Circuit board with embedded connector and method of manufacturing the same

Abstract

The application discloses a circuit board embedded with a connector, which comprises an inner layer circuit board, a first outer layer circuit board, a second outer layer circuit board and a conductive block. The first outer layer circuit board comprises a first base layer and a first outer layer conductive layer, and the second outer layer circuit board comprises a second base layer and a solder pad. The first base layer and the second base layer are respectively bonded to opposite sides of the inner layer circuit board through an insulating layer. The first outer layer conductive layer comprises a first metal layer and a first metal plating layer which are arranged in a stack. The first metal layer is in contact with the first base layer. The circuit board is provided with an opening which penetrates the first base layer, the first metal layer, the inner layer circuit board and the insulating layer. The solder pad is exposed in the opening. The conductive block is accommodated in the opening and covered by the first metal plating layer, and the conductive block is welded to the solder pad. Cavities are formed in the conductive block and the first metal plating layer. The connector is accommodated in the cavities and welded to the conductive block and the first metal plating layer. The application further provides a manufacturing method of the circuit board embedded with the connector.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a circuit board with an embedded connector and a method for manufacturing the same. Background Technology

[0002] A spring-loaded pin, also known as a pogo pin, is a common precision connector used in electronic products. It is typically used to connect two active devices and transmit current or signals between them. For example, spring-loaded pins are mounted on a circuit board to electrically connect the board to other components. Typically, spring-loaded pins are soldered to the surface of the circuit board, which affects the thinning of the circuit board. Summary of the Invention

[0003] In view of this, it is necessary to provide a circuit board for an embedded connector that can solve the above-mentioned technical problems and a method for manufacturing the same.

[0004] This application provides a circuit board for an embedded connector, including an inner circuit board, a first outer circuit board, a second outer circuit board, a conductive block, and a connector. The first outer circuit board includes a first base layer and a first outer conductive layer stacked together. The second outer circuit board includes a second base layer and solder pads stacked together. The side of the first base layer away from the first outer conductive layer and the side of the second base layer with the solder pads are respectively bonded to opposite sides of the inner circuit board through an insulating layer. The first outer conductive layer includes a first metal layer and a first metal plating layer stacked together. The first metal layer is in contact with the first base layer. The circuit board has an opening that passes through the first base layer, the first metal layer, the inner circuit board, and the insulating layer. The solder pads are exposed in the opening. The conductive block is accommodated in the opening and covered by the first metal plating layer, and the conductive block is soldered to the solder pads. A cavity is formed on the conductive block and the first metal plating layer. The connector is accommodated in the cavity and soldered to the conductive block and the first metal plating layer.

[0005] This application also provides a method for manufacturing a circuit board with an embedded connector, comprising the following steps:

[0006] An inner circuit board is provided, and a first opening is formed on the inner circuit board that penetrates the inner circuit board;

[0007] Two insulating layers are provided, and a second opening is formed in each insulating layer, penetrating the insulating layer;

[0008] A first stacked structure is provided, and a third opening is formed in the first stacked structure, the first stacked structure including a first base layer and a first metal layer stacked together;

[0009] A second laminated structure is provided, the second laminated structure including a second base layer and a solder pad disposed on the second base layer;

[0010] A conductive block is provided, and the conductive block is soldered onto the solder pad to obtain a first intermediate body;

[0011] The two insulating layers, the inner circuit board, and the first laminated structure are pressed onto one side of the first intermediate body to obtain a second intermediate body. The side of the first base layer away from the first metal layer and the side of the second base layer with the solder pad are respectively bonded to the opposite sides of the inner circuit board through the two insulating layers. The first opening, the second opening, and the third opening are connected to form an opening, and the conductive block is accommodated in the opening.

[0012] A first metal plating layer is formed on the side of the first metal layer opposite to the first base layer, and the first metal plating layer covers the conductive block;

[0013] A cavity is formed by removing a portion of the first metal plating and the conductive block.

[0014] The connector is soldered into the cavity, and the connector is electrically connected to the conductive block.

[0015] In the embedded connector circuit board and its manufacturing method provided in this application, the conductive block is embedded in the circuit board by setting an opening and a first metal plating layer; then, the connector is embedded in the circuit board by opening a cavity on the stacked first metal plating layer and conductive block to achieve thinness. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of an inner layer circuit board provided in one embodiment of this application.

[0017] Figure 2 In order to be in Figure 1 A cross-sectional schematic diagram showing the first opening formed on the inner circuit board.

[0018] Figure 3 This is a cross-sectional schematic diagram of an insulating layer provided in one embodiment of this application.

[0019] Figure 4 This is a cross-sectional schematic diagram of a first layered structure provided in one embodiment of this application.

[0020] Figure 5 This is a cross-sectional schematic diagram of a second layered structure provided in one embodiment of this application.

[0021] Figure 6 To solder the conductive block to Figure 5 A schematic cross-sectional view of the first intermediate obtained on the second stacked structure shown.

[0022] Figure 7 This is a schematic diagram showing the arrangement of the insulating layer, inner circuit board, first stacked structure, and first intermediate body according to an embodiment of this application.

[0023] Figure 8 To be Figure 7 A schematic cross-sectional view of the second intermediate obtained after the insulating layer, inner circuit board, and first stacked structure are pressed together on one side of the first intermediate.

[0024] Figure 9 In order to be in Figure 8 The diagram shows a cross-sectional view of the second intermediate body after the formation of the first metal plating layer, the second metal plating layer, the second conductive structure, the third conductive structure, and the fourth conductive structure.

[0025] Figure 10 In order to be in Figure 9 The diagram shows a cross-sectional view of the first metal plating layer and the second metal plating layer after the formation of the solder resist layer.

[0026] Figure 11 In order to be in Figure 10 The diagram shows a cross-section after removing part of the structure to form a second cavity and removing part of the structure to expose the cover layer.

[0027] Figure 12 for Figure 11 A schematic diagram of the conductive block shown.

[0028] Figure 13 This is a cross-sectional schematic diagram of a circuit board for an embedded connector provided in one embodiment of this application.

[0029] Explanation of main component symbols

[0030] Inner circuit board 10

[0031] 11 grassroots

[0032] First inner conductive layer 12

[0033] Second inner conductive layer 13

[0034] First conductive structure 14

[0035] Covering layer 15

[0036] Area 10A

[0037] Area 2, 10B

[0038] First opening 101

[0039] Insulation layer 20

[0040] Second opening 201

[0041] First layer structure 30

[0042] Third opening 301

[0043] First grassroots level 31

[0044] First metal layer 32

[0045] Second layer structure 40

[0046] Second grassroots level 41

[0047] solder pad 42

[0048] Second metal layer 43

[0049] Conductive block 50

[0050] First intermediate 60

[0051] Bottom wall 51

[0052] Side wall 52

[0053] First solder paste 53

[0054] First cavity 501

[0055] Second intermediate 70

[0056] Opening 110

[0057] Exposed surface 21

[0058] First metal plating layer 33

[0059] Second metal plating layer 44

[0060] Second conductive structure 81

[0061] Third conductive structure 82

[0062] Fourth conductive structure 83

[0063] First outer conductive layer 34

[0064] Second outer conductive layer 45

[0065] 90% solder resist layer

[0066] Second cavity 502

[0067] Cavity 503

[0068] Step surface 504

[0069] Connector 120

[0070] Second solder paste 54

[0071] Circuit board 100

[0072] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0073] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0074] One embodiment of this application provides a method for manufacturing a circuit board with an embedded connector, which includes the following steps.

[0075] Step S1, please refer to Figure 1 Provides inner layer circuit board 10.

[0076] The inner circuit board 10 includes a base layer 11 and a first inner conductive layer 12 and a second inner conductive layer 13 disposed on opposite sides of the base layer 11. The first inner conductive layer 12 and the second inner conductive layer 13 are electrically connected through a first conductive structure 14. In some embodiments, the first conductive structure 14 penetrates the base layer 11 and the first inner conductive layer 12, and electrically connects the first inner conductive layer 12 and the second inner conductive layer 13. The first conductive structure 14 can be a conductive via or a conductive post. In this embodiment, the first conductive structure 14 is a conductive via.

[0077] The base layer 11 can be made of a flexible insulating material, such as one of polyimide, polypropylene, liquid crystal polymer, polyethylene terephthalate, and polyethylene naphthalate. The base layer 11 can also be made of a rigid insulating material, such as one of FR-4 grade polyimide, polypropylene, liquid crystal polymer, polyethylene terephthalate, and polyethylene naphthalate. The materials of the first inner conductive layer 12 and the second inner conductive layer 13 may include, but are not limited to, copper, gold, and silver.

[0078] In some embodiments, the inner circuit board 10 includes a first region 10A covered by a cover layer 15 and a second region 10B not covered by the cover layer 15. Specifically, the two cover layers 15 respectively cover portions of the first inner conductive layer 12 and the second inner conductive layer 13 to divide the inner circuit board 10 into the first region 10A and the second region 10B.

[0079] The material of the cover layer 15 is a polymer material, such as polyimide, liquid crystal polymer, polyethylene terephthalate or polyethylene naphthalate.

[0080] In some embodiments, the cover layer 15 is bonded to the first inner conductive layer 12 and the second inner conductive layer 13 via an adhesive layer 16. The adhesive layer 16 is made of an adhesive resin; more specifically, the resin may be selected from at least one of polypropylene, epoxy resin, polyurethane, phenolic resin, urea-formaldehyde resin, melamine-formaldehyde resin, liquid crystal polymer, polyethylene terephthalate, polyethylene naphthalate, and polyimide.

[0081] The inner circuit board 10 can be manufactured using existing circuit board manufacturing methods. For example, it can be made using a double-sided copper-clad laminate through processes such as drilling, electroplating, circuit fabrication, and film lamination.

[0082] For step S2, please refer to [link / reference]. Figure 2 A first opening 101 is formed in the second region 10B of the inner circuit board 10. The first opening 101 penetrates the base layer 11, the first inner conductive layer 12 and the second inner conductive layer 13 along the thickness direction of the inner circuit board 10.

[0083] The first opening 101 can be formed by mechanical cutting or laser cutting.

[0084] Step S3, please refer to Figure 3 An insulating layer 20 is provided, and a second opening 201 is formed on the insulating layer 20. The shape and size of the second opening 201 can be adapted to the shape and size of the first opening 101 to facilitate rapid alignment of the insulating layer 20 with the inner layer circuit board 10 in subsequent lamination processes. The length of the insulating layer 20 is less than the length of the inner layer circuit board 10, so that at least a portion of the cover layer 15 can be exposed when the insulating layer 20 is subsequently laminated onto the inner layer circuit board 10. In some embodiments, the length of the insulating layer 20 is greater than the length of the second region 10B and less than the length of the inner layer circuit board 10.

[0085] For step S4, please refer to [link / reference]. Figure 4 A first stacked structure 30 is provided, and a third opening 301 is formed on the first stacked structure 30.

[0086] The first layered structure 30 includes a first base layer 31 and a first metal layer 32 stacked together. The third opening 301 penetrates the first base layer 31 and the first metal layer 32.

[0087] The shape and size of the third opening 301 can be adapted to the shape and size of the first opening 101. In this embodiment, the first opening 101, the second opening 201, and the third opening 301 have the same size. The sizes of the first opening 101, the second opening 201, and the third opening 301 are all larger than the conductive block 50 (see reference). Figure 6 The size of the conductive block 50 is adjusted so that, after a subsequent pressing process, the conductive block 50 can be exposed from the first opening 101, the second opening 201, and the third opening 301.

[0088] The material of the first base layer 31 can be a rigid insulating material or a flexible insulating material. The material of the first metal layer 32 may include, but is not limited to, copper, gold, silver, etc. The first metal layer 32 can be a copper foil layer, that is, the first laminated structure 30 is a single-sided copper-clad laminate.

[0089] The third opening 301 can be formed by mechanical cutting or laser cutting.

[0090] For step S5, please refer to [link / reference]. Figure 5 A second stacked structure 40 is provided. The second stacked structure 40 includes a second base layer 41 and solder pads 42 and a second metal layer 43 stacked on opposite sides of the second base layer 41. The size of the solder pads 42 is larger than the size of the first opening 101, the second opening 201, and the third opening 301.

[0091] The material of the second base layer 41 can be a rigid insulating material or a flexible insulating material. The materials of the solder pad 42 and the second metal layer 43 may include, but are not limited to, copper, gold, silver, etc. The second metal layer 43 may be a copper foil layer.

[0092] The second layered structure 40 can be made by removing a portion of the copper foil on one side of a double-sided copper-clad laminate to form the solder pad 42.

[0093] Step S6, please refer to Figure 6 A conductive block 50 is provided, and the conductive block 50 is welded and fixed to the pad 42 of the second stacked structure 40 to obtain a first intermediate body 60.

[0094] The conductive block 50 includes a bottom wall 51 and a plurality of side walls 52 arranged around the periphery of the bottom wall 51. The bottom wall 51 and the plurality of side walls 52 together form a first cavity 501. The ends of the plurality of side walls 52 away from the bottom wall 51 are soldered to the pads 42 by a first solder paste 53, wherein the first solder paste 53 seals the first cavity 501. The conductive block 50 may be, but is not limited to, a copper block.

[0095] For step S7, please refer to [link / reference]. Figure 7 and Figure 8 Two insulating layers 20, the inner circuit board 10, and the first stacked structure 30 are pressed onto one side of the first intermediate body to obtain the second intermediate body 70.

[0096] In this structure, the first base layer 31 of the first laminated structure 30 and the second base layer 41 of the second laminated structure 40 are bonded to opposite sides of the inner circuit board 10 by two insulating layers 20. Each insulating layer 20 covers a portion of the corresponding cover layer 15, and each cover layer 15 has a gap with the corresponding first base layer 31 or second base layer 41. The first opening 101, the second opening 201, and the third opening 301 are connected to form an opening 110. The conductive block 50 is accommodated in the opening 110, and the bottom wall 51 is exposed outside the second intermediate body 70 through the opening 110.

[0097] During pressing, the insulating layer 20 also fills the gap between the sidewall 52 of the conductive block 50 and the sidewall of the opening 110, so that the conductive block 50 is embedded in the second intermediate body 70. The insulating layer 20 includes an exposed surface 21 that is exposed outside the second intermediate body 70.

[0098] Step S8, please refer to Figure 9 A first metal plating layer 33 and a second metal plating layer 44 are formed on both sides of the second intermediate body 70, and a second conductive structure 81 electrically connecting the first metal plating layer 33 and the second metal plating layer 44, a third conductive structure 82 electrically connecting the first metal plating layer 33 and the first inner conductive layer 12, and a fourth conductive structure 83 electrically connecting the second metal plating layer 44 and the second inner conductive layer 13 are formed.

[0099] The first metal plating layer 33 completely covers the surface of the first metal layer 32 facing away from the first base layer 31, the exposed surface 21 of the insulating layer 20, and the surface of the bottom wall 51 of the conductive block 50 facing away from the side wall 52. The second metal plating layer 44 completely covers the surface of the second metal layer 43 facing away from the second base layer 41.

[0100] The second conductive structure 81 penetrates the second intermediate body 70. The third conductive structure 82 penetrates the first stacked structure 30 and the insulating layer 20 sandwiched between the first stacked structure 30 and the inner circuit board 10. The fourth conductive structure 83 penetrates the second stacked structure 40 and the insulating layer 20 sandwiched between the second stacked structure 40 and the inner circuit board 10. The second conductive structure 81, the third conductive structure 82, and the fourth conductive structure 83 can be conductive pillars or conductive vias. In this embodiment, the second conductive structure 81 is a conductive via, and the third conductive structure 82 and the fourth conductive structure 83 are both conductive pillars.

[0101] The first metal plating layer 33 and the second metal plating layer 44 can be formed by electroplating. The second conductive structure 81 can be obtained by first forming a through hole in the second intermediate body 70, and then forming a plating layer on the through hole by electroplating. The third conductive structure 82 and the fourth conductive structure 83 can be obtained by first forming a blind hole in the second intermediate body 70, and then filling the blind hole with conductive material.

[0102] For step S9, please refer to [link / reference]. Figure 10 A first outer conductive layer 34 is formed by fabricating circuits on the first metal plating layer 33 and the first metal layer 32 stacked together. A second outer conductive layer 45 is formed by fabricating circuits on the second metal plating layer 44 and the second metal layer 43 stacked together. A solder resist layer 90 is formed on the surface of the first outer conductive layer 34 and the second outer conductive layer 45.

[0103] The first base layer 31 and the first outer conductive layer 34 together constitute the first outer circuit board 37. The second base layer 41, the solder pad 42, and the second outer conductive layer 45 together constitute the second outer circuit board 47.

[0104] The solder resist layer 90 covers a portion of the first outer conductive layer 34, wherein the portion of the first outer conductive layer 34 corresponding to the conductive block 50 is not covered by the solder resist layer 90. Furthermore, the solder resist layer 90 completely covers the second outer conductive layer 45. When the second conductive structure 81 is a conductive hole, the solder resist layer 90 also covers the sidewall of the conductive hole.

[0105] The solder resist layer 90 can be formed by printing, baking, UV exposure and development of liquid photosensitive solder resist ink.

[0106] Step S10, please refer to Figure 11 and Figure 12The first metal plating layer 33 and a portion of the conductive block 50 are removed to form a second cavity 502 that communicates with the first cavity 501. The first cavity 501 is annular. The second cavity 502 and the first cavity 501 are connected to form a cavity 503.

[0107] In some embodiments, the inner diameter of the second cavity 502 is larger than the inner diameter of the first cavity 501, so as to form a stepped surface 504 at the connection between the first cavity 501 and the second cavity 502.

[0108] Step S11, please refer to Figure 11 Cut along the edge of the insulating layer 20 to remove portions of the first outer circuit board 37 and the corresponding solder resist layer 90 and insulating layer 20 to expose the corresponding cover layer 15, and remove portions of the second outer circuit board 47 and the corresponding solder resist layer 90 and insulating layer 20 to expose the corresponding cover layer 15.

[0109] Step S12, please refer to Figure 13 The connector 120 is soldered into the cavity 503 using the second solder paste 54 to obtain a circuit board 100 with the connector 120 embedded.

[0110] In this embodiment, the bottom surface of the connector 120 is soldered to the pad 42 via the first solder paste 53, and the side surface of the connector 120 is soldered to the conductive block 50 via the second solder paste 54. The second solder paste 54 connects to the first solder paste 53 and fills the gap between the connector 120 and the sidewall of the cavity 503. A portion of the connector 120 extends out of the second cavity 502 for electrical connection to other active devices. In this embodiment, the connector 120 is a spring pin.

[0111] This application also provides a circuit board 100 for an embedded connector 120, including an inner circuit board 10, a first outer circuit board 37, a second outer circuit board 47, and a conductive block 50.

[0112] The first outer circuit board 37 includes a first base layer 31 and a first outer conductive layer 34 stacked together. The second outer circuit board 47 includes a second base layer 41 and solder pads 42 stacked together. The side of the first base layer 31 facing away from the first outer conductive layer 34 and the side of the second base layer 41 with the solder pads 42 are respectively bonded to opposite sides of the inner circuit board 10 through an insulating layer 20. The first outer conductive layer 34 includes a first metal layer 32 and a first metal plating layer 33 stacked together. The first metal layer 32 is in contact with the first base layer 31, and the first metal plating layer 33 is located on the outside of the circuit board 100. The circuit board 100 has an opening 110 that penetrates the inner circuit board 10, the insulating layer 20, the first base layer 31, and the first metal layer 32 to expose at least a portion of the solder pads 42. The conductive block 50 is soldered to the pad 42 via first solder paste 53 and accommodated in the opening 110. It is covered by the first metal plating layer 33 to electrically connect the conductive block 50 to the first outer conductive layer 34. The insulating layer 20 further fills the gap between the conductive block 50 and the opening 110, embedding the conductive block 50 within the circuit board 100. A cavity 503 is formed in the first metal plating layer 33 and the conductive block 50, with the first solder paste 53 exposed within it. The connector 120 is accommodated in the cavity 503 and soldered to the pad 42 via the first solder paste 53. It is also soldered to the conductive block 50 and the first metal plating layer 33 via second solder paste 54. The second solder paste 54 further fills the gap between the connector 120 and the conductive block 50 and connects with the first solder paste 53, embedding the connector 120 within the circuit board 100. A portion of the connector 120 extends outside the cavity 503.

[0113] In the circuit board 100 and its manufacturing method for the embedded connector 120 provided in this application, the conductive block 50 is embedded in the circuit board 100 by providing an opening 110 and a first metal plating layer 33; then, the connector 120 is embedded in the circuit board 100 by creating a cavity 503 in the stacked first metal plating layer 33 and conductive block 50, thereby achieving a thinner profile. Furthermore, the connector 120 is soldered to the conductive block 50 and the first metal plating layer 33 with solder paste, achieving electrical connection with the first outer conductive layer 34, thus improving connection reliability. Additionally, the bottom and sides of the connector 120 are fixed by solder paste, increasing the soldering area and improving soldering strength.

[0114] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with this application are still within the scope of this application.

Claims

1. A circuit board for an embedded connector, characterized in that, The circuit board includes an inner circuit board, a first outer circuit board, a second outer circuit board, a conductive block, and a connector. The first outer circuit board includes a first base layer and a first outer conductive layer stacked together. The second outer circuit board includes a second base layer and solder pads stacked together. The side of the first base layer away from the first outer conductive layer and the side of the second base layer with the solder pads are respectively bonded to opposite sides of the inner circuit board through an insulating layer. The first outer conductive layer includes a first metal layer and a first metal plating layer stacked together. The first metal layer is in contact with the first base layer. The circuit board has an opening that passes through the first base layer, the first metal layer, the inner circuit board, and the insulating layer. The solder pads are exposed in the opening. The conductive block is accommodated in the opening and covered by the first metal plating layer, and the conductive block is soldered to the solder pads. A cavity is formed on the conductive block and the first metal plating layer. The connector is accommodated in the cavity and soldered to the conductive block and the first metal plating layer.

2. The circuit board with the embedded connector as described in claim 1, characterized in that, The insulating layer fills the gap between the conductive block and the sidewall of the opening.

3. The circuit board with the embedded connector as described in claim 1, characterized in that, The conductive block and the connector are soldered to the pad using a first solder paste.

4. The circuit board with the embedded connector as described in claim 3, characterized in that, The connector is soldered to the conductive block and the first metal plating layer by a second solder paste, and the second solder paste fills the gap between the connector and the sidewall of the cavity and connects with the first solder paste.

5. The circuit board with the embedded connector as described in claim 1, characterized in that, The second outer circuit board also includes a second outer conductive layer, which is disposed on the side of the second base layer away from the solder pad.

6. The circuit board with the embedded connector as described in claim 5, characterized in that, The surfaces of the first outer conductive layer and the second outer conductive layer are provided with solder resist layers.

7. A method for manufacturing a circuit board with an embedded connector, characterized in that, Includes the following steps: An inner circuit board is provided, and a first opening is formed on the inner circuit board that penetrates the inner circuit board; Two insulating layers are provided, and a second opening is formed in each insulating layer, penetrating the insulating layer; A first stacked structure is provided, and a third opening is formed in the first stacked structure, the first stacked structure including a first base layer and a first metal layer stacked together; A second laminated structure is provided, the second laminated structure including a second base layer and a solder pad disposed on the second base layer; A conductive block is provided, and the conductive block is soldered onto the solder pad to obtain a first intermediate body; The two insulating layers, the inner circuit board, and the first laminated structure are pressed onto one side of the first intermediate body to obtain a second intermediate body. The side of the first base layer away from the first metal layer and the side of the second base layer with the solder pad are respectively bonded to the opposite sides of the inner circuit board through the two insulating layers. The first opening, the second opening, and the third opening are connected to form an opening, and the conductive block is accommodated in the opening. A first metal plating layer is formed on the side of the first metal layer opposite to the first base layer, and the first metal plating layer covers the conductive block; A cavity is formed by removing a portion of the first metal plating layer and the conductive block. The connector is soldered into the cavity, and the connector is electrically connected to the conductive block.

8. The method for manufacturing a circuit board with an embedded connector as described in claim 7, characterized in that, During the pressing process, the insulating layer fills the gap between the conductive block and the sidewall of the opening.

9. The method for manufacturing a circuit board with an embedded connector as described in claim 7, characterized in that, The conductive block and the connector are soldered to the pad using a first solder paste. The connector is soldered to the conductive block and the first metal plating using a second solder paste. The second solder paste fills the gap between the connector and the sidewall of the cavity and connects with the first solder paste.

10. The method for manufacturing a circuit board with an embedded connector as described in claim 7, characterized in that, It also includes the following steps: A first outer conductive layer is formed by fabricating circuitry on the first metal plating layer and the first metal layer.

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