Semi-automatic film dicing machine

Abstract

The application discloses a kind of semi-automatic film grinding machine, it includes machine body and sample, speed-regulating motor is arranged in machine body, the output shaft of speed-regulating motor passes through machine body and extends to outside machine body, and the end of output shaft is movably provided with rotating platform, the top of machine body is movably provided with pressure metal platform, the lower surface of pressure metal platform is provided with movable lifting platform by pressure assembly, the bottom of movable lifting platform is movably provided with hard rubber, hard rubber is coaxial and opposite with rotating platform upside down, sample is located between hard rubber and rotating platform, digital display controller is arranged on machine body, precision displacer is arranged on the side of movable lifting platform, speed-regulating motor and precision displacer are electrically connected with digital display controller;The application uses pressure assembly to push hard rubber, so that hard rubber and rotating platform cooperate to clamp sample, by the cooperation of digital display controller and precision displacer, control speed-regulating motor drives rotating platform to grind sample, so as to sample uniformly, improve polishing efficiency and polishing accuracy.

Description

Technical Field

[0001] This invention relates to the field of fuel cell grinding equipment technology, specifically to a semi-automatic thin film grinding machine. Background Technology

[0002] SOFCs, as highly efficient energy converters, are considered an important tool for future hydrogen energy utilization. However, excessively thick electrode supports can severely affect their performance. Grinding can effectively reduce the thickness of the support, thereby reducing the electrolyte thickness, lowering ohmic impedance, and reducing the cathode or anode thickness, which can effectively reduce concentration polarization and thus improve SOFC output performance. Currently, the main method for reducing the thickness of the electrode support is manual grinding with sandpaper. However, manual grinding is inefficient, produces poor uniformity, and can easily damage the fingers. Summary of the Invention

[0003] To address the aforementioned problems in the prior art, this invention provides a semi-automatic thin film grinding machine, which solves the problems of low efficiency and poor uniformity in manual grinding of existing electrode supports using sandpaper.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] On one hand, a semi-automatic thin film grinding machine is provided, which includes a machine body and a sample. A speed-regulating motor is installed inside the machine body. The output shaft of the speed-regulating motor passes through the machine body and extends outside the machine body. A rotating platform is movably installed on the end of the output shaft. A pressure-applying metal stage is movably installed on the top of the machine body. A movable lifting platform is installed on the lower surface of the pressure-applying metal stage through a pressure-applying component. A hard rubber is movably installed at the bottom of the movable lifting platform. The hard rubber is coaxially opposed to the rotating platform. The sample is located between the hard rubber and the rotating platform. A digital display controller is installed on the machine body. A precision displacement device is installed on one side of the movable lifting platform. The speed-regulating motor and the precision displacement device are both electrically connected to the digital display controller.

[0006] The grinding machine of the present invention is highly adaptable and easy to operate. It uses a pressure component to push a hard rubber, which then cooperates with the rotating platform to clamp the sample. Through the cooperation of a digital display controller and a precision displacement device, the speed-regulating motor drives the rotating platform to grind the sample, thereby producing uniform sample preparation and improving grinding efficiency and precision.

[0007] Furthermore, the digital display controller integrates a digital speed display, a digital displacement display, a speed knob, and a digital displacement reset button.

[0008] In this solution, a speed-regulating motor is controlled by a digital display controller, and the speed of the speed-regulating motor and the displacement of the movable lifting platform are displayed by a digital speed display and a digital displacement display, thereby accurately controlling the precision of the polished sample.

[0009] Furthermore, a motor base is provided in the middle of the bottom of the machine body, and the speed-regulating motor is placed on the motor base. Multiple fixing holes are opened at the upper end of the speed-regulating motor, and the speed-regulating motor is fixed by bolts passing through the machine body and inserted into the fixing holes.

[0010] Furthermore, fixed metal columns are provided on the lower sides of the pressure-applying metal platform, and slots are provided on the upper surfaces of both sides of the pressure-applying metal platform. Buckles are provided on the fixed metal columns, and the pressure-applying metal platform is fixed by engaging the slots with the buckles.

[0011] In this design, the pressure metal platform provides support in the opposite direction for the movable landing platform, and the pressure metal platform is fixed to the machine body by a fixed metal column, which facilitates the subsequent disassembly and installation of the pressure metal platform.

[0012] Furthermore, the pressure application assembly includes a cylinder located in the middle of the lower surface of the pressure application metal platform. Two metal cylinders are symmetrically arranged inside the cylinder. The movable lifting platform is embedded in the cylinder. The end of the movable lifting platform embedded in the cylinder has a through hole that fits with the two metal cylinders. The metal cylinders are inserted into the through holes. A spring is sleeved on the metal cylinder. One end of the spring is fixed to the pressure application metal platform, and the other end of the spring is connected to the movable lifting platform.

[0013] In this design, the movable lifting platform is embedded in the cylinder, and the metal cylinder is embedded in the through hole to ensure the direction of movement of the movable lifting platform. One end of the spring is fixed to the pressure metal platform, and the other end of the spring is connected to the movable lifting platform. The pressure metal platform provides support and works with the spring to provide a vertical interaction force for the movable lifting platform.

[0014] Furthermore, the precision displacement device is fixed to the movable lifting platform by a displacement fixing frame to measure the displacement generated by the movable lifting platform.

[0015] In this design, a precision displacement sensor is installed on the movable lifting platform to measure the displacement of the platform, thereby accurately measuring the amount of grinding on the sample and improving the grinding accuracy of the device.

[0016] Furthermore, the precision displacement device is a spring-loaded displacement sensor. The displacement probe of the precision displacement device contacts the pressure metal stage and generates displacement.

[0017] In this scheme, the precision displacement device is a spring-loaded displacement sensor. The displacement probe of the precision displacement device presses against the metal stage and generates a certain amount of springback. The amount of springback is greater than or equal to the planned grinding thickness of the sample, so as to ensure that the precision displacement device can accurately measure the grinding thickness of the sample.

[0018] Furthermore, a dust cover is installed below the rotating platform to prevent splashes from entering the speed-regulating motor.

[0019] Furthermore, a protective cover is installed on the outside of the pressure metal platform.

[0020] On the other hand, a method of using a semi-automatic thin film grinding machine is provided, which includes the following steps:

[0021] Step S1: Remove the protective cover, open the buckles, and remove the pressure metal platform;

[0022] Step S2: Select a suitable hard rubber and rotating platform according to the material and size of the sample to be ground. Fix the sample to the bottom of the hard rubber with adhesive, then fix the sandpaper on the rotating platform and spray an appropriate amount of distilled water in the center of the sandpaper.

[0023] Step S3: Fix the high-precision displacement device to the movable lifting platform using the displacement fixing bracket to ensure that the high-precision displacement device and the pressure metal stage generate interaction force and displacement, so as to measure the displacement generated by the movable lifting platform. Then place the pressure metal stage and fix it with buckles. The pressure component pushes the movable lifting platform downward so that the hard rubber on the movable lifting platform is coaxially opposed to the rotating platform and clamps the sample.

[0024] Step S4: Cover the protective cover and observe whether the value displayed on the displacement digital display is zero. If the value is not zero, press the reset button to return the value displayed on the displacement digital display to zero.

[0025] Step S5: Start grinding. Start the speed-regulating motor. The speed-regulating motor drives the rotating platform to rotate and grind the sample. Adjust the speed of the speed-regulating motor by rotating the speed knob. The speed adjustment range is 1000rpm~6000rpm.

[0026] Step S6: Observe the value displayed on the displacement display. When the predetermined grinding value is reached, reset the speed knob to zero, turn off the speed control motor, and complete the grinding.

[0027] This invention discloses a semi-automatic thin film grinding machine, the beneficial effects of which are:

[0028] The grinding machine of this invention is highly adaptable and easy to operate. The sample is bonded to hard rubber, and a pressure component is used to push the movable lifting platform, thereby pushing the hard rubber so that the sample on the hard rubber contacts the rotating platform. Then, the speed-regulating motor drives the rotating platform to grind the sample. Finally, through the cooperation of digital display controller and precision displacement device, the thickness of the sample ground by the speed-regulating motor driving the rotating platform is precisely controlled, so as to make the sample uniform and improve the grinding efficiency and grinding accuracy. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a semi-automatic thin film grinding machine according to the present invention.

[0030] Figure 2 For the present invention Figure 1 A schematic diagram of the structure at point B.

[0031] Figure 3 For the present invention Figure 1 A schematic diagram of the structure at point A in the middle.

[0032] Figure 4 This is a schematic diagram of the speed-regulating motor of the present invention, wherein 4a is a top view and 4b is a front view.

[0033] Figure 5 This is a schematic diagram of the rotating platform of the present invention, wherein 5a is the front view, 5b is the side view, and 5c is the top view.

[0034] Figure 6 This is a schematic diagram of the structure of the movable landing platform of the present invention, wherein 6a is the front view, 6b is the side view, 6c is the top view, and 6d is the bottom view.

[0035] Figure 7 This is a schematic diagram of the hard rubber structure of the present invention, wherein 7a is the front view, 7b is the side view, and 7c is the top view.

[0036] Figure 8 This is a schematic diagram of the pressure-applying metal platform of the present invention, wherein 8a is the front view, 8b is the bottom view, and 8c is the top view.

[0037] Figure 9 This is a schematic diagram of the displacement fixing frame of the present invention, wherein 9a is a top view and 9b is a front view.

[0038] The components include: 1. Machine body; 101. Motor base; 2. Sample; 3. Speed-regulating motor; 31. Fixing hole; 4. Rotating platform; 5. Pressure metal platform; 51. Slot; 6. Pressure assembly; 61. Cylinder; 62. Metal cylinder; 63. Spring; 7. Movable lifting platform; 71. Through hole; 8. Hard rubber; 9. Digital display controller; 91. Tachometer; 92. Displacement meter; 93. Tachometer knob; 94. Displacement reset button; 10. Precision displacement device; 11. Fixed metal column; 12. Buckle; 13. Displacement fixing frame; 14. Dustproof cover; 15. Protective cover. Detailed Implementation

[0039] The present invention is described in detail with reference to specific embodiments to enable those skilled in the art to understand the invention. However, it should be understood that the invention is not limited to the scope of the specific embodiments. For those skilled in the art, various changes are obvious as long as they are within the spirit and scope of the invention as defined and determined by the appended claims. All inventions utilizing the concept of the present invention are protected.

[0040] Example 1

[0041] refer to Figure 1 and Figure 3 This is a schematic diagram of a semi-automatic thin film grinding machine according to this embodiment. Its purpose is to solve the problems of low efficiency and poor uniformity of manual grinding when using sandpaper to grind the electrode support. The specific structure of this embodiment will be described in detail below.

[0042] A semi-automatic thin film grinding machine includes a machine body 1 and a sample 2.

[0043] Specifically, a speed-regulating motor 3 is installed inside the machine body 1. The output shaft of the speed-regulating motor 3 passes through the machine body 1 and extends outside the machine body 1. A rotating platform 4 is movably installed on the end of the output shaft. A pressure-applying metal platform 5 is movably installed on the top of the machine body 1. A movable lifting platform 7 is installed on the lower surface of the pressure-applying metal platform 5 through a pressure-applying assembly 6. A hard rubber 8 is movably installed at the bottom of the movable lifting platform 7. The hard rubber 8 and the rotating platform 4 are coaxially opposed vertically. The sample 2 is located between the hard rubber 8 and the rotating platform 4.

[0044] In this embodiment, reference Figure 4 and Figure 5 ,in, Figure 4 In the diagram, 4a is the top view of the speed-regulating motor 3, and 4b is the front view of the speed-regulating motor 3. Figure 5 5a is the front view of the rotating platform 4, 5b is the side view of the rotating platform 4, and 5c is the top view of the rotating platform 4. The upper surface of the rotating platform 4 is a smooth plane, on which sandpaper is placed. The appropriate grit of the sandpaper can be selected according to the material of the sample 2. The lower surface is provided with a slot, which is fixed to the output shaft of the speed-regulating motor 3.

[0045] Sample 2 is bonded to hard rubber 8. The pressure component 6 is used to push the movable lifting platform 7, thereby pushing the hard rubber 8 so that sample 2 on hard rubber 8 comes into contact with the rotating platform 4. Then, the speed-regulating motor 3 drives the rotating platform 4 to polish sample 2.

[0046] Specifically, a digital display controller 9 is installed on the body 1, and a precision displacement device 10 is installed on one side of the movable lifting platform 7. The speed-regulating motor 3 and the precision displacement device 10 are both electrically connected to the digital display controller 9.

[0047] In this embodiment, the digital display controller 9 is used to control the speed regulating motor 3 and the precision displacement device 10, control the speed of the speed regulating motor 3, and receive the grinding thickness of the sample monitored by the precision displacement device 10, so as to uniformly grind the sample and improve grinding efficiency and grinding accuracy.

[0048] Specifically, the digital display controller 9 integrates a speed digital display 91, a displacement digital display 92, a speed knob 93, and a displacement digital display reset button 94.

[0049] In this embodiment, the tachometer 91 displays the tachometer speed of the speed-regulating motor 3, the displacement meter 92 displays the displacement of the movable lifting platform 7 monitored by the precision displacement device 10, the tachometer knob 93 is used to control and adjust the tachometer speed of the speed-regulating motor 3, and the displacement meter reset button 94 is used to reset the displacement value displayed by the displacement meter 92 to zero.

[0050] Specifically, a motor base 101 is provided in the middle of the bottom of the machine body 1. The speed-regulating motor 3 is placed on the motor base 101. Multiple fixing holes 31 are opened at the upper end of the speed-regulating motor 3. The speed-regulating motor 3 is fixed by inserting bolts through the machine body 1 into the fixing holes 31.

[0051] In this embodiment, reference Figure 4 The speed-regulating motor 3 is placed inside the machine body 1 through the motor base 101, and the speed-regulating motor 3 is fixed inside the machine body 1 by bolts passing through the four fixing holes 31 at the upper end of the speed-regulating motor 3.

[0052] Specifically, fixed metal columns 11 are provided on the lower sides of the pressure metal platform 5, and slots 51 are provided on the upper surfaces of both sides of the pressure metal platform 5. Buckles 12 are provided on the fixed metal columns 11, and the pressure metal platform 5 is fixed by engaging the slots 51 with the buckles 12.

[0053] In this embodiment, reference Figure 2 and Figure 8 ,in, Figure 8 8a is the front view of the pressure metal platform 5, 8b is the bottom view of the pressure metal platform 5, and 8c is the top view of the pressure metal platform 5. The pressure metal platform 5 provides support in the opposite direction for the movable lifting platform 7. Through the snap-fit ​​of the buckle 12 and the slot 51, the pressure metal platform 5 is fixed to the machine body 1 by the fixed metal column 11, which facilitates the subsequent disassembly and installation of the pressure metal platform 5. The fixed metal column 11 is a cuboid with a threaded cylinder at the bottom. The fixed metal column 11 is fixed to the upper surface of the machine body 1 by the threaded cylinder.

[0054] Specifically, a dust cover 14 is provided below the rotating platform 4 to prevent splashes from entering the speed-regulating motor 3.

[0055] In this embodiment, the dust cover 14 is a metal cover with a central opening and protrusion. The diameter of the opening is slightly larger than the diameter of the output shaft of the speed-regulating motor 3, and the diameter of the opening is smaller than the diameter of the upper surface of the rotating platform 4. Thus, the dust cover 14 prevents the sample 2 or splashes during the grinding process from entering the speed-regulating motor 3 and damaging the speed-regulating motor 3.

[0056] Specifically, the metal pressure table 5 is equipped with a protective cover 15, which can prevent the splashes generated during the grinding process from flying out.

[0057] Example 2

[0058] refer to Figure 1 , Figure 3 , Figures 6-8 This is a schematic diagram of a semi-automatic thin film grinding machine according to this embodiment. Its purpose is to solve the problems of low efficiency and poor uniformity of manual grinding when using sandpaper to grind the electrode support. The specific structure of this embodiment will be described in detail below.

[0059] The pressure application assembly 6 includes a cylinder 61 located in the middle of the lower surface of the pressure application metal platform 5. Two metal cylinders 62 are symmetrically arranged inside the cylinder 61, and the movable lifting platform 7 is embedded in the cylinder 61.

[0060] Specifically, the end of the movable lifting platform 7 embedded in the cylinder 61 is provided with a through hole 71 that fits with two metal cylinders 62. The metal cylinders 62 are inserted into the through hole 71, and a spring 63 is sleeved on the metal cylinders 62. One end of the spring 63 is fixed to the pressure metal platform 5, and the other end of the spring 63 is connected to the movable lifting platform 7.

[0061] In this embodiment, reference Figure 6 and Figure 7 ,in, Figure 6 6a is the front view of the movable landing platform, 6b is the side view of the movable landing platform, 6c is the top view of the movable landing platform, and 6d is the bottom view of the movable landing platform. Figure 7 7a is the front view of the hard rubber, 7b is the side view of the hard rubber, and 7c is the top view of the hard rubber. Figure 8 8a is the front view of the pressure-applying metal platform, 8b is the bottom view of the pressure-applying metal platform, and 8c is the top view of the pressure-applying metal platform.

[0062] The lower end of the movable lifting platform 7 is provided with a threaded hole, and a bolt is provided on one side of the hard rubber 8. The hard rubber 8 is fixed to the lower end of the movable lifting platform 7 by the cooperation of the bolt and the threaded hole.

[0063] The upper end of the movable lifting platform 7 is embedded in the cylinder 61, and the metal cylinder 62 is embedded in the through hole 71 of the movable lifting platform 7, thereby ensuring the moving direction of the movable lifting platform 7. One end of the spring 63, which is sleeved on the metal cylinder 62, is fixed to the pressure metal platform 5, and the other end of the spring 63 is connected to the movable lifting platform 7. The pressure metal platform 5 provides support, and the spring 63 cooperates with the movable lifting platform 7 to provide a vertical interaction force, providing the required pressure for the grinding of sample 2.

[0064] Example 3

[0065] refer to Figure 1 , Figure 3 and Figure 9This is a schematic diagram of a semi-automatic thin film grinding machine according to this embodiment. Its purpose is to solve the problems of low efficiency and poor uniformity of manual grinding when using sandpaper to grind the electrode support. The specific structure of this embodiment will be described in detail below.

[0066] The precision displacement device 10 is fixed to the movable lifting platform 7 by the displacement fixing frame 13 to measure the displacement generated by the movable lifting platform 7.

[0067] Specifically, the precision displacement sensor 10 is a spring-loaded displacement sensor. The displacement probe of the precision displacement sensor 10 contacts the pressure metal stage 5 and generates displacement.

[0068] In this embodiment, reference Figure 9 , where 9a is the top view of the displacement fixing frame 13 and 9b is the front view of the displacement fixing frame 13.

[0069] One end of the displacement fixing frame 13 is snapped onto the movable lifting platform 7, and the other end is snapped onto the precision displacement device 10, thereby fixing the precision displacement device 10 onto the movable lifting platform 7. The precision displacement device 10 is a spring-loaded displacement sensor. The displacement probe of the precision displacement device 10 contacts the pressure metal stage 5 and generates a certain amount of springback. This amount of springback is greater than or equal to the planned grinding thickness of the sample, so as to ensure that the precision displacement device 10 can accurately measure the grinding thickness of the sample 2.

[0070] Example 4

[0071] A method of using a semi-automatic thin film grinding machine includes the following steps:

[0072] Step S1: Remove the protective cover 15, open the buckle 12, and remove the pressure metal platform 5.

[0073] Step S2: Select hard rubber 8 and rotating platform 4 according to the material and size of the sample 2 to be ground. The bottom diameter of hard rubber 8 is greater than or equal to the surface diameter of sample 2, and the diameter of the upper surface of rotating platform 4 is greater than or equal to the bottom diameter of hard rubber 8. Use a NiO-YSZ anode support with a diameter of 13mm and a height of 1mm as sample 2. The bottom diameter of hard rubber 8 is 30mm, and the diameter of the upper surface of rotating platform 4 is 50mm. Then fix sample 2 to the bottom of hard rubber 8 with double-sided tape, and install sandpaper on the upper surface of rotating platform 4. The grit of sandpaper should be sufficient to generate sufficient friction with the material. Finally, spray distilled water on the sandpaper.

[0074] Step S3: Fix the precision displacement sensor 10 to the movable lifting platform 7 using the displacement fixing bracket 13. One end of the displacement fixing bracket 13 is attached to the movable lifting platform 7, and the other end is attached to the precision displacement sensor 10, thereby fixing the precision displacement sensor 10 to the movable lifting platform 7. The precision displacement sensor 10 is a spring-loaded displacement sensor. The displacement probe of the precision displacement sensor 10 contacts the pressure metal stage 5 and generates a certain amount of springback. This amount of springback is greater than or equal to the planned grinding thickness of the sample, so as to ensure that the precision displacement sensor 10 can accurately measure the grinding thickness of the sample 2.

[0075] Then, the pressure-applying metal platform 5 is placed and fixed with the buckle 12. The pressure-applying component 6 pushes the movable lifting platform 7 downward, so that the hard rubber 8 on the movable lifting platform 7 is coaxially opposed to the rotating platform 4 and clamps the sample 2. As grinding occurs, the thickness of the sample 2 decreases. The high-precision displacement device 10 follows the movable lifting platform 7 to make linear movements and measures the amount of thickness change of the sample 2.

[0076] Step S4: Cover the protective cover 15 and observe whether the value displayed on the displacement digital display 92 is zero. If the value is not zero, press the displacement digital display reset button to reset the value displayed on the displacement digital display 92 to zero.

[0077] Step S5: Start grinding. Start the speed-regulating motor 3. The speed-regulating motor 3 drives the rotating platform 4 to rotate and grind the sample 2. Adjust the speed of the speed-regulating motor 3 by rotating the speed knob 93. The speed adjustment range is 1000rpm~6000rpm.

[0078] Step S6: Observe the value displayed on the displacement display 92. The grinding value range of sample 2 is 10μm-1000μm. When the predetermined grinding value is reached, reset the speed knob 93 to zero and turn off the speed regulating motor 3 to complete the grinding.

[0079] Although specific embodiments of the invention have been described in detail with reference to the accompanying drawings, this should not be construed as limiting the scope of protection of this patent. Various modifications and variations that can be made by a person skilled in the art without inventive effort within the scope described in the claims still fall within the scope of protection of this patent.

Claims

1. A semi-automatic film dicer, characterized by: It comprises a body (1) and a sample (2); A speed regulating motor (3) is arranged in the body (1), the output shaft of the speed regulating motor (3) penetrates through the body (1) and extends to outside of the body (1), and a rotating platform (4) is movably arranged on the end of the output shaft; A pressure applying metal platform (5) is movably arranged on the top of the body (1), the lower surface of the pressure applying metal platform (5) is provided with a movable lifting platform (7) through a pressure applying assembly (6), the bottom of the movable lifting platform (7) is movably provided with a hard rubber (8), the hard rubber (8) is coaxially opposite to the rotating platform (4) in up and down direction, and the sample (2) is located between the hard rubber (8) and the rotating platform (4); A digital display controller (9) is arranged on the body (1), a precise displace device (10) is arranged on one side of the movable lifting platform (7), and the speed regulating motor (3) and the precise displace device (10) are electrically connected with the digital display controller (9); The digital display controller (9) is integrated with a rotating speed digital display table (91), a displacement digital display table (92), a rotating speed knob (93) and a displacement digital display reset button (94); The precise displace device (10) is fixed on the movable lifting platform (7) through a displacement fixing frame (13) to measure the displacement of the movable lifting platform (7); The precise displace device (10) is a rebound type displacement sensor, the displacement probe of the precise displace device (10) is in contact with the pressure applying metal platform (5) and generates displacement.

2. The semi-automatic film dicer of claim 1, wherein: A motor base (101) is arranged at the middle of the bottom of the body (1), the speed regulating motor (3) is placed on the motor base (101), a plurality of fixing holes (31) are formed in the upper end of the speed regulating motor (3), and the speed regulating motor (3) is fixed by inserting bolts through the body (1) into the fixing holes (31).

3. The semi-automatic film dicer of claim 1, wherein: Fixed metal columns (11) are arranged below both sides of the pressure applying metal platform (5), clamping grooves (51) are formed in the upper surfaces of both sides of the pressure applying metal platform (5), and buckles (12) are arranged on the fixed metal columns (11) to clamp the clamping grooves (51) and fix the pressure applying metal platform (5).

4. The semi-automatic film dicer of claim 1, wherein: The pressure applying assembly (6) comprises a cylinder (61) arranged at the middle of the lower surface of the pressure applying metal platform (5), and two metal cylinders (62) are symmetrically arranged in the cylinder (61); The movable lifting platform (7) is embedded in the cylinder (61), the end of the movable lifting platform (7) embedded in the cylinder (61) is provided with through holes (71) matched with the two metal cylinders (62), the metal cylinders (62) are inserted into the through holes (71), springs (63) are sleeved on the metal cylinders (62), one end of each spring (63) is fixed on the pressure applying metal platform (5), and the other end of each spring (63) is connected with the movable lifting platform (7).

5. The semi-automatic film dicer of claim 1, wherein: A dustproof cover (14) is arranged below the rotating platform (4) to prevent splashing into the speed regulating motor (3).

6. The semi-automatic film dicer of claim 1, wherein: A protective cover (15) is arranged outside the pressure applying metal platform (5).

7. A method of using the semi-automatic film dicer of any one of claims 1-6, wherein, The method comprises the following steps: S1, removing the protective cover (15), opening the buckle (12) and removing the pressure applying metal platform (5); Step S2, according to the material and size of the sample (2) to be ground, select the hard rubber (8) and the rotating platform (4), fix the sample (2) to the bottom of the hard rubber (8) through the adhesive, then fix the sandpaper on the rotating platform (4) and spray distilled water in the center of the sandpaper; Step S3, fix the precision displacement device (10) on the movable lifting platform (7) through the displacement fixing frame (13), ensure that the precision displacement device (10) and the pressure metal platform (5) generate mutual force and displacement to measure the displacement generated by the movable lifting platform (7), then place the pressure metal platform (5) and fix it using the buckle (12), the pressure assembly (6) pushes the movable lifting platform (7) to move downward, so that the hard rubber (8) on the movable lifting platform (7) is coaxial and opposite to the rotating platform (4) and clamps the sample (2); Step S4, cover the protective cover (15), and observe whether the displayed value on the displacement digital display table (92) is zero, if the value is not zero, press the displacement digital display reset button (94) to reset the displayed value of the displacement digital display table (92) to zero; Step S5, start grinding, start the speed regulating motor (3), the speed regulating motor (3) drives the rotating platform (4) to rotate and grind the sample (2), adjust the speed of the speed regulating motor (3) through the rotating speed knob (93), the speed adjustment range is 1000 rpm ~6000 rpm; Step S6, observe the value displayed on the displacement digital display table (92), when the predetermined grinding value is reached, clear the speed knob (93) and turn off the speed regulating motor (3), complete the grinding.

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