A shock pad

Abstract

The present application provides a kind of shock pad, the center of the shock pad is provided with mounting hole, the vibration body outside of the shock pad is divided into upper half and lower half by mounting slot, the mounting slot is used to connect the shock pad with the source component;The upper half is provided with sawtooth support portion in upper portion;The sawtooth support portion is connected with vibration absorbing end;The upper half between the mounting hole and the sawtooth support portion is distributed at least 3 layers of recess structure that are staggered with each other, at least one layer of recess assembly is cavity assembly, for reducing the low-frequency vibration of X and Y direction.The present application can weaken the low-frequency vibration of X and Y direction by distributing at least 3 layers of recess structure that are staggered with each other in the upper half between the mounting hole and the sawtooth support portion, at least one layer of recess assembly is cavity assembly.

Description

Technical Field

[0001] This invention relates to the field of vibration reduction, and particularly to a vibration damping pad. Background Technology

[0002] During operation, a car's engine generates tremendous power, and the ride is accompanied by bumps and vibrations. These not only produce noise but also significantly reduce the lifespan of related parts, thus affecting the driver's experience and even safety.

[0003] The working principle of commonly used metal vibration dampers is simply to absorb vibration energy through the deformation of the metal damping pad itself, and then dissipate the energy through its own damping. Commonly used metal damping pads are functional damping materials with loose, porous characteristics, produced through a special process. The metal wires within the molded product exhibit a rubber-like macromolecular porous structure with interlocking fibers. During vibration, the friction between the metal wires provides damping and vibration reduction. Generally, metal vibration dampers exhibit near-elasticity under certain displacement conditions, allowing them to operate within a range that provides good vibration reduction.

[0004] Currently, some vibration damping products are available on the market, but they are not designed with sufficient static stiffness and decoupling rate, and cannot meet current usage requirements, especially in terms of reducing low-frequency vibration signals. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a shock-absorbing pad that, through the even distribution of at least three layers of interlaced groove structures on the upper half between the mounting hole and the serrated support, with at least one groove assembly being a cavity assembly, can reduce low-frequency vibrations in the X and Y directions.

[0006] The present invention achieves the above-mentioned technical objectives through the following technical means.

[0007] A vibration damping pad has a mounting hole at its center. The outer side of the vibrating body of the vibration damping pad is divided into a symmetrical upper half and a lower half by a mounting groove, which is used to connect the vibration damping pad to a vibration source component. The upper half has a sawtooth support part at its upper part. The sawtooth support part is connected to the vibration absorption end. At least three layers of interlocking groove structures are evenly distributed in the upper half between the mounting hole and the sawtooth support part. At least one groove assembly is a cavity assembly, which is used to reduce low-frequency vibrations in the X and Y directions.

[0008] Furthermore, the cavity assembly includes at least one cavity; a conduit is provided between the cavity and a groove in an adjacent groove assembly for connecting the cavity and a groove in the groove assembly.

[0009] Furthermore, a conductive medium is placed in the cavity in the upper or lower half, and the liquid level of the conductive medium is not higher than the connection point where the conduit intersects with the cavity; a shape memory structure is provided in a groove communicating with the cavity, and a power contact is provided at the bottom of the groove. When the cavity deforms and the conductive medium enters the groove, the shape memory structure is connected to the power contact through the conductive medium, so as to cause the shape memory structure to deform; the distance between the bottom surface of the cavity and the top of the main body is greater than the distance between the bottom surface of the groove and the top of the main body.

[0010] Furthermore, the material of the shape memory structure is a NiTi-based shape memory alloy; when there is no current, the shape memory structure is a flat plate, and one end of the shape memory structure is embedded or vulcanized and bonded to the inner wall of the groove; after the shape memory structure is connected to the power source, the flat shape memory structure undergoes radial bending; the power source is installed inside the shock-absorbing pad, and the power contact is located at the bottom of the groove.

[0011] Furthermore, the cross-section of the groove communicating with the cavity gradually narrows along the axial direction, while the cross-section of the cavity gradually expands along the axial direction.

[0012] Furthermore, a first groove assembly, a second groove assembly, and a cavity assembly are provided between the mounting hole and the sawtooth support. The cavity assembly is located outside the mounting hole. The second groove assembly is located at the trough of the sawtooth support. The radius of the circumference of the groove distribution in the first groove assembly is larger than the radius of the circumference of the cavity distribution. The cavity in the cavity assembly is connected to the first groove in the adjacent first groove assembly. The cavity is shaped like a triangular prism, and the bottom surface of the triangular prism is perpendicular to the radial direction.

[0013] Furthermore, two shape memory structures are provided in the first groove along the axial direction, wherein the first shape memory structure is located at the bottom of the first groove and the second shape memory structure is located on top of the first shape memory structure; the elastic damping generated after the first shape memory structure is deformed is less than the elastic damping generated after the second shape memory structure is deformed.

[0014] Furthermore, a convex array area is provided on the inner wall surface of the cavity above the conductive medium liquid surface in the upper part and / or on the inner wall surface of the cavity in the lower part. Several protrusions are arranged alternately in the convex array area to reduce radial vibration during the deformation of the cavity.

[0015] Furthermore, the bump array region includes a first bump and a second bump, the second bump being distributed on the cavity wall surface in the vertical radial direction, the first bump being distributed on other cavity walls, and the first bump and the second bump being staggered in the axial direction.

[0016] The beneficial effects of this invention are as follows:

[0017] 1. The shock-absorbing pad of the present invention, through at least three layers of interlaced groove structure between the mounting hole and the sawtooth support, wherein at least one groove assembly is a cavity assembly, can reduce low-frequency vibrations in the X and Y directions.

[0018] 2. The shock-absorbing pad of the present invention includes at least one cavity in the cavity assembly, the cavity being a closed cavity; a conduit is provided between the cavity and a groove in an adjacent groove assembly for connecting the cavity and a groove in the groove assembly. By utilizing the fact that the cross-sectional area of ​​the conduit is much smaller than that of the groove and the adjacent closed hole, the radial vibration can be absorbed by utilizing the principle of perforated plate shock absorption.

[0019] 3. The shock-absorbing pad of the present invention has a conductive medium placed in the cavity, and the liquid level of the conductive medium is not higher than the connection point where the conduit intersects with the cavity; a shape memory structure is provided in a groove communicating with the cavity, and a power contact is provided at the bottom of the groove. When the cavity deforms and the conductive medium enters the groove, the shape memory structure is connected to the power contact through the conductive medium, so as to cause the shape memory structure to deform, which can further reduce radial low-frequency vibration.

[0020] 4. In the shock-absorbing pad of the present invention, two shape memory structures are provided along the axial direction in the first groove, wherein the first shape memory structure is located at the bottom of the first groove and the second shape memory structure is located on top of the first shape memory structure; the elastic damping generated after the first shape memory structure is deformed is less than the elastic damping generated after the second shape memory structure is deformed, so different amplitudes can be deformed by different shape memory structures.

[0021] 5. The shock-absorbing pad of the present invention has a convex array area distributed on the inner wall surface of the cavity above the conductive medium liquid surface in the upper part and / or on the inner wall surface of the cavity in the lower part, and a plurality of protrusions are staggered in the convex array area to reduce radial vibration during the deformation of the cavity. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are some embodiments of the present invention. For those skilled in the art, it is obvious that other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional view of the shock-absorbing pad described in Embodiment 1 of the present invention.

[0024] Figure 2 This is a top view of the shock-absorbing pad described in Embodiment 1 of the present invention.

[0025] Figure 3 for Figure 2 AA rotated sectional view.

[0026] Figure 4 for Figure 2 BB rotating section view.

[0027] Figure 5 This is a schematic diagram showing the connection between the cavity and the first groove.

[0028] Figure 6 This is a schematic diagram of the deformed shape memory structure.

[0029] Figure 7 This is a schematic diagram showing the connection between the cavity and the first groove in Example 2.

[0030] Figure 8 This is a schematic diagram of the interior of the cavity in Example 3.

[0031] Figure 9 This is an enlarged cross-sectional view of the cavity in Example 3.

[0032] Figure 10 This is a schematic diagram of the cavity deformation in Example 3.

[0033] In the picture:

[0034] 1-Sawtooth support; 2-Cavity assembly; 2-1-Cavity; 2-2-Raised dot array area; 2-2-1-First protrusion; 2-2-2-Second protrusion; 3-First groove assembly; 3-1-First groove; 4-Second groove assembly; 4-1-Second groove; 5-Conduit; 6-Conductive medium; 7-Shape memory structure; 7-1-First shape memory structure; 7-2-First shape memory structure; 8-Mounting hole; 9-Mounting slot; 10-Upper part; 11-Lower part. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] like Figure 1 As shown, the shock-absorbing pad of the present invention has a mounting hole 8 at its center. The outer side of the vibrating body of the shock-absorbing pad is divided into a symmetrical upper half 10 and a lower half 11 by a mounting groove 9. Since the upper half 10 and the lower half 11 are structurally symmetrical, the following description uses the upper half 10 as an example. The upper half 10 has a sawtooth support part 1. The mounting groove 9 is used to connect the shock-absorbing pad to the vibration source component, such as the shock-absorbing pad to an engine or pump, etc. The sawtooth support part 1 contacts the vibration-absorbing end, which can be considered as the vibrated end, such as the frame of the equipment or the ground, etc. Three layers of interlocking groove components are provided between the mounting hole 8 and the sawtooth support part 1, and at least one groove component is a cavity, which is used to reduce low-frequency vibrations in the X and Y directions. The low-frequency vibration is a low-frequency vibration signal less than 500 Hz. The cavity is located inside the main body of the shock-absorbing pad and can be understood as an internal closed cavity.

[0039] As shown in the figure, the sawtooth support 1 is a ring-shaped wave structure composed of several alternating arc-shaped peaks and troughs, and several alternating arc-shaped peaks and troughs are distributed circumferentially on the top of the main body of the shock-absorbing pad; a groove assembly is located at the arc-shaped trough.

[0040] Example 1

[0041] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the upper part 10 is provided with a sawtooth support part 1. The sawtooth support part 1 is a ring wave structure composed of several alternating arc-shaped peaks and troughs. The main body of the shock-absorbing pad is provided with a mounting hole 8 at its center. Between the mounting hole 8 and the sawtooth support part 1, there are three layers of intersecting first groove assembly 3, second groove assembly 4 and cavity assembly 2. In embodiment 1, a circular concave platform is provided at the center of the sawtooth support part 1. The first groove assembly 3 and cavity assembly 2 are provided on the plane where the circular concave platform intersects with the mounting hole 8. The first groove assembly 2 is composed of several first grooves 3-1 evenly distributed circumferentially outside the mounting hole 8. The first groove assembly 2 is composed of several second grooves 4 evenly distributed circumferentially at the troughs of the sawtooth support part 1. The cavity assembly 2 is composed of several cavities 2-1 evenly distributed circumferentially outside the mounting hole 8. The crests of the sawtooth support 1 correspond one-to-one with the centers of the second groove structure 1-3 and the cavity 2-1. That is, the phase angle of the crest distribution of the sawtooth support 1 is the same as the phase angle of the second groove structure 1-3 and the cavity 2-1. The cavity 2-1 is staggered with the first groove 3-1, and the distance from the cavity 2-1 to the axis of the mounting hole 8 is less than the distance from the first groove 3-1 to the axis of the mounting hole 8, which can better reduce low-frequency vibrations in the X and Y directions. When radial low-frequency vibrations occur, the vibration source compresses the air inside the cavity 2-1, generating gas elastic damping, which absorbs part of the radial vibration. This radial vibration refers to the low-frequency vibrations in the X and Y directions.

[0042] The radial width of the second groove 4-1 is greater than the radial width of the first groove 3-1; the axial depth of the second groove 4-1 is the same as the axial depth of the first groove 3-1. The second groove 4-1 of the upper half 10 is not connected to the corresponding second groove 4-1 of the lower half 11, and the first groove 3-1 of the upper half 10 is not connected to the corresponding first groove 3-1 of the lower half 11, as shown below. Figure 3 As shown.

[0043] In Embodiment 1, the first groove assembly 3 includes six first grooves 3-1, circumferentially distributed on the plane where the circular recess intersects with the mounting hole 8. The cavity assembly 2 includes six cavities 2-1, circumferentially distributed on the plane where the circular recess intersects with the mounting hole 8. Each cavity 2-1 is a closed cavity column, a triangular prism, with its base perpendicular to the radial direction (the radial direction of the damping pad or the radial direction of the vibration). As shown in the figure, a cavity 2-1 is provided between two first grooves 3-1, and the radius of the circumference of the first grooves 3-1 is greater than the radius of the circumference of the cavities 2-1. Only one end of each first groove 3-1 is connected to the plane where the circular recess intersects with the mounting hole 8. The second groove assembly 4 consists of twelve evenly distributed second grooves 4-1, with the axial depth of the first grooves 3-1 being the same as the axial depth of the second grooves 4-1. A perforated plate may be provided in the middle of each second groove 4-1 to increase elastic damping in the Z-direction and reduce vibration in the Z-direction.

[0044] like Figure 5 As shown, to better reduce radial low-frequency vibration, a conduit 5 is provided between a cavity 2-1 and an adjacent first groove 3-1, connecting the internal cavity of cavity 2-1 with the first groove 3-1. Since the cross-sectional area of ​​the conduit 5 is much smaller than that of the first groove 3-1 and the adjacent cavity 2-1, part of the radial vibration can be absorbed using the principle of orifice plate shock absorption. A conductive medium 6 is placed inside the cavity 2-1, with the liquid level of the conductive medium 6 slightly lower than the connection point where the conduit 5 intersects with the cavity 2-1, or the liquid level of the conductive medium 6 is flush with the connection point; alternatively, the conduit 5 can be designed at an angle, with a lower liquid level at one end of the conduit 5 connected to the cavity 2-1 and a higher liquid level at the other end. A shape memory structure 7 is provided in the first groove 3-1. When the cavity 2-1 is subjected to low-frequency vibrations in the X and Y directions, the wall surface of the cavity 2-1 deforms radially, causing the liquid level of the conductive medium 6 in the cavity 2-1 to rise. When the liquid level exceeds the conduit 5, some of the conductive medium 6 enters the first groove 3-1 through the conduit 5. At the bottom of the first groove 3-1, a power contact is provided. When the conductive medium 6 in the first groove 3-1 makes the shape memory structure 7 conductive, the shape memory structure 7 deforms after becoming conductive, forming an elastic damping force radially within the first groove 3-1, which can further reduce radial low-frequency vibrations. Figure 6 As shown. Due to the influence of gravity, the conductive medium 6 and the shape memory structure 7 are only provided in the upper half 10 of the installation method shown in the figure.

[0045] The distance H1 between the bottom surface of cavity 2-1 and the top of the sawtooth support 1 is greater than the distance H2 between the bottom surface of the first groove 3-1 and the top of the sawtooth support 1. One end of the conduit 5 is connected to the bottom of the first groove 3-1, which facilitates the entry of the conductive medium 6 into the first groove 3-1 after the cavity 2-1 deforms. At the same time, when the external force on the cavity 2-1 disappears, the wall of the cavity 2-1 returns to its original position. Using the generated negative pressure (here, negative pressure refers to pressure lower than atmospheric pressure in the first groove 3-1), the conductive medium 6 in the first groove 3-1 is drawn into the cavity 2-1 until the wall of the cavity 2-1 is completely returned to its original position.

[0046] The shape memory structure 7 is made of shape memory material, which can be a shape memory alloy. In the absence of current, the shape memory structure 7 is a NiTi-based shape memory alloy. When no current is applied, the shape memory structure 7 is a flat plate. One end of the shape memory structure 7 is embedded in or vulcanized and bonded to the inner wall of the first groove 3-1. When the shape memory structure 7 is connected to a power source, the flat shape memory structure 7 bends, forming a shape like... Figure 5 The bending structure shown has radial elastic damping formed within the first groove 3-1. The radial bending can be a semi-circular bend, an arc bend, or a vortex bend.

[0047] Working principle: When radial vibration occurs, the space of cavity 2-1 is first deformed by vibration. The perforated plate of the conduit 5 absorbs part of the radial vibration, which is the first stage of damping. Cavity 2-1 deforms under the influence of radial vibration. The magnitude of this deformation is related to the amplitude and frequency of the vibration source, as well as the transmission path between the vibration source and the damping pad. When the cavity of cavity 2-1 deforms, some conductive medium 6 enters the first groove 3-1 through the conduit 5. When the conductive medium 6 in the first groove 3-1 makes the shape memory structure 7 conduct with the power contact, the shape memory structure 7 deforms after becoming conductive, forming elastic damping radially in the first groove 3-1, thus forming the second stage of damping.

[0048] A power supply is installed inside the upper part 10 or the lower part 11, with the power contacts of the power supply located at the bottom of the first groove 3-1.

[0049] Example 2

[0050] like Figure 7As shown, based on Embodiment 1, two shape memory structures 7 are provided in the first groove 3-1. The first shape memory structure 7-1 is installed on the wall closest to the cavity 2-1 in the first groove 3-1, and the second shape memory structure 7-2 is located on other walls in the first groove 3-1. The distance between the first shape memory structure 7-1 and the point where the conduit 5 intersects with the first groove 3-1 is greater than the distance between the second shape memory structure 7-2 and the point where the conduit 5 intersects with the first groove 3-1. The elastic damping generated by the deformation of the first shape memory structure 7-1 is less than the elastic damping generated by the deformation of the second shape memory structure 7-2. Thus, when radial vibration causes small spatial vibration deformation of the cavity 2-1, the first shape memory structure 7-1 is connected to the power supply first, and the first shape memory structure 7-1 bends. When radial vibration causes large spatial vibration deformation of the cavity 2-1, the first shape memory structure 7-1 and the second shape memory structure 7-2 are connected to the power supply successively, and the first shape memory structure 7-1 and the second shape memory structure 7-2 bend successively. The cross-section of the first groove 3-1 gradually narrows along the axial direction, that is, from the serrated support part 1 to the mounting groove 9, the cross-sectional area of ​​the first groove 3-1 gradually narrows, while the cross-section of the cavity 2-1 gradually expands along the axial direction. In this way, even low-frequency radial vibration can cause the first shape memory structure 7-1 to bend.

[0051] An energy storage battery is installed inside the upper part 10 or the lower part 11, with the contacts of the energy storage battery located at the bottom of the first groove 3-1. A vibration energy recovery device is installed on the frame of the vibration source component to convert vibration energy into electrical energy, and the vibration energy recovery device stores the recovered electrical energy in the energy storage battery. The vibration energy recovery device is a type of existing vibration or vibration energy recovery equipment, which will not be described further here.

[0052] Example 3

[0053] Based on Example 1 or Example 2, such as Figure 8 and Figure 9 As shown, a protrusion array area 2-2 is provided on the inner wall surface of the cavity 2-1 at a certain distance from the surface of the conductive medium 6. Several protrusions are arranged alternately within the protrusion array area 2-2. During the deformation of the cavity 2-1, the radial vibration is mitigated by the mutual compression of the protrusions. Generally, the protrusion array area 2-2 is positioned at a distance of 0.2 to 0.3 times the length of the cavity 2-1 above the surface of the conductive medium 6. Figure 9 As shown, the cross-section of the cavity 2-1 of the triangular prism is a triangle DEF, with the base DE perpendicular to the radial direction. The base DE has two second protrusions 2-2-2, while each of the two opposite sides DF and EF has a first protrusion 2-2-1. The height of the first protrusion 2-2-1 protruding from the wall surface is greater than or equal to the height of the second protrusion 2-2-2 protruding from the wall surface. Combined with... Figure 8Two rows of second protrusions 2-2-2 are provided on the bottom wall of cavity 2-1, and one row of first protrusions 2-2-1 is provided on the other two walls of cavity 2-1. The first protrusions 2-2-1 are between the two rows of second protrusions 2-2-2, presenting an alternating distribution. The alternating distribution of the protrusion array area 2-2 can prevent or reduce the influence of inclined Z-direction (i.e., axial) vibration on cavity 2-1, causing excessive deformation of one wall of cavity 2-1, which would allow the internal conductive medium 6 to enter the first groove 3-1 and trigger the deformation of shape memory structure 7. However, even if a large amplitude Z-direction vibration causes the internal conductive medium 6 to enter the first groove 3-1 and trigger the deformation of shape memory structure 7, it will not affect the reset of shape memory structure 7 or its ability to reduce radial vibration. In embodiment 3, there are protrusions of different sizes in an alternating distribution. The compression and elastic deformation generated between the protrusions can prevent and mitigate the deformation caused by the inclined Z-direction, such as Figure 10 As shown. Figure 10 This is merely a schematic diagram of an edge deformation.

[0054] In Example 2, the cross-section of cavity 2-1 gradually expands along the axial direction, so the second protrusion 2-2-2 and the first protrusion 2-2-1 also increase in height along the axial direction.

[0055] Example 4

[0056] In Embodiment 1 or Embodiment 2, the cavity 2-1 of the upper half 10 is provided with a conductive medium 6, and the first groove 3-1 of the upper half 10 contains a shape memory structure 7. The upper half 10 of Embodiment 4 is the same as that of Embodiment 1 or Embodiment 2. In Embodiment 4, the cavity 2-1 of the lower half 11 is only provided with a bump array region 2-2. Since there is no conductive medium 6 in the cavity 2-1 of the lower half 11, the bump array region 2-2 can be provided on the entire surface of its wall. There are 2 to 4 rows of second protrusions 2-2-2 on the bottom wall of the cavity 2-1, and 1 to 3 rows of first protrusions 2-2-1 on the other two walls of the cavity 2-1. The first protrusions 2-2-1 are between the two rows of second protrusions 2-2-2, presenting an alternating distribution.

[0057] It should be understood that although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0058] The detailed descriptions listed above are merely specific illustrations of feasible embodiments of the present invention and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A shock-absorbing pad, characterized in that, The damping pad has a mounting hole (8) at its center. The outer side of the damping pad's vibrating body is divided into a symmetrical upper half (10) and a lower half (11) by a mounting groove (9). The mounting groove (9) is used to connect the damping pad to the vibration source component. The upper half (10) has a sawtooth support part (1). The sawtooth support part (1) is connected to the vibration absorption end. At least three layers of interlocking groove components are evenly distributed on the upper half (10) between the mounting hole (8) and the sawtooth support part (1). At least one layer of groove components is a cavity component (2) used to reduce low-frequency vibrations in the X and Y directions. The cavity assembly (2) includes at least one cavity (2-1); a conduit (5) is provided between the cavity (2-1) and a groove in an adjacent groove assembly for connecting the cavity (2-1) and a groove in the groove assembly; A conductive medium (6) is placed in the cavity (2-1) in the upper part (10), and the liquid level of the conductive medium (6) is not higher than the connection point where the conduit (5) intersects with the cavity (2-1); a shape memory structure (7) is provided in a groove connected to the cavity (2-1), and a power contact is provided at the bottom of the groove. When the cavity (2-1) deforms and the conductive medium (6) enters the groove, the shape memory structure (7) is connected to the power contact through the conductive medium (6) to cause the shape memory structure (7) to deform; the distance between the bottom surface of the cavity (2-1) and the top of the shock-absorbing pad is greater than the distance between the bottom surface of the groove and the top of the shock-absorbing pad.

2. The shock-absorbing pad according to claim 1, characterized in that, The material of the shape memory structure (7) is a NiTi-based shape memory alloy; when there is no current, the shape memory structure (7) is a flat plate, and one end of the shape memory structure (7) is embedded or vulcanized and bonded to the inner wall of the groove; after the shape memory structure (7) is connected to the power supply, the flat shape memory structure (7) undergoes radial bending; the power supply is installed inside the shock-absorbing pad, and the power supply contact is located at the bottom of the groove.

3. The shock-absorbing pad according to claim 1, characterized in that, The cross-section of the groove communicating with the cavity (2-1) gradually narrows along the axial direction, while the cross-section of the cavity (2-1) gradually expands along the axial direction.

4. The shock-absorbing pad according to any one of claims 1-3, characterized in that, The at least three layers of interlocking groove assemblies include a first groove assembly (3), a second groove assembly (4), and a cavity assembly (2); the cavity assembly (2) is located outside the mounting hole (8); the second groove assembly (4) is located at the trough of the sawtooth support (1); the radius of the circumference of the groove distribution in the first groove assembly (3) is greater than the radius of the circumference of the cavity (2-1); the cavity (2-1) in the cavity assembly (2) is connected to the first groove (3-1) in the adjacent first groove assembly (3) through the conduit; the cavity (2-1) is shaped like a triangular prism, and the bottom surface of the triangular prism is perpendicular to the radial direction of the shock-absorbing pad.

5. The shock-absorbing pad according to claim 4, characterized in that, Two shape memory structures are provided along the axial direction in the first groove (3-1), wherein the first shape memory structure (7-1) is located at the bottom of the first groove (3-1) and the second shape memory structure (7-2) is located on top of the first shape memory structure (7-1); the elastic damping generated after the first shape memory structure (7-1) is deformed is less than the elastic damping generated after the second shape memory structure (7-2) is deformed.

6. The shock-absorbing pad according to claim 1, characterized in that, A protrusion array area (2-2) is provided on the inner wall surface of the cavity (2-1) above the liquid surface of the conductive medium (6) in the upper part (10) and / or on the inner wall surface of the cavity (2-1) in the lower part (11). A number of protrusions are arranged alternately in the protrusion array area (2-2) to reduce radial vibration during the deformation of the cavity (2-1).

7. The shock-absorbing pad according to claim 6, characterized in that, The convex array area (2-2) includes a first convex (2-2-1) and a second convex (2-2-2). The second convex (2-2-2) is distributed on the wall of the cavity (2-1) perpendicular to the radial direction of the shock-absorbing pad. The first convex (2-2-1) is distributed on the wall of other cavities (2-1). The first convex (2-2-1) and the second convex (2-2-2) are staggered in the axial direction.

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