A temperature control and heat dissipation system for microelectronic equipment based on vapor-liquid phase change nanoemulsion boiling heat transfer

Abstract

The present invention discloses a microelectronic device temperature control and heat dissipation system based on vapor-liquid phase change nanoemulsion boiling heat transfer, which relates to the field of thermal management technology of microelectronic devices, including a fan radiator, a circulating water pump, a controllable ultrasonic emulsification module and a heat exchanger connected in sequence. The water-cooled heat dissipation system adopts a vapor-liquid phase change nanoemulsion with phase change function (ultrapure water as a continuous phase and a low-boiling organic fluoride as a dispersed phase) as a heat exchange medium, and the configured emulsion is pre-filled into the pipeline of the water-cooled heat dissipation system. The controllable ultrasonic emulsification module is used to perform real-time online regulation of the emulsion parameters to match the heat dissipation requirements of the microelectronic device. By replacing the heat exchange medium of the water-cooled heat dissipation system, the heat dissipation performance is significantly improved compared with single-phase flow heat exchange under the same pump work and the same flow conditions, and the efficient temperature control and heat dissipation requirements of microelectronic devices with a junction temperature not exceeding 85°C are met, and the safe and stable operation of the microelectronic devices under the trend of miniaturization and high integration is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal management of microelectronic equipment, in particular to a microelectronic equipment temperature control and heat dissipation system based on vapor-liquid phase change nanoemulsion boiling heat transfer. Background Art

[0002] As the thermal design power consumption of microelectronic devices continues to increase, device miniaturization and integration are placing ever-stricter demands on space utilization. In order to balance size and performance, the heat dissipation problem of microelectronic devices is becoming increasingly serious. Water cooling has become the mainstream solution for microelectronic device heat dissipation due to its high reliability and heat transfer efficiency. A water-cooling system typically consists of a heat exchanger, a circulation system, and a heat transfer medium (mostly ultrapure water). Due to the high heat carrying capacity of liquid water, its heat dissipation efficiency is over five times that of air cooling. Within the heat exchanger, which is in direct contact with the microelectronic device, the heat transfer medium flows in a laminar manner without undergoing a phase change, removing heat from the microelectronic device surface. Further improving the efficiency of single-phase flow can be achieved by modifying the flow channel configuration or introducing pin fins (to disrupt the boundary layer, enhance near-wall turbulence, and increase the heat transfer area). However, these methods come at the expense of increased pressure drop, increased processing complexity, and higher costs. Consequently, existing water-cooling systems struggle to further improve the temperature control and heat dissipation performance of microelectronic devices under constant pump power conditions. Summary of the Invention

[0003] The purpose of the present invention is to provide a microelectronic device temperature control and heat dissipation system based on vapor-liquid phase change nanoemulsion boiling heat transfer to solve the problems existing in the above-mentioned prior art. By replacing the heat exchange medium of the water-cooled heat dissipation system, the temperature control and heat dissipation performance of the microelectronic device under equal pump power conditions in a limited space can be greatly improved compared with single-phase flow heat exchange.

[0004] To achieve the above-mentioned purpose, the present invention provides the following solution: The present invention provides a temperature control and heat dissipation system for microelectronic equipment based on boiling heat transfer of vapor-liquid phase change nanoemulsion, comprising a fan radiator, a circulating water pump, a liquid storage tank, a transmittance sensor, a piezoelectric transducer and a heat exchanger connected in sequence. The water-cooled heat dissipation system uses vapor-liquid phase change nanoemulsion with phase change function as the heat exchange medium, and the emulsion is further emulsified in a real-time online manner by adjusting the duty cycle of the piezoelectric transducer.

[0005] Preferably, the continuous phase of the vapor-liquid phase change nanoemulsion is ultrapure water.

[0006] Preferably, the dispersed phase of the vapor-liquid phase change nanoemulsion is an organic fluoride having a boiling point higher than room temperature and lower than 85° C., a junction temperature of the microelectronic device, and its volume fraction does not exceed 5%.

[0007] Preferably, the vapor-liquid phase change nanoemulsion is prepared by pre-dispersing a low-boiling organic fluoride in water by an emulsification method, and the entire system pipeline is filled with the emulsion.

[0008] Preferably, the water cooling system is used for dissipating heat from microelectronic devices with a junction temperature below 85°C.

[0009] Preferably, the circulating water pump is started, and the nano phase change emulsion flows into the inlet of the heat exchanger in contact with the microelectronic device. When the temperature of the emulsion reaches the boiling point of the organic fluoride, the organic fluoride droplets boil in the water.

[0010] Preferably, the boiling vapor-liquid phase-change nanoemulsion flows out from the outlet of the heat exchanger, passes through a pipeline, and then enters a fan radiator for cooling.

[0011] Preferably, the transmittance sensor monitors the transmittance of the emulsion in the liquid storage tank and adjusts the duty cycle of the piezoelectric transducer in combination with the outlet temperature of the heat exchanger, thereby regulating the droplet diameter in real time online.

[0012] Preferably, the vapor-liquid phase-change nanoemulsion flows out of the liquid storage tank and then flows into the heat exchanger again for the next cycle.

[0013] Preferably, the temperature of the emulsion flowing into the heat exchanger during the circulation process must be lower than the boiling point of the organic fluoride droplets.

[0014] Preferably, the heat exchanger is made of copper and is hydrophilic treated.

[0015] The present invention discloses the following technical effects:

[0016] To reduce costs and improve the cooling efficiency of existing cooling systems, the novel temperature-controlled heat dissipation system for microelectronic devices in this invention introduces a novel heat transfer medium, a vapor-liquid phase-change nanoemulsion, into a water-cooled cooling system. A controllable ultrasonic emulsification module is installed in the system to enable real-time online control of droplet diameter, serving as the key to solving this problem. Compared to single-phase water flow heat transfer, the convective heat transfer coefficient generated by this emulsion can be increased by 20% to 60%. Furthermore, this invention can significantly reduce the operating temperature of microelectronic devices under conditions of constant pump power, thereby improving the computing power of microelectronic devices in the face of the trend toward miniaturization and high integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0018] Figure 1 This is the structural layout diagram of the water cooling system;

[0019] Among them, the fan radiator 1, the circulating water pump 2, the liquid storage tank 3, the light transmittance sensor 4, the piezoelectric transducer 5, and the heat exchanger 6. The controllable ultrasonic emulsification module includes the liquid storage tank 3, the light transmittance sensor 4 and the piezoelectric transducer 5. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] The purpose of the present invention is to provide a water-cooling heat dissipation system for temperature control and heat dissipation of microelectronic equipment to solve the problems existing in the above-mentioned prior art. By replacing the heat exchange medium of the existing water-cooling heat dissipation system and installing a controllable ultrasonic emulsification module in the system, the heat dissipation performance under equal pump power conditions in a limited space can be greatly improved compared with single-phase flow heat exchange.

[0022] In order to make the above-mentioned objects, features and effects of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] like Figure 1 As shown, this embodiment provides a water-cooling heat dissipation system for temperature control and heat dissipation of microelectronic devices, including a fan radiator 1, a circulating water pump 2, a liquid storage tank 3, a transmittance sensor 4, a piezoelectric transducer 5, and a heat exchanger 6. The liquid storage tank 3, the transmittance sensor 4, and the piezoelectric transducer 5 all belong to a controllable ultrasonic emulsification module. The present invention primarily changes the heat exchange medium in the water-cooling heat dissipation system. A controllable ultrasonic emulsification module is installed in the system to perform real-time online control of the emulsion. A nanoemulsion with a dispersed phase volume fraction of 3% is pre-prepared by an emulsification method to fill the entire system pipeline.

[0024] As a preferred specific implementation method, this embodiment can adjust the power of the circulating water pump 2 in real time to meet the cooling requirements under different working conditions.

[0025] As a preferred embodiment, the controllable ultrasonic emulsification module in this embodiment can further control the diameter of the droplets in real time by changing the duty cycle of the piezoelectric transducer 5 in real time to meet the heat dissipation requirements under different working conditions.

[0026] As a preferred embodiment, the flow channel in the heat exchanger 6 provided in this embodiment is a straight channel.

[0027] As a preferred embodiment, the heat exchanger 6 provided in this embodiment is made of copper having excellent thermal conductivity.

[0028] As a preferred embodiment, the flow channel in the heat exchanger 6 of this embodiment is at a sub-millimeter level.

[0029] As a preferred embodiment, the flow channels in the heat exchanger 6 of this embodiment are treated to be hydrophilic or super-hydrophilic.

[0030] As a preferred embodiment, a 1 cm long silicone tube is used at the inlet and outlet of the heat exchanger 6 in this embodiment for vibration isolation.

[0031] The working principle of the water cooling and heat dissipation system for temperature control and heat dissipation of microelectronic equipment in the present invention is as follows:

[0032] 1. Start the circulating water pump 2, and the vapor-liquid phase-change nanoemulsion flows into the inlet of the heat exchanger 6 in contact with the microelectronic device. When the boiling point of the organic fluoride is reached, the organic fluoride droplets will boil in the water. While taking into account the high heat carrying capacity of single-phase water, the latent heat of vaporization of the low-boiling organic fluoride is also utilized to synergistically enhance heat transfer. The high volume change rate during the vapor-liquid phase change process causes local disturbances, destroying the thermal boundary layer and further enhancing heat transfer.

[0033] 2. The emulsion flowing out of the heat exchanger 6 is cooled while flowing through the fan radiator 1, and returns to its initial state, waiting to enter the next cycle.

[0034] 3. Vapor-liquid phase-change nanoemulsions are not thermodynamically stable systems, and the dispersed phase nanodroplets within them tend to coalesce. As the emulsion flows through the controllable ultrasonic emulsification module, the transmittance of the emulsion is monitored in real time by the transmittance sensor 4 in the liquid storage tank 3. Simultaneously, the duty cycle of the piezoelectric transducer 5 is adjusted in real time based on the outlet temperature of the heat exchanger to further emulsify the emulsion, thereby varying the diameter of the nanodroplets and achieving optimal cooling.

[0035] Compared with the prior art, the innovative features of this application are as follows:

[0036] Water cooling technology has become the optimal method for temperature control and heat dissipation of microelectronic devices due to its excellent reliability and extremely high heat transfer efficiency. However, the heat transfer medium of existing water cooling systems is mainly ultrapure water. Water carries away heat in a laminar flow during single-phase flow heat transfer. The heat transfer performance can be further improved by increasing the pump work to increase the flow rate. Secondly, by changing the configuration and surface microstructure of the heat transfer channel, its heat transfer performance can be further improved at the cost of increasing the pressure drop. However, if a more efficient flow boiling heat transfer technology is used, the wall temperature must reach 100°C, and it is difficult for microelectronic devices to operate normally at this temperature.

[0037] This invention replaces the heat exchange medium in the temperature control and heat dissipation system for microelectronic devices with a vapor-liquid phase-change nanoemulsion. During the flow heat exchange process, the dispersed low-boiling organic fluoride nanodroplets in this emulsion boil within the microelectronic device's junction temperature of 85°C. This utilizes the high sensible heat of water, the latent heat of vaporization of the low-boiling organic fluoride, and the boiling droplet disturbance to synergistically enhance heat exchange. A piezoelectric transducer is also incorporated into the system to control the droplet diameter in real time. Under the same pump power and flow conditions, this system significantly reduces the operating temperature of the microelectronic device compared to single-phase flow heat exchange. It also requires less pump power to control the temperature of the microelectronic device within a certain range.

[0038] It should be noted that it is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from all perspectives, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims, not the foregoing description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims be included in the present invention, and any reference signs in the claims should not be regarded as limiting the claims involved.

[0039] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will be able to make changes in the specific implementation methods and application scope based on the concept of the present invention. In summary, the content of this specification should not be construed as limiting the present invention.

Claims

1. A microelectronic device temperature control and heat dissipation system based on vapor-liquid phase change nanoemulsion boiling heat transfer, characterized by: The system comprises a fan radiator, a circulating water pump, a liquid storage tank, a light transmittance sensor, a piezoelectric transducer and a heat exchanger connected in sequence. The heat exchange medium of the temperature control and heat dissipation system is a nanoemulsion with a vapor-liquid phase change function. The continuous phase of the nanoemulsion is ultrapure water, and the dispersed phase of the nanoemulsion is a low-boiling organic fluoride. The circulating water pump is started, and the vapor-liquid phase change nanoemulsion flows into the inlet of the heat exchanger in contact with the microelectronic device; when the boiling point of the organic fluoride is reached, the organic fluoride droplets boil in the water, taking into account the high heat carrying capacity of single-phase water while utilizing the latent heat of vaporization of the low-boiling organic fluoride to synergistically enhance heat exchange; the emulsion flowing out of the heat exchanger is cooled as it flows through the fan radiator; the transmittance of the nanoemulsion is monitored with the help of the transmittance sensor in the controllable ultrasonic emulsification module, and the duty cycle of the piezoelectric transducer is adjusted in real time in combination with the outlet temperature of the heat exchanger, and the emulsion is further emulsified in a real-time online manner, thereby regulating the diameter of the nanodroplets to achieve the best cooling effect.

2. The microelectronic device temperature control and heat dissipation system according to claim 1, characterized in that: The flow channels of the heat exchanger are subjected to hydrophilic treatment.

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