Processing device and manufacturing method of processed product

Abstract

The present application provides a processing device and a manufacturing method of a processed product, which can shorten the time spent on alignment, and includes: a cutting table that holds a finished sealing substrate provided with an alignment mark and can rotate; a cutting mechanism that cuts the finished sealing substrate held on the cutting table; a reference mark that is provided on the cutting table and whose relative position to the center of rotation of the cutting table is known; and a camera that photographs the reference mark and the alignment mark, photographs the alignment mark while moving the camera relative to the finished sealing substrate in a direction, and performs alignment of the finished sealing substrate and the cutting mechanism in the direction and a direction orthogonal to the direction based on the photographed alignment mark and reference mark.

Description

Technical Field

[0001] This invention relates to a processing apparatus and a method for manufacturing processed articles. Background Technology

[0002] As a previous cutting device, as shown in Patent Document 1, when cutting a rectangular sealed substrate, for each sealed substrate, the camera is moved along the long side to perform an alignment action (alignment action) and then the cutting is performed. Afterward, the sealed substrate is rotated 90 degrees, the camera is moved along the short side to perform an alignment action and then the cutting is performed.

[0003] However, in the cutting device, alignment actions are performed separately in both the long and short sides, thus the alignment process is time-consuming. As a result, the productivity of the cutting device is reduced.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-128122 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Therefore, the present invention was made to solve the aforementioned problems, and its main objective is to reduce the time spent on the alignment action.

[0009] Technical means to solve the problem

[0010] That is, the processing apparatus of the present invention is characterized by comprising: a processing worktable that holds a workpiece having an alignment mark provided on it and is rotatable; a processing mechanism that processes the workpiece held on the processing worktable; a reference mark provided on the processing worktable and whose relative position to the rotation center of the processing worktable is known; and a camera that captures images of the reference mark and the alignment mark, wherein the camera moves relative to the workpiece in one direction while capturing images of the alignment mark, and based on the captured images of the alignment mark and the reference mark, the workpiece is aligned with the processing mechanism in the one direction and in a direction orthogonal to the one direction.

[0011] The effects of the invention

[0012] According to the present invention configured in this way, the time spent on alignment can be shortened. Attached Figure Description

[0013] Figure 1 This diagram schematically illustrates the structure of a cutting device according to one embodiment of the present invention.

[0014] Figure 2 This is a perspective view schematically illustrating the cutting workbench and its surrounding structure in the described embodiment.

[0015] Figure 3 This is a plan view (view from the Z direction) schematically illustrating the structure of the cutting workbench and its surrounding structure in the described embodiment.

[0016] Figure 4 This is a front view (viewed from the Y direction) schematically illustrating the structure of the cutting workbench and its surrounding structure according to the embodiment.

[0017] Figure 5 A front view (viewed from the Y direction) schematically illustrating the structure of the first holding mechanism and the conveying moving mechanism of the described embodiment.

[0018] Figure 6 A side view (view from the X direction) schematically illustrating the structure of the first holding mechanism and the conveying moving mechanism of the described embodiment.

[0019] Figure 7 A front view (viewed from the Y direction) schematically illustrating the structure of the second holding mechanism and the conveying moving mechanism of the described embodiment.

[0020] Figure 8 A cross-sectional view schematically illustrating the structure of the rack and pinion mechanism of the described embodiment.

[0021] Figure 9 This is a schematic diagram illustrating the operation of the cutting device according to the described embodiment.

[0022] Figure 10 This is a plan view showing the state of the sealed substrate arranged on the cutting worktable of the embodiment described above.

[0023] Figure 11 This is a schematic diagram illustrating the structure of the retaining plate and retaining base in the described embodiment.

[0024] Figure 12 This diagram schematically illustrates the operation of the shooting reference mark and alignment mark in the described embodiment.

[0025] Figure 13 The diagram is used to schematically illustrate the operation of determining the rotation center of the cutting table in the described embodiment.

[0026] Figure 14 This is a flowchart of the alignment and cutting actions in the described embodiment.

[0027] Figure 15 A diagram illustrating the method for determining the distance from the center of rotation to the reference mark in the described embodiment.

[0028] Explanation of symbols

[0029] 100: Cutting device (processing device)

[0030] W: Sealed substrate (object to be processed)

[0031] AM: Alignment Marker

[0032] P: Product (Processed Goods)

[0033] 2A, 2B: Cutting worktable (machining worktable)

[0034] 201: Keep the board in use

[0035] 202: Maintain base

[0036] 4: Cutting mechanism (processing mechanism)

[0037] 8: Cutting moving mechanism (processing moving mechanism)

[0038] 811: X-axis guide rail

[0039] 812: Support

[0040] 24: Video camera

[0041] M1: Reference Marker

[0042] M2: Centered calculation using markers Detailed Implementation

[0043] The invention will then be described in more detail by way of examples. However, the invention is not limited to the following description.

[0044] As described above, the processing apparatus of the present invention is characterized by comprising: a processing worktable that holds a workpiece provided with an alignment mark and is rotatable; a processing mechanism that processes the workpiece held on the processing worktable; a reference mark provided on the processing worktable and whose relative position to the rotation center of the processing worktable is known; and a camera that captures images of the reference mark and the alignment mark, wherein the camera moves relative to the workpiece in one direction while capturing images of the alignment mark, and based on the captured images of the alignment mark and the reference mark, the workpiece is aligned with the processing mechanism in the one direction and in a direction orthogonal to the one direction.

[0045] The processing device moves a camera relative to the workpiece in one direction while simultaneously capturing images of alignment marks without rotating the workpiece. Based on the captured alignment marks and a reference mark, it aligns the workpiece with the processing mechanism in one direction and in a direction orthogonal to the first direction (i.e., two directions). Therefore, it eliminates the need to capture images of the alignment marks before and after rotating the workpiece. As a result, the number of times the alignment marks are captured is reduced, shortening the time spent on the alignment process.

[0046] In a specific implementation of the processing device, ideally, the object to be processed is rectangular in shape, and the camera moves in one of the directions of the long side or the short side of the object to be processed while capturing images of the alignment mark. Based on the captured alignment mark and the reference mark, the object to be processed is aligned with the processing mechanism in the directions of the long side and the short side.

[0047] Ideally, the processing worktable has: a holding plate for holding the workpiece; and a holding base on which the holding plate is detachably mounted, the workpiece being held using the holding plate, and a reference mark being provided on the holding plate or the holding base.

[0048] For better alignment control, ideally, the processing device corrects the camera's offset by photographing the reference mark with the camera.

[0049] Furthermore, the camera, which is corrected by the offset, captures the alignment mark, thereby enabling accurate alignment between the workpiece and the processing mechanism.

[0050] As a specific embodiment for determining the relative position of the rotation center of the machining worktable and the reference mark, ideally, a center calculation mark is provided on the machining worktable for calculating the rotation center of the machining worktable. Before and after rotating the machining worktable by a specified angle, the center mark is photographed by the camera to calculate the rotation center, and the relative position of the reference mark and the rotation center is calculated based on the calculated rotation center.

[0051] Ideally, the processing apparatus of the present invention further includes a processing moving mechanism for moving the processing mechanism in mutually orthogonal X and Y directions on a horizontal plane. The processing moving mechanism has: a pair of X-direction guide rails that clamp the processing table along the X direction; and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism in a manner that allows it to move along the Y direction.

[0052] If the structure described above is used, the machining mechanism can move the machining mechanism in mutually orthogonal X and Y directions on the horizontal plane via a machining moving mechanism. Therefore, the workpiece can be machined without moving the machining table in the X and Y directions. Thus, a moving mechanism that eliminates the need to move the machining table simplifies the device structure and reduces the footprint.

[0053] In the aforementioned structure, ideally, the camera moves together with the processing mechanism along the support in the Y direction.

[0054] If the structure is as described above, a processing moving mechanism can be used to move the camera.

[0055] In addition, the method of manufacturing the processed article using the aforementioned processing apparatus is also an embodiment of the present invention.

[0056] <An embodiment of the present invention>

[0057] Hereinafter, an embodiment of the processing apparatus of the present invention will be described with reference to the accompanying drawings. Furthermore, all figures shown below are schematic depictions that have been appropriately omitted or exaggerated for ease of understanding. Identical structural components are labeled with the same symbols, and descriptions have been appropriately omitted.

[0058] <Overall Structure of the Processing Equipment>

[0059] The processing apparatus 100 in this embodiment is a cutting device, which cuts the sealed substrate W, which is the object to be processed, thereby monolithically dividing it into multiple products P, which are processed products.

[0060] Specifically, such as Figure 1 As shown, the cutting device 100 includes: two cutting worktables (processing worktables) 2A and 2B for holding a sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W to transfer it to the cutting worktables 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting worktables 2A and 2B; a transfer worktable 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P to transfer them from the cutting worktables 2A and 2B to the transfer worktable 5; a transfer moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting moving mechanism (processing moving mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting worktables 2A and 2B.

[0061] Here, the term "sealed substrate W" refers to a substrate that houses electronic components such as semiconductor chips, resistors, and capacitors, and is formed by resin molding in a manner that at least seals the electronic components with resin. The substrate constituting the sealed substrate W can be a lead frame, a printed circuit board, or, in addition, a semiconductor substrate (including silicon wafers), a metal substrate, a ceramic substrate, a glass substrate, or a resin substrate. Furthermore, the substrate constituting the sealed substrate W may or may not have wiring.

[0062] In the following description, mutually orthogonal directions along the plane (horizontal plane) of the upper surfaces of the cutting worktables 2A and 2B are respectively defined as the X direction and Y direction, and the vertical direction orthogonal to the X and Y directions is defined as the Z direction. Specifically, Figure 1 The left-right direction is defined as the X direction, and the up-down direction as the Y direction. Although described later, the X direction is the direction of movement of the support 812. Additionally, it is the direction orthogonal to the long side (the direction of beam extension) of the beam (crossbeam) that supports the pair of legs of the portal support 812 (see reference). Figure 2 ).

[0063] <Cut-off workbench>

[0064] Two cutting worktables 2A and 2B are fixedly arranged in the X, Y, and Z directions, respectively. Furthermore, cutting worktable 2A can rotate in the θ direction via a rotating mechanism 9A located beneath it. Similarly, cutting worktable 2B can rotate in the θ direction via a rotating mechanism 9B located beneath it.

[0065] These two cutting worktables 2A and 2B are arranged along the X direction on a horizontal plane. Specifically, the two cutting worktables 2A and 2B are configured such that their upper surfaces are on the same horizontal plane (at the same height in the Z direction) (see reference). Figure 4 ), and are arranged such that the centers of these upper surfaces (specifically, the rotation centers based on rotation mechanisms 9A and 9B) lie on the same straight line extending along the X direction (see reference). Figure 2 and Figure 3 ).

[0066] In addition, the two cutting worktables 2A and 2B hold the sealed substrate W in place, such as... Figure 1 As shown, two vacuum pumps 10A and 10B for adsorption and holding are configured corresponding to the two cutting worktables 2A and 2B. Each vacuum pump 10A and 10B is, for example, a water-sealed vacuum pump.

[0067] Here, the cutting worktables 2A and 2B are fixed in the XYZ directions, thus shortening the piping (not shown) connecting the vacuum pumps 10A and 10B to the cutting worktables 2A and 2B. This reduces pressure loss in the piping and prevents a decrease in adsorption force. As a result, even extremely small packages, such as those less than 1 mm square, can be reliably adsorbed onto the cutting worktables 2A and 2B. Furthermore, the reduction in adsorption force due to pressure loss in the piping is prevented, allowing for a reduction in the capacity of the vacuum pumps 10A and 10B, leading to miniaturization or cost reduction.

[0068] <First Maintaining Agency>

[0069] like Figure 1 As shown, the first holding mechanism 3 holds the sealed substrate W in order to transport it from the substrate supply mechanism 11 to the cutting worktable 2A and the cutting worktable 2B. Figure 5 and Figure 6 As shown, the first holding mechanism 3 includes: an adsorption head 31 with multiple adsorption sections 311 for adsorbing and holding the sealed substrate W; and a vacuum pump (not shown) connected to the adsorption sections 311 of the adsorption head 31. Furthermore, the sealed substrate W is moved to the desired position by the adsorption head 31 via the transport mechanism 7 (described later), thereby transporting it from the substrate supply mechanism 11 to the cutting worktable 2A and the cutting worktable 2B.

[0070] like Figure 1 As shown, the substrate supply mechanism 11 includes: a substrate receiving section 111 for receiving a plurality of sealed substrates W from the outside; and a substrate supply section 112 for moving the sealed substrates W received in the substrate receiving section 111 to a holding position RP held by the first holding mechanism 3. The holding position RP is set in the X direction in a parallel configuration with the two cutting worktables 2A and 2B. Furthermore, the substrate supply mechanism 11 may also include a heating section 113 for heating in order to make the sealed substrates W held by the first holding mechanism 3 in a soft state for easy attachment.

[0071] <Cutting mechanism (processing mechanism)>

[0072] like Figure 1 , Figure 2 and Figure 3 As shown, the cutting mechanism 4 has two rotating tools 40 comprising blades 41A and 41B and two spindle portions 42A and 42B. The two spindle portions 42A and 42B are arranged with their rotation axes along the Y direction, and the blades 41A and 41B mounted on these spindles are arranged facing each other (see reference). Figure 3The blades 41A of the spindle portion 42A and 41B of the spindle 42B rotate in a plane including the X and Z directions, thereby cutting the sealed substrate W held on each of the cutting worktables 2A and 2B. Furthermore, in the cutting device 100 of this embodiment, such as... Figure 4 As shown, a liquid supply mechanism 12 is provided to suppress the frictional heat generated by the cutting blades 41A and 41B. The liquid supply mechanism 12 has a spray nozzle 121 for spraying cutting water (machining fluid). The spray nozzle 121 is supported, for example, on the Z-direction moving part 83 described later.

[0073] <Transfer Workbench>

[0074] like Figure 1 As shown, the transfer worktable 5 in this embodiment is a worktable for moving multiple products P that have been inspected by the inspection unit 13 (described later). This transfer worktable 5 is called an index table, and it temporarily holds the multiple products P before classifying them into various trays 21. Furthermore, the transfer worktable 5 is arranged in a row with two cutting worktables 2A and 2B along the X direction on a horizontal plane. The transfer worktable 5 can also move back and forth along the Y direction, reaching the classification mechanism 20. The multiple products P placed on the transfer worktable 5 are classified into various trays 21 by the classification mechanism 20 according to the inspection results (good products, defective products, etc.) obtained from the inspection unit 13.

[0075] Furthermore, various pallets 21 are transported to the required positions by a pallet conveying mechanism 22 that moves along the transfer axis 71, carrying the products P sorted by the sorting mechanism 20. After sorting, the various pallets 21 are housed in the pallet housing section 23 by the pallet conveying mechanism 22. In this embodiment, three types of pallets are configured to be housed in the pallet housing section 23: for example, the pallet 21 before housing products P, the pallet 21 containing good products P, and the pallet 21 containing defective products P that need to be reworked.

[0076] <Inspection Department>

[0077] Here, the inspection department 13, as shown Figure 1 As shown, a plurality of products P held in the second holding mechanism 6 are inspected and arranged between the cutting worktable 2A, the cutting worktable 2B and the transfer worktable 5. The inspection unit 13 of this embodiment has a first inspection unit 131 for inspecting the sealing surface (encapsulation surface) of the product P and a second inspection unit 132 for inspecting the lead surface of the product P. The first inspection unit 131 is a camera with an optical system for inspecting the encapsulation surface, and the second inspection unit 132 is a camera with an optical system for inspecting the lead surface. Alternatively, the first inspection unit 131 and the second inspection unit 132 can be shared.

[0078] In this embodiment, the sealed substrate W and the product P are structures in which one side of the substrate is resin-molded. In this structure, the resin-molded surface is the surface where electronic components connected to the substrate are sealed with resin, and is referred to as the "sealing surface" or "encapsulation surface". On the other hand, the un-resin-molded surface, opposite to the resin-molded surface, exposes leads that typically function as external connection electrodes of the product, and is therefore referred to as the lead surface. In the case where the leads are protruding electrodes used in electronic components such as ball grid arrays (BGAs), it is sometimes also referred to as a "spherical surface". Furthermore, the un-resin-molded surface, opposite to the resin-molded surface, may also have a form where no leads are formed, and is therefore sometimes referred to as the "substrate surface". In the description of this embodiment, the resin-molded surface is referred to as the "sealing surface" or "encapsulation surface", and the un-resin-molded surface, opposite to the resin-molded surface, is referred to as the "lead surface".

[0079] In addition, in order to inspect both sides of the multiple products P through the inspection section 13, a reversing mechanism 14 is provided to reverse the multiple products P (see reference). Figure 1 The reversing mechanism 14 includes a holding table 141 for holding multiple products P, and a reversing part 142 such as a motor for reversing the holding table 141 in a manner that makes the front and back sides reverse.

[0080] When the second holding mechanism 6 holds multiple products P on the self-cutting worktable 2A and the self-cutting worktable 2B, the packaging surface of the products P faces downwards. In this state, during the transfer of the multiple products P from the self-cutting worktable 2A and the self-cutting worktable 2B to the reversing mechanism 14, the packaging surface of the products P is inspected by the first inspection section 131. Subsequently, the multiple products P held in the second holding mechanism 6 are reversed by the reversing mechanism 14. In this state, the lead surface of the products P faces downwards, and the reversing mechanism 14 is moved to the second inspection section 132, whereby the lead surface of the products P is inspected.

[0081] <Second Holding Agency>

[0082] like Figure 1 As shown, the second holding mechanism 6 holds multiple products P to transport them from the cutting worktable 2A and the cutting worktable 2B to the transfer worktable 5. Figure 8 As shown, the second holding mechanism 6 includes: an adsorption head 61 with multiple adsorption sections 611 for adsorbing and holding multiple products P; and a vacuum pump (not shown) connected to the adsorption sections 611 of the adsorption head 61. Then, the multiple products P are moved to the desired position by the transfer mechanism 7 (described later) via the adsorption head 61, thereby transferring them from the cutting worktable 2A and the cutting worktable 2B to the holding worktable 141 or the transfer worktable 5.

[0083] <Moving mechanism for transport>

[0084] like Figure 1 As shown, the conveying moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting worktable 2A and the cutting worktable 2B, and moves the second holding mechanism 6 at least between the cutting worktable 2A, the cutting worktable 2B and the holding worktable 141.

[0085] Moreover, such as Figure 1 As shown, the conveying moving mechanism 7 has a common transfer shaft 71 that extends in a straight line along the arrangement direction (X direction) of the two cutting worktables 2A and 2B and the transfer worktable 5, for moving the first holding mechanism 3 and the second holding mechanism 6.

[0086] The transfer shaft 71 is positioned such that the first holding mechanism 3 is movable above the substrate supply section 112 of the substrate supply mechanism 11, and the second holding mechanism 6 is movable above the transfer table 5 (see reference). Figure 1 Furthermore, the first holding mechanism 3, the second holding mechanism 6, the cutting worktable 2A, the cutting worktable 2B, and the transfer worktable 5 are all located on the same side (near the front) relative to the transfer shaft 71. Additionally, the inspection unit 13, the reversing mechanism 14, various trays 21, the tray conveying mechanism 22, the tray receiving unit 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 (described later), and the recycling container 172 are also located on the same side (near the front) relative to the transfer shaft 71.

[0087] Furthermore, such as Figure 5 , Figure 6 and Figure 8 As shown, the conveying moving mechanism 7 includes: a main moving mechanism 72 for moving the first holding mechanism 3 and the second holding mechanism 6 along the transfer shaft 71 in the X direction; a lifting moving mechanism 73 for moving the first holding mechanism 3 and the second holding mechanism 6 in the Z direction relative to the transfer shaft 71; and a horizontal moving mechanism 74 for moving the first holding mechanism 3 and the second holding mechanism 6 horizontally relative to the transfer shaft 71 in the Y direction.

[0088] like Figures 5-8 As shown, the main moving mechanism 72 has: a common guide rail 721, which is disposed on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, which moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

[0089] The guide rail 721 extends linearly along the transfer axis 71 in the X direction and is positioned within the same range as the transfer axis 71, such that the first holding mechanism 3 is movable above the substrate supply section 112 of the substrate supply mechanism 11, and the second holding mechanism 6 is movable above the transfer table 5. A sliding member 723 is slidably provided on the guide rail 721, and the first holding mechanism 3 and the second holding mechanism 6 are provided on the sliding member 723 via a lifting mechanism 73 and a horizontal movement mechanism 74. Here, the guide rail 721 is shared by the first holding mechanism 3 and the second holding mechanism 6, but the lifting mechanism 73, the horizontal movement mechanism 74, and the sliding member 723 are provided separately for each of the first holding mechanism 3 and the second holding mechanism 6.

[0090] The rack and pinion mechanism 722 includes: a cam rack 722a, shared by the first retaining mechanism 3 and the second retaining mechanism 6; and a pinion 722b, respectively disposed in the first retaining mechanism 3 and the second retaining mechanism 6, and rotated by an actuator (not shown). The cam rack 722a is disposed on a common transmission shaft 71, and can be varied in length by connecting multiple cam rack components. Additionally, the pinion 722b is disposed on a sliding member 723 and is referred to as a roller pinion, such as... Figure 7 As shown, the device includes a pair of roller bodies 722b1 that rotate together with the rotating shaft of the motor, and a plurality of roller pins 722b2 that are equally spaced in the circumferential direction between the pair of roller bodies 722b1 and are arranged in a manner that allows them to roll relative to the roller bodies 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion, so that two or more roller pins 722b2 contact the cam rack 722a, and no backlash is generated in either direction, resulting in good positioning accuracy when the first holding mechanism 3 and the second holding mechanism 6 move in the X direction.

[0091] like Figure 5 and Figure 8 As shown, the lifting and moving mechanism 73 is respectively provided corresponding to the first holding mechanism 3 and the second holding mechanism 6. Figure 5 and Figure 6 As shown, the lifting and moving mechanism 73 of the first holding mechanism 3 is disposed between the transmission shaft 71 (specifically the main moving mechanism 72) and the first holding mechanism 3, and includes: a Z-direction guide rail 73a disposed along the Z-direction; and an actuator part 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. Furthermore, the actuator part 73b may be, for example, a ball screw mechanism, a cylinder, or a linear motor. Additionally, as... Figure 8 As shown, the structure of the lifting and moving mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and moving mechanism 73 of the first holding mechanism 3.

[0092] like Figure 5 , Figure 6 and Figure 8 As shown, the horizontal moving mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. Figure 5 and Figure 6 As shown, the horizontal movement mechanism 74 of the first holding mechanism 3 is disposed between the transmission shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, and includes: a Y-direction guide rail 74a disposed along the Y-direction; an elastic body 74b that applies force to one side of the first holding mechanism 3 toward the Y-direction guide rail 74a; and a cam mechanism 74c that moves the first holding mechanism 3 toward the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and by using an actuator such as a motor to rotate the eccentric cam, the amount of movement of the first holding mechanism 3 in the Y-direction can be adjusted.

[0093] In addition, such as Figure 8 As shown, the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the lifting movement mechanism 73 of the first holding mechanism 3. Alternatively, it can be configured such that the second holding mechanism 6 does not have a horizontal movement mechanism 74, or that neither the first holding mechanism 3 nor the second holding mechanism 6 has a horizontal movement mechanism 74. Furthermore, similar to the lifting movement mechanism 73, the horizontal movement mechanism 74 can be made without a cam mechanism 74c, or it can use, for example, a ball screw mechanism, a cylinder, or a linear motor.

[0094] <Cutting moving mechanism (processing moving mechanism)>

[0095] The cutting moving mechanism 8 causes each of the two spindle parts 42A and 42B to move independently in the X, Y and Z directions.

[0096] Specifically, such as Figure 2 , Figure 3 ,and Figure 9 As shown, the cutting moving mechanism 8 includes: an X-direction moving part 81 that moves the spindle parts 42A and 42B linearly in the X direction; a Y-direction moving part 82 that moves the spindle parts 42A and 42B linearly in the Y direction; and a Z-direction moving part 83 that moves the spindle parts 42A and 42B linearly in the Z direction.

[0097] The X-direction moving part 81 is shared by two cutting worktables 2A and 2B, especially as Figure 2 and Figure 3As shown, the device includes: a pair of X-direction guide rails 811 that clamp two cutting worktables 2A and 2B along the X-direction; and a support body 812 that moves along the pair of X-direction guide rails 811 and supports spindle portions 42A and 42B via Y-direction moving portions 82 and Z-direction moving portions 83. The pair of X-direction guide rails 811 are located to the sides of the two cutting worktables 2A and 2B that are arranged along the X-direction. Furthermore, the support body 812 is, for example, gate-shaped, having a shape extending along the Y-direction. Specifically, the support body 812 has a pair of legs extending upward from the pair of X-direction guide rails 811, and a beam portion (crossbeam portion) supported on the pair of legs, the beam portion extending along the Y-direction.

[0098] Furthermore, the support 812 can move linearly along the X direction on a pair of X-direction guide rails 811, for example, via a ball screw mechanism 813 extending along the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 can also be configured to move linearly via other linear mechanisms such as a linear motor.

[0099] Especially Figure 3 As shown, the Y-direction moving part 82 includes: a Y-direction guide rail 821, which is disposed in the support body 812 along the Y-direction; and a Y-direction slider 822, which moves along the Y-direction guide rail 821. The Y-direction slider 822 is driven, for example, by a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle parts 42A and 42B. Thus, the two spindle parts 42A and 42B can move independently of each other in the Y-direction. Furthermore, the Y-direction slider 822 can also be configured to move back and forth by using other linear mechanisms such as ball screw mechanisms.

[0100] like Figures 2-4 As shown, the Z-direction moving part 83 includes: a Z-direction guide rail 831, which is arranged along the Z-direction in each Y-direction slider 822; and a Z-direction slider 832, which moves along the Z-direction guide rail 831 and supports the spindle portions 42A and 42B. That is, the Z-direction moving part 83 is arranged corresponding to each spindle portion 42A and 42B. The Z-direction slider 832 is driven, for example, by an eccentric cam mechanism (not shown), and moves linearly back and forth on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 can also be configured to move back and forth by other linear mechanisms such as a ball screw mechanism.

[0101] Regarding the positional relationship between the cutting moving mechanism 8 and the transmission shaft 71, as follows: Figure 1 and Figure 4As shown, the transmission shaft 71 is arranged to pass through the cutting moving mechanism 8 above it. Specifically, the transmission shaft 71 is arranged to pass through the support body 812 above it, and the transmission shaft 71 and the support body 812 are in a mutually intersecting positional relationship.

[0102] <Processing chip collection section>

[0103] In addition, such as Figure 1 As shown, the cutting device 100 of this embodiment also includes a chip collection section 17, which collects the chip S, such as end material, generated by the cutting of the sealed substrate W.

[0104] like Figures 2-4 As shown, the chip collection section 17 is disposed below the cutting worktables 2A and 2B, and includes: a guide groove 171 having an upper opening 171X that surrounds the cutting worktables 2A and 2B in plan view; and a recovery container 172 for recovering the chip S guided by the guide groove 171. By disposing of the chip collection section 17 below the cutting worktables 2A and 2B, the recovery rate of the chip S can be improved.

[0105] The guide chute 171 guides the machining chips S scattered or falling from the cutting worktables 2A and 2B to the recovery container 172. In this embodiment, the guide chute 171 is configured such that its upper opening 171X surrounds the cutting worktables 2A and 2B (see reference). Figure 3 Therefore, it is less likely to miss machining chips S, which can further improve the recovery rate of machining chips S. In addition, the guide chute 171 is arranged to surround the rotating mechanism 9A and rotating mechanism 9B which are provided below the cutting table 2A and the cutting table 2B (see reference). Figure 4 It is configured to protect the rotating mechanism 9A and rotating mechanism 9B from machining chips S and cutting water.

[0106] In this embodiment, the chip receiving section 17 is shared by the two cutting worktables 2A and 2B, but it can also be provided corresponding to the cutting worktables 2A and 2B respectively.

[0107] The recycling container 172 collects the machining chips S that pass through the guide chute 171 due to their own weight. In this embodiment, as... Figure 4As shown, the two cutting worktables 2A and 2B are respectively provided. Furthermore, two recovery containers 172 are positioned near the front of the transfer shaft, configured to be independently detachable from the front of the cutting device 100. This structure improves maintainability regarding the disposal of processing chips S. Moreover, the recovery containers 172 can be provided as a single unit under all cutting worktables, taking into account factors such as the size of the sealed substrate W, the size and quantity of processing chips S, and workability; or they can be provided in three or more units.

[0108] In addition, such as Figure 4 As shown, the machining chip receiving section 17 has a separation section 173 that separates the cutting water from the machining chips. As a structure for the separation section 173, it is conceivable, for example, to provide a filter such as a perforated plate through which the cutting water passes on the bottom surface of the recovery container 172. Through the separation section 173, the machining chips S can be recovered without accumulating cutting water in the recovery container 172.

[0109] <First Cleaning Agency>

[0110] In addition, such as Figure 1 and Figure 5 As shown, the cutting device 100 of the present invention further includes: a first cleaning mechanism 18, which cleans the upper surface (lead wire surface) of a plurality of products P held on the cutting worktable 2A and the cutting worktable 2B. The first cleaning mechanism 18 uses a spray nozzle 18a (see reference) to spray cleaning liquid and / or compressed air onto the upper surface of the plurality of products P held on the cutting worktable 2A and the cutting worktable 2B. Figure 5 ), to clean the upper surface of product P.

[0111] like Figure 5 As shown, the first cleaning mechanism 18 is configured to move along the transmission shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is disposed on a sliding member 723, which slides on a guide rail 721 disposed on the transmission shaft 71. Here, a lifting and moving mechanism 181 is provided between the first cleaning mechanism 18 and the sliding member 723 to move the first cleaning mechanism 18 vertically in the Z direction. For example, a rack and pinion mechanism, a ball screw mechanism, or a cylinder can be used for the lifting and moving mechanism 181.

[0112] <Second Cleaning Agency>

[0113] Furthermore, such as Figure 1As shown, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 for cleaning the lower surface (encapsulation surface) of the plurality of products P held in the second holding mechanism 6. The second cleaning mechanism 19 is disposed between the cutting worktable 2B and the inspection section 13, and cleans the lower surface of the products P by spraying cleaning fluid and / or compressed air onto the lower surface of the plurality of products P held in the second holding mechanism 6. That is, the second cleaning mechanism 19 cleans the lower surface of the products P midway as the second holding mechanism 6 moves along the transfer shaft 71.

[0114] <An example of the operation of a cutting device>

[0115] Next, an example of the operation of the cutting device 100 will be described. Figure 9 In the diagram, the movement paths of the first holding mechanism 3 and the second holding mechanism 6 are shown during the operation of the cutting device 100. Furthermore, in this embodiment, all operations or controls of the cutting device 100, such as the transport of the sealed substrate W, the cutting of the sealed substrate W, and the inspection of the product P, are controlled by the control unit CTL (see reference). Figure 1 )conduct.

[0116] The substrate supply section 112 of the substrate supply mechanism 11 moves the sealed substrate W housed in the substrate housing section 111 toward the holding position RP held by the first holding mechanism 3.

[0117] Subsequently, the conveying mechanism 7 moves the first holding mechanism 3 to the holding position RP, whereby the first holding mechanism 3 holds the sealed substrate W. Afterward, the conveying mechanism 7 moves the first holding mechanism 3, holding the sealed substrate W, to the cutting worktables 2A and 2B, whereby the first holding mechanism 3 releases its hold, and the sealed substrate W is placed on the cutting worktables 2A and 2B. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72, and the position of the sealed substrate W in the Y direction is adjusted by the horizontal moving mechanism 74. Furthermore, the cutting worktables 2A and 2B hold the sealed substrate W.

[0118] Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting worktable 2B, the lifting and moving mechanism 73 raises the first holding mechanism 3 to a position where it does not physically interfere with the cutting moving mechanism 8 (support 812). Furthermore, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting worktable 2B, if the support 812 is retracted from the cutting worktable 2B towards the transfer worktable 5, it is not necessary to raise and lower the first holding mechanism 3 as described above.

[0119] In this state, the cutting moving mechanism 8 moves the two spindle parts 42A and 42B sequentially in the X and Y directions, and the cutting worktables 2A and 2B rotate, thereby cutting the sealed substrate W into a grid shape and making it a single piece.

[0120] After cutting, the conveying moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface (lead wire surface) of the multiple products P held on the cutting worktables 2A and 2B. After cleaning, the conveying moving mechanism 7 moves the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

[0121] Subsequently, the conveying mechanism 7 moves the second holding mechanism 6 to the cutting worktable 2A and the cutting worktable 2B after cutting, where the second holding mechanism 6 holds multiple products P. Then, the conveying mechanism 7 moves the second holding mechanism 6, which holds the multiple products P, to the second cleaning mechanism 19. Thereby, the second cleaning mechanism 19 cleans the lower surface (encapsulation surface) of the multiple products P held in the second holding mechanism 6.

[0122] After cleaning, the multiple products P held in the second holding mechanism 6 undergo double-sided inspection via the inspection section 13 and the reversing mechanism 14. Subsequently, the transfer mechanism 7 moves the second holding mechanism 6 to the transfer table 5, releasing the second holding mechanism 6 and placing the multiple products P onto the transfer table 5. Based on the inspection results (good products, defective products, etc.) obtained from the inspection section 13, the multiple products P placed on the transfer table 5 are classified into various trays 21 by the sorting mechanism 20.

[0123] Furthermore, regarding two-sided inspection, for example, one side of the product P is first inspected while it is held by the second holding mechanism 6. Then, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while it is held by the reversed holding table 141, thus performing two-sided inspection. Moreover, the subsequent transfer of the product P from the reversing table 14 to the transfer table 5 can be performed by transferring it from the holding table 141 to the second holding mechanism 6. Additionally, by equipping the holding table 141 with a structure capable of moving in the X direction, and equipping at least one of the holding table 141 or the transfer table 5 with a structure capable of moving in the Z direction, the holding table 141 can be moved above the transfer table 5, thereby allowing the product P to be transferred to the transfer table 5.

[0124] <Alignment function of the cutting device>

[0125] The cutting device 100 of this embodiment has the following alignment function: without rotating the cutting worktable 2A and the cutting worktable 2B (sealed substrate W), the sealed substrate W held on the cutting worktable 2A and the cutting worktable 2B is aligned with the blades 41A and 41B of the cutting mechanism 4 in both the X and Y directions.

[0126] Specifically, such as Figure 10 As shown, the cutting device 100 includes: a reference mark M1, which is set on the cutting worktable 2A and the cutting worktable 2B, and whose relative position to the rotation center RC of the cutting worktable 2A and the cutting worktable 2B is known; and a camera 24, which captures the reference mark M1 and the alignment mark AM.

[0127] Here, as Figure 10 and Figure 11 As shown, the cutting worktables 2A and 2B of this embodiment include: a replaceable holding plate 201; and a holding base 202, on which the holding plate 201 is detachably mounted, and the holding plate 201 is used to hold the sealed substrate W. Furthermore, the holding plate 201 is a clamp used to hold the sealed substrate W.

[0128] Reference marks M1 are provided on the upper surface of the holding plate 201 of the cutting worktable 2A and the cutting worktable 2B. The holding plate 201 holds the rectangular sealed substrate W, and two reference marks M1 are provided at the positions corresponding to the short side of the sealed substrate W. In addition, there may be one reference mark M1 or more reference marks M1.

[0129] Furthermore, a center calculation mark M2 is provided on the upper surface of the holding base 202 of the cutting worktables 2A and 2B for determining the rotation center RC of the cutting worktables 2A and 2B. The center calculation mark M2 is positioned so that it can be captured by the camera 24 when the holding plate 201 is mounted on the holding base 202. In this embodiment, the center calculation mark M2 is positioned so that the long side direction of the sealed substrate W is aligned with the Y direction when the cutting worktables 2A and 2B are used (see reference). Figure 10 ).

[0130] like Figures 1-3 and Figure 10As shown, the camera 24 is mounted on one of the two spindle sections 42A and 42B (here, spindle section 42A) and moves together with said spindle section 42A. That is, the camera 24 can move in the X direction along the X-direction guide rail 811 of the cutting moving mechanism 8 and can move in the Y direction along the support body 812. The camera 24 of this embodiment is a wide-field-of-view and high-resolution camera, capable of detecting multiple marks in a single shot.

[0131] Furthermore, the cutting device 100 moves the camera 24 relative to the sealed substrate W in one direction (here, the long side direction) while photographing the alignment mark AM of the sealed substrate W. Based on the photographed alignment mark AM and reference mark M1, the sealed substrate W is aligned with the blades 41A and 41B of the cutting mechanism 4 in the long side direction and the short side direction.

[0132] Specifically, the cutting device 100 is configured such that the long side of the sealed substrate W on the cutting worktable 2A and the cutting worktable 2B is in the Y direction. In this state, the camera 24 moves along the support 812 in the Y direction and takes pictures of the multiple alignment marks AM set on the sealed substrate W.

[0133] In this embodiment, multiple alignment marks AM are respectively provided on the two opposing sides of the sealed substrate W along the long side direction, such as... Figure 12 As shown, make one of the opposing edges (in) Figure 12 Multiple alignment marks AM (on the left side) are moved along the Y direction (long side direction) while shooting, and then the support 812 is moved in the X direction, so that the other opposite side (in the middle) is... Figure 12 Multiple alignment marks AM (located on the right side) move along the Y direction (long side direction) while taking pictures.

[0134] exist Figure 12 During the alignment process of the sealed substrate W, two actions are performed to photograph the reference mark M1, and ten actions are performed to photograph the alignment mark AM, for a total of twelve actions. That is, in each photographing action, the camera 24 is positioned at a predetermined imaging position. Furthermore, in... Figure 12 The sealed substrate W shown has twelve alignment marks AM, but in the camera 24 of this embodiment, two alignment marks AM located at the four corners are captured in a single shooting action. Specifically, after taking a picture with the intersection of the cut lines shown by the two alignment marks AM positioned at the center of the image, the position of the alignment marks AM is detected.

[0135] Furthermore, the cutting device 100 of this embodiment has the function of calculating the rotation center RC of the cutting worktable 2A and the cutting worktable 2B using the center calculation mark M2. Specifically, in Figure 13 In state (a), i.e., when the center calculation marker M2 is located on the left, an image is taken of the center calculation marker M2, and... Figure 13 In state (b), that is, with the cutting worktables 2A and 2B rotated by a predetermined angle (180 degrees in this embodiment) and the center calculation mark M2 located on the right, the center calculation mark M2 is photographed. Based on the position of the camera 24 when the two images are photographed, the coordinates of the center calculation mark M2 before rotation, and the coordinates of the center calculation mark M2 after rotation, the coordinates of the rotation center RC of the cutting worktables 2A and 2B are calculated.

[0136] Furthermore, in this embodiment, before photographing the alignment mark AM on the sealed substrate W, the cutting device 100 photographs a reference mark M1 using the camera 24 and calculates the offset of the camera 24's position (particularly the offset in the Y direction). Then, the cutting device 100 corrects the offset of the camera 24 while simultaneously photographing multiple alignment marks AM. By using the reference mark M1 in this way to correct the offset of the camera 24's position, a high-precision linear scale is not required; for example, a rotary encoder built into a servo motor can be used.

[0137] <Details of the alignment and cutting actions>

[0138] The following is for reference Figure 14 The alignment and cutting operations of the cutting device 100 in this embodiment will be described. Furthermore, the following alignment and cutting operations are controlled by the control unit CTL.

[0139] (Step S1: Determining the rotation center RC)

[0140] First, before rotating the cutting worktables 2A and 2B by a predetermined angle (here, 180 degrees) and after rotating them by the predetermined angle (here, 180 degrees), the camera 24 takes a picture of the center of the cutting worktables 2A and 2B, calculated using the mark M2 (see reference). Figure 13Then, the control unit CTL calculates the coordinates of marker M2 based on the center obtained from the camera image before rotation and the coordinates of marker M2 based on the center obtained from the camera image after rotation, and calculates the coordinates of the rotation center RC of cutting worktables 2A and 2B. Furthermore, the aforementioned operation is performed on both cutting worktables 2A and 2B respectively, and the coordinates of the rotation center RC of each of the two cutting worktables 2A and 2B are calculated.

[0141] (Step S2: Calculate the distances L1 and L2 between the reference mark M1 and the rotation center RC)

[0142] Next, the reference mark M1 set on the holding plate 201 is photographed by the camera 24. Then, the distance L1 between the reference mark M1 and the rotation center RC of the cutting table 2A and the cutting table 2B in the long side direction and the distance L2 in the short side direction are calculated based on the photographed images (refer to...). Figure 15 Thus, the relative position of the reference mark M1 and the rotation center RC is determined. Furthermore, these distances L1 and L2 can also be measured using a linear scale (not shown) provided on the support 812.

[0143] (Step S3: Calculation of the ideal cutting line)

[0144] Then, the control unit CTL calculates the ideal cutting lines in the long and short directions of the sealed substrate W, using the rotation centers RC of the cutting worktables 2A and 2B as a reference. Furthermore, the ideal cutting lines are determined according to the type of the sealed substrate W, and steps S1 to S3 are performed each time the type of the sealed substrate W is changed.

[0145] (Step S4: Holding the substrate W after sealing)

[0146] The sealed substrate W is placed on the holding plate 201 and held in place by the cutting worktables 2A and 2B. At this time, the cutting worktables 2A and 2B are in a state where the long side direction of the held sealed substrate W is aligned with the Y direction (the long side direction of the support 812). Furthermore, in the following steps S5 to S8, the cutting worktables 2A and 2B are fixed without rotating.

[0147] (Step S5: Calculate the offset of camera 24)

[0148] The camera 24 captures an image of the reference mark M1 set on the holding plate 201. Then, the offset of the camera 24's position is calculated based on the captured image and the position of the camera 24.

[0149] (Step S6: Aim and shoot at mark AM)

[0150] While correcting the calculated offset of the camera 24's position, the control unit CTL moves the camera 24 along the long side (Y direction) of the sealed substrate W and simultaneously captures images of multiple alignment marks AM (refer to) on the sealed substrate W. Figure 12 The multiple alignment marks AM are photographed while the cutting worktable 2A and the cutting worktable 2B (sealed substrate W) are not rotated, that is, the long side direction of the sealed substrate W is fixed in the same direction as the Y direction.

[0151] (Step S7: Take a picture of all alignment marks?)

[0152] If all of the alignment marks AM on the sealed substrate W have been photographed in step S6, proceed to the next step S8. Alternatively, if not all of the alignment marks AM on the sealed substrate W have been photographed, return to step S6.

[0153] (Step S8: Calculation of the actual cut line)

[0154] The control unit CTL calculates the measured cut lines in the long and short directions of the sealed substrate W based on the multiple alignment marks AM and reference mark M1 captured by the camera. That is, by capturing the alignment marks AM only in the long direction of the sealed substrate W without rotating the substrate W, both the measured cut lines in the long and short directions are calculated.

[0155] (Step S9: Calculate the offset of the actual cut line)

[0156] The control unit CTL calculates the offset between the ideal cutting line obtained in step S3 and the measured cutting line obtained in step S8.

[0157] (Step S10: Offset Correction)

[0158] The control unit CTL corrects the offset by rotating the cutting worktable 2A and the cutting worktable 2B and moving the spindle parts 42A and 42B based on the offset calculated in step S9.

[0159] (Step S11: Cutting along the shorter side)

[0160] After correcting the offset through step S10, the mandrel portions 42A and 42B are moved in the X direction (cutting feed direction) to cut the short side of the sealed substrate W, and the mandrel portions 42A and 42B are moved in the Y direction (pitch feed direction) to cut the sealed substrate W into multiple pieces. Furthermore, during the cutting in the short side direction, the cutting worktables 2A and 2B are fixed.

[0161] (Step S12: Rotation of substrate W after sealing)

[0162] After the short side of the sealed substrate W is cut off in step S11, the cutting worktables 2A and 2B are rotated 90 degrees, thereby rotating the sealed substrate W by 90 degrees.

[0163] (Step S13: Cutting along the long side)

[0164] The mandrel portions 42A and 42B are moved in the X direction (cutting feed direction) to cut the long side of the sealed substrate W, and the mandrel portions 42A and 42B are moved in the Y direction (pitch feed direction) to cut the sealed substrate W into multiple pieces. Furthermore, the cutting worktables 2A and 2B are fixed during the cutting in the long side direction.

[0165] <Effects of this implementation method>

[0166] According to the cutting device 100 of this embodiment, the camera 24 can move relative to the sealed substrate W in the long side direction while capturing an alignment mark AM without rotating the sealed substrate W. Based on the captured alignment mark AM and reference mark M1, alignment of the sealed substrate W with the blades 41A and 41B of the cutting mechanism 4 is performed in both the long and short side directions. That is, according to the cutting device 100 of this embodiment, the alignment operation is only performed in the long side direction, so it is not necessary to capture the alignment mark AM of the sealed substrate W before and after rotating the sealed substrate W. As a result, the number of times the alignment mark AM is captured can be reduced, and the time spent on the alignment operation can be shortened.

[0167] Furthermore, in this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved via a common transfer shaft 71 extending along the arrangement direction of the cutting worktables 2A, 2B, and 5. The cutting mechanism 4 is moved horizontally in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction via the cutting moving mechanism 8. Therefore, the sealed substrate W can be processed without moving the cutting worktables 2A and 2B in the X and Y directions. Thus, the cutting worktables 2A and 2B can be moved without using a ball screw mechanism, eliminating the need for a basalt member to protect the ball screw mechanism and a cover member to protect the basalt member. As a result, the device structure of the cutting device 100 can be simplified. Additionally, by providing a structure that prevents the cutting worktables 2A and 2B from moving in the X and Y directions, the area occupied by the cutting device 100 can be reduced.

[0168] <Other variations and implementations>

[0169] Furthermore, the present invention is not limited to the embodiments described herein.

[0170] For example, in the described embodiment, the action of photographing the alignment mark AM only in the long side direction of the sealed substrate W without rotating the sealed substrate W can also be performed by photographing the alignment mark AM only in the short side direction of the sealed substrate W without rotating the sealed substrate W. When photographing the alignment mark AM only in the short side direction, regarding cutting, the long side direction can be performed first, and then the cutting stage can be rotated 90 degrees before the short side direction is cut.

[0171] In addition, the processing object in the above embodiment is a rectangular sealed substrate W, but it can also be a processing object formed into a shape other than a rectangle, such as a circle.

[0172] In the described embodiment, a cutting device with a dual-cutting table and a dual-mandrel structure has been described, but it is not limited to this. It may also be a cutting device with a single-cutting table and a single-mandrel structure, or a cutting device with a single-cutting table and a dual-mandrel structure, etc.

[0173] In addition, the transfer worktable 5 in the above embodiment is an index table temporarily placed before sorting to various trays 21, but the transfer worktable 5 may also be set as the holding worktable 141 of the reversing mechanism 14.

[0174] Furthermore, in the aforementioned embodiment, the structure is one in which the workbench 5 sorts the items onto the tray 21, but it could also be a structure in which the product P is transported and attached to the adhesive tape disposed on the inside of the frame member.

[0175] Furthermore, in the structure of the described embodiment, it is also possible to configure the system such that the sealed substrate is not cut in the cutting worktables 2A and 2B, but instead grooves are formed. In this case, for example, it is also possible to configure the system such that the sealed substrate W, after the groove processing is performed in the cutting worktables 2A and 2B, returns to the substrate supply section 112 via the first holding mechanism 3 and the conveying moving mechanism 7. Alternatively, it is also possible to configure the system such that the sealed substrate W that has returned to the substrate supply section 112 is housed in the substrate receiving section 111.

[0176] Furthermore, the cam rack components constituting the transmission shaft 71 can be configured in multiple interconnected configurations. Therefore, for example, the cutting device (processing device) 100 can be configured as a modular structure that can be detached and connected (removed) between the second cleaning mechanism 19 and the inspection section 13. In this case, for example, a module for performing a different type of inspection than that performed in the inspection section 13 can be added between the module on the second cleaning mechanism 19 side and the module on the inspection section 13 side. In addition, besides the structure illustrated here, the cutting device (processing device) 100 can also be configured as a modular structure that can be detached and connected (removed) at a certain point, and the added module can be configured as a module with various functions other than inspection.

[0177] In addition, the processing apparatus of the present invention can also perform processing other than cutting, such as cutting or grinding.

[0178] Furthermore, the present invention is not limited to the described embodiments, and various modifications can be made without departing from its spirit.

[0179] Industrial availability

[0180] According to the present invention, the time spent on alignment can be reduced.

Claims

1. A processing apparatus, comprising: The machining worktable holds the workpiece with alignment marks and can rotate; The processing mechanism processes the workpiece held on the processing worktable. A reference mark is set on the machining table, and its relative position to the rotation center of the machining table is known; and A camera is used to photograph the reference mark and the alignment mark. While the camera moves relative to the workpiece in one direction, it captures images of the alignment mark. By correcting the offset between the measured cutting line calculated based on the captured alignment mark and the reference mark and the ideal cutting line calculated based on the rotation center, the workpiece and the processing mechanism are aligned in the one direction and in directions orthogonal to the one direction.

2. The processing apparatus according to claim 1, wherein, The object to be processed is rectangular in shape. While the camera moves in one of the long or short directions of the workpiece, it captures images of the alignment mark. By correcting the offset between the measured cutting line calculated based on the captured alignment mark and the reference mark and the ideal cutting line calculated based on the rotation center, the workpiece and the processing mechanism are aligned in the long and short directions.

3. The processing apparatus according to claim 1 or 2, wherein, The processing worktable includes: a holding plate for holding the workpiece; and a holding base on which the holding plate is detachably mounted, using the holding plate to hold the workpiece. The reference mark is set on the retaining plate or the retaining base.

4. The processing apparatus according to claim 1 or 2, wherein, The offset of the camera is corrected by photographing the reference mark with the camera.

5. The processing apparatus according to claim 4, wherein, The camera, after the offset is corrected, captures the alignment mark.

6. The processing apparatus according to claim 1 or 2, wherein, The machining worktable is provided with a center calculation mark for determining the rotation center of the machining worktable. Before and after rotating the processing table by a specified angle, the center is captured by the camera and the center of rotation is calculated by marking the center. Based on the calculated center of rotation, the relative position of the reference mark and the center of rotation is calculated.

7. The processing apparatus according to claim 1 or 2 further includes a processing moving mechanism for moving the processing mechanism in mutually orthogonal X and Y directions on a horizontal plane. The machining moving mechanism includes: a pair of X-direction guide rails that clamp the machining table along the X-direction; and a support that moves along the pair of X-direction guide rails and supports the machining mechanism in a manner that allows it to move along the Y-direction.

8. The processing apparatus according to claim 7, wherein, The camera moves together with the processing mechanism along the support in the Y direction.

9. A method for manufacturing a processed article, wherein the processed article is manufactured using the processing apparatus as described in any one of claims 1 to 8.

Images