A full-automatic integrated processing device and method for semiconductor ingot

Abstract

The application relates to the technical field of crystal processing, and provides a full-automatic integrated processing device and method for a semiconductor crystal bar, which comprises a machine tool bed body, an automatic feeding and discharging mechanism arranged on one side of the machine tool bed body, a crystal bar centering mechanism, a mechanical arm and a discharging table; a first moving mechanism comprising a first guide rail and a clamping mechanism, the clamping mechanism being used for clamping the crystal bar which has completed centering; a rounding processing mechanism arranged on the machine tool bed body and used for rounding the crystal bar which has completed centering; a crystal orientation mechanism arranged on the machine tool bed body and used for orienting the crystal bar which has completed rounding; and an edge grinding processing mechanism longitudinally arranged on the machine tool bed body and used for edge grinding the crystal bar which has completed crystal orientation. The full-automatic integrated processing device and method for the semiconductor crystal bar realize integrated processing and automatic control of multiple processes on a single device, can guarantee efficient and high-precision processing, can reduce labor cost and human error, and can improve the input-output ratio of the whole production line.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of crystal processing, in particular to a full-automatic integrated processing device and method for a semiconductor crystal bar. BACKGROUND

[0002] According to the traditional requirements of the semiconductor industry, a positioning edge needs to be made on a semiconductor substrate material to mark the crystal direction. The main positioning edge direction is generally oriented by an X-ray diffraction method, and then edge grinding processing is performed. Crystal orientation and edge grinding processing are of great significance to the later use of the substrate material.

[0003] After the growth of a semiconductor single crystal is completed, the crystal bar generally needs to undergo processes such as rounding, crystal orientation, grinding of a positioning edge, cutting, grinding and polishing, and finally is processed into a single crystal substrate.

[0004] For crystal bar rounding, after the crystal bar just grown is ground flat, it is generally clamped on a rounding grinding machine by artificial clamping, and the center position of the crystal bar is adjusted by a rubber hammer according to experience. However, the semiconductor crystal bar grown is not a standard cylindrical shape, so artificial clamping and centering according to experience can easily cause material waste and time consumption in the rounding process. Traditional crystal orientation is generally performed on a single crystal direction positioning device and relies on manual operation to judge the diffraction peak. This process greatly depends on manual operation and requires an operator with certain experience and professional knowledge to manually judge whether the diffraction peak reaches the peak, which increases the labor cost and is prone to human error, thereby reducing the accuracy of crystal orientation. After the crystal orientation is marked, it needs to be transferred to an edge grinding device for re-clamping, which can cause direction deviation during edge grinding and thus reduce the accuracy. At present, there are few integrated devices and methods in the prior art that can simultaneously perform outer diameter centering, automatic feeding, rounding, crystal orientation, edge grinding and automatic discharging.

[0005] Patent document CN115741263A discloses a silicon carbide multifunctional high-speed rounding grinding machine. The grinding machine adopts multiple grinding heads and is installed into a forming grinding wheel to realize multifunctional grinding in one machine; high-speed processing is adopted to significantly improve the processing efficiency. However, the high-speed rounding grinding machine can only be used for one of the semiconductor processing procedures, and the performance is slightly single.

[0006] The patent document with the publication number CN 203542884 U discloses a clamp for positioning and orienting a silicon carbide single crystal. The clamp belongs to an auxiliary accessory suitable for a split silicon carbide single crystal processing technology (the orientation instrument is separated from the grinding machine). After the crystal orientation is determined, the crystal needs to be manually moved to a flat grinding machine for the next step of processing. The clamp cannot be seamlessly matched with the subsequent process, which will cause certain human errors in actual operation, resulting in a certain direction deviation in the edge grinding process, and reducing the precision.

[0007] The patent document with the publication number CN 104827397 B discloses a clamp for grinding the positioning edge of a silicon carbide single crystal and application. The clamp does not need to be oriented for each crystal during the crystal processing process. According to the determined main positioning edge direction, the required crystal orientation and angle deviation can be directly ground. However, the clamp still needs other devices to orient the single crystal silicon carbide in the early stage, and then the clamp is transferred to the clamp for grinding the positioning edge. In the process of re-clamping, errors are easily caused. Therefore, the cooperation between processes, the integration and automation of processing are very important.

[0008] The above-mentioned prior art solutions have the following defects: multiple processes of semiconductor crystal bar processing need to be processed on different devices and rely on manual operation, so that there is a lack of continuity between multiple processes, and manual operation is prone to large errors, resulting in low crystal bar processing precision, and thus low crystal bar processing yield. SUMMARY

[0009] The embodiments of the present application provide a semiconductor crystal bar full-automatic integrated processing device and method, which solve the defects of the prior art, and can realize integrated processing and automatic control of multiple processes of semiconductor crystal bar processing on a single device. The device can ensure efficient and high-precision processing, reduce labor costs and human errors, and improve the input-output ratio of the entire production line.

[0010] The technical solution is as follows:

[0011] In one aspect, the embodiments of the present application provide a semiconductor crystal bar full-automatic integrated processing device, which comprises a machine tool bed body, and further comprises,

[0012] An automatic feeding and discharging mechanism is arranged on one side of the machine tool bed body, and comprises a crystal bar centering mechanism for determining the center point of the crystal bar, a mechanical arm for clamping the crystal bar, and a discharging table for placing the processed crystal bar;

[0013] A first moving mechanism comprises a first guide rail mounted on the machine tool bed body and a clamping mechanism slidingly connected to the first guide rail, and the clamping mechanism is used for clamping the crystal bar after centering;

[0014] A rounding mechanism is arranged on the machine tool bed and used for rounding the centered crystal bar;

[0015] A crystal orientation mechanism is arranged on the machine tool bed and used for orienting the rounded crystal bar;

[0016] An edge grinding mechanism is arranged longitudinally on the machine tool bed and used for edge grinding the oriented crystal bar.

[0017] In another aspect, the embodiment of the application provides a full-automatic integrated processing method for a semiconductor crystal bar, which comprises the following steps:

[0018] The position point of the center of the crystal bar found by the optical scanning system of the crystal centering mechanism is used to move the crystal bar to a fixed point by the X-Y moving table of the crystal centering mechanism, so as to determine the center point of the crystal bar.

[0019] The centered crystal bar based on the crystal centering mechanism is moved to the clamping mechanism by the mechanical arm.

[0020] The clamped centered crystal bar is rotated by the clamping mechanism, the crystal bar moves along the first guide rail in the axial direction with the rotation of the clamping mechanism, and is moved to the rounding mechanism, so that the clamped centered crystal bar is rounded by the rounding mechanism.

[0021] The crystal bar after the rounding is moved to the crystal orientation mechanism in the axial direction by the first moving mechanism, so as to orient the crystal bar and determine the target crystal orientation.

[0022] The crystal bar after the crystal orientation is moved to the edge grinding mechanism in the axial direction again, so as to perform edge grinding.

[0023] The crystal bar after the edge grinding is placed on the discharging table by the mechanical arm, so as to perform automatic discharging.

[0024] The technical scheme provided by the application has at least the following beneficial effects:

[0025] Through the layout and mutual coordination of the automatic feeding and discharging mechanism, the clamping mechanism, the first moving mechanism, the rounding processing mechanism, the crystal orientation mechanism and the edge grinding processing mechanism, the integration of the outer diameter centering, automatic feeding, rounding, crystal orientation, edge grinding processing and automatic discharging in the semiconductor crystal bar processing process on a single set of equipment is realized, the automation control is realized, the integration degree is high, the target size crystal bar center position can be automatically calculated, the material loss and the rounding processing time are reduced, the experienced technical workers are no longer needed to manually judge and modify during clamping, the crystal can be accurately oriented, the experienced technical workers are no longer needed to judge whether the diffraction peak reaches the highest peak, and the positioning edge meeting the industrial requirements is ground, the directional deviation caused by the re-clamping after the crystal orientation and the movement to the edge grinding equipment for processing is reduced, the processing precision is high and can be continuously maintained, the experienced and professional operators are no longer needed to operate, a large amount of labor cost can be saved, the processing efficiency is improved, the high yield can be ensured, and the input and output ratio of the whole process line equipment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0027] Figure 1 The overall structure schematic diagram of a semiconductor crystal bar full-automatic integrated processing device provided by an example embodiment of the present application is shown.

[0028] Figure 2 The structure schematic diagram of the automatic feeding and discharging mechanism in the feeding state is shown.

[0029] Figure 3 The structure schematic diagram of the automatic feeding and discharging mechanism in the discharging state is shown.

[0030] Figure 4 The structure schematic diagram of the automatic feeding and discharging mechanism in the free state is shown.

[0031] Figure 5 The structure schematic diagram of the clamping mechanism is shown.

[0032] Figure 6 The structure schematic diagram of the rounding processing mechanism is shown.

[0033] Figure 7 Fig. 1 shows a structural schematic diagram of a crystal orientation mechanism according to an example embodiment of the present application;

[0034] Figure 8 Fig. 2 shows a schematic diagram of converting a crystal diffraction peak into an electrical signal according to an example embodiment of the present application;

[0035] Figure 9 Fig. 3 shows a structural schematic diagram of an edge grinding mechanism according to an example embodiment of the present application;

[0036] Figure 10 Fig. 4 shows a flowchart of a full-automatic integrated processing method of a semiconductor crystal bar according to an example embodiment of the present application;

[0037] BRIEF DESCRIPTION OF DRAWINGS

[0038] Crystal bar 1;

[0039] Machine tool bed 2;

[0040] Automatic loading and unloading mechanism 3, crystal bar centering mechanism 31, optical scanning system 311, X-Y moving table 312; mechanical arm 32, mechanical gripper 33, unloading table 34, automatic loading and unloading mechanism base 35;

[0041] First moving mechanism 4, first servo motor 41, first lead screw 42, first guide rail 43, clamping mechanism 44, headstock 441, second servo motor 442, rotary center 443, tailstock 444, movable center 445, hydraulic cylinder 446, worktable 447;

[0042] Rolling processing mechanism 5, grinding wheel frame 51, grinding wheel disc 52, third servo motor 53, second moving mechanism 54, fourth servo motor 541, second lead screw 542, second guide rail 543, rolling processing mechanism base 55, first sliding table 56;

[0043] Crystal orientation mechanism 6, orientation instrument 61, third moving mechanism 611, fifth servo motor 6111, third lead screw 6112, third guide rail 6113; second sliding table 612, probe 613, transmitter 614, receiver 615;

[0044] Edge grinding mechanism 7, electric spindle 71, bowl-shaped grinding wheel 72, fourth moving mechanism 73, sixth servo motor 731, fourth lead screw 732, fourth guide rail 733, edge grinding mechanism base 74, third sliding table 75. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the present application more clear, the following will further describe the embodiments of the present application in combination with the drawings.

[0046] Example 1

[0047] Figure 1 Fig. 1 shows a schematic diagram of the overall structure of a semiconductor wafer full-automatic integrated processing device according to an example embodiment of the present application. As shown in Fig. 1, a semiconductor wafer full-automatic integrated processing device includes a machine tool bed 2, a first moving mechanism 4, a rounding processing mechanism 5, a crystal orientation mechanism 6, and an edge grinding processing mechanism 7, which are installed on the machine tool bed 2. The machine tool bed 2 is provided with an automatic loading and unloading mechanism 3. Figure 1

[0048] Figure 2 Fig. 2 shows a schematic diagram of the structure of the automatic loading and unloading mechanism in a loading state according to an example embodiment of the present application. Figure 3 Fig. 3 shows a schematic diagram of the structure of the automatic loading and unloading mechanism in an unloading state according to an example embodiment of the present application. Figure 4 Fig. 4 shows a schematic diagram of the structure of the automatic loading and unloading mechanism in a free state according to an example embodiment of the present application. Figure 2 Figure 4 As shown in Fig. 1, the automatic loading and unloading mechanism 3 is installed on the base 35 of the automatic loading and unloading mechanism, and includes a wafer centering mechanism 31, a mechanical arm 32, and a unloading table 34. The wafer centering mechanism 31 is used to determine the position of the center point of the wafer. The mechanical arm 32 is used to clamp the wafer. The unloading table 34 is used to place the processed wafer 1.

[0049] As shown in Fig. 1, the automatic loading and unloading mechanism 3 is installed on the base 35 of the automatic loading and unloading mechanism, and includes a wafer centering mechanism 31, a mechanical arm 32, and a unloading table 34. The wafer centering mechanism 31 is used to determine the position of the center point of the wafer. The mechanical arm 32 is used to clamp the wafer. The unloading table 34 is used to place the processed wafer 1. Figure 2 As shown in Fig. 2, the wafer centering mechanism 31 includes an optical scanning system 311 for finding the center position of the wafer and an X-Y moving table 312 for moving the wafer to a fixed point. The optical scanning system 311 is located directly above the axial end of the X-Y moving table 312. The mechanical arm 32 is provided with a mechanical gripper 33, and the clamping center point of the mechanical gripper 33 coincides with the center point of the wafer.

[0050] As shown in Fig. 3, the wafer centering mechanism 31 includes an optical scanning system 311 for finding the center position of the wafer and an X-Y moving table 312 for moving the wafer to a fixed point. The optical scanning system 311 is located directly above the axial end of the X-Y moving table 312. The mechanical arm 32 is provided with a mechanical gripper 33, and the clamping center point of the mechanical gripper 33 coincides with the center point of the wafer. Figures 1-4 As shown in Fig. 4, the wafer centering mechanism 31 includes an optical scanning system 311 for finding the center position of the wafer and an X-Y moving table 312 for moving the wafer to a fixed point. The optical scanning system 311 is located directly above the axial end of the X-Y moving table 312. The mechanical arm 32 is provided with a mechanical gripper 33, and the clamping center point of the mechanical gripper 33 coincides with the center point of the wafer.

[0051] ​​The numerical control panel is used to control the operation of the above-mentioned devices. The device provided by the embodiment only needs an ordinary worker to place the crystal bar on the X-Y moving table 312, and the numerical control panel can be operated to realize the outer diameter centering of the crystal bar, automatic feeding, rounding, crystal orientation, edge grinding, and automatic unloading. The device is highly automated and integrated, can reduce material loss and rounding processing time, can reduce the investment of technical personnel and the human error caused by the technical personnel, can improve the orientation accuracy and grind the positioning edge meeting the industrial requirements with high precision, can ensure a very high yield, and can improve the investment and output ratio of the process line equipment.

[0052] It should be noted that the fully automatic integrated processing device for semiconductor crystal bars is automatically controlled by connecting the numerical control panel with the controller. The control circuit of the controller can be realized by programming by those skilled in the art, and the power supply also belongs to the common knowledge in the art. Therefore, the control mode and circuit connection will not be described in detail.

[0053] Figure 5 The structure of the clamping mechanism provided by an example embodiment of the application is shown in the structure diagram. Figure 1 and Figure 5 As shown in FIGS. 4 and 5, the first moving mechanism 4 includes a first guide rail 43, a first servo motor 41 mounted on the machine tool bed 2, a first screw rod 42 in transmission connection with the power output end of the first servo motor 41, a first nut seat in threaded connection with the first screw rod 42, and a clamping mechanism 44 in sliding connection with the first guide rail 43, which is used to clamp the crystal bar 1 that has been centered.

[0054] The clamping mechanism 44 includes a workbench 447 in sliding connection with the first guide rail 43, a headstock 441 and a tailstock 444 mounted on the workbench 447; the bottom of the workbench 447 is fixedly connected with the top of the first nut seat by screws.

[0055] One end of the headstock 441 is connected with a second servo motor 442, and the other end is connected with a rotary center 443. The power output end of the second servo motor 442 is in transmission connection with the rotary center 443.

[0056] One end of the tailstock 444 is connected with a movable center 445, and the other end is connected with a hydraulic cylinder 446. The extension end of the hydraulic cylinder 446 is connected with the movable center 445. The movable center 445 is opposite to the rotary center 443 and is used to clamp the crystal bar.

[0057] The axial centers of the rotary center 443 and the movable center 445 coincide with the center point of the crystal bar 1. The headstock 441 and the tailstock 444 rotate around the crystal bar and move axially back and forth with the workbench 447.

[0058] Figure 6Fig. 1 shows a structural schematic diagram of a rounding mechanism according to an example embodiment of the present application. As shown in Fig. 1, the rounding mechanism is used to complete the rounding of the centering crystal bar. Figure 6 As shown in Fig. 1, the rounding mechanism is used to complete the rounding of the centering crystal bar.

[0059] In the example embodiment of the present application, the rounding mechanism 5 includes a rounding mechanism base 55 mounted on the machine tool bed 2 and a first sliding table 56 in sliding connection with the rounding mechanism base 55.

[0060] The first sliding table 56 is provided with a grinding wheel frame 51, one side of the grinding wheel frame 51 is provided with a grinding wheel disc 52 for longitudinal feeding of the crystal bar for rounding and a third servo motor 53 for driving the grinding wheel disc to rotate.

[0061] The rounding mechanism base 55 is provided with a second moving mechanism 54 for controlling the single longitudinal feeding amount of the grinding wheel disc to the crystal bar.

[0062] The second moving mechanism 54 includes a fourth servo motor 541 mounted on the rounding mechanism base 55, a second lead screw 542 in transmission connection with the power output end of the fourth servo motor 541, and a second guide rail 543 mounted on the rounding mechanism base 55, the second lead screw 542 is threadedly connected with a second nut seat, and the top of the second nut seat is fixedly connected with the bottom of the first sliding table 56 through screws.

[0063] Figure 7 Fig. 2 shows a structural schematic diagram of a crystal orientation mechanism according to an example embodiment of the present application. The crystal orientation mechanism 6 is arranged on the machine tool bed 2, and is used to orient the crystal bar emitting X-rays after rounding.

[0064] In the example embodiment of the present application, the crystal orientation mechanism 6 is an orientation instrument 61; the orientation instrument 61 includes a third moving mechanism 611 and a second sliding table 612 in sliding connection with the third moving mechanism 611.

[0065] The second sliding table 612 is provided with a probe 613 for determining that the crystal bar is in a positioning position, an emitter 614 for emitting X-rays, and a receiver 615 for receiving diffracted light.

[0066] The third moving mechanism 611 includes a fifth servo motor 6111, a third lead screw 6112 in transmission connection with the power output end of the fifth servo motor 6111, and a third guide rail 6113, the third lead screw 6112 is threadedly connected with a third nut seat, and the top of the third nut seat is fixedly connected with the bottom of the second sliding table 612 through screws.

[0067] The third guide rail 6113 is installed on a column which is vertically installed on the machine tool bed 2, and the third screw rod 6112 and the fifth servo motor 6111 are installed on a cross beam which is fixedly connected with the column.

[0068] When the crystal orientation mechanism 6 works, the third moving mechanism 611 drives the second sliding table 612 to vertically move along the horizontal plane of the machine tool bed 2.

[0069] In the embodiment of the present application, the transmitter 614 transmits X-rays which are diffracted after irradiating on the crystal bar, and the probe 613 is used to determine that the crystal bar is in the positioning position.

[0070] Figure 8 Fig. 6 shows a schematic diagram of converting the crystal diffraction peak into an electrical signal according to an exemplary embodiment of the present application; Figure 8 As shown in the figure, the orientation instrument 61 of the embodiment of the present application performs crystal orientation on the slowly rotating crystal bar by transmitting X-rays, and the diffraction peak is transmitted to the numerical control system, and the system automatically identifies the highest point of the strongest diffraction peak, and the crystal bar stops rotating after reaching the specified crystal orientation. The included angle between the transmitter 614 and the receiver 615 is determined by the target crystal orientation. At present, the different diffraction angles corresponding to different crystal orientations of the crystal are known, and reference is made to the attached Figure 7 and the attached Figure 8 As shown in the figure, in an embodiment of the present application, the diffraction angle corresponding to the known target crystal orientation is about 30°, and the included angle between the transmitter 614 and the receiver 615 of the orientation instrument 61 is set to 30°, so that the target crystal orientation will appear a diffraction peak at 2θ = 30° or so, and when the crystal bar is rotated, the diffraction peak reaches the highest point, that is, the target crystal orientation is found.

[0071] It should be noted that the height of the second sliding table 612 in the orientation instrument 61 is divided into working and non-working states. In the non-working state, the height of the second sliding table 612 is not limited. In the working state, that is, when the orientation starts, the height of the second sliding table 612 is adjusted by the third moving mechanism which is controlled by the numerical control panel, and the second sliding table 612 can smoothly move the head frame and the crystal bar axially to the left. The lowest position of the second sliding table 612 needs to make the probe vertically contact the crystal bar, so that the orientation of the crystal bar can be smoothly completed.

[0072] Figure 9 Fig. 7 shows a structural schematic diagram of an edge grinding mechanism according to an exemplary embodiment of the present application; in the embodiment of the present application, the edge grinding mechanism 7 is longitudinally arranged on the machine tool bed 2, and is used for edge grinding the crystal bar 1 which has completed crystal orientation.

[0073] In the embodiment of the present application, the edge grinding mechanism 7 includes an edge grinding mechanism base 74 which is installed on the machine tool bed 2, and a third sliding table 75 which is slidably connected with the edge grinding mechanism base 74,

[0074] The third sliding table 75 is provided with a bowl-shaped grinding wheel 72 and an electric spindle 71 for driving the bowl-shaped grinding wheel to rotate;

[0075] The edge grinding mechanism base 74 is provided with a fourth moving mechanism 73 for controlling the single-feeding amount of the bowl-shaped grinding wheel to the crystal bar for edge grinding;

[0076] The fourth moving mechanism 73 comprises a sixth servo motor 731 mounted on the edge grinding mechanism base 74, a fourth lead screw 732 in driving connection with the power output end of the sixth servo motor 731, and a fourth guide rail 733 mounted on the edge grinding mechanism base 74, and a fourth nut seat is threadedly connected to the fourth lead screw 732, and the top of the fourth nut seat is fixedly connected with the bottom of the third sliding table 75 through screws.

[0077] Optionally, the head frame 441, the tail frame 444 and the orientation instrument 61 are distributed along the axial direction of the crystal bar. The grinding wheel frame 51 and the edge grinding mechanism 7 are distributed along the longitudinal direction of the crystal bar, and the edge grinding mechanism 7 is located on the side of the grinding wheel frame 51 away from the orientation instrument 61. The orientation instrument 61 is higher than the head frame 441, the crystal bar is clamped by the head frame 441 and the tail frame 444, and the workbench 447 is driven to move axially to below the orientation instrument 61 by the first moving mechanism 4, and the crystal is oriented by the orientation instrument 61.

[0078] Optionally, the head frame 441 is connected with a second servo motor 442 and a rotary center 443, the second servo motor 442 drives the rotary center 443 to drive the crystal bar 1 to rotate, and the crystal bar 1 is centered and supported at the same time, and is fixed on the workbench 447. The tail frame 444 is connected with a movable center 445 and a hydraulic cylinder 446, and is driven to rotate by the counter-top with the rotary center 443 and the axial thrust provided by the hydraulic cylinder 446, the head frame 441 and the tail frame 444 are fixed on the workbench 447, and can move axially back and forth at the same time.

[0079] Optionally, the grinding wheel frame 51 is connected with a second moving mechanism 54, a third servo motor 53 and a grinding wheel disc 52, the third servo motor 53 drives the grinding wheel disc 52 and controls the rotating speed thereof, and the second moving mechanism controls the single longitudinal feeding amount, so that the crystal bar reaches the industrial commonly used size.

[0080] Optionally, the orienter 61 is fixed to the leftmost end of the machine tool bed 2. The main components of the orienter 61 include a third moving mechanism 611, a second slide 612, a probe 613, a transmitter 614, and a receiver 615. The second slide 612 is vertically raised and lowered relative to the upper plane of the machine tool bed 2. The second slide 612 is equipped with a probe 613, a transmitter 614, and a receiver 615. The transmitter 614 emits X-rays, which diffract after being irradiated on the crystal ingot. The diffracted light is received by the receiver. The probe 613 is used to determine whether the crystal ingot is in the positioning position. The transmitter emits X-rays, which diffract after being irradiated on the crystal ingot. The diffracted light is received by the receiver. The probe is used to determine whether the crystal ingot is in the positioning position.

[0081] Optionally, the edge grinding mechanism 7 includes a fourth moving mechanism 73, an electric spindle 71 and a bowl-shaped grinding wheel 72. After the crystal orientation is determined, the crystal rod is moved axially to the edge grinding area, and then the crystal rod is rotated 90°, the bowl-shaped grinding wheel 72 is started, and the crystal rod moves back and forth axially until a positioning edge notch that meets industrial requirements is ground out.

[0082] Optionally, the robotic arm 32 is arranged longitudinally with the ingot, on the other side of the grinding wheel frame 51. The right axial end of the robotic arm 32 is an XY moving stage 312, which also includes an optical scanning system 311 for calculating the center point of the target size ingot. The left axial end is a loading platform 34, where the processed ingot is placed.

[0083] The working principle of the fully automatic integrated processing device for semiconductor crystal ingots provided in the embodiment of the present application is as follows:

[0084] refer to Figures 1-2 and Figures 4-5 As shown, during the automatic loading process: first, the crystal rod 1 is placed on the XY movable table 312 at the right end, and the outer diameter data of the crystal rod cylinder is collected through the optical scanning system 311 at the upper end of the XY movable table 312. A two-dimensional contour map is displayed on the numerical control panel, and the center point position of the target size crystal rod is calculated based on the contour map; the crystal rod is clamped by coinciding the center point clamped by the mechanical claw 33 with the calculated center point of the crystal rod 1, and then placed on the center line of the rotating top 443 of the headstock 441 and the movable top 445 of the tailstock 444, and then the hydraulic cylinder 446 provides axial thrust to complete the centering and clamping of the crystal rod.

[0085] refer to Figure 1 and Figure 6As shown, the rounding process: the second servo motor 442 drives the rotating center 443 to rotate, the movable center on the tailstock 445 rotates, thereby driving the crystal bar to rotate, while the workbench 447 moves axially back and forth, then the third servo motor 53 drives the grinding wheel disc 52 to rotate, controls the single longitudinal feed of the second moving mechanism 54, performs rounding processing, obtains the crystal size meeting the industrial requirements, and after the processing is completed, the grinding wheel frame 51 retreats to the original position;

[0086] Referring to Figure 1 , Figure 7 and Figure 8 , in the crystal orientation process: after the rounding processing is completed, the crystal orientation is performed, the headstock 441 and the tailstock 444 clamp the crystal bar to move axially to the left of the workbench 447 through the first moving mechanism 4, so that the crystal bar is located below the orientation instrument 61, the crystal bar 1 is controlled to rotate at a low speed, the second sliding table 612 is driven to move vertically through the third moving mechanism 611, when the probe 613 stops moving about 0.2mm away from the crystal bar 0, the emitter 614 emits X-rays, which are received by the receiver 615, and the diffraction peak is displayed on the numerical control system, the highest point is automatically found, that is, the target crystal direction, and after the crystal direction is determined, the crystal bar immediately stops rotating;

[0087] Referring to Figure 1 and Figure 9 , in the edge grinding process: after the crystal orientation is completed, the headstock 441 and the tailstock 444 clamp the crystal bar to move axially to the right of the workbench 447 through the first moving mechanism 4 to the edge grinding area, the crystal bar is controlled to rotate by 90°, the electric spindle 71 on the edge grinding mechanism 7 drives the bowl-shaped grinding wheel 72 to rotate, then the single longitudinal feed of the fourth moving mechanism 73 is controlled, while the workbench 447 moves axially back and forth, axial cyclic grinding is performed until the positioning edge gap size meeting the requirements is ground out;

[0088] Referring to Figure 1 and Figure 3 , in the automatic unloading process: after the edge grinding is completed, the crystal bar is clamped again through the center point of the mechanical claw 33 coinciding with the center point of the crystal bar 1, and is placed on the unloading table 34 at the right end, and thus all the processings on the device are completed, and the operator can directly pick up the finished product for subsequent processing.

[0089] As described above, the cylindrical outer diameter data of the crystal bar to be processed is collected by the optical device, a two-dimensional contour map is drawn, and the position of the center point of the target size crystal bar is calculated according to the contour map, which is very beneficial to the overall rounding and grinding of the crystal bar with different outer diameters, and the calculation of the center point of the crystal bar is beneficial to the coincidence of the center line between the crystal bar clamping process and the rotating center and the movable center, without the need for manual experience to judge and adjust, the processing mode is optimized, and the material loss and processing time are reduced.

[0090] In summary, the whole process only needs one ordinary worker to place the crystal bar to be processed and take away the processed crystal bar, and the whole process is automatically connected, which can ensure high efficiency and high precision, reduce the labor cost and human error of skilled workers, has strong reusability, and improves the input-output ratio of the whole production line.

[0091] Embodiment 2:

[0092] Figure 10 A flow chart of a full-automatic integrated processing method of a semiconductor crystal bar provided by an example embodiment of the application is shown. Referring to FIG. 1, the example embodiment of the application provides a full-automatic integrated processing method of a semiconductor crystal bar, which applies the horizontal shaft type integrated processing device of the semiconductor crystal bar provided by the example 1, and the method comprises the following steps: Figure 10 The example embodiment of the application provides a full-automatic integrated processing method of a semiconductor crystal bar, which applies the horizontal shaft type integrated processing device of the semiconductor crystal bar provided by the example 1, and the method comprises the following steps:

[0093] In step S101, the center point of the crystal bar 1 is found by the optical scanning system 311 of the crystal bar centering mechanism 31, and then the crystal bar 1 is moved to the fixed point by the X-Y moving table 312 of the crystal bar centering mechanism 31 to determine the center point of the crystal bar 1.

[0094] In step S102, the crystal bar centered by the crystal bar centering mechanism 31 is moved to the clamping mechanism 44 by the mechanical arm 32.

[0095] The crystal bar 1 is placed on the X-Y moving table 312 at the right end, and the outer diameter data of the crystal bar column surface is collected by the optical scanning system 311 at the upper end of the X-Y moving table 312, and a two-dimensional contour map is displayed on the numerical control panel, and the target size crystal bar center point position is calculated according to the contour map. When the calculated center point of the crystal bar 1 deviates from the center point of the X-Y moving table 312, the X-Y moving table 312 controls the crystal bar 1 to move to the center point of the specified path, and then the crystal bar is clamped by the center point of the mechanical claw 33 coinciding with the center point of the specified path of the X-Y moving table 312, and then placed on the center line of the rotary center 443 and the movable center 445, and the hydraulic cylinder 446 provides a certain axial thrust to complete the centering and clamping of the crystal bar.

[0096] At present, after the crystal bar is grown, it is generally clamped on a rounding grinding machine by technical workers, and the center position of the crystal bar is adjusted by a rubber hammer according to experience. However, the grown semiconductor crystal bar is not a standard cylindrical shape, so it is easy to cause material waste and time consumption in the rounding process. By using the optical scanning system 311, the outer diameter center of the crystal bar can be automatically calculated to reduce material loss and rounding processing time, and experienced technical workers are no longer needed to make manual judgments and adjustments during clamping, and the mechanical claw 33 can directly center and coincide to complete clamping.

[0097] Step S103: Based on the centered crystal bar 1 clamped by the clamping mechanism 44, the clamping mechanism 44 is rotated, the crystal bar 1 moves along the first guide rail 43 axially with the rotation of the clamping mechanism 44, and moves to the rounding processing mechanism 5, and the clamping and centering crystal bar 1 is rounded by the rounding processing mechanism 5;

[0098] The second servo motor 442 is controlled by the numerical control panel to drive the rotating top 443 to rotate, so that the crystal bar has a certain rotating speed, and the rotating speed of the crystal bar is 15-300 r / min; at the same time, the first moving mechanism is controlled to drive the workbench 447 to carry out axial reciprocating motion. The third servo motor 53 is started to drive the grinding wheel disc 52 to rotate, the second moving mechanism 54 is controlled to longitudinally feed to carry out rounding processing according to the processing requirement, the crystal size meeting the industrial requirement is obtained, and after the processing is completed, the grinding wheel frame retreats to the original position.

[0099] Step S104: Based on the crystal bar 1 after the rounding processing is completed, the first moving mechanism 4 is axially moved to the crystal orientation mechanism 6 to carry out crystal orientation, and the target crystal orientation of the crystal bar 1 is determined;

[0100] In the embodiment of the application, the crystal orientation mechanism 6 is a direction finder 61.

[0101] After the rounding processing is completed, the head frame 441 and the tail frame 444 are clamped, the workbench 447 is axially moved to the left by the first moving mechanism 4, so that the crystal bar is located below the direction finder 61, the numerical control panel adjusts the low-speed rotation of the crystal bar, the emitter 614 emits X-ray, and after the X-ray is irradiated on the crystal bar, diffraction occurs, the diffraction light is received by the receiver 615, and the probe 613 is used to determine that the crystal bar is in the positioning position. The emitter 614 emits X-ray to carry out crystal orientation on the crystal bar, and the diffraction peak obtained is fed back to the numerical control system, the system automatically identifies the highest point of the diffraction peak, and the crystal orientation is completed. The direction finder 61 is initially installed on the left side of the head frame 441, the heights of the emitter 614, the probe 613 and the receiver 615 all need to be higher than the heights of the head frame 441 and the crystal bar 1 when the head frame 441 and the tail frame 444 clamp the crystal bar to move to the left, so that the head frame 441 and the tail frame 444 can clamp the crystal bar to pass below the direction finder 61. When the orientation is carried out, the third moving mechanism 611 drives the second sliding table 612 to move downward, so that the probe is slightly higher than the positioning position of the crystal bar by about 0.2 mm.

[0102] For crystal orientation, the single crystal orientation clamp commonly used in the factory needs workers with certain experience and professional basis to operate, and the crystal orientation is determined by judging whether the diffraction peak reaches the highest peak by naked eyes. The accuracy of the final crystal orientation result is not high, and the result is unstable, which is easy to cause low yield. In the application, the diffraction peak is directly fed back to the numerical control system, and the highest point of the diffraction peak is automatically identified by the system, so that the target crystal orientation is determined.

[0103] It should be noted that for the intensity of the diffraction peak, only when the crystal rod is rotated to a position close to the target crystal direction, a diffraction peak will appear on the orientation instrument, and then the diffraction peak intensity gradually increases, and when the peak reaches the highest point, it is the target crystal direction. The numerical control system only needs to identify the target crystal direction corresponding to the highest point of the diffraction peak, which has strong reusability, is more convenient and fast, does not need experienced operators to manually judge whether the diffraction peak reaches the peak, the precision can be higher, and the problem of large error caused by manual value taking is avoided, the stability is better, the precision of crystal orientation is greatly improved, and the yield of processed crystal rods is extremely high.

[0104] Step S105: Based on the crystal rod 1 after the crystal orientation is completed, the edge grinding mechanism 7 is axially moved again for edge grinding;

[0105] According to the orientation result, the head frame 441 and the tail frame 444 clamp the crystal rod 1, the workbench 447 is driven by the first moving mechanism 4 to move axially to the right, so that the crystal rod 1 moves to the edge grinding mechanism 7, the numerical control rotates the crystal rod 90°, the electric spindle 71 in the edge grinding mechanism 7 drives the bowl-shaped grinding wheel 72 to rotate, the fourth moving mechanism 73 controls the single longitudinal feed amount, and at the same time, the crystal rod 1 moves axially to and fro through the workbench 447, axial cyclic grinding is performed, until the positioning edge notch size meeting the requirements is ground, and after the processing is completed, the bowl-shaped grinding wheel 72 returns to the original position.

[0106] For the edge grinding of the crystal rod, most of the factories currently transfer to the edge grinding mechanism for grinding the positioning edge after the crystal orientation is determined. However, the accuracy of manual operation is very high in the process of re-clamping. The present application directly moves axially to the edge grinding mechanism 7 after the orientation is determined, and the crystal rod 1 is numerically controlled to rotate 90°, so that the edge grinding can be performed. Not only the precision of the crystal orientation can be improved, but also the integrated edge grinding can be performed, the high precision can be maintained, the processing efficiency can be greatly improved, the reusability is strong, and the direction deviation is extremely small.

[0107] Step S106: Based on the crystal rod 1 after the edge grinding is completed, the mechanical arm clamps the crystal rod 1 after the edge grinding and places it on the discharging table 34 for automatic discharging.

[0108] After the edge grinding is completed, the mechanical claw 33 on the mechanical arm 32 clamps the crystal rod again through the center point coincidence and places it on the discharging table 34. Thus, all the processing procedures are completed, and the operator can directly take away the crystal rod.

[0109] In summary, by the layout combination of the above-mentioned various devices, the semiconductor crystal bar outer diameter centering, automatic feeding, rounding, crystal orientation, edge grinding, automatic unloading are realized, the integrated processing of multiple processes in the crystal processing process on a single set of equipment can be realized, the automation control is high, the automatic calculation of the target size crystal bar center position can be realized, the material loss and the rounding processing time are reduced, the experienced technical workers are no longer needed to manually judge and modify during clamping, the crystal can be accurately oriented, the experienced technical workers are no longer needed to judge whether the diffraction peak reaches the highest peak, and the positioning edge meeting the industrial requirements is ground, the direction deviation caused by the re-clamping after the crystal orientation and the processing in the edge grinding device is reduced, the processing precision is high and can be continuously continued, the operation of the experienced and professional personnel is no longer needed, a large amount of labor cost can be saved, the processing efficiency is improved, the high good product rate can be ensured, the investment and output ratio of the process line equipment is improved. The operation of the above-mentioned devices is controlled through the numerical control panel, the integrated processing of multiple processes in the crystal processing process on a single set of equipment is realized, the automation control is high, the integration degree is high, and the operation is simple and easy to implement.

[0110] The above is only an optional embodiment of the present application, and is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0111] In the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood in a broad sense, for example, it can be fixedly connected, or detachably connected, or integrated; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

Claims

1. A fully automatic integrated processing method for semiconductor crystal rods, characterized in that: A fully automatic integrated processing device for semiconductor crystal rods is used, and the fully automatic integrated processing device for semiconductor crystal rods includes: Machine tool bed; An automatic loading and unloading mechanism is provided on one side of the machine tool bed and includes a crystal ingot centering mechanism for determining the center point of the crystal ingot, a mechanical arm for clamping the crystal ingot, and a loading platform for placing the processed crystal ingot; The crystal ingot centering mechanism includes an optical scanning system for finding the center position of the crystal ingot and an XY moving stage for moving the crystal ingot to a fixed point. The optical scanning system is located above one axial end of the XY moving stage. The mechanical arm is provided with a mechanical claw, the gripping center point of the mechanical claw coincides with the center point of the crystal ingot. The optical scanning system collects the outer diameter data of the crystal ingot cylinder and displays a two-dimensional contour map on the numerical control panel. Based on the contour map, the center point position of the target size crystal ingot is calculated. a first moving mechanism comprising a first guide rail mounted on the machine tool bed and a clamping mechanism slidably connected to the first guide rail, the clamping mechanism being used to clamp the centered crystal ingot; a rounding mechanism, which is provided on the machine bed and is used to round the centered crystal rod; a crystal orientation mechanism, which is provided on the machine bed and is used to orient the crystal rod that has completed the rounding process; An edge grinding mechanism, which is longitudinally arranged on the machine tool bed and is used to perform edge grinding on the crystal rod after the crystal orientation is completed; The crystal orientation mechanism includes a third moving mechanism and a second slide; the second slide is provided with a probe for determining that the crystal rod is in a positioning position, a transmitter for emitting X-rays, and a receiver for receiving diffracted light; The third moving mechanism includes a fifth servo motor, a third lead screw and a third guide rail that are transmission-connected to the power output end of the fifth servo motor, a third nut seat being threadedly connected to the third lead screw, and a top of the third nut seat being fixedly connected to the bottom of the second slide; When the crystal orientation mechanism is working, the third moving mechanism drives the second slide to move vertically along the horizontal plane of the machine bed; The angle between the transmitter and the receiver is adjusted according to the crystal orientation of the target crystal rod. The crystal orientation mechanism orients the slowly rotating crystal rod by emitting X-rays. The diffraction peak is transmitted to the numerical control system, and the system automatically identifies the highest point of the diffraction peak. When the specified crystal orientation is reached, the crystal rod stops rotating. The fully automatic integrated processing method for semiconductor crystal rods includes: The optical scanning system of the crystal ingot centering mechanism finds the position of the center of the crystal ingot, and then the XY moving stage of the crystal ingot centering mechanism moves the crystal ingot to a fixed point to determine the center point of the crystal ingot; The crystal ingot centered by the crystal ingot centering mechanism is moved to the clamping mechanism by the robotic arm; Based on the centered crystal ingot clamped by the clamping mechanism, the clamping mechanism rotates, and the crystal ingot moves axially along the first guide rail as the clamping mechanism rotates, and moves to the rounding processing mechanism, and the rounding processing mechanism performs rounding processing on the clamped and centered crystal ingot; Based on the crystal ingot after the rounding process is completed, the first moving mechanism is used to axially move the crystal ingot to the crystal orientation mechanism for crystal orientation, and the crystal ingot is ensured to reach the target crystal orientation; After the crystal orientation is completed, the crystal rod is axially moved to the edge grinding mechanism for edge grinding; Based on the crystal rod after the edge grinding process, the robotic arm clamps the crystal rod after the edge grinding process and places it on the unloading table for automatic unloading.

2. The fully automatic integrated processing device for semiconductor crystal rods according to claim 1, characterized in that: include: The clamping mechanism includes a workbench slidably connected to the first guide rail, a headstock and a tailstock mounted on the workbench; One end of the head frame is connected to a second servo motor, and the other end thereof is connected to a rotary top, and a power output end of the second servo motor is transmission-connected to the rotary top; One end of the tailstock is connected to a movable top, and the other end is connected to a hydraulic cylinder, the telescopic end of the hydraulic cylinder is connected to the movable top; the movable top is opposite to the rotary top and is used to clamp the crystal rod.

3. The fully automatic integrated processing device for semiconductor crystal ingots according to claim 2, characterized in that: The axial centers of the rotary top and the movable top coincide with the center point of the crystal rod, and the headstock and the tailstock perform rotational motion to center and clamp the crystal rod and perform axial reciprocating motion with the workbench.

4. The fully automatic integrated processing device for semiconductor crystal rods according to claim 3, characterized in that: The first moving mechanism also includes a first servo motor installed on the machine tool bed, a first screw rod transmission-connected to the power output end of the first servo motor, and a first nut seat threadedly connected to the first screw rod, and the top of the first nut seat is fixedly connected to the bottom of the workbench.

5. The fully automatic integrated processing device for semiconductor crystal ingots according to claim 4, characterized in that: The rounding mechanism comprises a rounding mechanism base mounted on the machine tool bed and a first slide slidably connected to the rounding mechanism base; A grinding wheel frame is provided on the first slide, and a grinding wheel disc for longitudinally feeding the crystal rod for rounding processing and a third servo motor for driving the grinding wheel disc to rotate are provided on one side of the grinding wheel frame; The base of the rounding mechanism is provided with a second moving mechanism for controlling the single longitudinal feed amount of the grinding wheel to the crystal rod; The second moving mechanism includes a fourth servo motor installed on the base of the rounding processing mechanism, a second lead screw transmission-connected to the power output end of the fourth servo motor, and a second guide rail installed on the base of the rounding processing mechanism, a second nut seat is threadedly connected to the second lead screw, and the top of the second nut seat is fixedly connected to the bottom of the first slide.

6. The fully automatic integrated processing device for semiconductor crystal ingots according to claim 1, characterized in that: The edge grinding mechanism includes an edge grinding mechanism base mounted on the machine tool bed and a third slide slidably connected to the edge grinding mechanism base; The third slide is provided with a bowl-shaped grinding wheel and an electric spindle for driving the bowl-shaped grinding wheel to rotate; The edging mechanism base is provided with a fourth moving mechanism for controlling the bowl-shaped grinding wheel to perform edging processing on the single feed amount of the crystal rod; The fourth moving mechanism includes a sixth servo motor installed on the base of the edging processing mechanism, a fourth lead screw transmission-connected to the power output end of the sixth servo motor, and a fourth guide rail installed on the base of the edging processing mechanism, a fourth nut seat is threadedly connected to the fourth lead screw, and the top of the fourth nut seat is fixedly connected to the bottom of the third slide.

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