramic substrate frame has two perpendicular positioning edges, a set of through holes are provided in the ceramic substrate frame, each through hole is provided with a circuit substrate, the edge of the circuit substrate is integrally fixedly connected to the corresponding through hole through at least two connecting parts, each circuit substrate and each positioning edge have a defined dimensional relationship; the circuit substrate is a circuit-formed substrate with electronic components. Furthermore, the outer contour of the ceramic substrate frame is rectangular, and its two adjacent vertical sides are positioning sides.

[0008] Furthermore, the circuit board is circular, and each circuit board has four interconnected connection parts evenly distributed around its center.

[0009] Furthermore, the connecting portion is a semi-cut point left by discontinuous cutting along the outline of the circuit board.

[0010] Furthermore, the surface of the ceramic substrate frame is provided with alignment marks, which have a defined dimensional relationship with each circuit board.

[0011] This application also provides a method for fabricating a thick-film multi-layer integrated ceramic substrate, which includes the following steps: S1. According to the design layout, multiple blank ceramic substrates are cut and manufactured. The two adjacent vertical edges of the ceramic substrate frame are precision machined to form positioning edges. At the same time, alignment marks are printed on the ceramic substrate frame. The alignment marks and positioning edges have a specific dimensional relationship with each circuit board. S2. Multiple screen printing processes are performed on multiple blank ceramic substrates, followed by drying and sintering to form printed circuits and film elements with certain electrical functions. S3. Perform laser trimming: 1) Position the ceramic substrates using two positioning edges and alignment marks, while adjusting the worktable to ensure that the multi-piece ceramic substrates meet the corresponding positional requirements; 2) Import the dimensional relationship between the alignment mark and each circuit board into the laser trimming device in a programmed manner, run the laser trimming device, and perform laser trimming.

[0012] S4. Use a conventional automatic chip mounter for chip mounting and a conventional automatic bonding machine for wire bonding.

[0013] Furthermore, during laser trimming, the program can determine whether a single resistor is qualified. The laser automatically marks an R pattern on unqualified single resistors. Single resistors with marked R patterns will not be attached or bonded in subsequent bonding and assembly processes.

[0014] Compared with existing technologies, the present invention has the following advantages: 1. This solution addresses the issue of print registration consistency by using process edges and alignment marks. The multi-piece structure eliminates errors from multiple positioning operations on a single substrate. Multiple individual pieces are positioned simultaneously during a single print run, enabling not only automatic laser fine-tuning of individual resistors but also, through a laser fine-tuning program, setting the spacing between circular substrates to achieve uninterrupted automatic fine-tuning of multiple interconnected pieces.

[0015] 2. The connection part not only enables multiple substrates to form a continuous structure, but also effectively resists the downward deformation during the printing and laser trimming process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of a thick-film multi-layer integrated ceramic substrate according to the present invention; Figure 2 This is a schematic diagram of step 1 of the method for manufacturing a thick-film multi-layer integrated ceramic substrate according to the present invention; Figure 3 This is a schematic diagram of step 2 of the method for manufacturing a thick-film multi-layer integrated ceramic substrate according to the present invention.

[0017] Explanation of reference numerals in the attached drawings: 1. Ceramic substrate frame; 2. Positioning edge; 3. Through hole; 4. Circuit board; 5. Connecting part; 6. Alignment mark; 7. Half-cut point. Detailed Implementation

[0018] To make the present invention clearer, the following description, in conjunction with the accompanying drawings, further illustrates a thick-film multi-layer integrated ceramic substrate and its fabrication method. The specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention.

[0019] like Figure 1As shown, a thick-film multi-layer integrated ceramic substrate includes a rectangular ceramic substrate frame 1. Two adjacent vertical sides of the ceramic substrate frame 1 serve as positioning edges 2. A set of through-holes 3 are equidistantly arranged within the ceramic substrate frame 1. Each through-hole 3 houses a circuit board 4. The shape of the through-hole 3's opening is matched to the shape of the circuit board 4, and the opening size of the through-hole 3 is slightly larger than the size of the circuit board 4. The circuit board 4 can be a conventional rectangular or square shape, or an irregularly shaped contour with an arc surface. In this embodiment, the circuit board 4 has a circular contour with a straight edge for positioning on one side. Here, the circuit board 4 is a ceramic substrate, formed into a post-film substrate through processes such as printing, resistivity adjustment, surface mounting, and bonding.

[0020] Four connecting parts 5 are integrally fixedly connected to the corresponding through holes 3 along the outline edge of the circuit board 4. The connecting parts 5 are evenly distributed around the center of the circuit board 4. The connecting parts 5 are semi-cutting points 7 left by discontinuous cutting along the outline of the circuit board 4. For example, the thickness of the semi-cutting point 7 area is half the thickness of the ceramic substrate, which facilitates the separation of individual boards by laser scanning after the finished product is processed, and the cutting of each circuit board 4 for assembly and testing.

[0021] Each circuit board 4 has a defined dimensional relationship with each positioning edge 2. Inputting these dimensional relationships into the automated production equipment for the circuit boards ensures accurate and rapid positioning of each circuit board 4. In addition, an alignment symbol 6 is provided on the surface of the ceramic substrate frame 1. The alignment symbol 6 has a defined dimensional relationship with each circuit board 4, further improving the positioning accuracy of each circuit board 4.

[0022] The method for manufacturing this structure includes the following steps: S1, such as Figure 2 As shown, according to the design layout, nine blank ceramic substrates are cut and manufactured, and the surface of the blank ceramic substrates is required to meet the flatness requirements. The ceramic substrate has a ceramic substrate frame 1 and nine through holes 3, with a circular blank substrate discontinuously connected within each through hole 3. Two adjacent vertical edges of the ceramic substrate frame 1 are precision machined to form positioning edges 2. Simultaneously, alignment marks 6 are printed on the ceramic substrate frame 1. Both the alignment marks 6 and the positioning edges 2 have a defined dimensional relationship with each circuit board 4.

[0023] S2, such as Figure 3 As shown, according to the design layout, nine blank ceramic substrates are screen printed multiple times, and then dried and sintered to form printed circuits and film elements with certain electrical functions, such as wire loops, resistive film elements, capacitive film elements, and inductive film elements.

[0024] S3. Perform laser trimming: 1) Position and fix the ceramic substrate frame 1 with the two positioning edges 2 and the alignment symbol 6, and adjust the XY position and level of the worktable until the nine ceramic substrates meet the corresponding position requirements. 2) Based on the dimensional relationship between the alignment mark 6 and each circuit board 4, the data is imported into the laser trimming device in a programmed manner, and the laser trimming device is run to perform laser trimming; During laser fine-tuning, the program can determine whether the circular unit resistor is qualified. The laser automatically marks the R pattern on the unqualified single piece. In the subsequent bonding and bonding processes, the single piece with the marked R pattern will not be attached or bonded.

[0025] S4. A conventional automatic placement machine is used for chip mounting, and a conventional automatic bonding machine is used for wire bonding to form... Figure 1 The structure shown.

[0026] After the above-mentioned thick film multi-layer integrated ceramic substrate is prepared, it is split by tooling (or by laser scanning of the four half-splitting points of each circular substrate to separate the plates), and finally assembled and tested as a single piece.

[0027] The above embodiments of the present invention are merely examples for clearly illustrating the present invention and are not intended to limit the implementation of the present invention. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. However, obvious variations or modifications derived from the essential spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A thick-film multi-layer integrated ceramic substrate, comprising a ceramic substrate frame (1), characterized in that: The outer contour of the ceramic substrate frame (1) has two perpendicular positioning edges (2). A set of through holes (3) is provided inside the ceramic substrate frame (1). A circuit board (4) is provided in each through hole (3). The edge of the circuit board (4) is integrally fixedly connected to the corresponding through hole (3) through at least two connecting parts (5). Each circuit board (4) and each positioning edge (2) have a defined dimensional relationship. The circuit board (4) is a circuit-formed substrate with electronic components. The outer contour of the ceramic substrate frame (1) is rectangular, and its two adjacent vertical sides are positioning sides (2). The circuit board (4) is circular, and each circuit board (4) has four interconnected connecting parts (5) evenly distributed around its center. The connecting part (5) is a half-cut point (7) left by discontinuous cutting along the outline of the circuit board (4). The surface of the ceramic substrate frame (1) is provided with an alignment mark (6), and the alignment mark (6) has a defined dimensional relationship with each circuit board.

2. The method for fabricating a thick-film multi-layer integrated ceramic substrate according to claim 1, characterized in that, Includes the following steps: S1. According to the design layout, multiple blank ceramic substrates are cut and made. The two adjacent vertical sides of the ceramic substrate frame (1) are finely processed to form positioning edges (2). At the same time, alignment marks (6) are printed on the ceramic substrate frame (1). The alignment marks (6) and positioning edges (2) have a definite dimensional relationship with each circuit board (4). S2. Multiple screen printing processes are performed on multiple blank ceramic substrates, followed by drying and sintering to form printed circuits and film elements with certain electrical functions. S3. Perform laser trimming: 1) Position the ceramic substrates by using two positioning edges (2) and alignment marks (6), and adjust the worktable to make the multi-piece ceramic substrates meet the corresponding position requirements. 2) Import the dimensional relationship between the alignment mark (6) and each circuit board (4) into the laser trimming device in a programmed manner, run the laser trimming device, and perform laser trimming; S4. Use a conventional automatic chip mounter for chip mounting and a conventional automatic bonding machine for wire bonding.

3. The method for fabricating a thick-film multi-layer integrated ceramic substrate according to claim 2, characterized in that: During laser trimming, the program can determine whether a single resistor is qualified. The laser automatically marks an R pattern on the unqualified single piece. The single piece with the marked R pattern will not be attached or bonded in the subsequent bonding and bonding processes.

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