A wafer de-gluing and deburring device

Abstract

The present invention relates to a wafer debonding and de-ringing device, which includes an adsorption and alignment stage assembly, a Y-direction alignment shaft, a Z-direction lifting shaft, a θ rotation shaft, a right stripping knife assembly, and a left stripping knife assembly; a Y-direction alignment shaft is arranged directly above the adsorption and alignment stage assembly, and the Y-direction alignment shaft can drive the upper Z-direction lifting shaft to move along the Y-axis direction, and the Z-direction lifting shaft can drive the θ rotation shaft to move along the Z-axis direction. The θ rotation shaft is used to grasp the wafer located on the adsorption and alignment stage assembly. The right stripping knife assembly and the left stripping knife assembly are respectively located on both sides of the adsorption and alignment stage assembly along the X-axis direction, and are used for stripping the waste ring on the wafer. The present invention is a device developed for de-ringing by laser cutting method, which is convenient for separating the peripheral crystal ring and the internal wafer, and adopts bilateral UV lamp irradiation and bilateral roller stripping knives to improve the efficiency of debonding and de-ringing.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor processing, and particularly to a wafer de-gluing and de-ringing device. Background Art

[0002] In the back grinding (TAIKO) process of wafers in the semiconductor industry, only the central area of the wafer is ground and thinned, and a crystal ring with a width of about 3 - 4 mm is reserved at the outer peripheral edge of the wafer, so as to reduce the warping deformation of the wafer, improve the strength of the wafer, and ensure the use requirements of the wafer in subsequent processes. However, retaining this ring of crystal ring makes it difficult to directly process the subsequent measurement and cutting processes, so it needs to be removed first.

[0003] After a large amount of retrieval, it is found that the prior art publication number CN114639623A discloses a device for wafer edge de-gluing, including a first box body, a sliding groove, a transmission cylinder, a hot air blower and a fixing plate. A wafer placement plate is installed inside the first box body. The side of the transmission cylinder is connected to the inner walls of the first box body and the second box body. A timer board is installed on the inner wall of the first box body, and a timer is installed inside the installation groove. The hot air blower is installed inside the second box body, and an annular air outlet is opened on the bottom surface of the hot air blower. A top cover is arranged on the top of the second box body, and a rubber buffer plate is installed on the surface of the top cover. Through the designed hot air mechanism in the present invention, the hot air blown by the hot air blower in the hot air mechanism is blown from the annular air outlet to the edge of the wafer, which can accelerate the de-gluing speed of the ultraviolet light on the edge of the wafer. The designed timer board, the first buffer block and the timer are convenient for the staff to monitor the de-gluing process of the wafer in real time, and the wafer with the de-gluing completed can be pulled out in time.

[0004] In summary, the currently commonly used wafer cutting methods mainly include blade cutting, laser cutting, and plasma cutting. The TAIKO wafers that need to be de-ringed are generally bonded to the UV film of the steel ring. Blade cutting requires controlling the depth of the blade cutting into the film, which should cut through the wafer without cutting through the film or damaging the cutting wheel. Laser cutting is convenient for controlling the depth of the laser focus and can accurately cut the wafer without damaging the UV film. After cutting the wafer, ultraviolet light is irradiated on the UV film part of the outer crystal ring, so that the viscosity of the film is reduced, making it convenient to remove the crystal ring.

[0005] In view of the above defects, the inventor actively conducts research and innovation in order to create a wafer de-gluing and de-ringing device, making it more valuable in industrial applications. Summary of the Invention

[0006] To solve the above technical problems, the purpose of the present invention is to provide a wafer de-gluing and de-ringing device.

[0007] To achieve the above purpose, the present invention adopts the following technical solutions:

[0008] A wafer de-gluing and de-ringing device, comprising an adsorption and alignment stage assembly, a Y-direction alignment shaft, a Z-direction lifting shaft, a θ-rotation shaft, a right stripping knife assembly and a left stripping knife assembly;

[0009] A Y-direction alignment shaft is arranged directly above the adsorption and alignment stage assembly. The Y-direction alignment shaft can drive the upper Z-direction lifting shaft to move along the Y-axis direction. The Z-direction lifting shaft can drive the θ-rotation shaft to move along the Z-axis direction. The θ-rotation shaft is used to grasp the wafer located on the adsorption and alignment stage assembly. The right stripping knife assembly and the left stripping knife assembly are respectively located on both sides of the adsorption and alignment stage assembly along the X-axis direction, and are used for stripping the waste ring on the wafer;

[0010] A CCD imaging assembly is arranged on the adsorption and alignment stage assembly between the right stripping knife assembly and the left stripping knife assembly. Right and left UV lamp assemblies are respectively arranged on both sides of the bottom of the Y-direction alignment shaft along the X-axis direction;

[0011] The adsorption and alignment stage assembly includes a base bottom plate. Handles are installed on both sides of the base bottom plate along the X-axis direction. A circular adsorption stage is arranged at the middle position of the base bottom plate. A plurality of suction cups are arranged on the adsorption stage along the circumferential direction;

[0012] The Y-direction alignment shaft includes a platform bottom plate, a Y-axis linear module and a Y-axis moving plate. The Y-axis linear module is installed on the platform bottom plate and can drive the Y-axis moving plate to move along the Y-axis direction;

[0013] The Z-direction lifting shaft includes a Z-axis mounting plate, a Z-axis motor and a Z-axis moving plate. The Z-axis motor is installed on the Z-axis mounting plate and can drive the lower Z-axis moving plate to move along the Z-axis direction through a lead screw and a bearing assembly;

[0014] The θ-rotation shaft includes a θ-axis mounting plate, a θ-axis motor, a rotating table, a coupling cylinder and an adsorption disc. The θ-axis motor is installed along the Z-axis direction on the θ-axis mounting plate and can drive the lower rotating table to rotate. The rotating table is connected to the lower adsorption disc adapter plate through the coupling cylinder. An adsorption disc is installed at the bottom of the adsorption disc adapter plate;

[0015] The four sides of the base bottom plate are all connected to the upper platform bottom plate through support columns. The Z-axis mounting plate is installed on the Y-axis moving plate through a plurality of Y-axis triangular braces. The θ-axis mounting plate is installed on the Z-axis mounting plate through a plurality of θ-axis triangular braces. The coupling cylinder can pass through the bottom plate hole on the platform bottom plate and be connected to the adsorption disc adapter plate located below the platform bottom plate. The adsorption disc is located above the adsorption stage.

[0016] As a further improvement of the present invention, the right blade stripping assembly or the left blade stripping assembly includes a blade X-axis module, a blade mounting plate, blades, and universal balls. The blade X-axis module is mounted on the base floor, and the blade X-axis module can drive the upper blade mounting plate to move along the X-axis direction. At least one blade is mounted on the blade mounting plate along the Y-axis direction and facing the adsorption stage, and universal balls are mounted on the blade mounting plate outside the blades.

[0017] As a further improvement of the present invention, the CCD imaging assembly includes a lens clamping block, a slide table mounting plate, a lens, and a camera. The slide table mounting plate is mounted on the base floor. The lens clamping block is mounted on the slide table mounting plate through a Z-axis slide. A camera is mounted at the bottom of the lens clamping block, a lens is mounted at the top of the lens clamping block, a light source is mounted on one side of the lens, and an imaging hole is provided on the base floor directly above the lens.

[0018] As a further improvement of the present invention, the right UV lamp assembly or the left UV lamp assembly includes a UV lamp mounting block, a retracting cylinder, and a UV lamp. The retracting cylinder is mounted along the X-axis direction at the bottom of the platform floor. The UV lamp is mounted on the adjusting mounting block through the UV lamp mounting block, and the retracting cylinder can drive the lower adjusting mounting block to move along the X-axis direction.

[0019] As a further improvement of the present invention, a waste cleaning assembly is further provided below the adsorption alignment stage assembly. The waste cleaning assembly includes a waste box, a brush mounting plate, a rodless cylinder, and a brush. The waste box is located directly below the adsorption stage and is arranged along the X-axis direction. The brush mounting plate is mounted in the waste box along the Y-axis direction. The rodless cylinder on one side of the waste box can drive the brush mounting plate to move along the X-axis direction in the waste box. A brush is mounted on one side of the brush mounting plate along the positive X-axis direction, and a waste box handle is mounted on one side of the waste box along the negative X-axis direction.

[0020] As a further improvement of the present invention, a Y-axis guide rail protective cover is provided on the Y-axis guide rail of the Y-axis linear module, and a Z-axis guide rail protective cover is provided on the Z-axis guide rail of the Z-axis motor.

[0021] As a further improvement of the present invention, a drag chain is mounted on the platform floor on one side of the Y-axis linear module. The drag chain is connected to the Y-axis moving plate, and a vacuum assembly is mounted on the platform floor on one side of the drag chain.

[0022] As a further improvement of the present invention, an air-electric slip ring mounting cylinder is mounted along the Z-axis direction in the connection cylinder. An air-electric slip ring is mounted at the top of the air-electric slip ring mounting cylinder. The air-electric slip ring is mounted on the air-electric slip ring tail frame, and the air-electric slip ring tail frame is mounted on the θ-axis triangular support.

[0023] By means of the above solution, the present invention has at least the following advantages:

[0024] The present invention is a device developed for removing rings by laser cutting method, which facilitates the separation of the peripheral crystal ring and the internal wafer. By using bilateral UV lamp irradiation and bilateral roller stripping knives, the efficiency of glue removal and ring removal is improved;

[0025] The present invention can be used as an independent platform or integrated into an automated machine;

[0026] The present invention can realize the glue removal and ring removal process for wafers of different sizes by replacing the adsorption carrier platform and adsorption disc of different sizes;

[0027] The present invention uses a CCD image to accurately locate the rotation center of the product, can completely peel the waste ring from the UV film, and prevent the stripping knife from damaging the remaining product;

[0028] The present invention avoids the need for a separate mechanism for clamping the waste ring. The waste ring falls by its own weight. By setting a reasonable blanking height, the waste ring is prevented from breaking after falling;

[0029] The waste cleaning component of the present invention can automatically clean the waste ring into the storage box, facilitating automation and improving production efficiency.

[0030] The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly and implement it according to the content of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 is a schematic structural diagram of a wafer glue removal and ring removal device of the present invention;

[0033] Figure 2 is Figure 1 a schematic structural diagram of the adsorption and alignment carrier assembly in;

[0034] Figure 3 is Figure 1 a schematic structural diagram of the Y-direction alignment shaft in;

[0035] Figure 4 is Figure 1 a schematic structural diagram of the Z-direction lifting shaft in;

[0036] Figure 5 is Figure 1Schematic diagram of the structure of the θ rotation axis;

[0037] Figure 6 is Figure 1 Schematic diagram of the structure of the right or left knife peeling component;

[0038] Figure 7 is Figure 1 Schematic diagram of the structure of the waste cleaning component;

[0039] Figure 8 is Figure 1 Schematic diagram of the structure of the CCD imaging component;

[0040] Figure 9 is Figure 1 Schematic diagram of the structure of the right or left UV lamp component.

[0041] Among them, the meanings of the reference numerals in the figures are as follows.

[0042] A - Adsorption alignment stage component, B - Y-axis alignment axis, C - Z-axis lifting axis, D - θ rotation axis, E1 - Right knife peeling component, E2 - Left knife peeling component, F - Waste cleaning component, G - CCD imaging component, H1 - Right UV lamp component, H2 - Left UV lamp component, I - Wafer, J - Waste ring;

[0043] 1 - Base floor plate, 2 - Adsorption stage, 3 - Handle, 4 - Support column, 5 - Suction cup;

[0044] 6 - Platform floor plate, 7 - Y-axis guide rail protection cover, 8 - Y-axis linear module, 9 - Y-axis moving plate, 10 - Drag chain, 11 - Vacuum component;

[0045] 12 - Y-axis triangular brace, 13 - Z-axis guide rail protection cover, 14 - Z-axis mounting plate, 15 - Z-axis motor, 16 - Lead screw and bearing assembly, 17 - Z-axis moving plate;

[0046] 18 - θ-axis mounting plate, 19 - θ-axis triangular brace, 20 - Pneumatic and electrical slip ring tailstock, 21 - Pneumatic and electrical slip ring, 22 - θ-axis motor, 23 - Pneumatic and electrical slip ring mounting cylinder, 24 - Rotating table, 25 - Connecting cylinder, 26 - Suction cup adapter plate, 27 - Suction cup;

[0047] 28 - Knife peeling X-axis module, 29 - Knife peeling mounting plate, 30 - Knife peeling tool, 31 - Universal ball;

[0048] 32 - Waste box, 33 - Waste box handle, 34 - Brush mounting plate, 35 - Rodless cylinder, 36 - Brush;

[0049] 37 - Lens clamping block, 38 - Light source, 39 - Slide mounting plate, 40 - Lens, 41 - Slide, 42 - Camera;

[0050] 43 - UV lamp mounting block, 44 - avoidance cylinder, 45 - adjustment mounting block, 46 - UV lamp. Detailed implementation manners

[0051] The following will further describe in detail the specific implementation manners of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0052] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Usually, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but only represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention.

[0053] Embodiment

[0054] As Figures 1 to 9 shown,

[0055] A wafer de-gluing and de-ringing device includes an adsorption and alignment stage assembly A, a Y-direction alignment shaft B, a Z-direction lifting shaft C, a θ-rotation shaft D, a right stripping knife assembly E1 and a left stripping knife assembly E2;

[0056] Above the adsorption and alignment stage assembly A, a Y-direction alignment shaft B is provided. The Y-direction alignment shaft B can drive the upper Z-direction lifting shaft C to move along the Y-axis direction. The Z-direction lifting shaft C can drive the θ-rotation shaft D to move along the Z-axis direction. The θ-rotation shaft D is used to grasp the wafer I located on the adsorption and alignment stage assembly A. The right stripping knife assembly E1 and the left stripping knife assembly E2 are respectively located on both sides of the adsorption and alignment stage assembly A along the X-axis direction, and are used for stripping the waste ring J on the wafer I;

[0057] A CCD imaging assembly G is provided on the adsorption and alignment stage assembly A between the right stripping knife assembly E1 and the left stripping knife assembly E2. On both sides of the bottom of the Y-direction alignment shaft B along the X-axis direction, a right UV lamp assembly H1 and a left UV lamp assembly H2 are respectively provided;

[0058] The adsorption and alignment stage assembly A includes a base bottom plate 1. On both sides of the base bottom plate 1 along the X-axis direction, handles 3 are installed. In the middle position of the base bottom plate 1, an annular adsorption stage 2 is provided. Along the circumferential direction of the adsorption stage 2, a plurality of suction cups 5 are provided;

[0059] The Y-axis alignment shaft B includes a platform bottom plate 6, a Y-axis linear module 8, and a Y-axis moving plate 9. The Y-axis linear module 8 is installed on the platform bottom plate 6 and can drive the Y-axis moving plate 9 to move along the Y-axis direction;

[0060] The Z-axis lifting shaft C includes a Z-axis mounting plate 14, a Z-axis motor 15, and a Z-axis moving plate 17. The Z-axis motor 15 is installed on the Z-axis mounting plate 14 and can drive the lower Z-axis moving plate 17 to move along the Z-axis direction through a lead screw and bearing assembly 16;

[0061] The θ-rotation shaft D includes a θ-axis mounting plate 18, a θ-axis motor 22, a rotating table 24, a coupling cylinder 25, and a suction cup 27. The θ-axis motor 22 is installed on the θ-axis mounting plate 18 along the Z-axis direction and can drive the lower rotating table 24 to rotate. The rotating table 24 is connected to the lower suction cup adapter plate 26 through the coupling cylinder 25, and the suction cup 27 is installed at the bottom of the suction cup adapter plate 26;

[0062] The four sides of the base bottom plate 1 are all connected to the upper platform bottom plate 6 through support columns 4. The Z-axis mounting plate 14 is installed on the Y-axis moving plate 9 through a plurality of Y-axis triangular braces 12. The θ-axis mounting plate 18 is installed on the Z-axis mounting plate 14 through a plurality of θ-axis triangular braces 19. The coupling cylinder 25 can pass through the bottom plate hole on the platform bottom plate 6 and be connected to the suction cup adapter plate 26 located below the platform bottom plate 6. The suction cup 27 is located above the suction carrier 2.

[0063] Preferably, the right stripping knife assembly E1 or the left stripping knife assembly E2 includes a stripping knife X-axis module 28, a stripping knife mounting plate 29, a stripping knife 30, and a universal ball 31. The stripping knife X-axis module 28 is installed on the base bottom plate 1. The stripping knife X-axis module 28 can drive the upper stripping knife mounting plate 29 to move along the X-axis direction. At least one stripping knife 30 is installed on the stripping knife mounting plate 29 along the Y-axis direction and facing the suction carrier 2. The universal ball 31 is installed on the stripping knife mounting plate 29 outside the stripping knife 30.

[0064] Preferably, the CCD imaging assembly G includes a lens clamping block 37, a slide table mounting plate 39, a lens 40, and a camera 42. The slide table mounting plate 39 is installed on the base bottom plate 1. The lens clamping block 37 is installed on the slide table mounting plate 39 through a Z-axis slide table 41. The camera 42 is installed at the bottom of the lens clamping block 37. The lens 40 is installed at the top of the lens clamping block 37. A light source 38 is installed on one side of the lens 40. An imaging hole is opened on the base bottom plate 1 directly above the lens 40.

[0065] Preferably, the right UV lamp assembly H1 or the left UV lamp assembly H2 includes a UV lamp mounting block 43, an avoidance cylinder 44 and a UV lamp 46. The avoidance cylinder 44 is installed at the bottom of the platform base plate 6 along the X-axis direction. The UV lamp 46 is installed on the adjustment mounting block 45 through the UV lamp mounting block 43. The avoidance cylinder 44 can drive the lower adjustment mounting block 45 to move along the X-axis direction.

[0066] Preferably, a waste cleaning assembly F is also provided below the adsorption alignment platform assembly A, and the waste cleaning assembly F includes a waste box 32, a brush mounting plate 34, a rodless cylinder 35 and a brush 36. The waste box 32 is located directly below the adsorption platform 2 and is arranged along the X-axis direction. The brush mounting plate 34 is installed in the waste box 32 along the Y-axis direction. The rodless cylinder 35 on one side of the waste box 32 can drive the brush mounting plate 34 to move in the waste box 32 along the X-axis direction. A brush 36 is installed on one side of the brush mounting plate 34 along the positive direction of the X-axis, and a waste box handle 33 is installed on one side of the waste box 32 along the negative direction of the X-axis.

[0067] Preferably, a Y-axis guide rail protective cover 7 is provided on the Y-axis guide rail on the Y-axis linear module 8 , and a Z-axis guide rail protective cover 13 is provided on the Z-axis guide rail on the Z-axis motor 15 .

[0068] Preferably, a drag chain 10 is installed on the platform bottom plate 6 on one side of the Y-axis linear module 8 , the drag chain 10 is connected to the Y-axis moving plate 9 , and a vacuum component 11 is installed on the platform bottom plate 6 on one side of the drag chain 10 .

[0069] Preferably, a gas-electric slip ring mounting cylinder 23 is installed in the connecting cylinder 25 along the Z-axis direction, a gas-electric slip ring 21 is installed on the top of the gas-electric slip ring mounting cylinder 23, the gas-electric slip ring 21 is installed on the gas-electric slip ring tail frame 20, and the gas-electric slip ring tail frame 20 is installed on the θ-axis triangular support 19.

[0070] The positional relationship and connection relationship between the components of the present invention are as follows:

[0071] The Y-axis alignment axis B is installed on the adsorption alignment platform component A, the Z-axis lifting axis C can drive the θ rotation axis D to move up and down, and the Z-axis lifting axis is installed on the Y-axis alignment axis; the right stripping knife component E1 and the left stripping knife component E2 are respectively installed on the basic bottom plate 1, and are symmetrically arranged on the left and right sides of the adsorption platform 2; the waste cleaning component F is located under the adsorption alignment platform component to receive the waste; the CCD imaging component G is installed under the basic bottom plate 1; the right UV lamp component H1 and the left UV lamp component H2 are installed on the back of the platform bottom plate 6, and are symmetrically arranged on the left and right sides of the adsorption platform 2.

[0072] Working principle and working process of the present invention:

[0073] An artificial or wafer manipulator places a wafer I product to be de-ringed on the adsorption stage 2. The suction cup 5 holds the wafer steel ring to prevent the product from shifting during the operation of the equipment. The Z-axis lifting shaft C drives the θ-rotation shaft D to descend. The suction cup 5 breaks the vacuum, and the adsorption disc 27 picks up the product. The Z-axis lifting shaft ascends. The Y-axis alignment shaft B moves above the lens 40 of the CCD imaging module G. The θ-rotation shaft rotates one full circle, and the CCD imaging module G takes a photo of the arc of the wafer. The Y-axis alignment shaft B returns above the adsorption stage 2. The software algorithm fits the center of the circle to obtain the deviation values in the X and Y directions after the product is placed on the stage. The Y-axis alignment shaft first corrects the deviation in the Y direction, and then after the θ-rotation shaft rotates the product by 90°, the Y-axis alignment shaft B corrects the deviation in the X direction, thus completing the precise positioning of the product and preparing for the next step of separating the waste ring by the stripping knife. At this time, the product has been precisely positioned. The right stripping knife assembly E1 and the left stripping knife assembly E2 move below the product steel ring driven by the stripping knife X-axis module. The Z-axis lifting shaft C descends, gently pressing the steel ring onto the universal ball 31. The steel ring will warp and temporarily undergo micro-deformation. The stripping knife module moves again to insert the blade of the stripping knife 30 into the gap between the outer peripheral crystal ring and the UV film. The left UV lamp assembly and the right UV lamp assembly avoid the cylinder 44 to extend the UV lamp 46. The UV lamp is turned on for irradiation. The θ-rotation shaft rotates an appropriate number of turns until the outer peripheral crystal ring automatically falls into the waste box 32. The rodless cylinder 35 drives the brush 36 to sweep the waste ring into the storage box. After the waste ring J falls, the left and right UV lamp assemblies avoid, the left and right stripping knife assemblies avoid, the Z-axis lifting shaft descends, the adsorption disc 27 releases the product on the adsorption stage, and then the product is taken away by an artificial or manipulator, thus completing the glue removal and de-ringing of one product.

[0074] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0075] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection: it can be a mechanical connection or an electrical connection: it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.

[0076] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer de-gluing and deburring device, comprising an adsorption and alignment stage assembly (A), a Y-direction alignment shaft (B), a Z-direction lifting shaft (C), a θ-rotation shaft (D), a right deburring blade assembly (E1) and a left deburring blade assembly (E2); characterized in that: A Y-direction alignment shaft (B) is arranged directly above the adsorption and alignment stage assembly (A). The Y-direction alignment shaft (B) can drive the upper Z-direction lifting shaft (C) to move along the Y-axis direction. The Z-direction lifting shaft (C) can drive the θ-rotation shaft (D) to move along the Z-axis direction. The θ-rotation shaft (D) is used to grasp the wafer (I) located on the adsorption and alignment stage assembly (A). The right deburring blade assembly (E1) and the left deburring blade assembly (E2) are respectively located on both sides of the adsorption and alignment stage assembly (A) along the X-axis direction and are used for peeling the waste ring (J) on the wafer (I); A CCD imaging assembly (G) is arranged on the adsorption and alignment stage assembly (A) between the right deburring blade assembly (E1) and the left deburring blade assembly (E2). On both sides of the bottom of the Y-direction alignment shaft (B) along the X-axis direction, a right UV lamp assembly (H1) and a left UV lamp assembly (H2) are respectively arranged; The adsorption and alignment stage assembly (A) includes a base bottom plate (1). Handles (3) are installed on both sides of the base bottom plate (1) along the X-axis direction. A circular adsorption stage (2) is arranged at the middle position of the base bottom plate (1). A plurality of suction cups (5) are arranged on the adsorption stage (2) along the circumferential direction; The Y-direction alignment shaft (B) includes a platform bottom plate (6), a Y-axis linear module (8) and a Y-axis moving plate (9). The Y-axis linear module (8) is installed on the platform bottom plate (6) and can drive the Y-axis moving plate (9) to move along the Y-axis direction; The Z-direction lifting shaft (C) includes a Z-axis mounting plate (14), a Z-axis motor (15) and a Z-axis moving plate (17). The Z-axis motor (15) is installed on the Z-axis mounting plate (14) and can drive the lower Z-axis moving plate (17) to move along the Z-axis direction through a lead screw and bearing assembly (16); The θ-rotation shaft (D) includes a θ-axis mounting plate (18), a θ-axis motor (22), a rotating table (24), a coupling cylinder (25) and an adsorption disc (27). The θ-axis motor (22) is installed on the θ-axis mounting plate (18) along the Z-axis direction and can drive the lower rotating table (24) to rotate. The rotating table (24) is connected to the lower adsorption disc adapter plate (26) through the coupling cylinder (25). An adsorption disc (27) is installed at the bottom of the adsorption disc adapter plate (26); The periphery of the base floor slab (1) is connected to the upper platform floor slab (6) through support columns (4). The Z-axis mounting plate (14) is mounted on the Y-axis moving plate (9) through a plurality of Y-axis triangular braces (12). The θ-axis mounting plate (18) is mounted on the Z-axis mounting plate (14) through a plurality of θ-axis triangular braces (19). The connecting cylinder (25) can pass through the floor hole on the platform floor slab (6) and then be connected to the suction cup adapter plate (26) located below the platform floor slab (6). The suction cup (27) is located above the suction carrier (2).

2. The wafer debonding and de-ringing device according to claim 1, characterized in that The right peeling knife assembly (E1) or the left peeling knife assembly (E2) includes a peeling knife X-axis module (28), a peeling knife mounting plate (29), a peeling knife (30) and a universal ball (31). The peeling knife X-axis module (28) is mounted on the base floor slab (1). The peeling knife X-axis module (28) can drive the upper peeling knife mounting plate (29) to move along the X-axis direction. At least one peeling knife (30) is mounted on the peeling knife mounting plate (29) along the Y-axis direction and facing the suction carrier (2). A universal ball (31) is mounted on the peeling knife mounting plate (29) outside the peeling knife (30).

3. A wafer de-gluing and de-ringing device according to claim 1, characterized in that, The CCD imaging assembly (G) includes a lens clamping block (37), a slide table mounting plate (39), a lens (40) and a camera (42). The slide table mounting plate (39) is mounted on the base floor slab (1). The lens clamping block (37) is mounted on the slide table mounting plate (39) through a Z-axis slide table (41). The camera (42) is mounted at the bottom of the lens clamping block (37). The lens (40) is mounted at the top of the lens clamping block (37). A light source (38) is mounted on one side of the lens (40). An imaging hole is opened on the base floor slab (1) directly above the lens (40).

4. A wafer debonding and de-ringing device according to claim 1, characterized in that, The right UV lamp assembly (H1) or the left UV lamp assembly (H2) includes a UV lamp mounting block (43), an avoidance cylinder (44) and a UV lamp (46). The avoidance cylinder (44) is mounted along the X-axis direction at the bottom of the platform floor slab (6). The UV lamp (46) is mounted on the adjustment mounting block (45) through the UV lamp mounting block (43). The avoidance cylinder (44) can drive the lower adjustment mounting block (45) to move along the X-axis direction.

5. The wafer debonding and de-ringing device according to claim 1, wherein, A waste cleaning assembly (F) is further provided below the adsorption and alignment carrier assembly (A). The waste cleaning assembly (F) includes a waste box (32), a brush mounting plate (34), a rodless cylinder (35) and a brush (36). The waste box (32) is located directly below the suction carrier (2) and is arranged along the X-axis direction. The brush mounting plate (34) is mounted in the waste box (32) along the Y-axis direction. The rodless cylinder (35) on one side of the waste box (32) can drive the brush mounting plate (34) to move along the X-axis direction in the waste box (32). A brush (36) is mounted on one side of the brush mounting plate (34) along the positive X-axis direction. A waste box handle (33) is mounted on one side of the waste box (32) along the negative X-axis direction.

6. The wafer de-gluing and de-ringing device according to claim 1, wherein A Y-axis guide rail protective cover (7) is provided on the Y-axis guide rail of the Y-axis linear module (8), and a Z-axis guide rail protective cover (13) is provided on the Z-axis guide rail of the Z-axis motor (15).

7. A wafer debonding and de-ringing device according to claim 1 or 6, characterized in that, A drag chain (10) is installed on the platform bottom plate (6) on one side of the Y-axis linear module (8). The drag chain (10) is connected to the Y-axis moving plate (9), and a vacuum assembly (11) is installed on the platform bottom plate (6) on one side of the drag chain (10).

8. The wafer debonding and de-ringing device according to claim 1, characterized in that, An air-electric slip ring mounting cylinder (23) is installed along the Z-axis direction in the connection cylinder (25). An air-electric slip ring (21) is installed on the top of the air-electric slip ring mounting cylinder (23). The air-electric slip ring (21) is installed on the air-electric slip ring tail frame (20), and the air-electric slip ring tail frame (20) is installed on the θ-axis triangular support (19).

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