Chip eutectic soldering apparatus

Abstract

The application relates to the technical field of chip eutectic welding, in particular to a chip eutectic welding device which comprises a welding platform, the top of the welding platform is fixedly connected with a rotating base, the rotating base is rotationally connected with a rotating shaft in the inside, the bottom end of the rotating shaft penetrates through the welding platform and extends to the below of the welding platform and is connected with a driving rotating mechanism; in the application, the connecting arm is continuously rotated and paused along with the rotating shaft, workers place chips and radiating fins used for welding in the adjacent first placing groove and second placing groove along the rotating direction, when the chips and the radiating fins are contacted and welded, the next group of chips and radiating fins to be welded are synchronously preheated, the waiting time in the welding process is reduced, and the eutectic welding efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip eutectic welding, in particular to a chip eutectic welding device. BACKGROUND

[0002] Eutectic welding is also known as low-melting alloy welding. The basic characteristic of eutectic alloy is that two different metals can form an alloy at a certain weight ratio far below their respective melting points. The most commonly used eutectic welding in microelectronic devices is to weld silicon chips to gold-plated bases or lead frames, i.e. "gold-silicon eutectic welding".

[0003] The prior art discloses some patent documents related to chip eutectic welding process. The Chinese invention patent with application number CN202010328491.8 discloses a chip eutectic welding device. The device includes an optical platform, a welding stage, a suction nozzle position adjusting stage, a placing table, control buttons, a main controller and a welding power supply. The heating table carrier is arranged on the slide to adjust the position, and the rotating table is arranged on the heating table carrier to adjust the angle of the heat sink base plate. The heating table is connected with the heating table carrier through the heat insulation column, and the heating sheet and the welding template are arranged on the heating table to fix the position of the heat sink base plate, and the flow guide block is arranged thereon. The suction nozzle position adjusting stage adjusts the position of the suction nozzle through the three-axis displacement adjusting stage and the arc swing stage.

[0004] When the chip and the heat sink base plate are welded in the prior art, the chip and the heat sink base plate usually need to be preheated, so that the surface of the chip and the heat sink base plate is heated to a certain temperature, so as to ensure the welding effect of the chip and the heat sink base plate. In the process of eutectic welding, only a single chip and heat sink base plate can be welded, and after the chip and heat sink base plate are heated and welded, the next group of chip and heat sink base plate can be welded, thereby affecting the efficiency of eutectic welding. SUMMARY

[0005] The purpose of the present application is to solve the problems existing in the prior art and provide a chip eutectic welding device.

[0006] To achieve the above purpose, the technical scheme adopted by the present application is as follows: a chip eutectic welding device, comprising a welding platform, a rotating base is fixedly connected to the top of the welding platform, a rotating shaft is rotatably connected to the inside of the rotating base, and a driving rotating mechanism is connected to the bottom end of the rotating shaft which penetrates through the welding platform and extends below the welding platform.

[0007] The top end of the rotating shaft is fixedly connected with a connecting disc, the side surface of the connecting disc is fixedly connected with four connecting arms in a circumferential array, the upper and lower sides of one end of the connecting arm are fixedly connected with a first placing block and a second placing block respectively, the bottom of the first placing block is provided with a first placing groove, and the first placing block is connected with a lifting and adsorbing mechanism; the top of the second placing block is provided with a second placing groove penetrating to the bottom, and the bottom of the second placing block is connected with a movable supporting mechanism.

[0008] The welding platform is connected with a preheating mechanism and a support release mechanism. The support release mechanism releases the support of the movable support mechanism on the bottom of the second placing groove. In the prior art, the chip and the heat sink substrate are usually preheated before welding, so that the surface of the chip and the heat sink substrate is heated to a certain temperature, thereby ensuring the welding effect of the chip and the heat sink substrate. In the process of eutectic welding, only a single chip and heat sink substrate can be welded. After the chip and the heat sink substrate are heated and welded, the next group of chips and heat sink substrates can be welded, thereby affecting the efficiency of eutectic welding. The technical solution can solve the above problems, and the specific working mode is as follows: first, the chip and the heat sink for welding are respectively placed in the adjacent first placing groove and second placing groove. The first placing groove and the second placing groove limit the position of the chip and the heat sink. The suction mechanism positions the chip in the first placing groove. The movable support mechanism supports the heat sink in the second placing groove. The driving rotating mechanism drives the rotating shaft to rotate in the rotating base. The rotating shaft drives the connecting disc to rotate. The connecting disc drives the connecting arm to rotate, so that the chip in the first placing groove and the heat sink in the second placing groove rotate. When the chip and the heat sink rotate by 90 degrees, the driving rotating mechanism makes the rotating shaft stop rotating. At this time, the chip in the first placing groove and the heat sink in the second placing groove are heated by the preheating mechanism. After heating, the rotating shaft continues to rotate by 90 degrees and stops. Then, the chip in the first placing groove moves vertically downward under the action of the lifting suction mechanism, and contacts the top of the heat sink in the second placing groove. Then, the contact position of the heat sink and the chip is eutectic welded. Then, the lifting suction mechanism releases the suction positioning of the chip. The rotating shaft continues to rotate by 90 degrees and stops. After welding, the heat sink and the chip move with the position of the second placing groove, and the movable support mechanism releases the support of the second placing groove bottom under the action of the support release mechanism, so that the welded heat sink and chip are separated from the bottom of the second placing groove, thereby completing the welding process of the heat sink and the chip. During the process of the connecting arm rotating with the rotating shaft, the workers place the chips and heat sinks for welding in the adjacent first placing groove and second placing groove in sequence along the rotating direction. When the chip and the heat sink are in contact and welded, the next group of chips and heat sinks to be welded are preheated synchronously, thereby reducing the waiting time in the welding process and improving the efficiency of eutectic welding.

[0009] Preferably, the driving rotating mechanism comprises a first motor and a matching gear, the first motor is fixedly installed on the bottom of the welding platform, the matching gear is fixedly connected to the bottom end of the rotating shaft, a driving gear is fixedly connected to the output shaft of the first motor, and the driving gear is engaged with the matching gear; in operation, the first motor drives the driving gear to rotate, the driving gear drives the matching gear to rotate through engagement, and the matching gear drives the rotating shaft to rotate, thereby completing the driving rotation of the rotating shaft.

[0010] Preferably, the lifting and adsorbing mechanism comprises a suction disc groove, a vacuum suction disc and a guide ring, the suction disc groove is arranged on the top surface of the first placing groove, the vacuum suction disc is located in the suction disc groove, a communication pipe is fixedly and communicatively connected to the top of the vacuum suction disc, an elastic hose is fixedly and communicatively connected to the top end of the communication pipe after extending above the first placing block, one end of the elastic hose is fixedly and communicatively connected to a vacuum pump, the vacuum pump is fixedly installed on the top of the adjacent connecting arm, an elastic rod is fixedly connected to the communication pipe, two first limiting pins are slidingly and telescopically arranged on the elastic rod, the first limiting pins are fixedly connected to the top of the first placing block, the guide ring is fixedly connected to the top of the welding platform, a guide groove is arranged on the side surface of the guide ring, the guide ring comprises a parallel section and a descending section, a U-shaped block is fixedly connected to the top of the elastic rod, a connecting pin is fixedly connected to one side of the U-shaped block, and one end of the connecting pin is located in the guide groove; in operation, when the chip is placed in the first placing groove, the chip is limited by the first placing groove, and negative pressure is generated by the vacuum pump, the vacuum pump is fixedly and communicatively connected to the vacuum suction disc through the elastic hose and the communication pipe, thereby adsorbing and fixing the chip, when the first placing block rotates with the rotating shaft, one end of the connecting pin moves along the guide groove, thereby limiting the vertical height of the vacuum suction disc, when the connecting pin moves from the parallel section to the descending section, the vertical height of the connecting pin changes, the U-shaped block moves downward, the elastic rod moves downward along the first limiting pin, the communication pipe drives the vacuum suction disc to move downward, the vacuum suction disc moves downward from the suction disc groove and drives the chip to move downward and contact the heat dissipation fin, thereby facilitating the eutectic welding of the chip and the heat dissipation fin, after the welding is completed, the corresponding vacuum pump is turned off, the adsorption of the vacuum suction disc to the welded chip is released, and the vacuum suction disc continues to act on the chip.

[0011] Preferably, the activity support mechanism comprises two supporting plates, both of which are located at both sides of the bottom of the second placing groove, two second limiting pins are slidingly inserted into the supporting plates, both of which are fixedly connected to the side of the second placing block, a spring is sleeved on the second limiting pin, and both ends of the spring are fixedly connected to the second limiting pin and the adjacent supporting plate.

[0012] Preferably, the support removal mechanism comprises two extrusion pins, both of which are fixedly connected to the top of the welding platform, when the second placing block is located at the top of the extrusion pins, the extrusion pins are located outside the corresponding two ends of the bottom of the second placing groove, and guide inclined surfaces are formed at both sides of the supporting plate; in operation, after the eutectic welding of the chip and the heat sink is completed, the second placing block continues to rotate and rotates to the top of the two extrusion pins, the extrusion pins and the guide inclined surfaces on one side of the adjacent supporting plate are in contact and extrusion, the supporting plate moves along the adjacent second limiting pin, and the spring is extruded, the supporting plate is extruded and separated from the bottom of the second placing groove, and after the chip and the heat sink welded are lost the support of the supporting plate, they fall from below the second placing groove.

[0013] Preferably, a first arc-shaped groove is formed in the top of the welding platform, a second arc-shaped groove is formed in the bottom surface of the first arc-shaped groove, a rotating ring is rotatably connected to the inside of the first arc-shaped groove, an outer gear ring is fixedly connected to the bottom of the rotating ring, the outer gear ring is located in the second arc-shaped groove, a second motor is fixedly installed on the side of the welding platform, a connecting gear is fixedly connected to the output shaft of the second motor, the connecting gear is engaged with the outer gear ring, and the two extrusion pins are located at the inner and outer sides of the top of the rotating ring; in operation, after the chip and the heat sink welded are lost the support of the supporting plate and fall from below the second placing groove, the welded chip and heat sink fall between the two extrusion pins to the top of the rotating ring, the output shaft of the second motor drives the connecting gear to rotate, and the rotating ring is driven to rotate through the meshing action of the connecting gear and the outer gear ring, so that the welded chip and heat sink are separated from the bottom of the second placing block through the rotation of the rotating ring, and the workers can conveniently take and collect the welded chip and heat sink.

[0014] Preferably, the preheating mechanism comprises a filler block between the first placing block and the second placing block, two connecting rods are fixedly connected to one side of the filler block, one end of the connecting rod is fixedly connected to the top of the welding platform, a rectangular through hole is formed in the filler block, two rotating paddles are rotatably connected in the rectangular through hole, the two rotating paddles are arranged above and below, two heating pieces are fixedly installed in the rectangular through hole, an air inlet pipe is fixedly connected to one side of the filler block, an air outlet hole is formed in the other side of the filler block, and the air outlet hole is communicated with the rectangular through hole; when the first placing block and the second placing block are rotated to the upper and lower sides of the filler block, nitrogen gas inlet equipment is fixedly communicated with one end of the air inlet pipe, and the heating pieces are started, nitrogen gas moves to the inside of the rectangular through hole through the air inlet pipe, passes between the two rotating paddles, and the two rotating paddles rotate reversely under the action of the airflow, so that the nitrogen gas is disturbed in the direction of the chip and the heat sink under the guidance of the rotating paddles, the contact effect of the chip and the heat sink with the nitrogen gas is improved, the oxidation protection in the eutectic process is facilitated, and the inside of the rectangular through hole is heated through the heating pieces, so that the chip and the heat sink are preheated, part of the nitrogen gas is discharged along the air outlet hole when the nitrogen gas continuously enters the inside of the rectangular through hole, part of the heated air is discharged from the air outlet hole, the chip is prevented from being damaged due to overheating, and the damage of the chip caused by the excessively high preheating temperature is reduced.

[0015] Compared with the prior art, the present application has the following beneficial effects:

[0016] 1、During the process of the connecting arm rotating and pausing, the workers place the chips and heat sinks used for welding in the adjacent first placing groove and second placing groove along the rotating direction, when the chips and heat sinks contact and are welded, the next group of chips and heat sinks to be welded are preheated synchronously, the waiting time in the welding process is reduced, and the eutectic welding efficiency is improved.

[0017] 2、When the connecting pin moves from the parallel section to the descending section, the vertical height of the connecting pin changes, the U-shaped block is driven to move downward, the movable rod moves downward along the first limiting pin, so that the connecting pipe drives the vacuum chuck to move downward, the vacuum chuck moves downward from the chuck groove and drives the chip to descend and the heat sink to contact, so as to facilitate the eutectic welding of the chip and the heat sink, after the welding is completed, the corresponding vacuum pump is closed, and the adsorption effect of the vacuum chuck on the welded chip is released, so as to prevent the vacuum chuck from continuing to act on the chip.

[0018] 3、When the chip and the heat sink are finished with the eutectic welding, the second placing block continues to rotate and rotates to the top of the two extrusion pins, and the extrusion pins and the guide inclined surface on one side of the adjacent supporting plate are in contact and extrusion, so that the supporting plate moves along the adjacent second limiting pin and extrudes the spring, the supporting plate is extruded and separated from the bottom of the second placing groove, and the chip and the heat sink finished with the welding lose the support of the supporting plate and fall from below the second placing groove.

[0019] 4、The output shaft of the second motor drives the connecting gear to rotate, and the connecting gear and the outer gear ring are in meshing engagement to drive the rotating ring to rotate, so that the welded chip and the heat sink are separated from the bottom of the second placing block and rotate, and the staff can conveniently take and collect the welded chip and the heat sink.

[0020] 5、Nitrogen moves to the inside of the rectangular through hole through the gas inlet pipe and passes between the two rotating paddles, and the two rotating paddles rotate in opposite directions under the action of the gas flow, so that the nitrogen is disturbed in the direction of the chip and the heat sink under the guidance of the rotating paddles, improving the contact effect of the chip and the heat sink with the nitrogen, which is beneficial to the anti-oxidation protection in the eutectic process, and the inside of the rectangular through hole is heated by the heating sheet, so that the chip and the heat sink are preheated, and when the nitrogen continues to enter the inside of the rectangular through hole, part of the nitrogen is discharged along the exhaust hole, so that part of the heated air is discharged from the exhaust hole, preventing the chip from being damaged due to overheating and reducing the damage of the preheating temperature that is too high to the chip. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the first structure schematic view of the application;

[0022] Figure 2 It is the second structure schematic view of the application;

[0023] Figure 3 It is the first structure schematic view of the application; Figure 2

[0024] Figure 4 It is the first structure schematic view of the application; Figure 2

[0025] Figure 5 It is the first structure schematic view of the application; Figure 2

[0026] Figure 6 It is the third structure schematic view of the application;

[0027] Figure 7 It is the first structure schematic view of the application; Figure 6

[0028] Figure 8 ​​​​The first placement block, the second placement block and the filling block cooperation structure profile schematic view of the present application;

[0029] Figure 9 The second placement block, the supporting plate and the extrusion pin cooperation structure diagram of the present application.

[0030] In the figure: 1, welding platform; 2, rotating base; 3, rotating shaft; 4, connecting disc; 5, connecting arm; 6, first placement block; 7, second placement block; 8, first placement groove; 9, second placement groove; 10, first motor; 11, cooperation gear; 12, driving gear; 13, suction cup groove; 14, vacuum suction cup; 15, guide ring; 1501, parallel section; 1502, descending section; 16, communication pipe; 17, movable hose; 18, vacuum pump; 19, movable rod; 20, first limit pin; 21, guide groove; 22, U-shaped block; 23, connecting pin; 24, supporting plate; 25, second limit pin; 26, spring; 27, extrusion pin; 28, first arc-shaped groove; 29, second arc-shaped groove; 30, rotating ring; 31, outer gear ring; 32, second motor; 33, connecting gear; 34, filling block; 35, connecting rod; 36, rectangular through hole; 37, rotating paddle; 38, heating sheet; 39, air inlet pipe; 40, exhaust hole. DETAILED DESCRIPTION

[0031] The following description is used to disclose the present application so that those skilled in the art can implement the present application. The preferred embodiments in the following description are only as examples, and other obvious modifications can be thought of by those skilled in the art.

[0032] As Figures 1 to 9 shown in a kind of chip eutectic welding equipment, including welding platform 1, the top of welding platform 1 is fixedly connected with rotating base 2, rotating base 2 is rotatably connected with rotating shaft 3 in the inside, the bottom of rotating shaft 3 penetrates welding platform 1 and extends to the below of welding platform 1 and is connected with driving rotation mechanism after;

[0033] The top of rotating shaft 3 is fixedly connected with connecting disc 4, four connecting arms 5 are fixedly connected with the side of connecting disc 4 in circle array, the upper and lower sides of one end of connecting arm 5 are fixedly connected with first placement block 6 and second placement block 7 respectively, the bottom of first placement block 6 is provided with first placement groove 8, and lifting suction mechanism is connected to first placement block 6;The top of second placement block 7 is provided with second placement groove 9 penetrating to the bottom, and movable support mechanism is connected to the bottom of second placement block 7;

[0034] The welding platform 1 is connected with a preheating mechanism and a support releasing mechanism. The support releasing mechanism releases the support of the movable support mechanism on the bottom of the second placing groove 9. In the prior art, the chip and the heat sink substrate are usually preheated before welding, so that the surface of the chip and the heat sink substrate is heated to a certain temperature, thereby ensuring the welding effect of the chip and the heat sink substrate. In the process of eutectic welding, only a single chip and heat sink substrate can be welded. After the chip and the heat sink substrate are heated and welded, the next group of chips and heat sink substrates can be welded, thereby affecting the efficiency of eutectic welding. The technical solution can solve the above problems, and the specific working mode is as follows: first, the chip and the heat sink for welding are respectively placed in the adjacent first placing groove 8 and second placing groove 9. The first placing groove 8 and the second placing groove 9 limit the position of the chip and the heat sink. The suction mechanism positions the chip in the first placing groove 8. The movable support mechanism supports the heat sink in the second placing groove 9. The driving rotating mechanism drives the rotating shaft 3 to rotate in the rotating base 2. The rotating shaft 3 drives the connecting disc 4 to rotate, and the connecting arm 5 rotates, so that the chip in the first placing groove 8 and the heat sink in the second placing groove 9 rotate. When the chip and the heat sink are rotated by ninety degrees, the driving rotating mechanism makes the rotating shaft 3 stop rotating. At this time, the chip in the first placing groove 8 and the heat sink in the second placing groove 9 are heated by the preheating mechanism. After heating, the rotating shaft 3 continues to rotate by ninety degrees and stops. Then, the chip in the first placing groove 8 moves vertically downward and contacts the top of the heat sink in the second placing groove 9 by the action of the lifting suction mechanism. Then, the contact position of the heat sink and the chip is eutectic welded. Then, the lifting suction mechanism releases the suction positioning of the chip. The rotating shaft 3 continues to rotate by ninety degrees and stops. After welding, the heat sink and the chip move with the second placing groove 9 and stop. The movable support mechanism releases the support of the second placing groove 9 on the bottom by the action of the support releasing mechanism, so that the welded heat sink and chip are separated from the bottom of the second placing groove 9, thereby completing the welding process of the heat sink and the chip. During the process of the rotating shaft 3 rotating and stopping, the workers place the chips and heat sinks for welding in the adjacent first placing groove 8 and second placing groove 9 along the rotating direction. When the chip and the heat sink are in contact and welded, the next group of chips and heat sinks to be welded are preheated synchronously, thereby reducing the waiting time in the welding process and improving the efficiency of eutectic welding.

[0035] As a further implementation of the present application, the driving rotating mechanism comprises a first motor 10 and a matching gear 11, the first motor 10 is fixedly installed on the bottom of the welding platform 1, the matching gear 11 is fixedly connected to the bottom end of the rotating shaft 3, a driving gear 12 is fixedly connected to the output shaft of the first motor 10, and the driving gear 12 is engaged with the matching gear 11; in operation, the first motor 10 drives the driving gear 12 to rotate, the driving gear 12 drives the matching gear 11 to rotate through the engagement, and the matching gear 11 drives the rotating shaft 3 to rotate, thereby completing the driving rotation of the rotating shaft 3.

[0036] As a further implementation of the present application, the lifting and adsorbing mechanism comprises a suction disc groove 13, a vacuum suction disc 14 and a guide ring 15, the suction disc groove 13 is formed on the top surface of the first placing groove 8, the vacuum suction disc 14 is located inside the suction disc groove 13, a communication pipe 16 is fixedly connected to the top of the vacuum suction disc 14, an active hose 17 is fixedly connected to the top end of the communication pipe 16 after extending to the upper side of the first placing block 6, one end of the active hose 17 is fixedly connected to a vacuum pump 18, the vacuum pump 18 is fixedly installed on the top of the adjacent connecting arm 5, an active rod 19 is fixedly connected to the communication pipe 16, two first limiting pins 20 are slidingly inserted into the active rod 19, the first limiting pins 20 are fixedly connected to the top of the first placing block 6, the guide ring 15 is fixedly connected to the top of the welding platform 1, a guide groove 21 is formed on the side surface of the guide ring 15, the guide ring 15 comprises a parallel section 1501 and a descending section 1502, a U-shaped block 22 is fixedly connected to the top of the active rod 19, a connecting pin 23 is fixedly connected to one side of the U-shaped block 22, and one end of the connecting pin 23 is located inside the guide groove 21; in operation, when the chip is placed inside the first placing groove 8, the chip is limited by the first placing groove 8, and the vacuum pump 18 generates negative pressure, the vacuum pump 18 is fixedly connected to the vacuum suction disc 14 through the active hose 17 and the communication pipe 16, thereby adsorbing and fixing the chip, when the first placing block 6 rotates with the rotating shaft 3, one end of the connecting pin 23 moves along the guide groove 21, thereby limiting the vertical height of the vacuum suction disc 14, when the connecting pin 23 moves from the parallel section 1501 to the descending section 1502, the vertical height of the connecting pin 23 changes, the U-shaped block 22 moves downward, the active rod 19 moves downward along the first limiting pin 20, the communication pipe 16 drives the vacuum suction disc 14 to move downward, the vacuum suction disc 14 moves downward from the suction disc groove 13 and drives the chip to move downward and contact the heat dissipation fin, thereby facilitating the eutectic welding of the chip and the heat dissipation fin, after the welding is completed, the corresponding vacuum pump 18 is closed, the adsorption of the vacuum suction disc 14 to the welded chip is released, and the vacuum suction disc 14 is prevented from continuing to act on the chip.

[0037] As a further implementation of the present application, the activity support mechanism comprises two supporting plates 24, which are respectively located on both sides of the bottom of the second placing groove 9, and two second limiting pins 25 are slidingly inserted into the supporting plates 24, the second limiting pins 25 are fixedly connected to the side of the second placing block 7, a spring 26 is sleeved on the second limiting pin 25, and the two ends of the spring 26 are fixedly connected to the adjacent supporting plate 24 and one end of the second limiting pin 25, respectively; during operation, when the heat dissipation fin is placed in the second placing groove 9, the bottom of the second placing groove 9 is supported by the two supporting plates 24 to prevent the heat dissipation fin from falling from the bottom of the second placing groove 9.

[0038] As a further implementation of the present application, the support release mechanism comprises two extrusion pins 27, which are fixedly connected to the top of the welding platform 1, when the second placing block 7 is located on the top of the extrusion pin 27, the extrusion pin 27 is located outside the corresponding two ends of the bottom of the second placing groove 9, and the two sides of the supporting plate 24 are provided with a guide slope; during operation, after the chip and the heat dissipation fin are eutectically welded, the second placing block 7 continues to rotate and rotates to the top of the two extrusion pins 27, the extrusion pin 27 and the guide slope on one side of the adjacent supporting plate 24 are in contact and extrusion, the supporting plate 24 moves along the adjacent second limiting pin 25, and the spring 26 is extruded, the supporting plate 24 is extruded and separated from the bottom of the second placing groove 9, and after the chip and the heat dissipation fin that are welded lose the support of the supporting plate 24, they fall from the bottom of the second placing groove 9.

[0039] As a further implementation of the present application, the top of the welding platform 1 is provided with a first arc-shaped groove 28, the bottom surface of the first arc-shaped groove 28 is provided with a second arc-shaped groove 29, a rotating ring 30 is rotatably connected to the inside of the first arc-shaped groove 28, the bottom of the rotating ring 30 is fixedly connected with an external gear ring 31, the external gear ring 31 is located in the inside of the second arc-shaped groove 29, a second motor 32 is fixedly installed on the side of the welding platform 1, a connecting gear 33 is fixedly connected to the output shaft of the second motor 32, the connecting gear 33 and the external gear ring 31 are in meshing engagement, and the two extrusion pins 27 are respectively located on the inside and outside of the top of the rotating ring 30; during operation, after the chip and the heat dissipation fin that are welded lose the support of the supporting plate 24 and fall from the bottom of the second placing groove 9, the welded chip and heat dissipation fin fall between the two extrusion pins 27 to the top of the rotating ring 30, the output shaft of the second motor 32 drives the connecting gear 33 to rotate, and the meshing action of the connecting gear 33 and the external gear ring 31 drives the rotating ring 30 to rotate, so that the welded chip and heat dissipation fin rotate away from the bottom of the second placing block 7 along with the rotation of the rotating ring 30, which facilitates the workers to take and collect the welded chip and heat dissipation fin.

[0040] As a further embodiment of the present application, the preheating mechanism comprises a filler block 34 located between the first placing block 6 and the second placing block 7, one side of the filler block 34 is fixedly connected with two connecting rods 35, one end of the connecting rod 35 is fixedly connected to the top of the welding platform 1, a rectangular through hole 36 is formed in the filler block 34, two rotating paddles 37 are rotatably connected inside the rectangular through hole 36, the two rotating paddles 37 are arranged in an up-down manner, two heating fins 38 are fixedly installed inside the rectangular through hole 36, an air inlet pipe 39 is fixedly communicated with one side of the filler block 34, an air exhaust hole 40 is formed in the other side of the filler block 34, and the air exhaust hole 40 is communicated with the rectangular through hole 36; in operation, when the first placing block 6 and the second placing block 7 are rotated to the upper and lower sides of the filler block 34, nitrogen gas is introduced into the air inlet pipe 39 by fixedly connecting a nitrogen gas inlet device to one end of the air inlet pipe 39, and the heating fins 38 are started, the nitrogen gas moves to the inside of the rectangular through hole 36 through the air inlet pipe 39 and passes between the two rotating paddles 37, the two rotating paddles 37 are reversely rotated under the action of the airflow, the nitrogen gas is disturbed in the direction of the chip and the heat sink under the guidance of the rotating paddles 37, the contact effect of the chip and the heat sink with the nitrogen gas is improved, which is beneficial to the anti-oxidation protection in the eutectic process, and the inside of the rectangular through hole 36 is heated by the heating fins 38, so that the chip and the heat sink are preheated, when the nitrogen gas continuously enters the inside of the rectangular through hole 36, part of the nitrogen gas is discharged along the air exhaust hole 40, so that part of the heated air is discharged from the air exhaust hole 40, preventing the chip from being damaged due to overheating, and reducing the damage of the preheating temperature that is too high to the chip.

[0041] The working principle of the present application is as follows:

[0042] First, the chip and the heat sink for welding are respectively placed in the adjacent first placing groove 8 and the second placing groove 9, the position of the chip and the heat sink is limited through the first placing groove 8 and the second placing groove 9, the chip in the first placing groove 8 is adsorbed and positioned through the adsorption mechanism, the heat sink in the second placing groove 9 is supported through the movable supporting mechanism, the rotating shaft 3 is driven to rotate in the inside of the rotating base 2 through the action of the driving rotating mechanism, the rotating shaft 3 drives the connecting disc 4 to rotate, the connecting disc 4 drives the connecting arm 5 to rotate, so that the chip in the first placing groove 8 and the heat sink in the second placing groove 9 are rotated, when the chip and the heat sink are rotated by ninety degrees, the rotating shaft 3 is paused through the driving rotating mechanism, at this time, the chip in the first placing groove 8 and the heat sink in the second placing groove 9 are heated through the preheating mechanism, after heating is completed, the rotating shaft 3 continues to rotate by ninety degrees and pause, then the chip in the first placing groove 8 is moved vertically downward through the action of the lifting adsorption mechanism, and the top of the heat sink in the second placing groove 9 is contacted, then the contact position of the heat sink and the chip is eutectic welded, then the adsorption positioning of the chip by the lifting adsorption mechanism is released, the rotating shaft 3 continues to rotate by ninety degrees and pause, the heat sink and the chip after welding are paused along with the position movement of the second placing groove 9, and the supporting action of the movable supporting mechanism on the bottom of the second placing groove 9 is released through the action of the supporting release mechanism, so that the welded heat sink and chip are separated from the bottom of the second placing groove 9, so that the welding process of the heat sink and the chip is completed, in the process of the connecting arm 5 rotating and pausing along with the rotating shaft 3, the staff places the chip and the heat sink for welding in the adjacent first placing groove 8 and second placing groove 9 in sequence along the rotating direction, when the chip and the heat sink are contacted and welded, the next group of chips and heat sinks to be welded are preheated synchronously, so that the waiting time in the welding process is reduced, and the efficiency of eutectic welding is improved.

[0043] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A chip eutectic soldering apparatus comprising a soldering platform (1), characterized in that, The top of the welding platform (1) is fixedly connected with a rotating base (2), the inside of the rotating base (2) is rotationally connected with a rotating shaft (3), the bottom end of the rotating shaft (3) penetrates through the welding platform (1) and extends below the welding platform (1) and is connected with a driving rotating mechanism; The top end of the rotating shaft (3) is fixedly connected with a connecting disc (4), the side of the connecting disc (4) is fixedly connected with four connecting arms (5) in a circumferential array, the upper and lower sides of one end of the connecting arm (5) are fixedly connected with a first placing block (6) and a second placing block (7) respectively, the bottom of the first placing block (6) is provided with a first placing groove (8), and the first placing block (6) is connected with a lifting and adsorbing mechanism; the top of the second placing block (7) is provided with a second placing groove (9) penetrating to the bottom, and the bottom of the second placing block (7) is connected with a movable supporting mechanism; The welding platform (1) is connected with a preheating mechanism and a supporting releasing mechanism, the movable supporting mechanism releases the supporting effect on the bottom of the second placing groove (9) through the action of the supporting releasing mechanism; The lifting and adsorbing mechanism comprises a suction disc groove (13), a vacuum suction disc (14) and a guide ring (15), the suction disc groove (13) is provided on the top surface of the first placing groove (8), the vacuum suction disc (14) is located in the inside of the suction disc groove (13), the top of the vacuum suction disc (14) is fixedly connected with a communicating pipe (16), the top end of the communicating pipe (16) penetrates through the first placing block (6) and extends above the first placing block (6) and is fixedly connected with a movable hose (17), one end of the movable hose (17) is fixedly connected with a vacuum pump (18), the vacuum pump (18) is fixedly installed on the top of the adjacent connecting arm (5), the communicating pipe (16) is fixedly connected with a movable rod (19), two first limiting pins (20) are slidingly inserted on the movable rod (19), the first limiting pins (20) are fixedly connected on the top of the first placing block (6), the guide ring (15) is fixedly connected on the top of the welding platform (1), the side of the guide ring (15) is provided with a guide groove (21), the guide ring (15) comprises a parallel section (1501) and a descending section (1502), the top of the movable rod (19) is fixedly connected with a U-shaped block (22), one side of the U-shaped block (22) is fixedly connected with a connecting pin (23), and one end of the connecting pin (23) is located in the inside of the guide groove (21).

2. A die-bonding apparatus according to claim 1, wherein The driving rotating mechanism comprises a first motor (10) and a matching gear (11), the first motor (10) is fixedly installed on the bottom of the welding platform (1), the matching gear (11) is fixedly connected on the bottom end of the rotating shaft (3), the output shaft of the first motor (10) is fixedly connected with a driving gear (12), and the driving gear (12) and the matching gear (11) are engaged.

3. The apparatus of claim 1, wherein the apparatus is configured to perform a flip-chip soldering process. The active support mechanism comprises two supporting plates (24), which are respectively located at two sides of the bottom of the second placing groove (9), two second limiting pins (25) are slidingly inserted into the supporting plates (24), the second limiting pins (25) are fixedly connected to the side surface of the second placing block (7), springs (26) are sleeved on the second limiting pins (25), and two ends of the springs (26) are fixedly connected to the adjacent supporting plates (24) and one end of the second limiting pins (25) respectively.

4. The apparatus according to claim 3, wherein The support release mechanism comprises two extrusion pins (27), which are fixedly connected to the top of the welding platform (1), when the second placing block (7) is located at the top of the extrusion pins (27), the extrusion pins (27) are located outside the corresponding two ends of the bottom of the second placing groove (9), and guide inclined surfaces are formed in the two sides of the supporting plates (24).

5. A die-bonding apparatus according to claim 4, wherein The top of the welding platform (1) is provided with a first arc-shaped groove (28), a second arc-shaped groove (29) is formed in the bottom surface of the first arc-shaped groove (28), a rotating ring (30) is rotatably connected to the inside of the first arc-shaped groove (28), an external gear ring (31) is fixedly connected to the bottom of the rotating ring (30), the external gear ring (31) is located in the second arc-shaped groove (29), a second motor (32) is fixedly installed on the side surface of the welding platform (1), a connecting gear (33) is fixedly connected to the output shaft of the second motor (32), the connecting gear (33) is engaged with the external gear ring (31), and the two extrusion pins (27) are located at the inner and outer sides of the top of the rotating ring (30) respectively.

6. The apparatus of claim 1, wherein the apparatus is configured to perform a flip-chip soldering process. The preheating mechanism comprises a filling block (34), which is located between the first placing block (6) and the second placing block (7), two connecting rods (35) are fixedly connected to one side of the filling block (34), one end of the connecting rod (35) is fixedly connected to the top of the welding platform (1), a rectangular through hole (36) is formed in the filling block (34), two rotating paddles (37) are rotatably connected to the inside of the rectangular through hole (36), the two rotating paddles (37) are arranged in an up-down mode, two heating fins (38) are fixedly installed in the inside of the rectangular through hole (36), an air inlet pipe (39) is fixedly connected to one side of the filling block (34), an air outlet hole (40) is formed in the other side of the filling block (34), and the air outlet hole (40) is communicated with the rectangular through hole (36).

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