A wafer single - piece electroplating machine with adjustable notches

Abstract

The present invention belongs to the technical field of semiconductor wafers, and in particular to a single-wafer electroplating machine with adjustable notches. A single-wafer electroplating machine with adjustable notches includes a frame and multiple electroplating troughs arranged on the frame. In this single-wafer electroplating machine with adjustable notches, by setting a telescopic stretching mechanism, the adjustment of the aperture size of the notch in the electroplating trough is realized, avoiding the mixing of different electroplating solutions, and at the same time adapting to the electroplating solution flushing of semiconductor wafers of different sizes. The rotation of the output shaft of the servo motor drives the rotation of the connecting shaft connected thereto. The rotation of this connecting shaft drives the rotation of the gear connected thereto. The rotation of this gear causes it to move along the surface of the toothed ring, thereby driving the rotation of another gear. At the same time, the rotation of this gear drives the rotation of the connecting shaft, and further facilitates driving two arc-shaped adjusting plates to move relatively along the inner wall of the groove through the connecting shaft, achieving the effect of adjusting the notch.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafers, and in particular to a single-wafer electroplater with adjustable notches. Background Art

[0002] Currently, in the process of electroplating semiconductor wafers using an electroplater, most often a manipulator is used to transport a single wafer into the electroplating tank, and different electroplating solutions are sequentially injected to rinse the surface of the wafer. However, due to the different sizes of the wafers, electroplating machines with different aperture sizes need to be selected according to the size of the wafers.

[0003] If a large-aperture wafer inlet and outlet are used, it is easy for the internal and external environments to communicate with each other during the electroplating process. The electroplating solution in the electroplater is obtained by chemical agents electroplating the surface of the wafer after being energized. These chemical agents have strict requirements on components, ratios, temperature, and volatility. Once they communicate with the external environment, it will accelerate the volatilization of the chemical solution, and at the same time, it is easy to damage the internal temperature environment, making it impossible for the wafer to maintain the required constant temperature and other constant states during the electroplating time. Moreover, it is easy for tiny particles in the external environment to enter the core electroplating area of the electroplater, thus reducing the electroplating efficiency and qualification rate of the wafer. Therefore, an electroplater needs to be designed to adapt to wafers of different sizes. Summary of the Invention

[0004] Based on the technical problem that the existing electroplater cannot adjust the aperture of the electroplating tank when rinsing the electroplating solution for semiconductor wafers, thus being unable to adapt to semiconductor wafers of different sizes and reducing the electroplating efficiency of semiconductor wafers, the present invention proposes a single-wafer electroplater with adjustable notches.

[0005] A single-wafer electroplater with adjustable notches proposed by the present invention includes a frame and a multi-layer electroplating tank body arranged on the frame, and further includes a protection mechanism arranged on both sides of the frame, a telescopic expansion mechanism arranged at the notch of the electroplating tank body, and a positioning and adjusting mechanism arranged on the inner bottom wall of the electroplating tank body.

[0006] The protection mechanism includes semi-circular closing plates symmetrically arranged on the upper surface of the electroplating tank body. The two closing plates perform closing or opening actions on the feeding notch of the electroplating tank body when approaching or moving away from each other, thereby ensuring the cleanliness inside the electroplating tank body.

[0007] A telescopic stretching mechanism, the telescopic stretching mechanism includes arc-shaped adjusting plates symmetrically arranged at the inner slot opening of the electroplating tank body. Both of the arc-shaped adjusting plates are located inside the slot opening of the electroplating tank body, and the relative movement of the two arc-shaped adjusting plates realizes the adjustment action of the aperture size of the inner slot opening of the electroplating tank body.

[0008] A positioning and adjusting mechanism, the positioning and adjusting mechanism includes a clamping table installed on the inner bottom wall of the electroplating tank body through a bearing. At the same time, a positioning disk is arranged on the upper part of the clamping table to realize the clamping and supporting action of semiconductor wafers of different sizes.

[0009] Preferably, the protection mechanism further includes brackets on both sides of the frame. The upper surfaces of the two brackets are both fixedly installed with slide rails, and the two brackets are connected through a mounting groove body. The mounting groove body is located on the upper surface of the frame and the inner wall of the mounting groove body is fixedly installed with a driving motor. One end of the output shaft of the driving motor extends to the outer surface of the mounting groove body and is fixedly sleeved with a bidirectional lead screw. The two ends of the bidirectional lead screw are respectively installed on the brackets through bearings. Both ends of the surface of the bidirectional lead screw are threadedly sleeved with sliders, and the lower surface of the slider is slidably clamped with the surface of the slide rail.

[0010] Through the above technical solution, the rotation of the output shaft of the driving motor drives the bidirectional lead screw to rotate, and the rotation of the bidirectional lead screw drives the two sliders to move relatively on the bidirectional lead screw along the surface of the slide rail respectively.

[0011] Preferably, the surface of the other slide rail is slidably clamped with the lower surfaces of the other two sliders. The upper surface of the slider is fixedly connected with an L-shaped rod. One end of the L-shaped rod is fixedly connected with a connecting block. One side of the connecting block is fixedly connected with one side of the closing plate. At the same time, sliding grooves are respectively opened on both sides of the outer surface of the electroplating tank body, and the surface of the closing plate is slidably clamped with the inner wall of the sliding groove.

[0012] Through the above technical solution, the movement of the slider drives the L-shaped rod to move. The movement of the L-shaped rod drives the closing plate to move along the inner wall of the sliding groove through the connecting block. At the same time, it drives the other slider to move on the corresponding slide rail through the other L-shaped rod. As the two closing plates move relatively, the upper slot opening of the electroplating tank body is sealed, so as to keep the inside of the electroplating tank body clean when not in use.

[0013] Preferably, sealing strips are respectively fixedly connected to the other sides of the two closing plates.

[0014] Through the above technical solution, the sealing strips seal the closing of the two closing plates to prevent dust from entering the electroplating tank body.

[0015] Preferably, the telescopic stretching mechanism further includes a groove formed at the inner notch of the electroplating tank body. A toothed ring is fixedly installed on the inner wall of the groove. At the same time, the surface of the arc-shaped adjusting plate is slidably clamped with the inner wall of the groove. Both ends of the two arc-shaped adjusting plates are hinged through a connecting shaft, and a gear is fixedly sleeved on the middle end of the two connecting shafts. The surface of the gear meshes with the surface of the toothed ring.

[0016] Through the above technical solution, due to the meshing of the gear and the toothed ring and the limitation of the arc-shaped adjusting plate by the groove, the two arc-shaped adjusting plates move relative to each other.

[0017] Preferably, a servo motor is fixedly installed inside the electroplating tank body. One end of the output shaft of the servo motor is fixedly sleeved with one end of the connecting shaft.

[0018] Through the above technical solution, the rotation of the output shaft of the servo motor drives the connecting shaft connected to it to rotate. The rotation of the connecting shaft drives the gear to rotate. The rotation of the gear causes it to move along the surface of the toothed ring. At the same time, the rotation of the gear drives the connecting shaft to rotate, thereby driving the two arc-shaped adjusting plates to move relative to each other.

[0019] Preferably, the positioning and adjusting mechanism further includes a telescopic hydraulic cylinder fixedly installed inside the clamping table. One end of the piston rod of the telescopic hydraulic cylinder extends out of the clamping table and is fixedly connected to the lower surface of the positioning disk. A rotating motor is fixedly installed on the inner wall of the frame. One end of the output shaft of the rotating motor extends into the electroplating tank body and is fixedly sleeved with the lower surface of the clamping table. At the same time, the bottom of the clamping table is installed on the inner bottom wall of the electroplating tank body through a bearing.

[0020] Through the above technical solution, the telescopic movement of the piston rod of the telescopic hydraulic cylinder drives the positioning disk to move up and down, and the rotation of the output shaft of the rotating motor drives the clamping table to rotate.

[0021] Preferably, a servo motor is fixedly installed inside the positioning disk. One end of the output shaft of the servo motor is fixedly sleeved with a driving gear. At the same time, a driven gear is installed inside the positioning disk through a bearing. The surface of the driving gear meshes with the surface of the driven gear. Arc-shaped grooves are formed in an annular array on the surface of the driven gear. A fixed disk is fixedly installed on the lower surface of the driven gear. Limiting grooves are formed in an annular array on the upper surface of the fixed disk. An L-shaped sliding rod is slidably clamped with the inner wall of the limiting groove. The upper surface of the L-shaped sliding rod is fixedly connected to a sliding column. The surface of the sliding column is slidably connected to the inner wall of the arc-shaped groove.

[0022] Through the above technical solution, the rotation of the output shaft of the servo motor drives the rotation of the driving gear. The rotation of the driving gear drives the rotation of the driven gear through meshing with the driven gear. The rotation of the driven gear drives the sliding column to move in the arc-shaped groove, and the movement of the sliding column drives the L-shaped sliding rod to move along the inner wall of the limiting groove.

[0023] Preferably, supporting columns are arranged on the upper surface of the positioning disk in an annular array, and a clamping column is fixedly installed at the upper end of the L-shaped sliding rod.

[0024] Through the above technical solution, the supporting columns position and place the semiconductor wafer, and the clamping column clamps the edge of the semiconductor wafer.

[0025] Preferably, liquid outlet pipes are fixedly communicated with the lower surface of the electroplating tank body in sequence according to the distribution of its internal cavity. One end of the liquid outlet pipe is fixedly communicated with a filtering liquid collecting tank inside the frame. A drain pipe is fixedly communicated with one side of the filtering liquid collecting tank, and one end of the drain pipe extends out of the frame.

[0026] Through the above technical solution, the electroplating solution flows out of the electroplating tank body through the liquid outlet pipe and enters the filtering liquid collecting tank, and is discharged through the drain pipe after being filtered by the filter screen in the filtering liquid collecting tank.

[0027] The beneficial effects of the present invention are as follows:

[0028] 1. By setting a protection mechanism, it is convenient to ensure the cleanliness inside the electroplating tank body and reduce dust accumulation. The rotation of the output shaft of the driving motor drives the rotation of the bidirectional lead screw. The rotation of the bidirectional lead screw drives the two sliders to approach each other on the bidirectional lead screw along the surface of the slide rail respectively. The movement of the slider drives the movement of the L-shaped rod. The movement of the L-shaped rod drives the closing plate to move along the inner wall of the chute through the connecting block. At the same time, the movement of the closing plate drives another slider to move on the corresponding slide rail through another L-shaped rod. As the two closing plates gather, the upper slot opening of the electroplating tank body is sealed, thus achieving the protection effect.

[0029] 2. By setting a telescopic stretching mechanism, the adjustment of the aperture size of the inner slot opening of the electroplating tank body is realized, avoiding the mixing of different electroplating solutions, and at the same time adapting to the flushing of electroplating solutions for semiconductor wafers of different sizes. The rotation of the output shaft of the servo motor drives the rotation of the connecting shaft connected thereto. The rotation of the connecting shaft drives the rotation of the gear connected thereto. The rotation of the gear makes it move along the surface of the toothed ring, thereby driving the rotation of another gear. At the same time, the rotation of the gear drives the rotation of the connecting shaft, and then it is convenient to drive the two arc-shaped adjusting plates to move relatively along the inner wall of the groove through the connecting shaft, achieving the effect of adjusting the slot opening.

[0030] 3. By setting up a positioning and adjusting mechanism, it is possible to achieve the clamping and supporting of semiconductor wafers of different sizes. The rotation of the output shaft of the servo motor drives the rotation of the driving gear. The rotation of the driving gear drives the rotation of the driven gear through meshing with the driven gear. The rotation of the driven gear drives the sliding column to move in the arc-shaped groove, and along with the movement of the sliding column, it drives the L-shaped sliding rod to move along the inner wall of the limiting groove. The movement of the L-shaped sliding rod drives the clamping column to move, thereby facilitating the clamping column to adapt to semiconductor wafers of different radii, and thus achieving the positioning and clamping effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Schematic diagram of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0032] Figure 2 Three-dimensional view of the slide rail structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0033] Figure 3 Three-dimensional view of the installation groove body structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0034] Figure 4 Three-dimensional view of the closing plate structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0035] Figure 5 Three-dimensional view of the electroplating tank body structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0036] Figure 6 Three-dimensional view of the chute structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0037] Figure 7 Three-dimensional view of the groove structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0038] Figure 8 Three-dimensional view of the arc-shaped adjusting plate structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0039] Figure 9 Three-dimensional view of the gear structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0040] Figure 10 Three-dimensional view of the clamping column structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0041] Figure 11 Three-dimensional view of the clamping table structure of a wafer single-piece electroplating machine with adjustable notch proposed by the present invention;

[0042] Figure 12 Stereoscopic view of the telescopic hydraulic cylinder structure of a wafer single - piece electroplating machine with adjustable notch proposed by the present invention;

[0043] Figure 13 Stereoscopic view of the supporting column structure of a wafer single - piece electroplating machine with adjustable notch proposed by the present invention;

[0044] Figure 14 Stereoscopic view of the driven gear structure of a wafer single - piece electroplating machine with adjustable notch proposed by the present invention;

[0045] Figure 15 Stereoscopic view of the rotating motor structure of a wafer single - piece electroplating machine with adjustable notch proposed by the present invention.

[0046] In the figure: 1, frame; 2, electroplating tank body; 3, closing plate; 301, bracket; 302, slide rail; 303, installation tank body; 304, drive motor; 305, bidirectional lead screw; 306, slider; 307, L - shaped rod; 308, connecting block; 309, chute; 310, sealing strip; 4, arc - shaped adjusting plate; 41, groove; 42, toothed ring; 43, connecting shaft; 44, gear; 45, servo motor; 5, clamping table; 51, positioning disk; 511, servo motor; 512, driving gear; 513, driven gear; 514, arc - shaped groove; 515, fixed disk; 516, limiting groove; 517, L - shaped slide bar; 518, sliding column; 519, supporting column; 520, clamping column; 52, telescopic hydraulic cylinder; 53, rotating motor; 6, liquid outlet pipe; 7, filter liquid collection tank; 8, drain pipe. Embodiment

[0047] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0048] Refer to Figures 1 - 15 , a wafer single - piece electroplating machine with adjustable notch, including a frame 1 and multiple electroplating tank bodies 2 arranged on the frame 1, and further including a protection mechanism arranged on both sides of the frame 1, a telescopic expansion mechanism arranged at the notch of the electroplating tank body 2, and a positioning and adjusting mechanism arranged on the inner bottom wall of the electroplating tank body 2.

[0049] Among them, as Figures 1 - 2 and Figure 15It can be seen that in order to prevent different types of electroplating solutions from mixing and to discharge them from the electroplating tank body 2 in sequence, liquid outlet pipes 6 are fixedly connected in sequence according to the distribution of the internal cavities on the lower surface of the electroplating tank body 2. One end of the liquid outlet pipe 6 is fixedly connected to a filtering liquid collecting tank 7 inside the frame 1. One side of the filtering liquid collecting tank 7 is fixedly connected to a liquid discharge pipe 8, and one end of the liquid discharge pipe 8 extends out of the frame 1.

[0050] Among them, as Figures 2 - 4 It can be seen that in order to prevent the electroplating tank body 2 from accumulating dust inside when not in use, the protection mechanism includes semi-circular closing plates 3 symmetrically arranged on the upper surface of the electroplating tank body 2. The two closing plates 3 perform closing or opening actions on the feeding slot of the electroplating tank body 2 when approaching or moving away from each other, so as to ensure the cleanliness inside the electroplating tank body 2.

[0051] In order to drive the two closing plates 3 to gather or move away from each other, the protection mechanism further includes brackets 301 on both sides of the frame 1. The upper surfaces of the two brackets 301 are fixedly installed with slide rails 302, and the two brackets 301 are connected through an installation groove body 303. The installation groove body 303 is located on the upper surface of the frame 1 and the inner wall of the installation groove body 303 is fixedly installed with a driving motor 304. The installation groove body 303 is used to install the driving motor 304 and at the same time used to connect the two brackets 301. One end of the output shaft of the driving motor 304 extends to the outer surface of the installation groove body 303 and is fixedly sleeved with a bidirectional lead screw 305. Both ends of the bidirectional lead screw 305 are installed on the brackets 301 through bearings. Both ends of the surface of the bidirectional lead screw 305 are threadedly sleeved with sliders 306, and the lower surface of the slider 306 is slidably clamped with the surface of the slide rail 302. By rotating the output shaft of the driving motor 304 to drive the bidirectional lead screw 305 to rotate, the rotation of the bidirectional lead screw 305 drives the two sliders 306 to move relatively at both ends of the bidirectional lead screw 305 along the surface of the slide rail 302 respectively.

[0052] In order to stabilize the movement of the closing plate 3, the surface of another slide rail 302 is slidably clamped with the lower surfaces of another two sliders 306. The upper surfaces of the four sliders 306 are fixedly connected with L-shaped rods 307. One end of the L-shaped rod 307 is fixedly connected with a connecting block 308, and one side of the connecting block 308 is fixedly connected with one side of the closing plate 3. In order to limit the movement of the closing plate 3, sliding grooves 309 are respectively opened on both sides of the outer surface of the electroplating tank body 2, and the surface of the closing plate 3 is slidably clamped with the inner wall of the sliding groove 309.

[0053] In order to facilitate the sealing of the closing plate 3, sealing strips 310 are respectively fixedly connected to the other sides of the two closing plates 3.

[0054] By setting up a protective mechanism, it is convenient to ensure the cleanliness inside the electroplating tank body 2, reduce dust accumulation, the rotation of the output shaft of the driving motor 304 drives the rotation of the bidirectional lead screw 305, the rotation of the bidirectional lead screw 305 drives the two sliders 306 to approach each other on the bidirectional lead screw 305 along the surface of the slide rail 302 respectively, the movement of the slider 306 drives the movement of the L-shaped rod 307, the movement of the L-shaped rod 307 drives the closing plate 3 to move along the inner wall of the chute 309 through the connecting block 308, and at the same time, the movement of the closing plate 3 drives another slider 306 to move on the corresponding slide rail 302 through another L-shaped rod 307. As the two closing plates 3 gather, the upper notch of the electroplating tank body 2 is sealed.

[0055] Among them, as Figure 3 and Figures 5 - 9 can be seen, in order to facilitate adjusting the notch diameter size inside the electroplating tank body 2 to adapt to the entry and exit of wafers of different sizes and prevent the mixing of electroplating solutions, the telescopic stretching mechanism includes arc-shaped adjusting plates 4 symmetrically arranged at the inner notch of the electroplating tank body 2. Both arc-shaped adjusting plates 4 are located inside the notch of the electroplating tank body 2. With the relative movement of the two arc-shaped adjusting plates 4, the adjusting action of the inner notch aperture size of the electroplating tank body 2 is realized.

[0056] In order to make the two arc-shaped adjusting plates 4 move relatively, the telescopic stretching mechanism further includes a groove 41 opened at the inner notch of the electroplating tank body 2. A toothed ring 42 is fixedly installed on the inner wall of the groove 41. At the same time, the surface of the arc-shaped adjusting plate 4 is slidably clamped with the inner wall of the groove 41. The groove 41 is convenient for limiting the movement of the arc-shaped adjusting plate 4. Both ends of the two arc-shaped adjusting plates 4 are hinged through a connecting shaft 43, and a gear 44 is fixedly sleeved in the middle of both connecting shafts 43. The surface of the gear 44 meshes with the surface of the toothed ring 42, and the rotation of the connecting shaft 43 is driven by the meshing of the gear 44 and the toothed ring 42.

[0057] In order to drive the rotation of the connecting shaft 43, a servo motor 45 is fixedly installed inside the electroplating tank body 2, and a protective housing is arranged on the outer surface of the servo motor 45 to prevent the electroplating solution from damaging the servo motor 45. The output shaft of the servo motor 45 is fixedly sleeved with one end of one of the connecting shafts 43. The rotation of the output shaft of the servo motor 45 drives the rotation of the connecting shaft 43 connected to it. The rotation of this connecting shaft 43 drives the rotation of the gear 44 connected to it. The rotation of this gear 44 makes it move along the surface of the toothed ring 42, thereby driving the rotation of another gear 44. At the same time, the rotation of the gear 44 drives the rotation of the connecting shaft 43, and further facilitates driving the two arc-shaped adjusting plates 4 to move relatively along the inner wall of the groove 41 through the connecting shaft 43.

[0058] By setting up a telescopic stretching mechanism, the adjustment of the aperture size of the inner slot opening in the electroplating tank body 2 is realized, avoiding the mixing of different electroplating solutions, and at the same time adapting to the flushing of electroplating solutions for semiconductor wafers of different sizes. The rotation of the output shaft of the servo motor 45 drives the rotation of the connecting shaft 43 connected thereto. The rotation of this connecting shaft 43 drives the rotation of the gear 44 connected thereto. The rotation of this gear 44 causes it to move along the surface of the toothed ring 42, thereby driving the rotation of another gear 44. At the same time, the rotation of this gear 44 drives the rotation of the connecting shaft 43, and further facilitates driving the two arc-shaped adjusting plates 4 to perform relative movement along the inner wall of the groove 41 through the connecting shaft 43.

[0059] Among them, as Figures 10 - 14 can be seen, in order to support and clamp semiconductor wafers of different sizes, and thus facilitate the flushing of electroplating solutions thereon, the positioning and adjusting mechanism includes a clamping table 5 installed on the inner bottom wall of the electroplating tank body 2 through bearings. At the same time, a positioning disk 51 is provided on the upper part of the clamping table 5 to realize the clamping and supporting actions for semiconductor wafers of different sizes.

[0060] In order to facilitate the telescoping and rotation of the positioning disk 51, the positioning and adjusting mechanism further includes a telescopic hydraulic cylinder 52 fixedly installed inside the clamping table 5. One end of the piston rod of the telescopic hydraulic cylinder 52 extends out of the clamping table 5 and is fixedly connected to the lower surface of the positioning disk 51. The telescoping of the piston rod of the telescopic hydraulic cylinder 52 drives the positioning disk 51 to move up and down, so as to drive the semiconductor wafer to be at different heights. A rotating motor 53 is fixedly installed on the inner wall of the frame 1. One end of the output shaft of the rotating motor 53 extends into the electroplating tank body 2 and is fixedly sleeved with the lower surface of the clamping table 5. At the same time, the bottom of the clamping table 5 is installed on the inner bottom wall of the electroplating tank body 2 through bearings. The rotation of the output shaft of the rotating motor 53 drives the rotation of the clamping table 5. The rotation of the clamping table 5 drives the rotation of the positioning disk 51, thereby driving the semiconductor wafer to be in a rotating state.

[0061] To facilitate the positioning disk 51 to adapt to semiconductor wafers of different sizes, a servo motor 511 is fixedly installed inside the positioning disk 51. One end of the output shaft of the servo motor 511 is fixedly sleeved with a driving gear 512. At the same time, a driven gear 513 is installed inside the positioning disk 51 through a bearing. The surface of the driving gear 512 meshes with the surface of the driven gear 513. Arc-shaped grooves 514 are formed through the surface of the driven gear 513 in an annular array distribution. And a fixed disk 515 is fixedly installed on the lower surface of the driven gear 513. Limiting grooves 516 are formed through the upper surface of the fixed disk 515 in an annular array distribution. The inner wall of the limiting groove 516 is slidably clamped with an L-shaped sliding rod 517. The upper surface of the L-shaped sliding rod 517 is fixedly connected with a sliding column 518. The surface of the sliding column 518 is slidably connected with the inner wall of the arc-shaped groove 514. By rotating the output shaft of the servo motor 511 to drive the driving gear 512 to rotate, the rotation of the driving gear 512 drives the driven gear 513 to rotate through meshing with the driven gear 513. The rotation of the driven gear 513 drives the sliding column 518 to move in the arc-shaped groove 514, and as the sliding column 518 moves, it drives the L-shaped sliding rod 517 to move along the inner wall of the limiting groove 516.

[0062] To support and clamp the semiconductor wafer, supporting columns 519 are arranged on the upper surface of the positioning disk 51 in an annular array distribution, and a clamping column 520 is fixedly installed at the upper end of the L-shaped sliding rod 517.

[0063] By setting the positioning and adjusting mechanism, the clamping and supporting of semiconductor wafers of different sizes can be realized. The rotation of the output shaft of the servo motor 511 drives the driving gear 512 to rotate. The rotation of the driving gear 512 drives the driven gear 513 to rotate through meshing with the driven gear 513. The rotation of the driven gear 513 drives the sliding column 518 to move in the arc-shaped groove 514, and as the sliding column 518 moves, it drives the L-shaped sliding rod 517 to move along the inner wall of the limiting groove 516. The movement of the L-shaped sliding rod 517 drives the clamping column 520 to move, thereby facilitating the clamping column 520 to adapt to semiconductor wafers of different radii, so as to achieve the positioning and clamping effect.

[0064] Working principle: During use, the manipulator transports the semiconductor wafer above the electroplating tank body 2, selects a suitable electroplating height and drainage cavity in the electroplating tank body 2 according to the radius of the transported semiconductor wafer, and starts the hydraulic cylinder. The telescopic movement of the piston rod of the hydraulic cylinder drives the positioning disc 51 to move to a suitable height. Then, the servo motor 511 is started, and the rotation of the output shaft of the servo motor 511 drives the driving gear 512 to rotate. The rotation of the driving gear 512 drives the driven gear 513 to rotate through meshing with the driven gear 513. The rotation of the driven gear 513 drives the sliding column 518 to move in the arc-shaped groove 514, and drives the L-shaped sliding rod 517 to move along the inner wall of the limiting groove 516 as the sliding column 518 moves. At the same time, the movement of the L-shaped sliding rod 517 drives the clamping column 520 to move until the clamping column 520 moves to a suitable position. Then, the manipulator places the semiconductor wafer on the positioning disc 51, and the semiconductor wafer is clamped and supported by the supporting column 519 and the clamping column 520;

[0065] After the clamping is completed, the notch diameter in the electroplating tank body 2 below the wafer is reduced as needed. The servo motor 45 is started, and the rotation of the output shaft of the servo motor 45 drives the connecting shaft 43 connected to it to rotate. The rotation of the connecting shaft 43 drives the gear 44 connected to it to rotate. The rotation of the gear 44 causes it to move along the surface of the toothed ring 42, thereby driving another gear 44 to rotate. At the same time, the rotation of the gear 44 drives the connecting shaft 43 to rotate, and then it is convenient to drive the two arc-shaped adjusting plates 4 to move relative to each other along the inner wall of the groove 41 through the connecting shaft 43;

[0066] After adjusting the diameter size, the swing arm drives the liquid outlet of the electroplating solution to move above the electroplating tank body 2, and lowers the liquid outlet to align it with the semiconductor wafer. At the same time, the rotation motor 53 is started and the liquid outlet is opened. The rotation motor 53 selects a suitable rotation frequency according to the height of the semiconductor wafer. The rotation of the output shaft of the rotation motor 53 drives the clamping table 5 to rotate, and the rotation of the clamping table 5 drives the positioning disc 51 to rotate, so that the electroplating solution enters the cavity of the electroplating tank body 2 under the centrifugal force when flushing the semiconductor wafer, and prevents the electroplating solutions in different cavities from mixing, reducing subsequent work;

[0067] The electroplating solution accumulated in the cavity flows into the filter collecting tank 7 along the liquid outlet pipe 6, and is discharged through the drain pipe 8 after being filtered by the filter screen in the filter collecting tank 7;

[0068] When not in use, the rotation of the output shaft of the drive motor 304 drives the rotation of the bidirectional lead screw 305. The rotation of the bidirectional lead screw 305 drives the two sliders 306 to approach each other on the bidirectional lead screw 305 along the surface of the slide rail 302 respectively. The movement of the slider 306 drives the movement of the L-shaped rod 307. The movement of the L-shaped rod 307 drives the movement of the closing plate 3 along the inner wall of the chute 309 through the connecting block 308. At the same time, the movement of the closing plate 3 drives the movement of the other slider 306 on the corresponding slide rail 302 through another L-shaped rod 307. As the two closing plates 3 gather, the upper notch of the electroplating tank body 2 is sealed.

[0069] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered within the protection scope of the present invention.

Claims

1. A wafer single - piece electroplating machine with adjustable notch, comprising a frame (1) and a multi - layer electroplating tank body (2) arranged on the frame (1), characterized in that: It further includes a protection mechanism arranged on both sides of the frame (1), a telescopic stretching mechanism arranged at the notch of the electroplating tank body (2), and a positioning and adjusting mechanism arranged on the inner bottom wall of the electroplating tank body (2); Protection mechanism, the protection mechanism includes semi-circular closing plates (3) symmetrically arranged on the upper surface of the electroplating tank body (2). The two closing plates (3) perform closing or opening actions on the feeding notch of the electroplating tank body (2) when approaching or moving away from each other, so as to ensure the cleanliness inside the electroplating tank body (2); Telescopic stretching mechanism, the telescopic stretching mechanism includes arc-shaped adjusting plates (4) symmetrically arranged at the inner notch of the electroplating tank body (2). Both of the two arc-shaped adjusting plates (4) are located inside the notch of the electroplating tank body (2). With the relative movement of the two arc-shaped adjusting plates (4), the adjustment action of the aperture size of the inner notch of the electroplating tank body (2) is realized; Positioning and adjusting mechanism, the positioning and adjusting mechanism includes a clamping table (5) installed on the inner bottom wall of the electroplating tank body (2) through a bearing. At the same time, a positioning disk (51) is arranged on the upper part of the clamping table (5) to realize the clamping and supporting actions for semiconductor wafers of different sizes.

2. The wafer single - piece electroplating machine with adjustable notch according to claim 1, characterized in that: The protection mechanism further includes brackets (301) on both sides of the frame (1). Slide rails (302) are fixedly installed on the upper surfaces of the two brackets (301). And the two brackets (301) are connected through a mounting groove body (303). The mounting groove body (303) is located on the upper surface of the frame (1), and a driving motor (304) is fixedly installed on the inner wall of the mounting groove body (303). One end of the output shaft of the driving motor (304) extends to the outer surface of the mounting groove body (303) and is fixedly sleeved with a bidirectional lead screw (305). The two ends of the bidirectional lead screw (305) are respectively installed on the brackets (301) through bearings. Both ends of the surface of the bidirectional lead screw (305) are threadedly sleeved with sliders (306), and the lower surface of the slider (306) is slidably clamped with the surface of the slide rail (302).

3. The wafer single - piece electroplating machine with adjustable notch according to claim 2, characterized in that: The surface of the other slide rail (302) is slidably clamped with the lower surfaces of the other two sliders (306). An L-shaped rod (307) is fixedly connected to the upper surface of the slider (306). One end of the L-shaped rod (307) is fixedly connected to a connecting block (308). One side of the connecting block (308) is fixedly connected to one side of the closing plate (3). At the same time, sliding grooves (309) are respectively opened on both sides of the outer surface of the electroplating tank body (2). The surface of the closing plate (3) is slidably clamped with the inner wall of the sliding groove (309).

4. The wafer single - piece electroplating machine with adjustable notch according to claim 1, characterized in that: Sealing strips (310) are respectively fixedly connected to the other sides of the two closing plates (3).

5. The wafer single - piece electroplating machine with adjustable notch according to claim 1, characterized in that: The telescopic stretching mechanism further includes a groove (41) opened at the inner slot opening of the electroplating tank body (2). A toothed ring (42) is fixedly installed on the inner wall of the groove (41). At the same time, the surface of the arc-shaped adjusting plate (4) is slidably clamped with the inner wall of the groove (41). Both ends of the two arc-shaped adjusting plates (4) are hinged through a connecting shaft (43), and a gear (44) is fixedly sleeved on the middle end of both connecting shafts (43). The surface of the gear (44) meshes with the surface of the toothed ring (42).

6. The wafer single - piece electroplating machine with adjustable notch according to claim 5, characterized in that: A servo motor (45) is fixedly installed inside the electroplating tank body (2). The output shaft of the servo motor (45) is fixedly sleeved with one end of one of the connecting shafts (43).

7. The wafer single - piece electroplating machine with adjustable notch according to claim 1, characterized in that: The positioning and adjusting mechanism further includes a telescopic hydraulic cylinder (52) fixedly installed inside the clamping table (5). One end of the piston rod of the telescopic hydraulic cylinder (52) extends out of the clamping table (5) and is fixedly connected to the lower surface of the positioning disk (51). A rotating motor (53) is fixedly installed on the inner wall of the frame (1). One end of the output shaft of the rotating motor (53) extends into the electroplating tank body (2) and is fixedly sleeved with the lower surface of the clamping table (5). At the same time, the bottom of the clamping table (5) is installed on the inner bottom wall of the electroplating tank body (2) through a bearing.

8. The wafer single - piece electroplating machine with adjustable notch according to claim 1, characterized in that: A servo motor (511) is fixedly installed inside the positioning disk (51). One end of the output shaft of the servo motor (511) is fixedly sleeved with a driving gear (512). At the same time, a driven gear (513) is installed inside the positioning disk (51) through a bearing. The surface of the driving gear (512) meshes with the surface of the driven gear (513). Arc-shaped grooves (514) are distributed in a circular array on the surface of the driven gear (513). A fixing disk (515) is fixedly installed on the lower surface of the driven gear (513). Limiting grooves (516) are distributed in a circular array on the upper surface of the fixing disk (515). An L-shaped sliding rod (517) is slidably clamped on the inner wall of the limiting groove (516). A sliding column (518) is fixedly connected to the upper surface of the L-shaped sliding rod (517). The surface of the sliding column (518) is slidably connected to the inner wall of the arc-shaped groove (514).

9. The wafer single - piece electroplating machine with adjustable notch according to claim 8, characterized in that: Support columns (519) are distributed in a circular array on the upper surface of the positioning disk (51). A clamping column (520) is fixedly installed at the upper end of the L-shaped sliding rod (517).

10. The wafer single - piece electroplating machine with adjustable notch according to claim 1, characterized in that: Liquid outlet pipes (6) are fixedly connected in sequence according to the distribution of the internal cavities on the lower surface of the electroplating tank body (2). One end of the liquid outlet pipe (6) is fixedly connected to a filtering liquid collection tank (7) inside the frame (1). A drain pipe (8) is fixedly connected to one side of the filtering liquid collection tank (7). One end of the drain pipe (8) extends out of the frame (1).

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