A printed circuit board welding method and device, electronic equipment and storage medium

Abstract

Embodiments of the present application provide a printed circuit board welding method and device, electronic equipment and storage medium, by obtaining the first pad spacing and the first pad size for the first device, obtaining the second pad spacing and the second pad size for the second device, when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold value, and the difference between the first pad size and the second pad size is not greater than a second preset difference, then the first device and the second device are stacked and placed, and the first device and the second device stacked and placed are welded to the printed circuit board, thereby improving the production yield of the printed circuit board and reducing the production cost.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board (PCB) soldering technology, and in particular to a PCB soldering method, a PCB soldering apparatus, an electronic device, and a computer-readable storage medium. Background Technology

[0002] With the development of social information technology, electronic products are gradually becoming more multifunctional and miniaturized. The circuit system design of electronic products is becoming more centralized and complex. At the same time, electronic products are gradually trending towards miniaturization, resulting in higher integration and greater component density of the core component, the PCB (Printed Circuit Board). When the component density is high, it will affect the wiring of key signals in the circuit system, leading to increased mutual interference between signals, and thus affecting the overall electrical performance stability of the entire circuit system. Taking the parallel resistor-capacitor circuit as an example, it is one of the commonly used circuits in electronic circuits. In PCB design, the conventional layout and routing of the parallel resistor-capacitor circuit is that the two components are closely parallel to the PCB and connected in parallel through the wiring. When the parallel resistor-capacitor circuit is used on a large scale, it will occupy a large area of ​​the PCB, which is not conducive to the miniaturization of the PCB. At the same time, due to the parallel wiring connection, the mutual interference between signals is increased, affecting electrical performance. This makes the design and manufacturing of high-density PCB boards more difficult, making it difficult to improve production yield and causing unnecessary cost waste.

[0003] Therefore, improving the production yield of PCB boards is a technical problem that needs to be overcome by those skilled in the art. Summary of the Invention

[0004] The present invention provides a printed circuit board soldering method, apparatus, electronic device, and computer-readable storage medium to solve the problem of how to solder printed circuit boards.

[0005] This invention discloses a printed circuit board (PCB) soldering method, applied to a PCB soldering apparatus. The apparatus is used to solder PCBs, which have corresponding first and second components, and may include:

[0006] Obtain the first pad spacing and the first pad size for the first device;

[0007] Obtain the second pad spacing and the second pad size for the second device;

[0008] When the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, then the first device and the second device are stacked.

[0009] The first device and the second device, which are stacked together, are soldered to the printed circuit board.

[0010] Optionally, it may also include:

[0011] When the first device is a chip, and the second device is a resistor-capacitor component, and the chip pin corresponding to the chip is configured on the physical epitaxial layer of the chip, the third pad spacing for the chip pin corresponding to the chip is obtained.

[0012] When the second pad spacing and the third pad spacing are equal, the resistor-capacitor components and the chip pins are stacked.

[0013] Optionally, the printed circuit board is configured with a corresponding first fixture, the first device has a corresponding first pin, and the second device has a corresponding second pin. The step of stacking the first device and the second device may include:

[0014] The first device is fixed using the first fixture;

[0015] The first device and the second device are stacked based on the first pin and the second pin;

[0016] The step of soldering the stacked first device and the second device to the printed circuit board may include:

[0017] A steel mesh is laid above the first pipe foot, and the first pipe foot is coated with a first welding material;

[0018] The first device and the second device are reflow soldered to generate a first stacked device;

[0019] The first stacked device and the printed circuit board are reflow soldered using a second soldering material.

[0020] Optionally, the printed circuit board is configured with a corresponding second fixture, the first device has a corresponding first pin, the second device has a corresponding second pin, and may further include:

[0021] When the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, the first device and the printed circuit board are reflow soldered using a third soldering material to generate a second stacked device.

[0022] The second stacked device is fixed using the second fixture;

[0023] The second device and the second stacked device are stacked based on the first pin and the second pin using a fourth soldering material and then reflow soldered.

[0024] Optionally, the melting point of the first welding material is higher than that of the second welding material.

[0025] Optionally, the melting point of the third welding material is higher than that of the fourth welding material.

[0026] Optionally, the first fixture is an assembly fixture, and the second fixture is a partial steel mesh fixture.

[0027] Optionally, the first device is configured with a metal sheet, the metal sheet being fixedly connected to the first pin, and the step of stacking the first device and the second device based on the first pin and the second pin may include:

[0028] The first device and the second device are stacked and fixedly connected by soldering the metal sheet and the second pin.

[0029] This invention also discloses a printed circuit board (PCB) soldering apparatus, applied to a PCB soldering device. The apparatus is used to solder PCBs, the PCB having corresponding first and second components, and may include:

[0030] The first pad size acquisition module is used to acquire the first pad spacing and the first pad size for the first device;

[0031] The second pad size acquisition module is used to acquire the second pad spacing and the second pad size for the second device;

[0032] The device stacking module is used to stack the first device and the second device when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold and the difference between the first pad size and the second pad size is not greater than a second preset difference.

[0033] A printed circuit board soldering module for soldering the stacked first device and the second device to the printed circuit board.

[0034] Optionally, it may also include:

[0035] The third pad spacing acquisition module is used to acquire the third pad spacing for the chip pins corresponding to the chip when the first device is a chip, the second device is a resistor-capacitor component, and the chip pins corresponding to the chip are configured on the physical epitaxial layer of the chip.

[0036] A chip pin stacking module is used to stack the resistor-capacitor components and the chip pins when the second pad spacing and the third pad spacing are equal.

[0037] Optionally, the printed circuit board is configured with a corresponding first fixture, the first device has a corresponding first pin, the second device has a corresponding second pin, and the device stacking module may include:

[0038] A first device fixing submodule is used to fix the first device using the first fixture;

[0039] A device stacking submodule is used to stack the first device and the second device based on the first pin and the second pin;

[0040] The printed circuit board soldering module may include:

[0041] The first welding material coating submodule is used to lay a steel mesh above the first pin and apply the first welding material to the first pin.

[0042] The first stacked device generation submodule is used to perform reflow soldering on the first device and the second device to generate the first stacked device.

[0043] A reflow soldering submodule is used to reflow solder the first stacked devices and the printed circuit board using a second soldering material.

[0044] Optionally, the printed circuit board is configured with a corresponding second fixture, the first device has a corresponding first pin, the second device has a corresponding second pin, and may further include:

[0045] The second stacked device generation module is used to reflow solder the first device and the printed circuit board using a third soldering material to generate a second stacked device when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold and the difference between the first pad size and the second pad size is not greater than a second preset difference.

[0046] The second stacking device fixing module is used to fix the second stacking device using the second fixture;

[0047] A reflow soldering module is used to stack the second device and the second stacked device based on the first pin and the second pin using a fourth soldering material, and to perform reflow soldering.

[0048] Optionally, the melting point of the first welding material is higher than that of the second welding material.

[0049] Optionally, the melting point of the third welding material is higher than that of the fourth welding material.

[0050] Optionally, the first fixture is an assembly fixture, and the second fixture is a partial steel mesh fixture.

[0051] Optionally, the first device is configured with a metal sheet, the metal sheet being fixedly connected to the first pin, and the device stacking submodule may include:

[0052] The second device fixing connection unit is used to stack the first device and the second device, and fix the first device and the second device by welding the metal sheet and the second pin.

[0053] This invention also discloses an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus;

[0054] The memory is used to store computer programs;

[0055] When the processor executes a program stored in the memory, it implements the method described in the embodiments of the present invention.

[0056] This invention also discloses a computer-readable storage medium storing instructions that, when executed by one or more processors, cause the processors to perform the methods described in this invention.

[0057] The embodiments of the present invention have the following advantages:

[0058] In this embodiment of the invention, by obtaining a first pad spacing and a first pad size for the first device; and obtaining a second pad spacing and a second pad size for the second device; when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, the first device and the second device are stacked; and the stacked first device and the second device are soldered to the printed circuit board, thereby improving the production yield of the printed circuit board and reducing the production cost. Attached Figure Description

[0059] Figure 1 This is a flowchart of the steps of a printed circuit board soldering method provided in an embodiment of the present invention;

[0060] Figure 2 This is a schematic diagram of a conventional PCB layout for an RC parallel circuit provided in the prior art;

[0061] Figure 3 This is a structural block diagram of a printed circuit board welding device provided in an embodiment of the present invention;

[0062] Figure 4 This is a hardware structure block diagram of an electronic device provided in various embodiments of the present invention;

[0063] Figure 5 This is a schematic diagram of a computer-readable medium provided in an embodiment of the present invention. Detailed Implementation

[0064] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0065] Parallel resistor-capacitor circuits, also known as RC parallel circuits, are a common circuit in electronic circuits. In printed circuit board (PCB) design, the conventional layout and routing of parallel resistor-capacitor circuits involves two components parallel to each other on the PCB and connected side-by-side via traces. However, when RC parallel circuits are used extensively, they occupy a large area of ​​the PCB, making this layout extremely unfavorable for PCB miniaturization. Furthermore, the parallel routing of components on the PCB increases signal stubs (also known as wire ends or off-target paths, referring to paths the signal is not intended to take), potentially causing signal reflection and mutual interference, thus affecting electrical performance. Embodiments of this invention provide a PCB soldering method that stacks and solders a first and a second component. This achieves PCB miniaturization while avoiding impact on the electrical performance of components on the PCB, thereby further improving PCB production yield.

[0066] Reference Figure 1 The diagram illustrates a flowchart of a printed circuit board soldering method provided in an embodiment of the present invention, which may specifically include the following steps:

[0067] Step 101: Obtain the first pad spacing and the first pad size for the first device;

[0068] Step 102: Obtain the second pad spacing and the second pad size for the second device;

[0069] Step 103: When the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, then the first device and the second device are stacked.

[0070] Step 104: Solder the stacked first device and the second device to the printed circuit board.

[0071] In practical applications, embodiments of the present invention can be applied to a printed circuit board welding device, which can be used to weld printed circuit boards. The printed circuit board can be a PCB board, and the printed circuit board can have corresponding first and second components. For example, the first component can be a component for welding onto the PCB board, such as a capacitor and / or a resistor. The second component can be a component for welding onto the PCB board, such as a capacitor and / or a resistor. The first and second components can be connected in parallel.

[0072] In a specific implementation, embodiments of the present invention can obtain a first pad spacing and a first pad size for a first device; obtain a second pad spacing and a second pad size for a second device; when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, then the first device and the second device are stacked; the stacked first device and the second device are soldered onto a printed circuit board, wherein a pad refers to a basic element unit of a surface mount assembly, used to form the pad pattern of the circuit board. When a pad structure is not designed correctly, it is difficult, sometimes even impossible, to achieve the desired solder joint. For example, when the pad corresponding to the first device is a circular pad, the distance between the centers of the pads corresponding to the first device can be used as the first pad spacing, and the diameter of the pad corresponding to the first device can be used as the first pad size. When the pads corresponding to the two components are circular pads, the distance between the centers of the pads corresponding to the second component can be used as the second pad spacing, and the diameter of the pads corresponding to the second component can be used as the second pad size. The first pad spacing and the first pad size for the first component are obtained, and the second pad spacing and the second pad size for the second component are also obtained. When the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset threshold (e.g., the first preset threshold can be 0mm, and the second preset threshold can be 0.5mm), that is, when it is known that the difference between the first pad spacing and the second pad spacing is the same, and the difference between the first pad size and the second pad size is not greater than 0.5mm, the first component and the second component can be stacked. This stacking can be done vertically, and then the stacked first component and the second component are soldered onto the PCB board.

[0073] Of course, the above are merely examples. Those skilled in the art can use other types of components as the first component and / or the second component, including but not limited to electronic devices such as inductors and crystal diodes. Those skilled in the art can also use other types of pads as the first component and / or the pads corresponding to the second component, including but not limited to square pads, polygonal pads, elliptical pads, etc. In this regard, the embodiments of the present invention do not impose any restrictions.

[0074] In practical applications, stacking components before soldering them to the PCB board can reduce the space occupied by parallel component arrangement on the PCB board, which is conducive to the miniaturization of the PCB board. At the same time, stacking components can reduce the stubs of signal traces in the circuit, reduce signal reflection, reduce parasitic capacitance and parasitic inductance, and improve the electrical performance stability of electronic products.

[0075] In this embodiment of the invention, by obtaining a first pad spacing and a first pad size for the first device; and obtaining a second pad spacing and a second pad size for the second device; when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, the first device and the second device are stacked; and the stacked first device and the second device are soldered to the printed circuit board, thereby improving the production yield of the printed circuit board and reducing the production cost.

[0076] Based on the above embodiments, modified embodiments of the above embodiments are proposed. It should be noted that, in order to keep the description brief, only the differences from the above embodiments are described in the modified embodiments.

[0077] In an optional embodiment of the present invention, it further includes:

[0078] When the first device is a chip, and the second device is a resistor-capacitor component, and the chip pin corresponding to the chip is configured on the physical epitaxial layer of the chip, the third pad spacing for the chip pin corresponding to the chip is obtained.

[0079] When the second pad spacing and the third pad spacing are equal, the resistor-capacitor components and the chip pins are stacked.

[0080] In practical applications, chip pins sometimes need to be connected to resistors and / or capacitors. For example, in IC (integrated circuit, also known as microelectronic device) chip pins, the VCC (Volt Current Condenser, referring to the circuit's supply voltage) pin is generally connected to a capacitor, usually in parallel with the VCC pin. This is because, during IC chip operation, unlike a pure resistor, the current of an IC chip will still vary even with a fixed voltage. Therefore, the IC's power supply current fluctuates, and this fluctuation inevitably leads to voltage fluctuation. If the current fluctuation is large, even with excellent power supply dynamic characteristics, voltage fluctuations will still occur, resulting in unstable power supply voltage during operation. Furthermore, a complete circuit includes not only power supplies but also various signals, inevitably resulting in power supplies being routed together in parallel. This can cause power supply noise, a type of electromagnetic interference, to be coupled. Choosing a suitable capacitor allows this noise to be transmitted to ground through the capacitor path, thereby improving the stability of the IC chip's power supply. Reducing source noise suppresses crosstalk signals and stabilizes the power supply in the circuit. In practical applications, capacitors are placed as close as possible to the IC pins. If the capacitors are placed far apart, crosstalk will occur again on the path after the capacitors have filtered out the power supply noise, generating new power supply noise. When an IC chip has multiple VCC pins, each pin is usually connected to a capacitor. Therefore, when multiple capacitors and chips are connected in parallel, they will occupy space on the printed circuit board, affecting the miniaturization of the printed circuit board. At the same time, they will create stubs in the signal traces, increase signal reflection, increase parasitic capacitance and parasitic inductance, and reduce the electrical performance stability of electronic products. If the capacitors and chips are stacked, the distance between the capacitors and IC pins can be further shortened, enhancing the filtering of electromagnetic interference, increasing electrical performance stability, and reducing the space occupied on the printed circuit board.

[0081] In a specific implementation, embodiments of the present invention can obtain a third pad spacing for the chip pins corresponding to the chip when the first device is a chip, the second device is a resistor-capacitor component, and the chip pins corresponding to the chip are configured on the physical epitaxial layer of the chip. When the second pad spacing and the third pad spacing are equal, the resistor-capacitor component and the chip pins are stacked. For example, the resistor-capacitor component can be a resistor and / or a capacitor. Taking a capacitor as an example, if the second pad spacing is known to be the distance between the centers of the pads corresponding to the second device, when the first device is a chip, the second device is a capacitor, and the chip pins are configured on the physical epitaxial layer of the chip, the spacing between adjacent chip pins can be obtained as the third pad spacing. When the second pad spacing and the third pad spacing are equal, the capacitor and the chip pins can be stacked. Then, the stacked capacitor and chip can be soldered to the printed circuit board.

[0082] This invention, in its embodiment, obtains a third pad spacing for the chip pins corresponding to the chip when the first device is a chip, the second device is a resistor-capacitor component, and the chip pins corresponding to the chip are configured on the physical epitaxial layer of the chip; when the second pad spacing and the third pad spacing are equal, the resistor-capacitor components and the chip pins are stacked, thereby further enhancing the electrical performance stability and improving the production yield of printed circuit boards.

[0083] In an optional embodiment of the present invention, the step of stacking the first device and the second device includes:

[0084] The first device is fixed using the first fixture;

[0085] The first device and the second device are stacked based on the first pin and the second pin;

[0086] The step of soldering the stacked first device and the second device to the printed circuit board includes:

[0087] A steel mesh is laid above the first pipe foot, and the first pipe foot is coated with a first welding material;

[0088] The first device and the second device are reflow soldered to generate a first stacked device;

[0089] The first stacked device and the printed circuit board are reflow soldered using a second soldering material.

[0090] In practical applications, the printed circuit board in this embodiment of the invention may be configured with a corresponding first fixture, which may be used to fix a first device, the first device may have a corresponding first pin, and the second device may have a corresponding second pin.

[0091] In a specific implementation, embodiments of the present invention may employ a first fixture to fix a first device; stack the first device and the second device based on a first pin and a second pin; lay a steel mesh above the first pin and apply a first soldering material to the first pin; perform reflow soldering on the first device and the second device to generate a first stacked device; and perform reflow soldering on the first stacked device and the printed circuit board using a second soldering material. For example, when the pads corresponding to the first device are circular pads, the distance between the centers of the pads corresponding to the first device can be used as the first pad spacing, and the diameter of the pads corresponding to the first device can be used as the first pad size. When the pads corresponding to the second device are circular pads, the distance between the centers of the pads corresponding to the second device can be used as the second pad spacing, and the diameter of the pads corresponding to the second device can be used as the second pad size. The first pad spacing and the first pad size for the first device are obtained, and the second pad spacing and the second pad size for the second device are obtained. When the first pad spacing and the second pad spacing are... When the difference is not greater than a first preset threshold and the difference between the size of the first pad and the size of the second pad is not greater than a second preset threshold, the first device can be fixed using a first fixture. Based on the first pin corresponding to the first device and the second pin corresponding to the second device, for example, the first pin and the second pin are made to correspond one-to-one, thereby determining the stacking method of the first device and the second device. Then, soldering can be performed based on the stacked first device and the second device. A steel mesh can be laid on top of the first pin. Preferably, the top of the first pin can be the side of the first device away from the first fixture. Next, a first soldering material can be applied to the first pin corresponding to the first device. The first soldering material can be solder for reflow soldering. Then, the second device is placed in the stacking method and reflow soldered to generate the first stacked device. Then, a second soldering material can be applied to the printed circuit board (PCB) and the first stacked device and the PCB are reflow soldered. The second soldering material can be solder for reflow soldering.

[0092] In practical applications, reflow soldering is a process that uses a heated coated hot air circulating oven to solder surface mount components onto a printed circuit board (PCB). The basic principle of reflow soldering is to place pre-soldered components on the PCB, heat them during the heating process to melt the solder, and then reheat and cool them for a period of time to achieve the purpose of attachment and soldering between the components and the PCB. Reflow soldering (also known as hot air duct oven) uses a hot air circulating oven to heat the PCB at a predetermined temperature for a period of time, so that the solder between the pads and the components becomes liquid, and then it is rapidly cooled to achieve the purpose of soldering. Through reflow soldering, the soldering between components and the PCB can be completed quickly. Reflow soldering and reflow soldering have different applications. Reflow soldering is generally suitable for surface mount technology, mainly used for soldering component leads and pads on the PCB, while reflow soldering is suitable for through-hole technology, usually used for soldering indirect connections between components and the PCB substrate. Reflow soldering only requires a hot air circulating oven and is relatively low in cost.

[0093] In this embodiment of the invention, the first device is fixed using the first fixture; the first device and the second device are stacked based on the first pin and the second pin; a steel mesh is laid on top of the first pin, and a first soldering material is applied to the first pin; the first device and the second device are reflow soldered to generate a first stacked device; and the first stacked device and the printed circuit board are reflow soldered using a second soldering material. This achieves different soldering methods for the first and second devices compared to the soldering of the stacked device and the printed circuit board, thereby improving soldering efficiency and reducing soldering costs.

[0094] In an optional embodiment of the present invention, it further includes:

[0095] When the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, the first device and the printed circuit board are reflow soldered using a third soldering material to generate a second stacked device.

[0096] The second stacked device is fixed using the second fixture;

[0097] The second device and the second stacked device are stacked based on the first pin and the second pin using a fourth soldering material and then reflow soldered.

[0098] In practical applications, the printed circuit board in this embodiment of the invention may be configured with a corresponding second fixture, which may be used to fix the second stacked device. The first device may have a corresponding first pin, and the second device may have a corresponding second pin.

[0099] In a specific implementation, embodiments of the present invention can, when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, use a third soldering material to reflow solder the first device and the printed circuit board to generate a second stacked device; use a second fixture to fix the second stacked device; use a fourth soldering material to stack the second device and the second stacked device based on the first pin and the second pin, and perform reflow soldering. For example, when the pads corresponding to the first device are circular pads, the distance between the centers of the pads corresponding to the first device can be used as the first pad spacing, and the diameter of the pads corresponding to the first device can be used as the first pad size. When the pads corresponding to the second device are circular pads, the distance between the centers of the pads corresponding to the second device can be used as the second pad spacing, and the diameter of the pads corresponding to the second device can be used as the second pad size. This allows for obtaining the first pad spacing and the first soldering distance for the first device. The first pad spacing and the second pad size for the second device are obtained. When the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset threshold, the stacking method of the first device and the second device can be determined based on the first pin corresponding to the first device and the second pin corresponding to the second device, for example, by making the first pin and the second pin correspond one-to-one. Then, a third soldering material can be applied to the first pin and / or the corresponding position of the printed circuit board, and the first device and the printed circuit board can be reflow soldered to generate a second stacked device. Then, the second stacked device is fixed by a second fixture, and a fourth soldering material is applied to the upper surface layer of the second stacked device. The upper surface layer can be the side of the first device in the second stacked device that is away from the printed circuit board. Then, the first pin and the second pin can be placed correspondingly based on the stacking method, and then the second device and the second stacked device can be reflow soldered.

[0100] In this embodiment of the invention, when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, the first device and the printed circuit board are reflow soldered using a third soldering material to generate a second stacked device; the second stacked device is fixed using a second fixture; and the second device and the second stacked device are stacked based on the first pin and the second pin using a fourth soldering material and reflow soldered. This achieves different soldering methods for the soldering of the first device and the second device compared to the soldering of the stacked device and the printed circuit board, thereby improving soldering efficiency and reducing soldering costs.

[0101] In an optional embodiment of the present invention, the melting point of the first welding material is higher than that of the second welding material.

[0102] In practical applications, the reflow soldering process can be as follows: First, raise the reflow oven temperature to 160°C within 100 seconds. Then, adjust the reflow oven temperature, raising it from 160°C to 180°C within 50-60 seconds. Next, adjust the reflow oven temperature again, raising it from 180°C to a temperature range of 245°C to 255°C within 10-20 seconds. Maintain this temperature range for 50-60 seconds, then allow it to cool. Alternatively, the reflow soldering process can be as follows: First, raise the reflow oven temperature to 160°C within 100 seconds. Then, adjust the reflow oven temperature, raising it from 160°C to 180°C within 50-60 seconds. Then, the reflow oven temperature is adjusted, rising from 180°C to a temperature range of 230°C to 240°C within 10 to 20 seconds, and maintained at 230°C to 240°C for 50 to 60 seconds. Then, it is allowed to cool. It can be seen that the temperatures of reflow soldering and reflow soldering are different, with the reflow soldering temperature being higher than the reflow soldering temperature. Therefore, if the same melting point soldering material is selected for reflow soldering and reflow soldering, or if the melting point of the soldering material for reflow soldering is lower than that for reflow soldering, the soldering material between the components that have already been soldered in reflow soldering will melt again during the reflow soldering process, causing poor soldering of stacked components and reducing the yield.

[0103] For example, in the embodiments of the present invention, the melting point of the first soldering material can be higher than that of the second soldering material. For instance, the first soldering material can be applied to the first pin corresponding to the first device, wherein the first soldering material can be solder for reflow soldering, and the melting point range of the first soldering material can be 245℃-255℃. Then, the second device is placed in a stacked manner and reflow soldered to generate the first stacked device. Then, the second soldering material can be applied to the printed circuit board (PCB) and the first stacked device and the PCB are reflow soldered, wherein the second soldering material can be solder for reflow soldering, and the melting point range of the second soldering material can be 230℃-240℃.

[0104] Of course, the above is only an example, and those skilled in the art can use solder with other melting points as the first welding material and the second welding material. This embodiment of the invention does not impose any restrictions on this.

[0105] In this embodiment of the invention, by making the melting point of the first welding material higher than that of the second welding material, welding defects caused by the remelting of the welding material during the secondary welding process are avoided, thereby further improving the yield of printed circuit board welding.

[0106] In an optional embodiment of the present invention, the melting point of the third welding material is higher than that of the fourth welding material.

[0107] In practical applications, during the secondary reflow soldering process, if the welding material used in the first reflow soldering has the same melting point as the welding material used in the reflow soldering, or if the melting point of the welding material used in the reflow soldering is lower than that used in the reflow soldering, the welding material between the components that have already been soldered in the reflow soldering process will melt again, causing soldering defects such as tombstoning of stacked components, thereby reducing the yield.

[0108] For example, in this embodiment of the invention, the melting point of the third welding material can be higher than that of the fourth welding material. For instance, the melting point range of the third welding material can be 245°C-255°C, and the melting point range of the fourth welding material can be 230°C-240°C. The third welding material is applied to the first pin and / or the corresponding position of the printed circuit board. The first device and the printed circuit board are then reflow soldered to generate a second stacked device. Then, the second stacked device is fixed using a second fixture, and the fourth welding material is applied to the upper surface layer of the second stacked device. The upper surface layer can be the side of the first device in the second stacked device that is away from the printed circuit board. Then, the first pin and the second pin can be placed correspondingly based on the stacking placement method, and then the second device and the second stacked device are reflow soldered.

[0109] Of course, the above is only an example, and those skilled in the art can use solder with other melting points as the third and fourth welding materials. This embodiment of the invention does not impose any restrictions on this.

[0110] In this embodiment of the invention, by making the melting point of the third welding material higher than that of the fourth welding material, problems such as tombstoning caused by the remelting of the welding material during the secondary welding process are avoided, thereby further improving the yield of printed circuit board welding.

[0111] In an optional embodiment of the present invention, the first fixture is an assembly fixture, and the second fixture is a partial steel mesh fixture.

[0112] In a specific implementation, the first fixture in this embodiment of the invention can be an assembly fixture, and the second fixture can be a partial stencil fixture. For example, the assembly fixture can be used to fix the first device, and the assembly fixture can be configured with a corresponding stencil. The first welding material can be applied to the first fixture in conjunction with the stencil. After the application is completed, the assembly fixture can be removed. The partial stencil fixture can be used to fix the second stacked device, and can be used to apply a fourth welding material to the upper surface layer of the second stacked device. After the application is completed, the partial stencil fixture can be removed. The partial stencil fixture can include a bracket. The height of the bracket can be the same as the height of the first device that has been soldered on the printed circuit board. The width between the brackets can be 0.6 mm longer than the long side of the first device, that is, there is a 0.3 mm free space on one side.

[0113] In this embodiment of the invention, by making the first fixture an assembly fixture and the second fixture a partial stencil fixture, a more suitable fixture can be selected for different welding processes. At the same time, there is no need to use clamps to fix components, which simplifies the welding process, ensures the welding effect, further improves the welding efficiency, and guarantees the welding yield of printed circuit boards.

[0114] In an optional embodiment of the present invention, the step of stacking the first device and the second device based on the first pin and the second pin includes:

[0115] The first device and the second device are stacked and fixedly connected by soldering the metal sheet and the second pin.

[0116] In practical applications, the first device in this embodiment of the invention may be configured with a metal sheet, which may be fixedly connected to the first pin.

[0117] In a specific implementation, embodiments of the present invention can stack a first device and a second device, and fix the first device and the second device together by soldering a metal sheet and a second pin. For example, the first device can be provided with a metal sheet, which is connected to the first pin of the first device and extends to the top of the first device. The first pin corresponding to the first device is soldered to a printed circuit board. The first device and the second device are stacked, for example, the second device can be vertically stacked on top of the first device, and the second pin corresponding to the second device is soldered to the metal sheet, thereby fixing the first device and the second device together.

[0118] In this embodiment of the invention, by stacking the first device and the second device, and by welding the metal sheet and the second pin, the first device and the second device are fixedly connected. This enables the first device and the second device to be stacked by configuring the metal sheet when the second pin cannot be directly soldered to the first pin. This reduces the space occupied on the printed circuit board and further improves the soldering yield of the printed circuit board.

[0119] To enable those skilled in the art to better understand the embodiments of the present invention, a complete example is used below to illustrate the embodiments of the present invention.

[0120] Reference Figure 2 , Figure 2 A schematic diagram of a conventional PCB layout for an RC parallel circuit provided in the prior art is shown; wherein R1 can be a resistor and C1 can be a capacitor.

[0121] In conventional electronic product design, if a PCB board contains a large number of components and signal network functions, it is difficult to fit all the components onto a PCB board of fixed size; or even if they can be placed on the PCB board, it will cause difficulties in signal network routing and wiring. Therefore, in order to ensure the electrical performance of electronic products, in this case, the problem of high-density board design is usually solved by increasing the number of PCB board layers or increasing the size of the PCB board.

[0122] However, current electronic product designs are leading to increasingly dense layouts of circuit components, increasing the difficulty of PCB layout and making it difficult to fit some chips and devices. Furthermore, high component density affects the routing of critical signals in the circuit system, increasing mutual interference between signals and consequently impacting the overall electrical performance stability of the entire circuit system. Parallel circuits are commonly used in printed circuit boards. Taking a parallel resistor-capacitor circuit as an example, it is one of the most common circuits in electronic circuits. In PCB design, the conventional layout and routing of a parallel resistor-capacitor circuit involves two components running parallel to each other on the PCB and connected side-by-side via traces. However, when RC parallel circuits are used extensively, they occupy a large area of ​​the PCB, making this layout extremely unfavorable for PCB miniaturization. Increased PCB layer stack-up or size leads to higher production costs for the entire electronic product. Simultaneously, parallel routing of components on the PCB increases signal stubs, potentially causing signal reflection and mutual interference, thus affecting electrical performance.

[0123] To solve the above problems, the specific process is as follows:

[0124] In PCB design, if the pad spacing (the distance between the centers of two or more parallel components) is approximately the same, and the pad size (i.e., pad diameter, or length and width if the pad type is square) deviates by no more than 0.5mm (e.g., a 0402 package resistor and a 0402 package capacitor), then the components can be stacked. If the capacitor is connected in parallel with the network of adjacent pins of the chip, and the pad spacing is the same, and the chip pins are relative to the outer edge of the chip body (e.g., SOP package), then the capacitor and chip pins can be stacked. This layout greatly saves PCB layout space, facilitating PCB miniaturization design; it also increases the space for other signal traces and reduces mutual interference between signals. In addition, this layout shortens the trace length of its own signals, reduces the stub size of its own signals, and avoids signal reflection caused by excessively long signal stubs; because the signal traces at both ends of the components are shortened, the parasitic capacitance and inductance generated by the signal traces are greatly attenuated, further improving the signal quality of the parallel circuit.

[0125] During PCB board soldering, the components with stacked layouts can be identified during the initial PCB design phase. A new assembly fixture is then used. This fixture first holds the components to be soldered onto the PCB board, securing the first component in the stack. A stencil is then applied to the pins of the secured component, followed by soldering. Next, the second component is placed on its corresponding pad, and then reflow soldering is performed. This process assembles the stacked components into a single unit, which is then soldered onto the PCB board using a standard reflow soldering process. Furthermore, the solder used between the stacked components must have a higher melting point than that used in standard reflow soldering. For example, the melting point range between stacked components is 245℃-255℃, while the melting point range on the PCB board is 230℃-240℃. This solder melting point design prevents the solder between the stacked components from melting during the second reflow soldering process, which could lead to poor soldering.

[0126] Alternatively, the first component in the stacked circuit can be soldered to the PCB board using a conventional reflow soldering process. Then, a novel partial stencil fixture is used to apply solder to the surface of the component already soldered to the PCB board, ensuring the solder adheres to the component pins. The height of the novel partial stencil fixture is the same as the height of the component already soldered to the PCB board, and its width is 0.6mm longer than the long side of the component, providing a 0.3mm margin on each side. Furthermore, the solder on the surface of the first component on the PCB board has a lower melting point than the solder used in conventional reflow soldering. This prevents the solder between the component and the PCB board from melting again during reflow soldering between stacked components, avoiding problems such as tombstoning. After setup, the stacked components and PCB board undergo a second reflow soldering process.

[0127] The above methods solve the bottleneck technical problem of miniaturization in the PCB design and assembly process of high-density circuit boards. Conventional PCB design methods and simple soldering fixtures can greatly solve the design problems of high-density PCB boards, while shortening the PCB trace length of parallel signals, eliminating redundant signal stubs, and improving signal quality. This improves the overall electrical performance of electronic products while promoting miniaturization. Furthermore, by stacking parallel circuits in the PCB board, the layout space of components can be greatly reduced, thus facilitating the miniaturization of PCB boards, electronic products, and reducing their costs.

[0128] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.

[0129] Reference Figure 3 The diagram shows a structural block diagram of a printed circuit board soldering apparatus provided in an embodiment of the present invention, which may specifically include the following modules:

[0130] The first pad size acquisition module 301 is used to acquire the first pad spacing and the first pad size for the first device;

[0131] The second pad size acquisition module 302 is used to acquire the second pad spacing and the second pad size for the second device;

[0132] The device stacking module 303 is used to stack the first device and the second device when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold and the difference between the first pad size and the second pad size is not greater than a second preset difference.

[0133] Printed circuit board soldering module 304 is used to solder the stacked first device and the second device to the printed circuit board.

[0134] Optionally, it may also include:

[0135] The third pad spacing acquisition module is used to acquire the third pad spacing for the chip pins corresponding to the chip when the first device is a chip, the second device is a resistor-capacitor component, and the chip pins corresponding to the chip are configured on the physical epitaxial layer of the chip.

[0136] A chip pin stacking module is used to stack the resistor-capacitor components and the chip pins when the second pad spacing and the third pad spacing are equal.

[0137] Optionally, the printed circuit board is configured with a corresponding first fixture, the first device has a corresponding first pin, the second device has a corresponding second pin, and the device stacking module may include:

[0138] A first device fixing submodule is used to fix the first device using the first fixture;

[0139] A device stacking submodule is used to stack the first device and the second device based on the first pin and the second pin;

[0140] The printed circuit board soldering module may include:

[0141] The first welding material coating submodule is used to lay a steel mesh above the first pin and apply the first welding material to the first pin.

[0142] The first stacked device generation submodule is used to perform reflow soldering on the first device and the second device to generate the first stacked device.

[0143] A reflow soldering submodule is used to reflow solder the first stacked devices and the printed circuit board using a second soldering material.

[0144] Optionally, the printed circuit board is configured with a corresponding second fixture, the first device has a corresponding first pin, the second device has a corresponding second pin, and may further include:

[0145] The second stacked device generation module is used to reflow solder the first device and the printed circuit board using a third soldering material to generate a second stacked device when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold and the difference between the first pad size and the second pad size is not greater than a second preset difference.

[0146] The second stacking device fixing module is used to fix the second stacking device using the second fixture;

[0147] A reflow soldering module is used to stack the second device and the second stacked device based on the first pin and the second pin using a fourth soldering material, and to perform reflow soldering.

[0148] Optionally, the melting point of the first welding material is higher than that of the second welding material.

[0149] Optionally, the melting point of the third welding material is higher than that of the fourth welding material.

[0150] Optionally, the first fixture is an assembly fixture, and the second fixture is a partial steel mesh fixture.

[0151] Optionally, the first device is configured with a metal sheet, the metal sheet being fixedly connected to the first pin, and the device stacking submodule may include:

[0152] The second device fixing connection unit is used to stack the first device and the second device, and fix the first device and the second device by welding the metal sheet and the second pin.

[0153] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0154] In addition, this invention also provides an electronic device, including: a processor, a memory, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the various processes of the above-described printed circuit board soldering method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0155] This invention also provides a computer-readable storage medium storing a computer program. When executed by a processor, the computer program implements the various processes of the above-described printed circuit board soldering method embodiments and achieves the same technical effects. To avoid repetition, it will not be described again here. The computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0156] Figure 4 A schematic diagram of the hardware structure of an electronic device for implementing various embodiments of the present invention.

[0157] The electronic device 400 includes, but is not limited to, components such as: a radio frequency unit 401, a network module 402, an audio output unit 403, an input unit 404, a sensor 405, a display unit 406, a user input unit 407, an interface unit 408, a memory 409, a processor 410, and a power supply 411. Those skilled in the art will understand that... Figure 4 The electronic device structures shown are not intended to limit the electronic device. An electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements. In embodiments of the present invention, the electronic device includes, but is not limited to, mobile phones, tablet computers, laptops, PDAs, in-vehicle terminals, wearable devices, and pedometers.

[0158] It should be understood that, in this embodiment of the invention, the radio frequency unit 401 can be used for receiving and transmitting signals during information transmission or calls. Specifically, it receives downlink data from the base station and processes it with the processor 410; additionally, it transmits uplink data to the base station. Typically, the radio frequency unit 401 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low-noise amplifier, a duplexer, etc. Furthermore, the radio frequency unit 401 can also communicate with networks and other devices through a wireless communication system.

[0159] The electronic device provides users with wireless broadband internet access through network module 402, such as helping users send and receive emails, browse web pages, and access streaming media.

[0160] The audio output unit 403 can convert audio data received by the radio frequency unit 401 or the network module 402 or stored in the memory 409 into audio signals and output them as sound. Furthermore, the audio output unit 403 can also provide audio output related to specific functions performed by the electronic device 400 (e.g., call signal reception sound, message reception sound, etc.). The audio output unit 403 includes a speaker, a buzzer, and a receiver, etc.

[0161] Input unit 404 is used to receive audio or video signals. Input unit 404 may include a graphics processing unit (GPU) 4041 and a microphone 4042. The GPU 4041 processes image data of still images or videos acquired by an image capture device (such as a camera) in video capture mode or image capture mode. The processed image frames can be displayed on display unit 406. The image frames processed by GPU 4041 can be stored in memory 409 (or other storage medium) or transmitted via radio frequency unit 401 or network module 402. Microphone 4042 can receive sound and process such sound into audio data. The processed audio data can be converted into a format that can be transmitted to a mobile communication base station via radio frequency unit 401 in telephone call mode.

[0162] The electronic device 400 also includes at least one sensor 405, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor and a proximity sensor. The ambient light sensor can adjust the brightness of the display panel 4061 according to the ambient light level, and the proximity sensor can turn off the display panel 4061 and / or backlight when the electronic device 400 is moved to the ear. As a type of motion sensor, an accelerometer sensor can detect the magnitude of acceleration in various directions (generally three axes). When stationary, it can detect the magnitude and direction of gravity and can be used to identify the posture of the electronic device (such as landscape / portrait switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc. The sensor 405 may also include a fingerprint sensor, pressure sensor, iris sensor, molecular sensor, gyroscope, barometer, hygrometer, thermometer, infrared sensor, etc., which will not be described in detail here.

[0163] The display unit 406 is used to display information input by the user or information provided to the user. The display unit 406 may include a display panel 4061, which may be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like.

[0164] User input unit 407 can be used to receive input numerical or character information, and generate key signal inputs related to user settings and function control of electronic devices. Specifically, user input unit 407 includes a touch panel 4071 and other input devices 4072. Touch panel 4071, also known as a touch screen, can collect touch operations performed by the user on or near it (such as operations performed by the user using a finger, stylus, or any suitable object or accessory on or near touch panel 4071). Touch panel 4071 may include two parts: a touch detection device and a touch controller. The touch detection device detects the user's touch position and the signal generated by the touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into touch point coordinates, and sends it to the processor 410, which receives and executes commands from the processor 410. In addition, touch panel 4071 can be implemented using various types such as resistive, capacitive, infrared, and surface acoustic wave. Besides touch panel 4071, user input unit 407 may also include other input devices 4072. Specifically, other input devices 4072 may include, but are not limited to, physical keyboards, function keys (such as volume control buttons, power buttons, etc.), trackballs, mice, joysticks, etc., which will not be described in detail here.

[0165] Furthermore, the touch panel 4071 can cover the display panel 4061. When the touch panel 4071 detects a touch operation on or near it, it transmits the information to the processor 410 to determine the type of touch event. Subsequently, the processor 410 provides corresponding visual output on the display panel 4061 based on the type of touch event. Although in Figure 4 In this embodiment, the touch panel 4071 and the display panel 4061 are two independent components to realize the input and output functions of the electronic device. However, in some embodiments, the touch panel 4071 and the display panel 4061 can be integrated to realize the input and output functions of the electronic device. The specific implementation is not limited here.

[0166] Interface unit 408 serves as an interface for connecting external devices to electronic device 400. For example, external devices may include a wired or wireless headphone port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device with an identification module, an audio input / output (I / O) port, a video I / O port, a headphone port, and so on. Interface unit 408 can be used to receive input from external devices (e.g., data, power, etc.) and transmit the received input to one or more components within electronic device 400, or it can be used to transmit data between electronic device 400 and external devices.

[0167] The memory 409 can be used to store software programs and various data. The memory 409 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, applications required for at least one function (such as sound playback, image playback, etc.), etc.; the data storage area may store data created based on the use of the mobile phone (such as audio data, phonebook, etc.). Furthermore, the memory 409 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0168] The processor 410 is the control center of the electronic device. It connects various parts of the electronic device via various interfaces and lines. By running or executing software programs and / or modules stored in the memory 409, and by calling data stored in the memory 409, it performs various functions and processes data, thereby providing overall monitoring of the electronic device. The processor 410 may include one or more processing units; preferably, the processor 410 may integrate an application processor and a modem processor. The application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into the processor 410.

[0169] The electronic device 400 may also include a power supply 411 (such as a battery) for supplying power to various components. Preferably, the power supply 411 can be logically connected to the processor 410 through a power management system, thereby enabling functions such as managing charging, discharging, and power consumption through the power management system.

[0170] In addition, the electronic device 400 includes some functional modules not shown, which will not be described in detail here.

[0171] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0172] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0173] like Figure 5 As shown, in another embodiment of the present invention, a computer-readable storage medium 501 is also provided, which stores instructions that, when executed on a computer, cause the computer to perform the printed circuit board soldering method described in the above embodiments.

[0174] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

[0175] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed in this invention can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0176] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0177] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0178] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0179] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0180] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, essentially, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0181] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for soldering printed circuit boards, characterized in that, An apparatus for soldering printed circuit boards, the apparatus being used for soldering printed circuit boards having corresponding first and second components, comprising: Obtain the first pad spacing and the first pad size for the first device; Obtain the second pad spacing and the second pad size for the second device; When the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, then the first device and the second device are stacked. The first device and the second device, which are stacked together, are soldered to the printed circuit board.

2. The method according to claim 1, characterized in that, Also includes: When the first device is a chip, and the second device is a resistor-capacitor component, and the chip pin corresponding to the chip is configured on the physical epitaxial layer of the chip, the third pad spacing for the chip pin corresponding to the chip is obtained. When the second pad spacing and the third pad spacing are equal, the resistor-capacitor components and the chip pins are stacked.

3. The method according to claim 1, characterized in that, The printed circuit board is configured with a corresponding first fixture, the first device has a corresponding first pin, and the second device has a corresponding second pin. The step of stacking the first device, the second device, and the third device includes: The first device is fixed using the first fixture; The first device and the second device are stacked based on the first pin and the second pin; The step of soldering the stacked first device and the second device to the printed circuit board includes: A steel mesh is laid above the first pipe foot, and the first pipe foot is coated with a first welding material; The first device and the second device are reflow soldered to generate a first stacked device; The first stacked device and the printed circuit board are reflow soldered using a second soldering material.

4. The method according to claim 3, characterized in that, The printed circuit board is configured with a corresponding second fixture, the first device has a corresponding first pin, the second device has a corresponding second pin, and further includes: When the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold, and the difference between the first pad size and the second pad size is not greater than a second preset difference, the first device and the printed circuit board are reflow soldered using a third soldering material to generate a second stacked device. The second stacked device is fixed using the second fixture; The second device and the second stacked device are stacked based on the first pin and the second pin using a fourth soldering material and then reflow soldered.

5. The method according to claim 3, characterized in that, The melting point of the first welding material is higher than that of the second welding material.

6. The method according to claim 4, characterized in that, The melting point of the third welding material is higher than that of the fourth welding material.

7. The method according to claim 4, characterized in that, The first fixture is an assembly fixture, and the second fixture is a partial steel mesh fixture.

8. The method according to claim 4, characterized in that, The first device is configured with a metal sheet, the metal sheet being fixedly connected to the first pin, and the step of stacking the first device and the second device based on the first pin and the second pin includes: The first device and the second device are stacked and fixedly connected by soldering the metal sheet and the second pin.

9. A printed circuit board soldering apparatus, characterized in that, An apparatus for soldering printed circuit boards, the apparatus being used for soldering printed circuit boards having corresponding first and second components, comprising: The first pad size acquisition module is used to acquire the first pad spacing and the first pad size for the first device; The second pad size acquisition module is used to acquire the second pad spacing and the second pad size for the second device; The device stacking module is used to stack the first device and the second device when the difference between the first pad spacing and the second pad spacing is not greater than a first preset threshold and the difference between the first pad size and the second pad size is not greater than a second preset difference. A printed circuit board soldering module for soldering the stacked first device and the second device to the printed circuit board.

10. An electronic device, characterized in that, It includes a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; The memory is used to store computer programs; When the processor executes a program stored in the memory, it implements the method as described in any one of claims 1-8.

11. A computer-readable storage medium having instructions stored thereon that, when executed by one or more processors, cause the processors to perform the method as described in any one of claims 1-8.

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