A die-cutting method and die-cutting equipment

Abstract

This application discloses a die-cutting method and die-cutting equipment, relating to the field of die-cutting technology. The method includes: bonding a material to be processed to a first strip using a first laminating machine; die-cutting the first strip using a die-cutting machine; rerouting the first strip using a second laminating machine; receiving the rerouted first strip using the first laminating machine and using it as a second strip; guiding the second strip using the first laminating machine; performing a die-cutting process on the second strip using the die-cutting machine; and collecting the second strip using the second laminating machine. This application can reduce the number of die-cutting machines required and lower production costs.

Description

Technical Field

[0001] This application relates to the field of die-cutting technology, and in particular to a die-cutting method and die-cutting equipment. Background Technology

[0002] In related technologies, with economic development, electronic products have entered millions of households. In the manufacturing process of electronic products, die-cutting is sometimes required to manufacture certain components. For example, in the manufacturing of waterproof membranes for headphones, die-cutting machines are needed. However, current die-cutting methods allow one die-cutting machine to perform only one die-cutting process. If there are multiple die-cutting processes, each process requires its own dedicated die-cutting machine, which increases manufacturing costs. Therefore, reducing the production cost of the die-cutting process has become an urgent technical problem to be solved. Summary of the Invention

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a die-cutting method and die-cutting equipment that can reduce the number of die-cutting machines required and lower production costs.

[0004] The die-cutting method according to a first aspect of this application is applied to a die-cutting device, the die-cutting device comprising:

[0005] First composite machine;

[0006] Die-cutting machine;

[0007] Second composite machine;

[0008] The first laminating machine, the die-cutting machine, and the second laminating machine are arranged in sequence.

[0009] The die-cutting method includes:

[0010] The first material strip is obtained by bonding the material to be processed using the first composite machine;

[0011] The first strip is die-cut using the die-cutting machine;

[0012] The first material strip is routed through the second composite machine;

[0013] The first composite machine receives the first material strip after a detour and uses the first material strip as the second material strip;

[0014] The second strip is guided by the first laminating machine;

[0015] The second strip is cut using the die-cutting machine;

[0016] The second composite machine collects the second strip.

[0017] The die-cutting method according to the embodiments of this application has at least the following beneficial effects: First, a first strip is obtained by bonding the material to be processed using a first laminating machine; second, the first strip is die-cut using a die-cutting machine; third, the first strip is rerouted using a second laminating machine; fourth, the rerouted first strip is received by the first laminating machine and used as a second strip; fifth, the second strip is guided by the first laminating machine; sixth, the second strip is cut using a die-cutting machine; and seventh, the second strip is collected by the second laminating machine. The die-cutting method of this application, by rerouted the first strip processed once as a second strip for further processing, enables two different processing steps to be performed on the same die-cutting machine, thereby reducing the number of die-cutting machines on the same production line and lowering production costs. Therefore, the die-cutting method of this application can reduce the number of die-cutting machines required and lower production costs.

[0018] According to some embodiments of this application, the material to be processed includes a base film, a release film, a foam film, and foam adhesive. The base film is disposed on the first feeding roller of the first laminating machine, the release film is disposed on the second feeding roller of the first laminating machine, the foam film is disposed on the third feeding roller of the first laminating machine, and the foam adhesive is disposed on the fourth feeding roller of the first laminating machine; the first laminating machine is provided with a bonding mechanism.

[0019] The process of bonding the material to be processed through the first laminating machine to obtain the first strip includes:

[0020] The first material strip is obtained by sequentially bonding the base film, the release film, the foam film, and the foam adhesive through the bonding mechanism.

[0021] According to some embodiments of this application, the die-cutting machine is provided with a first mold;

[0022] The process of die-cutting the first strip using the die-cutting machine includes:

[0023] The first strip is die-cut and punched using the first mold.

[0024] According to some embodiments of this application, the die-cutting machine is provided with a second mold;

[0025] The process of cutting the second strip using the die-cutting machine includes:

[0026] The second strip is cut and pinned using the second mold.

[0027] According to some embodiments of this application, the second composite machine is provided with a first detour mechanism;

[0028] The step of detouring the first material strip through the second composite machine includes:

[0029] The first material strip is detoured by the first detour mechanism.

[0030] According to some embodiments of this application, the first composite machine is provided with a second detour mechanism;

[0031] The step of guiding the second strip through the first laminating machine includes:

[0032] The second detour mechanism is used to detour and guide the second material strip.

[0033] According to some embodiments of this application, the second composite machine is provided with a first receiving roller, a second receiving roller, a third receiving roller, and a fourth discharging roller, wherein the fourth discharging roller is provided with a shim strip;

[0034] The step of collecting the second strip using the second laminating machine includes:

[0035] The waste material of the bottom film after processing is collected by the first receiving roller;

[0036] The processed foam adhesive waste is collected by the second receiving roller;

[0037] The finished product obtained after the waste material is collected by the third receiving roller, and the shim strip of the fourth discharging roller is attached to the finished product.

[0038] A die-cutting apparatus according to a second aspect of this application is used to implement the die-cutting method as described in the first aspect embodiment, the die-cutting apparatus comprising:

[0039] The first laminating machine is used to bond the material to be processed to obtain the first material strip; it is also used to detour and guide the second material strip obtained through the first material strip.

[0040] A die-cutting machine is used to die-cut the first strip and to cut the second strip.

[0041] The second composite machine is used to detour the first material strip and collect the second material strip;

[0042] The first laminating machine, the die-cutting machine, and the second laminating machine are arranged in sequence.

[0043] According to some embodiments of this application, the material to be processed includes a base film, a release film, a foam film, and foam adhesive. The base film is disposed on the first feeding roller of the first laminating machine, the release film is disposed on the second feeding roller of the first laminating machine, the foam film is disposed on the third feeding roller of the first laminating machine, and the foam adhesive is disposed on the fourth feeding roller of the first laminating machine. The first laminating machine is provided with a bonding mechanism for bonding the base film, the release film, the foam film, and the foam adhesive to obtain the first material strip.

[0044] The first composite machine is equipped with a second detour mechanism, which is used to detour and guide the second material strip.

[0045] The second composite machine is equipped with a first detour mechanism, which is used to detour the first material strip.

[0046] According to some embodiments of this application, the die-cutting machine is provided with a first mold and a second mold. The first mold is used to die-cut and punch holes in the first strip, and the second mold is used to cut and pin holes in the second strip.

[0047] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0048] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0049] Figure 1 This is a schematic flowchart of the die-cutting method provided in the embodiments of this application;

[0050] Figure 2 This is a schematic diagram of the structure of the die-cutting equipment provided in the embodiments of this application;

[0051] Figure 3 This is a schematic diagram of the structure of the first mold and the second mold provided in the embodiments of this application.

[0052] Figure label:

[0053] First compounding machine 100, first feeding roller 110, second feeding roller 120, third feeding roller 130, fourth feeding roller 140, second detour mechanism 150;

[0054] Die-cutting machine 200, first mold 210, second mold 220;

[0055] The second composite machine 300, the first take-up roller 310, the second take-up roller 320, the third take-up roller 330, the fourth discharge roller 340, and the first detour mechanism 350;

[0056] First strip 400;

[0057] The second material belt is 500. Detailed Implementation

[0058] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0059] It should be noted that although functional modules are divided in the system diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the system or the order in the flowchart. The terminology in the specification, claims, and the foregoing figures is used to distinguish similar objects and is not necessarily used to describe a specific order or sequence.

[0060] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0061] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0062] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0063] Below, according to Figure 1-3 This application describes a die-cutting method and die-cutting equipment according to embodiments of the present application.

[0064] It is understandable that, such as Figure 1 and Figure 2As shown, a die-cutting method is provided, applied to a die-cutting equipment, which includes:

[0065] First composite machine 100;

[0066] Die-cutting machine 200;

[0067] Second composite machine 300;

[0068] The first laminating machine 100, the die-cutting machine 200, and the second laminating machine 300 are arranged in sequence;

[0069] Die-cutting methods include:

[0070] The material to be processed is bonded together by the first composite machine 100 to obtain the first strip 400;

[0071] The first strip 400 is die-cut by the die-cutting machine 200;

[0072] The second composite machine 300 detours the first material belt 400;

[0073] The first composite machine 100 receives the detour first material belt 400 and uses the first material belt 400 as the second material belt 500;

[0074] The second material belt 500 is guided by the first composite machine 100;

[0075] The second strip 500 is cut using a die-cutting machine 200;

[0076] The second composite machine 300 collects the material from the second material belt 500.

[0077] The first step involves bonding the material to be processed to a first strip 400 using a first laminating machine 100. The second step involves die-cutting the first strip 400 using a die-cutting machine 200. The third step involves rerouting the first strip 400 using a second laminating machine 300. The fourth step involves receiving the rerouted first strip 400 using the first laminating machine 100 and using it as the second strip 500. The fifth step involves guiding the second strip 500 using the first laminating machine 100. The sixth step involves cutting the second strip 500 using the die-cutting machine 200. The seventh step involves collecting the second strip 500 using the second laminating machine 300. This die-cutting method, by rerouting the first strip 400 (processed once) into the second strip 500 for further processing, allows for two different processing steps to be performed on the same die-cutting machine 200. This reduces the number of die-cutting machines required on the production line, thus lowering production costs. Therefore, the die-cutting method of this application can reduce the number of die-cutting machines 200 and reduce production costs.

[0078] It is understandable that, such as Figure 2As shown, the materials to be processed include a base film, a release film, a foam film, and foam adhesive. The base film is disposed on the first feeding roller 110 of the first laminating machine 100, the release film is disposed on the second feeding roller 120 of the first laminating machine 100, the foam film is disposed on the third feeding roller 130 of the first laminating machine 100, and the foam adhesive is disposed on the fourth feeding roller 140 of the first laminating machine 100; the first laminating machine 100 is provided with a bonding mechanism;

[0079] The material to be processed is bonded together by the first laminating machine 100 to obtain the first strip 400, which includes:

[0080] The first material strip 400 is obtained by sequentially bonding the base film, release film, foam film and foam adhesive through the bonding mechanism.

[0081] It should be noted that the materials to be processed can be configured as needed, and the foam film is used to hold the foam adhesive.

[0082] It is understandable that, such as Figure 3 As shown, the die-cutting machine 200 is equipped with a first mold 210;

[0083] The first strip 400 is die-cut by the die-cutting machine 200, including:

[0084] The first strip 400 is die-cut and punched using the first mold 210.

[0085] It should be noted that the structure of the first mold 210 can be adjusted and changed according to the needs of the process.

[0086] It is understandable that, such as Figure 3 As shown, the die-cutting machine 200 is equipped with a second mold 220;

[0087] The second strip 500 is cut using a die-cutting machine 200, including:

[0088] The second material strip 500 is cut and pinned using the second mold 220.

[0089] It should be noted that the structure of the second mold 220 can be adjusted and changed according to the needs of the process.

[0090] It is understandable that, such as Figure 2 As shown, the second composite machine 300 is equipped with a first detour mechanism 350;

[0091] The second composite machine 300 detours the first material belt 400, including:

[0092] The first detour mechanism 350 detours the first material belt 400.

[0093] By setting the first detour mechanism 350, the first material strip 400 after the first processing can be detoured for the second processing, thereby reducing the number of die-cutting machines 200 required.

[0094] It is understandable that, such as Figure 2 As shown, the first composite machine 100 is equipped with a second detour mechanism 150;

[0095] The second material belt 500 is guided by the first composite machine 100, including:

[0096] The second detour mechanism 150 detours and guides the second conveyor belt 500.

[0097] By setting the second detour mechanism 150, the first material belt 400 that has detoured through the first detour mechanism 350 can be received, and detoured and guided again, so that the first material belt 400, after becoming the second material belt 500, can enter the first composite machine 100 from the set route.

[0098] It is understandable that, such as Figure 2 As shown, the second composite machine 300 is equipped with a first receiving roller 310, a second receiving roller 320, a third receiving roller 330, and a fourth discharging roller 340, with a shim placed on the fourth discharging roller 340;

[0099] The second composite machine 300 collects the second material belt 500, including:

[0100] The waste material of the bottom film after processing is collected by the first receiving roller 310;

[0101] The processed foam adhesive waste is collected by the second receiving roller 320;

[0102] The finished product obtained after the waste material is collected by the third receiving roller 330, and the padding strip of the fourth discharging roller 340 is attached to the finished product.

[0103] By setting the first receiving roller 310, the second receiving roller 320, and the third receiving roller 330, unwanted waste materials can be recycled. At the same time, the fourth discharging roller 340 is set to attach the padding strip to the finished product, thereby protecting the finished product.

[0104] It is understandable that, such as Figure 2 As shown, this application also provides a die-cutting device for implementing the die-cutting method of the above embodiments. The die-cutting device includes:

[0105] The first laminating machine 100 is used to bond the material to be processed to obtain the first material strip 400; it is also used to detour and guide the second material strip 500 obtained through the first material strip 400.

[0106] Die-cutting machine 200 is used to die-cut the first strip 400 and to cut the second strip 500.

[0107] The second composite machine 300 is used to detour the first material belt 400 and collect the second material belt 500;

[0108] The first laminating machine 100, the die-cutting machine 200, and the second laminating machine 300 are set up in sequence.

[0109] It is understandable that, such as Figure 2 As shown, the materials to be processed include a base film, a release film, a foam film, and foam adhesive. The base film is placed on the first feeding roller 110 of the first laminating machine 100, the release film is placed on the second feeding roller 120 of the first laminating machine 100, the foam film is placed on the third feeding roller 130 of the first laminating machine 100, and the foam adhesive is placed on the fourth feeding roller 140 of the first laminating machine 100. The first laminating machine 100 is provided with a bonding mechanism for bonding the base film, the release film, the foam film, and the foam adhesive to obtain a first material strip 400.

[0110] The first composite machine 100 is provided with a second detour mechanism 150, which is used to detour and guide the second material belt 500.

[0111] The second composite machine 300 is provided with a first detour mechanism 350, which is used to detour the first material belt 400.

[0112] It is understandable that, such as Figure 2 As shown, the die-cutting machine 200 is equipped with a first mold 210 and a second mold 220. The first mold 210 is used to die-cut and punch holes in the first strip 400, and the second mold 220 is used to cut and punch holes in the second strip 500.

[0113] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A die-cutting method, characterized in that, Applied to a die-cutting device, the die-cutting device includes: A first laminator; A die-cutting machine; A second laminator; The first laminator, the die-cutting machine, and the second laminator are arranged in sequence; The die-cutting method includes: Laminating a material to be processed through the first laminator to obtain a first strip; Die-cutting the first strip through the die-cutting machine; Detouring the first strip through the second laminator; Receiving the detoured first strip through the first laminator and taking the first strip as a second strip; Guiding the second strip through the first laminator; Nested cutting the second strip through the die-cutting machine; Collecting the second strip through the second laminator.

2. The die-cutting method according to claim 1, characterized in that, The material to be processed includes a base film, a release film, a foam adhesive film, and a foam rubber adhesive. The base film is arranged on the first unwinding roller of the first laminator, the release film is arranged on the second unwinding roller of the first laminator, the foam adhesive film is arranged on the third unwinding roller of the first laminator, and the foam rubber adhesive is arranged on the fourth unwinding roller of the first laminator; The first laminator is provided with a laminating mechanism; The process of laminating the material to be processed through the first laminator to obtain a first strip includes: Sequentially laminating the base film, the release film, the foam adhesive film, and the foam rubber adhesive through the laminating mechanism to obtain the first strip.

3. The die-cutting method according to claim 1, characterized in that, The die-cutting machine is provided with a first die; The process of die-cutting the first strip through the die-cutting machine includes: Die-cutting and punching the first strip through the first die.

4. The die-cutting method according to claim 3, characterized in that, The die-cutting machine is provided with a second die; The process of nested cutting the second strip through the die-cutting machine includes: Nested cutting and punching pin holes in the second strip through the second die.

5. The die-cutting method according to claim 1, characterized in that, The second laminator is provided with a first detouring mechanism; The process of detouring the first strip through the second laminator includes: Detouring the first strip through the first detouring mechanism.

6. The die-cutting method according to claim 1, characterized in that, The first laminator is provided with a second detouring mechanism; The process of guiding the second strip through the first laminator includes: Detouring and guiding the second strip through the second detouring mechanism.

7. The die-cutting method according to claim 2, characterized in that, The second laminator is provided with a first winding roller, a second winding roller, a third winding roller, and a fourth unwinding roller. A heightening strip is placed on the fourth unwinding roller; The process of collecting the second strip through the second laminator includes: Collecting the waste base film after processing through the first winding roller; Collecting the waste foam rubber adhesive after processing through the second winding roller; Collecting the finished product obtained after collecting the waste through the third winding roller and laminating the heightening strip on the fourth unwinding roller to the finished product.

8. A die-cutting device, characterized in that, For implementing the die-cutting method as claimed in claim 1, the die-cutting device includes: A first laminator, for laminating a material to be processed to obtain a first strip; and also for detouring and guiding a second strip obtained from the first strip; A die-cutting machine, for die-cutting the first strip and nested cutting the second strip; A second laminator, for detouring the first strip and collecting the second strip; The first laminating machine, the die-cutting machine, and the second laminating machine are arranged in sequence.

9. The die-cutting equipment according to claim 8, characterized in that, The materials to be processed include a base film, a release film, a foam film, and foam adhesive. The base film is disposed on the first feeding roller of the first laminating machine, the release film is disposed on the second feeding roller of the first laminating machine, the foam film is disposed on the third feeding roller of the first laminating machine, and the foam adhesive is disposed on the fourth feeding roller of the first laminating machine. The first laminating machine is provided with a bonding mechanism for bonding the base film, the release film, the foam film, and the foam adhesive to obtain the first material strip. The first composite machine is equipped with a second detour mechanism, which is used to detour and guide the second material strip. The second composite machine is equipped with a first detour mechanism, which is used to detour the first material strip.

10. The die-cutting equipment according to claim 8, characterized in that, The die-cutting machine is equipped with a first mold and a second mold. The first mold is used to die-cut and punch holes in the first strip, and the second mold is used to cut and punch holes in the second strip.

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