Electronic device

Abstract

An electronic device includes a substrate, a first metal layer, a first insulating layer, a second insulating layer, a second metal layer, a first contact hole, a second contact hole, and a first transparent electrode. The substrate includes an active region and a peripheral region adjacent to the active region. The first metal layer is disposed on the substrate. The first insulating layer is disposed on the first metal layer. The second insulating layer is disposed on the first insulating layer. The second metal layer is disposed between the first metal layer and the second insulating layer. The first contact hole passes through the first insulating layer and the second insulating layer and exposes a portion of the first metal layer in the peripheral region. The second contact hole passes through the second insulating layer and exposes a portion of the second metal layer in the peripheral region. The first transparent electrode is disposed on the second insulating layer, wherein the first transparent electrode is electrically connected to the first metal layer via the first contact hole and electrically connected to the second metal layer via the second contact hole.

Description

[0001] This application is a divisional application of the invention patent application filed on September 27, 2019, with application number 201910925334.2 and title "Flexible Display Device". Technical Field

[0002] This invention relates to an electronic device, and more particularly to a flexible electronic device having a bonding pad. Background Technology

[0003] Flexible display devices are widely used in daily life, and these devices are powered by integrated circuit chips and flexible circuit boards that drive the panel. Therefore, improving the quality of the electrical connection between the integrated circuit chip and the panel, or between the flexible circuit board and the panel, or enhancing the display quality or reliability of flexible display devices, is one of the topics that needs to be explored today. Summary of the Invention

[0004] To address the aforementioned problems, one embodiment of the present invention provides an electronic device comprising a substrate, a first metal layer, a first insulating layer, a second insulating layer, a second metal layer, a first contact hole, a second contact hole, and a first transparent electrode. The substrate includes an active region and a peripheral region adjacent to the active region. The first metal layer is disposed on the substrate. The first insulating layer is disposed on the first metal layer. The second insulating layer is disposed on the first insulating layer. The second metal layer is disposed between the first metal layer and the second insulating layer. The first contact hole penetrates the first and second insulating layers and exposes a portion of the first metal layer in the peripheral region. The second contact hole penetrates the second insulating layer and exposes a portion of the second metal layer in the peripheral region. The first transparent electrode is disposed on the second insulating layer, wherein the first transparent electrode is electrically connected to the first metal layer via the first contact hole and electrically connected to the second metal layer via the second contact hole. Attached Figure Description

[0005] Figure 1 This is a top view schematic diagram of a flexible display device according to an embodiment of the present invention.

[0006] Figure 2 This is an enlarged schematic diagram of one of the bonding pads according to an embodiment of the present invention.

[0007] Figure 3 For along Figure 2 A schematic diagram of the structural cross-section along section line A-A'.

[0008] Figure 4 This is an enlarged schematic diagram of a layered structure according to an embodiment of the present invention.

[0009] Figure 5 For along Figure 4Schematic diagram of the structural cross-sections B-B' and C-C'.

[0010] Figure 6 For along Figure 4 A schematic diagram of the structural cross-section D-D'.

[0011] Figure 7 This is a partial cross-sectional schematic diagram of one of the bonding pads in some embodiments of the present invention.

[0012] Figure 8 This is a partial cross-sectional schematic diagram of one of the bonding pads in some embodiments of the present invention.

[0013] Explanation of reference numerals in the attached figures: 10 - Flexible display device; 100 - Substrate; 102 - Scan line; 104 - Data line; 106R, 106G, 106B - Subpixel; 108 - Layer transfer structure; 110, 116 - Traces; 112, 114 - Bonding pads; 118 - Integrated circuit chip; 120 - Flexible circuit board; 122, 142 - Metal layers; 124, 126, 128 - Insulating layers; 1261 - Top surface; 124w, 126 w, 128w - sidewalls; 130, 132, 138, 140 - transparent electrodes; 130a, 130b, 130c, 130d, 130e, 130f, 1261r, 1261s, 1261t - portions; 134, 136, 144, 146 - contact holes; D1 - first direction; D2 - second direction; D3 - top view direction; DI1, DI2 - diameters; R1 - active region; R2 - peripheral region; α, β - included angles. Detailed Implementation

[0014] The invention can be understood by referring to the following detailed description and the accompanying drawings. It should be noted that, for ease of understanding and to maintain the simplicity of the illustrations, many of the drawings depict only a portion of the electronic device or flexible display device, and at least some specific components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of the invention.

[0015] Throughout this specification and the appended claims, certain terms are used to refer to specific components. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same components. This document is not intended to distinguish between components that have the same function but different names. In the following specification and claims, words such as "having" and "comprising" are open-ended terms and should therefore be interpreted as "including but not limited to...".

[0016] It should be understood that when a component or membrane is described as being "on" or "connected" to another component or membrane, it can be directly on or directly connected to that other component or membrane, or there may be an interposed component or membrane between them (in the indirect case). Conversely, when a component is described as being "directly" on or "directly connected" to another component or membrane, there may be no interposed component or membrane between them.

[0017] The terms “approximately,” “equal to,” “equivalent to,” or “same” typically mean falling within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0018] While the terms first, second, third… can be used to describe multiple components, the components are not limited to these terms. These terms are used only to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but rather replaced by first, second, third… in the order in which the components are declared in the claims. Therefore, in the following description, a first component may be a second component in the claims. Furthermore, the terms first, second, third… do not necessarily imply a process sequence.

[0019] It should be understood that the technical features of several different embodiments can be replaced, reorganized, or mixed to complete other embodiments without departing from the spirit or conflict of the present invention.

[0020] The electronic device of the present invention may include a display device, an antenna device, a light-emitting device, a sensing device, or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may include self-emissive organic light-emitting diodes (OLEDs), inorganic light-emitting diodes (LEDs), such as mini LEDs or micro-LEDs, quantum dot (QDs) materials, quantum dot light-emitting diodes (QLEDs, QDLEDs), fluorescent materials, phosphorescent materials, or other suitable materials, or any combination thereof, but is not limited thereto. The concept or principle of the present invention may also be applied to display devices including non-self-emissive liquid crystal (LC) materials, but is not limited thereto.

[0021] The antenna device may be, for example, a liquid crystal antenna or other types of antennas, but is not limited thereto. The splicing device may be, for example, a display splicing device, an antenna splicing device, or a combination thereof, but is not limited thereto. It should be noted that the electronic device may be any arrangement or combination of the foregoing, but is not limited thereto. Furthermore, the shape of the electronic device may be rectangular, circular, polygonal, with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, a control system, a light source system, a shelving system, etc., to support the display device, antenna device, or splicing device. The present invention will be described below using a flexible display device as an example of an electronic device, but the present invention is not limited thereto.

[0022] Please refer to Figure 1 This is a top view schematic diagram of a flexible display device according to a first embodiment of the present invention. The electronic device or flexible display device 10 of this embodiment may include a substrate 100, which may include an active region R1 and a peripheral region R2 adjacent to the active region R1. The peripheral region R2 is, for example, disposed on at least one side of the active region R1. Figure 1 The peripheral area R2 may surround the active area R1. The active area R1 may include a display area, a detection area, a sensing area, a light-emitting area, a working area, other suitable areas, or a combination of the above areas, but is not limited thereto.

[0023] The substrate 100 may include, but is not limited to, a flexible substrate. The material of the substrate 100 may include, but is not limited to, organic or inorganic flexible materials. If the substrate 100 is made of an organic polymer, it may include, for example, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), or combinations thereof, but is not limited thereto. Furthermore, the top view shape of the substrate 100 may be rectangular, curved, or any suitable shape, but is not limited thereto.

[0024] The flexible display device 10 may include multiple scan lines 102 and multiple data lines 104 disposed on a substrate 100. The scan lines 102 may extend along a first direction D1, and the data lines 104 may extend along a second direction D2, where the second direction D2 is different from the first direction D1. In this embodiment, the first direction D1 and the second direction D2 are, for example, perpendicular to each other, but are not limited thereto. Furthermore, the scan lines 102 and data lines 104 may intersect to define multiple sub-pixels, such as... Figure 1The subpixels are 106R, 106G, and 106B, but not limited to these. For example, subpixel 106R can correspond to a red subpixel, subpixel 106G can correspond to a green subpixel, and subpixel 106B can correspond to a blue subpixel. Different colors of light produced by the subpixels can be used to display a color image, but not limited to these. The color of the light provided by the subpixels can be designed according to requirements. Furthermore, the top-view shape of the subpixels can be rectangular, parallelogram, or ">", but not limited to these; they can have any suitable shape.

[0025] like Figure 1 The data line 104 can extend from the active area R1 into the peripheral area R2 along the second direction D2, and at least one of the data lines 104 can be electrically connected to a transition structure 108, but is not limited thereto. The flexible display device 10 may include multiple transition structures 108, which may be disposed adjacent to the active area R1 and may be disposed along the first direction D1 or along the edge of the active area R1, but are not limited thereto. Taking one of the transition structures 108 as an example, one end of the transition structure 108 can be electrically connected to the data line 104, and the other end of the transition structure 108 can be electrically connected to a trace 110, but is not limited thereto. The transition structure 108 can also be electrically connected to other signal lines within the active area R1. Through the transition structure 108, the data line 104 in the active area R1 can be electrically connected to the trace 110 in the peripheral area R2, or the metal layer of the data line 104 can also be electrically connected to another metal layer of the trace 110 through the transition structure 108. The term "electrical connection" in this invention can refer to the direct connection of two conductors or semiconductors to achieve an electrical connection, or to the electrical connection between two conductors or semiconductors through other components, but is not limited thereto.

[0026] The flexible display device 10 may include a plurality of bonding pads 112 and a plurality of bonding pads 114 disposed on a substrate 100, and the plurality of bonding pads 112 and a plurality of bonding pads 114 may be disposed along a first direction D1, but are not limited thereto. In a second direction D2, a transfer structure 108 may be disposed, for example, adjacent to an active region R1, and bonding pads 114 may be disposed, for example, adjacent to an edge of the substrate 100, while bonding pads 112 may be disposed between bonding pads 114 and transfer structure 108, but are not limited thereto. Taking one bonding pad 112 as an example, one end of bonding pad 112 may be electrically connected to a trace 110, and the other end of bonding pad 112 may be electrically connected to a trace 116, but are not limited thereto. Furthermore, one end of the trace 116 may be electrically connected to a bonding pad 112, and the other end of the trace 116 may be electrically connected to a bonding pad 114, but are not limited thereto. Thus, bonding pad 112 can be electrically connected to bonding pad 114. The number and placement of the bonding pads 112, 114, and the transition structure 108 are not based on... Figure 1 The above is the limit.

[0027] In some embodiments (not shown), certain bonding pads 112 may not be electrically connected to the transition structure 108, but may be electrically connected to other electronic components in the flexible display device 10 via wiring, such as driving circuits, detection circuits, sensing circuits, etc., but are not limited thereto.

[0028] The flexible display device 10 may include an integrated circuit chip 118 and a flexible circuit board 120. The integrated circuit chip 118 and the flexible circuit board 120 may be disposed on a substrate 100. The integrated circuit chip 118 may be electrically connected to a bonding pad 112, and the flexible circuit board 120 may be electrically connected to a bonding pad 114. For example, the integrated circuit chip 118 may include a plurality of bonding pads disposed on its surface, and at least some of the bonding pads in the integrated circuit chip 118 may be positioned corresponding to and electrically connected to the bonding pad 112. Similarly, the flexible circuit board 120 may include a plurality of bonding pads disposed on its surface, and at least some of the bonding pads in the flexible circuit board 120 may be positioned corresponding to and electrically connected to the bonding pad 114. The number and arrangement of the integrated circuit chip 118 and the flexible circuit board 120 are not limited to... Figure 1 The above is the limit.

[0029] Please refer to Figure 2 and Figure 3 , Figure 2 This is an enlarged schematic diagram of one of the bonding pads 112 in the first embodiment of the present invention. Figure 3 For along Figure 2 A cross-sectional view of the structure along line A-A'. One of the bonding pads 112 of the flexible display device 10 may include, but is not limited to, a metal layer 122, an insulating layer 124, an insulating layer 126, an insulating layer 128, a plurality of transparent electrodes 130, and a transparent electrode 132. For example... Figure 2 Trace 110 and trace 116 may be linear portions extending from the metal layer 122. In some embodiments, trace 110 and trace 116 may be directly connected to the metal layer 122 in the bonding pad 112, but this is not a limitation. Figure 3 Insulating layers 124 and 126 may be disposed on the metal layer 122, and insulating layer 126 may include a plurality of contact holes 134. Contact holes 134 may be disposed within the peripheral region R2 of the substrate 100, and contact holes 134 may penetrate insulating layers 124 and 126, exposing a portion of the surface of the metal layer 122. In some embodiments, a transparent electrode 130 may be disposed in a contact hole 134, and the transparent electrode 130 may directly contact a portion of the surface of the metal layer 122 exposed by the contact hole 134, allowing the transparent electrode 130 to be electrically connected to the metal layer 122, but this is not a limitation.

[0030] In some embodiments, the number of contact holes 134 and contact holes 136 is not limited to a plurality. In some embodiments, the bonding pad 112 or bonding pad 114 may include one contact hole 134 and one contact hole 136. In a top view D3 of the flexible display device 10, the contact hole 134 is located within the contact hole 136 (e.g., ...). Figure 2 In some embodiments, such as Figure 3 As shown, sidewall 128w surrounds contact hole 136, and sidewalls 124w and 126w surround contact hole 134. With the centers of contact holes 134 and 136 as a reference, the sidewall 126w surrounding contact hole 134 may be located inside the sidewall 128w surrounding contact hole 136. In some embodiments, insulating layer 128 may be disposed on insulating layer 126, and insulating layer 128 may include multiple contact holes 136. Contact holes 136 may penetrate insulating layer 128, allowing a portion of the surface of transparent electrode 130 to be exposed by contact holes 136. Figure 3 The contact hole 136 may expose a portion 1261s of the top surface 1261 of the insulating layer 126. Specifically, the transparent electrode 130 may include a portion 130a and a portion 130b of a transparent electrode, wherein portion 130a of the transparent electrode 130 is disposed in the contact hole 134, and portion 130b of the transparent electrode 130 is disposed on portion 1261s of the top surface 1261 of the insulating layer 126. In some embodiments, portion 130b of the transparent electrode 130 may cover portion 1261s of the top surface 1261 and may extend in a direction away from the contact hole 134 between the insulating layers 126 and 128, but is not limited thereto. In some embodiments, portion 130b of the transparent electrode 130 is in direct contact with the insulating layers 126 and 128. In some embodiments, the edge of portion 130b of the transparent electrode 130 may extend beyond the sidewalls 128w and 126w, but is not limited thereto.

[0031] Furthermore, contact hole 136 may have a diameter DI1, and contact hole 134 may have a diameter DI2. For example... Figure 3 The diameter DI1 can be determined by measuring the minimum width of the bottom profile of the sidewall 128w of the insulating layer 128, and the diameter DI2 can be determined by measuring the minimum width of the bottom profile of the sidewall 124w of the insulating layer 124, but this is not a limitation. In this embodiment, the diameter DI1 can be larger than the diameter DI2. The diameter DI1 of the contact hole 136 can be greater than or equal to 15 micrometers and less than or equal to 20 micrometers, but this is not a limitation.

[0032] The diameters DI1 and DI2 can be measured using an optical microscopy (OM), scanning electron microscopy (SEM), an alpha-step thickness gauge, an ellipsometry, or other suitable methods. Specifically, in some embodiments, a scanning electron microscope is used to obtain cross-sectional images of the structure, and the minimum width in any cross-sectional image is measured. Alternatively, an optical microscope is used to obtain top-view images of the structure, and the minimum width in any top-view image is measured.

[0033] Transparent electrode 132 may be disposed on insulating layer 128 and transparent electrode 130, and may at least partially cover insulating layer 128 and transparent electrode 130, but is not limited thereto. Transparent electrode 132 may be electrically connected to metal layer 122 via contact holes 136 and 134. For example, transparent electrode 132 may be in direct contact with a portion of the surface of transparent electrode 130 exposed by contact hole 136, so that transparent electrode 132 may be electrically connected to metal layer 122 via transparent electrode 130, but is not limited thereto. In some embodiments, since transparent electrode 132 may be filled into contact hole 136, the top surface of transparent electrode 132 may be concave at the location of contact hole 136. Similarly, the top surface of transparent electrode 130 may also be concave at the location of contact hole 134.

[0034] On the other hand, such as Figure 3 An included angle α may be formed between the sidewall 128w and the substrate 100, and the angle α may be greater than or equal to 45 degrees and less than or equal to 60 degrees. Designing the included angle α to be greater than or equal to 45 degrees can improve the coverage of the transparent electrode 132 filling the contact hole 136. Alternatively, considering the limitations of the manufacturing process, the included angle α may be designed to be less than or equal to 60 degrees, but this is not a limitation. An included angle β may be formed between the sidewall 124w and the substrate 100. In some embodiments, the angle range of included angle β may be the same as that of included angle α, and it may have the aforementioned effects, but this is not a limitation. In some embodiments, the angle of included angle β may be different from the angle of included angle α, and the slope of the sidewall 124w may be different from that of the sidewall 128w. In some embodiments, sidewalls 124w, 126w, and 128w may have different slopes, or two of sidewalls 124w, 126w, and 128w may have different slopes, but this is not a limitation.

[0035] like Figure 2 and Figure 3As shown, in the bonding pad 112 of this embodiment, the transparent electrode 130 is not entirely formed on the insulating layer 126. The transparent electrode 130 in this embodiment can be multiple separate electrodes, each disposed in a corresponding contact hole 134, and partially covering a portion 1261s of the top surface 1261 of the insulating layer 126 adjacent to the contact hole 134. This reduces the area of ​​the heterogeneous interface between the transparent electrode 130 and the insulating layer 126, or between the transparent electrode 130 and the insulating layer 128, thereby reducing the chance of detachment or breakage due to the heterogeneous interface. On the other hand, this embodiment utilizes two contact holes (such as contact hole 134 and contact hole 136) to penetrate the insulating layers 124, 126, and 128. Compared to using only one contact hole to penetrate the insulating layers 124, 126, and 128, this embodiment can save process time or reduce the size of the contact hole.

[0036] The mating pad 114 may have a similar structure and function to the mating pad 112, and may be referenced. Figure 2 , Figure 3 As described above. In some embodiments, the bonding pad 114 may be designed to have different sizes (e.g., area) and different numbers of contact holes than the bonding pad 112, but this is not a limitation. In some embodiments, one end of the bonding pad 114 may be connected to the trace 116, and the other end of the bonding pad 114 may not need to be connected to the trace.

[0037] like Figure 1 The flexible display device 10 may include a transparent electrode 138 disposed in the peripheral region R2, and a portion of the transparent electrode 138 may extend into the active region R1, but is not limited thereto. The transparent electrode 138 may be disposed on the transition structure 108 or may at least cover a portion of the transition structure 108. The transparent electrode 138 may protect the underlying components, but is not limited thereto. Please refer to [reference needed]. Figures 4 to 6 , Figure 4 This is an enlarged schematic diagram of the layer transition structure according to some embodiments of the present invention. Figure 5 For along Figure 4 A schematic diagram of the structural cross-sections along lines B-B' and C-C', and Figure 6 For along Figure 4 A schematic diagram of the structural cross-section along line D-D'. (See attached diagram.) Figure 4 and Figure 5 Taking one of the layered structures 108 as an example, a metal layer 142 can be disposed between the metal layer 122 and the insulating layer 126. More specifically, the metal layer 142 can be disposed between the insulating layer 124 and the insulating layer 126. Figure 4Data line 104 may be a trace extending from metal layer 142, and data line 104 may be directly connected to metal layer 142 in transition structure 108, but is not limited thereto. In addition, trace 110 (i.e. trace extending from metal layer 122) may be directly connected to metal layer 122 in transition structure 108, but is not limited thereto.

[0038] like Figure 5 An insulating layer 126 is disposed on a metal layer 142. A contact hole 144 can pass through the insulating layer 126 and expose a portion of the metal layer 142. A contact hole 146 can pass through the insulating layer 124 and the insulating layer 126 and expose a portion of the metal layer 122. In some embodiments, a transparent electrode 130 can be disposed in the contact holes 144 and 146 and can at least partially cover the top surface 1261 of the insulating layer 126, but is not limited thereto. In some embodiments, the transparent electrode 130 can directly contact a portion of the surface of the metal layer 142 exposed by the contact hole 144 and a portion of the surface of the metal layer 122 exposed by the contact hole 146, so that the transparent electrode 130 can be electrically connected to the metal layer 122 via the contact hole 146 and electrically connected to the metal layer 142 via the contact hole 144, but is not limited thereto. In some embodiments, such as Figure 4 Data cable 104 and trace 110 can be electrically connected through the layered structure 108. For example... Figure 5 The metal layers 122 and 142 can be electrically connected through the transparent electrode 130.

[0039] like Figure 5 As shown, at the contact hole 144, the transparent electrode 130 may include a portion 130c and another portion 130d, wherein portion 130c is disposed in the contact hole 144, and portion 130d is disposed on a portion 1261t of the top surface 1261 of the insulating layer 126. At the contact hole 146, the transparent electrode 130 may include a portion 130e and another portion 130f, wherein portion 130e is disposed in the contact hole 146, and portion 130f is disposed on a portion 1261r of the top surface 1261 of the insulating layer 126. In some embodiments, the top surface of the transparent electrode 130 may be concave at the contact holes 144 and 146. In the layered structure 108 of this embodiment, the area of ​​the heterogeneous interface between the transparent electrode 130 and the insulating layer 126 can be reduced by shrinking the area of ​​the transparent electrode 130 (for example, smaller than the area of ​​the metal layer 122 under the transparent electrode 130), or the area of ​​the heterogeneous interface between the transparent electrode 130 and the insulating layer 128 can be reduced, thereby reducing the chance of detachment or breakage caused by the heterogeneous interface.

[0040] like Figure 1The flexible display device 10 may include a transparent electrode 140 disposed within a peripheral region R2. In the second direction D2, the transparent electrode 140 may be disposed between the transparent electrode 138 and the integrated circuit chip 118, but is not limited thereto. Figure 4 and Figure 6 The transparent electrode 140 can be disposed on the trace 110 (i.e., the linear portion of the metal layer 122) or can at least cover a portion of the trace 110. The transparent electrode 140 can protect the underlying components, but is not limited thereto. In the flexible display device 10 of this embodiment, no transparent electrode (such as transparent electrode 130) is disposed between the insulating layer 126 and the insulating layer 128 under the transparent electrode 140. This can reduce the formation of heterogeneous interfaces between the transparent electrode and the insulating layer 126, or reduce the formation of heterogeneous interfaces between the transparent electrode and the insulating layer 128, thereby reducing the chance of detachment or breakage caused by heterogeneous interfaces. In addition, the number and placement of the transparent electrodes 138 and 140 of the present invention are not limited to... Figure 1 The above is the limit.

[0041] In this embodiment, metal layers 122 and 142 may comprise single-layer or multi-layer structures. Metal layers 122 and 142 may comprise metals (e.g., silver (Ag), copper (Cu), or aluminum (Al), molybdenum (Mo), or alloys thereof), metal oxides, metal nitrides, other suitable conductive materials, or combinations thereof, but are not limited thereto. In some embodiments, metal layer 122 may be, for example, a bilayer structure comprising aluminum and molybdenum or aluminum and molybdenum nitride, while metal layer 142 may be, for example, a trilayer structure comprising molybdenum / aluminum / molybdenum or molybdenum nitride / aluminum / molybdenum nitride, but is not limited thereto.

[0042] Insulating layers 124, 126, and 128 may comprise single-layer or multi-layer structures. The materials of insulating layers 124, 126, and 128 may include inorganic and organic insulating materials. Examples of inorganic insulating materials include silicon oxide, silicon nitride, silicon oxynitride, other suitable insulating materials, or combinations thereof, but are not limited thereto. Examples of organic insulating materials include organic resins, organic layer PFA (Polymer Film On Array), other suitable insulating materials, or combinations thereof, but are not limited thereto. In some embodiments, insulating layer 124 may be a gate insulating layer, which may be, for example, a single-layer structure comprising silicon nitride or a three-layer structure comprising silicon nitride / amorphous silicon / n-type doped silicon, but is not limited thereto. Insulating layers 126 and 128 may, for example, be single-layer structures comprising silicon nitride, but are not limited thereto.

[0043] The materials of transparent electrodes 130, 132, 138 and 140 may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), antimony zinc oxide (AZO), other suitable transparent conductive materials or combinations thereof, but are not limited thereto.

[0044] Other embodiments of the present invention will be described in detail below. For the sake of simplicity, the same reference numerals will be used to refer to the same components. In order to highlight the differences between the embodiments, the differences between the different embodiments will be described in detail below, and repeated technical features will not be repeated.

[0045] Please refer to Figure 7 This is a partial cross-sectional schematic diagram of one of the bonding pads in some embodiments of the present invention. Figure 7 It can be the cross-sectional structure of one of the sets of contact holes 134 and contact holes 136 of the bonding pad 114 or bonding pad 112 in the above embodiments. In this embodiment, no transparent electrode 130 is provided in the contact hole 134, only a transparent electrode 132 is provided to fill the contact hole 134 and contact hole 136 and directly contact the metal layer 122.

[0046] Please refer to Figure 8 This is a partial cross-sectional schematic diagram of one of the bonding pads in some embodiments of the present invention. In this embodiment, a portion 130b of the transparent electrode 130 may be disposed on a portion 1261s of the top surface 1261 of the insulating layer 126 exposed by the contact hole 136, and partially cover the portion 1261s of the top surface 1261. Therefore, a portion of the portion 1261s of the top surface 1261 may not be covered by the portion 130b of the transparent electrode 130, or the edge of the portion 130b of the transparent electrode 130 may be located between the sidewall 128w and the sidewall 126w, but is not limited thereto.

[0047] In summary, in the bonding pad of the electronic device or flexible display device of the present invention, one layer of transparent electrode is not entirely formed on the insulating layer but can be multiple separable electrodes. The transparent electrodes can be respectively disposed in corresponding contact holes and partially cover a portion of the top surface of the insulating layer adjacent to the contact hole. This reduces the area of ​​the heterogeneous interface between the transparent electrode and the insulating layer located above or below the transparent electrode, thereby reducing the chance of detachment or breakage due to the heterogeneous interface. Furthermore, in the transfer structure within the peripheral area or above a portion of the trace, the area of ​​the heterogeneous interface between the transparent electrode and the insulating layer can be reduced by decreasing the area of ​​the transparent electrode, thereby reducing the chance of detachment or breakage due to the heterogeneous interface.

[0048] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations, and the different features between the embodiments can be arbitrarily arranged and combined as long as they do not conflict with or violate the spirit of the invention, depending on design requirements. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electronic device, characterized in that, include: A substrate includes an active region and a peripheral region adjacent to the active region; A first metal layer is disposed on the substrate; A first insulating layer is disposed on the first metal layer; A second insulating layer is disposed on the first insulating layer; A second metal layer is disposed between the first metal layer and the second insulating layer; A first contact hole, penetrating the first and second insulating layers, and exposing a portion of the first metal layer in the peripheral area; A second contact hole, penetrating the second insulating layer and exposing a portion of the second metal layer in the peripheral area; A first transparent electrode is disposed on the second insulating layer, wherein the first transparent electrode is electrically connected to the first metal layer via the first contact hole and electrically connected to the second metal layer via the second contact hole, and the top surface of the first transparent electrode is concave at the positions of the first contact hole and the second contact hole; as well as A second transparent electrode is disposed on the second insulating layer, wherein the second transparent electrode covers the traces and the first transparent electrode is not disposed under the second transparent electrode; In a top view of the electronic device, the area of ​​the second metal layer is smaller than the area of ​​the first transparent electrode, and the area of ​​the first transparent electrode is smaller than the area of ​​the first metal layer.

2. The electronic device as claimed in claim 1, characterized in that, The first transparent electrode is in direct contact with the first metal layer and the second metal layer.

3. The electronic device as claimed in claim 1, characterized in that, The first transparent electrode includes a first part, a second part, and a third part, wherein the first part is disposed within the first contact hole, the second part is disposed within the second contact hole, and the third part is disposed on a portion of the top surface of the second insulating layer.

4. The electronic device as claimed in claim 1, characterized in that, In the top view of the electronic device, the length of the first metal layer is different from the length of the second metal layer.

5. The electronic device as claimed in claim 4, characterized in that, In the top view of the electronic device, the length of the first metal layer is greater than the length of the second metal layer.

6. The electronic device as claimed in claim 1, characterized in that, In the top view of the electronic device, the length of the first transparent electrode is different from the length of the second metal layer.

7. The electronic device as claimed in claim 6, characterized in that, In the top view of the electronic device, the length of the first transparent electrode is greater than the length of the second metal layer.

8. The electronic device as claimed in claim 1, characterized in that, The first metal layer comprises a multilayer structure.

9. The electronic device as claimed in claim 1, characterized in that, The second metal layer comprises a multilayer structure.

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