Contact pins for test devices for semiconductor devices and test devices

Abstract

The present invention provides a contact pin for a test device of a semiconductor device and a test device. The contact pin comprises a contact end comprising a tip portion and a connection end having a first shape; a neck portion connected with the connection end of the contact end having a second shape at its connection with the connection end; wherein the first shape and the second shape match each other to allow the contact end to be mounted on the neck portion; wherein a device pin of the semiconductor device is in electrical contact with the tip portion when the semiconductor device is tested with the test device. The present invention allows high current, high power testing without any arcing, ablation or pin wear and ensures a good electrical connection during testing.

Description

Technical Field

[0001] This invention relates to contact pins and testing apparatus for semiconductor devices. Background Technology

[0002] As part of the semiconductor device manufacturing process, test equipment is required to test semiconductor devices to evaluate their performance. During testing, the device pins of the semiconductor device must be electrically connected to the contact pins of the test equipment.

[0003] High-power integrated circuits (ICs), such as high-power MOSFETs, IGBTs, power modules, SOICs, SiCs, SiPs, DIPs, TPAKs, etc., are typically tested in horizontal / sleep mode by configuring the leads on the contact pins and pressing the leads with external force. Pin force, pin tip profile, and contact area play a crucial role in establishing a good electrical connection for this type of testing.

[0004] The following challenges currently exist in high current / power testing:

[0005] Current and Power Handling: Test fixtures include cantilever test sockets, which are typically designed for low-power applications. High-power ICs can generate large current and power levels, exceeding the capabilities of standard cantilever test sockets. This also generates heat during operation, and effective heat dissipation is crucial for maintaining device performance and preventing thermal damage. Standard cantilever test sockets may have limited heat dissipation capabilities, making it difficult to manage the increased heat generated by high-power ICs. In such cases, the pins in a standard cantilever test socket may prematurely experience contact tip wear, arcing, erosion, and ablation.

[0006] Mechanical stress: High-power ICs typically have larger package sizes and heavier structures, which can exert mechanical stress on cantilever test sockets. Increased device weight and size can lead to contact reliability issues such as poor contact force distribution, contact wear, and even cantilever spring damage. Ensuring reliable and consistent electrical contact under these conditions is a challenge.

[0007] Contact Resistance: High-power ICs typically require low-resistance electrical connections to minimize power loss and maintain accurate voltage and current measurements. Standard cantilever test sockets can introduce contact resistance due to contact materials, plating, and surface conditions. Contact resistance should be carefully characterized and minimized to ensure accurate power measurements and prevent thermal issues.

[0008] Mechanical Reliability: During testing, high-power ICs may be subjected to significant thermal cycling and mechanical stress. Typical standard cantilever test sockets cannot withstand these conditions without compromising contact performance or physical integrity. Special materials, appropriate contact design, and pin dynamics must be considered to ensure long-term reliability.

[0009] To overcome these challenges, it is important to select a cantilever test socket designed specifically for high-power applications. Summary of the Invention

[0010] To address the aforementioned problems in the prior art, in a first aspect, the present invention provides a contact pin for a testing apparatus for semiconductor devices, the contact pin comprising:

[0011] The contact end includes a pointed portion and a connecting end having a first shape;

[0012] The neck is connected to the connecting end of the contact end, and has a second shape at the connection point with the connecting end;

[0013] The first shape and the second shape are matched to each other so that the contact end is mounted on the neck;

[0014] When the semiconductor device is tested using the testing device, the device pins of the semiconductor device are in electrical contact with the tip.

[0015] Preferably, the contact end is detachably mounted on the neck.

[0016] Preferably, the contact end is made of a material that can withstand high current.

[0017] Preferably, the first shape is a dovetail tenon, and the second shape is a mortise.

[0018] Preferably, the first shape is L-shaped and the second shape is L-shaped.

[0019] Preferably, the first shape is a convex D-shape, and the second shape is a concave D-shape.

[0020] Preferably, the first shape is a concave A-shape, and the second shape is a convex A-shape.

[0021] Preferably, the first shape is Z-shaped and the second shape is Z-shaped.

[0022] Preferably, the connecting portion is connected to the neck by a welding process.

[0023] Preferably, the material capable of withstanding high current is one of tungsten, tungsten-copper alloy, molybdenum, beryllium-nickel alloy, and nickel-silver.

[0024] Preferably, the material of the contact end has one or more of the following properties: thermal conductivity, high hardness, high temperature resistance, and corrosion resistance.

[0025] Preferably, the neck extends longitudinally, wherein the contact pin further includes a first cantilever portion connected to the neck and extending laterally perpendicular to the longitudinal direction, a curved portion connected to the first cantilever portion, and a second cantilever portion connected to the curved portion and extending laterally.

[0026] The contact pin is movable in the longitudinal or transverse direction by means of the first cantilever and the bent portion.

[0027] Preferably, the curved portion is S-shaped.

[0028] Preferably, when the semiconductor device is tested using the test apparatus, the semiconductor device, which is placed horizontally above the contact pin, is pressed downward so that the device pin makes full contact with the tip.

[0029] Preferably, the tip is conical, A-shaped, pyramidal, or nail-shaped.

[0030] Preferably, a guide hook is provided above or below the second cantilever portion, by means of the guide hook, to connect the contact pin to the test device.

[0031] Preferably, the testing device includes a load plate, and a connecting portion is provided on the second cantilever portion for establishing an electrical connection between the contact pin and the load plate.

[0032] Secondly, the present invention also provides a testing apparatus for semiconductor devices, the testing apparatus comprising:

[0033] A pair of contact pins according to the first aspect, the pair of contact pins being connected to the test apparatus;

[0034] When the semiconductor device is tested using the testing device, the semiconductor device, which is placed horizontally above the contact pins, is pressed downwards so that the device pins of the semiconductor device simultaneously make electrical contact with the tip of each contact pin.

[0035] Preferably, the pair of contact pins are arranged vertically, wherein in the lower contact pin, the guide hook is located below the second cantilever of the contact pin, and in the upper contact pin, the guide hook is located above the second cantilever of the contact pin.

[0036] Preferably, one of the pair of contact pins is used as a forced pin, while the other contact pin is used as a sensing pin.

[0037] In this invention, the contact pin is connected to the device under test through the contact end. If the contact end is damaged due to use, only the contact end can be replaced instead of the entire contact pin, thereby significantly reducing the cost of use.

[0038] Furthermore, during testing, the device pins simultaneously come into close contact (connection) with a pair of contact terminals mounted on a pair of contact pins. These contacts are made of a high-current-resistance material, preventing burning or melting even during high-current, high-power testing. Therefore, this invention allows for high-current, high-power testing of high-power integrated circuits without any arcing, ablation, or pin wear.

[0039] Furthermore, the material of the contact end has good thermal conductivity, so heat can be effectively dissipated from the device pins, preventing overheating from causing potential damage to the semiconductor device or other surrounding components.

[0040] In addition, the contact material can have high hardness, meaning it is wear-resistant. This ensures that the contact can withstand repeated insertion and removal without excessive wear or deformation, thus increasing the lifespan of the contact pins and reducing the need for frequent replacements. Therefore, high-hardness contact terminals can last longer in large production cycles.

[0041] Furthermore, the material of the contact end has high temperature resistance. Since the testing scenarios of high-power ICs usually involve high temperatures, using high temperature resistant contact ends can ensure that the contact pins will not degrade while withstanding high temperatures.

[0042] Furthermore, the material of the contact end is corrosion resistant. Since the contact pins may be exposed to chemicals or moisture during testing, using corrosion resistant contact ends can prevent corrosion of the contact pins, thereby maintaining their electrical performance over a long period of time.

[0043] Furthermore, the tip of the contact end has a designed geometry so that when the device pin is subjected to downward pressure, the contact surface between the tip and the device pin is flat, thereby ensuring a good electrical connection.

[0044] Furthermore, the alloy-made contacts provide a low-resistance interface with the IC pads, minimizing contact resistance and voltage drop. This is particularly important for high-power applications, as it helps maintain accurate power delivery and reduces the risk of erroneous measurements or IC failure.

[0045] Other objects and advantages will become more fully apparent from the following disclosure and the appended claims. Attached Figure Description

[0046] Figure 1 A perspective view of a test apparatus and a semiconductor device according to an embodiment of the present invention is shown.

[0047] Figure 2 A cross-sectional view of a pair of contact pins in a test apparatus according to an embodiment of the present invention is shown.

[0048] Figure 3 A schematic diagram of a pair of contact pins according to an embodiment of the present invention is shown.

[0049] Figure 4 A partial schematic diagram of a pair of contact pins according to an embodiment of the present invention is shown.

[0050] Figure 5 A schematic diagram of a contact pin according to an embodiment of the present invention is shown.

[0051] Figure 6 A schematic diagram of a contact pin according to an embodiment of the present invention is shown.

[0052] Figure 7 A schematic diagram of a contact pin according to an embodiment of the present invention is shown.

[0053] Figure 8 A schematic diagram of a contact pin according to an embodiment of the present invention is shown.

[0054] Figure 9 A cross-sectional view of a semiconductor device placed on a test apparatus in a non-test state, according to an embodiment of the present invention, is shown.

[0055] Figure 10 An embodiment of the present invention is shown. Figure 9 A magnified view of a portion of the image.

[0056] Figure 11 A cross-sectional view of a semiconductor device placed on a test apparatus in a test state, according to an embodiment of the present invention, is shown.

[0057] Figure 12 An embodiment of the present invention is shown. Figure 11 A magnified view of a portion of the image.

[0058] Figure Labels

[0059] Test device 100

[0060] Semiconductor Device 101

[0061] Device pin 102

[0062] First contact pin 21

[0063] Second contact pin 22

[0064] First contact end 211

[0065] First tip 2111

[0066] First connection end 2112

[0067] First neck 212

[0068] First cantilever section 213

[0069] Bending part 214

[0070] Second cantilever section 215, 225

[0071] Second tip 2211

[0072] Second connection terminal 2212

[0073] First guide hook 216

[0074] Second guide hook 226

[0075] First connecting part 217

[0076] Second connecting part 227 Detailed Implementation

[0077] The embodiments of the present invention will be described below with reference to the accompanying drawings.

[0078] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.

[0079] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items. Words such as “comprising” or “including” mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects.

[0080] It should be noted that the following detailed description is for the contact pins of the test apparatus for semiconductor devices and the test apparatus itself, and is not limited to any particular size or configuration, but rather includes a variety of sizes and configurations within the general range described below.

[0081] Figure 1 A perspective view of a test apparatus and a semiconductor device according to an embodiment of the present invention is shown. Figure 1 As shown, the semiconductor device 101 can be placed on the test apparatus 100. The semiconductor device 101 is, for example, a high-power integrated circuit chip IC, and includes a plurality of device pins 102.

[0082] Figure 1 Only the cantilever test socket in the test apparatus is shown, so it can also be said that the semiconductor device 101 is placed on the cantilever test socket 100.

[0083] Figure 2 A cross-sectional view of the test apparatus is shown. Figure 3 A schematic diagram of a pair of contact pins in the test setup is shown. (As shown) Figure 2 , 3 As shown, a pair of contact pins includes a first contact pin 21 and a second contact pin 22. The first contact pin 21 and the second contact pin 22 are arranged vertically, and for example, the first contact pin 21 is below and the second contact pin 22 is above.

[0084] It is understood that the test apparatus 100 may include multiple pairs of contact pins arranged vertically, without limitation.

[0085] The following detailed explanation uses the first contact pin 21 as an example.

[0086] like Figure 3 As shown, the first contact pin 21 includes a first contact end 211, which is detachably or fixedly mounted on the first neck 212.

[0087] The first contact 211 may be made of a material that can withstand high current. Specifically, the material that can withstand high current includes metals or alloys, such as tungsten, tungsten-copper alloy, molybdenum, beryllium-nickel alloy or nickel-silver.

[0088] The first contact end 211 includes a first tip 2111 and a first connection end 2112 having a first shape. The first contact pin 21 includes a first neck 212 extending along the longitudinal direction Y, and the first contact end 211 is mounted above the first neck 212 in the longitudinal direction Y.

[0089] Figure 4 A partially enlarged view of the first contact pin 21 and the second contact pin 22 is shown. Figure 4As shown, the first connecting end 2112 has a first shape, and the connection between the first neck 212 and the first connecting end 2112 has a second shape, that is, the upper part of the first neck 212 has a second shape. The first shape and the second shape match each other so that the first contact end 211 is detachably mounted on the first neck 212 of the first contact pin 21.

[0090] like Figure 4 As shown, the first shape is a dovetail tenon, and the second shape is a mortise shape. The dovetail tenon and the mortise shape match each other so that the first contact end 211 is mounted on the first neck 212 of the first contact pin 21.

[0091] Alternatively, such as Figure 5 As shown, the first shape is L-shaped and the second shape is L-shaped. The two L-shapes match each other so that the first contact end 211 is mounted on the first neck 212 of the first contact pin 21.

[0092] Alternatively, such as Figure 6 As shown, the first shape is a convex D-shape, and the second shape is a concave D-shape. The convex D-shape and the concave D-shape match each other so that the first contact end 211 is mounted on the first neck 212 of the first contact pin 21.

[0093] Alternatively, such as Figure 7 As shown, the first shape is a concave A-shape, and the second shape is a convex A-shape. The concave A-shape and the convex A-shape match each other so that the first contact end 211 is mounted on the first neck 212 of the first contact pin 21.

[0094] Alternatively, such as Figure 8 As shown, the first shape is Z-shaped and the second shape is Z-shaped. The two Z-shapes match each other so that the first contact end 211 is mounted on the first neck 212 of the first contact pin 21.

[0095] Understandable Figure 5-8 The first connecting portion 2112 shown can be connected to the upper end of the first neck 212 by welding or other suitable means, thereby fixing or detachably mounting the first contact end 211 on the first neck 212.

[0096] Understandably, the first and second shapes match each other, allowing the contact ends to be easily installed on or removed from the neck.

[0097] The material of the first contact end 211 has one or more of the following properties: thermal conductivity, high hardness, high temperature resistance, and corrosion resistance.

[0098] In this embodiment, for example, the material of the first contact end 211 has thermal conductivity, high hardness, high temperature resistance, and corrosion resistance.

[0099] Return to reference Figure 3 The first contact pin 21 includes a first cantilever portion 213 connected to the first neck 212 and extending along the transverse X perpendicular to the longitudinal direction Y, a bent portion 214 connected to the first cantilever portion 213, and a second cantilever portion 215 connected to the bent portion 214 and extending along the transverse X.

[0100] like Figure 3 As shown, the bend 214 extends along the longitudinal direction Y and is S-shaped. With the help of the first cantilever 213 and the bend 214, the first contact pin 21 is flexible, thereby enabling it to move in the longitudinal direction Y and / or the lateral direction X.

[0101] The first tip 2111 is designed with different geometries. For example... Figure 4 and Figure 8 As shown, the first tip 2111 is tapered. Alternatively, as... Figure 5 As shown, the first tip 2111 is A-shaped. Alternatively, as... Figure 6 As shown, the first tip 2111 is pyramidal in shape. Alternatively, as... Figure 7 As shown, the first tip 2111 is nail-shaped.

[0102] Understandable Figures 4-8 The shape of the first tip 2111 in the figure is for illustrative purposes only, and the shape of the first tip 2111 in each figure may be different. For example, Figure 4 The first tip 2111 can be any of the following shapes: A-shaped, pyramidal, or nail-shaped.

[0103] The second contact pin 22 is essentially the same as the first contact pin 21 and can be made of the same material. For example... Figure 4 As shown, the second contact pin 22 includes a second contact end 221. The second contact end 221 may be made of a material capable of withstanding high current. Specifically, the material capable of withstanding high current includes metals or alloys, such as tungsten, tungsten-copper alloy, molybdenum, beryllium-nickel alloy, or nickel-silver. The second contact end 221 includes a second tip 2211 and a second connection end 2212.

[0104] like Figure 3 , 4 As shown, the first contact pin 21 is below, the second contact pin 22 is above, and the first tip 2111 and the second tip 2211 are flush in the longitudinal Y direction, so that they can contact the device pin 102 simultaneously (described in detail below).

[0105] Figure 9 A cross-sectional view is shown with a semiconductor device placed on a test setup in a non-testing state. (See diagram.) Figure 9As shown, the semiconductor device 101 is placed horizontally on the test apparatus 100, such that the device pins 102 on the semiconductor device 101 are placed horizontally above the first contact pin 21 and the second contact pin 22.

[0106] Figure 10 It shows Figure 9 A magnified view of a portion of the image, such as Figure 10 As shown, in the non-test state, only a portion of the first tip 2111 contacts the device pin 102, and only a portion of the second tip 2211 contacts the device pin 102.

[0107] See Figure 11 During testing, a downward pressure F is applied to the semiconductor device 101, causing the device pins 102 to point downwards, thereby applying downward pressure to the first contact pin 21 and the second contact pin 22 as well. As described above, the first contact pin 21 is flexible due to the curved portion 214 and the first cantilever portion 213, allowing it to move in the longitudinal (Y) and lateral (X) directions when subjected to downward pressure. Similarly, the second contact pin 22 can also move in the longitudinal (Y) and lateral (X) directions when subjected to downward pressure.

[0108] Figure 12 yes Figure 11 A magnified view of a portion of the image. For example... Figure 12 As shown, the first contact pin 21 and the second contact pin 22 are subjected to downward pressure and move in the longitudinal (Y) and lateral (X) directions, thereby causing the first tip 2111 and the second tip 2211 to move in the longitudinal (Y) and lateral (X) directions. Due to the geometry of the first tip 2111 and the second tip 2211, after the first tip 2111 and the second tip 2211 move in the longitudinal (Y) and lateral (X) directions, the contact surface between the first tip 2111 and the device pin 102 becomes flat, and the contact surface between the second tip 2211 and the device pin 102 also becomes flat. That is, the first tip 2111 and the second tip 2211 are in full contact with the device pin 102. Therefore, in the test state, a larger contact area between the first contact pin 21 and the second contact pin 22 and the device pin 102 can be ensured, thereby ensuring a good electrical connection.

[0109] Return to reference Figure 3 A first guide hook 216 is provided below the second cantilever portion 215 of the first contact pin 21, and a second guide hook 226 is provided above the second cantilever portion 225 of the second contact pin 22. The first contact pin 21 can be connected to the test apparatus 100 by means of the first guide hook 216, and the second contact pin 22 can be connected to the test apparatus 100 by means of the second guide hook 226, as shown below. Figure 2 As shown.

[0110] It is understandable that, such as Figure 2 As shown, the test device 100 is provided with grooves that match the first guide hook 216 and the second guide hook 226 respectively, for receiving the first guide hook 216 and the second guide hook 226, thereby connecting the first contact pin 21 and the second contact pin 22 to the test device 100.

[0111] Return to reference Figure 3 The second cantilever portion 215 of the first contact pin 21 also includes a first connection portion 217 for establishing an electrical connection with a load plate (not shown) on the test apparatus 100, thereby performing a test. The first connection portion 217 extends in the longitudinal Y direction to electrically connect with the load plate below.

[0112] Similarly, the second cantilever portion 225 of the second contact pin 22 also includes a second connection portion 227 for establishing an electrical connection with a load plate (not shown) on the test apparatus 100, thereby performing a test. The second connection portion 227 extends in the longitudinal Y direction to electrically connect with the load plate below.

[0113] It is understood that in some configurations of the test apparatus 100, two separate electrical connections, also known as Kelvin connections, need to be established between the test apparatus 100 and the device pin 102 of the semiconductor device 101 under test. A Kelvin connection includes a force pin and a sense pin. The force pin is used to deliver a high current (or voltage) to the device pin 102, and the sense pin measures the feedback current (or voltage) from the semiconductor device 101. It is understood that the force pin and the sense pin can be implemented using contact pins in this invention. For example, the force pin is implemented by a first contact pin 21, and the sense pin is implemented by a second contact pin 22.

[0114] In this invention, the contact pin is connected to the device under test through the contact end. If the contact end is damaged due to use, only the contact end can be replaced instead of the entire contact pin, thereby significantly reducing the cost of use.

[0115] Furthermore, during testing, the device pins simultaneously come into close contact (connection) with a pair of contact terminals mounted on a pair of contact pins. These contact terminals are made of a high-current-resistance material, preventing burning or melting even during high-current, high-power testing. Therefore, this invention allows for high-current, high-power testing without any arcing, ablation, or pin wear. Furthermore, the contact terminal material has good thermal conductivity, thus effectively dissipating heat from the device pins and preventing overheating that could potentially damage the semiconductor device or surrounding components.

[0116] Furthermore, the contact material has high hardness, meaning it is wear-resistant. This ensures the contact can withstand repeated insertion and removal without excessive wear or deformation, thus increasing the contact pin's lifespan and reducing the need for frequent replacements. Therefore, high-hardness contact terminals can be used for a longer period during continuous production cycles.

[0117] Furthermore, the material of the contact end has high temperature resistance. Since the testing scenarios of high-power ICs usually involve high temperatures, using high temperature resistant contact ends can ensure that the contact pins will not degrade while withstanding high temperatures.

[0118] Furthermore, the material of the contact end is corrosion resistant. Since the contact pins may be exposed to chemicals or moisture during testing, using corrosion resistant contact ends can prevent corrosion of the contact pins, thereby maintaining their electrical performance over a long period of time.

[0119] Furthermore, the tip of the contact end has a designed geometry so that when the device pin is subjected to downward pressure, the contact surface between the tip and the device pin is flat, thereby ensuring a good electrical connection.

[0120] Furthermore, the alloy-made contacts provide a low-resistance contact interface with the IC pads, thereby minimizing contact resistance and voltage drop. This is especially important for high-power applications, as it helps maintain accurate power delivery and reduces the risk of erroneous measurements or IC failure.

[0121] While several particularly preferred embodiments of the invention have been described and illustrated, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the scope of the invention. Therefore, the following claims are intended to include such changes, modifications, and applications within the scope of the invention.

Claims

1. A contact pin for a test device of a semiconductor device, characterized in that, The contact pin comprises: a contact end comprising a tip portion and a connecting end having a first shape; a neck portion connected to the connecting end of the contact end and having a second shape at the connection thereof to the connecting end; wherein the first shape and the second shape match each other to allow the contact end to be mounted on the neck portion, the connecting end is connected to the neck portion by a soldering process, the contact pin further comprises a first cantilever portion connected to the neck portion and extending along a transverse direction perpendicular to a longitudinal direction, a bending portion connected to the first cantilever portion, and a second cantilever portion connected to the bending portion and extending along the transverse direction, by means of the first cantilever portion and the bending portion, the contact pin is movable in the longitudinal direction or the transverse direction, wherein, when the semiconductor device is tested by using the testing device, the device pins of the semiconductor device are in electrical contact with the tip portions.

2. The contact pin according to claim 1, characterized in that The first shape is dovetail-shaped, and the second shape is mortise-shaped.

3. The contact pin of claim 1, wherein The first shape is L-shaped, and the second shape is L-shaped.

4. The contact pin of claim 1, wherein The first shape is convex D-shaped, and the second shape is concave D-shaped.

5. The contact pin of claim 1, wherein The first shape is concave A-shaped, and the second shape is convex A-shaped.

6. The contact pin of claim 1, wherein The first shape is Z-shaped, and the second shape is Z-shaped.

7. The contact pin of claim 1, wherein The contact end is made of one of tungsten, tungsten-copper alloy, molybdenum, beryllium-nickel alloy, and nickel-silver.

8. The contact pin of claim 1, wherein The tip portion is conical, A-shaped, pyramid-shaped, or nail-shaped.

9. The contact pin of claim 1, wherein A guide hook portion is arranged above or below the second cantilever portion, by means of which the contact pin is connected to the testing device.

10. The contact pin of claim 1, wherein The testing device comprises a load board, and a connecting portion is arranged on the second cantilever portion to establish electrical connection between the contact pin and the load board.

11. A testing apparatus for a semiconductor device, characterized by comprising: The testing device comprises: a pair of contact pins according to any one of claims 1-10, the pair of contact pins being connected to the testing device; wherein, when the semiconductor device is tested by using the testing device, the semiconductor device horizontally placed above the contact pins is pressed downward to make the device pins of the semiconductor device simultaneously in electrical contact with the tip portions on each of the contact pins.

12. The test device of claim 11, wherein, The pair of contact pins are arranged above and below respectively, wherein, in the lower contact pin, a guide hook portion is arranged below the second cantilever portion of the contact pin, and in the upper contact pin, the guide hook portion is arranged above the second cantilever portion of the contact pin.

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