A semiconductor wafer tray levelness adjustment holding system

Abstract

The present application relates to the technical field of semiconductor manufacturing, more particularly to a kind of semiconductor wafer tray levelness adjusting and retaining system.The semiconductor wafer tray levelness adjusting and retaining system provided by the present application includes horizontal screw adjusting mechanism as threaded column structure;Threaded fastening structure is arranged in the middle of wedge self-locking mechanism;Horizontal screw adjusting mechanism passes through the fixed tooling of semiconductor wafer tray and the mounting component of the bottom of semiconductor wafer tray in turn, and is connected with wedge self-locking mechanism by thread.The semiconductor wafer tray levelness adjusting and retaining system provided by the present application adopts screw adjusting mechanism and increases reading function, and is convenient and flexible to operate, with high adjustment precision.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically, to a semiconductor wafer tray leveling and holding system. Background Technology

[0002] Thin film deposition technology is used to manufacture thin films for microelectronic devices, forming deposits on a substrate. Common thin film deposition technologies include physical vapor deposition and chemical vapor deposition.

[0003] Most existing semiconductor coating equipment uses circular heating plates to heat wafers or other types of thin film substrates during the process. In addition, these heating plates also serve to support and position the wafers or other types of thin film substrates.

[0004] Semiconductor wafer trays or heating plates require leveling during use. Current leveling mechanisms for semiconductor wafer trays or heating plates have the following problems:

[0005] 1) It is usually adjusted by holding a wrench with both hands in a small space, which is very difficult to operate and has a poor user experience;

[0006] 2) Manual adjustment method: Generally speaking, the adjustment accuracy is not high, and it is impossible to read the value and quantify the adjustment;

[0007] 3) Existing adjustment mechanisms are prone to loosening, causing the wafer tray to drift horizontally.

[0008] Therefore, there is an urgent need for a system that can be used to adjust and maintain the level of semiconductor wafer trays, and more specifically, heating trays. Summary of the Invention

[0009] The purpose of this invention is to provide a semiconductor wafer tray leveling and holding system, which solves the problem that the existing semiconductor wafer tray leveling and holding systems are very difficult to operate.

[0010] Another objective of this invention is to provide a semiconductor wafer tray leveling and holding system that solves the problem of poor adjustment accuracy in existing semiconductor wafer tray leveling and holding systems.

[0011] Another objective of this invention is to provide a semiconductor wafer tray leveling and holding system that solves the problem of easy loosening in existing semiconductor wafer tray leveling and holding systems.

[0012] To achieve the above objectives, the present invention provides a semiconductor wafer tray leveling and holding system, comprising a leveling spiral adjustment mechanism and a wedge-shaped self-locking mechanism:

[0013] The horizontal spiral adjustment mechanism is a threaded columnar structure;

[0014] The wedge-shaped self-locking mechanism is provided with a threaded fastening structure in the middle;

[0015] The horizontal spiral adjustment mechanism passes sequentially through the fixing fixture of the semiconductor wafer tray and the mounting component at the bottom of the semiconductor wafer tray, and is then connected to the wedge-shaped self-locking mechanism via a thread.

[0016] In one embodiment, the horizontal helical adjustment mechanism includes a locking thread, a contact surface, and a transmission screw.

[0017] The locking thread is located at the top section of the transmission screw and is used to pass through the wedge-shaped self-locking mechanism and rotate to lock.

[0018] The contact surface is used to abut against the mounting components at the bottom of the semiconductor wafer tray;

[0019] The transmission screw has a fixed pitch transmission thread in the middle section, which is connected to the fixing fixture of the semiconductor wafer tray by the thread.

[0020] In one embodiment, a scale is provided on the outer periphery of the bottom section of the transmission screw to mark the adjustment amount.

[0021] In one embodiment, the wedge-shaped self-locking mechanism includes an anti-loosening nut, a wedge-shaped toothed disc spring, and a wedge-shaped toothed anti-loosening flat washer.

[0022] The wedge-shaped anti-loosening pad has a spiral wedge-shaped groove on the top.

[0023] The wedge-shaped tooth disc spring has several wedge-shaped teeth at its bottom, and these wedge-shaped teeth are arranged in a spiral pattern.

[0024] The anti-loosening nut, wedge-tooth disc spring, and wedge-tooth anti-loosening flat washer are installed in sequence, with the wedge-tooth disc spring's wedge-shaped teeth embedded in the spiral wedge-shaped groove of the wedge-tooth anti-loosening flat washer.

[0025] In one embodiment, the wedge-shaped anti-loosening pad has a spiral wedge-shaped anti-loosening tooth structure at its bottom, which contacts the mounting components at the bottom of the semiconductor wafer tray.

[0026] In one embodiment, the number of wedge teeth is no more than the number of spiral wedge grooves, and each wedge tooth is fitably matched with a corresponding spiral wedge groove.

[0027] In one embodiment, the semiconductor wafer tray leveling and holding system further includes a set screw anti-loosening structure:

[0028] The set screw anti-loosening structure is used to pass through the fixing fixture of the semiconductor wafer tray and abut against the side of the drive screw.

[0029] In one embodiment, the set screw anti-loosening structure includes a set screw and a knob disposed at the end of the set screw:

[0030] The knob is used to rotate the thread on the side of the set screw through the fixing fixture of the semiconductor wafer tray, so that one end of the set screw is pressed against the side of the drive screw.

[0031] In one embodiment, the horizontal spiral adjustment mechanism further includes a fine-tuning knob:

[0032] The fine-tuning knob includes a connecting knob, a spring, a first ratchet, a second ratchet, and a knob housing:

[0033] The connecting knob is connected to a transmission screw at one end and a connecting key at the other end;

[0034] The spring is disposed between the connecting knob and the first ratchet;

[0035] The first ratchet has a connecting groove on one end face to accommodate a connecting key;

[0036] The teeth of the first ratchet mesh with the teeth of the second ratchet;

[0037] The knob housing is connected and fixed to the second ratchet.

[0038] In one embodiment, the fine-tuning knob further includes a fastening screw:

[0039] The knob housing is fixed to the second ratchet by fastening screws.

[0040] In one embodiment, the horizontal spiral adjustment mechanism further includes a limiting block and a disc spring:

[0041] The connecting knob has one end as a cylinder with external threads, which is threaded to the transmission screw.

[0042] The limiting block is disposed between the bottom section of the transmission screw and the connecting knob;

[0043] The disc spring is positioned between the limiting block and the connecting knob.

[0044] In one embodiment, a first protrusion is provided on the surface of the knob housing;

[0045] The transmission screw surface is provided with a second protrusion.

[0046] The semiconductor wafer tray leveling and holding system provided by this invention adopts a screw adjustment mechanism and adds a reading function, which is convenient and flexible to operate and has high adjustment accuracy; it adopts a wedge self-locking mechanism to achieve self-locking, avoiding the problem of spontaneous loosening and slackness of the thread structure; it adopts a set screw anti-loosening structure to avoid the problem of horizontal position drift and improve the leveling and holding capability of the heating plate; and it adopts a fine adjustment knob to improve the contact surface fit. Attached Figure Description

[0047] The above and other features, properties and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings and embodiments, in which the same reference numerals always denote the same features, wherein:

[0048] Figure 1 A schematic diagram of a semiconductor wafer tray leveling and holding system according to an embodiment of the present invention is disclosed;

[0049] Figure 2 A schematic diagram of the installation of a semiconductor wafer tray leveling and holding system according to an embodiment of the present invention is disclosed;

[0050] Figure 3a A schematic diagram of a horizontal spiral adjustment mechanism according to an embodiment of the present invention is disclosed;

[0051] Figure 3b A schematic diagram of a set screw anti-loosening mechanism according to an embodiment of the present invention is disclosed;

[0052] Figure 3c A schematic diagram of a wedge-shaped self-locking mechanism according to an embodiment of the present invention is shown;

[0053] Figure 4 A cross-sectional view of a semiconductor wafer tray leveling and holding system according to an embodiment of the present invention is disclosed;

[0054] Figure 5a An external schematic diagram of a horizontal spiral adjustment mechanism according to an embodiment of the present invention is shown;

[0055] Figure 5b An internal schematic diagram of a horizontal spiral adjustment mechanism according to an embodiment of the present invention is disclosed;

[0056] Figure 6 A partial schematic diagram of a fine-tuning knob according to an embodiment of the present invention is shown;

[0057] Figure 7 A connection diagram of the fine-tuning knob according to an embodiment of the present invention is disclosed.

[0058] Figure 8a A schematic diagram of the springback state according to an embodiment of the present invention is disclosed;

[0059] Figure 8b A schematic diagram of the contact state according to an embodiment of the present invention is disclosed;

[0060] Figure 9 A front view of a wedge-shaped self-locking mechanism according to an embodiment of the present invention is disclosed;

[0061] Figure 10a A schematic diagram of a locking nut according to an embodiment of the present invention is disclosed;

[0062] Figure 10b A schematic diagram of a wedge-shaped toothed disc spring according to an embodiment of the present invention is disclosed;

[0063] Figure 10c A schematic diagram of a wedge-shaped toothed anti-loosening pad according to an embodiment of the present invention is disclosed;

[0064] Figure 11 An installation schematic diagram of a set screw anti-loosening mechanism according to an embodiment of the present invention is disclosed;

[0065] Figure 12 A schematic diagram of the initial state of a semiconductor wafer tray leveling and holding system according to an embodiment of the present invention is disclosed;

[0066] Figure 13 A schematic diagram of the adjustment function of a semiconductor wafer tray leveling and holding system according to an embodiment of the present invention is disclosed.

[0067] The meanings of the labels in the figures are as follows:

[0068] 1. Horizontal screw adjustment mechanism;

[0069] 11. Locking thread;

[0070] 12 contact surfaces;

[0071] 13. Transmission screw;

[0072] 131 Second protrusion;

[0073] 14. Ruler;

[0074] 15 limit blocks;

[0075] 16 disc springs;

[0076] 17 fine-tuning knobs;

[0077] 171 Connect the knob;

[0078] 1711 cylinder;

[0079] 172 springs;

[0080] 173 First ratchet;

[0081] 174 Second ratchet;

[0082] 175 fastening screw;

[0083] 176 knobs;

[0084] 177 Connect key;

[0085] 178 connecting slots;

[0086] 179 First protrusion;

[0087] 2. Wedge-shaped self-locking mechanism;

[0088] 21. Anti-loosening nuts;

[0089] 22 wedge-shaped disc springs;

[0090] 23 wedge-shaped anti-loosening pads;

[0091] 3. Set screw anti-loosening mechanism;

[0092] 31 set screw;

[0093] 32 knobs

[0094] 33 thread;

[0095] 4. Fixed fixtures;

[0096] 5. Installation components. Detailed Implementation

[0097] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention.

[0098] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0099] This invention proposes a semiconductor wafer tray leveling and holding system, which can be used to adjust and hold the level of a semiconductor wafer tray and a heating plate. The following embodiments use a semiconductor wafer tray as an example.

[0100] Figure 1 and Figure 2A semiconductor wafer tray leveling and holding system according to an embodiment of the present invention and an installation schematic diagram are disclosed respectively, as follows: Figure 1 and Figure 2 As shown, the semiconductor wafer tray leveling and holding system proposed in this invention includes at least a leveling spiral adjustment mechanism 1 and a wedge-shaped self-locking mechanism 2.

[0101] The horizontal spiral adjustment mechanism 1 has a threaded columnar structure;

[0102] The wedge-shaped self-locking mechanism 2 is provided with a threaded fastening structure in the middle;

[0103] The horizontal spiral adjustment mechanism 1 passes sequentially through the fixing fixture 4 of the semiconductor wafer tray and the mounting component 5 at the bottom of the semiconductor wafer tray, and is then connected to the wedge self-locking mechanism 2 by a thread.

[0104] Furthermore, such as Figure 2 As shown, the semiconductor wafer tray level adjustment and holding system proposed in this invention also includes a set screw anti-loosening mechanism 3.

[0105] Figure 3a A schematic diagram of a horizontal spiral adjustment mechanism according to an embodiment of the present invention is shown, such as... Figure 3a The horizontal screw adjustment mechanism 1 shown adopts a fixed pitch screw mechanism and adds scale readings, which can improve the level adjustment accuracy of the semiconductor wafer tray.

[0106] Figure 4 A cross-sectional view of a semiconductor wafer tray leveling and holding system according to an embodiment of the present invention is disclosed. Figure 5a An external schematic diagram of a horizontal spiral adjustment mechanism according to an embodiment of the present invention is shown. Figure 5b An internal schematic diagram of a horizontal spiral adjustment mechanism according to an embodiment of the present invention is disclosed, as shown below. Figures 4 to 5b The horizontal spiral adjustment mechanism 1 shown includes at least a locking thread 11, a contact surface 12, and a transmission screw 13.

[0107] The transmission screw 13 includes at least a top section, a middle section, and a bottom section.

[0108] The transmission screw 13 has a fixed pitch transmission thread in the middle section, which is connected to the fixing fixture of the semiconductor wafer tray through the transmission thread.

[0109] The locking thread 11 is provided on the top section of the transmission screw 13 and is used to pass through the wedge-shaped self-locking mechanism and rotate to lock.

[0110] The contact surface 12 is disposed on the top section of the transmission screw 13, located between the locking thread 11 and the middle section of the transmission screw 13, and is used to abut against the mounting component at the bottom of the semiconductor wafer tray.

[0111] The bottom section of the transmission screw 13 is provided with a second protrusion 131, which facilitates manual operation of the horizontal screw adjustment mechanism 1. The horizontal screw adjustment mechanism 1 ensures that it can be operated manually in a narrow area, which is convenient and flexible and greatly improves the user experience.

[0112] To improve the efficiency and repeatability of semiconductor wafer tray leveling adjustment and provide process stability and repeatability, the leveling screw adjustment mechanism 1 has been enhanced with a reading function. More specifically, a scale 14 is provided on the outer periphery of the bottom section of the transmission screw 13 to mark the adjustment amount, and the adjustment amount can be recorded in detail after each adjustment.

[0113] In this embodiment, the fixed pitch of the transmission screw 13 is 0.5 mm, and the graduation value of the scale 14 is 0.01 mm. Therefore, the measurement accuracy of the horizontal screw adjustment mechanism 1 is 0.01 mm.

[0114] The existing technology uses adjusting bolts, which can only be adjusted blindly by hand and cannot accurately control the amount of rotation. The adjustment accuracy can only reach 0.5mm. Therefore, the present invention greatly improves the levelness adjustment accuracy by using a horizontal spiral adjustment mechanism 1.

[0115] When the horizontal spiral adjustment mechanism 1 is adjusted to the correct position, there is usually a springback problem in the fit between the contact surface 12 and the mounting component 5 at the bottom of the semiconductor wafer tray, and at the connection between the transmission thread of the transmission screw 13 and the fixing fixture 4 of the semiconductor wafer tray.

[0116] To further determine and improve the fit of the contact surface and the transmission thread connection of the transmission screw, the horizontal spiral adjustment mechanism 1 proposed in this invention also includes a fine-tuning knob 17.

[0117] Figure 6 and Figure 7 Partial schematic diagrams and connection diagrams of a fine-tuning knob according to an embodiment of the present invention are shown respectively, as follows: Figure 6 and Figure 7 The fine-tuning knob 17 shown includes a connecting knob 171, a spring 172, a first ratchet 173, a second ratchet 174, and a knob housing 176.

[0118] The connecting knob 171 is connected to the transmission screw 13 at one end and is provided with a connecting key 177 at the other end;

[0119] The spring 172 is disposed between the connecting knob 171 and the first ratchet 173;

[0120] The first ratchet 173 has a connecting groove 178 on one end face for accommodating the connecting key 177;

[0121] The teeth of the first ratchet 173 mesh with the teeth of the second ratchet 174;

[0122] The knob housing 176 is connected and fixed to the second ratchet 174.

[0123] In this embodiment, as Figure 5b and Figure 6 As shown, one end of the connecting knob 171 is a cylinder 1711 with external threads, which is threadedly connected to the transmission screw 13.

[0124] Based on the connection method of the connecting knob 171 in this embodiment, the horizontal spiral adjustment mechanism 1 also includes a limiting block 15 and a disc spring 16.

[0125] The limiting block 15 is disposed between the bottom section of the transmission screw 13 and the connecting knob 171, and is used to limit the connection position of the connecting knob 171.

[0126] The disc spring 16 is located between the limiting block 15 and the connecting knob 171 and has the function of pre-tightening and preventing loosening.

[0127] It should be noted that the connecting knob 171 and the transmission screw 13 can also be integrally formed or fixedly connected in other ways, both of which should be considered within the protection scope and do not affect the realization of the overall function. When other forms of fixed connection are used, the limit block 15 and the disc spring 16 can be omitted according to the function.

[0128] In this embodiment, the fine-tuning knob 17 also includes a fastening screw 175. The knob housing 176 is connected and fixed to the second ratchet 174 by the fastening screw 175, and the knob housing 176 and the second ratchet 174 are fixed together.

[0129] In other embodiments, the knob housing 176 and the second ratchet 174 may also be integrally formed or fixed in other ways, which should be considered within the scope of protection and do not affect the realization of the overall function.

[0130] The surface of the knob housing 176 is provided with a first protrusion 179, which facilitates the operation of rotating the fine adjustment knob 17 by hand.

[0131] The following example, using the springback problem at the connection between the drive screw's drive thread and the semiconductor wafer tray's fixing fixture, illustrates the working principle of the fine-tuning knob 17.

[0132] Figure 8a A schematic diagram of the springback state according to an embodiment of the present invention is shown, such as Figure 8a As shown, the transmission thread of the transmission screw is in a springback state.

[0133] Rotating the knob housing 176 causes the second ratchet 174 to rotate as well.

[0134] The second ratchet 174 engages with the first ratchet 173, causing the first ratchet 173 to rotate.

[0135] The first ratchet 173 transmits rotational power to the connecting knob 171 via the connecting groove 178 and the connecting key 177.

[0136] Connect the knob 171 to drive the transmission screw 13 to rotate, so that the transmission thread of the transmission screw 13 changes from a spring-back state to a tight state.

[0137] Figure 8b A schematic diagram of the contact state according to an embodiment of the present invention is shown, such as Figure 8b As shown, after fine-tuning the knob 17, the transmission thread of the transmission screw 13 is in a tight state.

[0138] At this time, all gaps between the drive thread of the drive screw and the connection of the fixing tool of the semiconductor wafer tray disappear. Then the second ratchet 174 rotates, but because all gaps disappear, the drive screw 13 cannot rotate, and the connection groove 178 and the connection key 177 cannot transmit power, causing the spring 172 to be compressed by the first ratchet 173.

[0139] The first ratchet 173 disengages from the second ratchet 174, causing the second ratchet 174 to spin freely, accompanied by a "clicking" sound. At this point, the fine-tuning knob 17 completes the fine-tuning of the fit.

[0140] The principle behind the springback issue between the contact surface 12 and the mounting components at the bottom of the semiconductor wafer tray is the same, so it will not be elaborated here.

[0141] Figure 3c A schematic diagram of a wedge-shaped self-locking mechanism according to an embodiment of the present invention is shown. Figure 9 A front view of a wedge-shaped self-locking mechanism according to an embodiment of the present invention is shown, as follows: Figure 3c and Figure 9 As shown, the wedge-shaped self-locking mechanism 2 includes an anti-loosening nut 21, a wedge-shaped tooth disc spring 22, and a wedge-shaped tooth anti-loosening flat washer 23, which are used to achieve self-locking of the anti-loosening nut and prevent spontaneous loosening and relaxation of the thread structure.

[0142] Figure 10a A schematic diagram of a lock nut according to an embodiment of the present invention is shown, such as... Figure 10a As shown, the lock nut 21 has a hexagonal wrench-type structure. In other embodiments, the lock nut 21 may also have other forms of wrench-type structures, such as triangular, pentagonal, octagonal, etc.

[0143] Figure 10b A schematic diagram of a wedge-shaped toothed disc spring according to an embodiment of the present invention is shown, as follows: Figure 10bAs shown, the wedge-shaped tooth disc spring 22 has several wedge-shaped teeth at the bottom, which are arranged in a spiral pattern, and the top has a planar structure or an arc-shaped structure.

[0144] Figure 10c A schematic diagram of a wedge-shaped toothed anti-loosening pad according to an embodiment of the present invention is shown, as follows: Figure 10c As shown, the wedge-shaped anti-loosening pad 23 has a spiral wedge-shaped groove on the top.

[0145] The spiral wedge-shaped grooves and the wedge-shaped teeth of the wedge-shaped tooth disc spring 22 can be matched and fitted together. The number of wedge-shaped teeth is no more than the number of spiral wedge-shaped grooves, and all of them can be embedded into the corresponding spiral wedge-shaped grooves, that is, all of them can be embedded and matched with the corresponding spiral wedge-shaped grooves.

[0146] The wedge-shaped anti-loosening pad 23 has a spiral wedge-shaped anti-loosening tooth structure at the bottom, which contacts the mounting component 5 at the bottom of the semiconductor wafer tray.

[0147] The anti-loosening nut 21, the wedge-shaped tooth disc spring 22 and the wedge-shaped tooth anti-loosening flat washer 23 are installed in sequence, and the wedge-shaped teeth of the wedge-shaped tooth disc spring 22 are embedded in the spiral wedge-shaped groove of the wedge-shaped tooth anti-loosening flat washer 23.

[0148] Figure 3b A schematic diagram of a set screw anti-loosening mechanism according to an embodiment of the present invention is disclosed. Figure 11 An installation schematic diagram of a set screw anti-loosening mechanism according to an embodiment of the present invention is disclosed, as follows: Figure 3b , Figure 4 and Figure 11 As shown, the set screw anti-loosening structure 3 is used to pass through the fixing fixture 4 of the semiconductor wafer tray and press against the side of the transmission screw 13.

[0149] The set screw anti-loosening structure 3 includes a set screw 31 and a knob 32 disposed at the end of the set screw 31:

[0150] The knob 32 is used to control the threaded rotation of the side of the set screw 31 through the fixing fixture 4 of the semiconductor wafer tray, so that one end of the set screw 31 is pressed against the side of the transmission screw 13.

[0151] The set screw anti-loosening structure 3 avoids the problem of horizontal position drift and improves the horizontal holding capability of the semiconductor wafer tray.

[0152] Figure 12 A schematic diagram of the initial state of a semiconductor wafer tray leveling and holding system according to an embodiment of the present invention is shown. Figure 13 A schematic diagram of the adjustment function of a semiconductor wafer tray leveling and holding system according to an embodiment of the present invention is disclosed. Figure 12 and Figure 13For example, the specific steps of the semiconductor wafer tray leveling and holding system proposed in this invention for adjusting levelness are illustrated below:

[0153] Step 1: Loosen the lock nut 21;

[0154] Step 2: Loosen the set screw knob 32;

[0155] Step 3: Rotate the second protrusion 131 and adjust the scale until the target level is achieved;

[0156] Step 4: Rotate the first protrusion 179 of the fine adjustment knob 17 until a "click" sound is heard, and the fine adjustment knob 17 spins freely.

[0157] Step 5: Tighten the set screw knob 32;

[0158] Step 6: Tighten the lock nut 21.

[0159] The semiconductor wafer tray leveling and maintaining system provided by this invention has the following beneficial effects:

[0160] 1) The use of a screw adjustment mechanism ensures easy and flexible operation even in confined spaces;

[0161] 2) Added a reading function, improving the accuracy of level adjustment;

[0162] 3) The wedge-shaped self-locking mechanism enables the nut to lock itself, avoiding the spontaneous loosening and slackness problems of traditional bolt fastening;

[0163] 4) The set screw anti-loosening structure avoids the problem of horizontal position drift and improves the ability of the heating plate to maintain a horizontal position;

[0164] 5) The fine-tuning knob improves the fit of the contact surface.

[0165] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0166] In the description of this invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0167] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0168] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0169] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the claims.

Claims

1. A semiconductor wafer tray leveling and holding system, characterized in that, Includes a horizontal spiral adjustment mechanism and a wedge-shaped self-locking mechanism: The horizontal spiral adjustment mechanism is a threaded columnar structure; The wedge-shaped self-locking mechanism is provided with a threaded fastening structure in the middle; The horizontal spiral adjustment mechanism passes sequentially through the fixing fixture of the semiconductor wafer tray and the mounting component at the bottom of the semiconductor wafer tray, and is then connected to the wedge self-locking mechanism via a thread. The horizontal spiral adjustment mechanism includes at least a transmission screw and a fine-tuning knob. The transmission screw has a fixed pitch transmission thread in the middle section, which is connected to the fixing fixture of the semiconductor wafer tray by the thread. The fine-tuning knob includes a connecting knob, a spring, a first ratchet, a second ratchet, and a knob housing: The connecting knob is connected to a transmission screw at one end and a connecting key at the other end; The spring is disposed between the connecting knob and the first ratchet; The first ratchet has a connecting groove on one end face to accommodate a connecting key; The teeth of the first ratchet mesh with the teeth of the second ratchet; The knob housing is connected and fixed to the second ratchet.

2. The semiconductor wafer tray leveling and holding system according to claim 1, characterized in that, The horizontal spiral adjustment mechanism also includes a locking thread and a contact surface: The locking thread is located at the top section of the transmission screw and is used to pass through the wedge-shaped self-locking mechanism and rotate to lock. The contact surface is used to abut against the mounting components at the bottom of the semiconductor wafer tray.

3. The semiconductor wafer tray leveling and maintaining system according to claim 2, characterized in that, A scale is provided on the outer periphery of the bottom section of the transmission screw to mark the adjustment amount.

4. The semiconductor wafer tray leveling and holding system according to claim 1, characterized in that, The wedge-shaped self-locking mechanism includes an anti-loosening nut, a wedge-shaped toothed disc spring, and a wedge-shaped toothed anti-loosening flat washer. The wedge-shaped anti-loosening pad has a spiral wedge-shaped groove on the top. The wedge-shaped tooth disc spring has several wedge-shaped teeth at its bottom, and these wedge-shaped teeth are arranged in a spiral pattern. The anti-loosening nut, wedge-tooth disc spring, and wedge-tooth anti-loosening flat washer are installed in sequence, with the wedge-tooth disc spring's wedge-shaped teeth embedded in the spiral wedge-shaped groove of the wedge-tooth anti-loosening flat washer.

5. The semiconductor wafer tray leveling and holding system according to claim 4, characterized in that, The wedge-shaped anti-loosening pad has a spiral wedge-shaped anti-loosening tooth structure at the bottom, which contacts the mounting components at the bottom of the semiconductor wafer tray.

6. The semiconductor wafer tray leveling and holding system according to claim 4, characterized in that, The number of wedge teeth is no more than the number of spiral wedge grooves, and each wedge tooth is matched with the corresponding spiral wedge groove in an embeddable manner.

7. The semiconductor wafer tray leveling and holding system according to claim 2, characterized in that, It also includes a set screw anti-loosening structure: The set screw anti-loosening structure is used to pass through the fixing fixture of the semiconductor wafer tray and abut against the side of the drive screw.

8. The semiconductor wafer tray leveling and holding system according to claim 7, characterized in that, The set screw anti-loosening structure includes a set screw and a knob disposed at the end of the set screw: The knob is used to rotate the thread on the side of the set screw through the fixing fixture of the semiconductor wafer tray, so that one end of the set screw is pressed against the side of the drive screw.

9. The semiconductor wafer tray leveling and holding system according to claim 1, characterized in that, The fine-tuning knob also includes a fastening screw: The knob housing is fixed to the second ratchet by fastening screws.

10. The semiconductor wafer tray leveling and holding system according to claim 1, characterized in that, The horizontal spiral adjustment mechanism also includes a limiting block and a disc spring: The connecting knob has one end as a cylinder with external threads, which is threaded to the transmission screw. The limiting block is disposed between the bottom section of the transmission screw and the connecting knob; The disc spring is positioned between the limiting block and the connecting knob.

11. The semiconductor wafer tray leveling and holding system according to claim 1, characterized in that, The surface of the knob housing is provided with a first protrusion; The transmission screw surface is provided with a second protrusion.

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