Mask manufacturing method and mask
By processing a pre-set opening on the photomask substrate and enlarging it to the actual opening size, the problems of complexity and insufficient precision in traditional photomask manufacturing are solved, meeting the needs of high-precision and narrow-bezel display products, simplifying the process and reducing costs.
Patent Information
- Application Number
- CN202311078017.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-25
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2043-08-25
AI Technical Summary
Traditional photomask manufacturing methods are complex and difficult to meet the needs of high-precision and narrow-bezel display products, and they also have manufacturing errors and deviations.
A preset opening is fabricated on the photomask substrate and then tensioned and fixed to the support frame. The preset opening is then enlarged to the actual opening, and the actual opening is formed through photoresist film, exposure, development, etching, and film removal steps. Finally, it is welded to the metal frame.
It simplifies the mask production process, improves production precision, meets the needs of high-precision and narrow-bezel display products, and reduces production difficulty and cost.
Smart Images
Figure CN116949401B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of display technology, and in particular to a method for manufacturing a photomask and the photomask itself. Background Technology
[0002] In the process of manufacturing display panels, photomasks are required. During the vapor deposition process, photomasks define the effective display area.
[0003] Traditional photomask manufacturing involves sequentially cleaning, laminating, exposing, developing, etching, and stripping the photomask substrate to create the photomask sheet. This sheet is then stretched using a screen tensioning machine while its position is continuously adjusted before finally being welded to a metal frame. This tension-based welding fixation prevents the photomask from sagging under its own weight, ensuring manufacturing precision. However, this method is complex because the constant adjustment of the photomask's position during tension application adds complexity to the welding process. Furthermore, the inherent manufacturing errors and tension variations further reduce the photomask's precision, making it unsuitable for high-precision and narrow-bezel display products.
[0004] Therefore, there is an urgent need for a method for making photomasks and a photomask to solve the above problems. Summary of the Invention
[0005] The purpose of this invention is to provide a method for manufacturing a photomask and a photomask, so as to improve the manufacturing accuracy of the photomask, meet the needs of high-precision display products and narrow-bezel display products, and make the manufacturing simple and convenient.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] A method for fabricating a photomask includes the following steps:
[0008] A preset opening is processed on a photomask substrate, the size of which is smaller than the size of the actual opening;
[0009] The mask substrate with the preset opening is tensioned and fixed onto the support frame;
[0010] The photomask substrate fixed to the support frame is further processed to enlarge the preset opening to the actual opening.
[0011] As a preferred embodiment, the photomask substrate is divided into connected opening areas and connecting areas, the connecting areas surrounding the outer periphery of the opening areas, and the opening areas are provided with the preset openings. The step of tensioning and fixing the photomask substrate with the preset openings onto the support frame specifically includes the following steps:
[0012] Tension the wire mesh and secure it to the support frame;
[0013] The connecting area of the photomask substrate is fixed to the screen;
[0014] The screen is cut to remove the screen that is stacked on the opening area of the photomask substrate.
[0015] As a preferred embodiment, when fixing the connecting area to the wire mesh, adhesive is applied to the portion of the wire mesh facing the connecting area to adhere and fix the connecting area to the wire mesh.
[0016] As a preferred embodiment, after the connecting area is pasted and fixed onto the wire mesh and the applied adhesive has dried, the wire mesh is cut.
[0017] As a preferred embodiment, increasing the preset opening to the actual opening specifically includes the following steps:
[0018] Film lamination: Coating a photoresist film onto the upper and lower surfaces of the photomask substrate fixed to the support frame;
[0019] Exposure: UV light is irradiated onto the photomask substrate after lamination through a photomask. The photomask blocks light at a portion of the photomask substrate, and the photoresist film irradiated by UV light undergoes a photopolymerization reaction.
[0020] Development: The developing solution is sprayed onto the exposed photomask substrate so that the photoresist film that has not been exposed to UV light reacts with the developing solution and exposes the photomask substrate.
[0021] Etching: An etching solution is sprayed onto the developed photomask substrate to etch the actual opening on the photomask substrate;
[0022] Photoresist removal: A photoresist removal solution is sprayed onto the etched photomask substrate to remove any residual photoresist film.
[0023] As a preferred embodiment, after enlarging the preset opening to the actual opening, the mask substrate with the support frame is aligned and welded to the metal frame.
[0024] As a preferred embodiment, after welding and fixing the mask substrate with the support frame to the metal frame, the support frame and the remaining wire mesh are removed.
[0025] As a preferred embodiment, the actual opening size is 0.5mm to 2mm larger than the preset opening size.
[0026] As a preferred embodiment, the preset opening is processed on the photomask substrate by laser or etching.
[0027] A photomask is fabricated using the photomask fabrication method described above.
[0028] The beneficial effects of this invention are:
[0029] This invention provides a method for manufacturing a photomask. This method involves first machining a preset opening on a photomask substrate, then tensioning and fixing the substrate with the preset opening to a support frame, and finally enlarging the preset opening to its actual size. This not only achieves tension on the photomask substrate, preventing deformation due to sagging, but also simplifies and streamlines the process by ensuring the positional accuracy of the enlarged opening, making the tensioning and fixing of the substrate on the support frame much simpler and more convenient. Furthermore, by tensioning and fixing the photomask substrate to the support frame before enlarging the preset opening, this method eliminates deviations that occur during the tensioning process, improving the manufacturing accuracy of the photomask and meeting the needs of high-precision display products and narrow-bezel display products.
[0030] The present invention also provides a photomask, which is manufactured using the above-described photomask manufacturing method, thereby improving the manufacturing accuracy of the photomask, meeting the needs of high-precision display products and narrow-bezel display products, and is simple and convenient to manufacture. Attached Figure Description
[0031] Figure 1 This is a flowchart of the main process of mask fabrication method provided in the embodiments of the present invention;
[0032] Figure 2 This is a schematic diagram of the mask fabrication process provided in an embodiment of the present invention;
[0033] Figure 3 This is a detailed flowchart of the mask fabrication method provided in the embodiments of the present invention.
[0034] In the picture:
[0035] 1. Mask substrate; 11. Preset opening; 12. Actual opening; 2. Support frame; 3. Screen printing; 4. Photoresist film; 5. Photomask; 6. Metal frame. Detailed Implementation
[0036] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0037] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0038] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0039] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.
[0040] Traditional photomask manufacturing involves sequentially cleaning, laminating, exposing, developing, etching, and stripping the photomask substrate to create the photomask sheet. This sheet is then stretched using a screen tensioning machine while its position is continuously adjusted before finally being welded to a metal frame. This tension-based welding fixation prevents the photomask from sagging under its own weight, ensuring manufacturing precision. However, this method is complex because the constant adjustment of the photomask's position during tension application adds complexity to the welding process. Furthermore, the inherent manufacturing errors and tension variations further reduce the photomask's precision, making it unsuitable for high-precision and narrow-bezel display products.
[0041] To solve the above problems, such as Figure 1 and Figure 2 As shown, this embodiment provides a method for manufacturing a photomask, including the following steps: processing a preset opening 11 on a photomask substrate 1, wherein the size of the preset opening 11 is smaller than the size of the actual opening 12; tensioning and fixing the photomask substrate 1 with the preset opening 11 to a support frame 2; and further processing the photomask substrate 1 fixed to the support frame 2 to increase the preset opening 11 to the size of the actual opening 12.
[0042] The photomask fabrication method provided in this embodiment first processes a preset opening 11 on the photomask substrate 1, then tensions and fixes the photomask substrate 1 with the preset opening 11 onto the support frame 2, and then enlarges the preset opening 11 to an actual opening 12. This not only achieves tensioning of the photomask substrate 1, preventing deformation due to sagging, but also simplifies and makes the tensioning and fixing of the photomask substrate 1 onto the support frame 2 simpler and more convenient, as long as the positional accuracy of the enlarged actual opening 12 is guaranteed. Furthermore, by tensioning and fixing the photomask substrate 1 onto the support frame 2 and then enlarging the preset opening 11 to an actual opening 12, the above fabrication method eliminates deviations generated during the tensioning process, improves the fabrication accuracy of the photomask, and meets the needs of high-precision display products and narrow-bezel display products.
[0043] It should be noted that the photomask substrate 1 is isotropic. If the photomask substrate 1 is tensioned and fixed on the support frame 2 and the actual opening 12 is directly machined on the photomask substrate 1, the isotropic characteristics of the photomask substrate 1 will be greatly affected. The actual opening 12 machined will easily deform under the action of tension force, which will seriously affect the manufacturing accuracy of the entire photomask.
[0044] In this embodiment, the actual opening 12 is 0.5mm to 2mm larger than the preset opening 11. This size limitation facilitates the tensioning and fixing of the mask substrate 1 to the support frame 2, eliminating deviations during tensioning, and also prevents deformation of the actual opening 12 under tensioning force when the preset opening 11 is enlarged, thus ensuring the mask manufacturing accuracy. For example, the actual opening 12 is 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.5mm, or 2mm larger than the preset opening 11.
[0045] Preferably, the actual opening 12 is 1 mm larger than the preset opening 11. Under this size constraint, deviations generated during the tensioning process of the photomask can be better eliminated, ensuring the manufacturing accuracy of the photomask.
[0046] It should be noted that, in this embodiment, when both the actual opening 12 and the preset opening 11 are rectangular, the size of the actual opening 12 is 0.5mm to 2mm larger than the size of the preset opening 11, meaning that both the length and width of the actual opening 12 are 0.5mm to 2mm larger than the length and width of the preset opening 11. When both the actual opening 12 and the preset opening 11 are circular, the inner diameter of the actual opening 12 is 0.5mm to 2mm larger than the inner diameter of the preset opening 11. When both the actual opening 12 and the preset opening 11 are irregular shapes, it is sufficient to ensure that the value constraining the size of the actual opening 12 is 0.5mm to 2mm larger than the value constraining the size of the preset opening 11.
[0047] Optionally, in this embodiment, the photomask substrate 1 is divided into an interconnected opening region and a connecting region, the connecting region surrounding the outer periphery of the opening region, and a pre-set opening 11 is processed on the opening region, such as... Figure 2 and Figure 3 As shown, the process of tensioning and fixing the mask substrate 1 with the pre-set opening 11 onto the support frame 2 specifically includes the following steps:
[0048] Tension the wire mesh 3 and fix it onto the support frame 2;
[0049] The connection area of the photomask substrate 1 is fixed on the screen 3;
[0050] The screen 3 is cut to remove the screen 3 that is stacked on the opening area of the mask substrate 1.
[0051] By first tensioning and fixing the wire mesh 3 to the support frame 2, and then fixing the connecting area of the photomask substrate 1 to the wire mesh 3, when the wire mesh 3 is cut on the opening area of the photomask substrate 1, the tension of the wire mesh 3 can ensure that the photomask substrate 1 is tensioned and fixed on the support frame 2. There is no need to directly tension the photomask substrate 1, and there is no need to consider the positional accuracy during the tensioning of the wire mesh 3, which makes the operation convenient and greatly reduces the difficulty of fixing the photomask substrate 1.
[0052] Specifically, in this embodiment, when fixing the connecting area to the screen 3, adhesive is applied to the portion of the screen 3 facing the connecting area to adhere and fix the connecting area to the screen 3. This adhesive method ensures the stability and reliability of the photomask substrate 1 on the screen 3, and is simple and convenient to operate.
[0053] Preferably, in this embodiment, after the connecting area is adhered and fixed to the wire mesh 3 and the applied adhesive has dried, the wire mesh 3 is cut. This operation method avoids the connecting area from separating from the wire mesh 3 under tensile force during the cutting operation, thus ensuring the stability and reliability of the structure.
[0054] In this embodiment, as Figure 2 and Figure 3 As shown, increasing the preset opening 11 to the actual opening 12 specifically includes the following steps:
[0055] Lamination: Photoresist film 4 is coated onto the upper and lower surfaces of the photomask substrate 1 fixed on the support frame 2; Exposure: UV light is irradiated onto the laminated photomask substrate 1 through a photomask 5. The photomask 5 blocks light at certain locations on the photomask substrate 1, and the photoresist film 4 irradiated by UV light undergoes a photopolymerization reaction; Development: A developing solution is sprayed onto the exposed photomask substrate 1 to allow the photoresist film 4, which was not irradiated by UV light, to react with the developing solution and expose the photomask substrate 1; Etching: An etching solution is sprayed onto the developed photomask substrate 1 to etch actual openings 12 on the photomask substrate 1; Removal: A removal solution is sprayed onto the etched photomask substrate 1 to remove residual photoresist film 4.
[0056] Through the above etching steps, the preset opening 11 is etched and enlarged to the actual opening 12, ensuring the accuracy of the processing of the actual opening 12. Preferably, before coating the upper and lower surfaces of the photoresist film 4, the photoresist film 1 can be cleaned to remove oil stains from the surface of the photoresist film 1, ensuring the accuracy of etching the actual opening 12.
[0057] It should be noted that in this embodiment, the support frame 2 is a fixture frame. For example... Figure 2 and Figure 3 As shown, after the preset opening 11 is enlarged to the actual opening 12, the mask substrate 1 with the support frame 2 is aligned and welded to the metal frame 6, thereby fixing the mask substrate 1 on the metal frame 6 and ensuring the stability and reliability of the mask substrate 1 fixed on the metal frame 6.
[0058] Preferably, such as Figure 2 and Figure 3 As shown, after the photomask substrate 1 with the support frame 2 is welded and fixed to the metal frame 6, the support frame 2 and the remaining wire mesh 3 are removed, making the finished photomask more aesthetically pleasing and neat. Furthermore, the removed support frame 2 can be reused, improving resource utilization and reducing manufacturing costs.
[0059] It should be noted that in this embodiment, the preset opening 11 is processed by laser on the photomask substrate 1. Processing the preset opening 11 on the photomask substrate 1 using a laser simplifies the processing procedure. It should also be noted that in other embodiments, the preset opening 11 can be processed by etching. Furthermore, when processing the preset opening 11 by etching, the specific operation steps are basically the same as those for enlarging the preset opening 11 to the actual opening 12, and will not be repeated here.
[0060] This embodiment also provides a photomask, which is manufactured using the above-described photomask manufacturing method. This improves the manufacturing accuracy of the photomask, meets the needs of high-precision display products and narrow-bezel display products, and is simple and convenient to manufacture.
[0061] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A method of making a mask, the method comprising: It comprises the following steps: Processing a preset opening (11) on a mask substrate (1), the size of the preset opening (11) is smaller than that of an actual opening (12); Tensioning and fixing the mask substrate (1) with the preset opening (11) on a support frame (2); Further processing the mask substrate (1) fixed on the support frame (2) to increase the preset opening (11) to the actual opening (12); The mask substrate (1) is divided into a connected opening area and a connecting area, the connecting area is arranged around the outer periphery of the opening area, the preset opening (11) is processed on the opening area, and the mask substrate (1) with the preset opening (11) is tensioned and fixed on the support frame (2) specifically comprises the following steps: Tensioning and fixing a silk screen (3) on the support frame (2); Fixing the connecting area of the mask substrate (1) on the silk screen (3); Cutting the silk screen (3) to remove the silk screen (3) stacked on the opening area of the mask substrate (1); Increasing the preset opening (11) to the actual opening (12) specifically comprises the following steps: Film pressing: coating a photoresist film (4) to the upper and lower surfaces of the mask substrate (1) fixed on the support frame (2); Exposure: UV light is irradiated to the mask substrate (1) after film pressing through a mask (5), the mask (5) blocks light at some positions of the mask substrate (1), and the photoresist film (4) irradiated by UV light undergoes photopolymerization reaction; Development: spraying a developing solution to the mask substrate (1) after exposure to make the photoresist film (4) not irradiated by UV light react with the developing solution and leak out of the mask substrate (1); Etching: spraying an etching solution to the mask substrate (1) after development to etch the actual opening (12) on the mask substrate (1); Film stripping: spraying a film stripping solution to the mask substrate (1) after etching to remove the residual photoresist film (4); After increasing the preset opening (11) to the actual opening (12), the mask substrate (1) with the support frame (2) is aligned and welded with a metal frame (6); After welding and fixing the mask substrate (1) with the support frame (2) on the metal frame (6), the support frame (2) and the remaining silk screen (3) are removed.
2. The method of claim 1, wherein, When the connecting area is fixed on the silk screen (3), glue is coated on the part of the silk screen (3) opposite to the connecting area to paste and fix the connecting area on the silk screen (3).
3. The method of claim 2, wherein, When the connecting area is pasted on the silk screen (3) and the coated glue is dry, the silk screen (3) is cut.
4. The method of claim 1 to 3, wherein The size of the actual opening (12) is 0.5mm-2mm larger than that of the preset opening (11).
5. The method of claim 1-3, wherein Processing the preset opening (11) on the mask substrate (1) by means of laser or etching.
6. A mask, characterized in that, The mask manufacturing method of any one of claims 1-5 is used for manufacturing.
Citation Information
Patent Citations
Mask plate manufacturing method and mask plate
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