Door body assembly and semiconductor apparatus

Abstract

The present disclosure provides a door assembly and a semiconductor device. The door assembly comprises a door body, a support structure and a driving device. The support structure is used to provide support for the door body. The driving device is used to drive the door body to move to open or close a loading / unloading opening of a reaction chamber. The support structure comprises a support member and a reinforcing member connected to the support member. In the present disclosure, the reinforcing member is arranged in the support structure. The reinforcing member can provide structural reinforcement for the support member, thereby enhancing the impact resistance of the support structure, improving the stability, ensuring the stability of the reaction conditions in the reaction chamber, and facilitating the improvement of the yield of products.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor technology, and in particular, to a door assembly and a semiconductor device. BACKGROUND

[0002] In the process of semiconductor manufacturing, certain reaction conditions (temperature, pressure, etc.) need to be maintained in the reaction chamber of a semiconductor device to ensure that the process of semiconductor manufacturing can proceed normally.

[0003] At present, in the process of semiconductor manufacturing, the door of the reaction chamber is prone to shaking when impacted by the internal flowing gas, which changes the environmental conditions in the reaction chamber and affects the yield of semiconductor products. SUMMARY

[0004] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of protection of the claims.

[0005] According to some embodiments of the present disclosure, the first aspect of the present disclosure provides a door assembly applied to a semiconductor device for closing a loading / unloading opening of a reaction chamber of the semiconductor device, the door assembly comprising:

[0006] a door body;

[0007] a support structure connected to the door body, the support structure being used to support the door body, the support structure comprising a support member and a reinforcing member connected to the support member;

[0008] a driving device connected to the support structure, the driving device being used to drive the door body to move to open or close the loading / unloading opening.

[0009] In some embodiments, the support structure comprises a plurality of reinforcing members, and the plurality of reinforcing members are connected to the same support member, and the support member and any two reinforcing members connected thereto form a triangle.

[0010] In some embodiments, the support structure comprises a plurality of support members, and the plurality of support members are connected to different positions of the door body.

[0011] In some embodiments, the support structure further comprises a connecting member extending along the arrangement direction of the plurality of support members, and the connecting member connects and fixes the plurality of support members.

[0012] In some embodiments, the ends of the plurality of reinforcing members away from the support member are connected to the same position.

[0013] In some embodiments, the support structure comprises a first support rod and a second support rod, the first support rod is slidingly connected with the second support rod, one of the first support rod and the second support rod is fixedly connected with the door body;

[0014] The driving device is configured to drive the first support rod and the second support rod to move relative to each other, so as to drive the door body to move along the extension direction of the support structure.

[0015] In some embodiments, the driving direction of the driving device is parallel to the height direction of the semiconductor device, and the driving direction of the driving device is perpendicular to the extension direction of the access port.

[0016] In some embodiments, the driving device is connected with the support structure and / or the reinforcing member;

[0017] The driving device is configured to drive the door body to rotate to or away from the access port.

[0018] Optionally, the door body assembly further comprises a detection device configured to detect whether the door body opens or closes the access port.

[0019] According to a second aspect of the present disclosure, there is provided a semiconductor device, comprising a reaction chamber, a pumping device, and a door body assembly as described in the first aspect, the door body assembly is arranged inside the reaction chamber;

[0020] The pumping device is arranged at the bottom of the reaction chamber, and is configured to adjust the pressure and gas environment in the reaction chamber.

[0021] The sidewall of the reaction chamber is provided with an access port, and the door body of the door body assembly moves relative to the reaction chamber to open or close the access port.

[0022] The embodiments of the present disclosure have at least the following advantages:

[0023] The reinforcing member is arranged in the support structure, and can provide structural reinforcement to the support structure, thereby enhancing the impact resistance of the support structure, improving the stability of the support structure and the door body, and ensuring the stability of the reaction conditions in the reaction chamber, which is conducive to improving the yield of products. BRIEF DESCRIPTION OF DRAWINGS

[0024] In the drawings, similar reference numerals are used to represent similar elements. The drawings described below are some embodiments of the present disclosure, rather than all embodiments. Those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0025] Figure 1 FIG. 1 is a schematic view of a reaction chamber in the related art.

[0026] Figure 2 is Figure 1 is a sectional view taken along the line A-A in FIG. 1.

[0027] Figure 3 is Figure 1 is another sectional view taken along the line A-A in FIG. 1.

[0028] Figure 4 is a schematic view of a door assembly according to an exemplary embodiment.

[0029] Figure 5 is a schematic view of a door assembly according to an exemplary embodiment.

[0030] Figure 6 is a schematic view of a door assembly according to an exemplary embodiment.

[0031] Figure 7 is a schematic view of a semiconductor apparatus according to an exemplary embodiment.

[0032] Figure 8 is a schematic view of a semiconductor apparatus according to an exemplary embodiment.

[0033] Reference signs :

[0034] 100', door assembly; 10', door body; 20', support structure; 21', support member; 30', driving device;

[0035] 200', reaction chamber; 40', loading / unloading port; 50', base; 60', negative pressure passage;

[0036] 100, door assembly;

[0037] 10, door body;

[0038] 20, support structure; 21, support member; 211, first support rod; 212, second support rod; 22, reinforcing member; 23, connecting member; 24, roller;

[0039] 30, driving device;

[0040] 200, reaction chamber; 40, loading / unloading port; 50, base; 60, negative pressure passage;

[0041] 300, processing chamber;

[0042] 400, loading chamber. DETAILED DESCRIPTION

[0043] To make the purposes, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other in any manner without conflict.

[0044] In the semiconductor process, a certain reaction condition (temperature, pressure, etc.) needs to be maintained in the reaction chamber of the semiconductor device to ensure that the semiconductor product process can proceed normally.

[0045] At present, in the semiconductor process, the door body of the reaction chamber is easily shaken when impacted by the flow of reaction gas, environmental gas, or by-product gas, which changes the environmental conditions in the reaction chamber and affects the yield of the semiconductor product.

[0046] Reference Figures 1 to 3 shows a semiconductor device in the related art, which includes a reaction chamber 200' and a door body assembly 100' arranged in the reaction chamber 200'. The reaction chamber 200' is provided with a susceptor 50' and a negative pressure channel 60' arranged at the bottom of the reaction chamber and connected to an exhaust device (not shown). The susceptor 50' is used to carry a semiconductor product, and the exhaust device can exhaust the gas in the reaction chamber 200' through the negative pressure channel 60'.

[0047] Figure 2 shows that the door body 10' is in a position closing the access opening 40', Figure 2 shows that the door body is in a position opening the access opening 40'. Specifically, the driving device 30' is extended and contracted, driving part of the support 21' to rotate around a preset axis, and then driving part of the support 21' and the door body 10' to move downward (in the opposite direction of the z direction shown in FIG. 1) to open the access opening 40'. As shown in Figure 3 and Figure 2 and Figure 3 It can be determined that, due to the freedom of movement of the support 21' in the door body assembly 100' and the number of supports 21' arranged, the support 21' in the door body assembly 100' is easily shaken when impacted by the reaction gas, the support 21' is shaken and then drives the door body 10' to shake, which changes the temperature, gas pressure, etc. in the reaction chamber 200', and may cause gas etching to be not in place or excessive etching, etc., affecting the yield of the semiconductor product.

[0048] To solve the above problems, the door body assembly provided by the embodiment of the present disclosure includes a door body and a support structure for supporting the door body, and the support structure is provided with a reinforcing member capable of providing structural reinforcement to the support member, thereby enhancing the impact resistance of the support structure and improving the stability, so as to improve the cooperation reliability of the door body and the access opening.

[0049] According to an example embodiment of the present disclosure, as shown in Figures 4 to 6 , the embodiment of the present disclosure provides a door body assembly 100 applied to a semiconductor device, which can be used to open or close an access opening 40 of a reaction chamber 200 of the semiconductor device. The semiconductor device can be, for example, a device for performing etching process.

[0050] In the embodiment, as shown in Figure 4 , and in combination with Figure 2 , the door body assembly 100 provided by the embodiment of the present disclosure includes a door body 10 capable of being directly opposite to the access opening 40 of the reaction chamber 200 to close the access opening 40, so as to separate the inside of the reaction chamber 200 from the outside environment and ensure that the inside of the reaction chamber 200 is kept within the allowable range of reaction conditions.

[0051] As shown in Figure 4 , the door body assembly 100 provided by the embodiment of the present disclosure further includes a support structure 20 fixedly connected with the door body 10, which is used to provide support to the door body 10. The support structure 20 can be fixedly connected with the door body 10 by means of fasteners, welding, etc. In one example, referring to Figure 4 , and in the orientation as shown in Figure 4 , the support structure 20 can be connected with the bottom of the door body 10. In some alternative embodiments, the support structure 20 can also be connected with the top of the door body 10 or the side wall of the door body 10.

[0052] In which, referring to Figure 4 , the support structure 20 includes a support member 21 connected with the door body 10 for supporting the door body 10 and a reinforcing member 22 connected with the support member 21. The reinforcing member 22 has a preset installation included angle θ with the support member 21, and is capable of providing structural reinforcement to the support member 21, thereby improving the impact resistance of the support member 21 in the horizontal direction and avoiding the support member 21 from shaking due to the impact of the reaction gas, which can cause changes in the internal environmental parameters of the reaction chamber 200. In one example, the support member 21 and the reinforcing member 22 are both rod-shaped, and the preset installation included angle between the reinforcing member 22 and the support member 21 can be, for example, 30°-90°.

[0053] Referring to Figure 4The door body assembly 100 provided by the embodiment of the present disclosure further comprises a driving device 30, which is used to drive the door body 10 to move relative to the access opening 40 of the reaction chamber 200, so as to open or close the access opening 40 of the reaction chamber 200. In one example, referring to Figure 4 The support 21 can be a telescopic rod, and the driving device 30 serves as a telescopic power source of the support 21, and drives the support 21 to telescope, thereby driving the door body 10 to move relative to the access opening 40. In another example, referring to Figure 7 The driving device 30 can drive the whole structure of the support structure 20 (including the support 21 and the reinforcing member 22) to move relative to the access opening 40, thereby driving the door body 10 to move relative to the access opening 40, so as to open or close the access opening 40.

[0054] In the embodiment of the present disclosure, the support structure 20 is provided with the reinforcing member 22, which can provide structural reinforcement for the support 21, thereby enhancing the impact resistance of the support structure 20, improving the stability of the support 21 and the door body 10, and ensuring the stability of the reaction condition in the reaction chamber 200, which is conducive to improving the yield of products.

[0055] In one example, as shown in Figures 4 to 7 The door body assembly 100 provided by the embodiment of the present disclosure comprises a door body 10, a support structure 20 and a driving device 30. The support structure 20 is used to support the door body 10, and the driving device 30 is used to drive the door body 10 to move, so as to open or close the access opening 40 of the reaction chamber 200. The support structure 20 comprises a support 21 and a reinforcing member 22 connected to the support 21.

[0056] It should be noted that the support 21 in the form of a rod is taken as an example for illustration in the embodiment of the present disclosure. The rod section of the support 21 can be circular, square or irregular, but is not limited thereto.

[0057] In the embodiment, referring to Figure 4 and Figure 5 The support structure 20 comprises a plurality of reinforcing members 22, and one support 21 is connected to at least two reinforcing members 22. The support 21 and any two reinforcing members 22 connected thereto can enclose a triangle. Since the triangle is the most stable structure in polygons, it can be determined that the second support structure 20 provided by the embodiment of the present disclosure has extremely strong structural stability, thereby providing reliable support for the door body 10 and improving the performance of the door body 10 against the impact of reaction gas.

[0058] In one example, referring to Figure 4The diagram shows that the support structure 20 is provided with two reinforcing members 22 and one supporting member 21. The ends of the two reinforcing members 22 near the supporting member 21 are respectively connected to different positions of the supporting member 21, and the ends of the two reinforcing members 22 away from the supporting member 21 are connected together. Thus, the two reinforcing members 22 and part of the supporting member 21 can form a triangle to enhance the structural stability of the support structure 20.

[0059] In another example, referring to question 5, it is shown that the support structure 20 is provided with a support member 21 and three reinforcing members 22. The ends of the three reinforcing members 22 that are closer to the support member 21 are connected to different positions of the support member 21, and the ends of the reinforcing members 22 that are farther away from the support member 21 are connected together. The support member 21 and any two reinforcing members 22 form a triangle, which enhances the structural stability of the support structure 20.

[0060] In some embodiments, such as Figure 6 As shown, the support structure 20 includes multiple support members 21, which are connected to multiple different positions of the door body 10. The multiple positions where the multiple support members 21 are connected to the door body 10 may not be collinear, thereby improving the reliability of the support structure 20 in supporting the door body 10.

[0061] In one embodiment, reference Figures 4 to 7 and combined Figure 1 The reaction chamber 200 of the semiconductor device is cylindrical, meaning its sidewalls can be curved. The door 10 of the door assembly 100 is a curved plate, allowing it to fit snugly against the curved sidewalls of the reaction chamber 200, enhancing the seal between the door 10 and the access port 40. In one example, refer to... Figure 6 and Figure 7 The multiple support members 21 of the support structure 20 can be arranged at intervals along the arc direction of the door body 10. Taking the support structure 20 as having three support members 21 as an example, two support members 21 are respectively set at the two ends of the arc, and the other support member 21 is set at the middle position of the arc. The multiple support members 21 can provide support for multiple positions of the door body 10 so that the door body 10 is subjected to a balanced support force, thereby improving the stability of the door body 10.

[0062] In some possible implementations, the reaction chamber of the semiconductor device may also be cuboid, and the door may be configured as a planar plate structure. When multiple support members provide support for the planar plate structure of the door, the connection points between the multiple support members 21 and the door 10 may be non-collinear; for example, the three connection points of the three support members 21 and the three points of the door 10 may form the three vertices of a triangle.

[0063] In some embodiments, reference Figure 6 and Figure 7The support structure 20 further comprises a connecting member 23 extending along the arrangement direction of the plurality of support members 21, the connecting member 23 being connectable with the plurality of support members 21 to connect and fix the plurality of support members 21, so that the plurality of support members 21 form an entirety, improving the reliability of the support structure 20. The number of the connecting member 23 can be one or multiple. When the number of the connecting member 23 is multiple, the multiple connecting members 23 can be arranged at intervals along the extension direction of the support members 21 to further improve the reliability of the support structure 20.

[0064] In one example, referring to Figure 6 and Figure 7 , the connecting member 23 can be an arc-shaped connecting rod. The number of the support members 21 is three, two of which are arranged at the two ends of the arc-shaped connecting rod, and the other one is arranged at the middle position of the arc-shaped connecting rod. As can be seen, the three support members 21 are arranged in a triangle to improve the stability between the plurality of support members 21.

[0065] In some embodiments, as shown in Figure 6 and Figure 7 , the ends of the plurality of reinforcing members 22 away from the support members 21 are connected to the same position.

[0066] Referring to Figure 4 and Figure 5 , it can be understood that the ends of the plurality of reinforcing members 22 connected with the same support member 21 are connected to the same position, so that the plurality of reinforcing members 22 and the support member 21 can form a triangle to improve the reliability of the support structure 20.

[0067] Continuing to refer to Figure 6 and Figure 7 , the ends of the plurality of reinforcing members 22 connected with different support members 21 are connected to the same position. It can be understood that the connecting member 23 and the reinforcing members 22 connected with different support members 21 can form a triangle to improve the reliability of the support structure 20.

[0068] As can be seen, in the door assembly 100 provided by the embodiments of the present disclosure, the support members and the reinforcing members connected therewith can form a triangle to improve the reliability of the door assembly. Furthermore, the support members and the reinforcing members connected therewith are regarded as an entirety, and the plurality of the entireties can form a triangle through the arc-shaped connecting member to improve the reliability of the door assembly. In the door assembly provided by the embodiments of the present disclosure, a plurality of triangles are formed between the various structures, greatly improving the reliability of the door assembly and effectively avoiding the shaking of the door body caused by the impact of gas.

[0069] In one example embodiment, as Figures 4 to 7As shown, the door body assembly 100 provided by the embodiment of the present disclosure includes a door body 10, a support structure 20, and a driving device 30. The door body assembly 100 includes the door body 10, the support structure 20, and the driving device 30. The support structure 20 is configured to support the door body 10. The driving device 30 is configured to drive the door body 10 to move, so as to open or close the access opening 40 of the reaction chamber 200. The support structure 20 includes a support member 21 and a reinforcing member 22 connected to the support member 21.

[0070] The door body assembly 100 provided by the embodiment can include any of the devices, structures, etc. provided by the above embodiments.

[0071] In the embodiment, as shown in Figure 4 and Figure 5 , the support member 21 includes a first support rod 211 and a second support rod 212. The first support rod 211 is slidably connected to the second support rod 212. The sliding direction of the first support rod 211 and the second support rod 212 is the moving direction of the door body 10.

[0072] Referring to Figure 4 and Figure 5 , the first support rod 211 has a first end and a second end. The first end of the first support rod 211 is fixedly connected to the door body 10. The second end of the first support rod 211 is connected to the driving device 30. The second support rod 212 has a third end and a fourth end. The third end of the second support rod 212 is connected to the driving device 30. The fourth end of the second support rod 212 can be installed at a bottom wall, a top, a side wall, etc. of the reaction chamber. That is, the driving device is located between the first support rod 211 and the second support rod 212.

[0073] The driving device 30 can output linear motion, such as a telescopic cylinder, an electric push rod, or a combination of a driving motor and a screw mechanism. The output direction of the driving device 30 is parallel to the relative sliding direction of the first support rod 211 and the second support rod 212. For example, when the output shaft of the driving device 30 is elongated, the door body 10 can be driven to move towards the access opening 40 of the reaction chamber 200, so as to close the access opening 40 of the reaction chamber 200. When the output shaft of the driving device 30 is retracted, the door body 10 can be driven to move away from the access opening 40, so as to open the access opening 40.

[0074] In one example, referring to Figures 4 to 6 and combining Figure 3 , the fourth end (bottom) of the second support rod 212 of the support member 21 can be fixedly connected to the bottom wall of the reaction chamber 200. The driving direction of the driving device 30 is parallel to the height direction (z direction shown in Figure 2 ) of the semiconductor equipment. Moreover, the driving direction of the driving device 30 is parallel to the extension direction of the access opening 40.Figure 2 The x-direction shown is perpendicular to the x-direction.

[0075] In another example (not shown in the accompanying drawings), the fourth end (bottom) of the second support rod of the support member is slidably connected to the bottom wall of the reaction chamber, the first support rod and the second support rod of the support member are fixedly connected, and the driving direction of the drive device can be the same as the height direction of the semiconductor device (see reference). Figure 2 The z-direction shown has a preset included angle (e.g., 90°, so that the drive device can extend and retract in the horizontal direction) to drive the support member to move in the horizontal direction to open or close the material receiving port. In some alternative embodiments, a roller 2424 (see reference) can be provided at the fourth end (bottom) of the second support rod. Figure 7 This is to reduce the friction when the drive device moves the door.

[0076] In some embodiments, reference Figure 7 The drive unit 30 can output torque to drive the door 10 to rotate around a preset axis, thereby opening or closing the loading / unloading port 40 of the reaction chamber 200. The preset axis can, for example, be aligned with the height direction of the semiconductor device. Figure 2 (The z-direction shown in the diagram) is parallel. The drive unit 30 can be, for example, a servo motor, a steering gear, or other drive unit capable of outputting torque.

[0077] In some embodiments, reference Figures 4 to 7 The door assembly 100 also includes a detection device (not shown in the attached drawings) for detecting the position of the door 10 to determine whether the door 10 opens or closes the access port 40 of the reaction chamber 200. The detection device may include, for example, a distance sensor or a pressure sensor.

[0078] In one example, the detection device can be a distance sensor, which can be installed on the door 10, the support rod, or the side wall of the reaction chamber 200. For example, when the distance detected by the distance sensor is greater than a first preset threshold or less than a second preset threshold, it indicates that the door 10 is in the open position of the retrieval port 40; when the distance detected by the distance sensor is greater than the second preset threshold and less than the first preset threshold, it indicates that the door 10 is in the closed position of the retrieval port 40.

[0079] In another example, the detection device can be a pressure sensor. When the pressure value detected by the pressure sensor is less than a preset threshold, it indicates that the door 10 has not moved to the designated position, that is, the door 10 has not completely closed the access port 40 of the reaction chamber 200. When the pressure value detected by the pressure sensor is greater than or equal to the preset threshold, it indicates that the door 10 has moved to the designated position, that is, the door 10 has completely closed the access port 40 of the reaction chamber 200.

[0080] According to an exemplary embodiment of this disclosure, such asFigures 4 to 8 As shown, the semiconductor device according to the embodiments of the present disclosure can process semiconductor products (such as wafers), and can be a device capable of performing an etching process.

[0081] In the embodiments, as shown in Figure 8 The semiconductor device includes at least one reaction chamber 200 and a gas extraction device connected to the reaction chamber 200. The reaction chamber 200 can be used for etching and other process technologies. The gas extraction device is used to adjust the pressure and gas environment in the reaction chamber, so that the semiconductor product is in the reaction atmosphere. The reaction chamber 200 is provided with a pedestal 50 and a negative pressure channel 60. The pedestal 50 is located at the middle position of the bottom of the reaction chamber 200. The top surface of the pedestal 50 is used to carry and fix the semiconductor product. The negative pressure channel 60 is usually arranged at the bottom of the pedestal 50. The gas extraction device is also arranged at the bottom of the reaction chamber. The negative pressure channel 60 can be connected to the gas extraction device and a waste gas treatment device. The gas extraction device can extract negative pressure in the reaction chamber 200 to drive the reaction gas to move in the reaction chamber 200 and discharge the reaction byproducts from the reaction chamber 200. The waste gas treatment device is used to treat the reaction byproducts in the reaction chamber 200.

[0082] In some optional embodiments, referring to Figure 8 The semiconductor device includes a plurality of reaction chambers 200, a processing chamber 300 connected to the plurality of reaction chambers 200, and a loading chamber 400. The door assembly 100 can be arranged at the position of the access opening 40 of each reaction chamber 200. The door assembly 100 can also be arranged at the communication channel between the processing chamber 300 and the loading chamber 400. The processing chamber 300 is provided with a mechanical arm (not shown in the figure). The mechanical arm can transport the semiconductor product between different reaction chambers 200 or between the reaction chamber 200 and the loading chamber 400. The mechanical arm can align the position of the semiconductor product on the mechanical arm in the processing chamber 300 to ensure that the semiconductor product is ready to be placed on the pedestal 50 of the reaction chamber 200. The loading chamber 400 is used to transport the semiconductor product. Taking a wafer as an example, the loading chamber 400 can take the wafer from a front opening unified pod (FOUP, not shown in the figure) and transport the wafer to the reaction chamber 200 for process processing. The loading chamber 400 is provided with a special transmission cavity. During the transportation of the wafer, the outside atmosphere can be prevented from entering the reaction chamber 200 to ensure the reaction environment in the reaction chamber 200. The embodiments of the present disclosure do not make detailed description on this.

[0083] In one example, referring to Figure 8 and combining Figure 1This disclosure provides a cylindrical reaction chamber 200. This does not limit the technical solution of this disclosure; the shape of the reaction chamber 200 can also be cuboid, pear-shaped, etc.

[0084] like Figure 8 As shown, the semiconductor device provided in this embodiment of the present disclosure further includes a gate assembly 100, which can be any of the gate assembly 100 provided in the foregoing embodiments of the present disclosure. The gate assembly 100 is disposed at the pick-up / placement port 40 of each reaction chamber 200. The gate assembly 100 moves relative to the reaction chamber 200 to open or close the pick-up / placement port 40. When the gate assembly 100 opens the pick-up / placement port 40, unprocessed semiconductor products can be output from the loading chamber 400 to the reaction chamber 200 for processing; alternatively, semiconductor products processed in the reaction chamber 200 can be transported to the loading chamber 400 and transferred to a wafer transfer box. When the gate assembly 100 closes the pick-up / placement port 40, the interior and exterior of the reaction chamber 200 are separated, and processing can be performed within the reaction chamber 200.

[0085] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0086] In the description of this specification, references to the terms "embodiment," "exemplary embodiment," "some implementation," "illustrated implementation," "example," etc., refer to specific features, structures, materials, or characteristics described in connection with an implementation or example that are included in at least one implementation or example of this disclosure.

[0087] In this specification, the illustrative expressions of the terms used do not necessarily refer to the same implementation or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more implementations or examples.

[0088] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0089] It is understood that the terms "first," "second," etc., as used in this disclosure may be used to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish one structure from another.

[0090] In one or more accompanying drawings, the same elements are represented by similar reference numerals. For clarity, many parts in the drawings are not drawn to scale. Furthermore, certain well-known parts may not be shown. For simplicity, a structure obtained after several steps may be depicted in a single drawing. Many specific details of this disclosure, such as the structure, materials, dimensions, processing methods, and techniques of the devices, are described below to provide a clearer understanding of the disclosure. However, as those skilled in the art will understand, this disclosure may be implemented without adhering to these specific details.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A door assembly, applied to a semiconductor device, for sealing the access port of the reaction chamber of the semiconductor device, characterized in that, The door assembly comprises: a door body; a support structure connected to the door body, the support structure being used to support the door body, the support structure comprising a plurality of support members, a plurality of reinforcing members connected to the support members, and a connecting member, the plurality of support members being connected to different positions of the door body, the different positions being not in a same line, the same support member being connected to at least two corresponding reinforcing members, the support member and any two reinforcing members connected to the same support member forming a closed triangle, the connecting member extending along the arrangement direction of the plurality of support members, and the connecting member connecting and fixing the plurality of support members; the ends of the plurality of reinforcing members away from the support members being connected to the same position; the support member comprising a first support rod and a second support rod, the first support rod being connected to the second support rod in a sliding manner, one of the first support rod and the second support rod being fixedly connected to the door body; a driving device connected to the support structure, the driving device being used to drive the first support rod and the second support rod to move relative to each other, so as to drive the door body to move along the extension direction of the support member, so as to open or close the access opening.

2. The door assembly of claim 1, wherein, The driving direction of the driving device is parallel to the height direction of the semiconductor device, and the driving direction of the driving device is perpendicular to the extension direction of the access opening.

3. The door assembly of claim 1, wherein, The driving device is connected to the support member and / or the reinforcing member; The driving device is used to drive the door body to rotate to or away from the access opening.

4. The door assembly of claim 1, wherein, The door assembly further comprises a detection device, the detection device being used to detect whether the door body opens or closes the access opening.

5. A semiconductor device, characterized by comprising: The semiconductor device comprises a reaction chamber, a gas extraction device, and the door assembly according to any one of claims 1-4, the door assembly being arranged inside the reaction chamber; The gas extraction device is arranged at the bottom of the reaction chamber, and is used to adjust the pressure and gas environment in the reaction chamber; The side wall of the reaction chamber is provided with an access opening, and the door body of the door assembly moves relative to the reaction chamber, so as to open or close the access opening.

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