Bonding machine with detection and adjustment level function

Abstract

The present application is a bonding machine with detection and adjustment functions, which mainly comprises a first cavity, a second cavity, a compression unit, a platform, a plurality of horizontal adjustment units and a plurality of telescopic distance measuring units. The first cavity is used to connect the second cavity, and a sealed space is formed between the two. The compression unit is arranged in the first cavity, and the platform is arranged in the second cavity. The compression unit faces the platform and is used to bond the substrate placed on the platform. The horizontal adjustment unit is arranged on the first cavity, and the telescopic distance measuring unit is arranged on the second cavity. When the compression unit approaches the platform, it will contact and compress the telescopic distance measuring unit to measure the level of the compression unit, and adjust the level of the compression unit through the horizontal adjustment unit, so that the compression unit and the platform can continuously maintain the level.

Description

Technical Field

[0001] This invention relates to a bonding machine with a level detection and adjustment function, which can measure the level of the bonding unit during use and adjust the level of the bonding unit in real time. Background Technology

[0002] Integrated circuit technology has matured, and electronic products are currently trending towards thinner, smaller, higher-performance, more reliable, and smarter designs. Chips within electronic products significantly impact their performance, with some of these performance characteristics related to chip thickness. For example, thinner chips can improve heat dissipation efficiency, enhance mechanical properties, improve electrical performance, and reduce package size and weight.

[0003] In semiconductor manufacturing, substrate thinning, via etching, and back metallization are typically performed on the back side (bottom surface) of the chip. However, during substrate thinning, if the substrate thickness is too thin (e.g., less than or equal to 150 micrometers), it may cause wafer breakage or bending deformation, rendering the chip unusable and reducing chip yield.

[0004] Therefore, a bonding process is performed before the substrate thinning process. This mainly involves placing an adhesive layer between the wafer and the carrier (e.g., sapphire glass), and then bonding the wafer and carrier together using a lamination unit and a stage. After the substrate thinning process is completed, a debonding process is performed to separate the wafer from the carrier.

[0005] However, if the bonding unit and the stage are not kept horizontal during the bonding process, the bonding force of the bonding unit and the stage on the wafer and the carrier may be uneven, resulting in bonding bubbles in the adhesive layer between the substrate and the carrier, and poor total thickness variation (TTV) of the bonded wafer. Summary of the Invention

[0006] To address the problems encountered in prior art, this invention proposes a novel bonding machine with level detection and adjustment functions. It can detect the level of the bonding unit through multiple telescopic distance measuring units and adjust the level of the bonding unit based on the detection results. This ensures that the bonding unit and the stage remain continuously level, and applies uniform pressing force to the first and second substrates between them, thereby preventing bonding bubbles from forming between the first and second substrates.

[0007] One objective of this invention is to provide a bonding machine with detection and adjustment functions for horizontality, which mainly includes a first cavity, a second cavity, a pressing unit, a stage, multiple horizontal adjustment units and multiple telescopic distance measurement units, wherein the first cavity is used to connect the second cavity and form a sealed space between the two.

[0008] The laminating unit is located in the first cavity, while the stage is located in the second cavity. The bearing surface of the stage is used to support the stacked first and second substrates, while the laminating unit faces the stage. The laminating unit can be displaced relative to the stage and used to press the first and second substrates on the stage to form a bonding substrate.

[0009] Telescopic distance measuring units are installed around the platform and protrude from the platform's bearing surface. Three telescopic distance measuring units can be used to measure the distance between three non-collinear points on the pressing unit to determine the levelness of the pressing unit.

[0010] A horizontal adjustment unit passes through the first cavity, with one end connected to the pressing unit and the other end located outside the first cavity and the enclosed space. When the pressing unit is not kept horizontal, the horizontal level between the pressing unit and the bearing surface of the platform can be adjusted using the horizontal adjustment unit located outside the enclosed space.

[0011] Specifically, this invention can determine whether the pressing unit is level by measuring the results of the telescopic distance measuring unit, and adjust the level of the pressing unit in real time using a leveling adjustment unit. During the measurement and adjustment of the pressing unit's level, the sealed space between the first and second cavities can be maintained at low pressure or vacuum to improve the accuracy of measuring and adjusting the pressing unit's level.

[0012] To achieve the above objectives, the present invention proposes a bonding machine with detection and adjustment functions for leveling, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect to the second cavity and form a sealed space between the first cavity and the second cavity; a pressing unit connected to the first cavity and located in the sealed space; a stage connected to the second cavity and located in the sealed space, the stage including a bearing surface facing the pressing unit, wherein the bearing surface is used to support a first substrate and a second substrate stacked together; and a plurality of leveling adjustment units disposed on the first cavity and including an adjustment rod, wherein the adjustment... A rod passes through the first cavity and connects to the pressing unit, while a portion of the adjusting rod is located outside the sealed space and forms an adjusting part on the first cavity; and multiple telescopic distance measuring units are disposed on the second cavity and include: a fixed base; a rod facing the pressing unit and higher than the bearing surface of the platform; a base connecting the rod and connected to the fixed base via a slide rail; and an elastic unit located between the base and the fixed base, wherein when the pressing unit moves toward the platform, it contacts the rod, causing the rod and the base to move relative to the fixed base and compress the elastic unit, so as to measure the distance between the pressing unit and the multiple telescopic distance measuring units.

[0013] The bonding machine with detection and adjustment level functions includes a telescopic distance measuring unit comprising an optical ruler or a magnetic ruler, which is set on a fixed base to measure the distance that the rod and base move relative to the fixed base, so as to know the distance between the bonding unit and multiple telescopic distance measuring units.

[0014] The bonding machine with detection and adjustment of level functions includes a fixed base comprising a bottom and a side, the bottom and the side being perpendicular, the base being connected to the bottom via an elastic unit and connected to the side via a slide rail.

[0015] The bonding machine with detection and adjustment of level functions includes a level adjustment unit comprising a hanging rod connected to the bonding unit.

[0016] The bonding machine with detection and adjustment level functions includes a level adjustment unit comprising a housing connected to and fixed on a first cavity, and an adjustment rod and a hanging rod passing through the housing and the first cavity and connected to the pressing unit, wherein the adjustment rod and the hanging rod are respectively connected to the housing via a shaft sealing unit.

[0017] The bonding machine with detection and adjustment level functions includes an adjustment rod comprising a connecting part, a first elastic part, and a first sleeve. One end of the connecting part is connected to the pressing unit, and the other end of the connecting part is connected to the adjustment part via the first elastic part. The first sleeve is sleeved outside the first elastic part, and one end of the first sleeve is connected to the pressing unit.

[0018] The bonding machine with detection and adjustment level functions includes a bonding unit driver connected to a bonding unit, which drives the bonding unit to move closer to or away from the stage, and the bonding unit presses the first substrate and the second substrate carried by the stage.

[0019] The bonding machine with detection and adjustment level functions has multiple telescopic distance measurement units located around the stage.

[0020] The bonding machine with detection and adjustment level functions includes a pressing unit comprising multiple protrusions corresponding to multiple telescopic distance measuring units. When the pressing unit moves toward the platform, the protrusions will contact the rod.

[0021] The bonding machine with detection and adjustment level functions has three or more protrusions and telescopic distance measuring units.

[0022] The beneficial effects of this invention are: it provides a novel bonding machine with detection and adjustment functions, which can measure the level of the bonding unit through multiple telescopic distance measuring units, and adjust the level of the bonding unit based on the measurement results. This ensures that the bonding unit and the stage remain continuously level, and applies uniform pressing force to the first and second substrates between them, thereby avoiding the formation of bonding bubbles between the first and second substrates. Attached Figure Description

[0023] Figure 1 This is a perspective view of an embodiment of a bonding machine with detection and adjustment functions according to the present invention.

[0024] Figure 2 This is a cross-sectional schematic diagram of an embodiment of a bonding machine with detection and adjustment functions according to the present invention.

[0025] Figure 3 This is a partial cross-sectional schematic diagram of another embodiment of the bonding machine with detection and adjustment level functions of the present invention.

[0026] Figure 4 This is a perspective view of an embodiment of the telescopic distance measuring unit of the bonding machine with detection and adjustment of level functions according to the present invention.

[0027] Figure 5 This is a side view of an embodiment of the telescopic distance measuring unit of the bonding machine with level detection and adjustment functions of the present invention.

[0028] Figure 6 This is a perspective view of an embodiment of the bonding machine with detection and adjustment of horizontality functions of the present invention, including the stage, pressing unit, and telescopic distance measuring unit.

[0029] Figure 7This is a top view of an embodiment of the bonding machine platform with detection and adjustment functions according to the present invention.

[0030] Explanation of reference numerals in the attached drawings: 10 - Bonding machine with detection and adjustment functions; 111 - First cavity; 112 - Sealed space; 113 - Second cavity; 121 - First substrate; 123 - Second substrate; 13 - Pressing unit; 131 - Pressing plate; 132 - Second heating unit; 133 - Connecting plate; 135 - Fixing rod; 137 - Protrusion; 14 - Alignment unit; 15 - Stage; 151 - Bearing surface; 153 - First heating unit; 16 - Vacuum motor; 17 - Horizontal adjustment unit; 171 - Adjusting rod; 1711 - Adjustment part; 1713 - First elastic part; 1715 - Connecting part; 1717- First sleeve; 172- Shaft sealing unit; 173- Hanging rod; 1731- Fixed end; 1733- Second elastic part; 1735- Connecting end; 1737- Second sleeve; 175- Housing; 1761- First fixing unit; 1763- Second fixing unit; 18- Telescopic distance measuring unit; 180- Processor; 181- Rod body; 182- Base; 183- Fixing seat; 1831- Bottom; 1833- Side; 185- Elastic unit; 187- Optical scale; 189- Slide rail; 191- Cavity driver; 193- Pressing unit driver. Detailed Implementation

[0031] Please see Figure 1 and Figure 2 Figures show a perspective view and a cross-sectional view of an embodiment of a bonding machine with level detection and adjustment functions according to the present invention. As shown in the figures, the bonding machine 10 with level detection and adjustment functions includes a first cavity 111, a second cavity 113, a pressing unit 13, a platform 15, multiple level adjustment units 17, and multiple telescopic distance measuring units 18. The first cavity 111 faces the second cavity 113, and the first cavity 111 is movable relative to the second cavity 113.

[0032] like Figure 2 As shown, the pressing unit 13 is located within and connected to the first cavity 111. The platform 15 is located within and connected to the second cavity 113. The bearing surface 151 of the platform 15 faces the pressing unit 13. After the first cavity 111 is connected to the second cavity 113, a sealed space 112 is formed between them, and the pressing unit 13 and the platform 15 are located within the sealed space 112.

[0033] like Figure 1As shown, in one embodiment of the present invention, the first cavity 111 may be connected to a cavity actuator 191, wherein the cavity actuator 191 is located outside the sealed space 112 and connected to the first cavity 111. The cavity actuator 191 is used to drive the first cavity 111 to move relative to the second cavity 113. For example, the cavity actuator 191 may be a linear actuator.

[0034] Furthermore, the bonding unit driver 193 is located outside the enclosed space 112 and connected to the bonding unit 13. For example, the bonding unit driver 193 can be a linear actuator used to drive the bonding unit 13 to move closer to or away from the stage 15. After the alignment of the first substrate 121 and the second substrate 123 is completed, the bonding unit driver 193 can drive the bonding unit 13 to move closer to the bearing surface 151 of the stage 15 and press the first substrate 121 and the second substrate 123 carried by the stage 15 to complete the bonding of the first substrate 121 and the second substrate 123.

[0035] like Figure 2 and Figure 3 As shown, a vacuum motor 16 may be provided in the first cavity 111 or the second cavity 113. The vacuum motor 16 is fluidly connected to the sealed space 112 and is used to extract the gas in the sealed space 112 to reduce the pressure in the sealed space 112, so that the sealed space 112 is maintained in a vacuum or low-pressure state.

[0036] like Figure 3 As shown, the bearing surface 151 of the stage 15 is used to support a first substrate 121 and a second substrate 123 stacked together. For example, the first substrate 121 is a bearing substrate, and the second substrate 123 is a wafer. An adhesive layer is provided between the first substrate 121 and the second substrate 123 to bond the first substrate 121 and the second substrate 123 together. In different embodiments, the first substrate 121 and the second substrate 123 may also be wafers that have undergone semiconductor processing.

[0037] The pressing unit 13 includes a pressing plate 131, a connecting plate 133, and a plurality of fixing rods 135, wherein the connecting plate 133 is connected to the pressing plate 131 through the fixing rods 135. The pressing plate 131 faces the bearing surface 151 of the stage 15 and is used to press the first substrate 121 and the second substrate 123 placed on the stage 15. The pressing unit 13, including the pressing plate 131, the connecting plate 133, and the fixing rods 135, is only one embodiment of the present invention and is not a limitation of the scope of the present invention.

[0038] In one embodiment of the present invention, a first heating unit 153 may be disposed in the stage 15, and a second heating unit 132 may be disposed in the pressing unit 13. The first heating unit 153 and the second heating unit 132 can heat the first substrate 121, the second substrate 123 and the adhesive layer between the pressing unit 13 and the stage 15 during the bonding process.

[0039] Multiple horizontal adjustment units 17 are disposed on the first cavity 111, wherein the horizontal adjustment unit 17 passes through the top of the first cavity 111 and is connected to the pressing unit 13 in the sealed space 112. The horizontal adjustment unit 17 includes an adjustment rod 171, wherein the adjustment rod 171 passes through the first cavity 111 and is connected to the pressing unit 13.

[0040] The adjusting rod 171 may include an adjusting portion 1711 and a connecting portion 1715. A portion of the adjusting rod 171 is disposed in the first cavity 111 and located outside the sealed space 112, forming the adjusting portion 1711 on the first cavity 111. The portion of the adjusting rod 171 located within the sealed space 112 forms the connecting portion 1715, and one end of the connecting portion 1715 is connected to the pressing unit 13. For example, the connecting plate 133 of the pressing unit 13 may have multiple screw holes on its surface facing the first cavity 111, and the connecting portion 1715 includes a screw and is screwed into the screw holes of the pressing unit 13. When the user rotates the exposed adjusting rod 171, the connecting portion 1715 also rotates relative to the pressing unit 13, changing the length of the connecting portion 1715 entering the screw holes to adjust the horizontal height of the pressing unit 13.

[0041] In one embodiment of the present invention, the adjusting rod 171 may include a first elastic portion 1713, wherein the other end of the connecting portion 1715 is connected to the adjusting portion 1711 via the first elastic portion 1713, for example, the first elastic portion 1713 may be a spring. When the length of the connecting portion 1715 entering the screw hole increases, the pressing unit 13 will displace upward or toward the first cavity 111 and compress the first elastic portion 1713. When the length of the connecting portion 1715 entering the screw hole decreases, the pressing unit 13 will displace downward or away from the first cavity 111, causing the first elastic portion 1713 to elongate. In addition, a first sleeve 1717 may be sleeved on the outside of the first elastic portion 1713, wherein one end of the first sleeve 1717 is connected or fixed to the pressing unit 13 and moves downward or upward with the pressing unit 13.

[0042] In another embodiment of the present invention, the horizontal adjustment unit 17 may include a hanging rod 173, which passes through the first cavity 111 and is connected to the pressing unit 13. The structure of the hanging rod 173 is similar to that of the adjustment rod 171, and includes a fixed end 1731 and a connecting end 1735, wherein the fixed end 1731 is the hanging rod 173 disposed outside the first cavity 111 and the sealed space 112, and the connecting end 1735 is located inside the sealed space 112 and is used to connect to the pressing unit 13. Furthermore, a second elastic part 1733 may be provided between the fixed end 1731 and the connecting end 1735, and a second sleeve 1737 may be sleeved on the outside of the second elastic part 1733, wherein one end of the second sleeve 1737 is connected to or fixed on the pressing unit 13.

[0043] When the user adjusts the level of the pressing unit 13 using the adjusting rod 171, the second elastic portion 1733 of the hanging rod 173 is also compressed or extended, and the second sleeve 1737 also moves downward or upward with the pressing unit 13. Furthermore, in one embodiment of the invention, the connecting end 1735 of the hanging rod 173 can be fixed to the pressing unit 13, so that the hanging rod 173 does not rotate relative to the pressing unit 13. In different embodiments, the hanging rod 173 can also be designed to rotate relative to the pressing unit 13.

[0044] Furthermore, the leveling unit 17 may include a housing 175 connected and fixed to the first cavity 111, while the adjusting rod 171 and / or the hanging rod 173 pass through the housing 175 and the first cavity 111, are fixed to the housing 175, and are connected to the pressing unit 13. For example, the adjusting rod 171 and / or the hanging rod 173 may be connected to the housing 175 via a shaft sealing unit 172 and / or at least one bearing, so that the adjusting rod 171 and / or the hanging rod 173 can rotate relative to the housing 175 and the first cavity 111, and maintain a low-pressure or vacuum state within the sealed space 112.

[0045] Specifically, the adjusting part 1711 of the adjusting rod 171 and the fixed end 1731 of the hanging rod 173 can be fixed to the housing 175 via a first fixing unit 1761 and a second fixing unit 1763, respectively, so that the adjusting rod 171 and / or the hanging rod 173 will not rotate relative to the housing 175 and / or the first cavity 111, and fix the height and level of the pressing unit 13. For example, the first fixing unit 1761 and the second fixing unit 1763 can be nuts.

[0046] like Figure 2 , Figure 4 and Figure 5As shown, multiple telescopic distance measuring units 18 are disposed on the second cavity 113 and face the pressing unit 13. Each telescopic distance measuring unit 18 includes a rod 181, a base 182, a fixed seat 183, and an elastic unit 185. The rod 181 is disposed on the base 182 and faces the pressing unit 13, and is higher than the bearing surface 151 of the platform 15. The base 182 connects to the rod 181 and is disposed on the fixed seat 183 via a slide rail 189. The base 182 is also connected to the fixed seat 183 via the elastic unit 185, allowing the rod 181 and the base 182 to move relative to the fixed seat 183 along the slide rail 189 and compress the elastic unit 185.

[0047] like Figure 4 and Figure 5 As shown, in one embodiment of the present invention, the fixing base 183 may include a bottom 1831 and a side portion 1833, for example, the bottom 1831 and the side portion 1833 are plate-shaped, wherein the included angle between the two is approximately 90 degrees. A slide rail 189 is disposed on the side portion 1833 of the fixing base 183, and the base 182 is connected to the side portion 1833 of the fixing base 183 via the slide rail 189, so that the rod 181 and the base 182 can be displaced relative to the fixing base 183 along the slide rail 189.

[0048] The elastic unit 185 is disposed between the base 182 and the bottom 1831 of the fixed seat 183. When the rod 181 and the base 182 move relative to the fixed seat 183 along the slide rail 189, for example, when the rod 181 is subjected to downward pressure, the bottom 1831 of the base 182 and the fixed seat 183 will compress the elastic unit 185 between them. When the downward pressure on the rod 181 disappears, the elastic unit 185 will extend, causing the rod 181 to return to its original uncompressed height.

[0049] In one embodiment of the present invention, a marking scale may be provided on the side 1833 of the fixed base 183. When the rod 181 and the base 182 are displaced relative to the fixed base 183, the displacement distance of the rod 181 and the base 182 can be known through the marking scale.

[0050] In another embodiment of the present invention, an optical ruler 187 may be provided on the fixed base 183 and / or the base 182, and the distance of displacement of the rod 181 and the base 182 relative to the fixed base 183 may be measured by the optical ruler 187. The optical ruler 187 is a common distance measuring device, which typically includes components such as a main ruler, a secondary ruler, and a light sensor, and is a device well known to those skilled in the art to which this invention pertains, and will not be described in detail here. In different embodiments, the optical ruler 187 may also be replaced by a magnetic ruler.

[0051] like Figure 5As shown, the number of telescopic distance measuring units 18 described in this invention can be three or more, and they are arranged around the platform 15. For ease of explanation, three telescopic distance measuring units 18 are used in this embodiment, but in actual applications, the number of telescopic distance measuring units 18 can be greater than three. The three telescopic distance measuring units 18 of this invention are not arranged on the same straight line, and the rod 181 of the telescopic distance measuring unit 18 is higher than the bearing surface 151 of the platform 15 when not subjected to external force.

[0052] In one embodiment of the present invention, three telescopic distance measuring units 18 are arranged equidistantly around the platform 15. The equidistant arrangement of the three telescopic distance measuring units 18 is only one embodiment of the present invention; in other embodiments, the three telescopic distance measuring units 18 may also be arranged unequally around the platform 15.

[0053] As the pressing unit 13 moves toward the platform 15, it comes into contact with the rod 181 of the telescopic distance measuring unit 18. As the pressing unit 13 continues to move toward the platform 15, it applies pressure to the rod 181 of the telescopic distance measuring unit 18, causing the rod 181 and base 182 to displace relative to the fixed base 183 and compress the elastic unit 185. In this manner, each telescopic distance measuring unit 18 can measure the distance between itself and the pressing unit 13.

[0054] like Figure 6 As shown, the pressing unit 13 may be provided with multiple protrusions 137, each corresponding to a multiple telescopic distance measuring unit 18. For example, three protrusions 137 may be provided around the pressing plate 131 and protrude radially along the pressing plate 131. The three protrusions 137 are not arranged on the same straight line and each corresponds to a telescopic distance measuring unit 18. When the pressing unit 13 moves toward the platform 15, each protrusion 137 of the pressing unit 13 will contact and press down on the rod 181 of each telescopic distance measuring unit 18.

[0055] Specifically, the three telescopic distance measuring units 18 can respectively measure the distance between the pressing unit 13 and the three protrusions 137 or the three contact points of the pressing plate 131. For example, the distances between the pressing unit 13 and the three telescopic distance measuring units 18 are measured as a first distance, a second distance, and a third distance. If the first distance, the second distance, and the third distance are equal, it indicates that the pressing unit 13 is horizontal. The protrusions 137 are not essential components of this invention. In practical applications, the three telescopic distance measuring units 18 can also directly contact the three non-collinear points of the pressing plate 131.

[0056] When the difference between the first distance, the second distance and / or the third distance is greater than a threshold value, it indicates that the pressing unit 13 is not level with the bearing surface 151 of the stage 15, and may cause uneven pressing force of the pressing unit 13 and the stage 15 on the first substrate 121 and the second substrate 123, resulting in bonding bubbles in the adhesive layer between the first substrate 121 and the second substrate 123.

[0057] In one embodiment of the present invention, the optical rulers 187 or magnetic rulers of the plurality of telescopic distance measuring units 18 can be electrically connected to a processor 180 or a computer. The processor 180 is used to receive the distances measured by each telescopic distance measuring unit 18 and calculate whether the difference between each distance is greater than a threshold value. When the difference between any two distances is greater than the threshold value, the processor 180 can control an alarm unit to issue an alarm signal, such as a horn or a light-emitting diode, and use it to generate sound or light to remind the user to adjust the level between the pressing unit 13 and the platform 15.

[0058] In addition, such as Figure 7 As shown, a plurality of alignment units 14 can be provided on the bearing surface 151 of the stage 15, wherein the plurality of alignment units 14 can be close to or away from the first substrate 121 and the second substrate 123 on the stage 15, so that the second substrate 123 is aligned with the first substrate 121.

[0059] In practical applications, the bonding machine 10, which has the function of detecting and adjusting the level, can be calibrated. First, the pressing unit 13 is driven by the pressing unit driver 193 to move closer to the stage 15, so that the pressing plate 131 of the pressing unit 13 contacts the bearing surface 151 of the stage 15. Then, the level adjustment unit 17 is released, for example, the first fixing unit 1761 and the second fixing unit 1763 are released, so that the pressing plate 131 is completely in contact with the bearing surface 151 of the stage 15.

[0060] Then, the distance between the pressing unit 13 and the multiple telescopic distance measuring units 18 is measured and zeroed. For example, when the pressing unit 13 is completely in contact with the bearing surface 151 of the platform 15, the distance of the pressing unit 13 measured by the multiple telescopic distance measuring units 18 is defined as zero. After the multiple telescopic distance measuring units 18 are zeroed, the horizontal adjustment unit 17 can be tightened to fix the position of the pressing unit 13.

[0061] After the above steps, the zeroing calibration of the bonding machine 10, which has the function of detecting and adjusting the level, is initially completed, and bonding of the first substrate 121 and the second substrate 123 can be performed. During the bonding process, the level of the bonding unit 13 can be continuously measured by the telescopic distance measuring unit 18.

[0062] Advantages of this invention:

[0063] A novel bonding machine with level detection and adjustment functions is provided. It measures the level of the bonding unit using multiple telescopic distance measuring units and adjusts the level of the bonding unit based on the measurement results. This ensures that the bonding unit and the stage remain continuously level, and applies uniform pressing force to the first and second substrates between them, thereby preventing bonding bubbles from forming between the first and second substrates.

[0064] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A bonder station having a function of detecting and adjusting a level, characterized by comprising: include: First cavity; The second cavity faces the first cavity, wherein the first cavity is used to connect the second cavity and form a sealed space between the first cavity and the second cavity; The pressing unit is connected to the first cavity and is located in the sealed space; A stage, connected to the second cavity and located in the sealed space, the stage includes a bearing surface facing the pressing unit, wherein the bearing surface is used to support the stacked first substrate and second substrate; Multiple horizontal adjustment units are disposed on the first cavity and include adjustment rods, wherein the adjustment rods pass through the first cavity and are connected to the pressing unit, and a portion of the adjustment rods is located outside the sealed space and forms an adjustment part on the first cavity; and Multiple telescopic distance measurement units are disposed on the second cavity and include: A mounting base, wherein the mounting base includes a bottom and a side, the bottom being perpendicular to the side; The rod is positioned towards the pressing unit and is higher than the bearing surface of the platform; The base connects to the rod and is connected to the fixed seat via a slide rail; and An elastic unit is located between the base and the fixed seat. When the pressing unit moves toward the platform, it contacts the rod, causing the rod and the base to move relative to the fixed seat and compress the elastic unit to measure the distance between the pressing unit and the plurality of telescopic distance measuring units. The base is connected to the bottom via the elastic unit and to the side via the slide rail.

2. The bonding machine with detection and adjustment level functions according to claim 1, characterized in that, The telescopic distance measuring unit includes an optical ruler or a magnetic ruler, which is set on the fixed base to measure the distance that the rod and the base move relative to the fixed base, so as to know the distance between the pressing unit and the plurality of telescopic distance measuring units.

3. The bonding machine with detection and adjustment level functions according to claim 1, characterized in that, The horizontal adjustment unit includes a hanging rod that is connected to the pressing unit.

4. The bonding machine with detection and adjustment level functions according to claim 3, characterized in that, The leveling unit includes a housing connected to and fixed to the first cavity, while the adjusting rod and the hanging rod pass through the housing and the first cavity and are connected to the pressing unit. The adjusting rod and the hanging rod are respectively connected to the housing via a shaft sealing unit.

5. The bonding machine with detection and adjustment level functions according to claim 1, characterized in that, The adjusting rod includes a connecting part, a first elastic part, and a first sleeve. One end of the connecting part is connected to the pressing unit, and the other end of the connecting part is connected to the adjusting part via the first elastic part. The first sleeve is sleeved outside the first elastic part, and one end of the first sleeve is connected to the pressing unit.

6. The bonding machine with level detection and adjustment function according to claim 1, characterized in that, The device includes a pressing unit driver connected to the pressing unit, which drives the pressing unit to move closer to or away from the stage, and presses the first substrate and the second substrate carried on the stage with the pressing unit.

7. The bonding machine with level detection and adjustment function according to claim 1, characterized in that, The multiple telescopic distance measurement units are located around the platform.

8. The bonding machine with level detection and adjustment function according to claim 1, characterized in that, The pressing unit includes multiple protrusions corresponding to the multiple telescopic distance measuring units. When the pressing unit moves toward the platform, the protrusions will contact the rod.

9. The bonding machine with level detection and adjustment function according to claim 8, characterized in that, The number of the protrusion and the telescopic distance measuring unit is three or more.

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