An optical device coupling method

Abstract

The application discloses a kind of optical device coupling methods, belong to chip mounting technical field, comprising: rotating mounting piece along third direction, so that mounting piece and the center line of each optoelectronic component on mounting surface are parallel;Rotating mounting piece along first direction, so that mounting piece is parallel with mounting surface in second direction;If the distance between second side and mounting surface is greater than the distance between first side and mounting surface, then move mounting piece along third direction, so that the first side of mounting piece is connected with mounting surface, and the included angle between mounting piece and mounting surface is obtained;Rotating mounting piece with second direction as axis, the fitting of mounting piece and mounting surface is completed;Otherwise, rotate mounting piece in reverse with second direction as axis, until the distance between second side and mounting surface is greater than the distance between first side and mounting surface.The optical device coupling method of the application avoids the problem that the conventional identification method cannot obtain the alignment condition of mounting piece and mounting surface by adjusting in three directions, and improves the mounting precision of optical device.

Description

Technical Field

[0001] This invention belongs to the field of chip mounting technology, and specifically relates to an optical device coupling method. Background Technology

[0002] COB (Chip-on-Board) packaging is a packaging technology that directly mounts chips onto a substrate. Unlike traditional chip packaging methods, COB packaging does not use a casing or leads; instead, gold wires are soldered onto metallized pads on the substrate. COB packaging features small chip size, low cost, high reliability, and good heat dissipation, while also providing higher mounting density.

[0003] In the COB (Chip-on-Board) assembly process, higher precision is required for chip placement. During the coupling of optical devices, two large planar structures are typically bonded together. For example, when coupling an arrayed waveguide grating (AWR) to a photodiode, the lower surface of the AWR needs to be bonded to the upper surface of the PCB. Therefore, the two bonding surfaces must be leveled. However, due to the presence of other components on the PCB, the positional relationship between the AWR and the bonding surfaces cannot be accurately determined during bonding. Conventional camera methods struggle to monitor the bonding, leading to positional and angular deviations in the bonding between the AWR and the PCB. This results in poor COB package quality and impacts communication quality. Summary of the Invention

[0004] In response to one or more of the above-mentioned defects or improvement needs in the prior art, the present invention provides an optical device coupling method to solve the problem that the positional and angular deviations in the bonding of existing arrayed waveguide gratings to PCBs cause low quality of COB packaged products and affect communication quality.

[0005] To achieve the above objectives, the present invention provides an optical device coupling method, which includes the following steps:

[0006] S1. Obtain the projection of the mounting component onto the plane containing the first and second directions, and obtain the outer contour of the projection along the first direction; rotate the mounting component about the third direction as an axis so that the outer contour of the projection of the mounting component along the first direction is parallel to the line connecting the centers of each optoelectronic component on the mounting surface.

[0007] S2. Rotate the mounting component about the first direction as an axis so that the mounting component is parallel to the mounting surface in the second direction;

[0008] S3. Move the mounting component along a third direction so that the mounting component is in contact with the mounting surface.

[0009] As a further improvement to the present invention, it also includes,

[0010] S4. In response to the fact that the second side of the mounting component is not in contact with the mounting surface, rotate the mounting component by a first angle about the second direction as the axis.

[0011] S5: Repeat steps S3 and S4 until the second side of the mounting part is in contact with the mounting surface.

[0012] As a further improvement of the present invention, S4 specifically includes:

[0013] Identify the distance h between the second side of the mount and the mounting surface;

[0014] If h is greater than the first threshold, rotate the mounting component by a first angle with the second direction as the axis.

[0015] If h is not greater than the first threshold, the mounting component is rotated by a second angle with the second direction as the axis, wherein the first angle is greater than the second angle.

[0016] As a further improvement of the present invention, in step S4, the second side of the mounting component is visually identified as being in contact with the mounting surface, and / or the distance between the second side of the mounting component and the mounting surface is identified.

[0017] As a further improvement of the present invention, if h is less than the second threshold and / or the angle between the mounting component and the mounting surface is less than the fourth threshold, it is determined that the mounting component is bonded to the mounting surface.

[0018] This invention also provides another optical device coupling method, which includes the following steps:

[0019] S1. Obtain the projection of the mounting component onto the plane containing the first and second directions, and obtain the outer contour of the projection along the first direction; rotate the mounting component about the third direction as an axis so that the outer contour of the projection of the mounting component along the first direction is parallel to the line connecting the centers of each optoelectronic component on the mounting surface.

[0020] S2. Rotate the mounting component about the first direction as an axis so that the mounting component is parallel to the mounting surface in the second direction;

[0021] S3. Move the mounting component along a third direction until it contacts the mounting surface;

[0022] S4. Obtain the angle between the mounting part and the mounting surface as the third angle, and rotate the mounting part by the third angle along the B direction with the second direction as the axis.

[0023] S5. Move the mounting component along a third direction so that the mounting component is in contact with the mounting surface.

[0024] As a further improvement of the present invention, the following is included before step S4:

[0025] S301, Identify the distance h from the second side edge of the mounting component to the mounting surface;

[0026] S302. If the distance h from the second side of the mounting part to the mounting surface is 0, move the mounting part in the opposite direction of the third direction, and rotate the mounting part by a fourth angle along the A direction with the second direction as the axis.

[0027] S303. Move the mounting component along a third direction so that the mounting component contacts the mounting surface.

[0028] As a further improvement of the present invention, it also includes S304: repeating S301 to S303 until it is detected in S301 that the distance from the second side of the mounting part to the mounting surface is greater than 0.

[0029] As a further improvement of the present invention, the fourth angle is less than the fifth threshold.

[0030] As a further improvement of the present invention, whether the distance between the mounting component and the mounting surface is zero is identified by a pressure sensor or a visual recognition mechanism; and / or the distance from the second side of the mounting component to the mounting surface is identified by a visual recognition mechanism.

[0031] As a further improvement to the present invention, step S4 is further included,

[0032] Move the mounting component in the opposite direction of the third direction, and rotate the mounting component by a fifth angle along direction A with the second direction as the axis;

[0033] Move the mounting component along a third direction until it comes into contact with the mounting surface.

[0034] This invention also provides another optical device coupling method, which includes the following steps:

[0035] S1. Obtain the projection of the mounting component onto the plane containing the first and second directions, and obtain the outer contour of the projection along the first direction; rotate the mounting component about the third direction as an axis so that the outer contour of the projection of the mounting component along the first direction is parallel to the line connecting the centers of each optoelectronic component on the mounting surface.

[0036] S2. Rotate the mounting component about the first direction as an axis so that the mounting component is parallel to the mounting surface in the second direction;

[0037] S3. Move the mounting component along a third direction until it contacts the mounting surface;

[0038] S4. Rotate the mounting component around the third direction as the axis to complete the bonding of the mounting component with the mounting surface.

[0039] As a further improvement of the present invention, the mounting component is an arrayed waveguide grating, the mounting surface is a PCB board, the optoelectronic component is a photodiode, and the center of the optoelectronic component is the center of the photosensitive surface of the photodiode.

[0040] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0041] In summary, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art include:

[0042] (1) The optical device coupling method of the present invention acquires the projection formed on the mounting surface of the mounting component, and rotates the mounting component around a third direction as an axis, so that the outer contour of the projection in the first direction is parallel or coincident with the line connecting the centers of each optoelectronic component on the mounting surface; then, by rotating the mounting component around the first direction as an axis, the mounting component is made parallel to the mounting surface in the second direction; finally, by moving the mounting component along the third direction and acquiring the angle difference between the mounting component and the mounting surface, the mounting component is adjusted, and finally, the mounting component is mounted correspondingly to the mounting surface. This optical device coupling method, by adjusting in three directions respectively, avoids the problem that conventional identification methods cannot obtain the alignment of the mounting component and the mounting surface, and greatly improves the mounting accuracy.

[0043] (2) The optical device coupling method of the present invention obtains the distance h from the side of the mounting component near the visual inspection device along the first direction to the mounting surface in the third direction, where the side length L of the mounting component along the first direction is a known value. This allows for the determination of the angle between the mounting component and the mounting surface, and the adjustment of this angle. Since this coupling method can directly obtain the distance h from the side of the mounting component near the visual inspection device along the first direction to the mounting surface in the third direction, it avoids interference from components on the mounting surface and solves the problem of difficulty in photographing the bonding surface between the mounting component and the mounting surface. It also allows for accurate calculation of the deviation between the mounting component and the mounting surface, facilitating the adjustment and alignment of the mounting component.

[0044] (3) The optical device coupling method of the present invention adjusts the angle between the mounting component and the mounting surface by adopting a step-by-step iterative method, so as to avoid the problem that the visual inspection device cannot identify whether the mounting component is adjusted in place or over-adjusted after the angle θ between the mounting component and the mounting surface is adjusted too much, thereby reducing the adjustment error of the mounting component and improving the adjustment accuracy of the mounting component. Attached Figure Description

[0045] Figure 1 This is a schematic diagram of the adjustment device structure of the optical device coupling method in an embodiment of the present invention;

[0046] Figure 2 This is a schematic diagram of the structure of the optoelectronic component mounted on the mounting surface in an embodiment of the present invention;

[0047] Figure 3 This is a schematic diagram of the overall structure of the six-axis adjustment bracket mounting component in an embodiment of the present invention;

[0048] Figure 4 This is a schematic diagram of the mounting component and mounting surface in an embodiment of the present invention.

[0049] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically:

[0050] 1. Mounting component; 2. Mounting surface; 3. Six-axis adjustment bracket; 4. First identification component; 5. Second identification component; 6. Optoelectronic component; 7. First side; 8. Second side. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0052] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0054] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0055] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0056] Please see Figures 1-4 In a preferred embodiment of the present invention, the optical device coupling method is mainly used to mount the mounting component 1 onto the mounting surface 2. The position and angle of the mounting component 1 are mainly adjusted by a six-axis adjustment bracket 3. The position and angle of the mounting component 1 are mainly obtained by a first identification component 4 and a second identification component 5. The first identification component 4 and the second identification component 5 are, for example, visual inspection devices.

[0057] The first identification component 4 is located on the side opposite to the mounting surface 2 relative to the mounting part 1. That is, the first identification component 4, the mounting part 1 and the mounting surface 2 are arranged vertically in sequence. The first identification component 4 is used to capture the outline of the mounting part 1 from the vertical direction (third direction) and can obtain the projection of the mounting part 1 onto the mounting surface 2 in the first direction and the second direction.

[0058] The second identification component 5 is disposed on the side of the mounting component 1 facing the first direction. The second identification component 5 can obtain the angle of inclination of the mounting component 1 with the plane formed by the first and second directions (or the angle between the edge of the mounting component 1 near the second identification component 5 and the mounting surface) from the side of the mounting component 1 and the mounting surface 2. By rotating the corresponding angle around the first direction as the axis, the mounting component 1 and the mounting surface 2 are made parallel along the projection of the second and third directions on the plane (or the edge of the mounting component 1 near the second identification component 5 is made parallel to the mounting surface). Since the mounting surface 2 has electronic components disposed on the side away from the second identification component 5 along the first direction, it is impossible to obtain the bonding status of the first side 7 of the mounting component 1 away from the second identification component 5 with the mounting surface 2 by setting the second identification component 5. Therefore, this application can only achieve the bonding of the mounting component 1 and the mounting surface 2 by setting the second identification component 5 on the side of the mounting component 1 facing the first direction and adjusting the mounting component 1 by the angle between the mounting component 1 and the mounting surface 2.

[0059] Meanwhile, since other components are mounted on the mounting surface 2 in the second direction, and the photoelectric components 6 mounted on the mounting surface 2 are spaced apart along the first direction, the angle between the mounting component 1 and the mounting surface 2 cannot be obtained directly from the second direction (due to obstruction by the photoelectric components 6). Therefore, the second identification component 5 needs to obtain the difference in distance between the two sides (first side 7 and second side 8) of the mounting component 1 along the second direction and the mounting surface 2 in the third direction, thereby obtaining the included angle between the mounting component 1 and the mounting surface 2. By rotating the corresponding angle around the second direction as the axis, the mounting component 1 can be flush with the mounting surface 2 along the first direction. By adjusting the angle of the mounting component 1 along the three directions, the mounting component 1 can be attached to the mounting surface 2, thus achieving accurate mounting of the mounting component 1 on the mounting surface 2.

[0060] Furthermore, the aforementioned six-axis adjustment frame 3 is also equipped with a pressure sensor, which can detect pressure when the mounting part 1 comes into contact with the mounting surface 2, thereby stopping the movement of the six-axis adjustment frame 3 and preventing the mounting part 1 from making hard contact with the mounting surface 2, which could lead to damage to the mounting part 1 and / or the mounting surface 2.

[0061] Furthermore, the mounting surface 2 is a PCB board, and the optoelectronic component 6 is a photodiode, with the center of the optoelectronic component 6 being the center of the photosensitive surface of the photodiode. There are multiple optoelectronic components 6, typically four photodiodes, which are arranged at intervals along the first direction.

[0062] Furthermore, the aforementioned mounting component 1 is a fiber optic array assembly. The fiber optic array assembly has a first mounting surface and a second mounting surface formed along a second direction on the side facing the PCB board. The first mounting surface is bonded to the surface of the PCB board, and a gap is left between the second mounting surface and the PCB board. A photoelectric component 6 is mounted on the PCB board at the gap, and the photoelectric component 6 is coupled to the mounting component. Preferably, the first mounting surface in this application is rectangular, and the second mounting surface is parallel to the first mounting surface.

[0063] Further, in this application, the first direction is the direction from the mounting component 1 toward the second identification component 5, the second direction is the direction from the mounting component 1 toward the optoelectronic component 6, and the third direction is the direction from the first identification component 4 toward the mounting surface 2. Preferably, the first, second, and third directions in this application are mutually perpendicular. Preferably, the origin of the coordinate axes of the three directions in this application is the point where the six-axis adjustment bracket 3 connects to the mounting component 1.

[0064] Example 1:

[0065] The optical device coupling method in this application specifically includes the following steps:

[0066] S1. Obtain the projection of the mounting part 1 on the plane containing the first direction and the second direction, and obtain the outer contour of the projection along the first direction; rotate the mounting part 1 about the third direction as the axis so that the outer contour of the projection of the mounting part 1 along the first direction is parallel to the line connecting the centers of each optoelectronic component 6 on the mounting surface 2.

[0067] S2. Rotate the mounting component 1 about the first direction as the axis, so that the mounting component 1 is parallel to the mounting surface 2 in the second direction;

[0068] S3. Move the mounting part 1 along the third direction so that the mounting part 1 is in contact with the mounting surface 2;

[0069] Further preferably, before step S1 of this application, an initialization adjustment is also included: the mounting component 1 is clamped using a clamping structure, and the mounting component 1 is moved above the mounting surface 2 so that the projection of the mounting component 1 falls on the mounting surface 2.

[0070] Preferably, step S1 in this application specifically includes:

[0071] Obtain the projection of the mounting part 1 on the plane containing the first direction and the second direction, obtain the outer contour of the projection along the first direction, and rotate the mounting part 1 around the third direction as the axis so that the outer contour of the projection along the first direction is parallel to the line connecting the centers of each optoelectronic component 6 on the mounting surface 2.

[0072] Obtain the projection of the mounting part 1 onto the plane containing the second direction and the third direction, and rotate the mounting part 1 about the first direction as the axis so that the mounting part 1 is parallel to the mounting surface 2 in the second direction.

[0073] It is worth noting that the mounting component 1 in this application is a sheet-like structure with a regular shape, similar to or comparable to the arrayed waveguide grating, such as a fiber optic array assembly. Its outer contour along the second direction is linearly arranged, and its outer contour along the first direction can directly coincide with the line connecting the centerlines of each optoelectronic component 6 on the mounting surface 2. In this application, the mounting component 1 being parallel to the mounting surface 2 in the second direction means that the first side 7 and the second side 8 of the mounting component 1 are parallel to the second direction.

[0074] Optionally, in step S2, the mounting component 1 is observed by the second identification component 5, and the mounting component 1 is identified as being parallel to the mounting surface 2 in the second direction by identifying whether the second edge 8 of the mounting component 1 is parallel to the mounting surface.

[0075] Furthermore, as a preferred embodiment of the present invention, this application further includes step S4: in response to the second side of the mounting component 1 not being adhered to the mounting surface 2, rotating the mounting component 1 by a first angle about the second direction as an axis; S5: repeating steps S3 and S4 until the second side of the mounting component 1 is adhered to the mounting surface 2. After the first side 7 or the second side 8 of the mounting component 1 is in contact with the mounting surface 2, by rotating the mounting component 1 by a first angle about the second direction as an axis, one end of the first side 7 and the second side 8 of the mounting component 1 is raised, while the other end is lowered, so that the entire mounting component 1 is floating relative to the mounting surface 2. Therefore, it is necessary to move the mounting component 1 again along the third direction so that the first side 7 or the second side 8 is in contact with the mounting surface 2, and then rotate the mounting component 1 again. Through continuous iterative adjustments, the adhesion between the mounting component 1 and the mounting surface 2 is finally completed.

[0076] Furthermore, as an optional embodiment of the present invention, whether the first side 7 is in contact with the mounting surface 2 is identified by the second identification component 5, which includes:

[0077] The mounting component 1 is moved along a third direction, and the distance h between the second side 8 and the mounting surface 2 along the third direction is identified. During the movement of the mounting component 1 along the third direction, when h no longer changes, the first side 7 is in contact with the mounting surface 2. When the first side 7 is close to the mounting surface 2, the second identification component 5 has difficulty identifying whether the first side 7 is completely in contact with the mounting surface 2. Therefore, the contact status between the first side 7 and the mounting surface 2 can be indirectly determined by the change in the distance h between the second side 8 and the mounting surface 2. When h no longer changes, it indicates that the first side 7 is completely in contact with the mounting surface 2.

[0078] Of course, this application can also directly identify whether the second side 8 of the mounting part 1 is in contact with the mounting surface 2 through the second identification component 5.

[0079] Furthermore, step S4 above also includes obtaining the distance h between the second side 8 and the mounting surface 2 in the third direction;

[0080] If h is greater than the first threshold, rotate the mounting part 1 by a first angle with the second direction as the axis;

[0081] If h is not greater than the first threshold, rotate the mounting part 1 by a second angle with the second direction as the axis, wherein the first angle is greater than the second angle.

[0082] Specifically, the first threshold in this application can be adjusted according to the actual coupling accuracy of the optical device, and the first threshold is preferably 50 μm. When iteratively adjusting the angle θ between the mount 1 and the mount surface 2, to avoid over-adjustment, the angle adjustment is divided into two stages. When the angle θ between the mount 1 and the mount surface 2 is large, the distance h between the corresponding second side 8 and the mount surface 2 in the third direction is greater than 50 μm, and a slightly larger first angle can be used for rotation adjustment. When the angle θ between the mount 1 and the mount surface 2 is small, the distance h between the corresponding second side 8 and the mount surface 2 in the third direction is less than or equal to 50 μm. In this case, an excessively large adjustment angle will cause the first side 7 to warp, so a smaller second angle is needed for rotation adjustment to gradually bring the angle between the mount 1 and the mount surface 2 closer to the set adjustment accuracy. Optionally, as the iterative adjustment proceeds, the value of h further decreases relative to 50 μm. Corresponding to a smaller value of h, a smaller (less than the second angle) rotation angle can be used for rotation adjustment.

[0083] Furthermore, as an optional embodiment of the present invention, when the distance h between the second side 8 of the mounting component 1 and the mounting surface 2 is less than a second threshold and / or the angle between the mounting component 1 and the mounting surface 2 is less than a fourth threshold, it is determined that the mounting component 1 is bonded to the mounting surface 2. Here, the second and fourth thresholds can be adjusted and selected according to the actual mounting accuracy.

[0084] Optionally, in this application, when h is not greater than 10 μm or θ is less than or equal to 0.1°, the mounting part 1 is mounted onto the mounting surface 2. In actual adjustment, it is difficult to adjust the mounting part 1 and the mounting surface 2 to be completely flush. Therefore, a certain error is required in the mounting between the mounting part 1 and the mounting surface 2. When the distance h between the second side 8 and the mounting surface 2 is not greater than 10 μm or the calculated θ is not greater than 0.1°, the mounting part 1 and the mounting surface 2 are assumed to meet the mounting accuracy requirements. Preferably, when h is not greater than 8 μm, the mounting accuracy between the mounting part 1 and the mounting surface 2 is higher.

[0085] Furthermore, as an optional embodiment of the present invention, when the optoelectronic component 6 in this application is a photodiode, the distance between the centers of the photosensitive surfaces of the two outermost optoelectronic components 6 arranged side by side along the first direction is set to A, and the diameter of the photosensitive surface of the optoelectronic component 6 is set to d. After the i-th iteration, the distance h between the two side edges 8 and the mounting surface 2 in the third direction is... i Less than or equal to At the same time, it is assumed that the mounting part 1 and the mounting surface 2 meet the mounting accuracy requirements, and the mounting part 1 can be mounted onto the mounting surface.

[0086] Furthermore, as a preferred embodiment of the present invention, when the mounting component 1 in this application is an arrayed waveguide grating and the optoelectronic component 6 is a photodiode, this application further includes step S5: rotating the arrayed waveguide grating around a third direction as the axis, so that the light from each photodiode is coupled into the arrayed waveguide grating. After the arrayed waveguide grating is mounted to the PCB board, it is necessary to couple the four photodiodes to the arrayed waveguide grating in the later stage. Therefore, it is also necessary to adjust the angle of the arrayed waveguide grating on the plane so that each photodiode can be coupled to the arrayed waveguide grating.

[0087] Example 2:

[0088] This application also discloses another optical device coupling method, which includes the following steps:

[0089] S1. Obtain the projection of the mounting component 1 onto the plane containing the first and second directions, and obtain the outer contour of the projection along the first direction; rotate the mounting component 1 about the third direction as the axis so that the outer contour of the projection of the mounting component 1 along the first direction is parallel to the line connecting the centers of each optoelectronic component 6 on the mounting surface.

[0090] S2. Rotate the mounting component 1 about the first direction as the axis, so that the mounting component 1 is parallel to the mounting surface 2 in the second direction;

[0091] S3. Move the mounting part 1 along the third direction so that the mounting part 1 is in contact with the mounting surface 2;

[0092] S4. Obtain the angle between the mounting part 1 and the mounting surface 2 as the third angle, and rotate the mounting part 1 along the B direction with the second direction as the axis to make the third angle.

[0093] S5. Move the mounting part 1 along a third direction so that the mounting part 1 is in contact with the mounting surface 2.

[0094] When bonding the mounting part 1 to the mounting surface 2, the angle between the mounting part 1 and the mounting surface 2 can be adjusted in one step by obtaining the included angle between the mounting part 1 and the mounting surface 2.

[0095] Furthermore, as a preferred embodiment of the present invention, the method for obtaining the included angle between the mounting component 1 and the mounting surface 2 in step S4 of embodiment 2 of this application is as follows:

[0096] By observing the mounting component 1 through the second identification component 5, the second side 8 of the mounting component 1 along the first direction is obtained, the distance h between the second side 8 and the mounting surface 2 in the third direction is obtained, and the length L of the mounting component 1 along the first direction is obtained. The angle θ between the mounting component 1 and the mounting surface 2 is calculated as follows:

[0097] θ = arcsin(h / L) (Formula 1)

[0098] After adjustment via step S2, the mounting component 1 and mounting surface 2 only have an angle of rotation along the second direction as their axis. This angle is the angle at which the mounting component 1 needs to rotate along the second direction. Since mounting surface 2 contains numerous components, the tilt of the mounting component 1 needs to be determined from the side using the second identification component 5 to facilitate its rotation adjustment along the second direction. After obtaining the distance h between the second side 8 of the mounting component 1 and the mounting surface 2 in the third direction using the second identification component 5, the angle between the mounting component 1 and the mounting surface 2 can be directly obtained since the length of the mounting component 1 in the first direction is known.

[0099] Preferably, in this application, the mounting component 1 rotates along direction B with the second direction as the axis of rotation as follows: with the first side 7 as the axis of rotation, it rotates in a direction that drives the second side 8 to move closer to the mounting surface 2; in this application, the mounting component 1 rotates along direction A with the second direction as the axis of rotation as follows: with the first side 7 as the axis of rotation, it rotates in a direction that drives the second side 8 to move away from the mounting surface 2.

[0100] In step S4 of embodiment 2, it is necessary to obtain the included angle between the mounting component 1 and the mounting surface 2. However, after moving the mounting component 1 along a third direction in step S3 so that the mounting component 1 contacts the mounting surface 2, there are three possible situations: (1) the second side 8 of the mounting component 1 contacts the mounting surface first; (2) the first side 7 of the mounting component 1 contacts the mounting surface first; (3) the first side 7 and the second side 8 of the mounting component 1 contact the mounting surface simultaneously. In embodiment 2, since it is necessary to observe the angle of the mounting component 1 relative to the mounting surface through the second identification component 5, only the relative relationship between the second side 8 and the mounting surface can be observed. Specifically, there are two kinds of relative relationships between the second side 8 and the mounting surface observed by the second identification component 5: (A) the second side 8 contacts the mounting surface; (B) the second side 8 does not contact the mounting surface. This relationship (A) corresponds to the above situations (1) and (3), while relationship (B) corresponds to the above situation (2).

[0101] In a further embodiment, before step S4 or even step S3, when it is unknown what state the mounting component 1 will be in after step S3 moves it along a third direction to make it contact the mounting surface 2, the mounting component 1 is rotated by a large angle along direction A with the second direction as the axis. This ensures that the distance from the second side 8 to the mounting surface is greater than the distance from the first side 7 to the mounting surface, thereby ensuring that the mounting component 1 is in state (1) after step S3 moves it along a third direction to make it contact the mounting surface 2. Then step S4 is executed.

[0102] In yet another further embodiment, prior to step S4, it is not necessary to determine which of the above-mentioned situations the relationship between the mount and the mount surface belongs to, but rather to adjust it through a further step:

[0103] S301, Identify the distance h from the second side 8 of the mounting part 1 to the mounting surface 2;

[0104] S302. If the distance h from the second side 8 of the mounting part 1 to the mounting surface 2 is 0 (corresponding to the above situation (2)), move the mounting part 1 in the opposite direction of the third direction and rotate the mounting part 1 by a fourth angle along the A direction with the second direction as the axis.

[0105] S303. Move the mounting component 1 along a third direction so that the mounting component 1 is in contact with the mounting surface 2.

[0106] During the alignment process after obtaining the angle θ between the mounting component 1 and the mounting surface 2, the actual adjustment angle may be greater than the angle θ between the mounting component 1 and the mounting surface 2 due to adjustment accuracy issues. When the second side 8 contacts the mounting surface 2, the second identification component 5 cannot obtain the specific mounting status of the first side 7. Therefore, it is necessary to move the mounting component 1 in the opposite direction along the third direction, and then rotate the mounting component 1 by a fourth angle along the A direction with the second direction as the axis, so that the distance between the second side 8 and the mounting surface 2 is greater than or equal to the distance between the first side 7 and the mounting surface 2, ensuring that the second identification component 5 can obtain the distance h of the second side 8 relative to the mounting surface in step S4.

[0107] Further preferably, this application also includes S304: repeating S301 to S303 until it is detected in S301 that the distance from the second side 8 of the mount 1 to the mounting surface 2 is greater than 0. To avoid the mount 1 rotating too much along direction A, causing the mounting angle between the mount 1 and the mounting surface 2 to not meet the mounting accuracy requirements, the fourth angle in this application is less than the fifth threshold, which is less than or equal to the mounting accuracy difference between the mount 1 and the mounting surface 2. In this application, after rotating the mount 1 by the fourth angle along direction A, the first side 7 of the mount 1 may still be in a raised state, therefore iterative adjustments are needed until it is detected that the distance from the second side 8 of the mount 1 to the mounting surface 2 is greater than 0.

[0108] Optionally, this application may include the following steps prior to step S4:

[0109] S401. Move the mounting part 1 in the opposite direction of the third direction, and rotate the mounting part 1 by a fifth angle along the A direction with the second direction as the axis.

[0110] S402, Move the mounting part 1 along a third direction so that the mounting part 1 is in contact with the mounting surface 2.

[0111] As one optional form, when the distance from the second side 8 of the mounting component 1 to the mounting surface 2 is 0, a fifth angle can be rotated along the A direction with the second direction as the axis, so that the included angle between the mounting component 1 and the mounting surface 2 is less than the mounting accuracy difference. Then, by moving the mounting component 1 along the third direction, the mounting component 1 and the mounting surface 2 are properly bonded. The fifth angle is much larger than the fourth angle, thus ensuring that the distance h from the second side 8 of the mounting component to the mounting surface is greater than the distance from the first side 7 to the mounting surface in one go by rotating at a larger angle along the A direction with the second direction as the axis. Optionally, steps S401 and S402 occur after step 3 and before step S4, and in step S401, it is also checked whether the distance h from the second side 8 of the mounting component 1 to the mounting surface 2 is 0. If h = 0, the other operations in step S401 are performed. Optionally, steps S401 and S402 may occur before step S3 to ensure that after step S3 is performed, the second side 8 (instead of the first side 7) of the mounting part 1 contacts the mounting surface.

[0112] Example 3:

[0113] As an example Figure 1 In the diagram, the first recognition component 4 and the second recognition component 5 are cameras, and the angles θx, θy, and θz are the rotation angles of the mounting component 1 about the first, second, and third directions, respectively. The mounting component 1 is generally a rectangular plane, and the mounting component 2 is also generally a rectangular plane.

[0114] like Figure 1 As shown, the first identification component 4 observes the mounting component 1, and simultaneously makes an initial adjustment to the angle θz so that the straight line containing the edge of the mounting component 1 observed by the first identification component 4 is parallel to the straight line connecting the centers of each optoelectronic component 6 on the mounting surface 2. The adjusted angle is only the initial coupling angle, and further adjustments are needed during subsequent actual coupling. Understandably, the straight line containing the edge of the mounting component 1 observed by the first identification component 4 is the projection of the mounting component 1 onto the plane containing the first and second directions. Specifically, the edge of the mounting component 1 observed by the first identification component 4 is the edge of the mounting component 1 extending along the second direction, or the edge whose extension direction is substantially consistent with the arrangement direction of the multiple optoelectronic components 6.

[0115] The acute angle θx between the bottom edge of the mounting part 1 and the edge of the mounting surface 2 can be observed through the second identification component 5. Rotating the six-axis adjustment bracket 3 makes the acute angle θx zero, meaning that the bottom edge of the mounting part 1 and the edge of the mounting surface 2 are parallel as observed by the second identification component 5. Here, the bottom edge of the mounting part 1 and the edge of the mounting surface 2 extend along a second direction. It can be understood that the bottom edge of the mounting part 1 is, for example, the second side 8, such as... Figure 4 The first side 7 is obscured by the second side 8 and is therefore difficult to observe by the second identification component 5.

[0116] The negative direction of the second direction is taken as the view direction, and the view in this direction is as follows: Figure 3 As shown. Let direction 1 be the clockwise rotation centered on the second direction. Rotate the six-axis adjusting bracket 3 along direction 1 to bring the mounting part 1 to its initial position, ensuring... Figure 3 In the view, the vertical distance between the second side 8 of the mounting component 1, which is closer to the second identification component 5, and the mounting surface 2 is greater than the vertical distance between the first side 7, which is farther from the bottom of the mounting component 1, and the mounting surface 2. That is, the mounting component 1 has a distance relative to the mounting surface 2. Figure 3 The acute tilt angle θ is shown. Since no camera is set along the second direction, it can only rotate significantly around direction 1 of the second direction to make the tilt angle θ large enough to be observed by the human eye, thus obtaining the initial relative position between the mounting part 1 and the mounting surface 2.

[0117] The second identification component 5 monitors the relative distance between the mounting component 1 and the mounting surface 2, and moves the mounting component 1 along a third direction. The second identification component 5 observes that the distance between the mounting component 1 and the mounting surface 2 continuously decreases. When the distance (h) observed by the second identification component 5 no longer decreases, it indicates that the mounting component 1 and the mounting surface 2 are in contact on the side furthest from the second identification component 5 (first side 7). Figure 4 As shown.

[0118] It should be noted that in actual production, when the light source of the second identification component 5 illuminates the first side 7 which is far away from the second identification component 5, it cannot form a clear outline of light and shadow. Therefore, the relative distance between the first side 7 which is far away from the second identification component 5 and the mounting surface 2 is difficult to be clearly captured by the second identification component 5. So the distance between the mounting part 1 and the mounting surface 2 that the second identification component 5 can only capture is the vertical distance between the bottom side (second side 8) of the mounting part 1 which is close to the second identification component 5 and the surface of the mounting surface 2.

[0119] For the purpose of explaining the content of this invention, Figure 4 Only the mounting component 1 and the mounting surface 2 are retained. After the first side 7 contacts the mounting surface 2, the mounting component 1 is moved vertically upward to create space for the mounting component 1 to rotate again. Rotating about the second direction as the axis of rotation, in the opposite direction 2 (i.e., counterclockwise), the acute angle θ between the mounting component 1 and the mounting surface 2 (see also...) is adjusted. Figure 3 The included angle θ decreases, thus making the mounting part 1 and the mounting surface 2 more parallel.

[0120] The relative distance between the mounting component 1 and the mounting surface 2 is monitored again by the second identification component 5. By moving the mounting component 1 downwards (along a third direction) via the six-axis adjustment bracket 3, the distance between the mounting component 1 and the mounting surface 2 can be observed to continuously decrease through the second identification component 5. When the distance between the mounting component 1 and the mounting surface 2 is h (see also...) Figure 4When h) no longer decreases, it indicates that the mounting part 1 is in contact with the mounting surface 2 on the side away from the second identification component 5 (first side 7).

[0121] The above actions are repeated continuously, including lifting the mounting component 1 upward along a third direction, then rotating the mounting component 1 along direction 2 with the second direction as the axis of rotation, reducing the acute angle θ between the mounting component 1 and the mounting surface 2, and then moving the mounting component 1 downward along the third direction until it contacts the mounting surface 2, so that the mounting component 1 and the mounting surface 2 gradually approach parallelism. Understandably, each time the mounting component 1 is rotated along direction 2 with the second direction as the axis of rotation by a relatively small angle, thereby gradually reducing the angle θ while keeping the second side 8 further away from the mounting surface 2 than the first side 7, until the mounting component and the mounting surface 2 are substantially parallel.

[0122] Understandably, as the mounting component 1 moves downward along a third direction, the distance h between the second side 8 near the second identification component 5 and the mounting surface 2 continuously decreases.

[0123] Optionally, in the above-described repetitive actions, the angle at which the mounting component 1 rotates along direction 2 with the second direction as the rotation axis can be a fixed value or a value that varies with the detected height h. When the first side 7 contacts the mounting surface, if the height h is greater than a specified threshold, the angle at which the mounting component 1 rotates along direction 2 with the second direction as the rotation axis is relatively large; while if the height h is not greater than the specified threshold, the angle at which the mounting component 1 rotates along direction 2 with the second direction as the rotation axis is relatively small.

[0124] It should be noted that when h is small enough, for example, within 50μm, the angle of rotation of the mounting part 1 along direction 2 with the second direction as the rotation axis needs to be continuously reduced so that h gradually approaches 0 in multiple repeated actions. This is to avoid the rotation amplitude of the mounting part 1 along direction 2 with the second direction as the rotation axis being too large, which would cause the distance between the mounting part 1 side (second side 8) closer to the second identification component 5 and the mounting surface 2 when the mounting part 1 contacts the mounting surface 2 to be less than the distance between the mounting part 1 side (first side 7) farther away from the second identification component 5 and the mounting surface 2.

[0125] After the above process is repeated 0 times, 1 time, or multiple times, when the mounting component 1 contacts the mounting surface 2, if the distance h between the mounting component 1 (second side 8) and the mounting surface 2 is observed to be 0 in the second identification component 5, the acute angle θ between the mounting component 1 and the mounting surface 2 is 0°, meaning that the mounting component 1 has completed leveling in the second direction. It should be noted that in actual production, the acute angle θ can be controlled within 0°±0.1° to meet the accuracy requirements. Within this angle range, the difference in distance between the bottom two sides of θ (first side 7 and second side 8) and the mounting surface 2 is within 8μm. Therefore, in the above repeated process, the angle by which the mounting component 1 rotates along direction 2 with the second direction as the rotation axis can be less than 0.1° each time.

[0126] In Example 3, the mounting component 1 is gradually rotated around the second direction during multiple repetitions to achieve leveling between the mounting component 1 and the mounting surface 2. However, this requires repeated adjustments, resulting in longer leveling times and a need to improve production efficiency.

[0127] Example 4:

[0128] like Figure 1 As shown, the first identification component 4 causes the mounting component 1 to rotate about a third direction, so that the straight line containing the edge of the mounting component 1 is parallel to or coincides with the straight line connecting the centers of each photoelectric sensor 6 on the upper surface of the mounting surface 2. This step is similar to the corresponding operation in embodiment 3.

[0129] The second identification component 5 observes the angle between the second side 8 of the mounting component 1 and the mounting surface, and at the same time, the six-axis adjustment bracket 3 rotates the mounting component 1 around the first direction as the axis so that the angle between the second side 8 of the mounting component 1 and the mounting surface 2 is 0.

[0130] The second identification component 5 monitors the relative distance between the mounting component 1 and the mounting surface 2 (the distance h between the second side 8 and the mounting surface 2), and moves the mounting component 1 downward (along a third direction) via the six-axis adjustment bracket 3. A pressure sensor is installed on the six-axis adjustment bracket 3, and the movement stops when the pressure sensor detects that the mounting component 1 is in contact with the mounting surface 2.

[0131] When the initial relative relationship between the mounting part 1 and the mounting surface 2 is unknown, the mounting part 1 is moved downward (along a third direction). When the mounting part 1 comes into contact with the mounting surface 2, there are two possibilities: the first side 7 comes into contact with the mounting surface 2, or the second side 8 comes into contact with the mounting surface 2 (it is also possible that the first side 7 and the second side 8 come into contact with the mounting surface 2 at the same time, in which case the leveling of the mounting part 1 and the mounting surface 2 has been achieved).

[0132] like Figure 4As shown, if the mounting component 1 moves downward and stops, it contacts the mounting surface 2 on the side away from the camera 1 (i.e., the first side 7 contacts the mounting surface 2). The distance h between the mounting component 1 and the mounting surface 2 on the side closest to the second recognition component 5 (the second side 8) is measured by the second recognition component 5. Using the formula sinθ=h / l, where l is the width of the mounting component 1 base plate (the edge width of the mounting component 1 along the first direction), θ=arcsin(h / l) is calculated. Then, the mounting component 1 is controlled by the six-axis adjustment bracket 3 to rotate around the second direction as the axis in direction 2 by an angle θ=arcsin(h / l), thus completing the leveling of the mounting component 1 in the second direction.

[0133] Typically, in Example 4, leveling of the mounting component 1 and the mounting surface 2 is achieved by rotating the angle θ once, which greatly shortens the coupling time of the optical device.

[0134] If the mounting piece 1 is moved downwards (along a third direction) and comes into contact with the mounting surface 2, the second recognition component 5 measures that the distance between the mounting piece 1 and the mounting surface 2 on the side closest to the second recognition component 5 (from the second side 8 to the mounting surface 2) is 0, indicating that the mounting piece 1 and the mounting surface 2 are in contact on the side closest to the camera 1 (the second side 8). At this time, the first side 7 may not be in contact with the mounting surface 2. Therefore, the mounting piece 1 is lifted upwards (along a third direction) by the six-axis adjustment bracket 3 to provide space for the rotation of the mounting piece 1. The mounting piece 1 is rotated θ0 in direction 1 about the second direction as an axis by the six-axis adjustment bracket 3, where θ0 is a preset predetermined value. θ0 can be, for example, a small angle value, such as less than 0.1°. θ0 can also be relatively large to ensure that the distance from the second side 8 to the mounting surface 2 is greater than the distance from the first side 7 to the mounting surface 2. Alternatively, θ0 can also take other values.

[0135] Next, the mounting component 1 is moved downwards along the third direction again, and the movement stops when the mounting component 1 contacts the mounting surface 2 (contact is identified by, for example, a pressure sensor). If the mounting component 1 contacts the mounting surface 2 on the side away from the second recognition component 5 (first side 7), the distance h2 between the coupled mounting component 1 and the mounting surface 2 on the side closer to the camera 1 (second side 8) is measured by the second recognition component 5. The mounting component 1 is then rotated in direction 2 by an angle θ2 = arcsin(h2 / l) by the six-axis adjustment bracket 3, thus completing the leveling of the mounting component 1 by rotating around the second direction as an axis.

[0136] When the mounting component 1 contacts the mounting surface 2 (contact is detected, for example, by a pressure sensor), if the second recognition component 5 measures that the distance between the mounting component 1 and the mounting surface 2 on the side closest to the camera 1 is still 0, the mounting component 1 is again lifted upwards along a third direction by the six-axis adjustment bracket 3, and the mounting component 1 is rotated θ0 in direction 1 with the second direction as the axis. The mounting component 1 is then lowered, and the distance between the mounting component 1 and the mounting surface 2 on the side closest to the second recognition component 5 (second side 8) is measured. The above steps are repeated until the distance h on the side closest to the second recognition component 5 (second side 8) when the mounting component 1 contacts the mounting surface 2 is... n The value is not 0. The mounting component 1 is controlled by the six-axis adjustment bracket 3 to rotate by an angle θ in direction 2 with the second direction as the axis. n =arcsin(h n / l), that is, to complete the leveling of the mounting part 1 by rotating it around the second direction as an axis.

[0137] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for coupling optical devices, characterized in that, Includes the following steps: S1. Obtain the projection of the mounting component onto the plane containing the first and second directions, and obtain the outer contour of the projection along the first direction; rotate the mounting component about the third direction as an axis so that the outer contour of the projection of the mounting component along the first direction is parallel to the line connecting the centers of each optoelectronic component on the mounting surface. S2. Rotate the mounting component about the first direction as an axis so that the mounting component is parallel to the mounting surface in the second direction; S3. Move the mounting component along a third direction until it contacts the mounting surface; S4. In response to the fact that the second side of the mounting component is not in contact with the mounting surface, the mounting component is rotated by a first angle about the second direction as an axis; the second side is the side of the mounting component along the second direction; S5. Repeat steps S3 and S4 until the second side of the mounting part is in contact with the mounting surface; The position and angle of the mounting component are obtained by a first identification component and a second identification component. The first identification component is located on the side of the mounting component away from the mounting surface and is used to obtain the projection of the mounting component onto the mounting surface in a first direction and a second direction. The second identification component is located on the side of the mounting component facing the first direction and is used to obtain the tilt angle of the mounting component with the plane formed by the first direction and the second direction from the side of the mounting component and the mounting surface.

2. The optical device coupling method according to claim 1, characterized in that, S4 specifically includes: Identify the distance h between the second side of the mount and the mounting surface; If h is greater than the first threshold, rotate the mounting component by a first angle with the second direction as the axis. If h is not greater than the first threshold, the mounting component is rotated by a second angle with the second direction as the axis, wherein the first angle is greater than the second angle.

3. The optical device coupling method according to claim 1 or 2, characterized in that, In step S4, the second side of the mounting component is visually identified as being in contact with the mounting surface, and / or the distance between the second side of the mounting component and the mounting surface is identified.

4. The optical device coupling method according to claim 2, characterized in that, If h is less than the second threshold and / or the angle between the mounting component and the mounting surface is less than the fourth threshold, then it is determined that the mounting component is bonded to the mounting surface.

5. A method for coupling optical devices, characterized in that, Includes the following steps: S1. Obtain the projection of the mounting component onto the plane containing the first and second directions, and obtain the outer contour of the projection along the first direction; rotate the mounting component about the third direction as an axis so that the outer contour of the projection of the mounting component along the first direction is parallel to the line connecting the centers of each optoelectronic component on the mounting surface. S2. Rotate the mounting component about the first direction as an axis so that the mounting component is parallel to the mounting surface in the second direction; S3. Move the mounting component along a third direction until it contacts the mounting surface; S3 specifically includes: S301, Identify the distance h from the second side edge of the mounting component to the mounting surface; S302. If the distance h from the second side of the mounting part to the mounting surface is 0, move the mounting part in the opposite direction of the third direction, and rotate the mounting part by a fourth angle along the A direction with the second direction as the axis. S303. Move the mounting component along a third direction so that the mounting component is in contact with the mounting surface; S4. Obtain the angle between the mounting part and the mounting surface as the third angle, and rotate the mounting part by the third angle along the B direction with the second direction as the axis. S5. Move the mounting component along a third direction so that the mounting component is in contact with the mounting surface.

6. The optical device coupling method according to claim 5, characterized in that, It also includes S304: Repeat S301~S303 until S301 detects that the distance from the second side of the mounting part to the mounting surface is greater than 0.

7. A method for coupling optical devices according to claim 5 or 6, characterized in that, The fourth angle is less than the fifth threshold.

8. The optical device coupling method according to claim 6, characterized in that, Whether the distance between the mounting component and the mounting surface is 0 is identified by a pressure sensor or a visual recognition mechanism; and / or the distance from the second side of the mounting component to the mounting surface is identified by a visual recognition mechanism.

9. The optical device coupling method according to claim 5, characterized in that, Before S4, there are also, Move the mounting component in the opposite direction of the third direction, and rotate the mounting component by a fifth angle along direction A with the second direction as the axis; Move the mounting component along a third direction until it comes into contact with the mounting surface.

10. A method for coupling optical devices, characterized in that, Includes the following steps: S1. Obtain the projection of the mounting component onto the plane containing the first and second directions, and obtain the outer contour of the projection along the first direction; rotate the mounting component about the third direction as an axis so that the outer contour of the projection of the mounting component along the first direction is parallel to the line connecting the centers of each optoelectronic component on the mounting surface. S2. Rotate the mounting component about the first direction as an axis, so that the mounting component is parallel to the mounting surface in the second direction; rotate the mounting component clockwise about the second direction as an axis, so that the vertical distance between the second side of the mounting component near the second identification component and the mounting surface is greater than the vertical distance between the first side of the mounting component away from the second identification component and the mounting surface. S3. Move the mounting component along a third direction until it contacts the mounting surface; S4. Rotate the mounting part around the third direction as the axis to complete the bonding of the mounting part with the mounting surface; The position and angle of the mounting component are obtained by a first identification component and a second identification component. The first identification component is located on the side of the mounting component away from the mounting surface and is used to obtain the projection of the mounting component onto the mounting surface in a first direction and a second direction. The second identification component is located on the side of the mounting component facing the first direction and is used to obtain the tilt angle of the mounting component with the plane formed by the first direction and the second direction from the side of the mounting component and the mounting surface.

Images