A low-temperature baking and curing device suitable for nano-scale film-making process

Abstract

The present invention relates to the field of semiconductor and photovoltaic industry coating technology, and specifically discloses a low-temperature baking and curing equipment suitable for nano-scale film-making processes, comprising a lower supporting mechanism, an upper supporting mechanism and a control mechanism, wherein the lower supporting mechanism comprises a lower supporting component and a lower outer protective component covered on the outer side of the lower supporting component, the upper supporting mechanism comprises an upper supporting component and an upper outer protective component covered on the outer side of the upper supporting component, and the control mechanism comprises a temperature control component; in the present invention, a thicker heating plate is adopted to increase its strength, which can reduce the deformation of the heating plate due to heat deformation, and play a role in uniformly transferring heat energy to the surface; heat radiation from the heating plate will form heat reflection when encountering the lower end surface of the heat reflecting plate, thereby increasing the angle of heat propagation in all directions and improving the uniformity of heat conduction; the lower heat insulation slot plate, the lower outer heat insulation plate, the upper heat insulation cover plate and the upper outer heat insulation plate play a heat insulation role relative to the heating plate, thereby reducing the heat loss of the entire equipment.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor and photovoltaic industry coating technology, and in particular to a low-temperature baking and curing device suitable for nano-scale film-making processes. Background Art

[0002] The semiconductor and photovoltaic industries involve a large amount of metal film production. Metal films are generally treated by coating and baking. In the existing technology, metal film baking equipment generally uses electric heating wires / tubes to heat a specific volume hot plate. The hot plate is fixed to the device housing. After the metal film is coated on the hot plate, it is heated and baked. The entire metal film is baked by heating. This device can meet general usage requirements, but it still has the following disadvantages in actual use:

[0003] 1. In the existing coating baking equipment, the hot plate is easily deformed under high temperature conditions, and the treated objects are often affected by this and fail to meet the theoretical or ideal annealing requirements;

[0004] 2. In the coating baking equipment in the existing technology, the bottom heating temperature control of the hot plate is poor, and the heat loss in different directions around the hot plate is different. Therefore, the heat distribution of the hot plate is poor during the heating process. When used, the treated object is affected by this and often fails to meet the theoretical or ideal annealing requirements. Summary of the Invention

[0005] The purpose of the present invention is to provide a low-temperature baking and curing device suitable for nano-scale film-making technology to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A low-temperature baking and curing device suitable for nano-scale film-making process, comprising a lower support mechanism, an upper support mechanism and a control mechanism, the lower support mechanism comprising a lower support component and a lower outer protective component covered on the outside of the lower support component, the upper support mechanism comprising an upper support component and an upper outer protective component covered on the outside of the upper support component, the control mechanism comprising a temperature control component, the upper support component is hinged to one side of the upper end of the lower support component, the lower support component comprises a lower support trough plate of a trough structure, the upper support component comprises an upper support cover plate of a trough structure, and one side of the lower port of the upper support cover plate is hinged and fixed to one side of the upper port of the lower support trough plate.

[0007] Preferably, the lower end of the lower support trough plate is fixedly connected to the support base plate by bolts, and support feet are fixedly connected to the left and right sides of the lower end of the support base plate. A lower insulation trough plate is fixedly provided on the trough side of the lower support trough plate, and a heating plate is fixedly installed on the inner side of the lower insulation trough plate.

[0008] Preferably, the inner side of the upper support cover plate groove is fixedly connected to a heat reflecting support plate by bolts, and a heat reflecting plate is fixedly overlapped on the upper end of the heat reflecting support plate, and an upper heat insulating cover plate is sandwiched between the upper support cover plate and the heat reflecting plate.

[0009] Preferably, a guide opening is opened at the lower end of the heating plate toward the bottom of the supporting base plate, and a wire groove of a trough structure is fixedly installed at the lower end of the guide opening and at the bottom of the supporting base plate, and a wire pipe joint is fixedly connected to the side of the wire groove.

[0010] Preferably, the lower outer protection assembly includes a lower outer support frame plate provided on the outer side of the lower support trough plate, and a lower outer heat insulation plate is fixedly embedded on the outer side of the lower outer support frame plate, and the lower support trough plate and the lower outer support frame plate are fixedly connected by bolts.

[0011] Preferably, the upper outer protection assembly includes an upper outer support frame plate of a frame structure provided on the outside of the upper support cover plate, and an upper outer heat insulation plate is fixedly embedded on the outside of the upper outer support frame plate, and the upper outer support frame plate and the upper support cover plate are fixedly connected by bolts.

[0012] Preferably, the upper outer support frame plate is a three-sided surrounding frame structure on the outer side of the upper support cover plate, and handles are fixedly connected to the left and right sides of the outer side of the upper outer support frame plate.

[0013] Preferably, the temperature control component is electrically connected to the heating plate, and the temperature control component is provided with a temperature control sensor contact in a wire groove at the lower end of the heating plate.

[0014] Preferably, the lower end surface of the heat reflecting plate is a mirror reflection structure, and the lower end surface of the outer side of the heat reflecting plate is attached and fixed to the upper end surface of the heat reflecting support plate.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] 1. In the present invention, a thicker heating plate is used to increase its strength, which can reduce the deformation of the heating plate due to heat deformation and play a role in uniformly transferring heat energy to the surface;

[0017] 2. In the present invention, an upper support cover plate is provided on the upper end of the heating plate, and a heat reflector plate is fixed on the lower end of the upper support cover plate. When the heat radiation from the heating plate encounters the lower end surface of the heat reflector plate, heat reflection is formed, reflecting the heat downward, increasing the angle of heat propagation in all directions, improving the uniformity of heat conduction, improving the stability of heating, and improving the quality of heat treatment;

[0018] 3. In the present invention, an upper heat insulation cover plate is provided on the upper end of the heat reflecting plate, a lower heat insulation slot plate is provided circumferentially on the outer side of the heating plate, and a lower outer support frame plate and an upper outer support frame plate are provided around the outer sides of the lower support slot plate and the upper support cover plate. The upper heat insulation cover plate and the lower heat insulation slot plate provide heat insulation and heat preservation relative to the heating plate and the heat reflecting plate, thereby reducing heat loss of the entire equipment and improving heating efficiency. The lower outer heat insulation plate embedded on the outer side of the lower outer support frame plate and the upper outer heat insulation plate embedded on the outer side of the upper outer support frame plate further provide heat insulation and heat preservation.

[0019] 4. In the present invention, the temperature of the heating plate is controlled by the temperature control component, so that the temperature is maintained in a relatively stable range, thereby improving the balance and stability of the treatment and improving the quality of the heat treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is an axonometric view of the overall structure of the present invention;

[0021] Figure 2 This is a front view of the overall structure of the present invention;

[0022] Figure 3 for Figure 2 Axial view of the cross-section structure at AA in the middle;

[0023] Figure 4 for Figure 2 Axial view of the cross-section structure at the middle BB;

[0024] Figure 5 for Figure 2 Axial view of the cross-section structure at CC;

[0025] Figure 6 for Figure 5 A magnified schematic diagram of the local structure at point E in the middle;

[0026] Figure 7 It is a bottom view of the overall structure of the present invention;

[0027] Figure 8 It is a left view of the overall structure of the present invention;

[0028] Figure 9 for Figure 8 Axial view of the cross-sectional structure at the middle DD;

[0029] Figure 10 for Figure 9 Enlarged schematic diagram of the local structure at point F in the middle.

[0030] In the figure: 1. Lower support assembly; 2. Lower outer protection assembly; 3. Upper support assembly; 4. Upper outer protection assembly; 5. Temperature control assembly; 101. Support foot; 102. Support base plate; 103. Wire trough; 104. Wire pipe joint; 105. Lower support trough plate; 106. Lower insulation trough plate; 107. Heating plate; 201. Lower outer support frame plate; 202. Lower outer insulation plate; 301. Upper support cover plate; 302. Upper insulation cover plate; 303. Heat reflecting plate; 304. Heat reflecting support plate; 401. Upper outer support frame plate; 402. Upper outer insulation plate; 403. Handle. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] See also Figures 1 to 10 The present invention provides a technical solution: a low-temperature baking and curing device suitable for a nano-scale film-forming process, comprising a lower support mechanism, an upper support mechanism and a control mechanism, the lower support mechanism comprising a lower support component 1 and a lower outer protection component 2 covered on the outside of the lower support component 1, the upper support mechanism comprising an upper support component 3 and an upper outer protection component 4 covered on the outside of the upper support component 3, the control mechanism comprising a temperature control component 5, the upper support component 3 is hinged to one side of the upper end of the lower support component 1, wherein the lower support component 1 plays a role of bottom support and heating relative to the entire machine, the upper support component 3 plays a role of upper end protection and heat reflection relative to the lower support component 1, the lower outer protection component 2 and the upper outer protection component 4 play a role of heat insulation and external protection relative to the lower support component 1 and the upper support component 3 respectively, and the temperature control component 5 plays a role of temperature control relative to the lower support component 1.

[0033] The lower support assembly 1 is composed of a support base plate 102, a lower support slot plate 105 fixedly installed on the upper end of the support base plate 102, a lower heat insulation slot plate 106 annularly fixed and fitted in the slot body of the lower support slot plate 105, and a heating plate 107 fixedly installed in the middle of the lower heat insulation slot plate 106, wherein the lower support slot plate 105 is a plate-shaped slot structure lower support slot plate 105, the lower end of the lower support slot plate 105 is fixedly connected to the support base plate 102 by bolts, the lower end of the heating plate 107 is provided with a guide opening toward the bottom of the support base plate 102, and a wire groove 103 of a slot structure is fixedly installed at the lower end of the guide opening and at the bottom of the support base plate 102, and a wire pipe joint 104 is fixedly connected to the side of the wire groove 103, and support feet 101 are fixedly connected to the left and right sides of the lower end of the support base plate 102, and the support feet 101 are relative to the support base The plate 102 plays a role of bottom support, and the supporting bottom plate 102 plays a role of bottom support relative to the lower supporting slot plate 105. The lower supporting slot plate 105 plays a supporting role relative to the lower insulation slot plate 106. The lower insulation slot plate 106 plays a supporting and heat-insulating protection role relative to the heating plate 107. The heating plate 107 is an electric heating plate, and the wire groove 103 at the lower end of the heating plate 107 plays a role of a wire and detection guide. During installation, the energized wire and the temperature control sensor contact are led out by the temperature control component 5 and introduced into the wire groove 103 through the wire pipe joint 104. The energized wire passes through the guide port and is connected to the heating plate 107. During operation, the heating temperature and heating time of the heating plate 107 are controlled by the temperature control component 5, so that the heating temperature of the heating plate 107 is controlled within a relatively stable range, thereby improving the stability of the heat treatment.

[0034] The upper support assembly 3 is composed of an upper support cover plate 301 of a plate-shaped trough structure, a heat reflecting support plate 304 fixedly connected to the inner side of the upper support cover plate 301 trough body by bolts, and a heat reflecting plate 303 fixedly overlapped at the upper end of the heat reflecting support plate 304, wherein the lower end surface of the heat reflecting plate 303 is a mirror reflection structure, the lower end surface of the outer side of the heat reflecting plate 303 is fitted and fixed to the upper end surface of the heat reflecting support plate 304, one side of the lower port of the upper support cover plate 301 is hinged and fixed to one side of the upper port of the lower support trough plate 105, an upper heat insulation cover plate 302 is sandwiched between the upper support cover plate 301 and the heat reflecting plate 303, and the upper support The support cover plate 301 plays an outer protection and support role relative to the heat reflecting support plate 304, and the heat reflecting support plate 304 plays a supporting role relative to the heat reflecting plate 303. The upper heat insulation cover plate 302 plays a heat insulating role between the heat reflecting plate 303 and the upper support cover plate 301. During operation, there will be heat radiation during the heating process of the heating plate 107. The heating wave of the heat radiation forms a reflection after reaching the lower end of the heat reflecting plate 303, reflecting and propagating the heat to the upper end of the heating plate 107, thereby improving the heat balance of the upper end of the heating plate 107, improving the heating efficiency, improving the heating effect, and improving the heat treatment quality.

[0035] The lower outer protection assembly 2 includes a lower outer support frame plate 201 provided on the outer side of the lower support trough plate 105, and a lower outer heat insulation plate 202 is fixedly embedded on the outer side of the lower outer support frame plate 201. The lower support trough plate 105 and the lower outer support frame plate 201 are fixedly connected by bolts, wherein the lower outer support frame plate 201 plays a fixed supporting role relative to the lower outer heat insulation plate 202, the lower support trough plate 105 plays an internal supporting role relative to the lower outer support frame plate 201, and the lower outer heat insulation plate 202 plays an external protection and heat insulation role relative to the lower support trough plate 105.

[0036] The upper outer protection assembly 4 includes an upper outer support frame plate 401 of a frame structure provided on the outer side of the upper support cover plate 301, and an upper outer heat insulation plate 402 is fixedly embedded on the outer side of the upper outer support frame plate 401. The upper outer support frame plate 401 is fixedly connected to the upper support cover plate 301 by bolts. The upper outer support frame plate 401 is a three-sided surrounding frame structure on the outer side of the upper support cover plate 301, and handles 403 are fixedly connected to the left and right sides of the outer side of the upper outer support frame plate 401. The cover plate 301 plays an internal supporting role relative to the upper outer support frame plate 401, the upper outer support frame plate 401 plays a fixed supporting role relative to the upper outer heat insulation plate 402, and the upper outer heat insulation plate 402 plays an external protection and heat insulation role relative to the upper support cover plate 301. After the heating treatment is completed, hold the handle 403 to open the upper outer support frame plate 401 and the upper support cover plate 301 from the upper end of the lower support groove plate 105 to one side, and take away the heated diaphragm at the upper end of the heating plate 107.

[0037] The present invention, before work, the coated film is placed on the heating plate 107, and the heating plate 107 is controlled by the temperature control component 5 to start heating. During the heating process, a temperature sensor probe led out from the temperature control component 5 is installed at the lower end of the heating plate 107 and in the wire groove 103. The heating temperature of the heating plate 107 is monitored by the temperature sensor probe and the temperature information is uploaded to the temperature control component 5. The temperature control component 5 in turn adjusts the heating temperature of the heating plate 107 to be controlled within a stable range. The heat radiation wave generated during the heating process of the heating plate 107 contacts the heat reflecting plate 303 and is reflected downward to the upper end of the heating plate 107, so that the temperature stability of the upper end of the heating plate 107 is higher and the heat utilization efficiency of the heating plate 107 is improved. At the same time, the lower insulation groove plate 106, the lower outer insulation plate 202, the upper insulation cover plate 302, and the upper outer insulation plate 402 play a heat insulation role, reducing the heat loss of the entire equipment, further improving the heat utilization rate, and improving the heating quality and heating efficiency.

[0038] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A low-temperature baking and curing device suitable for nano-scale film-making process, characterized by: The invention comprises a lower support mechanism, an upper support mechanism and a control mechanism, wherein the lower support mechanism comprises a lower support component (1) and a lower outer protection component (2) provided on the outer side of the lower support component (1), the upper support mechanism comprises an upper support component (3) and an upper outer protection component (4) provided on the outer side of the upper support component (3), the control mechanism comprises a temperature control component (5), the upper support component (3) is hinged to one side of the upper end of the lower support component (1), the lower support component (1) comprises a lower support slot plate (105) of a slot structure, the upper support component (3) comprises an upper support cover plate (301) of the slot structure, and one side of the lower port of the upper support cover plate (301) is hinged and fixed to one side of the upper port of the lower support slot plate (105); The lower end of the lower support trough plate (105) is fixedly connected to the support base plate (102) by bolts, and support legs (101) are fixedly connected to the left and right sides of the lower end of the support base plate (102). A lower heat insulation trough plate (106) is fixedly provided in a circumferential direction on the trough body side of the lower support trough plate (105), and a heating plate (107) is fixedly installed on the inner side of the lower heat insulation trough plate (106). The inner side of the trough body of the upper support cover plate (301) is fixedly connected to a heat reflection support plate (304) by means of bolts, and a heat reflection plate (303) is fixedly overlapped on the upper end of the heat reflection support plate (304), and an upper heat insulation cover plate (302) is sandwiched between the upper support cover plate (301) and the heat reflection plate (303); The lower outer protection assembly (2) includes a lower outer support frame plate (201) provided on the outer side of the lower support trough plate (105), and a lower outer heat insulation plate (202) is fixedly embedded on the outer side of the lower outer support frame plate (201), and the lower support trough plate (105) and the lower outer support frame plate (201) are fixedly connected by bolts; The upper outer protection assembly (4) comprises an upper outer support frame plate (401) of a frame structure provided on the outer side of the upper support cover plate (301), and an upper outer heat insulation plate (402) is fixedly embedded on the outer side of the upper outer support frame plate (401), and the upper outer support frame plate (401) and the upper support cover plate (301) are fixedly connected by bolts.

2. The low-temperature baking and curing equipment suitable for nano-scale film-making process according to claim 1, characterized in that: A guide opening is provided at the lower end of the heating plate (107) toward the bottom of the supporting base plate (102), and a wire trough (103) with a trough structure is fixedly installed at the lower end of the guide opening and at the bottom of the supporting base plate (102), and a wire pipe joint (104) is fixedly connected to the side of the wire trough (103).

3. The low-temperature baking and curing equipment suitable for nano-scale film-making process according to claim 2, characterized in that: The upper outer support frame plate (401) is formed into a three-sided surrounding frame structure on the outer side of the upper support cover plate (301), and handles (403) are fixedly connected to the left and right sides of the outer side of the upper outer support frame plate (401).

4. The low-temperature baking and curing equipment suitable for nano-scale film-making process according to claim 3, characterized in that: The temperature control component (5) is electrically connected to the heating plate (107), and the temperature control component (5) is provided with a temperature control sensor contact that is led into the wire groove (103) at the lower end of the heating plate (107).

5. The low-temperature baking and curing equipment suitable for nano-scale film-making process according to claim 4, characterized in that: The lower end surface of the heat reflection plate (303) is a mirror reflection structure, and the lower end surface of the outer side of the heat reflection plate (303) is fitted and fixed to the upper end surface of the heat reflection support plate (304).

Images