A fan module structure and server heat dissipation device

Abstract

The present invention relates to a fan module structure and a server heat dissipation device, wherein the fan module structure comprises: a front frame and a rear frame, wherein the front frame and the rear frame are connected to form an installation cavity, wherein the installation cavity comprises an upper installation cavity and a lower installation cavity, and wherein the upper installation cavity and the lower installation cavity are staggered in a front-to-back manner, wherein an upper 2U fan is placed in the upper installation cavity, and wherein a lower 2U fan is placed in the lower installation cavity. The present invention connects the front frame and the rear frame to form an installation cavity, wherein the installation cavity comprises an upper installation cavity and a lower installation cavity, and wherein the upper installation cavity and the lower installation cavity are staggered in a front-to-back manner, wherein an upper 2U fan is placed in the upper installation cavity, and wherein a lower 2U fan is placed in the lower installation cavity; wherein the upper 2U fan can be directly electrically connected to a mainboard, and the lower 2U fan can be electrically connected to a fan board, thereby effectively reducing the number of adapter cables used and reducing costs. Moreover, when installation and maintenance are required, the upper 2U fan and the lower 2U fan will not interfere with each other, and operation is convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of server heat dissipation, and in particular to a fan module structure and a server heat dissipation device. Background Art

[0002] In the existing technical solution, a 4U server needs to develop a separate fan board, which supplies power to 8 fans at the same time. All power supplies need to be transferred from the motherboard through cables, resulting in a large fan board size, many adapter cables, high cost, and inconvenient installation and maintenance. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a fan module structure and a server heat dissipation device.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] In the first aspect, an embodiment of the present invention provides a fan module structure, comprising: a front frame and a rear frame, the front frame and the rear frame being connected to form an installation cavity, the installation cavity comprising an upper installation cavity and a lower installation cavity, and the upper installation cavity and the lower installation cavity are staggered in the front and back direction, an upper 2U fan is placed in the upper installation cavity, and a lower 2U fan is placed in the lower installation cavity.

[0006] In a specific embodiment, the upper 2U fan is connected to an upper connector, and the upper connector extends out of the upper mounting cavity. The lower 2U fan is connected to a lower connector, and the lower connector extends out of the lower mounting cavity.

[0007] In a specific embodiment, an upper connection position is extended outward from the upper end of the rear frame, and a lower connection position is extended outward from the lower end. The upper connection position is used to fix the upper connector, and the lower connection position is used to fix the lower connector.

[0008] In a specific embodiment, an accommodating cavity is further provided at the upper end of the front frame body. The accommodating cavity is located at the front end of the upper mounting cavity, and a waveguide plate is installed in the accommodating cavity.

[0009] In a specific embodiment, the accommodating cavity is further provided with a fastener, and the fastener is used to fix the waveguide plate.

[0010] In a specific embodiment, a handle is further provided on the top of the front frame.

[0011] In a specific embodiment, the front frame is provided with an upper air inlet and a lower air inlet corresponding to the upper mounting cavity and the lower mounting cavity, and the rear frame is provided with an upper air outlet and a lower air outlet corresponding to the upper mounting cavity and the lower mounting cavity.

[0012] In a specific embodiment, the upper 2U fan is located at the rear end of the lower 2U fan in the vertical direction.

[0013] The fan module structure of the present invention has the following advantages compared with the prior art: a mounting cavity is formed by connecting the front frame and the rear frame, the mounting cavity includes an upper mounting cavity and a lower mounting cavity, and the upper mounting cavity and the lower mounting cavity are staggered in the front and back direction, an upper 2U fan is placed in the upper mounting cavity, and a lower 2U fan is placed in the lower mounting cavity; the upper 2U fan can be directly electrically connected to the mainboard, and the lower 2U fan is electrically connected to the fan board, which can effectively reduce the number of adapter cables used and reduce costs, and when installation and maintenance are required, the upper 2U fan and the lower 2U fan will not interfere with each other, and operation is convenient.

[0014] In a second aspect, an embodiment of the present invention provides a server cooling device, which adopts at least one fan module structure, chassis, motherboard, fan plate and bracket as described above, wherein the motherboard, the fan plate and the bracket are installed in the chassis, the fan module structure is installed in the bracket, the upper 2U fan is electrically connected to the motherboard, the lower 2U fan is electrically connected to the fan plate, and the fan plate is electrically connected to the motherboard.

[0015] In a specific embodiment, the upper connector is electrically connected to the main board, and the lower connector is electrically connected to the fan board.

[0016] The server heat dissipation device of the present invention has the following advantages compared with the prior art: by installing the mainboard, fan board and bracket on the chassis, installing the fan module structure on the bracket, the upper 2U fan is electrically connected to the mainboard, the lower 2U fan is electrically connected to the fan board, and the fan board is electrically connected to the mainboard, the problem that the server fans have to be connected to the mainboard for power through the fan board is solved, the number of adapter cables used can be effectively reduced, the cost is reduced, and when installation and maintenance are required, the upper 2U fan and the lower 2U fan will not interfere with each other, and the operation is convenient.

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 A three-dimensional schematic diagram of a fan module structure provided by an embodiment of the present invention;

[0020] Figure 2An exploded schematic diagram of a fan module structure provided by an embodiment of the present invention;

[0021] Figure 3 A three-dimensional schematic diagram of a server heat dissipation device provided in an embodiment of the present invention;

[0022] Figure 4 Schematic diagram of the server heat dissipation device provided by the embodiment of the present invention Figure 1 ;

[0023] Figure 5 Schematic diagram of the server heat dissipation device provided by the embodiment of the present invention Figure 2 . DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0028] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0029] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0030] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0031] See also Figures 1 to 2 As shown, the present invention discloses a specific embodiment of a fan module structure, comprising: a front frame 10 and a rear frame 20, wherein the front frame 10 and the rear frame 20 are connected to form a mounting cavity 30, wherein the mounting cavity 30 comprises an upper mounting cavity 31 and a lower mounting cavity 32, and the upper mounting cavity 31 and the lower mounting cavity 32 are staggered in the front and back direction, an upper 2U fan 40 is placed in the upper mounting cavity 31, and a lower 2U fan 50 is placed in the lower mounting cavity 32.

[0032] Wherein, U is a unit, 1U=44.45mm, which is used to indicate the height of the server.

[0033] Specifically, the upper mounting cavity 31 and the lower mounting cavity 32 are staggered front to back, and the upper mounting cavity 31 is located at the rear end of the lower mounting cavity 32. The upper 2U fan 40 is placed through the upper mounting cavity 31, and the lower 2U fan 50 is placed through the lower mounting cavity 32, so that the upper 2U fan 40 and the lower 2U fan 50 are staggered front to back, so that the upper 2U fan 40 can be directly electrically connected to the mainboard, and the lower 2U fan 50 is electrically connected to the fan board, which can effectively reduce the number of adapter cables used and reduce costs. When installation and maintenance are required, the upper 2U fan 40 and the lower 2U fan 50 will not interfere with each other, and operation is convenient.

[0034] Preferably, the upper 2U fan 40 and the lower 2U fan 50 have the same structure, which facilitates operation and reduces production costs.

[0035] In one embodiment, the upper 2U fan 40 is connected to an upper connector 41 , and the upper connector 41 extends out of the upper mounting cavity 31 . The lower 2U fan 50 is connected to a lower connector 51 , and the lower connector 51 extends out of the lower mounting cavity 32 .

[0036] Specifically, the upper connector 41 extends out of the upper end of the rear frame 20 along the upper mounting cavity 31, and the lower connector 51 extends out of the lower end of the rear frame 20 along the lower mounting cavity 32. The lower connector 51 avoids the space of the upper connector 41, so that the upper connector 41 can be directly electrically connected to the motherboard without the use of an adapter cable. The lower connector 51 is electrically connected to the fan board, which can effectively reduce the volume of the fan board.

[0037] In one embodiment, an upper connection position 21 extends outward from the upper end of the rear frame 20 , and a lower connection position 22 extends outward from the lower end. The upper connection position 21 is used to fix the upper connector 41 , and the lower connection position 22 is used to fix the lower connector 51 .

[0038] Specifically, by extending an upper connection position 21 outward from the upper end of the rear frame 20 and a lower connection position 22 outward from the lower end, the upper connector 41 can be fixed to the upper connection position 21 so that the upper connector 41 can be directly plugged into the mainboard, and the lower connector 51 can be fixed to the lower connection position 22 so that the lower connector 51 can be directly plugged into the fan board.

[0039] Preferably, the upper connecting portion 21 , the lower connecting portion 22 and the rear frame 20 are an integrally formed structure, which has high strength and only requires one set of production molds, thereby reducing production costs.

[0040] Preferably, the front frame 10 and the rear frame 20 are both made of plastic, are elastic, and are easy to assemble and disassemble.

[0041] In one embodiment, an accommodating cavity 11 is further provided at the upper end of the front frame 10 . The accommodating cavity 11 is located at the front end of the upper mounting cavity 31 , and a waveguide plate 60 is installed in the accommodating cavity 11 .

[0042] Specifically, the accommodating cavity 11 is located at the front end of the upper mounting cavity 31 , and a waveguide plate 60 is installed in the accommodating cavity 11 to guide air flow, reduce air vibration, and thus reduce wind noise.

[0043] In one embodiment, the accommodating cavity 11 is further provided with a fastener 70 , and the fastener 70 is used to fix the waveguide plate 60 .

[0044] Specifically, the fastener 70 is installed in the accommodating cavity 11 and is engaged with the front frame 10 to limit and fix the waveguide plate 60 so that the waveguide plate 60 is not easily displaced.

[0045] In other embodiments, in addition to installing the waveguide plate 60 on the upper end of the front frame 10, the waveguide plate 60 may also be installed on the lower end of the front frame 10, so as to form a situation where the waveguide plates 60 are installed on both the upper and lower ends to adapt to different application scenarios.

[0046] In one embodiment, a handle 12 is further provided on the top of the front frame 10 .

[0047] Specifically, the handle 12 is rotatably connected to both sides of the top of the front frame 10. The handle 12 can be rotated 90 degrees (ie, from the front frame 10 toward the rear frame 20) to facilitate plugging and unplugging maintenance of the fan module structure.

[0048] In one embodiment, the front frame 10 is provided with an upper air inlet 13 and a lower air inlet 14 corresponding to the upper mounting cavity 31 and the lower mounting cavity 32, and the rear frame 20 is provided with an upper air outlet 23 and a lower air outlet 24 corresponding to the upper mounting cavity 31 and the lower mounting cavity 32.

[0049] Specifically, the upper air inlet 13 corresponds to the upper air outlet 23 , and the lower air inlet 14 corresponds to the lower air outlet 24 , so that fan heat dissipation is performed simultaneously at the upper and lower sides to improve heat dissipation performance.

[0050] In one embodiment, the upper 2U fan 40 is located at the rear end of the lower 2U fan 50 in the vertical direction.

[0051] Specifically, the upper 2U fan 40 is vertically arranged at the rear end of the lower 2U fan 50 to achieve front-to-back staggered distribution.

[0052] Preferably, the front frame 10 and the rear frame 20 are fixed by snap connection, which is convenient for assembly and disassembly and has a compact structure.

[0053] See also Figures 3 to 5As shown, the present invention also discloses a server cooling device, which adopts at least one fan module structure, chassis 70, motherboard 80, fan plate 90 and bracket 100 as described above, wherein the motherboard 80, the fan plate 90 and the bracket 100 are installed on the chassis 70, the fan module structure is installed on the bracket 100, the upper 2U fan 40 is electrically connected to the motherboard 80, the lower 2U fan 50 is electrically connected to the fan plate 90, and the fan plate 90 is electrically connected to the motherboard 80.

[0054] Specifically, the fan plate 90 is first installed in the chassis 70, and then the mainboard 80 is installed in the chassis 70. The fan plate 90 and the mainboard 80 are electrically connected through an adapter cable. Then the bracket 100 is installed in the chassis 70, and finally the fan module structure is installed on the bracket 100, so that the upper 2U fan 40 is electrically connected to the mainboard 80 to directly obtain power, and the lower 2U fan 50 is electrically connected to the fan plate 90. This solves the problem that the server fans must obtain power from the mainboard 80 through the fan plate 90, which can effectively reduce the number of adapter cables used and reduce costs. Moreover, when installation and maintenance are required, the upper 2U fan 40 and the lower 2U fan 50 will not interfere with each other, and the operation is convenient.

[0055] In one embodiment, the upper connector 41 is electrically connected to the mainboard 80 , and the lower connector 51 is electrically connected to the fan board 90 .

[0056] Specifically, the upper connector 41 is directly electrically connected to the motherboard 80, avoiding the use of adapter cables, and the lower connector 51 is electrically connected to the fan board 90, avoiding the need for all connectors to be electrically connected to the fan board 90. This can effectively reduce the volume of the fan board 90 and enable the motherboard 80 to be compatible with both 2U and 4U servers, thereby improving the compatibility of the motherboard 80 and saving the cost of the fan board 90 and adapter cables.

[0057] In one embodiment, the server cooling device uses a fan module structure of 2 or 4 fans, etc., which is not specifically limited here.

[0058] The server cooling device of the present invention can meet the requirement of the fan operating at a low speed when the server is not turned on, so that the mainboard 80 can be compatible with both 4U and 2U chassis 70. The lower 2U fan 50 is powered by a small fan board 90 and is installed diagonally below the upper 2U fan 40. The eight fan connectors are distributed in the middle position of the 4U chassis 70, and cooperate with the handle 12 to make disassembly and maintenance more convenient.

[0059] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A server heat dissipation device, characterized in that: include: A fan module structure, a chassis, a mainboard, a fan plate and a bracket, the mainboard, the fan plate and the bracket are installed on the chassis, the fan module structure is installed on the bracket, the fan module structure includes: a front frame and a rear frame, the front frame and the rear frame are connected to form an installation cavity, the installation cavity includes an upper installation cavity and a lower installation cavity, and the upper installation cavity and the lower installation cavity are staggered in the front and back, the upper installation cavity is placed with an upper 2U fan, and the lower installation cavity is placed with a lower 2U fan; the upper 2U fan is located at the rear end of the lower 2U fan in the vertical direction; the upper 2U fan is electrically connected to the mainboard, the lower 2U fan is electrically connected to the fan plate, and the fan plate is electrically connected to the mainboard.

2. A server heat dissipation device according to claim 1, characterized in that: The upper 2U fan is connected to an upper connector, and the upper connector extends out of the upper mounting cavity. The lower 2U fan is connected to a lower connector, and the lower connector extends out of the lower mounting cavity.

3. A server heat dissipation device according to claim 2, characterized in that: An upper connection position is extended outwardly from the upper end of the rear frame, and a lower connection position is extended outwardly from the lower end. The upper connection position is used to fix the upper connector, and the lower connection position is used to fix the lower connector.

4. A server heat dissipation device according to claim 2, characterized in that: An accommodating cavity is further provided at the upper end of the front frame body. The accommodating cavity is located at the front end of the upper mounting cavity, and a waveguide plate is mounted in the accommodating cavity.

5. A server heat dissipation device according to claim 4, characterized in that: The accommodating cavity is further provided with a fastener, and the fastener is used to fix the waveguide plate.

6. A server heat dissipation device according to claim 2, characterized in that: A handle is also provided on the top of the front frame.

7. A server heat dissipation device according to claim 2, characterized in that: The front frame is provided with an upper air inlet and a lower air inlet corresponding to the upper mounting cavity and the lower mounting cavity, and the rear frame is provided with an upper air outlet and a lower air outlet corresponding to the upper mounting cavity and the lower mounting cavity.

8. A server heat dissipation device according to claim 2, characterized in that: The upper connector is electrically connected to the main board, and the lower connector is electrically connected to the fan board.

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