A Bl-phase power device abnormality processing module

Abstract

The present invention belongs to the technical field of power device exception handling, and specifically relates to a Bl-phase power device exception handling module. This invention transmits information via a single data line, thereby reducing the number of IO interfaces required for the MCU. This allows the MCU to adopt a minimalist IO-type MCU, thereby reducing costs and providing greater flexibility to meet the needs of different application scenarios. It adopts an efficient and reliable data transmission method to ensure the timely and accurate transmission of exception information. The hardware closes the internal loop to achieve more timely exception handling, reducing system damage and safety risks. When a control signal first appears, protective processing can be performed to ensure the normal operation of the power device. When the control signal appears again, the hardware closes the power device loop, achieving more timely exception handling and reducing system damage and safety risks.

Description

Technical Field

[0001] The present invention belongs to the technical field of power device abnormality processing, and in particular relates to a B1-phase power device abnormality processing module. Background Art

[0002] Power devices are key components in modern power electronics applications, widely used in AC / DC conversion, inverters, motor control, and other fields. However, power devices may encounter abnormal conditions during operation, such as overtemperature, overcurrent, or load impedance mismatch. These abnormal conditions may cause device performance degradation or even damage.

[0003] In order to ensure the stable operation and safety of power devices, an abnormality control module is usually required, as well as an efficient way to transmit abnormal information to the controller so that timely measures can be taken to deal with it.

[0004] Traditional power device exception handling methods typically use internal hardware loops to monitor and handle abnormal conditions. These methods often employ multi-line transmission methods, such as SPI and I2C. While reliable, these transmission methods require a large number of I / O pins. This approach can lead to complex designs and place high demands on the MCU, requiring numerous I / O interfaces and complex hardware connections. Furthermore, the large amount of data transmitted results in relatively long exception handling response times, and directly shutting down the device when an abnormality occurs reduces the system's real-time performance. Summary of the Invention

[0005] The present invention aims to provide an exception handling module based on a Bl-phase power device, which can transmit information through a single data line, thereby reducing the number of IO interfaces required for the MCU. This allows the MCU to adopt a minimalist IO type MCU, thereby reducing costs and providing greater flexibility to meet the needs of different application scenarios. It adopts an efficient and reliable data transmission method to ensure the timely and accurate transmission of exception information, and closes the internal loop by hardware to achieve more timely exception handling, thereby reducing system damage and safety risks.

[0006] The technical solutions adopted by the present invention are as follows:

[0007] A B1-phase power device abnormality processing module, comprising:

[0008] An abnormality detection module is used to detect abnormal information of the power device, wherein the abnormal information includes over-temperature information, over-current information and load impedance mismatch information;

[0009] BI-phase encoding module, used to encode abnormal information into BI-phase signals;

[0010] A data transmission module, configured to convert the BI-phase signal into a plurality of data packets, each of which contains 2 bits of data and a 1-bit CRC, and form an identification data packet;

[0011] MCU control module, used to receive and decode identification data packets, extract power device abnormality information from them, and output control signals;

[0012] The abnormality control module is used to close the internal circuit of the power device when receiving the control signal.

[0013] In a preferred embodiment, the anomaly detection module operates as follows:

[0014] Acquire anomaly detection thresholds set by an anomaly detection module, wherein the anomaly detection thresholds include an over-temperature threshold, an over-current threshold, and a load impedance mismatch threshold;

[0015] Acquiring detection information of the power device, the detection information including temperature information, current information, and impedance information, comparing the detection information of the power device with an abnormality detection threshold, and generating abnormality information for detection information exceeding the abnormality detection threshold;

[0016] If the temperature information exceeds the over-temperature threshold, it is determined that the temperature of the power device is abnormal and abnormal information is generated, which indicates that the power device is over-temperature;

[0017] If the current information exceeds the overcurrent threshold, the current of the power device is judged to be abnormal, and abnormal information is generated, which indicates that the power device is overcurrent;

[0018] If the impedance information exceeds the impedance mismatch threshold, it is determined that the impedance of the power device is abnormal, and abnormal information is generated. The abnormal information is that the power device load impedance is mismatched.

[0019] In a preferred embodiment, the BI-phase encoding module operates as follows:

[0020] Obtain anomaly information generated by the anomaly detection module;

[0021] Convert the abnormal information into BI-phase code to obtain code data, wherein the code data includes over-temperature code, over-current code and load impedance mismatch code;

[0022] Assemble multiple encoded data into a complete BI-phase signal.

[0023] In a preferred embodiment, the data transmission module operates as follows:

[0024] Obtain the BI-phase signal encoded by the BI-phase encoding module;

[0025] The continuous BI-phase signal is obtained and divided into several data packets, each of which contains 2 bits of data and 1 bit of CRC;

[0026] Adding header information, tail information, and an identification code to each data packet to form an identification data packet, wherein the header information is the start of the identification data packet, the tail information is the end position of the identification data packet, and the identification code includes an over-temperature code, an over-current code, and a load impedance mismatch code;

[0027] The formed identification data packet is transmitted to the MCU control module.

[0028] In a preferred embodiment, the MCU control module includes a receiving unit, an extracting unit, a generating unit and an executing unit;

[0029] The receiving unit is used to receive an identification data packet transmitted by the data transmission module, the extraction unit extracts abnormal information of the power device from the received identification data packet, the generation unit generates a control signal based on the abnormal information extracted by the extraction unit, and the control signal includes a cooling signal, a current limiting signal and a resistance adjustment signal, and the execution unit outputs the generated control signal to the abnormal control module.

[0030] In a preferred embodiment, the abnormality control module includes a circuit breaker unit, a current limiting unit, a resistance regulating unit and a temperature reduction unit. The MCU control module is connected to the circuit breaker unit, the current limiting unit, the resistance regulating unit and the temperature reduction unit respectively. One end of the circuit breaker unit is connected to the current limiting unit. The current limiting unit and the resistance regulating unit are both connected to the power device.

[0031] When the current limiting unit is in operation, current limiting protection is performed on the power device;

[0032] When the resistance adjustment unit is in operation, the load impedance of the power device is adjusted;

[0033] When the cooling unit is in operation, the power device is cooled and protected;

[0034] When the circuit breaker unit is in operation, circuit breaker protection is provided to the power device.

[0035] In a preferred embodiment, the circuit breaker unit includes a resistor R1, a transistor VT1, a diode VD1 and an electromagnetic relay K1, one end of the resistor R1 is connected to the MCU control module, the other end of the resistor R1 is connected to the base of the transistor VT1, the emitter of the transistor VT1 is grounded, the collector of the transistor VT1 is connected to one end of the diode VD1 and one end of the coil of the electromagnetic relay K1, the other end of the diode VD1 is connected to the other end of the coil of the electromagnetic relay K1, and pin 2 of the electromagnetic relay K1 is connected to the current limiting unit.

[0036] In a preferred embodiment, the current limiting unit includes a resistor R2, a transistor VT2, a diode VD2, an electromagnetic relay K2 and a resistor R4, one end of the resistor R2 is connected to the MCU control module, the other end of the resistor R2 is connected to the base of the transistor VT2, the emitter of the transistor VT2 is grounded, the collector of the transistor VT2 is connected to one end of the diode VD2 and one end of the coil of the electromagnetic relay K2, the other end of the diode VD2 is connected to the other end of the coil of the electromagnetic relay K2, pin 1 of the electromagnetic relay K2 is connected to pin 2 of the electromagnetic relay K1, pin 2 of the electromagnetic relay K2 is connected to one end of the resistor R4 and the power device, and pin 3 of the electromagnetic relay K2 is connected to the other end of the resistor R4.

[0037] In a preferred embodiment, the resistance adjustment unit includes a transistor VT4, a resistor R5 and a capacitor C, the base of the transistor VT4 is connected to the MCU control module, the collector of the transistor VT4 is connected to the power device, the emitter of the transistor VT4 is connected to one end of the resistor R5, the other end of the resistor R5 is connected to one end of the capacitor C, and the other end of the capacitor C is grounded.

[0038] In a preferred embodiment, the cooling unit includes a resistor R3, a transistor VT3, a diode VD3, an electromagnetic relay K3 and a cooling fan M, one end of the resistor R3 is connected to the MCU control module, the other end of the resistor R3 is connected to the base of the transistor VT3, the emitter of the transistor VT3 is grounded, the collector of the transistor VT3 is connected to one end of the diode VD3 and one end of the coil of the electromagnetic relay K3, the other end of the diode VD3 is connected to the other end of the coil of the electromagnetic relay K3, and pin 3 of the electromagnetic relay K3 is connected to the cooling fan M.

[0039] The technical effects achieved by the present invention are:

[0040] The present invention detects abnormal information of the power device through the abnormal detection module when the system is started. When abnormal information is detected, the BI-phase encoding module encodes the abnormal information into a BI-phase signal. When the data transmission module receives the BI-phase signal, it converts the BI-phase signal into a plurality of identification data packets. The MCU control module can receive and decode the identification data packets, extract the abnormal information of the power device from the data packets, and can transmit the information through a single data line, thereby reducing the number of IO interfaces required for the MCU. This allows the MCU to adopt a minimalist IO type MCU, thereby reducing costs and providing more flexibility to meet the needs of different application scenarios. An efficient and reliable data transmission method is adopted to ensure the timely transmission and accuracy of abnormal information. The internal loop is closed by hardware to achieve more timely abnormal processing, reducing system damage and safety risks.

[0041] According to the present invention, when the abnormal control module receives abnormal information, the operation of the current limiting unit, the resistance regulating unit and the temperature reduction unit is controlled according to the received abnormal information. When the current limiting unit, the resistance regulating unit and the temperature reduction unit are in operation and the same control signal is received again, the circuit breaker unit is operated to perform circuit breaker protection on the power device. When the control signal appears for the first time, the protection processing is performed to ensure the normal operation of the power device. When the control signal appears again, the hardware closes the circuit of the power device, thereby realizing more timely abnormal processing and reducing system damage and safety risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a system module diagram provided by the present invention;

[0043] Figure 2 is an example of the differential bi-phase encoding scheme of the present invention;

[0044] Figure 3 It is a circuit diagram of the abnormality control module of the present invention. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0046] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0047] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in a preferred embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it constitute a separate or selective embodiment that is mutually exclusive of other embodiments.

[0048] Secondly, the present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience, the schematic diagrams are only examples and should not limit the scope of protection of the present invention.

[0049] Example 1

[0050] Please see the attached Figure 1 and Figure 2 FIG. 1 is a first embodiment of the present invention, which provides a B1-phase power device abnormality processing module, including:

[0051] An abnormality detection module is used to detect abnormal information of power devices, including over-temperature information, over-current information and load impedance mismatch information;

[0052] BI-phase encoding module, used to encode abnormal information into BI-phase signals;

[0053] The data transmission module is used to convert the BI-phase signal into several data packets, each of which contains 2 bits of data and 1 bit of CRC, and form an identification data packet;

[0054] MCU control module, used to receive and decode identification data packets, extract power device abnormality information from them, and output control signals;

[0055] The abnormality control module is used to close the internal circuit of the power device when receiving the control signal.

[0056] Specifically, when the system starts, the abnormal information of the power device is detected by the abnormal detection module. When abnormal information is detected, the BI-phase encoding module encodes the abnormal information into a BI-phase signal. When the data transmission module receives the BI-phase signal, it converts the BI-phase signal into several identification data packets. The MCU control module can receive and decode the identification data packets, extract the abnormal information of the power device from them, and can transmit information through a single data line, thereby reducing the number of IO interfaces required for the MCU. This allows the MCU to adopt a minimalist IO type MCU, thereby reducing costs and providing more flexibility to adapt to the needs of different application scenarios. It adopts an efficient and reliable data transmission method to ensure the timely transmission and accuracy of abnormal information. The hardware closes the internal loop to achieve more timely exception processing, reducing system damage and safety risks.

[0057] In a preferred embodiment, the anomaly detection module operates as follows:

[0058] Obtain the anomaly detection thresholds set by the anomaly detection module. The anomaly detection thresholds include over-temperature thresholds, over-current thresholds, and load impedance mismatch thresholds.

[0059] Acquire detection information of the power device, the detection information including temperature information, current information, and impedance information, compare the detection information of the power device with an abnormality detection threshold, and generate abnormality information for detection information that exceeds the abnormality detection threshold;

[0060] If the temperature information exceeds the over-temperature threshold, it is determined that the temperature of the power device is abnormal and abnormal information is generated, which indicates that the power device is over-temperature;

[0061] If the current information exceeds the overcurrent threshold, the current of the power device is judged to be abnormal, and abnormal information is generated, which indicates that the power device is overcurrent;

[0062] If the impedance information exceeds the impedance mismatch threshold, it is determined that the impedance of the power device is abnormal, and abnormal information is generated. The abnormal information is that the power device load impedance is mismatched.

[0063] As mentioned above, the anomaly detection module needs to pre-set anomaly detection thresholds, including over-temperature thresholds, over-current thresholds, and load impedance mismatch thresholds. These thresholds are used to define the critical points between the normal operating range and abnormal conditions. Usually, these thresholds are configured according to the specific power device model, design requirements, and operating environment. The power device will be equipped with sensors to monitor its working status in real time. These sensors can be used to obtain temperature information, current information, and impedance information. Temperature information can be measured by a temperature sensor, current information can be measured by a current sensor, and impedance information may be obtained through a specific measurement circuit or sensor. These detection information will be used for subsequent anomaly detection. The anomaly detection module will compare the detection information of the power device obtained with the previously set anomaly detection threshold. For example, corresponding threshold comparisons must be performed on temperature information, current information, and impedance information. If the temperature information exceeds the over-temperature threshold, the temperature of the power device is judged to be abnormal, and abnormal information is generated. The abnormal information is that the power device is overheated. If the current information exceeds the over-current threshold, the current of the power device is judged to be abnormal, and abnormal information is generated. The abnormal information is that the power device is overcurrent. If the impedance information exceeds the impedance mismatch threshold, the impedance of the power device is judged to be abnormal, and abnormal information is generated. The abnormal information is that the power device load impedance does not match, thereby ensuring the safety of the equipment and system. Once the detection information of the power device exceeds the abnormal detection threshold, the abnormal detection module will generate corresponding abnormal information, and the system can take appropriate measures to deal with the problem in a targeted manner, thereby improving the efficiency of fault handling.

[0064] In a preferred embodiment, the BI-phase encoding module operates as follows:

[0065] Obtain anomaly information generated by the anomaly detection module;

[0066] Convert the abnormal information into BI-phase code to obtain code data, which includes over-temperature code, over-current code and load impedance mismatch code;

[0067] Assemble multiple encoded data into a complete BI-phase signal.

[0068] As mentioned above, the anomaly detection module determines whether an anomaly occurs based on the comparison of the detection information with the anomaly detection threshold, and generates corresponding anomaly information. The anomaly information may be a flag bit, binary code or other data format to indicate the specific anomaly type (overtemperature, overcurrent or load impedance mismatch) and the severity of the anomaly. The anomaly detection module will save this information in a suitable data structure for subsequent processing, convert the anomaly information into BI-phase encoding, and obtain the encoded data. BI-phase encoding is a commonly used digital encoding technology used to encode signals when transmitting data. The anomaly information needs to be converted into BI-phase encoding. The basic idea of ​​BI-phase encoding is that each data bit (0 or 1) corresponds to two phases (0 or 180 degrees), so that data can be represented by phase shifts. The encoded data According to the abnormal information generated by the abnormal detection module, three types of coding data can be obtained: over-temperature coding, over-current coding and load impedance mismatch coding. Each type of coding data corresponds to an abnormality type, which is used to indicate whether the state of the power device exceeds the abnormality detection threshold. Multiple coding data are assembled into a complete BI-phase signal, and multiple abnormal information are integrated together so that multiple abnormal situations can be handled simultaneously during transmission and reception. The assembly method can be designed according to the specific application and communication protocol. During the transmission process, the receiving end will parse the BI-phase signal, extract each abnormal information, and perform corresponding processing or warnings. It can effectively transmit and handle the abnormal conditions of the power device, and provide timely warnings and protection measures to ensure the safe operation of the power device.

[0069] In a preferred embodiment, the data transmission module operates as follows:

[0070] Obtain the BI-phase signal encoded by the BI-phase encoding module;

[0071] The continuous BI-phase signal is split into several data packets, each of which contains 2 bits of data and 1 bit of CRC.

[0072] Adding header information, tail information and identification code to each data packet to form an identification data packet. The header information is the start of the identification data packet, and the tail information is the end position of the identification data packet. The identification code includes an over-temperature code, an over-current code and a load impedance mismatch code.

[0073] The formed identification data packet is transmitted to the MCU control module.

[0074] As mentioned above, the BI-phase signal encoded by the BI-phase encoding module is obtained and a continuous signal stream is output. In order to manage and process data packets during transmission, the continuous BI-phase signal needs to be divided into several data packets. Each data packet contains a certain number of data bits to indicate specific abnormal information, usually including data bits and check bits (CRC). In order to ensure the integrity and accuracy of the data, header information and tail information are added before and after each data packet. The header information is used to identify the start of the data packet, and the tail information is used to identify the end position of the data packet. In this way, at the receiving end, the data packet can be correctly extracted according to the header and tail. At the same time, an identification code is added to each data packet to identify The code is used to identify the type of abnormal information contained in the data packet. According to the previous description, the identification code may include over-temperature code, over-current code and load impedance mismatch code. Through the identification code, the receiving end can identify the abnormal type in the data packet and perform corresponding processing. Once the data packet is formed, an identification header, identification footer and identification code are added to each data packet. These identification data packets will be transmitted to the MCU control module. The MCU control module is a microcontroller unit responsible for receiving and processing these data packets, and making corresponding control and decision-making according to the abnormal information. It can effectively transmit abnormal information and perform corresponding processing and protection measures according to the abnormal type. In actual applications, the details need to be implemented according to specific system requirements and communication protocols.

[0075] In a preferred embodiment, the MCU control module includes a receiving unit, an extracting unit, a generating unit, and an executing unit;

[0076] The receiving unit is used to receive the identification data packet transmitted by the data transmission module, the extraction unit extracts the abnormal information of the power device from the received identification data packet, and the generation unit generates a control signal based on the abnormal information extracted by the extraction unit. The control signal includes a cooling signal, a current limiting signal and a resistance adjustment signal. The execution unit outputs the generated control signal to the abnormal control module.

[0077] As mentioned above, the receiving unit is a functional module of the MCU control module, and its main task is to receive the identification data packet transmitted by the data transmission module. The data transmission module transmits the formed identification data packet to the MCU control module. The receiving unit is responsible for receiving and caching the data when receiving these data packets to ensure that the data can be smoothly transmitted to the subsequent processing unit. The extraction unit extracts the abnormal information of the power device from the received identification data packet. In each identification data packet, the header, tail and identification code, as well as the data bits containing abnormal information and CRC check bits have been added. The extraction unit is responsible for parsing the structure of the data packet, finding the location of the abnormal information, and extracting it. The generation unit generates corresponding control signals based on the abnormal information extracted by the extraction unit. These control signals include cooling signals, current limiting signals and resistance adjustment signals, which are used to control the operating status of the power device. Based on the extracted abnormal information, the generation unit will judge the type and severity of the abnormality and generate appropriate control signals accordingly;

[0078] When an over-temperature abnormality of a power device is detected, the generation unit generates a cooling signal to trigger a cooling system or other cooling measures to reduce the temperature of the power device;

[0079] When an overcurrent anomaly is detected in a power device, the generation unit generates a current limiting signal to limit the current flowing through the device to prevent it from being damaged by overload;

[0080] When an abnormal load impedance mismatch of a power device is detected, the generation unit generates a resistance adjustment signal to adjust the load matching to ensure that the power device can work normally;

[0081] The execution unit outputs the control signal generated by the generation unit to the abnormal control module. The abnormal control module may be an external device connected to the MCU control module, which is used to perform actual control operations. The execution unit is responsible for transmitting the control signal to the abnormal control module to ensure that the control signal can effectively execute the corresponding control measures on time, enable the system to perform automatic control according to the actual abnormal situation, and ensure the safe operation of the power device.

[0082] Example 2

[0083] Please see the attached Figure 3 FIG. 1 is a second embodiment of the present invention, which provides a B1-phase power device abnormality processing module. The abnormality control module includes a circuit breaker unit, a current limiting unit, a resistance adjustment unit, and a temperature reduction unit. The MCU control module is connected to the circuit breaker unit, the current limiting unit, the resistance adjustment unit, and the temperature reduction unit, respectively. One end of the circuit breaker unit is connected to the current limiting unit. Both the current limiting unit and the resistance adjustment unit are connected to the power device.

[0084] When the current limiting unit is running, it provides current limiting protection for the power devices;

[0085] When the resistance adjustment unit is running, the load impedance of the power device is adjusted;

[0086] When the cooling unit is running, it provides cooling protection for the power devices;

[0087] When the circuit breaker unit is in operation, the power device is protected from circuit breaker.

[0088] As mentioned above, when the abnormal control module receives abnormal information, it controls the operation of the current limiting unit, the resistance regulating unit and the temperature reduction unit according to the received abnormal information. When the current limiting unit, the resistance regulating unit and the temperature reduction unit are in operation and receive the same control signal again, the circuit breaker unit will be operated to perform circuit breaker protection on the power device. When the control signal appears for the first time, protection processing can be performed to ensure the normal operation of the power device. When the control signal appears again, the hardware closes the circuit of the power device, so that the abnormal processing is more timely and the system damage and safety risks are reduced.

[0089] In a preferred embodiment, the circuit breaker unit includes a resistor R1, a transistor VT1, a diode VD1 and an electromagnetic relay K1, one end of the resistor R1 is connected to the MCU control module, the other end of the resistor R1 is connected to the base of the transistor VT1, the emitter of the transistor VT1 is grounded, the collector of the transistor VT1 is connected to one end of the diode VD1 and one end of the coil of the electromagnetic relay K1, the other end of the diode VD1 is connected to the other end of the coil of the electromagnetic relay K1, and pin 2 of the electromagnetic relay K1 is connected to the current limiting unit.

[0090] As mentioned above, in normal state, transistor VT1 is in the cut-off state, the coil of electromagnetic relay K1 is not energized, pin 1 of electromagnetic relay K1 is connected to pin 2, so that the input passes through pin 1 of electromagnetic relay K1 and pin R1 of resistor, and is connected to the power device through the current limiting unit, wherein pin 1 of electromagnetic relay K1 is connected to the input end of the power device to control the power device to be turned off and ensure the operation of the power device. After the MCU control module receives the cooling signal, current limiting signal and resistance adjustment signal for the first time, the current limiting unit, resistance adjustment unit and cooling unit operate for protection. When M When the CU control module receives the cooling signal, current limiting signal and resistance adjustment signal again, the MCU control module will apply a high level to the transistor VT1, so that the transistor VT1 is saturated and turned on, which is equivalent to a closed switch. The coil of the electromagnetic relay K1 will be energized and the No. 1 pin of the electromagnetic relay K1 will be connected to the No. 3 pin, which will open the circuit of the power device to avoid damage to the power device caused by the secondary cooling signal, current limiting signal and resistance adjustment signal, so as to achieve more timely abnormal processing and reduce system damage and safety risks. The diode VD1 is mainly used to prevent the inductor current from suddenly changing when the switch is disconnected.

[0091] In a preferred embodiment, the current limiting unit includes a resistor R2, a transistor VT2, a diode VD2, an electromagnetic relay K2 and a resistor R4, one end of the resistor R2 is connected to the MCU control module, the other end of the resistor R2 is connected to the base of the transistor VT2, the emitter of the transistor VT2 is grounded, the collector of the transistor VT2 is connected to one end of the diode VD2 and one end of the electromagnetic relay K2 coil, the other end of the diode VD2 is connected to the other end of the electromagnetic relay K2 coil, pin 1 of the electromagnetic relay K2 is connected to pin 2 of the electromagnetic relay K1, pin 2 of the electromagnetic relay K2 is connected to one end of the resistor R4 and the power device, and pin 3 of the electromagnetic relay K2 is connected to the other end of the resistor R4.

[0092] As mentioned above, in normal conditions, transistor VT2 is in the cut-off state, the coil of electromagnetic relay K2 is not energized, and pin 1 of electromagnetic relay K2 is connected to pin 2. When the MCU control module receives the current limiting signal, the MCU control module will apply a high level to transistor VT2, so that transistor VT2 is saturated and turned on, which is equivalent to a closed switch. The coil of electromagnetic relay K2 will be energized and activated, so that pin 1 of electromagnetic relay K2 is connected to pin 3, and resistor R4 will be connected in series with the power device to provide current limiting protection for the large current of the power device, ensure the normal operation of the power device, and increase the service life of the power device. Diode VD2 is mainly used to prevent the inductive current from suddenly changing when the switch is turned off.

[0093] In a preferred embodiment, the resistance adjustment unit includes a transistor VT4, a resistor R5 and a capacitor C, the base of the transistor VT4 is connected to the MCU control module, the collector of the transistor VT4 is connected to the power device, the emitter of the transistor VT4 is connected to one end of the resistor R5, the other end of the resistor R5 is connected to one end of the capacitor C, and the other end of the capacitor C is grounded.

[0094] As mentioned above, in normal state, transistor VT4 is in the cut-off state. When the MCU control module receives the resistance adjustment signal, the MCU control module will apply a high level to transistor VT4, so that transistor VT2 is saturated and turned on, which is equivalent to a closed switch. The resistor R5 and the capacitor C will be connected in parallel with the power device to adjust the impedance, which is suitable for multiple loads without increasing DC power consumption.

[0095] In a preferred embodiment, the cooling unit includes a resistor R3, a transistor VT3, a diode VD3, an electromagnetic relay K3 and a cooling fan M, one end of the resistor R3 is connected to the MCU control module, the other end of the resistor R3 is connected to the base of the transistor VT3, the emitter of the transistor VT3 is grounded, the collector of the transistor VT3 is connected to one end of the diode VD3 and one end of the electromagnetic relay K3 coil, the other end of the diode VD3 is connected to the other end of the electromagnetic relay K3 coil, and pin 3 of the electromagnetic relay K3 is connected to the cooling fan M.

[0096] As mentioned above, in normal state, transistor VT3 is in the cut-off state, the coil of electromagnetic relay K3 is not energized, pin 1 of electromagnetic relay K3 is connected to pin 2, wherein pin 1 of electromagnetic relay K3 is powered, and cooling fan M is in the open circuit state. When the MCU control module receives the cooling signal, the MCU control module will apply a high level to transistor VT3, so that transistor VT3 is saturated and turned on, which is equivalent to a closed switch, and the coil of electromagnetic relay K3 will be energized and actuated, so that pin 1 of electromagnetic relay K3 is connected to pin 3, and power will be supplied to cooling fan M, so that cooling fan M will run, and power devices will be cooled to prevent abnormal operation of power devices due to high temperature. Diode VD3 is mainly used to prevent sudden changes in inductive current when the switch is disconnected.

[0097] The foregoing is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art may make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described or explained herein shall, unless otherwise specified or limited, be implemented in accordance with conventional means in the art.

Claims

1. A B1-phase power device abnormality processing module, characterized in that: include: An abnormality detection module is used to detect abnormal information of the power device, wherein the abnormal information includes over-temperature information, over-current information and load impedance mismatch information; BI-phase encoding module, used to encode abnormal information into BI-phase signals; A data transmission module, configured to convert the BI-phase signal into a plurality of data packets, each of which contains 2 bits of data and a 1-bit CRC, and form an identification data packet; MCU control module, used to receive and decode identification data packets, extract power device abnormality information from them, and output control signals; The abnormal control module controls the operation of the current limiting unit, resistance regulating unit and temperature reduction unit for protection when the control signal appears for the first time. When the control signal appears again, the circuit breaker unit will be operated and the hardware will close the circuit of the power device to provide circuit breaker protection for the power device. The abnormality control module includes a circuit breaker unit, a current limiting unit, a resistance regulating unit and a temperature reduction unit. The MCU control module is connected to the circuit breaker unit, the current limiting unit, the resistance regulating unit and the temperature reduction unit respectively. One end of the circuit breaker unit is connected to the current limiting unit. The current limiting unit and the resistance regulating unit are both connected to the power device. When the current limiting unit is in operation, current limiting protection is performed on the power device; When the resistance adjustment unit is in operation, the load impedance of the power device is adjusted; When the cooling unit is in operation, the power device is cooled and protected; When the circuit breaker unit is in operation, circuit breaker protection is provided to the power device.

2. The Bl-phase power device abnormality processing module according to claim 1, characterized in that: The operation process of the anomaly detection module is as follows: Acquire anomaly detection thresholds set by an anomaly detection module, wherein the anomaly detection thresholds include an over-temperature threshold, an over-current threshold, and a load impedance mismatch threshold; Acquiring detection information of the power device, the detection information including temperature information, current information, and impedance information, comparing the detection information of the power device with an abnormality detection threshold, and generating abnormality information for detection information exceeding the abnormality detection threshold; If the temperature information exceeds the over-temperature threshold, it is determined that the temperature of the power device is abnormal and abnormal information is generated, which indicates that the power device is over-temperature; If the current information exceeds the overcurrent threshold, the current of the power device is judged to be abnormal, and abnormal information is generated, which indicates that the power device is overcurrent; If the impedance information exceeds the impedance mismatch threshold, it is determined that the impedance of the power device is abnormal, and abnormal information is generated. The abnormal information is that the power device load impedance is mismatched.

3. The Bl-phase power device abnormality processing module according to claim 1, characterized in that: The BI-phase encoding module runs as follows: Obtain anomaly information generated by the anomaly detection module; Convert the abnormal information into BI-phase code to obtain code data, wherein the code data includes over-temperature code, over-current code and load impedance mismatch code; Assemble multiple encoded data into a complete BI-phase signal.

4. The Bl-phase power device abnormality processing module according to claim 1, characterized in that: The data transmission module operates as follows: Obtain the BI-phase signal encoded by the BI-phase encoding module; The continuous BI-phase signal is obtained and divided into several data packets, each of which contains 2 bits of data and 1 bit of CRC; Adding header information, tail information, and an identification code to each data packet to form an identification data packet, wherein the header information is the start of the identification data packet, the tail information is the end position of the identification data packet, and the identification code includes an over-temperature code, an over-current code, and a load impedance mismatch code; The formed identification data packet is transmitted to the MCU control module.

5. The abnormality handling module based on Bl-phase power device according to claim 1, characterized in that: The MCU control module includes a receiving unit, an extracting unit, a generating unit and an executing unit; The receiving unit is used to receive an identification data packet transmitted by the data transmission module, the extraction unit extracts abnormal information of the power device from the received identification data packet, the generation unit generates a control signal based on the abnormal information extracted by the extraction unit, and the control signal includes a cooling signal, a current limiting signal and a resistance adjustment signal, and the execution unit outputs the generated control signal to the abnormal control module.

6. The abnormality handling module based on Bl-phase power device according to claim 1, characterized in that: The circuit breaker unit includes a resistor R1, a transistor VT1, a diode VD1 and an electromagnetic relay K1. One end of the resistor R1 is connected to the MCU control module, the other end of the resistor R1 is connected to the base of the transistor VT1, the emitter of the transistor VT1 is grounded, the collector of the transistor VT1 is connected to one end of the diode VD1 and one end of the coil of the electromagnetic relay K1, the other end of the diode VD1 is connected to the other end of the coil of the electromagnetic relay K1, and pin 2 of the electromagnetic relay K1 is connected to the current limiting unit.

7. The Bl-phase power device abnormality processing module according to claim 1 or 6, characterized in that: The current limiting unit includes a resistor R2, a transistor VT2, a diode VD2, an electromagnetic relay K2 and a resistor R4, one end of the resistor R2 is connected to the MCU control module, the other end of the resistor R2 is connected to the base of the transistor VT2, the emitter of the transistor VT2 is grounded, the collector of the transistor VT2 is connected to one end of the diode VD2 and one end of the coil of the electromagnetic relay K2, the other end of the diode VD2 is connected to the other end of the coil of the electromagnetic relay K2, pin 1 of the electromagnetic relay K2 is connected to pin 2 of the electromagnetic relay K1, pin 2 of the electromagnetic relay K2 is connected to one end of the resistor R4 and the power device, and pin 3 of the electromagnetic relay K2 is connected to the other end of the resistor R4.

8. The Bl-phase power device abnormality processing module according to claim 1 or 6, characterized in that: The resistance adjustment unit includes a transistor VT4, a resistor R5 and a capacitor C. The base of the transistor VT4 is connected to the MCU control module, the collector of the transistor VT4 is connected to the power device, the emitter of the transistor VT4 is connected to one end of the resistor R5, the other end of the resistor R5 is connected to one end of the capacitor C, and the other end of the capacitor C is grounded.

9. The Bl-phase power device abnormality processing module according to claim 1 or 6, characterized in that: The cooling unit includes a resistor R3, a transistor VT3, a diode VD3, an electromagnetic relay K3 and a cooling fan M. One end of the resistor R3 is connected to the MCU control module, the other end of the resistor R3 is connected to the base of the transistor VT3, the emitter of the transistor VT3 is grounded, the collector of the transistor VT3 is connected to one end of the diode VD3 and one end of the coil of the electromagnetic relay K3, the other end of the diode VD3 is connected to the other end of the coil of the electromagnetic relay K3, and pin 3 of the electromagnetic relay K3 is connected to the cooling fan M.

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