A silicon wafer collecting device and a silicon wafer sorting system

Abstract

The application provides a silicon wafer collecting device and a silicon wafer sorting system, which comprises a main conveying line, a box conveying line, a basket conveying line, a first collecting mechanism, a second collecting mechanism, a first AGV transfer mechanism and a second AGV transfer mechanism. The main conveying line is provided with a first discharging station and a second discharging station. The box conveying line and the first discharging station are provided with a first wafer collecting station, and the box conveying line is connected with the first AGV transfer mechanism. The basket conveying line and the second discharging station are provided with a second wafer collecting station, and the basket conveying line is connected with the second AGV transfer mechanism. The first collecting mechanism carries the full NG silicon wafer box to the box conveying line, and the box conveying line conveys the box to the first AGV transfer mechanism. The second collecting mechanism transfers the full qualified silicon wafer basket to the basket conveying line, and the basket conveying line conveys the basket to the second AGV transfer mechanism. The application realizes the automatic connection of the silicon wafer collecting device, the NG silicon wafer recycling station and the silicon wafer processing station, and improves the silicon wafer processing efficiency.

Description

Technical Field

[0001] This application relates to the field of battery production, specifically a silicon wafer receiving device and a silicon wafer sorting system. Background Technology

[0002] After the silicon wafers are sorted and inspected, they are divided into qualified wafers and NG wafers according to the inspection results. Then, according to the type of silicon wafer, qualified wafers and NG wafers are collected into different material boxes.

[0003] Currently, after the traditional silicon wafer collecting device completes the sorting and collecting of silicon wafers, qualified wafers are generally removed from the cassettes and sent to the downstream silicon wafer processing station, while NG wafers are removed from the cassettes and sent to the silicon wafer recycling station. The manual transfer method between the silicon wafer collecting device and the downstream silicon wafer processing station and NG silicon wafer recycling station reduces production efficiency. Summary of the Invention

[0004] A silicon wafer receiving device includes a main conveyor line, a material box conveyor line, a material basket conveyor line, a first receiving mechanism, a second receiving mechanism, a first AGV transfer mechanism, and a second AGV transfer mechanism, wherein:

[0005] The main conveyor line is configured to transport silicon wafers that have completed inspection, including NG silicon wafers and qualified silicon wafers. The main conveyor line has a first unloading station and a second unloading station on its conveying path.

[0006] The material box conveyor line is located at least partially on the side of the first unloading station, and a first receiving station is set between the material box conveyor line and the first unloading station. The material box conveyor line is connected to the first AGV transfer mechanism.

[0007] The material basket conveyor line is located on the side of the second unloading station. A second receiving station is set between the material basket conveyor line and the second unloading station. The material basket conveyor line is connected to the second AGV transfer mechanism.

[0008] The first receiving mechanism is configured to receive NG silicon wafers delivered to the first unloading station into a cassette located at the first receiving station, and to transport the cassette full of NG silicon wafers to a cassette conveyor line. The cassette conveyor line is configured to transport the cassette full of NG silicon wafers to a first AGV transfer mechanism. The first AGV transfer mechanism is configured to transfer the received cassette full of NG silicon wafers to the subsequent NG silicon wafer recycling station.

[0009] The second receiving mechanism is configured to insert qualified silicon wafers conveyed to the second unloading station into a basket located at the second receiving station, and to transfer the basket full of qualified silicon wafers to a basket conveyor line. The basket conveyor line is configured to convey the basket full of qualified silicon wafers to a second AGV transfer mechanism, and the second AGV transfer mechanism is configured to transfer the received basket full of qualified silicon wafers to the downstream silicon wafer processing station.

[0010] By setting up a first AGV transfer mechanism and a second AGV transfer mechanism, the NG silicon wafers and qualified silicon wafers that have completed classification and collection can be automatically transported to the NG silicon wafer recycling station and the silicon wafer processing station, respectively. This realizes the automated docking of the silicon wafer collection device with the NG silicon wafer recycling station and the subsequent silicon wafer processing station, which greatly improves the processing efficiency of silicon wafers.

[0011] In some embodiments, the first AGV transfer mechanism is further configured to transfer empty boxes to a box conveyor line, and the first receiving mechanism is further configured to transport empty boxes on the box conveyor line to a first receiving station; the second AGV transfer mechanism is further configured to transfer empty baskets to a basket conveyor line.

[0012] By utilizing the cooperation of the first AGV transfer mechanism and the first receiving mechanism, the empty material boxes that have been removed are recycled back to their original state, and by utilizing the second AGV transfer mechanism, the empty material baskets that have been removed are recycled back to their original state, thereby further improving the processing efficiency of silicon wafers.

[0013] In some embodiments, the first receiving mechanism includes a receiving assembly and a conveying assembly. The receiving assembly is configured to reverse and transfer NG silicon wafers delivered to the first unloading station to a cassette located at the first receiving station. The conveying assembly is configured to convey a cassette full of NG silicon wafers at the first receiving station to a cassette conveyor line, and to convey an empty cassette from the cassette conveyor line to the first receiving station.

[0014] Through the cooperation of the receiving assembly and the transport assembly, the receiving assembly achieves the following: after receiving the NG silicon wafers into the cassette of the first receiving station, the cassette full of NG silicon wafers is transported to the cassette conveyor line, and the empty cassettes that are recycled are transported back to the side of the first receiving station, thereby ensuring the continuity of NG silicon wafer receiving.

[0015] In some embodiments, the receiving assembly includes a first lifting member and a first conveyor line. The first lifting member is located at a first unloading station and is configured to lift the NG silicon wafers located at the first unloading station away from the main conveyor line. The first conveyor line is disposed on the side of the first unloading station and perpendicular to the main conveyor line, and is configured to convey the NG silicon wafers that have been removed from the main conveyor line to a cassette located at the first receiving station.

[0016] A wafer receiving assembly is provided, which uses a combination of lifting and conveying to receive NG silicon wafers from the main conveyor line into the material box. This method is easy to modify based on existing sorting machines and has wide applicability.

[0017] In some embodiments, the receiving assembly includes a first suction cup and a first traverse member, the first suction cup being mounted on the first traverse member and located above the first unloading station, the first suction cup being configured to pick up NG silicon wafers located at the first unloading station and transport them to a cassette located at the first receiving station.

[0018] Another implementation of the wafer receiving assembly is provided, in which a first lateral moving member drives a first suction cup to move back and forth between a first unloading station and a first wafer receiving station, so as to directly adsorb the NG silicon wafers at the first unloading station into the material box located at the first wafer receiving station. Compared with the method of combining lifting and conveying, this further improves the wafer receiving efficiency of NG silicon wafers, thereby improving the wafer processing efficiency.

[0019] In some embodiments, the receiving assembly includes a second conveyor line and an adsorption element disposed on the second conveyor line and configured to non-contactly hold an NG silicon wafer located at a first unloading station on the second conveyor line. The second conveyor line is disposed above the first unloading station and configured to convey the NG silicon wafer held on the second conveyor line to a cassette located at the first receiving station.

[0020] Another implementation of the wafer receiving assembly is provided, which uses an adsorption element to non-contactly hold NG silicon wafers on a second conveyor line, and then transports the NG silicon wafers to a hopper located at the first receiving station via the second conveyor line. This receiving method utilizes the adsorption element on the second conveyor line to generate negative pressure along the conveying direction, adsorbing and holding the NG silicon wafers on the second conveyor line. This helps reduce the deformation of NG silicon wafers caused by negative pressure, avoiding secondary damage to the NG silicon wafers. At the same time, compared with the method of using suction cups, the wafer receiving efficiency is higher, which can further improve the silicon wafer processing efficiency.

[0021] In some embodiments, a material box conveyor line is provided on each side of the main conveyor line. Each material box conveyor line includes a receiving conveyor section, a transfer conveyor section, and a discharging conveyor section. The receiving conveyor section is located on the side of the first unloading station and parallel to the main conveyor line. A first wafer receiving station is provided between the receiving conveyor section and the first unloading station. The discharging conveyor section is located on the side of the second unloading station and is set at a different height from the second receiving mechanism. The discharging conveyor section is parallel to the main conveyor line and is connected to the first AGV transfer mechanism. The transfer conveyor section is perpendicular to the main conveyor line, and its two ends are connected to the receiving conveyor section and the discharging conveyor section, respectively. The first receiving mechanism transports the material box filled with NG silicon wafers to the receiving conveyor section. The transfer conveyor section is configured to transport the material box filled with NG silicon wafers transported by the receiving conveyor section to the discharging conveyor section. The discharging conveyor section is configured to transport the material box filled with NG silicon wafers to the first AGV transfer mechanism.

[0022] Through the coordination of the receiving conveyor section, the transfer conveyor section, and the discharging conveyor section, the material box conveyor line is connected to the first AGV transfer mechanism, which can transport the material boxes filled with NG silicon wafers into the first AGV transfer mechanism. In particular, the discharging conveyor section is located on the side of the second unloading station and at a different height from the second receiving mechanism. That is, the discharging conveyor section and the material basket conveyor line are located in the same area, which can shorten the size of the silicon wafer receiving device in this embodiment.

[0023] In addition, by setting up material box conveyor lines on both sides of the main conveyor line, the two material box conveyor lines can realize the collection and conveying of NG silicon wafers in parallel, thereby improving the collection efficiency of NG silicon wafers.

[0024] In some embodiments, the material box conveyor line includes a first-side receiving conveyor section, a second-side receiving conveyor section, a first-side transfer conveyor section, a second-side transfer conveyor section, and a converging discharge conveyor section, wherein: the first-side receiving conveyor section is located on the first side of the first unloading station and parallel to the main conveyor line; the second-side receiving conveyor section is located on the second side of the first unloading station and parallel to the main conveyor line; a first receiving station is provided between the first-side receiving conveyor section and the first unloading station, and between the second-side receiving conveyor section and the first unloading station; the converging discharge conveyor section is located below the second unloading station and parallel to the main conveyor line, and the converging discharge conveyor section is connected to a first AGV transfer mechanism; the first-side transfer conveyor section is vertically aligned with the main conveyor line. The first side transfer conveyor section is perpendicular to the main conveyor line, and its two ends are respectively connected to the first side receiving conveyor section and the confluence discharge conveyor section; the second side transfer conveyor section is perpendicular to the main conveyor line, and its two ends are respectively connected to the second side receiving conveyor section and the confluence discharge conveyor section; the first receiving mechanism transports the cassette filled with NG silicon wafers to the first side receiving conveyor section and / or the second side receiving conveyor section, and the first side transfer conveyor section and the second side transfer conveyor section respectively transport the cassette filled with NG silicon wafers transported by the first side receiving conveyor section and the second side receiving conveyor section to the confluence conveyor section, which is configured to transport the cassette filled with NG silicon wafers to the first AGV transfer mechanism.

[0025] Through the coordination of the first side receiving conveyor section, the second side receiving conveyor section, the first side transfer conveyor section, the second side transfer conveyor section, and the confluence discharge conveyor section, the material box conveyor line in this embodiment achieves docking with the first AGV transfer mechanism, which can transport the material box filled with NG silicon wafers into the first AGV transfer mechanism. In particular, the confluence discharge conveyor section is located below the second unloading station, that is, the confluence discharge conveyor section and the material basket conveyor line are located in the same area, thus reducing the size of the silicon wafer receiving device in this embodiment.

[0026] In some embodiments, the second receiving mechanism includes a second suction cup, a second traverse member, a third conveyor line, and a lifting member. The second suction cup is mounted on the second traverse member and located above the second unloading station. The second suction cup is configured to pick up qualified silicon wafers located at the second unloading station and release the qualified silicon wafers onto the third conveyor line. The third conveyor line is located on the side of the second unloading station and perpendicular to the main conveyor line. It is configured to convey qualified silicon wafers into a basket located at the second receiving station. The lifting member is configured to lift the basket located at the second receiving station upwards so that the slot of the basket is flush with the third conveyor line, so as to insert the qualified silicon wafers conveyed by the third conveyor line into the slot of the basket.

[0027] Through the cooperation of the second suction cup, the second transverse component, the third conveyor line, and the lifting component, the second receiving mechanism picks up the qualified silicon wafers that are conveyed to the second unloading station and automatically inserts the picked-up qualified silicon wafers into the slots of the material basket.

[0028] In some embodiments, the second receiving mechanism further includes a rotary drive unit, the drive end of which is connected to the second suction cup and configured to drive the second suction cup to rotate so as to release the qualified silicon wafer adsorbed by the second suction cup to the third conveyor line after rotating it 90°.

[0029] When inspecting silicon wafers for wire marks, it is necessary to ensure that the wire marks are perpendicular to the direction of silicon wafer transport. However, in the subsequent silicon wafer processing station, the wire marks are required to be parallel to the opening of the basket. By rotating the silicon wafer with a second suction cup, the angle of qualified silicon wafers can be adjusted, eliminating the need for wafer rewinding. This further improves the processing efficiency of silicon wafers and also reduces the damage to silicon wafers caused by wafer rewinding.

[0030] In some embodiments, a basket conveyor line is provided on each side of the second unloading station, and a second AGV transfer mechanism is provided at the end of each of the two basket conveyor lines; the lifting component is also configured to release the basket onto the basket conveyor line.

[0031] By setting up two basket conveyor lines and two second AGV transfer mechanisms, the collection and transfer of qualified silicon wafers can be carried out independently or interactively from both sides of the main conveyor line, thereby improving the collection efficiency of qualified silicon wafers.

[0032] In some embodiments, the silicon wafer receiving device further includes a basket buffer mechanism, which is located downstream of the basket conveyor line and connected to a second AGV transfer mechanism. The basket buffer mechanism is configured to buffer baskets filled with qualified silicon wafers and empty baskets.

[0033] By setting up a basket buffering mechanism, baskets filled with qualified silicon wafers are buffered, which further reduces the transfer frequency of the second AGV transfer mechanism and better coordinates the wafer collection efficiency of the basket with the transfer efficiency of the second AGV transfer mechanism; buffering empty baskets can provide a relatively sufficient number of empty baskets for the basket conveyor line, preventing it from affecting the wafer collection efficiency of the basket.

[0034] In some embodiments, at least four first unloading stations and at least four second unloading stations are provided on the conveying path of the main conveyor line.

[0035] By setting up at least four first unloading stations and at least four second unloading stations, the efficiency of receiving NG silicon wafers and qualified silicon wafers is further improved.

[0036] In some embodiments, the silicon wafer receiving device further includes a rotating mechanism disposed between the basket conveyor line and the second AGV transfer mechanism, the rotating mechanism being configured to rotate and reverse the direction of the basket.

[0037] By setting up a rotating mechanism, the rotation and direction of the material basket can be changed as needed.

[0038] In some embodiments, the first AGV transfer mechanism and / or the second AGV transfer mechanism include two conveying channels arranged side by side.

[0039] The first AGV transfer mechanism has two parallel conveying channels, which improves its efficiency in transferring and conveying material boxes. The second AGV transfer mechanism also has two parallel conveying channels, which improves its efficiency in transferring and conveying material baskets.

[0040] This application also provides a silicon wafer sorting system, which includes a silicon wafer detection device and a silicon wafer receiving device as described in any of the above claims, wherein:

[0041] The silicon wafer inspection device is configured to inspect silicon wafers to distinguish them into NG (non-quality) and qualified silicon wafers;

[0042] The silicon wafer receiving device is located after the silicon wafer inspection device and is configured to classify and receive NG silicon wafers and qualified silicon wafers, and to transport the received NG silicon wafers to the NG silicon wafer recycling station and the received qualified silicon wafers to the downstream silicon wafer processing station.

[0043] With the cooperation of the silicon wafer inspection device and the silicon wafer receiving device, the silicon wafer sorting system realizes the classification and receiving of NG silicon wafers and qualified silicon wafers, and automatically transfers the collected NG silicon wafers and qualified silicon wafers to the corresponding NG silicon wafer recycling station and silicon wafer processing station, which greatly improves the processing efficiency after silicon wafer sorting. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the silicon wafer receiving device in one embodiment of this application;

[0045] Figure 2 This is a schematic diagram of the silicon wafer receiving device in another embodiment of this application;

[0046] Figure 3 This is a schematic diagram of the cyclic conveying of the material box and material basket in the embodiments of this application;

[0047] Figure 4 This is a schematic diagram of the silicon wafer sorting system in the embodiments of this application;

[0048] Figure 5 This is a schematic diagram of one embodiment of the receiving component in this application.

[0049] Figures 1 to 5 Includes:

[0050] Main conveyor line 1

[0051] Material box conveyor line 2:

[0052] Material receiving conveyor section 21; transfer conveyor section 22; material discharging conveyor section 23;

[0053] First side receiving conveyor section 24, second side receiving conveyor section 25, first side transfer conveyor section 26

[0054] Second side transfer conveying section 27, converging discharge conveying section 28;

[0055] Material basket conveyor line 3;

[0056] First receiving mechanism 4:

[0057] 41 receiving assembly, 411 second conveyor line, 412 adsorption component, 42 handling assembly;

[0058] Second receiving mechanism 5:

[0059] First AGV transfer machine 6;

[0060] Second AGV transfer mechanism 7;

[0061] Silicon wafer inspection device 10, silicon wafer receiving device 20;

[0062] 100 silicon wafers, 200 material boxes, and 300 material baskets. Detailed Implementation

[0063] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0064] like Figure 1 and Figure 2 As shown, the silicon wafer receiving device provided in this embodiment includes a main conveyor line 1, a material box conveyor line 2, a material basket conveyor line 3, a first receiving mechanism 4, a second receiving mechanism 5, a first AGV transfer mechanism 6, and a second AGV transfer mechanism 7, wherein:

[0065] The main conveyor line 1 is configured to transport silicon wafers 100 that have completed inspection. The silicon wafers 100 include NG (non-performing) and qualified silicon wafers. The conveying path of the main conveyor line 1 includes a first unloading station and a second unloading station. To improve silicon wafer processing efficiency, multiple first and second unloading stations can be set up, such as... Figure 1 and Figure 2 As shown, there are 7 first unloading stations and 4 second unloading stations. Optionally, the 7 first unloading stations can accept different types of NG silicon wafers to effectively distinguish the defect types of NG silicon wafers. Optionally, the 4 second unloading stations can accept qualified wafers of the same grade to improve wafer receiving efficiency, or they can accept qualified wafers of different grades to further classify the qualified wafers.

[0066] The material box conveyor line 2 is at least partially located on the side of the first unloading station. A first receiving station is set between the material box conveyor line 2 and the first unloading station. The material box conveyor line 2 is connected to the first AGV transfer mechanism 6. Of course, when there are multiple first unloading stations, there are correspondingly multiple first receiving stations, each corresponding to one of the first unloading stations.

[0067] Optionally, a material box conveyor line is set on each side of the main conveyor line. Each material box conveyor line has a first receiving station between it and the first unloading station. When there are multiple first unloading stations, the number of first receiving stations is twice the number of first unloading stations. Figure 1 and Figure 2 As shown, there are 7 unloading stations and 14 receiving stations.

[0068] The material basket conveyor line 3 is located on the side of the second unloading station. A second receiving station is set between the material basket conveyor line 3 and the second unloading station. The material basket conveyor line 3 is connected to the second AGV transfer mechanism 7. Of course, when there are multiple second unloading stations, there are correspondingly multiple second receiving stations, each corresponding to one of the second unloading stations.

[0069] Optionally, a basket conveyor line 3 is set on each side of the main conveyor line. Each basket conveyor line 3 has a second receiving station between it and the second unloading station. When there are multiple second unloading stations, the number of second receiving stations is twice the number of the second unloading stations. For example... Figure 1 and Figure 2 As shown, there are 4 second unloading stations and 8 second receiving stations.

[0070] The first receiving mechanism 4 is configured to receive NG silicon wafers delivered to the first unloading station into a cassette 200 located at the first receiving station, and to transport the cassette 200 filled with NG silicon wafers to the cassette conveyor line 2. The cassette conveyor line 2 is configured to transport the cassette filled with NG silicon wafers to the first AGV transfer mechanism 6, and the first AGV transfer mechanism 6 is configured to transfer the received cassette filled with NG silicon wafers to the subsequent NG silicon wafer recycling station.

[0071] The second receiving mechanism 5 is configured to insert the qualified silicon wafers conveyed to the second unloading station into the basket 300 located at the second receiving station, and to transfer the basket 300 filled with qualified silicon wafers to the basket conveyor line 3. The basket conveyor line 3 is configured to convey the basket 300 filled with qualified silicon wafers to the second AGV transfer mechanism 7. The second AGV transfer mechanism 7 is configured to transfer the received basket 300 filled with qualified silicon wafers to the downstream silicon wafer processing station.

[0072] As can be seen, by setting up the first AGV transfer mechanism 6 and the second AGV transfer mechanism 7, the NG silicon wafers and qualified silicon wafers that have completed classification and collection can be automatically transported to the NG silicon wafer recycling station and the silicon wafer processing station respectively. This realizes the automated docking of the silicon wafer collection device with the NG silicon wafer recycling station and the subsequent silicon wafer processing station, which greatly improves the processing efficiency of silicon wafers.

[0073] Optionally, the first AGV transfer mechanism 6 is also configured to transfer the empty boxes back to the box conveyor line 2, thus realizing the recycling of empty boxes. Of course, the return box conveyor line 2 can also reverse the flow, thereby transporting the empty boxes back to the side of the first receiving station.

[0074] Similarly, optionally, the second AGV transfer mechanism 7 is also configured to transfer the empty basket back to the basket conveyor line 3. This achieves the recycling of the empty basket. Of course, the basket conveyor line 3 can also reverse the flow, thus transporting the empty basket back to the side of the second receiving station.

[0075] The overall efficiency of silicon wafer processing is further improved by automating the reflow of empty wafer boxes and baskets.

[0076] like Figure 4 As shown, optionally, the first receiving mechanism 4 includes a receiving assembly 41 and a conveying assembly 42. The receiving assembly 41 is configured to redirect and transfer the NG silicon wafers transported to the first unloading station on the main conveyor line 1 to the cassette 200 located at the first receiving station. The conveying assembly 42 is configured to convey the cassette full of NG silicon wafers at the first receiving station to the cassette conveyor line 2. The conveying assembly 42 is also configured to convey empty cassettes returned to their positions on the cassette conveyor line 2 to the first receiving station.

[0077] As can be seen, through the cooperation of the wafer receiving assembly 41 and the conveying assembly 42, the wafer receiving assembly 41 achieves the following: after receiving the NG silicon wafers on the main conveyor line 1 into the material box 200 of the first wafer receiving station, the material box full of NG silicon wafers is conveyed to the material box conveyor line 2, and the empty material boxes circulating back on the material box conveyor line 2 are conveyed back to the first wafer receiving station, thereby ensuring the continuity of NG silicon wafer receiving.

[0078] The wafer receiving assembly 41 can adopt various existing wafer receiving mechanisms that can collect silicon wafers from the conveyor line into the hopper. Of course, in order to improve the wafer receiving effect, the following three preferred implementation methods of the wafer receiving assembly are provided in the embodiments of this application.

[0079] The first implementation: The receiving assembly 41 includes a first lifting member and a first conveyor line, wherein the first lifting member is located at a first unloading station and is configured to lift the NG silicon wafers located at the first unloading station away from the main conveyor line 1. The first conveyor line is located on the side of the first unloading station and is perpendicular to the main conveyor line 1, and is configured to convey the NG silicon wafers that have been removed from the main conveyor line 1 into the material box 200 located at the first receiving station.

[0080] Optionally, the main conveyor line 1 includes two parallel conveyor belts. A first lifting member is disposed between the two conveyor belts of the main conveyor line 1. The first lifting member includes a lifting section and a deflector conveyor belt disposed on the lifting section. The deflector conveyor belt is perpendicular to the main conveyor line 1 and is on the same conveying path as the first conveyor line. Initially, the deflector conveyor belt is located below the two conveyor belts of the main conveyor line 1. When the NG silicon wafer is conveyed to the first unloading station, the lifting section drives the deflector conveyor belt to lift upward, thereby lifting the NG silicon wafer away from the main conveyor line 1. Then, the deflector conveyor belt conveys the NG silicon wafer onto the first conveyor line.

[0081] The wafer receiving assembly 41 uses a combination of lifting and conveying to collect NG silicon wafers from the main conveyor line 1 into the material box, which is convenient for modification based on the existing sorting machine and has wide applicability.

[0082] The second implementation method: the receiving assembly 41 includes a first suction cup and a first transverse member, wherein the first suction cup is mounted on the first transverse member and located above the first unloading station. The first suction cup is configured to pick up the NG silicon wafer located at the first unloading station and transport the picked-up NG silicon wafer to the material box 200 located at the first receiving station.

[0083] Compared to the combination of lifting and conveying, this method further improves the efficiency of receiving NG silicon wafers, thereby increasing the processing efficiency of silicon wafers.

[0084] The third implementation method: such as Figure 5As shown, the wafer receiving assembly 41 includes a second conveyor line 411 and an adsorption member 412. The adsorption member 412 is disposed on the second conveyor line and configured to non-contactly adsorb and hold the NG silicon wafer located at the first unloading station on the second conveyor line 411. The second conveyor line 411 is disposed above the first unloading station and configured to transport the NG silicon wafer held on the second conveyor line 411 to the material box 200 located at the first wafer receiving station. The NG silicon wafer is non-contactly adsorbed and held on the second conveyor line by the adsorption member, and then transported to the material box located at the first wafer receiving station by the second conveyor line. This wafer receiving method utilizes the adsorption member on the second conveyor line to generate negative pressure along the conveying direction to adsorb and hold the NG silicon wafer on the second conveyor line, which helps to reduce the deformation of the NG silicon wafer caused by the negative pressure and avoids secondary damage to the NG silicon wafer. At the same time, compared with the method of using suction cups, the wafer receiving efficiency is higher, which can further improve the processing efficiency of silicon wafers.

[0085] The following two embodiments will be used to provide an illustrative description of the structure of the material box conveying line 2 in this application and its specific conveying process of the material boxes.

[0086] First Embodiment

[0087] like Figure 1 and Figure 3 As shown, in this embodiment, the material box conveyor line 2 includes a receiving conveyor section 21, a transfer conveyor section 22, and a discharging conveyor section 23.

[0088] The receiving conveyor section 21 is located on the side of the first unloading station and parallel to the main conveyor line 1. A first receiving station is provided between the receiving conveyor section 21 and the first unloading station.

[0089] The discharge conveyor section 23 is located on the side of the second unloading station and is set at a different height from the second receiving mechanism 5. For example, the discharge conveyor section 23 is located below the second receiving mechanism 5. The discharge conveyor section 23 is parallel to the main conveyor line 1 and is connected to the first AGV transfer mechanism 6.

[0090] The transfer conveying section 22 is perpendicular to the main conveying line 1, and its two ends are connected to the receiving conveying section 21 and the discharging conveying section 23, respectively.

[0091] In this embodiment, the cassette conveyor line 2 transports cassettes filled with NG silicon wafers to the first AGV transfer mechanism 6 according to the following process:

[0092] First, the receiving conveyor section 21 receives the NG silicon wafer-filled cassette 200 transported by the first receiving mechanism 4 and then conveys the NG silicon wafer-filled cassette 200 to the transfer conveyor section 22.

[0093] Next, the transfer conveyor section 22 transports the NG silicon wafer-filled cassette 200, which was transported by the receiving conveyor section, to the discharging conveyor section 23.

[0094] Finally, the material box filled with NG silicon wafers is transported by the material discharge conveyor section 23 to the first AGV transfer mechanism 6.

[0095] As can be seen, through the cooperation of the receiving conveyor section 21, the transfer conveyor section 22, and the discharging conveyor section 23, the material box conveyor line 2 in this embodiment achieves docking with the first AGV transfer mechanism 6, which can transport the material box 200 filled with NG silicon wafers into the first AGV transfer mechanism 6. In particular, the discharging conveyor section 23 is set on the side of the second unloading station and is set at a different height from the second receiving mechanism 5. That is, the discharging conveyor section 23 and the material basket conveyor line 3 are set in the same area, thus shortening the size of the silicon wafer receiving device in this embodiment.

[0096] Optionally, the material box conveyor line 2 in this embodiment can also perform return conveying of the emptied material boxes, thereby realizing the recycling of the material boxes. The specific process is as follows:

[0097] First, the discharge conveying section 23 collects the empty material box that was transported back by the first AGV transfer mechanism 6, and then transports the empty material box to the transfer conveying section 22.

[0098] Next, the transfer conveyor section 22 transports the emptied material box to the receiving conveyor section 21.

[0099] Finally, the receiving conveyor section 21 transports the empty material box to the side of the first unloading station.

[0100] Continue to refer to Figure 1 As shown, in order to improve the efficiency of collecting NG silicon wafers, optionally, a material box conveyor line 2 is provided on each side of the main conveyor line 1. The two material box conveyor lines 2 can collect and convey NG silicon wafers in parallel from both sides of the main conveyor line 1.

[0101] Optionally, to enable the material box to transition between the receiving conveyor section 21 and the transfer conveyor section 22, and between the transfer conveyor section 22 and the discharging conveyor section 23, and to make the silicon wafer receiving device more compact, the height settings of the receiving conveyor section 21, the transfer conveyor section 22, and the discharging conveyor section 23 can be selected in several ways. For example, in one method: the receiving conveyor section 21, the transfer conveyor section 22, and the second receiving mechanism 5 are at the same height, and the discharging conveyor section 23 is designed to be lower than the height of the second receiving mechanism 5, thus offsetting the receiving of the second receiving mechanism 5. That is, the height of the discharging conveyor section 23 is lower than the height of the transfer conveyor section 22. When the material box transitions between the transfer conveyor section 22 and the discharging conveyor section 23, due to the height difference, a lifting and turning conveyor needs to be set at the docking point of the transfer conveyor section 22 and the discharging conveyor section 23. The lifting and turning conveyor can adopt the same structure as the lifting component mentioned in the previous embodiment. Method 2: The receiving conveyor section 21 and the second receiving mechanism 5 are at the same height. The discharging conveyor section 23 is designed to be lower than the height of the second receiving mechanism 5, offsetting the receiving of materials by the second receiving mechanism 5. The transfer conveyor section 22 is designed to be at the same height as the discharging conveyor section 23. A lifting and steering conveyor is installed at the junction of the receiving conveyor section 21 and the transfer conveyor section 22. Method 3: Unlike Method 1, the discharging conveyor section 23 is designed to be higher than the height of the second receiving mechanism 5. Method 4: Unlike Method 2, the transfer conveyor section 22 is designed to be higher than the height of the second receiving mechanism 5.

[0102] Optionally, in this embodiment, the first AGV transfer mechanism 6 includes two parallel conveying channels. One conveying channel is connected to the discharge conveying section 23 of the material box conveying line 2 located on the first side of the main conveying line 1, and the other conveying channel is connected to the discharge conveying section 23 of the material box conveying line 2 located on the second side of the main conveying line 1.

[0103] Second Embodiment

[0104] like Figure 2 As shown, in this embodiment, the material box conveyor line 2 includes a first side receiving conveyor section 24, a second side receiving conveyor section 25, a first side transfer conveyor section 26, a second side transfer conveyor section 27, and a confluence discharge conveyor section 28.

[0105] The first side receiving conveyor section 24 is located on the first side of the first unloading station and is parallel to the main conveyor line 1. The second side receiving conveyor section 25 is located on the second side of the first unloading station and is parallel to the main conveyor line 1. A first receiving station is provided between the first side receiving conveyor section 24 and the first unloading station, and between the second side receiving conveyor section 25 and the first unloading station.

[0106] The converging discharge conveyor section 28 is located below the second unloading station and parallel to the main conveyor line 1. The converging discharge conveyor section 28 is connected to the first AGV transfer mechanism 6.

[0107] The first side transfer conveying section 26 is perpendicular to the main conveying line 1, and the two ends of the first side transfer conveying section 26 are respectively connected to the first side receiving conveying section 24 and the confluence discharge conveying section 28.

[0108] The second side transfer conveyor section 27 is perpendicular to the main conveyor line 1, and its two ends are connected to the second side receiving conveyor section 25 and the confluence discharge conveyor section 28, respectively.

[0109] In this embodiment, the cassette conveyor line 2 transports cassettes filled with NG silicon wafers to the first AGV transfer mechanism 6 according to the following process:

[0110] First, the first receiving mechanism 4 transports the cassette filled with NG silicon wafers to the first receiving conveyor section 24 and / or the second receiving conveyor section 25.

[0111] The first receiving conveyor section 24 transports the received cassettes filled with NG silicon wafers to the first transfer conveyor section 26, while the second receiving conveyor section 25 transports the received cassettes filled with NG silicon wafers to the second transfer conveyor section 27.

[0112] Next, the first side transfer conveyor section 26 and the second side transfer conveyor section 25 respectively convey the hoppers filled with NG silicon wafers to the confluence conveyor section 28.

[0113] Finally, the hopper conveyor section 28 transports the NG silicon wafer-filled cassette to the first AGV transfer mechanism 6.

[0114] As can be seen, through the cooperation of the first side receiving conveyor section 24, the second side receiving conveyor section 25, the first side transfer conveyor section 26, the second side transfer conveyor section 27 and the confluence discharge conveyor section 28, the material box conveyor line 2 in this embodiment achieves docking with the first AGV transfer mechanism 6, thereby conveying the material box 200 filled with NG silicon wafers to the first AGV transfer mechanism 6.

[0115] Specifically, the confluence discharge conveyor section 28 is located below the second unloading station, that is, the confluence discharge conveyor section 28 and the material basket conveyor line 3 are located in the same three-dimensional area, which makes the silicon wafer receiving device structure in this embodiment more compact.

[0116] Optionally, the hopper conveyor line 2 in this embodiment can also perform return conveying of the emptied hoppers, thereby realizing the cyclical use of the hoppers. The specific process is as follows:

[0117] First, the outflow conveyor section 28 collects the empty material boxes that have been emptied and transported back by the first AGV transfer mechanism 6, and then diverts and transports the empty material boxes to the first side transfer conveyor section 26 and the second side transfer conveyor section 27.

[0118] The first side transfer conveyor section 26 transports the empty material box to the first side receiving conveyor section 24, and the second side transfer conveyor section 27 transports the empty material box to the second side receiving conveyor section 25.

[0119] The first side receiving conveyor section 24 transports the received empty boxes to the first side of the first receiving station, while the first side receiving conveyor section 25 transports the received empty boxes to the second side of the first receiving station.

[0120] Optionally, to enable the material baskets to transition between the first receiving conveyor section 24 and the first transfer conveyor section 26, between the first receiving conveyor section 25 and the second transfer conveyor section 27, between the first transfer conveyor section 26 and the outflow conveyor section 28, and between the second transfer conveyor section 27 and the outflow conveyor section 28, when there is a height difference between the aforementioned adjacent sections, a lifting and turning conveyor is provided at the joint of the adjacent sections. The lifting and turning conveyor turns and conveys the material basket on one section to the other section. The lifting and turning conveyor can adopt the same structure as the lifting member mentioned in the previous embodiment.

[0121] Optionally, in this embodiment, the first AGV transfer mechanism 6 includes two parallel conveying channels. The first AGV transfer mechanism 6 is configured to translate perpendicular to the conveying direction of the main conveyor line 1, so that the two conveying channels alternately connect with the confluence discharge conveying section 28. This improves the transfer efficiency of the material box by the first AGV transfer mechanism 6. Of course, the first AGV transfer mechanism 6 may also include only one conveying channel.

[0122] The second receiving mechanism 5 in this application can be any existing receiving mechanism capable of inserting silicon wafers from the conveyor line into the material basket. A preferred embodiment of the second receiving mechanism 5 is also provided in this application, which includes a second suction cup, a second traversing member, a third conveyor line, and a lifting member, wherein:

[0123] The second suction cup is mounted on the second transverse component and located above the second unloading station. The second suction cup is configured to pick up qualified silicon wafers located at the second unloading station and release the qualified silicon wafers to the third conveyor line.

[0124] The third conveyor line is located on the side of the second unloading station and perpendicular to the main conveyor line 1. It is configured to convey qualified silicon wafers into the basket located at the second receiving station.

[0125] The lifting mechanism is configured to raise the basket located at the second wafer receiving station, aligning the basket's slot with the third conveyor line, so that qualified silicon wafers conveyed by the third conveyor line can be inserted into the basket's slot. That is, after each silicon wafer is received, the lifting mechanism raises the basket once, ensuring the next empty slot is aligned with the third conveyor line.

[0126] As can be seen, through the cooperation of the second suction cup, the second transverse component, the third conveyor line and the lifting component, the second receiving mechanism realizes the suction of qualified silicon wafers conveyed to the second unloading station, and automatically inserts the suction of qualified silicon wafers into the slots of the material basket.

[0127] Optionally, the lifting mechanism is also configured to release a basket filled with qualified silicon wafers onto the basket conveyor line 3.

[0128] As those skilled in the art know, during silicon wafer trace inspection, the traces are perpendicular to the wafer's transport direction. That is, the traces on the silicon wafers to be collected on the main transport line 1 are perpendicular to the transport direction of the main transport line 1. However, the subsequent silicon wafer processing station requires the traces to be parallel to the opening of the basket, therefore, the angle of the silicon wafers needs to be adjusted before insertion.

[0129] To implement the angle adjustment of the silicon wafer, the second receiving mechanism 5 may optionally include a rotary drive unit, the drive end of which is connected to the second suction cup and is configured to drive the second suction cup to rotate so as to release the qualified silicon wafer adsorbed by the second suction cup to the third conveyor line after rotating it 90°.

[0130] like Figures 1 to 3 As shown, optionally, a basket conveyor line 3 is set on each side of the second unloading station, and a second AGV transfer mechanism 7 is set on the back of each of the two basket conveyor lines 3.

[0131] By setting up two basket conveyor lines 3 and two second AGV transfer mechanisms 7, the collection and transfer of qualified silicon wafers can be carried out in parallel from both sides of the main conveyor line 1, thereby improving the collection efficiency of qualified silicon wafers.

[0132] Optionally, the second AGV conveying mechanism 7 includes two parallel conveying channels. The second AGV conveying mechanism 7 is configured to translate perpendicular to the conveying direction of the main conveyor line 1, allowing the two conveying channels to alternately connect with the basket conveyor line 1. This improves the conveying efficiency of the basket by the second AGV transfer mechanism 7. Of course, the second AGV transfer mechanism 7 may also include only one conveying channel.

[0133] Optionally, the silicon wafer receiving device in this embodiment of the application further includes a basket buffer mechanism. The basket buffer mechanism is located after the basket conveyor line 3 and is connected to the second AGV transfer mechanism 7. The basket buffer mechanism is configured to buffer baskets that are full of qualified silicon wafers and empty baskets.

[0134] For example, when basket conveyor 3 transports a basket full of qualified silicon wafers to the docking end with the second AGV transfer mechanism 7, and a basket is already present at the docking end of the second AGV transfer mechanism 7, basket conveyor 3 buffers the basket full of qualified silicon wafers into the basket buffering mechanism, waiting for a suitable time to place the buffered basket full of qualified silicon wafers onto the loading end of the second AGV transfer mechanism 7. Similarly, when the second AGV transfer mechanism 7 transports an empty basket back to the docking end, and a basket is already present at the docking end of basket conveyor 3, the second AGV transfer mechanism 7 buffers the empty basket into the basket buffering mechanism, waiting for a suitable time to place the buffered empty basket onto basket conveyor 3.

[0135] By setting up a basket buffering mechanism, baskets filled with qualified silicon wafers are buffered, which further reduces the transfer frequency of the second AGV transfer mechanism and better coordinates the wafer collection efficiency of the basket with the transfer efficiency of the second AGV transfer mechanism; buffering empty baskets can provide a relatively sufficient number of empty baskets for the basket conveyor line, preventing it from affecting the wafer collection efficiency of the basket.

[0136] In some embodiments, the opening direction of the wafer receiving basket is not the same as the wafer picking direction at the subsequent silicon wafer processing station. Therefore, it is necessary to rotate the basket. Optionally, the silicon wafer receiving device in this embodiment further includes a rotating mechanism disposed between the basket conveyor line 3 and the second AGV transfer mechanism 7. The rotating mechanism is configured to rotate and reverse the direction of the basket. Specifically, when the basket conveyor line 3 conveys a basket full of qualified silicon wafers to the rotating mechanism, the rotating mechanism rotates the basket so that the opening direction of the basket is consistent with the wafer picking direction at the silicon wafer processing station. The rotating mechanism then places the rotated basket full of qualified silicon wafers onto the second AGV transfer mechanism 7. When the second AGV transfer mechanism 7 returns an empty basket to the rotating mechanism, the rotating mechanism rotates the empty basket so that the opening of the basket faces the main conveyor line 1 again.

[0137] This application also provides a silicon wafer sorting system, such as Figure 4 As shown, the silicon wafer sorting system in this embodiment includes a silicon wafer detection device 10 and a silicon wafer receiving device 20, wherein the silicon wafer receiving device 20 is the silicon wafer receiving device provided in any of the above embodiments.

[0138] The silicon wafer inspection device 10 is configured to inspect silicon wafers to distinguish them into NG silicon wafers and qualified silicon wafers.

[0139] The silicon wafer receiving device 20 is located after the silicon wafer inspection device 10. The silicon wafer receiving device 20 is configured to perform sorting and receiving of NG silicon wafers and qualified silicon wafers, and to transport the collected NG silicon wafers to the NG silicon wafer recycling station and the collected qualified silicon wafers to the downstream silicon wafer processing station.

[0140] With the cooperation of the silicon wafer inspection device 10 and the silicon wafer receiving device 20, the silicon wafer sorting system provided in this application embodiment realizes the classification and receiving of NG silicon wafers and qualified silicon wafers, and automatically transfers the collected NG silicon wafers and qualified silicon wafers to the corresponding NG silicon wafer recycling station and silicon wafer processing station, which greatly improves the processing efficiency after silicon wafer sorting.

[0141] Optionally, the main conveyor line 1 of the silicon wafer receiving device 20 is connected to the conveyor line of the silicon wafer inspection device 10, so that the inspected silicon wafers output by the silicon wafer inspection device 10 can automatically enter the silicon wafer inspection device 10. Of course, the main conveyor line 1 of the silicon wafer receiving device 20 and the conveyor line of the silicon wafer inspection device 10 can also be the same complete conveyor line.

[0142] The foregoing has provided a sufficiently detailed and specific description of this application. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within the protection scope of this application. The scope of protection claimed in this application is defined by the claims, and not by the above descriptions in the embodiments.

Claims

1. A silicon wafer receiving device, characterized in that, The silicon wafer receiving device includes a main conveyor line, a material box conveyor line, a material basket conveyor line, a first receiving mechanism, a second receiving mechanism, a first AGV transfer mechanism, and a second AGV transfer mechanism, wherein: The main conveyor line is configured to convey silicon wafers that have completed inspection, including NG silicon wafers and qualified silicon wafers. The conveying path of the main conveyor line is provided with a first unloading station and a second unloading station. The material box conveyor line is at least partially located on the side of the first unloading station, and a first receiving station is provided between the material box conveyor line and the first unloading station. The material box conveyor line is connected to the first AGV transfer mechanism. The material basket conveyor line is located on the side of the second unloading station, and a second receiving station is set between the material basket conveyor line and the second unloading station. The material basket conveyor line is connected to the second AGV transfer mechanism. The first receiving mechanism is configured to receive NG silicon wafers delivered to the first unloading station into a cassette located at the first receiving station, and to transport the cassette full of NG silicon wafers to the cassette conveyor line. The cassette conveyor line is configured to transport the cassette full of NG silicon wafers to the first AGV transfer mechanism. The first AGV transfer mechanism is configured to transfer the received cassette full of NG silicon wafers to the subsequent NG silicon wafer recycling station. The second receiving mechanism is configured to insert qualified silicon wafers delivered to the second unloading station into a basket located at the second receiving station, and to transfer the basket full of qualified silicon wafers to the basket conveyor line. The basket conveyor line is configured to transport the basket full of qualified silicon wafers to the second AGV transfer mechanism. The second AGV transfer mechanism is configured to transfer the received basket full of qualified silicon wafers to the downstream silicon wafer processing station. A material box conveyor line is provided on each side of the main conveyor line. Each material box conveyor line includes a receiving conveyor section, a transfer conveyor section, and a discharging conveyor section. The discharging conveyor section is located on the side of the second unloading station and is set at a different height from the second receiving mechanism. The discharging conveyor section is parallel to the main conveyor line and is connected to the first AGV transfer mechanism; or... The material box conveyor line includes a first side receiving conveyor section, a second side receiving conveyor section, a first side transfer conveyor section, a second side transfer conveyor section, and a converging discharge conveyor section. The converging discharge conveyor section is located below the second unloading station and parallel to the main conveyor line. The converging discharge conveyor section is connected to the first AGV transfer mechanism. The first AGV transfer mechanism and the second AGV transfer mechanism are arranged side by side.

2. The silicon wafer receiving device as described in claim 1, characterized in that, The first AGV transfer mechanism is also configured to transfer empty boxes to the box conveyor line, and the first receiving mechanism is also configured to transport empty boxes on the box conveyor line to the first receiving station. The second AGV transfer mechanism is also configured to transfer empty baskets to the basket conveyor line.

3. The silicon wafer receiving device as described in claim 1, characterized in that, The first receiving mechanism includes a receiving component and a conveying component. The receiving component is configured to reverse and transfer NG silicon wafers delivered to the first unloading station to a cassette located at the first receiving station. The conveying component is configured to convey a cassette full of NG silicon wafers at the first receiving station to the cassette conveyor line, and to convey an empty cassette on the cassette conveyor line to the first receiving station.

4. The silicon wafer receiving device as described in claim 3, characterized in that, The receiving assembly includes a first lifting member and a first conveyor line. The first lifting member is located at the first unloading station and is configured to lift the NG silicon wafers located at the first unloading station away from the main conveyor line. The first conveyor line is located on the side of the first unloading station and is perpendicular to the main conveyor line. It is configured to convey the NG silicon wafers that have been removed from the main conveyor line to a hopper located at the first receiving station.

5. The silicon wafer receiving device as described in claim 3, characterized in that, The receiving assembly includes a first suction cup and a first transverse member. The first suction cup is mounted on the first transverse member and located above the first unloading station. The first suction cup is configured to pick up NG silicon wafers located at the first unloading station and transport them to a cassette located at the first receiving station.

6. The silicon wafer receiving device as described in claim 3, characterized in that, The receiving assembly includes a second conveyor line and an adsorption element. The adsorption element is disposed on the second conveyor line and configured to non-contactly adsorb and hold an NG silicon wafer located at a first unloading station on the second conveyor line. The second conveyor line is disposed above the first unloading station and configured to convey the NG silicon wafer held on the second conveyor line to a hopper located at the first receiving station.

7. The silicon wafer receiving device as described in claim 1, characterized in that, The receiving conveyor section is located on the side of the first unloading station and parallel to the main conveyor line, and the first receiving station is provided between the receiving conveyor section and the first unloading station; The transfer conveying section is perpendicular to the main conveying line, and its two ends are respectively connected to the receiving conveying section and the discharging conveying section; The first receiving mechanism transports the cassette filled with NG silicon wafers to the receiving conveyor section. The transfer conveyor section is configured to transport the cassette filled with NG silicon wafers from the receiving conveyor section to the discharge conveyor section. The discharge conveyor section is configured to transport the cassette filled with NG silicon wafers to the first AGV transfer mechanism.

8. The silicon wafer receiving device as described in claim 1, characterized in that, The first side receiving conveyor section is located on the first side of the first unloading station and is parallel to the main conveyor line. The second side receiving conveyor section is located on the second side of the first unloading station and is parallel to the main conveyor line. The first receiving station is provided between the first side receiving conveyor section and the first unloading station, and between the second side receiving conveyor section and the first unloading station. The first side transfer conveying section is perpendicular to the main conveyor line, and its two ends are respectively connected to the first side receiving conveyor section and the confluence discharge conveyor section; the second side transfer conveying section is perpendicular to the main conveyor line, and its two ends are respectively connected to the second side receiving conveyor section and the confluence discharge conveyor section. The first receiving mechanism transports the cassette filled with NG silicon wafers to the first side receiving conveyor section and / or the second side receiving conveyor section. The first side transfer conveyor section and the second side transfer conveyor section respectively transport the cassette filled with NG silicon wafers transported by the first side receiving conveyor section and the second side receiving conveyor section to the confluence conveyor section. The confluence conveyor section is configured to transport the cassette filled with NG silicon wafers to the first AGV transfer mechanism.

9. The silicon wafer receiving device as described in claim 1, characterized in that, The second receiving mechanism includes a second suction cup, a second transverse member, a third conveyor line, and a lifting member. The second suction cup is mounted on the second transverse member and located above the second unloading station. The second suction cup is configured to pick up qualified silicon wafers located at the second unloading station and release the qualified silicon wafers onto the third conveyor line. The third conveyor line is located on the side of the second unloading station and perpendicular to the main conveyor line, and is configured to convey qualified silicon wafers into the material basket located at the second receiving station; The lifting component is configured to lift the basket located at the second receiving station upwards, so that the slot of the basket is flush with the third conveyor line, so as to insert the qualified silicon wafers conveyed by the third conveyor line into the slot of the basket.

10. The silicon wafer receiving device as described in claim 9, characterized in that, The second receiving mechanism further includes a rotary drive unit, the drive end of which is connected to the second suction cup and configured to drive the second suction cup to rotate so as to release the qualified silicon wafer adsorbed by the second suction cup to the third conveyor line after rotating it 90°.

11. The silicon wafer receiving apparatus as described in claim 9, characterized in that, A material basket conveyor line is set on each side of the second unloading station, and a second AGV transfer mechanism is set on the back of each of the two material basket conveyor lines. The lifting component is also configured to release the basket onto the basket conveyor line.

12. The silicon wafer receiving device as described in claim 1, characterized in that, The silicon wafer receiving device also includes a basket buffer mechanism, which is located after the basket conveyor line and is connected to the second AGV transfer mechanism. The basket buffer mechanism is configured to buffer baskets that are full of qualified silicon wafers and empty baskets.

13. The silicon wafer receiving apparatus as described in claim 1, characterized in that, The main conveyor line has at least four first unloading stations and at least four second unloading stations along its conveying path.

14. The silicon wafer receiving apparatus as described in claim 1, characterized in that, The silicon wafer receiving device also includes a rotating mechanism disposed between the basket conveyor line and the second AGV transfer mechanism, the rotating mechanism being configured to rotate and change the direction of the basket.

15. The silicon wafer receiving apparatus according to any one of claims 1-14, characterized in that, The first AGV transfer mechanism and / or the second AGV transfer mechanism include two conveying channels arranged side by side.

16. A silicon wafer sorting system, characterized in that, The silicon wafer sorting system includes a silicon wafer detection device and a silicon wafer receiving device as described in any one of claims 1 to 15, wherein: The silicon wafer inspection device is configured to inspect silicon wafers to distinguish them into NG silicon wafers and qualified silicon wafers; The silicon wafer receiving device is located after the silicon wafer inspection device and is configured to classify and receive NG silicon wafers and qualified silicon wafers, and to transport the received NG silicon wafers to the NG silicon wafer recycling station and the received qualified silicon wafers to the subsequent silicon wafer processing station.

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