Chip mounting apparatus

Abstract

The application relates to a chip mounting device and relates to the technical field of RFID label production equipment. The mounting device comprises a feeding device, a dispensing device, a mounting device, a hot pressing device, a detection device and a material collecting device. The dispensing device comprises a dispensing machine, and the mounting device comprises a mounting machine. The dispensing machine and the mounting machine are both provided with a driving positioning platform at the lower side in the vertical direction. The driving positioning platform comprises a driving positioning plate. The driving positioning plate is provided with a transmission roller group for conveying a material belt at both sides along the length direction of the driving positioning plate. The driving positioning plate is provided with a positioning driving assembly which can drive the driving positioning plate to move in the horizontal plane. The position of the dispensing machine and the mounting machine is fixed. The driving positioning platform adopts the transmission roller group to realize long-distance conveying of the material belt in the conveying direction of the material belt, realizes rapid positioning of the material belt, and realizes fine adjustment and correction of the material belt in a small distance and high precision through cooperation of the positioning driving assembly. Therefore, the mounting efficiency of the chip on the material belt can be improved.

Description

Technical Field

[0001] This application relates to the technical field of RFID tag production equipment, and in particular to a chip mounting device. Background Technology

[0002] RFID, or Radio Frequency Identification, is commonly known as electronic tags. RFID is a non-contact automatic identification technology that uses radio frequency signals to automatically identify target objects and acquire relevant data. Identification requires no human intervention and can operate in various harsh environments.

[0003] An RFID system consists of three parts: tags, readers, and antennas. A complete system also requires a data transmission and processing system.

[0004] With the development of new packaging technologies, new processing techniques have emerged in tag packaging, such as flip-chip, bump generation, and antenna printing. Compared with common wire or carrier tape connections, flip-chip technology offers advantages such as higher packaging density, better electrical and thermal performance, higher reliability, and lower cost. The substrate (antenna) used in flip-chip packaging typically has a width of 320mm. The packaging process for RFID antenna substrates generally includes the following steps: material loading, dispensing, mounting, hot pressing, testing, and unloading.

[0005] Currently, in the chip mounting process of 320mm wide RFID antenna substrates, a dual flip chip picking device and a dual motion mounting head are generally used for chip picking and mounting; in the dispensing process, a dual dispensing device is generally used for alternating dispensing.

[0006] Regarding the aforementioned technologies, in the dispensing process, the dispensing head moves to align with the corresponding antenna substrate and perform the dispensing operation. In the mounting process, after the mounting head picks up the chip, it moves to position the antenna substrate. This repetitive positioning with the antenna substrate through the movement of the dispensing and mounting heads results in a longer waiting time after the antenna is basically delivered, leading to lower production efficiency. Using the aforementioned equipment for chip mounting on a single-row narrow-width RFID antenna substrate further increases the processing difficulty and reduces mounting efficiency. Summary of the Invention

[0007] This application provides a chip mounting device, the purpose of which is to improve the chip mounting efficiency of a single-row narrow-width RFID antenna substrate.

[0008] The chip mounting equipment provided in this application adopts the following technical solution:

[0009] A chip mounting device includes a feeding device, a dispensing device, a mounting device, a hot pressing device, a detection device, and a receiving device. The dispensing device includes a dispensing machine, and the mounting device includes a mounting machine. Active positioning platforms are spaced apart along the lower vertical direction of both the dispensing machine and the mounting machine. Each active positioning platform includes an active positioning plate. Conveyor rollers for conveying the material strip are arranged on both sides of the active positioning plate along its length. A positioning drive component capable of driving the active positioning plate to move in a horizontal plane is provided on the active positioning plate.

[0010] By adopting the above technical solution, and by setting up a feeding device, a dispensing device, a mounting device, a hot pressing device, a detection device, and a receiving device, the material tape can sequentially pass through feeding, dispensing, mounting, hot pressing, detection, and receiving, thereby realizing all the processing steps required for chip mounting to the corresponding RFID antenna substrate.

[0011] An active positioning platform is installed under both the dispensing machine and the placement machine. Two transfer roller groups are positioned on both sides of the active positioning plate along its length. These roller groups transport the tape to the underside of the respective dispensing and placement machines, enabling rapid, long-distance (but low-precision) forward or backward transport along the tape's transport direction. A positioning drive assembly is located under the active positioning plate, driving it to move horizontally and allowing for precise, small-distance positioning adjustments of the tape. Therefore, the active positioning platform enables automatic tape positioning while keeping both the dispensing and placement machines stationary, improving processing accuracy. The combination of rapid, long-distance transport and fine-tuning achieves rapid tape positioning, thus improving the chip placement efficiency of single-row narrow-width RFID antenna substrates.

[0012] Optionally, the transfer roller group includes a pressure roller and a conveying roller. The pressure roller and the conveying roller are arranged parallel to each other and spaced apart in the vertical direction. The pressure roller and the conveying roller are axially arranged along the width direction of the active positioning plate. The conveying roller is coaxially connected to a drive motor for driving the conveying roller to rotate.

[0013] By adopting the above technical solution, the drive motor in the conveyor roller group drives the active roller to rotate, which can provide power for the conveying of the material belt, while the rubber pressure roller can press the material belt and the conveying roller together. Through the rubber pressure roller and the conveying roller, the material belt can be conveyed over a long distance.

[0014] Optionally, the positioning drive assembly includes a first drive component and a second drive component, both of which are connected to the active positioning plate, and the driving direction of the first drive component is perpendicular to the driving direction of the second drive component.

[0015] By adopting the above technical solution, in the positioning drive assembly, the driving directions of the first drive member and the second drive member are set perpendicular to each other, so that the position of the active positioning plate can be adjusted in any direction in the horizontal plane, which facilitates the positioning of the material strip on the active positioning plate in the horizontal direction.

[0016] Optionally, the dispensing machine is equipped with a CCD vision inspection system on both sides along the length of the active positioning plate, and the detection part of the CCD vision inspection system is arranged vertically toward the corresponding active positioning plate.

[0017] By adopting the above technical solution, the CCD vision inspection system can take pictures and analyze the material strip when it passes over the active positioning plate, and feed back the analysis results to the positioning drive component to position the material strip.

[0018] Optionally, the mounting apparatus further includes a chip loading assembly, which includes a pin system, a wafer motion module, and a transfer assembly for transporting chips to the mounting machine. The pin system and the transfer assembly are respectively arranged on both sides of the wafer motion module in the vertical direction, and the pin system and the transfer assembly are arranged facing each other in the vertical direction.

[0019] By adopting the above technical solution, the wafer motion module in the chip loading assembly is used to mount and position the wafer. The ejector pin system is vertically positioned below the wafer motion module, allowing the ejector pins to push the chip off the wafer. The transfer assembly is vertically positioned above the wafer motion module and directly opposite the ejector pin system. Therefore, after the ejector pin system pushes the chip off, the transfer system picks up the chip and transports it to the placement machine. Thus, through the arrangement of the ejector pin system, wafer motion module, and transfer assembly, the chip can be removed from the wafer, realizing the chip loading function of the placement machine.

[0020] Optionally, the transfer assembly includes a suction head, which is arranged vertically, and has a suction port for picking up chips at one end of the suction head along the vertical direction. A flipping drive is connected to the suction head for driving the suction head to flip vertically.

[0021] By adopting the above technical solution, in the transfer assembly, the pick-up head is vertically arranged, and a pick-up port is opened at the lower end of the pick-up head. The pick-up head is connected to the flipping drive component. Thus, the pick-up port can be set to apply negative pressure to pick up the chip when the ejector system pushes the chip out of the wafer, thereby gripping the chip. The flipping drive component can flip the pick-up head after the pick-up port at the lower end of the pick-up head has gripped the chip, flipping the pick-up port to face vertically upward. At this time, the chip is set vertically and is picked up by the placement machine.

[0022] Optionally, the suction head has suction ports at both ends in the vertical direction, and the flipping drive is connected to the middle of the suction head in the vertical direction.

[0023] By adopting the above technical solution, suction ports are opened at both ends of the suction head. Therefore, the suction port at the lower end of the suction head can pick up the chip and the suction port at the upper end of the suction head can deliver the chip to the placement machine simultaneously, thereby speeding up the chip loading speed for the placement machine.

[0024] Optionally, the placement machine includes a plurality of placement heads and a station switching drive. The plurality of placement heads are evenly arranged around the station switching drive in the circumferential direction. The station switching drive is used to drive the placement heads to rotate about the central axis of the station switching drive. When the station switching drive rotates, one placement head is vertically opposite to the corresponding active positioning platform, and another placement head is vertically opposite to the transfer assembly.

[0025] By adopting the above technical solution, the placement head in the placement machine is used to pick up the chip and place the chip onto the tape; several placement heads are evenly arranged around the station switching drive in the circumferential direction, so that when the station switching drive rotates, the placement head rotates around the central axis of the station switching drive.

[0026] Therefore, the position of the placement head can be switched by setting up the station switching drive. When the station switching drive rotates, one of the placement heads is vertically opposite to the corresponding active positioning platform, and this placement head can perform chip placement; at the same time, another placement head is vertically opposite to the transfer component, and this placement head can perform chip gripping. Thus, the station switching drive can switch each placement head between chip gripping and chip placement, and the cooperation of multiple placement heads can speed up the chip placement speed on the tape, thereby increasing processing efficiency.

[0027] Optionally, the placement machine further includes a visual orientation corrector, which is positioned horizontally opposite the placement head.

[0028] By adopting the above technical solution, the vision posture corrector can take pictures of the chip picked up by the mounting head, and realize the analysis and positioning of the chip's posture at this time.

[0029] Optionally, a plurality of visual attitude correctors are provided, and the plurality of visual attitude correctors are respectively arranged in a clockwise circumferential direction along the workstation switching drive between the transfer component and the corresponding active positioning platform, and in a counterclockwise circumferential direction along the workstation switching drive between the transfer component and the corresponding active positioning platform.

[0030] By adopting the above technical solution, several visual attitude correctors are set up. There are two parts to the visual attitude correctors: one part is positioned clockwise along the station switching drive between the transfer assembly and the corresponding positioning platform; the other part is positioned counterclockwise along the station switching drive between the transfer assembly and the corresponding positioning platform. Thus, when the station switching drive rotates clockwise and counterclockwise, each placement head switches between the chip gripping station and the chip placement station. During this switching process, each placement head passes through the corresponding visual attitude corrector, thereby enabling attitude positioning of the chip gripped by the placement head.

[0031] In summary, this application includes at least one of the following beneficial technical effects:

[0032] 1. In this application, the positions of the dispensing machine and the placement machine are fixed, and the material tape is transported through the active positioning platform, which reduces the time for the dispensing machine and the placement machine to find the material tape and improves the chip placement efficiency on the material tape.

[0033] 2. The active positioning platform uses a transmission roller assembly to achieve long-distance forward or backward conveying of the material belt along its own conveying direction, enabling rapid positioning of the material belt; in conjunction with the positioning drive component, it achieves high-precision fine-tuning and alignment of the material belt over short distances. This results in rapid and high-precision positioning of the material belt.

[0034] 3. The placement machine adopts a rotating multi-placement head setup, which realizes chip gripping, chip orientation positioning and chip placement in a fixed position. Therefore, multiple placement heads can work in parallel, which can reduce the time spent by the placement heads during the movement process and improve the chip placement speed on the tape.

[0035] 4. Chip picking is achieved through a material handling assembly. The material handling assembly adopts a dual-sucking port flip-type sucker head setting, which picks up and feeds chips at a fixed position, allowing the two sucker ports to move in parallel. This enables chip picking and feeding to be carried out synchronously, reducing chip picking time and improving the chip placement speed on the tape. Attached Figure Description

[0036] Figure 1This is a schematic diagram of the overall structure of the tape conveyor in the chip mounting equipment of this application.

[0037] Figure 2 This is a schematic diagram of the overall structure of the material conveyor belt in the feeding device of this application.

[0038] Figure 3 This is a schematic diagram of the overall structure of the material conveying in the dispensing device and the mounting device in this application.

[0039] Figure 4 This is a schematic diagram of the overall structure of the dispensing device and the mounting device in this application.

[0040] Figure 5 This is a schematic diagram of the overall structure of the active positioning platform in this application.

[0041] Figure 6 This is a schematic diagram of the internal structure of the dispensing machine in this application.

[0042] Figure 7 This is a schematic diagram of the overall structure of the mounting device in this application.

[0043] Figure 8 yes Figure 7 A magnified schematic diagram of part A in the middle.

[0044] Figure 9 This is a schematic diagram of the placement machine structure with four placement heads installed in this application.

[0045] Figure 10 This is a schematic diagram of the overall structure of the material conveying in the hot pressing device, the detection device, and the winding device in this application.

[0046] In the diagram, 1 is the feeding device; 11 is the unwinding roller; 12 is the receiving platform; 13 is the first vacuum adsorption cylinder; and 14 is the feeding auxiliary roller.

[0047] 2. Dispensing device; 21. Dispensing machine; 211. Dispensing head; 212. Vertical drive assembly; 213. Horizontal drive assembly; 2131. Synchronous drive motor; 2132. Drive wheel; 2133. Driven wheel; 2134. Drive rod; 22. CCD vision inspection system;

[0048] 3. Placement device; 31. Placement machine; 311. Placement head; 312. Station switching drive; 313. Vision orientation corrector; 32. Chip loading assembly; 321. Ejector pin system; 322. Wafer motion module; 3221. Wafer mounting platform; 3222. Wafer driver; 323. Transfer assembly; 3231. Pickup head; 3232. Pickup port; 3233. Flip drive;

[0049] 4. Hot pressing device; 41. First hot pressing head; 42. Second hot pressing head;

[0050] 5. Detection device;

[0051] 6. Receiving device; 61. Rewinding roller; 62. Second auxiliary roller; 63. Protective film feeding roller; 64. Third auxiliary roller;

[0052] 7. Active positioning platform; 71. Active positioning plate; 711. Vacuum adsorption hole; 712. Vacuum air pipe; 72. Conveyor roller group; 721. Adhesive roller; 722. Conveyor roller; 73. Positioning drive assembly; 731. First drive component; 732. Second drive component;

[0053] 8. Dispensing and storage device; 81. Second vacuum adsorption cylinder;

[0054] 9. Mounting material storage device; 91. Third vacuum adsorption cylinder; 92. Floating roller assembly;

[0055] 10. Hot-pressed material storage device;

[0056] 100. Conveying traction assembly; 200. Material belt. Detailed Implementation

[0057] The following is in conjunction with the appendix Figure 1 - Appendix Figure 10 This application will be described in further detail below.

[0058] A chip mounting device, with reference to Figure 1 The system includes a feeding device 1, a dispensing device 2, a mounting device 3, a hot pressing device 4, an inspection device 5, and a take-up device 6. The tape 200 is unwound by the feeding device 1 and then sequentially passes through the dispensing device 2, the mounting device 3, the hot pressing device 4, and the inspection device 5. Finally, the tape 200 is rewound by the take-up device 6. In this process, the tape 200 sequentially undergoes unwinding, dispensing, mounting, hot pressing, inspection, and rewinding, realizing the full automation of chip mounting on the tape 200.

[0059] Along the conveying direction of the material belt 200, a conveying traction assembly 100 is provided in the feeding device 1, dispensing device 2, mounting device 3, hot pressing device 4, detection device 5, and receiving device 6, as well as between two adjacent devices. The conveying traction assembly 100 consists of a power roller driven by a motor and a driven roller that presses the material belt 200, and is used to assist in the conveying of the material belt 200.

[0060] Reference Figure 2The feeding device 1 includes an unwinding roller 11, a receiving platform 12, a first vacuum adsorption cylinder 13, and several feeding auxiliary rollers 14. The unwinding roller 11 and the feeding auxiliary rollers 14 are arranged parallel to each other. The unwinding roller 11, the receiving platform 12, and the first vacuum cylinder are arranged sequentially at intervals along the conveying direction of the material belt 200. Several feeding auxiliary rollers 14 are arranged between the unwinding roller 11 and the receiving platform 12 and are distributed on both sides of the material belt 200. The material belt 200 is unwound by the unwinding roller 11 to achieve feeding. With the arrangement of the receiving platform 12 and the first vacuum adsorption cylinder 13, the material belt 200 can be fed at a constant speed and direction with a slight tension.

[0061] Reference Figure 3 and Figure 4 The dispensing device 2 includes a dispensing machine 21, and an active positioning platform 7 is arranged vertically below the dispensing machine 21. The material belt 200 passes through the upper side of the active positioning platform 7.

[0062] Reference Figure 5 The active positioning platform 7 includes a transmission roller group 72, which includes a pressure roller 721 and a conveyor roller 722. The conveyor roller 722 is coaxially connected to a drive motor. The pressure roller 721 and the conveyor roller 722 are axially parallel to each other and both are arranged along the width direction of the material belt 200. The conveyor roller 722 is vertically positioned below the pressure roller 721, and the conveyor roller 722 and the pressure roller 721 are spaced apart vertically. The material belt 200 passes through the gap between the conveyor roller 722 and the pressure roller 721. Therefore, driven by the drive motor, the transmission roller group 72 can convey the material belt 200. Two transmission roller groups 72 are spaced apart along the conveying direction of the material belt 200. Through the cooperation of the two transmission roller groups 72, the material belt 200 can be conveyed forward or backward.

[0063] Reference Figure 5 An active positioning plate 71 is disposed between two conveyor roller groups 72, with the two conveyor roller groups 72 arranged on both sides of the active positioning plate 71 along its length. The conveying direction of the material belt 200 is arranged along the length direction of the active positioning plate 71. The active positioning plate 71 has several vacuum adsorption holes 711, and a vacuum tube 712 is connected to one side of the active positioning plate 71, and the vacuum tube 712 is interconnected with the vacuum adsorption holes 711. Therefore, by drawing air through the vacuum tube 712, the material belt 200 passing on the active positioning plate 71 can be adsorbed and fixed, facilitating the dispensing process.

[0064] Reference Figure 5A positioning drive assembly 73 is provided on the lower side of the active positioning plate 71. The positioning drive assembly 73 includes a first drive member 731 and a second drive member 732. Both the first drive member 731 and the second drive member 732 are connected to the active positioning plate 71. The driving direction of the first drive member 731 on the active positioning plate 71 is set along the width direction of the active positioning plate 71, and the driving direction of the second drive member 732 on the active positioning plate 71 is set along the length direction of the active positioning plate 71. Thus, the driving directions of the first drive member 731 and the second drive member 732 on the active positioning plate 71 are perpendicular to each other in the horizontal plane. Both the first drive member 731 and the second drive member 732 adopt ball screw pairs driven by servo motors, thereby realizing high-precision conveying of the active positioning plate 71.

[0065] Reference Figure 4 and Figure 5 By configuring the active positioning plate 71, the transmission roller group 72, and the positioning drive assembly 73, the material belt 200 can be transported over long distances at high speed and positioned with high precision. Therefore, the position of the dispensing machine 21 can be fixed, and the positioning between the dispensing machine 21 and the material belt 200 can be achieved by positioning the material belt 200.

[0066] Reference Figure 3 and Figure 4 The dispensing machine 21 is equipped with CCD vision inspection systems 22 on both sides along its horizontal direction. The two CCD vision inspection systems 22 are spaced apart along the length of the active positioning platform 7. The detection parts of the CCD vision inspection systems 22 are vertically downward and directly facing the active positioning platform 7 below the dispensing machine 21. Therefore, by taking pictures and analyzing the material strip 200 conveyed on the active positioning platform 7 below the dispensing machine 21 through the two CCD vision inspection systems 22, the analysis results are fed back to the positioning drive component 73 to achieve precise positioning of the material strip 200.

[0067] Reference Figure 4 and Figure 6The dispensing machine 21 includes a dispensing head 211 arranged vertically, with its working end facing downwards. A vertical drive assembly 212 is provided on one side of the dispensing head 211. The vertical drive assembly 212 is a ball screw pair arranged vertically and driven by a servo motor. A horizontal drive assembly 213 is also provided on one side of the dispensing head 211 along the width direction of the material belt 200. The horizontal drive assembly 213 includes a synchronous drive motor 2131, a drive wheel 2132, a driven wheel 2133, and a drive rod 2134. The synchronous drive motor 2131 is coaxially connected to the drive wheel 2132, and the drive wheel 2132 and the driven wheel 2133 are connected to each other via a synchronous belt. One end of the drive rod 2134 is rotatably connected to the drive wheel 2132, and the other end is rotatably connected to the dispensing head 211. Thus, the horizontal drive assembly 213 enables the dispensing head 211 to reciprocate along the width direction of the material belt 200. The vertical drive component 212 and the horizontal drive component 213 work together to enable the dispensing head 211 to dispense adhesive onto the material belt 200.

[0068] Reference Figure 3 and Figure 4 An adhesive storage device 8 is provided between the dispensing device 2 and the mounting device 3. The adhesive storage device 8 includes a second vacuum suction cylinder 81. The adhesive tape 200 is fed into the mounting device 3 after passing through the second vacuum suction cylinder 81 from the dispensing device 2. By setting the second vacuum suction cylinder 81, on the one hand, the tension of the adhesive tape 200 surface can be controlled by controlling the vacuum degree of the second vacuum suction cylinder 81. On the other hand, during the curing period of the adhesive on the adhesive tape 200, the second vacuum suction cylinder 81 can temporarily maintain the adhesive in the state it was in before leaving the dispensing station, preventing the adhesive from curing or deteriorating prematurely or from spilling during the conveying process.

[0069] Reference Figure 4 and Figure 7 The mounting device 3 includes a mounting machine 31, and an active positioning platform 7, identical to that on the underside of the dispensing machine 21, is provided on the lower side of the mounting machine 31. This enables automatic feeding and positioning of the tape 200 during the mounting process.

[0070] Reference Figure 3 and Figure 7 The mounting device 3 also includes a chip loading assembly 32, which includes a wafer motion module 322. The wafer motion module 322 is vertically arranged below the active positioning platform 7 on the lower side of the mounting machine 31. The wafer motion module 322 includes a wafer mounting platform 3221. A wafer driver 3222 is arranged on the lower side of the wafer mounting platform 3221. Therefore, by setting the wafer driver 3222, automatic positioning of the wafer can be achieved after the wafer is installed in the wafer mounting platform 3221.

[0071] Reference Figure 3 and Figure 7 The wafer motion module 322 has a pin system 321 on its vertically lower side. The pin system 321 is arranged in the vertical direction, and the pin extension end of the pin system 321 is set directly in the vertical direction to the wafer inside the wafer motion module 322. Therefore, the chip can be ejected from the wafer through the pin system 321.

[0072] Reference Figure 7 and Figure 8 The wafer motion module 322 has a transfer component 323 on its upper vertical side. The transfer component 323 includes a suction head 3231, which is arranged vertically and has a suction port 3232 at its lower end. The suction port 3232 is arranged vertically and faces the ejector system 321. Therefore, when the ejector system 321 ejects the chip from the wafer, the suction port 3232 can pick up the ejected chip by negative pressure suction, thus realizing the chip picking function.

[0073] The upper end of the suction head 3231 is also provided with a suction port 3232, and a flipping drive 3233 is provided on one side of the suction head 3231 along the horizontal direction. The flipping drive 3233 is connected to the middle of the suction head 3231 along the vertical direction. Therefore, under the drive of the flipping drive 3233, the suction head 3231 flips 180° in the vertical direction each time, so that the suction port 3232 at the lower end of the suction head 3231 picks up the chip. The flipping drive 3233 can flip the suction port 3232 of the suction head 3231 with the chip in it to a vertically upward position, so as to facilitate the feeding of the chip to the placement machine 31. At the same time, the suction port 3232 at the upper end of the suction head 3231 is flipped to a vertically downward position, at which time the suction port 3232 can pick up the chip. Therefore, by setting up the suction head 3231 of the dual suction port 3232, and cooperating with the flip drive 3233, the chip picking and feeding work can be carried out synchronously, thus accelerating the chip picking speed and the continuity of picking.

[0074] Reference Figure 7 and Figure 9The placement machine 31 includes several placement heads 311 and a station switching drive 312. The station switching drive 312 uses a DD motor. The placement heads 311 are all located below the station switching drive 312 and are evenly spaced around it circumferentially. When the station switching drive 312 rotates, one placement head 311 is vertically aligned with the suction port 3232 at the upper end of the suction head 3231. Simultaneously, another placement head 311 is vertically positioned directly above the corresponding active positioning platform 7 and directly opposite the material tape 200 on the active positioning platform 7. Thus, by driving the several placement heads 311 to rotate synchronously through the station switching drive 312, each placement head 311 can switch from the chip picking station to the chip placement station, thereby ensuring the continuity and speed of the placement process.

[0075] Reference Figure 3 and Figure 7 The placement machine 31 also includes a visual orientation corrector 313, which employs a CCD vision system. The visual orientation corrector 313 is positioned horizontally, with its detection unit directly facing the lower end of a placement head 311. By using the visual orientation corrector 313, the chip picked up by the placement head 311 can be photographed and its orientation determined, improving the positioning accuracy of chip placement.

[0076] Several visual attitude correctors 313 can be configured. These visual attitude correctors 313 are divided into two parts: one part is arranged clockwise around the station switching drive 312 between the transfer assembly 323 and the corresponding active positioning platform 7; the other part is arranged counterclockwise around the station switching drive 312 between the transfer assembly 323 and the corresponding active positioning platform 7. Therefore, regardless of whether the station switching drive 312 rotates forward or backward, the chip passes through the corresponding visual attitude corrector 313 after the placement head 311 picks up the chip, ensuring that the chip's attitude can be positioned by the placement head 311 before chip placement.

[0077] Reference Figure 7 and Figure 9In this application, the number of placement heads 311 is not less than three, and preferably four. When three placement heads 311 are used, at the same time, one placement head 311 is in the chip picking station, that is, at this time the placement head 311 is directly above the pick-up head 3231, and this placement head 311 performs chip picking; one placement head 311 is in the chip placement station, that is, at this time the placement head 311 is directly above the corresponding positioning platform, and this placement head 311 performs chip placement; one placement head 311 is in the chip posture positioning station, that is, at this time the placement head 311 is horizontally positioned directly opposite the visual posture corrector 313, and the visual posture corrector 313 performs posture positioning on the chip picked up by the placement head 311. By rotating the station switching drive 312 once, the corresponding placement head 311 will switch sequentially according to the chip picking station, chip posture positioning, and chip placement station, thereby realizing the smoothness and speed of each operation in the chip placement process.

[0078] When using four placement heads 311, two vision orientation correctors 313 and two corresponding vision orientation correction stations are set up. The two vision orientation correctors 313 are set facing each other horizontally, so that the station switching drive 312 rotates clockwise or counterclockwise around the circumference. There is always a vision orientation correction station between the chip placement station and the chip picking station. Therefore, regardless of whether the station switching drive 312 rotates clockwise or counterclockwise, each placement head 311 can sequentially pass through the chip picking station, chip orientation positioning, and chip placement station to achieve chip placement.

[0079] Reference Figure 1 and Figure 10 A mounting storage device 9 is provided between the mounting device 3 and the hot pressing device 4. The mounting storage device 9 includes a third vacuum suction cylinder 91 and a floating roller group 92. Along the conveying direction of the material strip 200, the third vacuum suction cylinder 91 is positioned between the floating roller groups 92. The material strip 200 is fed from the mounting device 3 into the third vacuum suction cylinder 91, and discharged from the third vacuum suction cylinder 91 into the floating roller group 92. The floating roller group 92 includes several floating rollers, one end of which is connected to a drive cylinder or drive motor in the vertical or horizontal direction. The setting of the third vacuum suction cylinder 91, due to the vacuum, can keep the material strip 200 tightly attached to the inner wall of the third vacuum suction cylinder 91, which can ensure the tension of the material strip 200 during the curing period of chip mounting. At the same time, the material strip 200 is tensioned in a non-contact manner, which will not affect the position of the chip. Therefore, it can protect the chip and prevent the chip from shifting or moving during the conveying process of the material strip 200. The floating roller group 92 can store longer strips 200 and can quickly transport long strips 200 to the hot pressing station.

[0080] Reference Figure 10The hot pressing device 4 includes several first hot pressing heads 41 and several second hot pressing heads 42. The first hot pressing heads 41 and the second hot pressing heads 42 are arranged one-to-one in the vertical direction. The several first hot pressing heads 41 are evenly spaced along the conveying direction of the material strip 200. The material strip 200 passes through the gap between the first hot pressing head 41 and the corresponding second hot pressing head 42 in the vertical direction. Therefore, when the material strip 200 is in the hot pressing device 4, the first hot pressing head 41 is heated and then presses down vertically. The corresponding second hot pressing head 42 is heated and then moves up, thereby strengthening the corresponding chip on the material strip 200 and bonding it to the material strip 200, realizing the curing and encapsulation of the chip.

[0081] Reference Figure 10 A hot pressing storage device 10 is provided between the hot pressing device 4 and the take-up device 6. The hot pressing storage device 10 uses several floating rollers, which can output a longer strip 200, and also facilitates buffering between different winding speeds in the take-up device 6.

[0082] Reference Figure 10 The detection device 5 is located between the hot-press storage device 10 and the receiving device 6. The detection device 5 uses a position detector and faces the side of the material strip 200 where the chip is mounted. It is used to detect the position of the chip mounting.

[0083] Reference Figure 10 The material receiving device 6 includes a take-up roller 61 and several second auxiliary rollers 62. The take-up roller 61 is coaxially connected to a take-up motor. After passing through several second auxiliary rollers 62, the material strip 200 is connected to the take-up roller 61 to realize the take-up of the material strip 200.

[0084] Reference Figure 10 The receiving device 6 also includes a protective film feeding roller 63 and a third auxiliary roller 64. The protective film feeding roller 63 feeds the protective film onto the adhesive roller 721 and the material strip 200 passes through the third auxiliary roller 64. The third auxiliary roller 64 presses the protective film against the side of the material strip 200 where the chip is installed, thus covering the material strip 200 with a protective film to protect the material strip 200.

[0085] The implementation principle of this application embodiment is as follows: the feeding device 1 unwinds the material strip 200 into the dispensing device 2.

[0086] The dispensing device 2, in conjunction with the corresponding active positioning platform 7 and the CCD vision attitude corrector 313, precisely positions the material strip 200. After positioning, the dispensing head 211 dispenses adhesive onto the material strip 200. After dispensing, the material strip 200 is conveyed to the dispensing storage device 8 for storage.

[0087] The tape 200, after being fed into the placement unit 3 via the dispensing and storage device 8, is positioned by the corresponding active positioning platform 7. Then, through the cooperation of the chip loading component 32 and the placement machine 31 within the placement unit 3, the entire process from chip loading to placement is completed. After placement, the tape 200 is sent to the placement storage device 9 for storage.

[0088] The tape 200, after passing through the mounting storage device 9, enters the hot pressing device 4, where the chip on the tape 200 is hot-pressed and packaged. After hot pressing and packaging, the tape 200 is sent into the hot pressing storage device 10 for storage.

[0089] The material strip 200, after passing through the hot-press storage device 10, is fed into the take-up device 6 for winding. Before winding, the side of the material strip 200 with the chip attached is detected by the position detector in the detection device 5 to check the chip position and mark chips with inaccurate positions. After the detection is completed, a protective film is applied to the chip side of the material strip 200 mounting head 311 through the cooperation of the protective film feeding roller 63 and the third auxiliary roller 64.

[0090] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A chip mounting apparatus characterized by comprising: The application relates to a chip mounting device, which comprises a feeding device (1), a glue dispensing device (2), a mounting device (3), a hot pressing device (4), a detecting device (5) and a collecting device (6); the glue dispensing device (2) comprises a glue dispenser (21), the mounting device (3) comprises a mounting machine (31), and the glue dispenser (21) and the mounting machine (31) are both provided with a driving positioning platform (7) at lower sides in a vertical direction; the driving positioning platform (7) comprises a driving positioning plate (71), transmission roller groups (72) for feeding a conveying belt (200) are arranged on both sides of the driving positioning plate (71) along the length direction of the driving positioning plate (71), and a positioning driving assembly (73) for driving the driving positioning plate (71) to move in a horizontal plane is arranged on the driving positioning plate (71). The positions of the glue dispenser (21) and the mounting machine (31) are fixed, and the positioning driving assembly (73) is used for driving the driving positioning plate (71) to finely adjust and correct.

2. The chip mounter according to Claim 1, wherein The transmission roller groups (72) comprise glue pressing rollers (721) and conveying rollers (722), the glue pressing rollers (721) and the conveying rollers (722) are arranged in parallel and are spaced apart in a vertical direction, the glue pressing rollers (721) and the conveying rollers (722) are arranged in the width direction of the driving positioning plate (71) in an axial direction, and the conveying roller (722) is coaxially connected with a driving motor for driving the conveying roller (722) to rotate.

3. The chip mounter according to Claim 1, wherein The positioning driving assembly (73) comprises first driving members (731) and second driving members (732), the first driving members (731) and the second driving members (732) are connected with the driving positioning plate (71), and the driving directions of the first driving members (731) and the second driving members (732) are arranged in perpendicular to each other.

4. The chip mounter according to Claim 1, wherein CCD visual detecting systems (22) are arranged on both sides of the driving positioning plate (71) along the length direction of the driving positioning plate (71), and the detecting parts of the CCD visual detecting systems (22) are arranged towards the corresponding driving positioning plate (71) in a vertical direction.

5. The chip mounter according to Claim 1, wherein The mounting device (3) further comprises a chip feeding assembly (32), the chip feeding assembly (32) comprises a thimble system (321), a wafer movement module (322) and a transfer assembly (323) for conveying chips to the mounting machine (31), the thimble system (321) and the transfer assembly (323) are arranged on both sides of the wafer movement module (322) in a vertical direction respectively, and the thimble system (321) and the transfer assembly (323) are arranged in a vertical direction and face each other.

6. The chip mounter according to Claim 5, wherein The transfer assembly (323) comprises a suction head (3231), the suction head (3231) is arranged in a vertical direction, a suction port (3232) for sucking chips is arranged at one end of the suction head (3231) in a vertical direction, and a turnover driving member (3233) for driving the suction head (3231) to overturn in a vertical direction is connected to the suction head (3231).

7. The chip mounter according to Claim 6, wherein The suction head (3231) is provided with the suction port (3232) at both ends in the vertical direction, and the turnover driving member (3233) is connected with the middle part of the suction head (3231) in the vertical direction.

8. The chip mounter according to Claim 5, wherein The mounting machine (31) comprises a plurality of mounting heads (311) and a station switching driving member (312), the mounting heads (311) are uniformly arranged around the station switching driving member (312) in the circumferential direction of the station switching driving member (312), and the station switching driving member (312) is used for driving the mounting heads (311) to rotate about the central axis of the station switching driving member (312); when the station switching driving member (312) rotates, one mounting head (311) is arranged opposite to the corresponding active positioning platform (7) in the vertical direction, and another mounting head (311) is arranged opposite to the transfer assembly (323) in the vertical direction.

9. The chip mounter according to Claim 8, wherein The mounting machine (31) further comprises a visual posture corrector (313), and the visual posture corrector (313) is arranged opposite to the mounting heads (311) in the horizontal direction.

10. A chip mounting device according to claim 9, characterized in that, A plurality of visual posture correctors (313) are arranged, and the visual posture correctors (313) are arranged between the transfer assembly (323) and the corresponding active positioning platform (7) in the clockwise circumferential direction of the station switching driving member (312) and between the transfer assembly (323) and the corresponding active positioning platform (7) in the counterclockwise circumferential direction of the station switching driving member (312) respectively.

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